WO2008153076A1 - Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding - Google Patents

Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding Download PDF

Info

Publication number
WO2008153076A1
WO2008153076A1 PCT/JP2008/060704 JP2008060704W WO2008153076A1 WO 2008153076 A1 WO2008153076 A1 WO 2008153076A1 JP 2008060704 W JP2008060704 W JP 2008060704W WO 2008153076 A1 WO2008153076 A1 WO 2008153076A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical adhesive
substrate bonding
epoxy group
group
disclosed
Prior art date
Application number
PCT/JP2008/060704
Other languages
French (fr)
Japanese (ja)
Inventor
Shigeru Nomura
Tokushige Shichiri
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to JP2008529066A priority Critical patent/JPWO2008153076A1/en
Publication of WO2008153076A1 publication Critical patent/WO2008153076A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C09J183/12—Block or graft copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is an optical adhesive for substrate bonding, which enables to prevent separation and maintain excellent adhesion at the interface between a panel and a protective substrate regardless of temperature change in the environment in which a display device is used, thereby enabling the display device to have excellent display quality. Also disclosed is an optical adhesive cured body for substrate bonding, which is obtained by curing the optical adhesive for substrate bonding. Specifically disclosed is an optical adhesive for substrate bonding, which contains a curable resin represented by the general formula (1-1) below, a cationically polymerizable monomer and a cationic polymerization initiator. (1-1) In the general formula (1-1), l, m and n respectively represent a number of 1-500; R1 represents H and/or CH3; R2 represents a linear or branched chain alkylene group having 1-6 carbon atoms; A represents a benzene ring or a cyclohexane ring; X represents CR2, O, S(O2) or S; Y represents an epoxy group, an oxetanyl group or an alicyclic epoxy group; Y' represents a ring-opened structure of an epoxy group, an oxetanyl group or an alicyclic epoxy group; and R represents H and/or CH3.
PCT/JP2008/060704 2007-06-14 2008-06-11 Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding WO2008153076A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008529066A JPWO2008153076A1 (en) 2007-06-14 2008-06-11 Optical adhesive for substrate bonding, and cured optical adhesive for substrate bonding

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007157629 2007-06-14
JP2007-157629 2007-06-14

Publications (1)

Publication Number Publication Date
WO2008153076A1 true WO2008153076A1 (en) 2008-12-18

Family

ID=40129681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060704 WO2008153076A1 (en) 2007-06-14 2008-06-11 Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding

Country Status (3)

Country Link
JP (1) JPWO2008153076A1 (en)
TW (1) TW200909552A (en)
WO (1) WO2008153076A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (en) * 2009-07-01 2011-01-06 協立化学産業株式会社 Energy ray-curable epoxy resin composition having excellent fast curing properties
JP2013112686A (en) * 2011-11-25 2013-06-10 Shin-Etsu Chemical Co Ltd Condensation reaction curing type primer composition for silicone adhesive
JP2014095913A (en) * 2009-12-17 2014-05-22 3M Innovative Properties Co Display panel assembly and methods of making the same
JP2015218332A (en) * 2014-05-21 2015-12-07 スリーボンドファインケミカル株式会社 Cation curable resin composition
JP2017090523A (en) * 2015-11-04 2017-05-25 日東電工株式会社 Polarizing plate
CN107760258A (en) * 2016-08-16 2018-03-06 北京康美特科技股份有限公司 Battery component sealant, battery component and its encapsulating method
CN108886849A (en) * 2016-10-19 2018-11-23 积水化学工业株式会社 The manufacturing method of organic EL display element sealant and organic EL display element sealant
JP2022521846A (en) * 2019-04-02 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー The process of producing a curable precursor of a structural adhesive composition
JP2022521847A (en) * 2019-04-02 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー Curable precursor of structural adhesive composition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106827A (en) * 1983-11-15 1985-06-12 Nitto Electric Ind Co Ltd One-pack thermosetting epoxy resin composition
JPH01272623A (en) * 1988-04-25 1989-10-31 Matsushita Electric Works Ltd Epoxy resin composition
JP2002179762A (en) * 2000-12-08 2002-06-26 Arakawa Chem Ind Co Ltd Silane-modified epoxy resin composition and cured product thereof
JP2004231957A (en) * 2003-01-09 2004-08-19 Sekisui Chem Co Ltd Optically post curable composition, adhesive for display element and display element
JP2005306949A (en) * 2004-04-20 2005-11-04 Three Bond Co Ltd Photocurable composition
JP2006257280A (en) * 2005-03-17 2006-09-28 Fuji Electric Holdings Co Ltd Thermosetting resin composition for mounting electronic part
JP2006290998A (en) * 2005-04-08 2006-10-26 Ablestik Japan Co Ltd Transparent resin composition

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106827A (en) * 1983-11-15 1985-06-12 Nitto Electric Ind Co Ltd One-pack thermosetting epoxy resin composition
JPH01272623A (en) * 1988-04-25 1989-10-31 Matsushita Electric Works Ltd Epoxy resin composition
JP2002179762A (en) * 2000-12-08 2002-06-26 Arakawa Chem Ind Co Ltd Silane-modified epoxy resin composition and cured product thereof
JP2004231957A (en) * 2003-01-09 2004-08-19 Sekisui Chem Co Ltd Optically post curable composition, adhesive for display element and display element
JP2005306949A (en) * 2004-04-20 2005-11-04 Three Bond Co Ltd Photocurable composition
JP2006257280A (en) * 2005-03-17 2006-09-28 Fuji Electric Holdings Co Ltd Thermosetting resin composition for mounting electronic part
JP2006290998A (en) * 2005-04-08 2006-10-26 Ablestik Japan Co Ltd Transparent resin composition

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (en) * 2009-07-01 2011-01-06 協立化学産業株式会社 Energy ray-curable epoxy resin composition having excellent fast curing properties
CN102471456A (en) * 2009-07-01 2012-05-23 协立化学产业株式会社 Energy ray-curable epoxy resin composition having excellent fast curing properties
JP5736568B2 (en) * 2009-07-01 2015-06-17 協立化学産業株式会社 Energy ray curable epoxy resin composition excellent in rapid curing
KR101671047B1 (en) * 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 Energy ray-curable epoxy resin composition having excellent fast curing properties
JP2014095913A (en) * 2009-12-17 2014-05-22 3M Innovative Properties Co Display panel assembly and methods of making the same
JP2013112686A (en) * 2011-11-25 2013-06-10 Shin-Etsu Chemical Co Ltd Condensation reaction curing type primer composition for silicone adhesive
JP2015218332A (en) * 2014-05-21 2015-12-07 スリーボンドファインケミカル株式会社 Cation curable resin composition
JP2017090523A (en) * 2015-11-04 2017-05-25 日東電工株式会社 Polarizing plate
CN107760258A (en) * 2016-08-16 2018-03-06 北京康美特科技股份有限公司 Battery component sealant, battery component and its encapsulating method
CN107760258B (en) * 2016-08-16 2020-12-04 北京康美特科技股份有限公司 Sealing agent for battery module, battery module and sealing method thereof
CN108886849A (en) * 2016-10-19 2018-11-23 积水化学工业株式会社 The manufacturing method of organic EL display element sealant and organic EL display element sealant
CN108886849B (en) * 2016-10-19 2022-10-21 积水化学工业株式会社 Sealing agent for organic EL display element and method for producing sealing agent for organic EL display element
JP2022521846A (en) * 2019-04-02 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー The process of producing a curable precursor of a structural adhesive composition
JP2022521847A (en) * 2019-04-02 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー Curable precursor of structural adhesive composition
JP7186310B2 (en) 2019-04-02 2022-12-08 スリーエム イノベイティブ プロパティズ カンパニー Curable precursor for structural adhesive compositions
JP7186309B2 (en) 2019-04-02 2022-12-08 スリーエム イノベイティブ プロパティズ カンパニー Process for producing curable precursors for structural adhesive compositions

Also Published As

Publication number Publication date
JPWO2008153076A1 (en) 2010-08-26
TW200909552A (en) 2009-03-01

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