WO2020153259A1 - Cover member - Google Patents

Cover member Download PDF

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Publication number
WO2020153259A1
WO2020153259A1 PCT/JP2020/001528 JP2020001528W WO2020153259A1 WO 2020153259 A1 WO2020153259 A1 WO 2020153259A1 JP 2020001528 W JP2020001528 W JP 2020001528W WO 2020153259 A1 WO2020153259 A1 WO 2020153259A1
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WO
WIPO (PCT)
Prior art keywords
cover member
group
adhesive
member according
glass plate
Prior art date
Application number
PCT/JP2020/001528
Other languages
French (fr)
Japanese (ja)
Inventor
大和洋
岩谷真男
Original Assignee
株式会社ダイセル
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ダイセル filed Critical 株式会社ダイセル
Priority to JP2020568125A priority Critical patent/JPWO2020153259A1/en
Publication of WO2020153259A1 publication Critical patent/WO2020153259A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/10Homopolymers or copolymers of unsaturated ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04Homopolymers or copolymers of vinyl acetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present invention relates to a cover member composed of a laminated body including a glass plate.
  • glass is often used as a cover member for displays of mobile devices such as mobile phones, personal digital assistants, and tablet PCs. This is because glass is excellent in transparency, gas barrier property, chemical stability, surface smoothness, and the like, and the texture of glass is preferred.
  • Patent Document 1 describes a thinned glass plate, and it is described that the thinned glass plate has flexibility and can be bent slowly.
  • a cover member obtained by joining a glass plate and a resin film via an adhesive layer has the characteristics of glass, and has flexibility and impact resistance. It has been found that the cover member is excellent and easy to handle, and that the cover member is suitable as a cover glass for a display, a protective film for a fingerprint authentication sensor, a substrate for an organic electroluminescent device or an organic thin film solar cell, or a sealing member.
  • the present invention has been completed based on these findings.
  • the present invention provides a cover member having a structure in which a glass plate having a thickness of 500 ⁇ m or less and a resin film are laminated via an adhesive layer.
  • the present invention also provides the cover member according to the following test, which has an impact resistance of 4 cm or more.
  • Impact resistance test The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate. The drop height (cm) before cracking is used as an index of impact resistance
  • the present invention also provides the cover member having a minimum bending radius of 250 mm or less.
  • the present invention also provides the cover member having a total thickness of 1000 ⁇ m or less.
  • the present invention also provides the cover member, wherein the adhesive layer is a cured product of the following adhesive (1).
  • Adhesive (1) containing a cationically polymerizable monomer and a curing catalyst, and as the cationically polymerizable monomer, at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule.
  • R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond.
  • s represents a valent group, and s represents an integer of 2 or more
  • the compound represented by 5 wt% or more of the total amount of the cationically polymerizable monomer is contained.
  • the adhesive (1) further comprises the following formula (b′) as a cationically polymerizable monomer.
  • X represents a single bond or a linking group
  • the cover member comprises the compound represented by 10% by weight or more of the total amount of the cationically polymerizable monomer.
  • the present invention also provides the cover member, wherein the adhesive layer is a cured product of an acrylic urethane adhesive (2) containing urethane (meth)acrylate or a polymer thereof.
  • the present invention also provides the cover member, wherein the adhesive layer is a cured product of a vinyl acetate adhesive (3) containing a vinyl acetate polymer.
  • the present invention also provides the cover member, wherein the resin film is laminated so that the MD direction is along the bending direction of the cover member.
  • the present invention also provides the cover member for a touch panel display.
  • the present invention also provides the cover member for a flexible display.
  • the present invention also provides the cover member for a fingerprint authentication sensor.
  • the present invention also provides a touch panel display including the cover member.
  • the present invention also provides a flexible display including the cover member.
  • the present invention also provides an electronic device including the display.
  • the present invention also provides an organic electroluminescent device including the cover member.
  • the present invention also provides an organic thin film solar cell including the cover member.
  • the present invention also provides a fingerprint authentication sensor including the cover member.
  • the present invention also provides an electronic device with a personal authentication function that includes the fingerprint authentication sensor.
  • the cover member of the present invention has the characteristics of glass. That is, transparency, gas barrier property, water vapor barrier property, chemical stability, thermal stability, electrical insulation property, surface smoothness, high hardness, resistance to twisting (or curl resistance), etc., and good texture (Appearance and touch). In addition to the characteristics of the glass, it also has flexibility and impact resistance. Furthermore, when it has a specific adhesive layer, it also has bending durability and cracks do not occur even if it is repeatedly bent.
  • the cover member of the present invention has the above-mentioned characteristics, it is used for a display (especially, as a member for covering the surface of a touch panel display or a flexible display, or as an electrode protective film of a plasma display), and for protecting a fingerprint authentication sensor. It can be suitably used for applications as a membrane.
  • the touch panel display equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance. Further, the touch panel display of the present invention is superior in touch detection sensitivity to a conventional display having a plastic film as a cover member.
  • the flexible display equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance.
  • the plasma display equipped with the cover member of the present invention has excellent chemical stability due to the characteristics derived from glass, so that it is possible to stably maintain the low voltage characteristics, which contributes to power saving.
  • the electronic device including the display contributes to power saving.
  • the cover member of the present invention has the above-mentioned characteristics, and in particular, since it has the gas barrier property and the water vapor barrier property, it is a substrate member in an organic electroluminescence device (hereinafter sometimes referred to as “organic EL device”) or an organic thin film solar cell. And/or can be preferably used as a sealing member.
  • organic EL device and the organic thin-film solar cell provided with the cover member of the present invention can be thin, lightweight, flexible, and have a long life.
  • the fingerprint authentication sensor equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance. Further, the fingerprint authentication sensor of the present invention has higher sensitivity than a conventional fingerprint authentication sensor having a plastic film as a cover member.
  • the electronic device with a personal authentication function equipped with the fingerprint authentication sensor has high performance, is easy to handle, and has excellent impact resistance.
  • FIG. 2 is a schematic diagram (side view) showing a bending durability test method (R bending method) (one set of bending and stretching operations of the cover member at a bending radius (R) of 180° in a direction in which the surface of the glass plate is concave) is there. It is the figure which expanded and showed (4) of FIG.
  • FIG. 3 is a schematic cross-sectional view showing an example of the cover member (1) of the present invention, in which the orientation of the resin film (6) is adjusted so that the MD direction of the resin film (6) is parallel to the bending direction of the cover member.
  • FIG. 3 is a view of the glass plate (4) being bonded via an adhesive layer (5).
  • the cover member of the present invention is a laminate having a structure in which a glass plate having a thickness of 500 ⁇ m or less and a resin film are laminated via an adhesive layer.
  • the width and length of the cover member can be appropriately adjusted according to the application.
  • the cover member of the present invention has at least a three-layer laminated structure of glass plate/adhesive layer/resin film.
  • the cover member of the present invention may have other layers in addition to the above three layers.
  • various functional films for example, antireflection film, antiglare film, antifouling film, ITO film
  • Etc. may be provided.
  • the total thickness of the cover member of the present invention is, for example, 1000 ⁇ m or less, and in view of excellent flexibility and bending durability, it is preferably 300 ⁇ m or less, more preferably 250 ⁇ m or less, particularly preferably 200 ⁇ m or less, most preferably 150 ⁇ m or less. Is.
  • the lower limit of the total thickness is, for example, 50 ⁇ m, preferably 75 ⁇ m, and particularly preferably 100 ⁇ m.
  • the cover member of the present invention has excellent impact resistance, and the impact resistance according to the following test method (details will be described in Examples) is, for example, 4 cm or more, preferably 5 cm or more, and particularly preferably 6 cm or more.
  • Impact resistance test The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate.
  • the drop height (cm) before cracking is used as an index of impact resistance
  • the cover member of the present invention has flexibility, and its minimum bending radius changes depending on the thickness of the glass plate.
  • the minimum bending radius of the cover member is, for example, 3 mm or less. (That is, it can be bent at least once until the bending radius becomes 3 mm or less).
  • the minimum bending radius of the cover member is, for example, 20 mm or less (for example, 10 to 20 mm).
  • the minimum bending radius of the cover member is, for example, 40 mm or less (for example, 25 to 40 mm).
  • the minimum bending radius of the cover member is, for example, 100 mm or less (for example, 45 to 100 mm).
  • the minimum bending radius of the cover member is, for example, 250 mm or less (for example, 110 to 250 mm).
  • the minimum bending radius of the cover member can be measured by the method described in the examples.
  • the cover member of the present invention (particularly, the cover member having an adhesive layer made of a cured product of the adhesive (1) described later) is excellent in that the stress load on the glass plate during bending is relaxed by the adhesive layer. It can exhibit excellent bending durability. That is, it is possible to suppress the occurrence of cracks in the glass plate even after repeated bending and extension.
  • the bending durability according to the following test is, for example, 10 or more, preferably 100 or more, particularly preferably 1000 or more, further preferably 2000 or more, most preferably 10000 or more.
  • Bending durability test From the stretched state of the cut piece (size: 1 cm ⁇ 7 cm) of the cover member, in the direction in which the surface of the glass plate becomes concave (preferably, the surface of the glass plate becomes concave and the direction along the MD direction of the resin film). The number of sets until a crack is generated in the cut piece when the above-mentioned operation is performed at a speed of 43 sets per minute, with an operation of bending 180° and re-extending at a bending radius (R) below as one set. Is used as an index of bending durability
  • the bending radius (R) is preferably changed according to the thickness of the glass plate as described below.
  • the bending radius is, for example, 3 mm.
  • the bending radius is, for example, 20 mm or less (preferably 10 to 20 mm).
  • the bending radius is, for example, 40 mm or less (preferably 25 to 40 mm).
  • the bending radius is, for example, 100 mm or less (for example, 45 to 100 mm).
  • the bending radius is, for example, 250 ⁇ m and is 500 ⁇ m or less (for example, 110 to 250 mm).
  • the cover member of the present invention has high transparency, and the total light transmittance is, for example, 80% or more, preferably 85% or more, particularly preferably 88% or more, and most preferably 90% or more.
  • the surface hardness of the cover member of the present invention is, for example, H or higher, preferably 2H or higher, especially pencil hardness (JIS K5600-5-4 (ISO/DIN15184)). It is preferably 3H or more, and most preferably 5H or more, and the cover member of the present invention can maintain high surface hardness (particularly the surface hardness of the bent portion) as described above even after continuous bending.
  • the cover member of the present invention can be wound into a roll to form a wound body.
  • the wound body thus obtained is easy to convey and easy to store.
  • the cover member of the present invention since the cover member of the present invention has the above-mentioned characteristics, it can be suitably used as a cover member for a display (in particular, a flexible display). More specifically, the cover member of the present invention can be suitably used as a cover member for a touch panel display or a cover member for a flexible display.
  • the cover member of the present invention has high gas barrier property and water vapor barrier property derived from glass, and also has flexibility, so that it is used as a substrate member and/or a sealing member in an organic EL device or an organic thin film solar cell. It can be used preferably.
  • the surface of the cover member of the present invention is provided with a conductor wiring, it can be used as a printed circuit board (particularly, a flexible printed circuit board).
  • a flexible display, a flexible solar cell, a flexible touch panel electrode substrate, a flexible illumination, a flexible It can be suitably used as a substrate in a flexible device such as a battery.
  • the cover member of the present invention can also be used as a semiconductor insulating film, a liquid crystal display insulating film, an electrode protective film, and the like.
  • the thickness of the glass plate constituting the cover member of the present invention is 500 ⁇ m or less, and in terms of excellent flexibility, preferably 250 ⁇ m, more preferably 150 ⁇ m or less, further preferably 100 ⁇ m or less, particularly preferably 75 ⁇ m or less, most preferably Is 50 ⁇ m or less. Further, in terms of extremely excellent bending durability, it is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and particularly preferably 30 ⁇ m or more.
  • the minimum bending radius of the glass plate changes according to the thickness of the glass plate, but using a glass plate having a minimum bending radius within the following range is effective in improving the bending durability of the cover member. preferable.
  • the minimum bending radius is, for example, 3 mm or less (that is, it can be bent at least once until the bending radius becomes 3 mm or less).
  • the minimum bending radius is, for example, 20 mm or less (for example, 10 to 20 mm).
  • the minimum bending radius is, for example, 40 mm or less (for example, 25 to 40 mm).
  • the minimum bending radius is, for example, 100 mm or less (for example, 45 to 100 mm).
  • the minimum bending radius is, for example, 250 mm or less (for example, 110 to 250 mm).
  • resin film As the resin film forming the cover member of the present invention, it is preferable to use a plastic film having excellent transparency (total light transmittance is 80% or more).
  • thermoplastic plastics As the material of the plastic film, there are thermoplastic plastics and thermosetting plastics.
  • thermoplastic include polyethylene, polypropylene, polyethylene terephthalate (PET), polyvinyl chloride, acrylonitrile butadiene styrene (ABS), polyvinylidene chloride, cellulose acetate (eg, triacetyl cellulose (TAC)), polyethylene.
  • thermosetting plastics include, for example, phenol resin, melamine resin, polyurethane, silicone resin and the like.
  • a plastic film made of at least one material selected from PET, PAI, PI, cellulose acetate (in particular, TAC), and PEN is preferable because of its extremely excellent bending durability.
  • PET or PI plastic films are preferred.
  • the thickness of the resin film is, for example, 500 ⁇ m or less, and in terms of excellent flexibility, it is preferably 250 ⁇ m, more preferably 150 ⁇ m or less, further preferably 140 ⁇ m or less, particularly preferably 120 ⁇ m or less, most preferably 100 ⁇ m or less, further preferably Is 80 ⁇ m or less, particularly preferably 70 ⁇ m or less. Further, it is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and particularly preferably 30 ⁇ m or more from the viewpoint of extremely excellent bending durability.
  • the thickness of the adhesive layer constituting the cover member of the present invention is, for example, 100 ⁇ m or less, preferably 80 ⁇ m or less, particularly preferably 50 ⁇ m or less, and most preferably 30 ⁇ m or less.
  • the lower limit of the thickness is, for example, 1 ⁇ m, preferably 5 ⁇ m.
  • the adhesiveness and bending durability as well as the transparency are preferable, which is preferable.
  • the thickness of the adhesive layer is excessive, the adhesiveness is improved, but the bending durability and the transparency tend to be lowered.
  • the adhesive layer has excellent adhesion to a glass plate or a resin film.
  • the adhesion of the adhesive layer (particularly, the adhesive layer made of a cured product of the adhesive (1) described later) to the glass plate and/or the resin film is determined by the cross-cut method (based on JIS K 5600-5-6). In the 6-step classification test, for example, classification 0 to 2.
  • the elastic modulus of the adhesive layer (particularly, the adhesive layer made of a cured product of the adhesive (1) described later) (for example, 25° C.). Young's modulus) is, for example, preferably 0.01 MPa to 1000 GPa, particularly preferably 1 MPa to 100 GPa, most preferably 5 MPa to 50 GPa, and particularly preferably 5 MPa to 10 GPa.
  • the adhesive layer preferably has excellent heat resistance in that the bending durability of the cover member of the present invention can be kept high even in a high temperature environment, and the glass transition temperature (Tg) or melting point (Tm) of the adhesive layer is preferable. ) Is preferably in the following range.
  • the glass transition temperature (Tg) or melting point (Tm) of the adhesive layer made of a cured product of the adhesive (1) described below is preferably 70° C. or higher, particularly preferably 80° C. or higher.
  • the upper limit is, for example, 150°C.
  • the glass transition temperature (Tg) or melting point (Tm) of the adhesive (1) can be measured by thermal analysis such as DSC or TGA or dynamic viscoelasticity measurement.
  • the glass transition temperature (Tg) of the adhesive layer made of a cured product of the acrylic urethane adhesive (2) described below is preferably 0 to 100°C, more preferably 0 to 70°C, and particularly preferably 0 to 30°C. ..
  • the glass transition temperature (Tg) of the adhesive layer made of a cured product of the vinyl acetate adhesive (3) described below is preferably 5° C. or lower, more preferably less than ⁇ 5° C., and particularly preferably ⁇ 10° C. or lower.
  • the lower limit of the glass transition temperature is, for example, ⁇ 30° C., preferably ⁇ 20° C.
  • the glass transition temperatures of the adhesives (2) and (3) are measured, for example, by a method based on JIS K7244-4, more specifically, by dynamic viscoelasticity measurement (for example, heating rate: 5° C./min, measurement It can be determined as the temperature of the peak top of tan ⁇ (loss tangent) measured in the temperature: 20 to 350° C., deformation mode: dynamic viscoelasticity measurement under the conditions of tensile mode).
  • the storage elastic modulus at 20° C. of the adhesive layer is preferably in the following range.
  • the storage elastic modulus in the present specification is a value measured using a dynamic viscoelasticity measuring device.
  • the storage elastic modulus at 20° C. of the adhesive layer made of a cured product of the acrylic urethane adhesive (2) described below is preferably 10 MPa or more, more preferably 50 MPa or more, particularly preferably 80 MPa or more, and most preferably 120 MPa or more. is there.
  • the storage elastic modulus at 20° C. of the adhesive layer made of a cured product of the vinyl acetate adhesive (3) described later is preferably 10 to 200 MPa, more preferably 30 to 150 MPa, and particularly preferably 30 to 100 MPa.
  • the adhesive layer is made of a cured product of an adhesive.
  • the adhesive for forming the adhesive layer include an ultraviolet curable adhesive, a thermosetting adhesive, and a thermoplastic adhesive.
  • the ultraviolet curable adhesives are preferable because they are excellent in quick-curing properties and can be used for resin films having low heat resistance.
  • "curing" includes curing of the radical-curable or cationic-curable adhesive described below accompanied by polymerization of monomers, and curing by cooling a heated and softened thermoplastic adhesive (or , Solidification).
  • UV curable adhesives include radical curable and cationic curable adhesives. Radical curable adhesives are excellent in that they have fast curability and that they have a wide variety of monomers. On the other hand, the cation-curable adhesive is excellent in that it is less susceptible to curing inhibition by oxygen and is rapidly cured even in the presence of oxygen. Further, since the curing shrinkage is small, it has excellent dimensional stability. When the resin film and the glass plate are bonded to each other using an adhesive having a large curing shrinkage, curling is likely to occur in the obtained cover member due to the curing shrinkage of the adhesive.
  • the cationically curable adhesive contains a cationically polymerizable monomer and a curing catalyst.
  • the cationically polymerizable monomer include compounds containing at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group.
  • the cation-curable adhesive has, as a cation-polymerizable monomer, at least one cation-polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule.
  • a compound hereinafter sometimes referred to as "compound (I)" in an amount of 10% by weight or more based on the total amount of the cationically polymerizable monomer, (In the formula, R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond.
  • s represents a valent group, and s represents an integer of 2 or more
  • the adhesive (1) has excellent adhesion to a glass plate and has an extremely excellent adhesive force even if the glass plate surface is not pretreated (for example, primer treatment, plasma treatment, corona treatment, etc.).
  • the film can be glued. Also, since it has excellent adhesive strength, it can bond the glass plate and the resin film with a very small amount of use, and when the glass plate and the resin film are transparent, they can bond without impairing their transparency. It is possible to form a cover member having excellent transparency (total light transmittance is, for example, 80% or more). Furthermore, the cured product of the adhesive (1) is suppressed in brittleness to an extremely low level and has excellent toughness.
  • the compound (I) is a compound having at least two kinds of functional groups in one molecule. Specifically, it is a compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule.
  • the cured product obtained by curing the adhesive containing the compound (I) has high hardness because the two types of functional groups are polymerized to form a highly crosslinked structure.
  • a cationic polymerization selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule, from the viewpoint of increasing the hardness, reducing the curing shrinkage, and improving the adhesiveness, of the resulting cured product.
  • the compound (i) having one functional group and one hydroxyl group is preferable.
  • the compound (i) includes the following three types of compounds. i-1: a compound having one vinyl ether group and one hydroxyl group, i-2: one compound having an epoxy group and one hydroxyl group, i-3: having one oxetanyl group and one hydroxyl group Compound
  • the compound (i) is represented by the following formula, for example.
  • HO-R a -Y (i) (In the formula, R a represents a divalent hydrocarbon group, a divalent heterocyclic group, or a divalent group in which these are bonded via a single bond or a linking group.
  • Y is a vinyl ether group, an epoxy group, And a cationically polymerizable group selected from oxetanyl groups)
  • the above-mentioned hydrocarbon group includes an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group.
  • divalent aliphatic hydrocarbon group examples include a linear or branched alkylene group having 1 to 18 carbon atoms such as methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group and trimethylene group.
  • a linear or branched alkenylene group having 2 to 18 carbon atoms such as vinylene, 1-methylvinylene, propenylene, 1-butenylene, 2-butenylene, 1-pentenylene or 2-pentenylene group; ethynylene, propynylene, 3- Examples thereof include linear or branched alkynylene groups having 2 to 18 carbon atoms such as methyl-1-propynylene, butynylene, and 1,3-butadiynylene groups.
  • the alicyclic ring that constitutes the divalent alicyclic hydrocarbon group includes a monocyclic hydrocarbon ring and a polycyclic hydrocarbon ring, and the polycyclic hydrocarbon ring includes a spiro hydrocarbon ring and a ring. It includes an aggregated hydrocarbon ring, a bridged cyclic hydrocarbon ring, a condensed cyclic hydrocarbon ring, and a bridged condensed cyclic hydrocarbon ring.
  • Examples of the divalent alicyclic hydrocarbon group include groups obtained by removing two hydrogen atoms from the structural formula of the alicycle.
  • Examples of the monocyclic hydrocarbon ring include C 3-12 cycloalkane rings such as cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane and cyclooctane; C 3-12 cycloalkene rings such as cyclopentene and cyclohexene. Are listed.
  • spiro hydrocarbon ring examples include C 5-16 spiro hydrocarbon rings such as spiro[4.4]nonane, spiro[4.5]decane, and spirobicyclohexane.
  • ring-assembled hydrocarbon ring examples include a ring-assembled hydrocarbon ring containing two or more C 5-12 cycloalkane rings such as bicyclohexane .
  • bridged cyclic hydrocarbon ring examples include pinane, bornane, norpinane, norbornane, norbornene, bicycloheptane, bicycloheptene, bicyclooctane (bicyclo[2.2.2]octane, bicyclo[3.2.1]octane, etc. ) Etc.; bicyclic hydrocarbon rings; tricyclic hydrocarbons such as homobredan, adamantane, tricyclo[5.2.1.0 2,6 ]decane, tricyclo[4.3.1.1 2,5 ]undecane Ring; tetracyclo[4.4.0.1 2,5 . 1 7,10 ]dodecane, perhydro-1,4-methano-5,8-methanonaphthalene, and other tetracyclic hydrocarbon rings.
  • Examples of the condensed cyclic hydrocarbon ring include a plurality of 5- to 8-membered cycloalkane rings such as perhydronaphthalene (decalin), perhydroanthracene, perhydrophenanthrene, perhydroacenaphthene, perhydrofluorene, and perhydroindene. Examples include fused rings that are individually condensed.
  • bridged condensed cyclic hydrocarbon ring examples include diene dimers (for example, cycloalkadiene dimers such as cyclopentadiene, cyclohexadiene, and cycloheptadiene) and hydrogenated products thereof.
  • diene dimers for example, cycloalkadiene dimers such as cyclopentadiene, cyclohexadiene, and cycloheptadiene
  • divalent aromatic hydrocarbon group examples include arylene groups having 6 to 18 carbon atoms such as phenylene group, biphenylene group and naphthylene group.
  • the hydrocarbon group may be various substituents [eg, halogen atom, oxo group, substituted oxy group (eg, alkoxy group, aryloxy group, aralkyloxy group, acyloxy group, etc.), carboxyl group, substituted oxycarbonyl group (alkoxy group). Carbonyl group, aryloxycarbonyl group, aralkyloxycarbonyl group, etc.), substituted or unsubstituted carbamoyl group, cyano group, nitro group, substituted or unsubstituted amino group, sulfo group, heterocyclic group, etc.] Good.
  • the carboxyl group may be protected by a protecting group commonly used in the field of organic synthesis. Further, a heterocyclic ring having an aromatic or non-aromatic attribute may be condensed with the ring forming the alicyclic hydrocarbon group or the aromatic hydrocarbon group.
  • linking group examples include a carbonyl group (—CO—), an ether bond (—O—), a thioether bond (—S—), an ester bond (—COO—), an amide bond (—CONH—), and a carbonate bond. (-OCOO-) and the like.
  • heterocycle forming the divalent heterocyclic group examples include a heterocycle containing an oxygen atom as a hetero atom (for example, a 4-membered ring such as an oxetane ring; a furan ring, a tetrahydrofuran ring, an oxazole ring, an isoxazole ring, 5-membered ring such as ⁇ -butyrolactone ring; 6-membered ring such as 4-oxo-4H-pyran ring, tetrahydropyran ring and morpholine ring; benzofuran ring, isobenzofuran ring, 4-oxo-4H-chromene ring, chroman ring, Fused rings such as isochroman ring; 3-oxatricyclo[4.3.1.1 4,8 ]undecan-2-one ring, 3-oxatricyclo[4.2.1.0 4,8 ]nonane- A bridge ring such as a 2-one ring),
  • a condensed ring such as a benzothiophene ring
  • a heterocycle containing a nitrogen atom as a hetero atom for example, a 5-membered ring such as a pyrrole ring, a pyrrolidine ring, a pyrazole ring, an imidazole ring, a triazole ring; a pyridine ring, 6-membered ring such as pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring; condensed ring such as indole ring, indoline ring, quinoline ring, acridine ring, naphthyridine ring, quinazoline ring and purine ring) .
  • a 5-membered ring such as a pyrrole ring, a pyrrolidine ring, a pyrazole ring, an imidazole ring, a tri
  • the heterocyclic group includes, in addition to the substituents that the hydrocarbon group may have, an alkyl group (for example, a C 1-4 alkyl group such as a methyl group and an ethyl group), a cycloalkyl group, an aryl group. (For example, a phenyl group, a naphthyl group, etc.) may be included.
  • alkyl group for example, a C 1-4 alkyl group such as a methyl group and an ethyl group
  • a cycloalkyl group for example, a phenyl group, a naphthyl group, etc.
  • Examples of the divalent heterocyclic group include groups obtained by removing two hydrogen atoms from the above structural formula of the heterocycle.
  • R a is preferably a divalent hydrocarbon group or a divalent group in which two or more hydrocarbon groups are bonded via a linking group, particularly preferably a divalent aliphatic hydrocarbon group, Alternatively, a divalent group in which two or more aliphatic hydrocarbon groups are bonded via a linking group, most preferably a linear or branched alkylene group having 1 to 18 carbon atoms, or a divalent group having 1 to 18 carbon atoms A group in which two or more linear or branched alkylene groups are bonded via a linking group, particularly preferably a linear or branched alkylene group having 1 to 6 carbon atoms, or 1 to 6 carbon atoms. Two or more of the straight-chain or branched-chain alkylene groups are bound to each other via a linking group. Moreover, as the linking group, an ether bond is preferable.
  • the compound (i) contains a compound (i-1) having one vinyl ether group and one hydroxyl group and/or a compound (i-3) having one oxetanyl group and one hydroxyl group, It is preferable in that a cured product having higher hardness can be obtained, and it is particularly preferable to contain at least the compound (i-3).
  • the compound (i) preferably contains at least one selected from the compounds represented by the following formulas (i-1-1) to (i-1-3) (i-3-1), Especially, it is preferable to contain at least a compound represented by the following formula (i-3-1).
  • the compound (b) is a compound represented by the following formula (b).
  • R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond.
  • s represents a valent group, and s represents an integer of 2 or more
  • S in the formula represents an integer of 2 or more, for example, an integer of 2 to 6, preferably an integer of 2 to 4, particularly preferably an integer of 2 to 3, and particularly preferably 2.
  • examples of the divalent linear or branched saturated aliphatic hydrocarbon group include, for example, methylene group, methylmethylene group, and dimethyl group.
  • Straight-chain or branched alkylene having 1 to 18 carbon atoms preferably 1 to 10 carbon atoms, particularly preferably 3 to 6 carbon atoms
  • the trivalent or higher valent linear or branched saturated aliphatic hydrocarbon group is further defined as (s-2) hydrogens from the structural formula of the divalent linear or branched saturated aliphatic hydrocarbon group.
  • the total number of carbon atoms of the group represented by R is, for example, 1 to 20, preferably 2 to 15, particularly preferably 2 to 10, and most preferably 3 to 8.
  • Examples of the compound (b) include compounds represented by the following formulas (b-1) to (b-5), trimethylolethane triglycidyl ether, pentaerythritol tetraglycidyl ether, glycerin triglycidyl ether, and dipenta. At least one selected from erythritol hexaglycidyl ether is preferable, and particularly at least selected from compounds represented by the following formulas (b-1) to (b-5) in view of low viscosity and excellent coatability. It is one kind, and most preferably at least one kind selected from the compounds represented by the following formulas (b-1) to (b-4).
  • the adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one vinyl ether group in one molecule and having no hydroxyl group (in the present specification, other than the compound (I) described above). 1 type, or 2 or more types may be contained.
  • the vinyl ether compound (A) may have another cationically polymerizable group (for example, an epoxy group, an oxetanyl group, etc.) in addition to the vinyl ether group.
  • Examples of the vinyl ether compound (A) include compounds represented by the following formula (a).
  • the t is an integer of 1 or more, for example, an integer of 1 to 10, preferably an integer of 1 to 5, particularly preferably an integer of 2 to 5.
  • t-valent hydrocarbon group and t-valent heterocyclic group in R c include t-valent group corresponding to the divalent hydrocarbon group and divalent heterocyclic group in R a.
  • the t-valent hydrocarbon group and the t-valent heterocyclic group may have a substituent, and as the substituent, the divalent hydrocarbon group and the divalent heterocyclic group in R a can be used .
  • examples of the linking group include the same examples as the linking group for R a .
  • R c is preferably a t-valent group having an alicyclic or heterocyclic skeleton.
  • Examples of the vinyl ether compound (A) include compounds represented by the following formulas (a-1) to (a-2), cyclohexyl dimethanol monovinyl ether, cyclohexyl vinyl ether, cyclohexyl methyl vinyl ether, cyclohexyl ethyl vinyl ether, menthyl vinyl ether, and tetrahydrofuran. Furyl vinyl ether, norbornenyl vinyl ether, 1-adamantyl vinyl ether, 2-adamantyl vinyl ether, 1,4-cyclohexanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether and the like are preferable.
  • the adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one epoxy group in a molecule and not having a hydroxyl group (in addition to the compound (I) and the compound (b) described above. Except for compounds having a vinyl ether group; in the present specification, it may be referred to as “epoxy compound (B)”) may be contained in one kind or two or more kinds.
  • the epoxy compound (B) may have another cationically polymerizable group (eg, oxetanyl group) in addition to the epoxy group.
  • the epoxy group includes two adjacent carbon atoms forming an alicyclic ring (for example, a 3- to 8-membered alicyclic ring) such as a cyclohexene oxide group represented by the following formula (e-1), and an oxygen atom. And a group composed of and (hereinafter sometimes referred to as “alicyclic epoxy group”) and an ethylene oxide group represented by the following formula (e-2).
  • R 1 represents a hydrogen atom or a C 1-3 alkyl group.
  • a compound having two or more epoxy groups in one molecule is preferable because of its excellent curability, and particularly, a compound having two or more alicyclic epoxy groups in one molecule, ethylene oxide. At least one selected from a compound having two or more groups in one molecule and a compound having one or more alicyclic epoxy groups and one or more ethylene oxide groups in one molecule is preferable.
  • a compound represented by the following formula (b′) is preferable.
  • X represents a single bond or a linking group.
  • the linking group include a divalent hydrocarbon group, an alkenylene group in which part or all of carbon-carbon double bonds are epoxidized, a carbonyl group (—CO—), an ether bond (—O—), Examples thereof include an ester bond (-COO-), a carbonate bond (-O-CO-O-), an amide bond (-CONH-), and a group in which a plurality of these are linked.
  • Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms and a divalent alicyclic hydrocarbon group having 3 to 18 carbon atoms.
  • Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group, trimethylene group and the like.
  • Examples of the divalent alicyclic hydrocarbon group having 3 to 18 carbon atoms include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group and 1,2-cyclohexylene group.
  • cycloalkylene groups (including cycloalkylidene group) such as 1,3-cyclohexylene group, 1,4-cyclohexylene group, and cyclohexylidene group.
  • alkenylene group in the alkenylene group in which some or all of the carbon-carbon double bonds are epoxidized include, for example, vinylene group, propenylene group, 1-butenylene group.
  • alkenylene group examples include linear or branched alkenylene groups having 2 to 8 carbon atoms such as 2-butenylene group, butadienylene group, pentenylene group, hexenylene group, heptenylene group and octenylene group.
  • the epoxidized alkenylene group is preferably an alkenylene group in which all carbon-carbon double bonds are epoxidized, and more preferably an alkenylene group having 2 to 4 carbon atoms in which all carbon-carbon double bonds are epoxidized. It is an alkenylene group.
  • a substituent may be bonded to the cyclohexene oxide group in the above formula (b′), and examples of the substituent include a halogen atom, a C 1-10 alkyl group, a C 1-10 alkoxy group, C 2-10 alkenyloxy group, C 6-14 aryloxy group, C 7-18 aralkyloxy group, C 1-10 acyloxy group, C 1-10 alkoxycarbonyl group, C 6-14 aryloxycarbonyl group, C 7- 18 aralkyloxycarbonyl group, epoxy group-containing group, oxetanyl group-containing group, C 1-10 acyl group, isocyanate group, sulfo group, carbamoyl group, oxo group and the like.
  • Typical examples of the compound represented by the above formula (b') include (3,4,3',4'-diepoxy)bicyclohexyl, bis(3,4-epoxycyclohexylmethyl)ether, 1,2. -Epoxy-1,2-bis(3,4-epoxycyclohexan-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 1,2-bis(3,4) —Epoxycyclohexan-1-yl)ethane, compounds represented by the following formulas (b′-1) to (b′-8) and the like can be mentioned.
  • L is an alkylene group having 1 to 8 carbon atoms (for example, a straight chain or branched chain having 1 to 3 carbon atoms such as methylene group, ethylene group, propylene group, isopropylene group).
  • a chain-like alkylene group is shown.
  • n 1 and n 2 in the following formulas (b′-5) and (b′-7) each represent an integer of 1 to 30.
  • the compounds having two or more alicyclic epoxy groups in one molecule further include compounds represented by the following formulas (b'-9) (b'-10).
  • N 3 to n 8 in the following formulas (b′-9) and (b′-10) are the same or different and each represents an integer of 1 to 30.
  • Examples of the compound having two or more ethylene oxide groups in one molecule include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated biphenol diglycidyl ether, and hydrogenated phenol novolac diglycidyl.
  • Alicyclic glycidyl ethers such as ethers and hydrogenated cresol novolac diglycidyl ethers; bisphenol A diglycidyl ethers, bisphenol F diglycidyl ethers, biphenol diglycidyl ethers, phenol novolac diglycidyl ethers, cresol novolac diglycidyl ethers
  • Aromatic glycidyl ethers such as ethers; compounds represented by the following formula (b′′) and the like can be mentioned.
  • R" is a group (p-valent organic group) obtained by removing p hydroxyl groups (-OH) from the structural formula of p-valent alcohol, and p and n 9 each represent a natural number. ..
  • the p-valent alcohol [R′′(OH) p ] include polyhydric alcohols such as 2,2-bis(hydroxymethyl)-1-butanol (polyhydric alcohols having 1 to 15 carbon atoms) and the like.
  • n 9 is 1 to case 30 is preferably .p is 2 or more, n 9 in groups in each [] (outside the square brackets) may be different may be the same
  • Specific examples of the compound represented by the above formula (b′′) include a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol.
  • EHPE3150 trade name "manufactured by Daicel Corporation) and the like can be mentioned.
  • Examples of the compound having at least one alicyclic epoxy group and at least one ethylene oxide group in one molecule include 1,2:8,9-diepoxylimonene.
  • epoxy compound (B) containing a compound having two or more alicyclic epoxy groups in one molecule (particularly, a compound represented by the formula (b′)) has fast curing property, It is preferable in that a cured product with high hardness can be obtained.
  • the adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one oxetanyl group in one molecule other than the compound (I) and having no hydroxyl group (vinyl ether group and/or Except for compounds having an epoxy group; in the present specification, it may be referred to as "oxetane compound (C)"), and may contain one or more kinds.
  • the oxetane compound (C) is represented by, for example, the following formula (c).
  • R a represents a monovalent organic group
  • R b represents a hydrogen atom or an ethyl group
  • m represents an integer of 0 or more.
  • the monovalent organic group for R a is a monovalent hydrocarbon group, a monovalent heterocyclic group, a substituted oxycarbonyl group (alkoxycarbonyl group, aryloxycarbonyl group, aralkyloxycarbonyl group, cycloalkyloxycarbonyl group. Etc.), substituted carbamoyl groups (N-alkylcarbamoyl groups, N-arylcarbamoyl groups, etc.), acyl groups (aliphatic acyl groups such as acetyl groups; aromatic acyl groups such as benzoyl groups), and two or more of these. Include a monovalent group bonded through a single bond or a linking group.
  • Examples of the monovalent hydrocarbon group and the monovalent heterocyclic group include monovalent groups corresponding to the divalent hydrocarbon group and the divalent heterocyclic group in R a above.
  • Examples of the linking group include the same examples as the linking group for R a . These groups may have a substituent, and examples of the substituent include the same examples as the substituent which the hydrocarbon group for R a may have.
  • m represents an integer of 0 or more, and is, for example, an integer of 0 to 20, preferably an integer of 0 to 1.
  • oxetane compound (C) it is preferable to use, among others, a compound having two or more oxetanyl groups in one molecule from the viewpoint of having a fast curing property and a cured product having a high hardness.
  • a compound represented by the following formula (c-1), a compound represented by the following formula (c-2), and the like are preferable.
  • commercially available products such as "Aron oxetane OXT-221" and “Aron oxetane OXT-121" (all manufactured by Toagosei Co., Ltd.) can be used.
  • the adhesive (1) contains, for example, 50 to 99.9% by weight (preferably 70 to 98% by weight) of the cationically polymerizable monomer, based on the total amount (100% by weight) of the adhesive.
  • the adhesive (1) contains at least the compound (I) and the compound (b) as a cationically polymerizable monomer, and further, the vinyl ether compound (A), the epoxy compound (B), and the oxetane compound (C). You may contain 1 type(s) or 2 or more types selected from.
  • the content of the compound (I) is preferably 10% by weight or more (for example, 10 to 65% by weight) of the total amount of the cationically polymerizable monomer contained in the adhesive (1), and a cured product having particularly excellent adhesion to a resin film.
  • the lower limit is preferably 25% by weight, more preferably 30% by weight, particularly preferably 33% by weight, and most preferably 35% by weight.
  • the upper limit is preferably 55% by weight, particularly preferably 50% by weight, and most preferably 45% by weight from the viewpoint of obtaining a cured product having particularly high hardness. If the content of the compound (I) is less than the above range, the adhesion to glass tends to decrease.
  • the content of the compound (i-1-1) having at least one vinyl ether group and at least one hydroxyl group and the compound (i-3-1) having at least one oxetanyl group and at least one hydroxyl group is an adhesive agent. It is 25% by weight or more (for example, 25 to 65% by weight) based on the total amount of the cationically polymerizable monomer contained in (1), because a cured product having excellent adhesion to a resin film and high hardness can be obtained. From the standpoint of excellent curability, it is preferably 25% by weight or more and less than 60% by weight, most preferably 25 to 55% by weight, and particularly preferably 25 to 45% by weight.
  • the content of the compound (i-1-1) having one vinyl ether group and one hydroxyl group is, for example, 30% by weight or less, preferably 25% by weight or less of the total amount of the cationically polymerizable monomer contained in the adhesive (1). And particularly preferably 18% by weight or less.
  • the content of the compound (i-3-1) having one oxetanyl group and one hydroxyl group is excellent in adhesiveness to a resin film, and a cured product having high hardness is obtained, and thus the adhesive (1)
  • the amount is preferably 15% by weight or more, more preferably 20% by weight or more, and particularly preferably 25% by weight or more based on the total amount of the cationically polymerizable monomer contained in.
  • the upper limit of the content is, for example, 55% by weight, preferably 45% by weight, and particularly preferably 40% by weight.
  • the content of the compound (b) is preferably 5% by weight or more based on the total amount of the cationically polymerizable monomer contained in the adhesive (1), has fast curing property, and has high hardness with excellent adhesion to glass. From the viewpoint of obtaining a cured product of, the content is more preferably 5 to 45% by weight, particularly preferably 12 to 40% by weight, and most preferably 18 to 30% by weight. When the content of the compound (b) is less than the above range, the obtained cured product tends to have low crack resistance and become brittle.
  • the compound (I)/compound (b) weight ratio is, for example, 0.5 or more, preferably 1.0 or more, and particularly preferably 1 from the viewpoint of obtaining a cured product having excellent adhesion to glass. 0.1 or more, and most preferably 1.3 or more.
  • the upper limit of the weight ratio is, for example, 6.5, preferably 5.5, particularly preferably 3.0, most preferably 2.5, and particularly preferably 2.0.
  • the content of the compound other than the compound (I) and the compound (b), which has two or more cationically polymerizable groups selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule is From the viewpoint of curability, for example, 15% by weight or more, preferably 20% by weight or more, particularly preferably 25% by weight or more, and most preferably 30% by weight or more of the total amount of the cationically polymerizable monomer contained in the adhesive (1). is there.
  • the upper limit of the content is, for example, 55% by weight, preferably 50% by weight, from the viewpoint of obtaining a cured product having high hardness and excellent adhesion to glass.
  • the content of the compound represented by the formula (b′)) is a cationically polymerizable monomer contained in the adhesive (1) in that it has fast curing property and a cured product with high hardness is obtained.
  • the total amount is preferably 10% by weight or more, more preferably 20% by weight or more, and particularly preferably 25% by weight or more.
  • the upper limit of the content is, for example, 50% by weight, preferably 45% by weight, and particularly preferably 43% by weight from the viewpoint of obtaining a cured product having high hardness and excellent adhesion to glass.
  • the content of the compound having two or more vinyl ether groups in one molecule and having no hydroxyl group is, for example, 20% by weight or less of the total amount of the cationically polymerizable monomers contained in the adhesive (1), and preferably It is 15% by weight or less.
  • the content of the compound having two or more oxetanyl groups in one molecule and having no hydroxyl group is, for example, 20% by weight or less of the total amount of the cationically polymerizable monomer contained in the adhesive (1), and preferably It is 15% by weight or less.
  • the content of the compound having one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule and having no hydroxyl group is, from the viewpoint of curability, an adhesive (1 Is less than 30% by weight, more preferably 20% by weight or less, particularly preferably 10% by weight or less, most preferably 5% by weight or less, particularly preferably 1% by weight. It is as follows.
  • the curing catalyst includes known or conventional photocationic polymerization initiators and photoradical polymerization initiators. It is preferable that the cationically curable adhesive contains at least a photocationic polymerization initiator as a curing catalyst, and in particular, it is preferable that both the cationic photopolymerization initiator and the photoradical polymerization initiator are contained so that the curing reaction of the adhesive may be further improved. It is preferable in that it can be efficiently progressed, and a cured product having particularly high hardness can be obtained.
  • the cationically curable adhesive preferably uses a photocationic polymerization initiator as a curing catalyst, and the amount thereof is, for example, 0.1 to 20 parts by weight, preferably 0 based on 100 parts by weight of the cationically polymerizable monomer. 0.5 to 20 parts by weight, particularly preferably 1 to 10 parts by weight.
  • the amount of the photoradical polymerization initiator used is 0.1 to 5 parts by weight based on 100 parts by weight of the cationically polymerizable monomer. It is particularly preferably 0.5 to 3 parts by weight, most preferably 0.5 to 2 parts by weight.
  • Examples of the cationic photopolymerization initiator include diazonium salt compounds, iodonium salt compounds, sulfonium salt compounds, phosphonium salt compounds, selenium salt compounds, oxonium salt compounds, ammonium salt compounds, bromine salt compounds. Etc.
  • product names “CPI-101A”, “CPI-100P”, “CPI-110P” above, manufactured by San Apro Co., Ltd.
  • photoradical polymerization initiator examples include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, 1-(4-isopropylphenyl)-2- Hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)-phenyl(2-hydroxy-2- Propyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoinphenyl Ether, benzyl dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone-4-me
  • radical-curable adhesive examples include acrylic adhesives.
  • the acrylic adhesive contains a (meth)acrylic copolymer and a crosslinking agent.
  • the (meth)acrylic copolymer can be produced, for example, by reacting one or more acrylic monomers in the presence of a photo or thermal radical polymerization initiator.
  • the weight average molecular weight (converted to standard polystyrene) of the (meth)acrylic copolymer is, for example, about 100,000 to 5,000,000.
  • acrylic monomer examples include ethyl acrylate, butyl acrylate, isobutyl acrylate, t-butyl acrylate, and acrylic acid C 1-10 alkyl esters such as 2-ethylhexyl acrylate, and the like.
  • acrylic acid esters examples include (meth)acrylic acid esters such as methacrylic acid esters. These can be used individually by 1 type or in combination of 2 or more types.
  • acrylic monomer other radical polymerizable monomers copolymerizable with the (meth)acrylic acid ester can be used in addition to the (meth)acrylic acid ester.
  • Other radically polymerizable monomers include carboxyl group-containing monomers and hydroxyl group-containing monomers. These can be used individually by 1 type or in combination of 2 or more types.
  • carboxyl group-containing monomer examples include monocarboxylic acids such as (meth)acrylic acid, crotonic acid and isocrotonic acid; polyvalent carboxylic acids such as itaconic acid, maleic acid and fumaric acid; maleic anhydride and itaconic anhydride.
  • An anhydride of polyvalent carboxylic acid; a monoalkyl ester of the polyvalent carboxylic acid for example, a C 1-16 alkyl ester such as methyl ester, ethyl ester, propyl ester, butyl ester, hexyl ester, octyl ester, lauryl ester, etc.
  • hydroxyl group-containing monomer examples include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, Examples thereof include vinyl alcohol and allyl alcohol.
  • radically polymerizable monomers include olefins [eg chain olefins such as ethylene, propylene, 1-butene and butadiene (especially C 2-12 alkenes); cyclopentene, cyclohexene, cycloheptene, norbornene, Cyclic olefins such as 5-methyl-2-norbornene and tetracyclododecene], aromatic vinyl compounds (eg, styrene, vinyltoluene, ⁇ -methylstyrene, 1-propenylbenzene, 1-vinylnaphthalene, 2-vinylnaphthalene, C 6-14 aromatic vinyl compounds such as 3-vinylpyridine, 3-vinylfuran, 3-vinylthiophene and 3-vinylquinoline; urethane (meth)acrylates (eg 2,4-tolylene diisocyanate, 1,3 -Xylylene diiso
  • reaction product with (meth)acrylic monomer having active hydrogen vinyl ester (eg, , C 1-16 fatty acid vinyl esters such as vinyl acetate, vinyl propionate, vinyl caprylate, and vinyl caproate), maleic acid esters or fumaric acid esters (eg, diethyl maleate, dibutyl maleate, dioctyl maleate, maleic acid) Maleic acid di-C 1-10 alkyl esters such as acid di(2-ethylhexyl), and fumaric acid diesters corresponding thereto, and indenes (eg, indene, methyl indene, ethyl indene, dimethyl indene, etc.) Indene; halogenated indene such as chloroindene and bromoindene) and the like.
  • vinyl ester eg, C 1-16 fatty acid vinyl esters such as vinyl acetate, vinyl propionate, vinyl caprylate, and vinyl caproate
  • cross-linking agent examples include isocyanate cross-linking agents and epoxy cross-linking agents.
  • isocyanate-based cross-linking agent examples include aliphatic polyisocyanates such as 1,6-hexamethylene diisocyanate; cycloaliphatic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; toluene diisocyanate and xylylene diisocyanate.
  • epoxy cross-linking agent examples include 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane and resorcin diglycidyl ether. These can be used individually by 1 type or in combination of 2 or more types.
  • the content of the cross-linking agent is, for example, 0.001 to 10 parts by weight with respect to 100 parts by weight of the (meth)acrylic copolymer.
  • thermoplastic adhesive contains at least one thermoplastic resin.
  • thermoplastic resin examples include (meth)acrylic acid ester homopolymers or copolymers, (meth)acrylic/urethane copolymers (particularly, (meth)acrylic/urethane graft copolymers), styrene-(meth) ) Acrylic ester copolymer, vinyl acetate-(meth)acrylic acid ester copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-(meth)acrylic acid copolymer, (meth)acrylic acid ester -(Meth)acrylic acid copolymer, styrene-acrylonitrile-(meth)acrylic acid ester copolymer, styrene-(meth)acrylic acid ester-(meth)acrylic acid copolymer, styrene-acrylonitrile-(meth)acrylic Acid ester-(meth)acrylic acid copolymer, ethylene-vinyl acetate-
  • thermoplastic adhesive an acrylic urethane adhesive (2) containing a (meth)acrylic/urethane copolymer or a vinyl acetate adhesive (3) containing a vinyl acetate polymer (especially ethylene-vinyl acetate (Copolymer) is preferable in that a cover member having excellent bending durability can be obtained.
  • the adhesive may further contain a solvent, but if it is solvent-free, that is, if it does not contain a solvent, the drying property can be improved, and it can be applied to a resin film that is easily deteriorated by the solvent. Is preferable, and the generation of odor due to volatilization of the solvent can be prevented.
  • the content of the solvent is, for example, 10% by weight or less, preferably 5% by weight or less of the total amount of the adhesive (100% by weight). It is particularly preferably 1% by weight or less.
  • additives such as an antioxidant, a defoaming agent, a leveling agent, a silane coupling agent, a filler, a flame retardant, and a stabilizer (for example, amines) may be added to the adhesive.
  • the adhesive is a cation-curable adhesive
  • a well-known and commonly used sensitizer for example, acridine compound, benzoflavins, perylenes, anthracenes, thioxanthone compounds, laser dyes, etc.
  • a sensitizer or the like can be added.
  • the inclusion of a sensitizer improves the ultraviolet light absorption of the curing catalyst and improves the curability.
  • the content of the sensitizer (the total amount of two or more kinds) is, for example, 0.05 to 10 parts by weight, preferably 0.1 to 5 parts by weight, relative to 100 parts by weight of the monomer. Is.
  • the coloration of the obtained cured product can be suppressed to an extremely low level. It is preferable from the viewpoint that it can be used, and the combined ratio of these compounds [the compound represented by the formula (d-1)/the compound represented by the formula (d-2); the weight ratio] is, for example, 0.01 to 1.0, It is preferably 0.1 to 0.5, particularly preferably 0.2 to 0.5.
  • a trade name "ANTRACURE UVS-1331” manufactured by Kawasaki Kasei Co., Ltd.
  • a trade name “ANTRACURE UVS-581” manufactured by Kawasaki Kasei Co., Ltd.
  • the surface tension (at 30° C. and 1 atmospheric pressure) of the adhesive is preferably 10 to 50 mN/m, for example.
  • the viscosity of the adhesive [at 25° C. and a shear rate of 100 (1/s)] is 1 to 1000 mPa ⁇ s because it has excellent fluidity and excellent dischargeability when applied using an inkjet printing machine or the like.
  • s is preferable, more preferably 5 to 500 mPa ⁇ s, particularly preferably 10 to 100 mPa ⁇ s, most preferably 10 to 50 mPa ⁇ s, and particularly preferably 10 to 30 mPa ⁇ s.
  • the surface tension of the adhesive can be measured by the Wilhelmy method (plate method) using, for example, a high precision surface tensiometer “DY-700” (manufactured by Kyowa Interface Science Co., Ltd.).
  • the cover member of the present invention can be manufactured, for example, by bonding the above-mentioned glass plate and resin film with an adhesive, and then curing the adhesive.
  • the MD direction of the resin film is the bending direction of the cover member (or , Along the bending direction showing excellent bending durability) or substantially parallel to the bending direction of the cover member (the crossing angle between the MD direction of the resin film and the bending direction of the cover member is, for example, 30° or less, preferably 20). 0° or less, particularly preferably 10° or less, most preferably 5° or less), or the MD direction of the resin film is substantially perpendicular to the fold line generated when the cover member is bent in the bending direction (MD direction of the resin film).
  • the laminating direction is adjusted so that the crossing angle of the fold line and the fold line intersects, for example, 60 to 120°, preferably 70 to 110°, particularly preferably 80 to 100°, and most preferably 85 to 95°. Is preferable in that a cover member having particularly excellent bending durability can be obtained (see FIG. 4 ).
  • the MD direction is the direction in which the molten resin flows when the resin film is manufactured by injection molding, and tends to have better mechanical strength than the TD direction.
  • the MD direction and the TD direction of the resin film can be confirmed by the birefringence orientation direction measured using, for example, a two-dimensional birefringence device (PA-100, manufactured by Photonic Lattice Co., Ltd.).
  • the method of applying the adhesive to the glass plate and/or the resin film is not particularly limited, and may be, for example, a printing method, a coating method, or the like. Specifically, screen printing, mask printing, offset printing, inkjet printing, flexo printing, gravure printing, squeegee printing, silk screen printing, stamping, dispensing, spraying, brushing, etc. ..
  • Curing of the adhesive can be performed by a method according to the type of adhesive. For example, when using an ultraviolet curable adhesive as the adhesive, it can be cured by irradiating it with ultraviolet rays, and when using a thermoplastic adhesive as the adhesive, cool the adhesive softened by heating. Can be cured (or solidified).
  • the ultraviolet light source examples include a UV-LED, a mercury lamp such as a low, medium or high pressure mercury lamp, a mercury xenon lamp, a metal halide lamp, a tungsten lamp, an arc lamp, an excimer lamp, an excimer laser, a semiconductor laser, and a YAG.
  • a laser, a laser system in which a laser and a nonlinear optical crystal are combined, a high frequency induced ultraviolet ray generator, or the like can be used.
  • the ultraviolet irradiation amount (integrated light amount) is, for example, 10 to 5000 mJ/cm 2 .
  • heat treatment may be applied in addition to UV irradiation.
  • the degree of curing can be further improved.
  • the heating temperature is about 40 to 200° C.
  • the heating time is about 1 minute to 15 hours.
  • the curing degree can be improved by leaving still for 1 to 48 hours at room temperature (20° C.) after irradiation with ultraviolet rays.
  • the display of the present invention includes the cover member.
  • the display includes a liquid crystal display and a plasma display. Further, the display includes a touch panel display, a flexible display and the like.
  • a liquid crystal display for example, as the display of the present invention includes the cover member as a member for covering the panel surface. Further, for example, a plasma display as a display of the present invention includes the cover member as an electrode protective film.
  • the display of the present invention includes the above-mentioned cover member, it has characteristics derived from glass (fine texture, transparency, smoothness, thermal stability, electrical insulation, chemical stability, high hardness, resistance to twisting, etc.). ), and also has flexibility and impact resistance. Furthermore, when the cover member has a specific adhesive layer (preferably an adhesive layer made of a cured product of the adhesive (1) described above), cracks do not occur even when repeatedly bent.
  • a touch panel display for example, a capacitance type or a resistance film type touch panel display
  • the cover member has a high-quality touch derived from glass.
  • glass has a higher relative permittivity than plastic
  • a touch panel display including the cover member is superior in touch detection sensitivity to a conventional touch panel display formed of a plastic film.
  • the cover member of the present invention is thin, it has high hardness and excellent impact resistance, so that the cover member can be made into a thin film, whereby the charge amount can be increased and the touch detection sensitivity can be further improved. Can be increased.
  • the hardness is high and the impact resistance is excellent as described above, even if an impact is applied to the display surface, cracks hardly occur and the handling is easy. Further, since it has excellent chemical stability, the surface of the display does not become white and turbid even when it is wiped with a detergent or the like.
  • the flexible display provided with the cover member (preferably, the cover member having the adhesive layer made of the cured product of the adhesive (1)) is excellent in flexibility and does not crack even when repeatedly bent,
  • the display surface does not turn white.
  • it has a good texture derived from glass.
  • the hardness is high and the shock resistance is excellent, even if an impact is applied to the display surface, cracks are less likely to occur and the handling is easy.
  • it has excellent chemical stability, the surface of the display does not become cloudy even when it is wiped with a detergent or the like.
  • Plasma displays have a structure in which two glass substrates, a front substrate and a rear substrate, are bonded together. Display electrodes, a dielectric layer, a protective layer, and the like are formed on the front substrate, and address electrodes, barriers, phosphor layers, and the like are formed on the rear substrate.
  • the electrode protection film is a member that covers the dielectric surface of the front substrate and serves as an electron emission source of the plasma display.
  • the cover member since the cover member has excellent chemical stability due to the characteristics derived from glass, low voltage characteristics can be stably maintained, which contributes to power saving. ..
  • An electronic device of the present invention includes the above display. More specifically, the display includes a display in which the cover member covers the panel surface. Alternatively, it includes a display having the cover member as an electrode protective film.
  • the electronic device of the present invention Since the electronic device of the present invention has the above-mentioned constitution, it has characteristics derived from glass (fine texture, transparency, smoothness, thermal stability, electrical insulation, chemical stability, high hardness, and resistance to twisting, etc.). ), and also has flexibility and impact resistance. Furthermore, when the display includes a cover member having an adhesive layer made of the cured product of the adhesive (1), it has excellent bending durability and does not crack even when repeatedly bent. Therefore, the electronic device of the present invention has high performance, is easy to handle, and has excellent impact resistance.
  • the organic EL device of the present invention includes the cover member. More specifically, the cover member is provided as a substrate member and/or a sealing member.
  • the cover member has a high gas barrier property derived from glass and a high water vapor barrier property (water vapor permeation at 23° C. and 50% RH). Since the rate is, for example, 10 ⁇ 5 g/m 2 /day or less), it is possible to prevent the organic material and the electrode from being deteriorated by moisture or oxygen. Further, the cover member also has flexibility.
  • the organic EL device of the present invention includes an organic EL display and an organic EL lighting.
  • the organic thin film solar cell of the present invention includes the cover member. More specifically, the cover member is provided as a substrate member and/or a sealing member.
  • the element (surface electrode/hole transport layer/photoelectric conversion layer/back electrode) constituting the organic thin-film solar cell is deteriorated by a very small amount of water or oxygen, but the cover member has a high gas barrier property derived from glass. Since it has a high water vapor barrier property (the water vapor transmission rate at 23° C. and 50% RH is, for example, 10 ⁇ 5 g/m 2 /day or less), it is possible to prevent the element from being deteriorated by moisture or oxygen. .. Further, the cover member also has flexibility.
  • the organic thin film solar cell of the present invention a thin and lightweight flexible organic thin film solar cell can be realized.
  • deterioration of the element can be prevented and a long life can be realized.
  • the organic thin film solar cell of the present invention can be suitably used for mobile charging devices and the like.
  • the fingerprint authentication sensor of the present invention includes the cover member as a protective film that covers the surface of the fingerprint authentication sensor.
  • the fingerprint authentication sensor of the present invention can be used for electronic devices (including IC cards) desired to have a personal authentication function such as a touch panel, a display, a card key, and a credit card.
  • the fingerprint authentication sensor has a structure in which an electrode is formed on the first substrate and the second substrate is stacked on it.
  • the fingerprint authentication sensor of the present invention includes the cover member as the first substrate and/or the second substrate.
  • the fingerprint authentication sensor of the present invention Since the fingerprint authentication sensor of the present invention has the above-mentioned configuration, it has a high-quality touch derived from glass. Further, glass has a higher relative dielectric constant than plastic. Therefore, the fingerprint authentication sensor can have a larger capacitance and higher sensitivity than a conventional product using a plastic film as a substrate. Further, since the hardness is high and the impact resistance is excellent, even if an impact is applied to the surface, cracks are less likely to occur and the handling is easy. Further, since it has excellent chemical stability, the surface of the display does not become white and turbid even when it is wiped with a detergent or the like.
  • An electronic device with a personal authentication function of the present invention is an electronic device (including an IC card) provided with the fingerprint authentication sensor, and includes, for example, a touch panel with a personal authentication function, a display with a personal authentication function, a card key with a personal authentication function, and an individual. Examples include credit cards with an authentication function.
  • the electronic device with a personal authentication function of the present invention includes the fingerprint authentication sensor including the cover member, it has high sensitivity and high quality. Furthermore, it is easy to handle.
  • Preparation Example 1 (Preparation of adhesive) Each component was mixed according to the formulation shown in Table 1 (unit is parts by weight) to obtain an adhesive. The viscosity of the obtained adhesive at 25° C. and a shear rate of 100 (1/s) was measured using an E-type viscometer (trade name “VISCOMETER TV-25”, manufactured by Toki Sangyo Co., Ltd.), It was 22.6 mPa ⁇ s.
  • the adhesive obtained in the preparation example and the comparative preparation example was applied to a glass plate (trade name "S9112", manufactured by Matsunami Glass Industry Co., Ltd.) (coating thickness: 5 ⁇ m), and an LED irradiator as a light source under an air atmosphere.
  • a glass plate trade name "S9112", manufactured by Matsunami Glass Industry Co., Ltd.
  • an LED irradiator as a light source under an air atmosphere.
  • the obtained laminate was subjected to an adhesion test (cross-cut method; conforming to JIS K5600-5-6 (ISO2409)), and the adhesion was evaluated by a 6-step classification test.
  • HEVE ethylene glycol monovinyl ether
  • HBVE 4-hydroxybutyl vinyl ether
  • DEGMVE diethylene glycol monovinyl ether
  • OXT101 3-ethyl-3-hydroxymethyl oxetane, trade name "Aron Oxetane OXT-101", manufactured by Toagosei Co., Ltd.
  • OXT221 Bis[1-ethyl(3-oxetanyl)] Methyl ether, trade name "Aron Oxetane OXT-221", manufactured by Toagosei Co., Ltd.
  • DCPA tricyclodecane dimethanol diacrylate
  • DPGDA dipropylene glycol diacrylate
  • VEEA 2-(2-vinyloxyethoxy)ethyl acrylate
  • CPI-110P a mixture of diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate and thiodi-p-phenylenebis(diphenylsulfonium)bis(hexafluorophosphate) (99.5/0.5), trade name "CPI-110P", Irg184: 1-hydroxy-cyclohexyl-phenyl-ketone manufactured by San-Apro Co., Ltd., trade name "CPI-110P”
  • Irg184 1-
  • TAC triacetyl cellulose film
  • a layer/G-leaf stack was obtained.
  • the pencil hardness of the G-leaf surface of the obtained laminate was 9H.
  • Example 3 A laminate was obtained in the same manner as in Example 2 except that the PET film (thickness: 75 ⁇ m) was replaced with the PET film (thickness: 38 ⁇ m).
  • Example 4 A laminate was obtained in the same manner as in Example 3 except that the glass plate having a thickness of 50 ⁇ m was changed to the glass plate having a thickness of 100 ⁇ m.
  • Example 5 A laminate was obtained in the same manner as in Example 3 except that the glass plate having a thickness of 50 ⁇ m was changed to the glass plate having a thickness of 150 ⁇ m.
  • Example 6 PET plate with acrylic adhesive layer adheresive layer thickness: 25 ⁇ m, PET thickness: 50 ⁇ m, product name “ASF50 527ALF”) on a glass plate (trade name “G-leaf”, manufactured by Nippon Electric Glass Co., Ltd., thickness 50 ⁇ m) (Manufactured by Daicel Co., Ltd.) were stuck together to obtain a PET/acrylic adhesive layer/G-leaf laminate.
  • Example 7 A laminate was obtained in the same manner as in Example 6 except that the glass plate having a thickness of 50 ⁇ m was changed to the glass plate having a thickness of 100 ⁇ m.
  • Example 8 A laminate was obtained in the same manner as in Example 6 except that the glass plate having a thickness of 50 ⁇ m was changed to the glass plate having a thickness of 150 ⁇ m.
  • Comparative Example 1 instead of the laminate, only G-leaf (thickness: 50 ⁇ m) was used.
  • the pencil hardness of the G-leaf surface was 9H.
  • Comparative example 2 instead of the laminate, only a glass plate with a thickness of 100 ⁇ m was used.
  • Comparative Example 3 instead of the laminate, only a glass plate having a thickness of 150 ⁇ m was used.
  • Total light transmittance The transparency of the laminate (in the comparative example, a glass plate) was evaluated by measuring the total light transmittance (in accordance with JIS-K7361).
  • the laminate (a glass plate in the comparative example) was bent so as to have a concave glass plate surface, sandwiched between the vices of a vise, and a handle was turned to gradually tighten the laminate at the time when the laminate cracked for the first time.
  • the bending radius of the laminate was defined as the minimum bending radius (mm).
  • the laminated body in the comparative example, a glass plate
  • a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g (without ZEBRA New Crystal Care S cap) was placed.
  • the laminate With the pen tip facing downward, the laminate is naturally dropped toward the surface of the laminate, and the lowest drop height (cm) at which a glass plate is cracked is used as an index of impact resistance.
  • the drop height is the height of the pen tip position of the ballpoint pen. The drop height started from 1 cm and increased in 1 cm increments.
  • the relative permittivity of the laminate (a structure not including the adhesive layer) was calculated. Note that the relative permittivity of the glass plate was 5.8 (1 MHz, 20° C.), the relative permittivity of the PET film was 3.2 (1 MHz, 20° C.), and these two dielectric materials were connected in series for calculation. ..
  • a light of 365 nm was irradiated (irradiation amount: 2000 mJ/cm 2 ) using an LED irradiator in an air atmosphere to obtain a resin film/adhesive layer/G-leaf laminate ( A sample number of 10) was obtained for each example.
  • the minimum bending radius was measured by the same method as the above (evaluation of flexibility).
  • PET Biaxially stretched PET film, trade name "Cosmo Shine A4300", Toyobo Co., Ltd.
  • TAC Biaxially stretched triacetyl cellulose film, trade name "Fujitac TG60UL", Fuji Film Co., Ltd.
  • PEN Biaxially stretched polyethylene Naphthalate film, trade name "Teonex Q65HA”, manufactured by Teijin Film Solutions Ltd.
  • PAI Biaxially oriented polyamideimide film, trade name "Taimide OT-050", manufactured by Taimide Tech. Inc.
  • the storage elastic modulus and Tg of the adhesive layer were measured by cutting a cured adhesive (thickness: 0.5 mm) into a width of 4 mm and a length of 3 cm, and using this as a sample for dynamic viscoelasticity measurement (DMA). , was carried out under the following conditions.
  • Example 19 the impact resistance of the laminate obtained in Example 19 was evaluated by the following method.
  • the laminated body in the comparative example, a glass plate
  • a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g (without ZEBRA New Crystal Care S cap) was used.
  • the pen tip facing downward, the laminate is naturally dropped toward the surface of the laminate, and the lowest drop height (cm) at which a glass plate is cracked is used as an index of impact resistance.
  • the drop height is the height of the pen tip position of the ballpoint pen. The drop height started from 1 cm and increased in 1 cm increments.
  • UA1 Composition containing urethane-modified acrylic polymer and solvent (ethyl acetate/isopropyl alcohol) (Brand name "Akrit 8UA-017", manufactured by Taisei Fine Chemicals Co., Ltd.)
  • UA2 UV-curable urethane acrylate (commercial name "Acryt 8UX-077A", manufactured by Taisei Fine Chemicals Co., Ltd.) 100 parts by weight, and 5 parts by weight of Irgacure-184 are mixed together
  • UA3 UV-curable urethane acrylic A composition obtained by mixing 0.2 parts by weight of Irgacure-184 with 100 parts by weight of a polymer (trade name "Akrit 8BR-600", manufactured by Taisei Fine Chemical Co., Ltd.)
  • EVA1 Vinyl acetate and ethylene-vinyl acetate co-weight Composition containing coalesce and solvent (water) (trade name "C
  • the member according to [1] which has an impact resistance of 4 cm or more according to the following test. Impact resistance test: The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate.
  • Adhesive (1) containing a cationically polymerizable monomer and a curing catalyst, and as the cationically polymerizable monomer, at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule. And 10% by weight or more of the compound having at least one hydroxyl group in the total amount of the cationically polymerizable monomer, and 5% by weight or more of the total amount of the cationically polymerizable monomer in the compound represented by the formula (b).
  • a compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule is represented by formulas (i-1-1) to (i -1-3)
  • a compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule is represented by the formula (i-3-1).
  • the compound represented by the formula (b) is at least one compound selected from compounds represented by the formulas (b-1) to (b-5), [5] to [7] The member according to any one of 1.
  • the compound represented by the formula (b) is at least one compound selected from compounds represented by the formulas (b-1) to (b-4), [5] to [7] The member according to any one of 1.
  • the adhesive (1) contains, as a cationically polymerizable monomer, a compound represented by the formula (b′) in an amount of 10% by weight or more based on the total amount of the cationically polymerizable monomer.
  • the compound represented by the formula (b′) is 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, (3,4,3′,4′-diepoxy)bicyclohexyl, bis. (3,4-epoxycyclohexylmethyl) ether, 1,2-epoxy-1,2-bis(3,4-epoxycyclohexane-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexane-1) -Yl) propane and at least one compound selected from 1,2-bis(3,4-epoxycyclohexane-1-yl)ethane.
  • the adhesive (1) contains the compound represented by the formula (c-1) and/or the compound represented by the formula (c-2) as a cationically polymerizable monomer, [5] to [5] 11] The member according to any one of [11]. [13] The member according to any one of [1] to [4], wherein the adhesive layer is a cured product of an acrylic urethane adhesive (2) containing urethane (meth)acrylate or a polymer thereof. [14] The member according to any one of [1] to [4], wherein the adhesive layer is a cured product of a vinyl acetate adhesive (3) containing a vinyl acetate polymer.
  • [15] The member according to any one of [1] to [14], wherein the resin films are laminated so that the MD direction is along the bending direction of the member.
  • [16] The member according to any one of [1] to [15], which is a cover member.
  • [18] The member according to any one of [1] to [15], which is a cover member for a flexible display.
  • [21] Use of the member according to any one of [1] to [15] as a cover member for a touch panel display.
  • [22] Use of the member according to any one of [1] to [15] as a cover member for a flexible display.
  • [23] Use of the member according to any one of [1] to [15] as a cover member for a fingerprint authentication sensor.
  • a method for manufacturing a cover member using the member according to any one of [1] to [15] to obtain a cover member.
  • [25] A method for manufacturing a cover member for a touch panel display, using the member according to any one of [1] to [15] to obtain a cover member for a touch panel display.
  • a method for manufacturing a cover member for flexible display which comprises using the member according to any one of [1] to [15] to obtain a cover member for flexible display.
  • a method for manufacturing a cover member for a fingerprint authentication sensor which comprises using the member according to any one of [1] to [15] to obtain a cover member for a fingerprint authentication sensor.
  • a touch panel display including the member according to any one of [1] to [15].
  • a flexible display provided with the member according to any one of [1] to [15].
  • An electronic device including the display according to [28] or [29].
  • An organic electroluminescent device including the member according to any one of [1] to [15].
  • An organic thin-film solar cell including the member according to any one of [1] to [15].
  • a fingerprint authentication sensor including the member according to any one of [1] to [15].
  • An electronic device with a personal authentication function comprising the fingerprint authentication sensor according to [33].
  • the cover member of the present invention is excellent in transparency, gas barrier properties, water vapor barrier properties, chemical stability, thermal stability, electrical insulation properties, surface smoothness, high hardness, and curl resistance, and has a good texture. At the same time, it has both flexibility and impact resistance. Therefore, it can be suitably used as a cover glass for a display or a protective film for a fingerprint authentication sensor.

Abstract

Provided is a cover member which combines the properties of glass, flexibility and ease of handling. This cover member has a configuration comprising a glass plate having a thickness not exceeding 500 μm and a resin film, laminated together with an adhesive layer interposed therebetween. This cover member preferably has a shock resistance of at least 4 cm when subjected to the following testing. Shock resistance testing: the cover member is positioned on a flat surface with the glass plate-side surface facing upward, a ball-point pen having a ball diameter of 0.7 mm and a weight of 5.7 g is made to drop naturally onto the surface of the cover member with the pen tip first, and the dropping height (in cm) at which a crack occurs in the glass plate is taken as an indicator of shock resistance.

Description

カバー部材Cover member
 本発明は、ガラス板を含む積層体からなるカバー部材に関する。本願は、2019年1月25日に日本に出願した、特願2019-010836号の優先権を主張し、その内容をここに援用する。 The present invention relates to a cover member composed of a laminated body including a glass plate. This application claims the priority of Japanese Patent Application No. 2019-010836 filed in Japan on January 25, 2019, and the content thereof is incorporated herein.
 近年、携帯電話、携帯情報端末、タブレットPC等のモバイル機器のディスプレイには、カバー部材としてガラスが使用されることが多い。それは、ガラスが透明性、ガスバリア性、化学的安定性、表面平滑性等に優れることや、ガラスの質感が好まれることが理由に挙げられる。 In recent years, glass is often used as a cover member for displays of mobile devices such as mobile phones, personal digital assistants, and tablet PCs. This is because glass is excellent in transparency, gas barrier property, chemical stability, surface smoothness, and the like, and the texture of glass is preferred.
 しかし、ガラスは可とう性に欠ける点、及び割れやすく取扱が困難である点が問題である。特許文献1には、薄化ガラス板が記載され、当該薄化ガラス板は可とう性を有し、ゆっくり折り曲げることができることが記載されている。 However, the problems with glass are that it lacks flexibility and that it is easily broken and difficult to handle. Patent Document 1 describes a thinned glass plate, and it is described that the thinned glass plate has flexibility and can be bent slowly.
特開2010-105900号公報JP, 2010-105900, A
 しかし、前記薄化ガラス板には、取扱が困難であるという問題が残されていた。 However, there was a problem with the thin glass plate that it was difficult to handle.
 従って、本発明の目的は、ガラスの特性と、可とう性及び良好な取扱性を兼ね備えるカバー部材を提供することにある。
 本発明の他の目的は、ガラスの特性と、可とう性、耐衝撃性、及び良好な取扱性を兼ね備えるカバー部材を提供することにある。
 本発明の他の目的は、ガラスの特性と、可とう性、耐衝撃性、屈曲耐久性、及び良好な取扱性を兼ね備えるカバー部材を提供することにある。
 本発明の他の目的は、前記カバー部材を備えるタッチパネルディスプレイ、フレキシブルディスプレイ、指紋認証センサーを提供することにある。
 本発明の他の目的は、前記カバー部材を備える有機エレクトロルミネッセンスデバイスや有機薄膜太陽電池を提供することにある。
 本発明の他の目的は、前記ディスプレイ又は指紋認証センサーを備える電子機器を提供することにある。
Therefore, an object of the present invention is to provide a cover member which has the characteristics of glass, flexibility and good handleability.
Another object of the present invention is to provide a cover member that has the characteristics of glass, flexibility, impact resistance, and good handleability.
Another object of the present invention is to provide a cover member that has the characteristics of glass, flexibility, impact resistance, bending durability, and good handleability.
Another object of the present invention is to provide a touch panel display, a flexible display, and a fingerprint authentication sensor including the cover member.
Another object of the present invention is to provide an organic electroluminescent device or an organic thin film solar cell including the cover member.
Another object of the present invention is to provide an electronic device including the display or the fingerprint authentication sensor.
 本発明者等は上記課題を解決するため鋭意検討した結果、ガラス板と樹脂フィルムとが接着層を介して接合されてなるカバー部材は、ガラスの特性を備えると共に、可とう性及び耐衝撃性に優れ、取扱が容易であること、前記カバー部材はディスプレイのカバーガラスや指紋認証センサーの保護膜、有機エレクトロルミネッセンスデバイスや有機薄膜太陽電池の基板若しくは封止部材として好適であることを見いだした。本発明はこれらの知見に基づいて完成させたものである。 As a result of intensive studies by the present inventors in order to solve the above problems, a cover member obtained by joining a glass plate and a resin film via an adhesive layer has the characteristics of glass, and has flexibility and impact resistance. It has been found that the cover member is excellent and easy to handle, and that the cover member is suitable as a cover glass for a display, a protective film for a fingerprint authentication sensor, a substrate for an organic electroluminescent device or an organic thin film solar cell, or a sealing member. The present invention has been completed based on these findings.
 すなわち、本発明は、厚みが500μm以下であるガラス板と、樹脂フィルムとが接着層を介して積層された構成を有する、カバー部材を提供する。 That is, the present invention provides a cover member having a structure in which a glass plate having a thickness of 500 μm or less and a resin film are laminated via an adhesive layer.
 本発明は、また、下記試験による耐衝撃性が4cm以上である前記カバー部材を提供する。
耐衝撃性試験:
カバー部材を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペンをペン先からカバー部材の表面に向けて自然落下させ、ガラス板にクラックが生じるまでの落下高さ(cm)を耐衝撃性の指標とする
The present invention also provides the cover member according to the following test, which has an impact resistance of 4 cm or more.
Impact resistance test:
The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate. The drop height (cm) before cracking is used as an index of impact resistance
 本発明は、また、最小曲げ半径が250mm以下である前記カバー部材を提供する。 The present invention also provides the cover member having a minimum bending radius of 250 mm or less.
 本発明は、また、総厚みが1000μm以下である前記カバー部材を提供する。 The present invention also provides the cover member having a total thickness of 1000 μm or less.
 本発明は、また、接着層が、下記接着剤(1)の硬化物である前記カバー部材を提供する。
 接着剤(1):カチオン重合性モノマーと硬化触媒とを含有し、前記カチオン重合性モノマーとして、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物をカチオン重合性モノマー全量の10重量%以上含有し、下記式(b)
Figure JPOXMLDOC01-appb-C000003
(式中、Rは、s価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基、又は2個以上の直鎖状又は分岐鎖状飽和脂肪族炭化水素基がエーテル結合を介して結合したs価の基を示し、sは2以上の整数を示す)
で表される化合物をカチオン重合性モノマー全量の5重量%以上含有する。
The present invention also provides the cover member, wherein the adhesive layer is a cured product of the following adhesive (1).
Adhesive (1): containing a cationically polymerizable monomer and a curing catalyst, and as the cationically polymerizable monomer, at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule. And 10% by weight or more of the compound having at least one hydroxyl group based on the total amount of the cationically polymerizable monomer,
Figure JPOXMLDOC01-appb-C000003
(In the formula, R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond. s represents a valent group, and s represents an integer of 2 or more)
The compound represented by 5 wt% or more of the total amount of the cationically polymerizable monomer is contained.
 本発明は、また、接着剤(1)が、カチオン重合性モノマーとして、更に、下記式(b’)
Figure JPOXMLDOC01-appb-C000004
(式中、Xは単結合又は連結基を示す)
で表される化合物をカチオン重合性モノマー全量の10重量%以上含有する前記カバー部材を提供する。
In the present invention, the adhesive (1) further comprises the following formula (b′) as a cationically polymerizable monomer.
Figure JPOXMLDOC01-appb-C000004
(In the formula, X represents a single bond or a linking group)
The cover member comprises the compound represented by 10% by weight or more of the total amount of the cationically polymerizable monomer.
 本発明は、また、接着層が、ウレタン(メタ)アクリレート又はその重合体を含むアクリルウレタン系接着剤(2)の硬化物である前記カバー部材を提供する。 The present invention also provides the cover member, wherein the adhesive layer is a cured product of an acrylic urethane adhesive (2) containing urethane (meth)acrylate or a polymer thereof.
 本発明は、また、接着層が酢酸ビニル系重合体を含む酢酸ビニル系接着剤(3)の硬化物である前記カバー部材を提供する。 The present invention also provides the cover member, wherein the adhesive layer is a cured product of a vinyl acetate adhesive (3) containing a vinyl acetate polymer.
 本発明は、また、樹脂フィルムのMD方向がカバー部材の屈曲方向に沿うように積層されてなる前記カバー部材を提供する。 The present invention also provides the cover member, wherein the resin film is laminated so that the MD direction is along the bending direction of the cover member.
 本発明は、また、タッチパネルディスプレイ用である前記カバー部材を提供する。 The present invention also provides the cover member for a touch panel display.
 本発明は、また、フレキシブルディスプレイ用である前記カバー部材を提供する。 The present invention also provides the cover member for a flexible display.
 本発明は、また、指紋認証センサー用である前記カバー部材を提供する。 The present invention also provides the cover member for a fingerprint authentication sensor.
 本発明は、また、前記カバー部材を備えるタッチパネルディスプレイを提供する。 The present invention also provides a touch panel display including the cover member.
 本発明は、また、前記カバー部材を備えるフレキシブルディスプレイを提供する。 The present invention also provides a flexible display including the cover member.
 本発明は、また、前記ディスプレイを備える電子機器を提供する。 The present invention also provides an electronic device including the display.
 本発明は、また、前記カバー部材を備える有機エレクトロルミネッセンスデバイスを提供する。 The present invention also provides an organic electroluminescent device including the cover member.
 本発明は、また、前記カバー部材を備える有機薄膜太陽電池を提供する。 The present invention also provides an organic thin film solar cell including the cover member.
 本発明は、また、前記カバー部材を備える指紋認証センサーを提供する。 The present invention also provides a fingerprint authentication sensor including the cover member.
 本発明は、また、前記指紋認証センサーを備える個人認証機能付き電子機器を提供する。 The present invention also provides an electronic device with a personal authentication function that includes the fingerprint authentication sensor.
 本発明のカバー部材は、ガラスの特性を備える。すなわち、透明性、ガスバリア性、水蒸気バリア性、化学的安定性、熱的安定性、電気絶縁性、表面平滑性、高硬度、捻れにくさ(若しくは、耐カール性)等に優れ、良好な質感(外観や触感)を備える。また、前記ガラスの特性を備えると共に、可とう性及び耐衝撃性をも兼ね備える。更に、特定の接着層を有する場合には、屈曲耐久性をも兼ね備え、繰り返し屈曲させてもクラックが生じることがない。 The cover member of the present invention has the characteristics of glass. That is, transparency, gas barrier property, water vapor barrier property, chemical stability, thermal stability, electrical insulation property, surface smoothness, high hardness, resistance to twisting (or curl resistance), etc., and good texture (Appearance and touch). In addition to the characteristics of the glass, it also has flexibility and impact resistance. Furthermore, when it has a specific adhesive layer, it also has bending durability and cracks do not occur even if it is repeatedly bent.
 本発明のカバー部材は上記特性を兼ね備える為、ディスプレイ用途(特に、タッチパネルディスプレイやフレキシブルディスプレイの表面を被覆する部材としての用途や、プラズマディスプレイの電極保護膜としての用途)や、指紋認証センサーの保護膜としての用途に好適に使用することができる。 Since the cover member of the present invention has the above-mentioned characteristics, it is used for a display (especially, as a member for covering the surface of a touch panel display or a flexible display, or as an electrode protective film of a plasma display), and for protecting a fingerprint authentication sensor. It can be suitably used for applications as a membrane.
 本発明のカバー部材を備えるタッチパネルディスプレイは、ガラスに由来する特性を備えつつ、取扱が容易であり、耐衝撃性にも優れる。また、本発明のタッチパネルディスプレイは、プラスチックフィルムをカバー部材として有する従来のディスプレイに比べてタッチ検出感度に優れる。 The touch panel display equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance. Further, the touch panel display of the present invention is superior in touch detection sensitivity to a conventional display having a plastic film as a cover member.
 本発明のカバー部材を備えるフレキシブルディスプレイは、ガラスに由来する特性を備えつつ、取扱が容易であり、耐衝撃性にも優れる。 The flexible display equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance.
 本発明のカバー部材を備えるプラズマディスプレイは、ガラス由来の特性により化学的安定性に優れるため、低電圧特性を安定的に維持することができ、省電力化に資する。 The plasma display equipped with the cover member of the present invention has excellent chemical stability due to the characteristics derived from glass, so that it is possible to stably maintain the low voltage characteristics, which contributes to power saving.
 上記ディスプレイを備える電子機器は、高性能であり、取扱が容易であり、且つ耐衝撃性にも優れる。そのため、上記ディスプレイを備える電子機器は、省電力化に資する。 -Electronic devices equipped with the above display have high performance, are easy to handle, and have excellent impact resistance. Therefore, the electronic device including the display contributes to power saving.
 本発明のカバー部材は上記特性を兼ね備え、とりわけ、ガスバリア性と水蒸気バリア性を兼ね備える為、有機エレクトロルミネッセンスデバイス(以後、「有機ELデバイス」と称する場合がある)や有機薄膜太陽電池において、基板部材及び/又は封止部材として好適に使用することができる。そして、本発明のカバー部材を備える有機ELデバイスや有機薄膜太陽電池は、薄型、軽量、フレキシブル、且つ長寿命を実現ですることができる。 The cover member of the present invention has the above-mentioned characteristics, and in particular, since it has the gas barrier property and the water vapor barrier property, it is a substrate member in an organic electroluminescence device (hereinafter sometimes referred to as “organic EL device”) or an organic thin film solar cell. And/or can be preferably used as a sealing member. The organic EL device and the organic thin-film solar cell provided with the cover member of the present invention can be thin, lightweight, flexible, and have a long life.
 本発明のカバー部材を備える指紋認証センサーは、ガラスに由来する特性を備えつつ、取扱が容易であり、耐衝撃性にも優れる。また、本発明の指紋認証センサーは、プラスチックフィルムをカバー部材として有する従来の指紋認証センサーに比べて高感度を有する。 The fingerprint authentication sensor equipped with the cover member of the present invention has characteristics derived from glass, is easy to handle, and has excellent impact resistance. Further, the fingerprint authentication sensor of the present invention has higher sensitivity than a conventional fingerprint authentication sensor having a plastic film as a cover member.
 前記指紋認証センサーを備える個人認証機能付き電子機器は、高性能であり、取扱が容易であり、且つ耐衝撃性にも優れる。 ㆍThe electronic device with a personal authentication function equipped with the fingerprint authentication sensor has high performance, is easy to handle, and has excellent impact resistance.
耐カール性を評価する際の、試験片の浮き量の測定方法を示す模式図である。It is a schematic diagram which shows the measuring method of the floating amount of a test piece at the time of evaluating curl resistance. 屈曲耐久性の試験方法(R曲げ方法)(カバー部材をガラス板の面が凹となる方向に屈曲半径(R)で180°折り曲げ、伸ばす動作の1セット)を示す模式図(側面図)である。FIG. 2 is a schematic diagram (side view) showing a bending durability test method (R bending method) (one set of bending and stretching operations of the cover member at a bending radius (R) of 180° in a direction in which the surface of the glass plate is concave) is there. 図2の(4)を拡大して示した図である。It is the figure which expanded and showed (4) of FIG. 本発明のカバー部材(1)の一例を示す模式断面図であり、樹脂フィルム(6)の向きを、樹脂フィルム(6)のMD方向がカバー部材の屈曲方向と平行になるように調整して、接着層(5)を介しガラス板(4)と貼り合わせた図である。FIG. 3 is a schematic cross-sectional view showing an example of the cover member (1) of the present invention, in which the orientation of the resin film (6) is adjusted so that the MD direction of the resin film (6) is parallel to the bending direction of the cover member. FIG. 3 is a view of the glass plate (4) being bonded via an adhesive layer (5).
 [カバー部材]
 本発明のカバー部材は、厚みが500μm以下であるガラス板と、樹脂フィルムとが接着層を介して積層された構成を有する積層体である。尚、カバー部材の幅や長さは、用途に応じて適宜調整することができる。
[Cover member]
The cover member of the present invention is a laminate having a structure in which a glass plate having a thickness of 500 μm or less and a resin film are laminated via an adhesive layer. The width and length of the cover member can be appropriately adjusted according to the application.
 本発明のカバー部材は、ガラス板/接着層/樹脂フィルムの3層積層構造を少なくとも有する。本発明のカバー部材は、前記3層以外にも他の層を有していてもよく、例えば、ガラス板の表面に各種機能膜(例えば、反射防止膜、アンチグレア膜、防汚膜、ITO膜等)を設けてもよい。 The cover member of the present invention has at least a three-layer laminated structure of glass plate/adhesive layer/resin film. The cover member of the present invention may have other layers in addition to the above three layers. For example, various functional films (for example, antireflection film, antiglare film, antifouling film, ITO film) are formed on the surface of the glass plate. Etc.) may be provided.
 本発明のカバー部材の総厚みは、例えば1000μm以下であり、可とう性及び屈曲耐久性に優れる点で、好ましくは300μm以下、より好ましくは250μm以下、特に好ましくは200μm以下、最も好ましくは150μm以下である。尚、総厚みの下限は、例えば50μm、好ましくは75μm、特に好ましくは100μmである。 The total thickness of the cover member of the present invention is, for example, 1000 μm or less, and in view of excellent flexibility and bending durability, it is preferably 300 μm or less, more preferably 250 μm or less, particularly preferably 200 μm or less, most preferably 150 μm or less. Is. The lower limit of the total thickness is, for example, 50 μm, preferably 75 μm, and particularly preferably 100 μm.
 本発明のカバー部材は耐衝撃性に優れ、下記試験方法(詳細は、実施例において記載する)による耐衝撃性は、例えば4cm以上、好ましくは5cm以上、特に好ましくは6cm以上である。
耐衝撃性試験:
カバー部材を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペンをペン先からカバー部材の表面に向けて自然落下させ、ガラス板にクラックが生じるまでの落下高さ(cm)を耐衝撃性の指標とする
The cover member of the present invention has excellent impact resistance, and the impact resistance according to the following test method (details will be described in Examples) is, for example, 4 cm or more, preferably 5 cm or more, and particularly preferably 6 cm or more.
Impact resistance test:
The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate. The drop height (cm) before cracking is used as an index of impact resistance
 本発明のカバー部材は可とう性を備え、その最小曲げ半径は、ガラス板の厚みに応じて変化するが、例えば、ガラス厚みが50μm以下の場合、カバー部材の最小曲げ半径は、例えば3mm以下である(すなわち、屈曲半径が3mm以下となるまで、少なくとも1回、折り曲げ可能である)。
 ガラス厚みが50μmを超え、100μm以下の場合、カバー部材の最小曲げ半径は、例えば20mm以下(例えば、10~20mm)である。
 ガラス厚みが100μmを超え、150μm以下の場合、カバー部材の最小曲げ半径は、例えば40mm以下(例えば、25~40mm)である。
 ガラス厚みが150μmを超え、250μm以下の場合、カバー部材の最小曲げ半径は、例えば100mm以下(例えば、45~100mm)である。
 ガラス厚みが250μmを超え、500μm以下の場合、カバー部材の最小曲げ半径は、例えば250mm以下(例えば、110~250mm)である。
 尚、カバー部材の最小曲げ半径は実施例に記載の方法により測定することができる。
The cover member of the present invention has flexibility, and its minimum bending radius changes depending on the thickness of the glass plate. For example, when the glass thickness is 50 μm or less, the minimum bending radius of the cover member is, for example, 3 mm or less. (That is, it can be bent at least once until the bending radius becomes 3 mm or less).
When the glass thickness exceeds 50 μm and is 100 μm or less, the minimum bending radius of the cover member is, for example, 20 mm or less (for example, 10 to 20 mm).
When the glass thickness exceeds 100 μm and 150 μm or less, the minimum bending radius of the cover member is, for example, 40 mm or less (for example, 25 to 40 mm).
When the glass thickness exceeds 150 μm and is 250 μm or less, the minimum bending radius of the cover member is, for example, 100 mm or less (for example, 45 to 100 mm).
When the glass thickness exceeds 250 μm and is 500 μm or less, the minimum bending radius of the cover member is, for example, 250 mm or less (for example, 110 to 250 mm).
The minimum bending radius of the cover member can be measured by the method described in the examples.
 また、本発明のカバー部材(特に、後述の接着剤(1)の硬化物からなる接着層を有するカバー部材)は、屈曲させる際の、ガラス板への応力負荷が接着層によって緩和され、優れた屈曲耐久性を発揮することができる。すなわち、屈曲-伸展を繰り返してもガラス板にクラックが発生するのを抑制することができる。下記試験による屈曲耐久性は、例えば10以上、好ましくは100以上、特に好ましくは1000以上、更に好ましくは2000以上、最も好ましくは10000以上である。
屈曲耐久性試験:
カバー部材の切断片(サイズ:例えば1cm×7cm)を伸ばした状態から、ガラス板の面が凹となる方向に(好ましくは、ガラス板の面が凹となり、且つ樹脂フィルムのMD方向に沿う方向に)、下記屈曲半径(R)で、180°折り曲げ、再び伸ばす動作を1セットとし、1分間に43セットの速さで前記動作を行った際における、切断片にクラックが生じるまでのセット数を屈曲耐久性の指標とする
Further, the cover member of the present invention (particularly, the cover member having an adhesive layer made of a cured product of the adhesive (1) described later) is excellent in that the stress load on the glass plate during bending is relaxed by the adhesive layer. It can exhibit excellent bending durability. That is, it is possible to suppress the occurrence of cracks in the glass plate even after repeated bending and extension. The bending durability according to the following test is, for example, 10 or more, preferably 100 or more, particularly preferably 1000 or more, further preferably 2000 or more, most preferably 10000 or more.
Bending durability test:
From the stretched state of the cut piece (size: 1 cm×7 cm) of the cover member, in the direction in which the surface of the glass plate becomes concave (preferably, the surface of the glass plate becomes concave and the direction along the MD direction of the resin film). The number of sets until a crack is generated in the cut piece when the above-mentioned operation is performed at a speed of 43 sets per minute, with an operation of bending 180° and re-extending at a bending radius (R) below as one set. Is used as an index of bending durability
 前記屈曲半径(R)は、以下に記載の通りガラス板の厚みに応じて変更することが好ましい。
 ガラス厚みが50μm以下の場合、屈曲半径は、例えば3mmである。
 ガラス厚みが50μmを超え、100μm以下の場合、屈曲半径は、例えば20mm以下(好ましくは、10~20mm)である。
 ガラス厚みが100μmを超え、150μm以下の場合、屈曲半径は、例えば40mm以下(好ましくは、25~40mm)である。
 ガラス厚みが150μmを超え、250μm以下の場合、屈曲半径は、例えば100mm以下(例えば、45~100mm)である。
 ガラス厚みが250μmを超え、500μm以下の場合、屈曲半径は、例えば250mm以下(例えば、110~250mm)である。
The bending radius (R) is preferably changed according to the thickness of the glass plate as described below.
When the glass thickness is 50 μm or less, the bending radius is, for example, 3 mm.
When the glass thickness exceeds 50 μm and is 100 μm or less, the bending radius is, for example, 20 mm or less (preferably 10 to 20 mm).
When the glass thickness exceeds 100 μm and 150 μm or less, the bending radius is, for example, 40 mm or less (preferably 25 to 40 mm).
When the glass thickness exceeds 150 μm and is 250 μm or less, the bending radius is, for example, 100 mm or less (for example, 45 to 100 mm).
When the glass thickness exceeds 250 μm and is 500 μm or less, the bending radius is, for example, 250 mm or less (for example, 110 to 250 mm).
 本発明のカバー部材は高い透明性を有し、全光線透過率は、例えば80%以上、好ましくは85%以上、特に好ましくは88%以上、最も好ましくは90%以上である。 The cover member of the present invention has high transparency, and the total light transmittance is, for example, 80% or more, preferably 85% or more, particularly preferably 88% or more, and most preferably 90% or more.
 更に、本発明のカバー部材の表面硬度(特に、ガラス板側表面の表面硬度)は、鉛筆硬度(JIS K5600-5-4(ISO/DIN15184))が、例えばH以上、好ましくは2H以上、特に好ましくは3H以上、最も好ましくは5H以上であり、本発明のカバー部材は連続屈曲した後も、表面硬度(特に屈曲部位の表面硬度)を前記の通り高く維持することができる。 Further, the surface hardness of the cover member of the present invention (particularly the surface hardness of the glass plate side surface) is, for example, H or higher, preferably 2H or higher, especially pencil hardness (JIS K5600-5-4 (ISO/DIN15184)). It is preferably 3H or more, and most preferably 5H or more, and the cover member of the present invention can maintain high surface hardness (particularly the surface hardness of the bent portion) as described above even after continuous bending.
 本発明のカバー部材はロール状に巻き取ることにより巻回体を形成することができる。また、このようにして得られた巻回体は、搬送が容易であり、収納しやすい。 The cover member of the present invention can be wound into a roll to form a wound body. In addition, the wound body thus obtained is easy to convey and easy to store.
 また、本発明のカバー部材は上記特性を有するため、ディスプレイ(特に、フレキシブルディスプレイ)用カバー部材として好適に使用することができる。より詳細には、本発明のカバー部材は、タッチパネルディスプレイ用カバー部材、又はフレキシブルディスプレイ用カバー部材として好適に使用することができる。 Further, since the cover member of the present invention has the above-mentioned characteristics, it can be suitably used as a cover member for a display (in particular, a flexible display). More specifically, the cover member of the present invention can be suitably used as a cover member for a touch panel display or a cover member for a flexible display.
 また、本発明のカバー部材は、ガラス由来の高いガスバリア性と水蒸気バリア性とを備えつつ、可とう性を有するため、有機ELデバイスや有機薄膜太陽電池において、基板部材及び/又は封止部材として好適に使用することができる。 In addition, the cover member of the present invention has high gas barrier property and water vapor barrier property derived from glass, and also has flexibility, so that it is used as a substrate member and/or a sealing member in an organic EL device or an organic thin film solar cell. It can be used preferably.
 その他、本発明のカバー部材の表面に導体配線を施せば、プリント基板(特に、フレキシブルプリント基板)として使用することができ、例えば、フレキシブルディスプレイ、フレキシブル太陽電池、フレキシブルタッチパネル電極基板、フレキシブル照明、フレキシブルバッテリー等のフレキシブルデバイスにおいて基板として好適に使用することができる。 In addition, if the surface of the cover member of the present invention is provided with a conductor wiring, it can be used as a printed circuit board (particularly, a flexible printed circuit board). For example, a flexible display, a flexible solar cell, a flexible touch panel electrode substrate, a flexible illumination, a flexible It can be suitably used as a substrate in a flexible device such as a battery.
 本発明のカバー部材は、更に、半導体絶縁膜、液晶ディスプレイ用絶縁膜、電極保護膜等としても使用することができる。 The cover member of the present invention can also be used as a semiconductor insulating film, a liquid crystal display insulating film, an electrode protective film, and the like.
 (ガラス板)
 本発明のカバー部材を構成するガラス板の厚みは500μm以下であり、可とう性に優れる点で、好ましくは250μm、より好ましくは150μm以下、更に好ましくは100μm以下、特に好ましくは75μm以下、最も好ましくは50μm以下である。また、屈曲耐久性に極めて優れる点で、10μm以上であることが好ましく、より好ましくは20μm以上、特に好ましくは30μm以上である。
(Glass plate)
The thickness of the glass plate constituting the cover member of the present invention is 500 μm or less, and in terms of excellent flexibility, preferably 250 μm, more preferably 150 μm or less, further preferably 100 μm or less, particularly preferably 75 μm or less, most preferably Is 50 μm or less. Further, in terms of extremely excellent bending durability, it is preferably 10 μm or more, more preferably 20 μm or more, and particularly preferably 30 μm or more.
 ガラス板の最小曲げ半径は、ガラス板の厚みに応じて変化するが、最小曲げ半径が下記範囲であるガラス板を使用することが、カバー部材の屈曲耐久性を向上する効果が得られる点で好ましい。
 ガラス厚みが50μm以下の場合、最小曲げ半径は、例えば3mm以下である(すなわち、屈曲半径が3mm以下となるまで、少なくとも1回、折り曲げ可能である)。
 ガラス厚みが50μmを超え、100μm以下の場合、最小曲げ半径は、例えば20mm以下(例えば、10~20mm)である。
 ガラス厚みが100μmを超え、150μm以下の場合、最小曲げ半径は、例えば40mm以下(例えば、25~40mm)である。
 ガラス厚みが150μmを超え、250μm以下の場合、最小曲げ半径は、例えば100mm以下(例えば、45~100mm)である。
 ガラス厚みが250μmを超え、500μm以下の場合、最小曲げ半径は、例えば250mm以下(例えば、110~250mm)である。
The minimum bending radius of the glass plate changes according to the thickness of the glass plate, but using a glass plate having a minimum bending radius within the following range is effective in improving the bending durability of the cover member. preferable.
When the glass thickness is 50 μm or less, the minimum bending radius is, for example, 3 mm or less (that is, it can be bent at least once until the bending radius becomes 3 mm or less).
When the glass thickness exceeds 50 μm and is 100 μm or less, the minimum bending radius is, for example, 20 mm or less (for example, 10 to 20 mm).
When the glass thickness exceeds 100 μm and is 150 μm or less, the minimum bending radius is, for example, 40 mm or less (for example, 25 to 40 mm).
When the glass thickness exceeds 150 μm and is 250 μm or less, the minimum bending radius is, for example, 100 mm or less (for example, 45 to 100 mm).
When the glass thickness is more than 250 μm and 500 μm or less, the minimum bending radius is, for example, 250 mm or less (for example, 110 to 250 mm).
 (樹脂フィルム)
 本発明のカバー部材を構成する樹脂フィルムとしては、透明性に優れる(全光線透過率は、例えば80%以上である)プラスチックフィルムを使用することが好ましい。
(Resin film)
As the resin film forming the cover member of the present invention, it is preferable to use a plastic film having excellent transparency (total light transmittance is 80% or more).
 前記プラスチックフィルムの材料としては、熱可塑性プラスチックや熱硬化性プラスチックが挙げられる。前記熱可塑性プラスチックには、例えば、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレート(PET)、ポリ塩化ビニル、アクリロニトリル・ブタジエン・スチレン(ABS)、ポリ塩化ビニリデン、酢酸セルロース(例えば、トリアセチルセルロース(TAC))、ポリエチレンナフタレート(PEN)等の汎用プラスチック;ポリアミド、ポリカーボネート、ポリフッ化ビニリデンなどのエンジニアリングプラスチック;ポリスルホン、ポリエーテルスルホン、ポリフェニレンサルファイド、ポリアミドイミド(PAI)、ポリイミド(PI)、ポリエーテルエーテルケトン(PEEK)等のスーパーエンジニアリングプラスチック等が含まれる。前記熱硬化性プラスチックには、例えば、フェノール樹脂、メラミン樹脂、ポリウレタン、シリコーン樹脂等が含まれる。 As the material of the plastic film, there are thermoplastic plastics and thermosetting plastics. Examples of the thermoplastic include polyethylene, polypropylene, polyethylene terephthalate (PET), polyvinyl chloride, acrylonitrile butadiene styrene (ABS), polyvinylidene chloride, cellulose acetate (eg, triacetyl cellulose (TAC)), polyethylene. General-purpose plastics such as naphthalate (PEN); engineering plastics such as polyamide, polycarbonate, polyvinylidene fluoride; polysulfone, polyether sulfone, polyphenylene sulfide, polyamide imide (PAI), polyimide (PI), polyether ether ketone (PEEK), etc. Super engineering plastics, etc. are included. The thermosetting plastics include, for example, phenol resin, melamine resin, polyurethane, silicone resin and the like.
 樹脂フィルムとしては、なかでも、屈曲耐久性に極めて優れる点で、PET、PAI、PI、酢酸セルロース(特に、TAC)、及びPENから選択される少なくとも1種の材料からなるプラスチックフィルムが好ましく、特に、PET又はPIからなるプラスチックフィルムが好ましい。 As the resin film, a plastic film made of at least one material selected from PET, PAI, PI, cellulose acetate (in particular, TAC), and PEN is preferable because of its extremely excellent bending durability. , PET or PI plastic films are preferred.
 樹脂フィルムの厚みは、例えば500μm以下であり、可とう性に優れる点で、好ましくは250μm、より好ましくは150μm以下、更に好ましくは140μm以下、特に好ましくは120μm以下、最も好ましくは100μm以下、更に好ましくは80μm以下、とりわけ好ましくは70μm以下である。また、屈曲耐久性に極めて優れる点で10μm以上が好ましく、より好ましくは20μm以上、特に好ましくは30μm以上である。 The thickness of the resin film is, for example, 500 μm or less, and in terms of excellent flexibility, it is preferably 250 μm, more preferably 150 μm or less, further preferably 140 μm or less, particularly preferably 120 μm or less, most preferably 100 μm or less, further preferably Is 80 μm or less, particularly preferably 70 μm or less. Further, it is preferably 10 μm or more, more preferably 20 μm or more, and particularly preferably 30 μm or more from the viewpoint of extremely excellent bending durability.
 (接着層)
 本発明のカバー部材を構成する接着層の厚みは、例えば100μm以下であり、好ましくは80μm以下、特に好ましくは50μm以下、最も好ましくは30μm以下である。尚、厚みの下限は、例えば1μm、好ましくは5μmである。接着層が上記範囲であると、接着性と屈曲耐久性と共に、透明性(全光線透過率は、例えば80%以上)を兼ね備えることができる点で好ましい。接着層の厚みが過剰となると、接着性は向上するが、屈曲耐久性や透明性が低下する傾向がある。
(Adhesive layer)
The thickness of the adhesive layer constituting the cover member of the present invention is, for example, 100 μm or less, preferably 80 μm or less, particularly preferably 50 μm or less, and most preferably 30 μm or less. The lower limit of the thickness is, for example, 1 μm, preferably 5 μm. When the adhesive layer is in the above range, the adhesiveness and bending durability as well as the transparency (the total light transmittance is, for example, 80% or more) are preferable, which is preferable. When the thickness of the adhesive layer is excessive, the adhesiveness is improved, but the bending durability and the transparency tend to be lowered.
 前記接着層はガラス板や樹脂フィルムに対して密着性に優れることが好ましい。前記接着層(特に、後述の接着剤(1)の硬化物からなる接着層)の、ガラス板及び/又は樹脂フィルムに対する密着性は、クロスカット法(JIS K 5600-5-6に準拠)の6段階分類試験において、例えば分類0~2である。 It is preferable that the adhesive layer has excellent adhesion to a glass plate or a resin film. The adhesion of the adhesive layer (particularly, the adhesive layer made of a cured product of the adhesive (1) described later) to the glass plate and/or the resin film is determined by the cross-cut method (based on JIS K 5600-5-6). In the 6-step classification test, for example, classification 0 to 2.
 また、本発明のカバー部材に優れた屈曲耐久性を付与することができる点において、接着層(特に、後述の接着剤(1)の硬化物からなる接着層)の弾性率(例えば、25℃でのヤング率)は、例えば0.01MPa~1000GPaであることが好ましく、特に好ましくは1MPa~100GPa、最も好ましくは5MPa~50GPa、とりわけ好ましくは5MPa~10GPaである。 In addition, in terms of imparting excellent bending durability to the cover member of the present invention, the elastic modulus of the adhesive layer (particularly, the adhesive layer made of a cured product of the adhesive (1) described later) (for example, 25° C.). Young's modulus) is, for example, preferably 0.01 MPa to 1000 GPa, particularly preferably 1 MPa to 100 GPa, most preferably 5 MPa to 50 GPa, and particularly preferably 5 MPa to 10 GPa.
 また、本発明のカバー部材の屈曲耐久性を、高温環境下でも高く保持することができる点において、接着層は耐熱性に優れることが好ましく、接着層のガラス転移温度(Tg)又は融点(Tm)は以下の範囲であることが好ましい。 Further, the adhesive layer preferably has excellent heat resistance in that the bending durability of the cover member of the present invention can be kept high even in a high temperature environment, and the glass transition temperature (Tg) or melting point (Tm) of the adhesive layer is preferable. ) Is preferably in the following range.
 後述の接着剤(1)の硬化物からなる接着層のガラス転移温度(Tg)又は融点(Tm)は、好ましくは70℃以上、特に好ましくは80℃以上である。また、上限は、例えば150℃である。尚、接着剤(1)のガラス転移温度(Tg)又は融点(Tm)は、例えば、DSC、TGA等の熱分析や動的粘弾性測定により測定できる。 The glass transition temperature (Tg) or melting point (Tm) of the adhesive layer made of a cured product of the adhesive (1) described below is preferably 70° C. or higher, particularly preferably 80° C. or higher. The upper limit is, for example, 150°C. The glass transition temperature (Tg) or melting point (Tm) of the adhesive (1) can be measured by thermal analysis such as DSC or TGA or dynamic viscoelasticity measurement.
 後述のアクリルウレタン系接着剤(2)の硬化物からなる接着層のガラス転移温度(Tg)は、0~100℃が好ましく、より好ましくは0~70℃、特に好ましくは0~30℃である。 The glass transition temperature (Tg) of the adhesive layer made of a cured product of the acrylic urethane adhesive (2) described below is preferably 0 to 100°C, more preferably 0 to 70°C, and particularly preferably 0 to 30°C. ..
 後述の酢酸ビニル系接着剤(3)の硬化物からなる接着層のガラス転移温度(Tg)は、5℃以下が好ましく、より好ましくは-5℃未満、特に好ましくは-10℃以下である。また、ガラス転移温度の下限は、例えば-30℃、好ましくは-20℃である。 The glass transition temperature (Tg) of the adhesive layer made of a cured product of the vinyl acetate adhesive (3) described below is preferably 5° C. or lower, more preferably less than −5° C., and particularly preferably −10° C. or lower. The lower limit of the glass transition temperature is, for example, −30° C., preferably −20° C.
 尚、接着剤(2)、(3)のガラス転移温度は、例えば、JIS K7244-4に準拠した方法、より詳しくは、動的粘弾性測定(例えば、昇温速度:5℃/分、測定温度:20~350℃、変形モード:引っ張りモードの条件での動的粘弾性測定)において測定されるtanδ(損失正接)のピークトップの温度として求めることができる。 The glass transition temperatures of the adhesives (2) and (3) are measured, for example, by a method based on JIS K7244-4, more specifically, by dynamic viscoelasticity measurement (for example, heating rate: 5° C./min, measurement It can be determined as the temperature of the peak top of tan δ (loss tangent) measured in the temperature: 20 to 350° C., deformation mode: dynamic viscoelasticity measurement under the conditions of tensile mode).
 更に、本発明のカバー部材に優れた屈曲耐久性を付与することができる点において、接着層の20℃における貯蔵弾性率は以下の範囲であることが好ましい。尚、本明細書における貯蔵弾性率は動的粘弾性測定装置を用いて測定された値である。 Further, from the viewpoint that excellent bending durability can be imparted to the cover member of the present invention, the storage elastic modulus at 20° C. of the adhesive layer is preferably in the following range. The storage elastic modulus in the present specification is a value measured using a dynamic viscoelasticity measuring device.
 後述のアクリルウレタン系接着剤(2)の硬化物からなる接着層の、20℃における貯蔵弾性率は、10MPa以上が好ましく、より好ましくは50MPa以上、特に好ましくは80MPa以上、最も好ましくは120MPa以上である。 The storage elastic modulus at 20° C. of the adhesive layer made of a cured product of the acrylic urethane adhesive (2) described below is preferably 10 MPa or more, more preferably 50 MPa or more, particularly preferably 80 MPa or more, and most preferably 120 MPa or more. is there.
 後述の酢酸ビニル系接着剤(3)の硬化物からなる接着層の、20℃における貯蔵弾性率は、10~200MPaが好ましく、より好ましくは30~150MPa、特に好ましくは30~100MPaである。 The storage elastic modulus at 20° C. of the adhesive layer made of a cured product of the vinyl acetate adhesive (3) described later is preferably 10 to 200 MPa, more preferably 30 to 150 MPa, and particularly preferably 30 to 100 MPa.
 (接着剤)
 上記接着層は接着剤の硬化物から成る。上記接着層を形成するための接着剤としては、例えば、紫外線硬化型接着剤、熱硬化型接着剤、熱可塑性接着剤等が挙げられる。前記硬化型接着剤のなかでは、紫外線硬化型接着剤が、速硬化性に優れる点及び耐熱性の低い樹脂フィルムにも使用可能である点で好ましい。尚、本明細書における「硬化」には、後述のラジカル硬化型又はカチオン硬化型接着剤のモノマーの重合を伴う硬化、及び熱可塑性接着剤の加熱し軟化したものを冷却することによる硬化(若しくは、固化)を含む。
(adhesive)
The adhesive layer is made of a cured product of an adhesive. Examples of the adhesive for forming the adhesive layer include an ultraviolet curable adhesive, a thermosetting adhesive, and a thermoplastic adhesive. Among the above-mentioned curable adhesives, the ultraviolet curable adhesives are preferable because they are excellent in quick-curing properties and can be used for resin films having low heat resistance. In the present specification, "curing" includes curing of the radical-curable or cationic-curable adhesive described below accompanied by polymerization of monomers, and curing by cooling a heated and softened thermoplastic adhesive (or , Solidification).
 紫外線硬化型接着剤には、ラジカル硬化型及びカチオン硬化型が含まれる。ラジカル硬化型接着剤は速硬化性を有する点、及びモノマーの種類が豊富である点で優れている。一方、カチオン硬化型接着剤は、酸素による硬化阻害を受けにくく、酸素の存在下でも速やかに硬化する点で優れている。また、硬化収縮が小さいため、寸法安定性にも優れている。硬化収縮が大きい接着剤を使用して樹脂フィルムとガラス板とを接着した場合、接着剤の硬化収縮によって、得られるカバー部材にカールが発生し易い。 UV curable adhesives include radical curable and cationic curable adhesives. Radical curable adhesives are excellent in that they have fast curability and that they have a wide variety of monomers. On the other hand, the cation-curable adhesive is excellent in that it is less susceptible to curing inhibition by oxygen and is rapidly cured even in the presence of oxygen. Further, since the curing shrinkage is small, it has excellent dimensional stability. When the resin film and the glass plate are bonded to each other using an adhesive having a large curing shrinkage, curling is likely to occur in the obtained cover member due to the curing shrinkage of the adhesive.
 (カチオン硬化型接着剤)
 カチオン硬化型接着剤は、カチオン重合性モノマーと硬化触媒を含有する。前記カチオン重合性モノマーには、ビニルエーテル基、エポキシ基、及びオキセタニル基から選択される少なくとも1種のカチオン重合性基を含有する化合物が挙げられる。
(Cationic curable adhesive)
The cationically curable adhesive contains a cationically polymerizable monomer and a curing catalyst. Examples of the cationically polymerizable monomer include compounds containing at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group.
 カチオン硬化型接着剤としては、なかでも、カチオン重合性モノマーとして、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物(以後、「化合物(I)」と称する場合がある)をカチオン重合性モノマー全量の10重量%以上含有し、下記式(b)
Figure JPOXMLDOC01-appb-C000005
(式中、Rは、s価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基、又は2個以上の直鎖状又は分岐鎖状飽和脂肪族炭化水素基がエーテル結合を介して結合したs価の基を示し、sは2以上の整数を示す)
で表される化合物(以後、「化合物(b)」と称する場合がある)をカチオン重合性モノマー全量の5重量%以上含有する接着剤(以後、「接着剤(1)」と称する場合がある)が好ましい。
Among them, the cation-curable adhesive has, as a cation-polymerizable monomer, at least one cation-polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule. A compound (hereinafter sometimes referred to as "compound (I)") in an amount of 10% by weight or more based on the total amount of the cationically polymerizable monomer,
Figure JPOXMLDOC01-appb-C000005
(In the formula, R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond. s represents a valent group, and s represents an integer of 2 or more)
An adhesive containing a compound represented by (hereinafter sometimes referred to as "compound (b)") in an amount of 5% by weight or more based on the total amount of the cationically polymerizable monomer (hereinafter sometimes referred to as "adhesive (1)"). ) Is preferred.
 接着剤(1)は、ガラス板に対する密着性に優れ、ガラス板表面に前処理(例えば、プライマー処理、プラズマ処理、コロナ処理等)を施さなくても、極めて優れた接着力でガラス板と樹脂フィルムを接着することができる。また、優れた接着力を有するため、極めて少量の使用でガラス板と樹脂フィルムを接着することができ、ガラス板や樹脂フィルムが透明である場合はその透明性を損なうことなく接着することができ、透明性に優れたカバー部材(全光線透過率は、例えば80%以上)を形成することができる。更にまた、接着剤(1)の硬化物は、脆性が極めて低くまで抑制され、靱性に優れる。 The adhesive (1) has excellent adhesion to a glass plate and has an extremely excellent adhesive force even if the glass plate surface is not pretreated (for example, primer treatment, plasma treatment, corona treatment, etc.). The film can be glued. Also, since it has excellent adhesive strength, it can bond the glass plate and the resin film with a very small amount of use, and when the glass plate and the resin film are transparent, they can bond without impairing their transparency. It is possible to form a cover member having excellent transparency (total light transmittance is, for example, 80% or more). Furthermore, the cured product of the adhesive (1) is suppressed in brittleness to an extremely low level and has excellent toughness.
 (化合物(I))
 化合物(I)は、1分子中に少なくとも2種の官能基を有する化合物である。詳細には、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物である。化合物(I)を含む接着剤を硬化して得られる硬化物は、前記2種の官能基が重合して高度な架橋構造体を形成するため高硬度を有する。
(Compound (I))
The compound (I) is a compound having at least two kinds of functional groups in one molecule. Specifically, it is a compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule. The cured product obtained by curing the adhesive containing the compound (I) has high hardness because the two types of functional groups are polymerized to form a highly crosslinked structure.
 化合物(I)としては、なかでも、得られる硬化物の高硬度化、低硬化収縮化、密着性向上の観点から、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を1個と、水酸基を1個有する化合物(i)が好ましい。 As the compound (I), a cationic polymerization selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule, from the viewpoint of increasing the hardness, reducing the curing shrinkage, and improving the adhesiveness, of the resulting cured product. The compound (i) having one functional group and one hydroxyl group is preferable.
 前記化合物(i)には、以下の3種類の化合物が含まれる。
i-1:ビニルエーテル基1個と、水酸基1個とを有する化合物
i-2:エポキシ基1個と、水酸基1個とを有する化合物
i-3:オキセタニル基1個と、水酸基1個とを有する化合物
The compound (i) includes the following three types of compounds.
i-1: a compound having one vinyl ether group and one hydroxyl group, i-2: one compound having an epoxy group and one hydroxyl group, i-3: having one oxetanyl group and one hydroxyl group Compound
 前記化合物(i)は、例えば下記式で表される。
   HO-Ra-Y   (i)
(式中、Raは2価の炭化水素基、2価の複素環式基、又はこれらが単結合若しくは連結基を介して結合した2価の基を示す。Yはビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を示す)
The compound (i) is represented by the following formula, for example.
HO-R a -Y (i)
(In the formula, R a represents a divalent hydrocarbon group, a divalent heterocyclic group, or a divalent group in which these are bonded via a single bond or a linking group. Y is a vinyl ether group, an epoxy group, And a cationically polymerizable group selected from oxetanyl groups)
 前記炭化水素基には、脂肪族炭化水素基、脂環式炭化水素基、及び芳香族炭化水素基が含まれる。 The above-mentioned hydrocarbon group includes an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group.
 2価の脂肪族炭化水素基としては、例えば、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基等の炭素数1~18の直鎖状又は分岐鎖状のアルキレン基;ビニレン、1-メチルビニレン、プロペニレン、1-ブテニレン、2-ブテニレン、1-ペンテニレン、2-ペンテニレン基等の炭素数2~18の直鎖状又は分岐鎖状アルケニレン基;エチニレン、プロピニレン、3-メチル-1-プロピニレン、ブチニレン、1、3-ブタジイニレン基等の炭素数2~18の直鎖状又は分岐鎖状アルキニレン基が挙げられる。 Examples of the divalent aliphatic hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms such as methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group and trimethylene group. A linear or branched alkenylene group having 2 to 18 carbon atoms such as vinylene, 1-methylvinylene, propenylene, 1-butenylene, 2-butenylene, 1-pentenylene or 2-pentenylene group; ethynylene, propynylene, 3- Examples thereof include linear or branched alkynylene groups having 2 to 18 carbon atoms such as methyl-1-propynylene, butynylene, and 1,3-butadiynylene groups.
 2価の脂環式炭化水素基を構成する脂環には、単環式炭化水素環及び多環式炭化水素環が含まれ、前記多環式炭化水素環には、スピロ炭化水素環、環集合炭化水素環、架橋環式炭化水素環、縮合環式炭化水素環、架橋縮合環式炭化水素環が含まれる。2価の脂環式炭化水素基としては、前記脂環の構造式から2個の水素原子を除いた基が挙げられる。 The alicyclic ring that constitutes the divalent alicyclic hydrocarbon group includes a monocyclic hydrocarbon ring and a polycyclic hydrocarbon ring, and the polycyclic hydrocarbon ring includes a spiro hydrocarbon ring and a ring. It includes an aggregated hydrocarbon ring, a bridged cyclic hydrocarbon ring, a condensed cyclic hydrocarbon ring, and a bridged condensed cyclic hydrocarbon ring. Examples of the divalent alicyclic hydrocarbon group include groups obtained by removing two hydrogen atoms from the structural formula of the alicycle.
 前記単環式炭化水素環としては、例えば、シクロプロパン、シクロブタン、シクロペンタン、シクロヘキサン、シクロヘプタン、シクロオクタン等のC3-12シクロアルカン環;シクロペンテン、シクロヘキセン等のC3-12シクロアルケン環等が挙げられる。 Examples of the monocyclic hydrocarbon ring include C 3-12 cycloalkane rings such as cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane and cyclooctane; C 3-12 cycloalkene rings such as cyclopentene and cyclohexene. Are listed.
 前記スピロ炭化水素環としては、例えば、スピロ[4.4]ノナン、スピロ[4.5]デカン、スピロビシクロヘキサン等のC5-16スピロ炭化水素環等が挙げられる。 Examples of the spiro hydrocarbon ring include C 5-16 spiro hydrocarbon rings such as spiro[4.4]nonane, spiro[4.5]decane, and spirobicyclohexane.
 前記環集合炭化水素環としては、例えば、ビシクロヘキサン等のC5-12シクロアルカン環を2個以上含む環集合炭化水素環等が挙げられる。 Examples of the ring-assembled hydrocarbon ring include a ring-assembled hydrocarbon ring containing two or more C 5-12 cycloalkane rings such as bicyclohexane .
 前記架橋環式炭化水素環としては、例えば、ピナン、ボルナン、ノルピナン、ノルボルナン、ノルボルネン、ビシクロヘプタン、ビシクロヘプテン、ビシクロオクタン(ビシクロ[2.2.2]オクタン、ビシクロ[3.2.1]オクタン等)等の2環式炭化水素環;ホモブレダン、アダマンタン、トリシクロ[5.2.1.02,6]デカン、トリシクロ[4.3.1.12,5]ウンデカン等の3環式炭化水素環;テトラシクロ[4.4.0.12,5.17,10]ドデカン、パーヒドロ-1,4-メタノ-5,8-メタノナフタレン等の4環式炭化水素環等が挙げられる。 Examples of the bridged cyclic hydrocarbon ring include pinane, bornane, norpinane, norbornane, norbornene, bicycloheptane, bicycloheptene, bicyclooctane (bicyclo[2.2.2]octane, bicyclo[3.2.1]octane, etc. ) Etc.; bicyclic hydrocarbon rings; tricyclic hydrocarbons such as homobredan, adamantane, tricyclo[5.2.1.0 2,6 ]decane, tricyclo[4.3.1.1 2,5 ]undecane Ring; tetracyclo[4.4.0.1 2,5 . 1 7,10 ]dodecane, perhydro-1,4-methano-5,8-methanonaphthalene, and other tetracyclic hydrocarbon rings.
 前記縮合環式炭化水素環としては、例えば、パーヒドロナフタレン(デカリン)、パーヒドロアントラセン、パーヒドロフェナントレン、パーヒドロアセナフテン、パーヒドロフルオレン、パーヒドロインデン等の5~8員シクロアルカン環が複数個縮合した縮合環が挙げられる。 Examples of the condensed cyclic hydrocarbon ring include a plurality of 5- to 8-membered cycloalkane rings such as perhydronaphthalene (decalin), perhydroanthracene, perhydrophenanthrene, perhydroacenaphthene, perhydrofluorene, and perhydroindene. Examples include fused rings that are individually condensed.
 前記架橋縮合環式炭化水素環には、ジエン類の二量体(例えば、シクロペンタジエン、シクロヘキサジエン、シクロヘプタジエン等のシクロアルカジエンの二量体)や、その水素添加物等が挙げられる。 Examples of the above-mentioned bridged condensed cyclic hydrocarbon ring include diene dimers (for example, cycloalkadiene dimers such as cyclopentadiene, cyclohexadiene, and cycloheptadiene) and hydrogenated products thereof.
 2価の芳香族炭化水素基としては、例えば、フェニレン基、ビフェニレン基、ナフチレン基等の、炭素数6~18のアリーレン基が挙げられる。 Examples of the divalent aromatic hydrocarbon group include arylene groups having 6 to 18 carbon atoms such as phenylene group, biphenylene group and naphthylene group.
 上記炭化水素基は、種々の置換基[例えば、ハロゲン原子、オキソ基、置換オキシ基(例えば、アルコキシ基、アリールオキシ基、アラルキルオキシ基、アシルオキシ基等)、カルボキシル基、置換オキシカルボニル基(アルコキシカルボニル基、アリールオキシカルボニル基、アラルキルオキシカルボニル基等)、置換又は無置換カルバモイル基、シアノ基、ニトロ基、置換又は無置換アミノ基、スルホ基、複素環式基等]を有していてもよい。前記カルボキシル基は有機合成の分野で慣用の保護基で保護されていてもよい。また、脂環式炭化水素基や芳香族炭化水素基を構成する環には芳香族性又は非芳香属性の複素環が縮合していてもよい。 The hydrocarbon group may be various substituents [eg, halogen atom, oxo group, substituted oxy group (eg, alkoxy group, aryloxy group, aralkyloxy group, acyloxy group, etc.), carboxyl group, substituted oxycarbonyl group (alkoxy group). Carbonyl group, aryloxycarbonyl group, aralkyloxycarbonyl group, etc.), substituted or unsubstituted carbamoyl group, cyano group, nitro group, substituted or unsubstituted amino group, sulfo group, heterocyclic group, etc.] Good. The carboxyl group may be protected by a protecting group commonly used in the field of organic synthesis. Further, a heterocyclic ring having an aromatic or non-aromatic attribute may be condensed with the ring forming the alicyclic hydrocarbon group or the aromatic hydrocarbon group.
 前記連結基としては、例えば、カルボニル基(-CO-)、エーテル結合(-O-)、チオエーテル結合(-S-)、エステル結合(-COO-)、アミド結合(-CONH-)、カーボネート結合(-OCOO-)等が挙げられる。 Examples of the linking group include a carbonyl group (—CO—), an ether bond (—O—), a thioether bond (—S—), an ester bond (—COO—), an amide bond (—CONH—), and a carbonate bond. (-OCOO-) and the like.
 2価の複素環式基を構成する複素環としては、例えば、ヘテロ原子として酸素原子を含む複素環(例えば、オキセタン環等の4員環;フラン環、テトラヒドロフラン環、オキサゾール環、イソオキサゾール環、γ-ブチロラクトン環等の5員環;4-オキソ-4H-ピラン環、テトラヒドロピラン環、モルホリン環等の6員環;ベンゾフラン環、イソベンゾフラン環、4-オキソ-4H-クロメン環、クロマン環、イソクロマン環等の縮合環;3-オキサトリシクロ[4.3.1.14,8]ウンデカン-2-オン環、3-オキサトリシクロ[4.2.1.04,8]ノナン-2-オン環等の橋かけ環)、ヘテロ原子としてイオウ原子を含む複素環(例えば、チオフェン環、チアゾール環、イソチアゾール環、チアジアゾール環等の5員環;4-オキソ-4H-チオピラン環等の6員環;ベンゾチオフェン環等の縮合環等)、ヘテロ原子として窒素原子を含む複素環(例えば、ピロール環、ピロリジン環、ピラゾール環、イミダゾール環、トリアゾール環等の5員環;ピリジン環、ピリダジン環、ピリミジン環、ピラジン環、ピペリジン環、ピペラジン環等の6員環;インドール環、インドリン環、キノリン環、アクリジン環、ナフチリジン環、キナゾリン環、プリン環等の縮合環等)等が挙げられる。上記複素環式基は、前記炭化水素基が有していてもよい置換基のほか、アルキル基(例えば、メチル基、エチル基等のC1-4アルキル基等)、シクロアルキル基、アリール基(例えば、フェニル基、ナフチル基等)等を有していてもよい。2価の複素環式基は、前記複素環の構造式から2個の水素原子を除いた基が挙げられる。 Examples of the heterocycle forming the divalent heterocyclic group include a heterocycle containing an oxygen atom as a hetero atom (for example, a 4-membered ring such as an oxetane ring; a furan ring, a tetrahydrofuran ring, an oxazole ring, an isoxazole ring, 5-membered ring such as γ-butyrolactone ring; 6-membered ring such as 4-oxo-4H-pyran ring, tetrahydropyran ring and morpholine ring; benzofuran ring, isobenzofuran ring, 4-oxo-4H-chromene ring, chroman ring, Fused rings such as isochroman ring; 3-oxatricyclo[4.3.1.1 4,8 ]undecan-2-one ring, 3-oxatricyclo[4.2.1.0 4,8 ]nonane- A bridge ring such as a 2-one ring), a heterocycle containing a sulfur atom as a hetero atom (for example, a 5-membered ring such as a thiophene ring, a thiazole ring, an isothiazole ring, a thiadiazole ring; a 4-oxo-4H-thiopyran ring, etc. A condensed ring such as a benzothiophene ring), a heterocycle containing a nitrogen atom as a hetero atom (for example, a 5-membered ring such as a pyrrole ring, a pyrrolidine ring, a pyrazole ring, an imidazole ring, a triazole ring; a pyridine ring, 6-membered ring such as pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring; condensed ring such as indole ring, indoline ring, quinoline ring, acridine ring, naphthyridine ring, quinazoline ring and purine ring) .. The heterocyclic group includes, in addition to the substituents that the hydrocarbon group may have, an alkyl group (for example, a C 1-4 alkyl group such as a methyl group and an ethyl group), a cycloalkyl group, an aryl group. (For example, a phenyl group, a naphthyl group, etc.) may be included. Examples of the divalent heterocyclic group include groups obtained by removing two hydrogen atoms from the above structural formula of the heterocycle.
 前記Raとしては、なかでも2価の炭化水素基、又は炭化水素基の2個以上が連結基を介して結合した2価の基が好ましく、特に好ましくは2価の脂肪族炭化水素基、又は脂肪族炭化水素基の2個以上が連結基を介して結合した2価の基、最も好ましくは炭素数1~18の直鎖状又は分岐鎖状のアルキレン基、又は炭素数1~18の直鎖状又は分岐鎖状のアルキレン基の2個以上が連結基を介して結合した基、とりわけ好ましくは炭素数1~6の直鎖状又は分岐鎖状のアルキレン基、又は炭素数1~6の直鎖状又は分岐鎖状のアルキレン基の2個以上が連結基を介して結合した基である。また、前記連結基としては、エーテル結合が好ましい。 Above all, R a is preferably a divalent hydrocarbon group or a divalent group in which two or more hydrocarbon groups are bonded via a linking group, particularly preferably a divalent aliphatic hydrocarbon group, Alternatively, a divalent group in which two or more aliphatic hydrocarbon groups are bonded via a linking group, most preferably a linear or branched alkylene group having 1 to 18 carbon atoms, or a divalent group having 1 to 18 carbon atoms A group in which two or more linear or branched alkylene groups are bonded via a linking group, particularly preferably a linear or branched alkylene group having 1 to 6 carbon atoms, or 1 to 6 carbon atoms. Two or more of the straight-chain or branched-chain alkylene groups are bound to each other via a linking group. Moreover, as the linking group, an ether bond is preferable.
 化合物(i)としては、ビニルエーテル基1個と水酸基1個とを有する化合物(i-1)及び/又はオキセタニル基1個と水酸基1個とを有する化合物(i-3)を含有することが、より高硬度を有する硬化物が得られる点で好ましく、とりわけ、前記化合物(i-3)を少なくとも含有することが好ましい。 The compound (i) contains a compound (i-1) having one vinyl ether group and one hydroxyl group and/or a compound (i-3) having one oxetanyl group and one hydroxyl group, It is preferable in that a cured product having higher hardness can be obtained, and it is particularly preferable to contain at least the compound (i-3).
 化合物(i)としては、下記式(i-1-1)~(i-1-3)(i-3-1)で表される化合物から選択される少なくとも1種を含有することが好ましく、とりわけ、下記式(i-3-1)で表される化合物を少なくとも含有することが好ましい。
Figure JPOXMLDOC01-appb-C000006
The compound (i) preferably contains at least one selected from the compounds represented by the following formulas (i-1-1) to (i-1-3) (i-3-1), Especially, it is preferable to contain at least a compound represented by the following formula (i-3-1).
Figure JPOXMLDOC01-appb-C000006
 (化合物(b))
 化合物(b)は、下記式(b)で表される化合物である。
Figure JPOXMLDOC01-appb-C000007
(式中、Rは、s価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基、又は2個以上の直鎖状又は分岐鎖状飽和脂肪族炭化水素基がエーテル結合を介して結合したs価の基を示し、sは2以上の整数を示す)
(Compound (b))
The compound (b) is a compound represented by the following formula (b).
Figure JPOXMLDOC01-appb-C000007
(In the formula, R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond. s represents a valent group, and s represents an integer of 2 or more)
 式中のsは2以上の整数を示し、例えば2~6の整数、好ましくは2~4の整数、特に好ましくは2~3の整数、とりわけ好ましくは2である。 S in the formula represents an integer of 2 or more, for example, an integer of 2 to 6, preferably an integer of 2 to 4, particularly preferably an integer of 2 to 3, and particularly preferably 2.
 Rにおけるs価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基のうち、2価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基としては、例えば、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基等の炭素数1~18(好ましくは炭素数1~10、特に好ましくは炭素数3~6)の直鎖状又は分岐鎖状のアルキレン基が挙げられる。また、3価以上の直鎖状又は分岐鎖状飽和脂肪族炭化水素基は、2価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基の構造式から更に(s-2)個の水素を除いた基が挙げられる。 Among the s-valent linear or branched saturated aliphatic hydrocarbon groups for R, examples of the divalent linear or branched saturated aliphatic hydrocarbon group include, for example, methylene group, methylmethylene group, and dimethyl group. Straight-chain or branched alkylene having 1 to 18 carbon atoms (preferably 1 to 10 carbon atoms, particularly preferably 3 to 6 carbon atoms) such as methylene group, ethylene group, propylene group, trimethylene group, tetramethylene group, etc. Groups. The trivalent or higher valent linear or branched saturated aliphatic hydrocarbon group is further defined as (s-2) hydrogens from the structural formula of the divalent linear or branched saturated aliphatic hydrocarbon group. Groups excluding.
 Rで示される基の総炭素数は、例えば1~20、好ましくは2~15、特に好ましくは2~10、最も好ましくは3~8である。 The total number of carbon atoms of the group represented by R is, for example, 1 to 20, preferably 2 to 15, particularly preferably 2 to 10, and most preferably 3 to 8.
 化合物(b)としては、なかでも、下記式(b-1)~(b-5)で表される化合物、トリメチロールエタントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、グリセリントリグリシジルエーテル、及びジペンタエリスリトールヘキサグリシジルエーテルから選択される少なくとも1種が好ましく、特に低粘度で塗布性に優れる点において、好ましくは下記式(b-1)~(b-5)で表される化合物から選択される少なくとも1種であり、最も好ましくは下記式(b-1)~(b-4)で表される化合物から選択される少なくとも1種である。
Figure JPOXMLDOC01-appb-C000008
Examples of the compound (b) include compounds represented by the following formulas (b-1) to (b-5), trimethylolethane triglycidyl ether, pentaerythritol tetraglycidyl ether, glycerin triglycidyl ether, and dipenta. At least one selected from erythritol hexaglycidyl ether is preferable, and particularly at least selected from compounds represented by the following formulas (b-1) to (b-5) in view of low viscosity and excellent coatability. It is one kind, and most preferably at least one kind selected from the compounds represented by the following formulas (b-1) to (b-4).
Figure JPOXMLDOC01-appb-C000008
 (ビニルエーテル化合物(A))
 前記接着剤(1)は、カチオン重合性モノマーとして、上述の化合物(I)以外にも、ビニルエーテル基を1分子中に少なくとも1個有し、且つ水酸基を有さない化合物(本明細書においては「ビニルエーテル化合物(A)」と称する場合がある)を1種又は2種以上含有していてもよい。ビニルエーテル化合物(A)は、ビニルエーテル基以外にも他のカチオン重合性基(例えば、エポキシ基、オキセタニル基等)を有していてもよい。
(Vinyl ether compound (A))
The adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one vinyl ether group in one molecule and having no hydroxyl group (in the present specification, other than the compound (I) described above). 1 type, or 2 or more types may be contained. The vinyl ether compound (A) may have another cationically polymerizable group (for example, an epoxy group, an oxetanyl group, etc.) in addition to the vinyl ether group.
 ビニルエーテル化合物(A)としては、例えば、下記式(a)で表される化合物が挙げられる。
   Rc-(O-CH=CH2t  (a)
(式中、Rcは、t価の炭化水素基、t価の複素環式基、又はこれらが単結合若しくは連結基を介して結合したt価の基を示し、tは1以上の整数を示す)
Examples of the vinyl ether compound (A) include compounds represented by the following formula (a).
R c -(O-CH=CH 2 ) t (a)
(In the formula, R c represents a t-valent hydrocarbon group, a t-valent heterocyclic group, or a t-valent group in which these are bonded via a single bond or a linking group, and t is an integer of 1 or more. Show)
 前記tは1以上の整数であり、例えば1~10の整数、好ましくは1~5の整数、特に好ましくは2~5の整数である。 The t is an integer of 1 or more, for example, an integer of 1 to 10, preferably an integer of 1 to 5, particularly preferably an integer of 2 to 5.
 前記Rcにおけるt価の炭化水素基及びt価の複素環式基としては、Raにおける2価の炭化水素基及び2価の複素環式基に対応するt価の基が挙げられる。また、前記t価の炭化水素基及びt価の複素環式基は置換基を有していてもよく、前記置換基としてはRaにおける2価の炭化水素基及び2価の複素環式基が有していてもよい置換基や、エポキシ基又はオキセタニル基を含む基が挙げられる。更に、前記連結基としては、Raにおける連結基と同様の例が挙げられる。前記Rcとしては、なかでも脂環式又は複素環式骨格を有するt価の基が好ましい。 As the t-valent hydrocarbon group and t-valent heterocyclic group in R c, include t-valent group corresponding to the divalent hydrocarbon group and divalent heterocyclic group in R a. Further, the t-valent hydrocarbon group and the t-valent heterocyclic group may have a substituent, and as the substituent, the divalent hydrocarbon group and the divalent heterocyclic group in R a can be used . And a group containing an epoxy group or an oxetanyl group. Further, examples of the linking group include the same examples as the linking group for R a . Above all, R c is preferably a t-valent group having an alicyclic or heterocyclic skeleton.
 ビニルエーテル化合物(A)としては、下記式(a-1)~(a-2)で表される化合物や、シクロヘキシルジメタノールモノビニルエーテル、シクロヘキシルビニルエーテル、シクロヘキシルメチルビニルエーテル、シクロヘキシルエチルビニルエーテル、メンチルビニルエーテル、テトラヒドロフルフリルビニルエーテル、ノルボルネニルビニルエーテル、1-アダマンチルビニルエーテル、2-アダマンチルビニルエーテル、1,4-シクロヘキサンジオールジビニルエーテル、1,4-シクロヘキサンジメタノールジビニルエーテル等が好ましい。
Figure JPOXMLDOC01-appb-C000009
Examples of the vinyl ether compound (A) include compounds represented by the following formulas (a-1) to (a-2), cyclohexyl dimethanol monovinyl ether, cyclohexyl vinyl ether, cyclohexyl methyl vinyl ether, cyclohexyl ethyl vinyl ether, menthyl vinyl ether, and tetrahydrofuran. Furyl vinyl ether, norbornenyl vinyl ether, 1-adamantyl vinyl ether, 2-adamantyl vinyl ether, 1,4-cyclohexanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether and the like are preferable.
Figure JPOXMLDOC01-appb-C000009
 (エポキシ化合物(B))
 前記接着剤(1)は、カチオン重合性モノマーとして、上述の化合物(I)や化合物(b)以外にも、エポキシ基を1分子中に少なくとも1個有し、且つ水酸基を有さない化合物(ビニルエーテル基を有する化合物を除く;本明細書においては「エポキシ化合物(B)」と称する場合がある)を1種又は2種以上含有していてもよい。エポキシ化合物(B)は、エポキシ基以外にも他のカチオン重合性基(例えば、オキセタニル基)を有していてもよい。
(Epoxy compound (B))
The adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one epoxy group in a molecule and not having a hydroxyl group (in addition to the compound (I) and the compound (b) described above. Except for compounds having a vinyl ether group; in the present specification, it may be referred to as “epoxy compound (B)”) may be contained in one kind or two or more kinds. The epoxy compound (B) may have another cationically polymerizable group (eg, oxetanyl group) in addition to the epoxy group.
 前記エポキシ基には、下記式(e-1)で表されるシクロヘキセンオキシド基などの、脂環(例えば、3~8員の脂環)を構成する隣接する2個の炭素原子と、酸素原子とで構成される基(以後、「脂環式エポキシ基」と称する場合がある)や、下記式(e-2)で表されるエチレンオキシド基が含まれる。下記式中、R1は水素原子又はC1-3アルキル基を示す。
Figure JPOXMLDOC01-appb-C000010
The epoxy group includes two adjacent carbon atoms forming an alicyclic ring (for example, a 3- to 8-membered alicyclic ring) such as a cyclohexene oxide group represented by the following formula (e-1), and an oxygen atom. And a group composed of and (hereinafter sometimes referred to as “alicyclic epoxy group”) and an ethylene oxide group represented by the following formula (e-2). In the following formula, R 1 represents a hydrogen atom or a C 1-3 alkyl group.
Figure JPOXMLDOC01-appb-C000010
 エポキシ化合物(B)としては、なかでもエポキシ基を1分子中に2個以上有する化合物が硬化性に優れる点で好ましく、特に、脂環式エポキシ基を1分子中に2個以上有する化合物、エチレンオキシド基を1分子中に2個以上有する化合物、及び脂環式エポキシ基とエチレンオキシド基を1分子中にそれぞれ1個以上有する化合物から選択される少なくとも1種が好ましい。 As the epoxy compound (B), a compound having two or more epoxy groups in one molecule is preferable because of its excellent curability, and particularly, a compound having two or more alicyclic epoxy groups in one molecule, ethylene oxide. At least one selected from a compound having two or more groups in one molecule and a compound having one or more alicyclic epoxy groups and one or more ethylene oxide groups in one molecule is preferable.
 脂環式エポキシ基を1分子中に2個以上有する化合物としては、下記式(b’)で表される化合物が好ましい。
Figure JPOXMLDOC01-appb-C000011
As the compound having two or more alicyclic epoxy groups in one molecule, a compound represented by the following formula (b′) is preferable.
Figure JPOXMLDOC01-appb-C000011
 上記式(b’)中、Xは単結合又は連結基を示す。前記連結基としては、例えば、二価の炭化水素基、炭素-炭素二重結合の一部又は全部がエポキシ化されたアルケニレン基、カルボニル基(-CO-)、エーテル結合(-O-)、エステル結合(-COO-)、カーボネート結合(-O-CO-O-)、アミド結合(-CONH-)、及びこれらが複数個連結した基等が挙げられる。 In the above formula (b'), X represents a single bond or a linking group. Examples of the linking group include a divalent hydrocarbon group, an alkenylene group in which part or all of carbon-carbon double bonds are epoxidized, a carbonyl group (—CO—), an ether bond (—O—), Examples thereof include an ester bond (-COO-), a carbonate bond (-O-CO-O-), an amide bond (-CONH-), and a group in which a plurality of these are linked.
 上記二価の炭化水素基としては、例えば、炭素数1~18の直鎖状又は分岐鎖状のアルキレン基、炭素数3~18の二価の脂環式炭化水素基等が挙げられる。炭素数1~18の直鎖状又は分岐鎖状のアルキレン基としては、例えば、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基等が挙げられる。炭素数3~18の二価の脂環式炭化水素基としては、例えば、1,2-シクロペンチレン基、1,3-シクロペンチレン基、シクロペンチリデン基、1,2-シクロヘキシレン基、1,3-シクロヘキシレン基、1,4-シクロヘキシレン基、シクロヘキシリデン基等のシクロアルキレン基(シクロアルキリデン基を含む)等が挙げられる。 Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms and a divalent alicyclic hydrocarbon group having 3 to 18 carbon atoms. Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group, trimethylene group and the like. Examples of the divalent alicyclic hydrocarbon group having 3 to 18 carbon atoms include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group and 1,2-cyclohexylene group. And cycloalkylene groups (including cycloalkylidene group) such as 1,3-cyclohexylene group, 1,4-cyclohexylene group, and cyclohexylidene group.
 上記炭素-炭素二重結合の一部又は全部がエポキシ化されたアルケニレン基(「エポキシ化アルケニレン基」と称する場合がある)におけるアルケニレン基としては、例えば、ビニレン基、プロペニレン基、1-ブテニレン基、2-ブテニレン基、ブタジエニレン基、ペンテニレン基、ヘキセニレン基、ヘプテニレン基、オクテニレン基等の炭素数2~8の直鎖状又は分岐鎖状のアルケニレン基等が挙げられる。特に、上記エポキシ化アルケニレン基としては、炭素-炭素二重結合の全部がエポキシ化されたアルケニレン基が好ましく、より好ましくは炭素-炭素二重結合の全部がエポキシ化された炭素数2~4のアルケニレン基である。 Examples of the alkenylene group in the alkenylene group in which some or all of the carbon-carbon double bonds are epoxidized (sometimes referred to as “epoxidized alkenylene group”) include, for example, vinylene group, propenylene group, 1-butenylene group. Examples thereof include linear or branched alkenylene groups having 2 to 8 carbon atoms such as 2-butenylene group, butadienylene group, pentenylene group, hexenylene group, heptenylene group and octenylene group. In particular, the epoxidized alkenylene group is preferably an alkenylene group in which all carbon-carbon double bonds are epoxidized, and more preferably an alkenylene group having 2 to 4 carbon atoms in which all carbon-carbon double bonds are epoxidized. It is an alkenylene group.
 上記式(b’)中のシクロヘキセンオキシド基には、置換基が結合していても良く、前記置換基としては、例えば、ハロゲン原子、C1-10アルキル基、C1-10アルコキシ基、C2-10アルケニルオキシ基、C6-14アリールオキシ基、C7-18アラルキルオキシ基、C1-10アシルオキシ基、C1-10アルコキシカルボニル基、C6-14アリールオキシカルボニル基、C7-18アラルキルオキシカルボニル基、エポキシ基含有基、オキセタニル基含有基、C1-10アシル基、イソシアナート基、スルホ基、カルバモイル基、オキソ基等が挙げられる。 A substituent may be bonded to the cyclohexene oxide group in the above formula (b′), and examples of the substituent include a halogen atom, a C 1-10 alkyl group, a C 1-10 alkoxy group, C 2-10 alkenyloxy group, C 6-14 aryloxy group, C 7-18 aralkyloxy group, C 1-10 acyloxy group, C 1-10 alkoxycarbonyl group, C 6-14 aryloxycarbonyl group, C 7- 18 aralkyloxycarbonyl group, epoxy group-containing group, oxetanyl group-containing group, C 1-10 acyl group, isocyanate group, sulfo group, carbamoyl group, oxo group and the like.
 上記式(b’)で表される化合物の代表的な例としては、(3,4,3’,4’-ジエポキシ)ビシクロヘキシル、ビス(3,4-エポキシシクロヘキシルメチル)エーテル、1,2-エポキシ-1,2-ビス(3,4-エポキシシクロヘキサン-1-イル)エタン、2,2-ビス(3,4-エポキシシクロヘキサン-1-イル)プロパン、1,2-ビス(3,4-エポキシシクロヘキサン-1-イル)エタンや、下記式(b'-1)~(b'-8)で表される化合物等が挙げられる。尚、下記式(b'-5)中のLは炭素数1~8のアルキレン基(例えば、メチレン基、エチレン基、プロピレン基、イソプロピレン基等の炭素数1~3の直鎖状又は分岐鎖状のアルキレン基)を示す。また、下記式(b'-5)(b'-7)中のn1、n2は、それぞれ1~30の整数を示す。
Figure JPOXMLDOC01-appb-C000012
Typical examples of the compound represented by the above formula (b') include (3,4,3',4'-diepoxy)bicyclohexyl, bis(3,4-epoxycyclohexylmethyl)ether, 1,2. -Epoxy-1,2-bis(3,4-epoxycyclohexan-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 1,2-bis(3,4) —Epoxycyclohexan-1-yl)ethane, compounds represented by the following formulas (b′-1) to (b′-8) and the like can be mentioned. In the formula (b'-5), L is an alkylene group having 1 to 8 carbon atoms (for example, a straight chain or branched chain having 1 to 3 carbon atoms such as methylene group, ethylene group, propylene group, isopropylene group). A chain-like alkylene group) is shown. In addition, n 1 and n 2 in the following formulas (b′-5) and (b′-7) each represent an integer of 1 to 30.
Figure JPOXMLDOC01-appb-C000012
 脂環式エポキシ基を1分子中に2個以上有する化合物には、更に、下記式(b'-9)(b'-10)で表される化合物も含まれる。下記式(b'-9)(b'-10)中のn3~n8は、同一又は異なって1~30の整数を示す。
Figure JPOXMLDOC01-appb-C000013
The compounds having two or more alicyclic epoxy groups in one molecule further include compounds represented by the following formulas (b'-9) (b'-10). N 3 to n 8 in the following formulas (b′-9) and (b′-10) are the same or different and each represents an integer of 1 to 30.
Figure JPOXMLDOC01-appb-C000013
 エチレンオキシド基を1分子中に2個以上有する化合物としては、例えば、水素化ビスフェノールA型ジグリシジルエーテル、水素化ビスフェノールF型ジグリシジルエーテル、水素化ビフェノール型ジグリシジルエーテル、水素化フェノールノボラック型ジグリシジルエーテル、水素化クレゾールノボラック型ジグリシジルエーテル等の脂環式グリシジルエーテル;ビスフェノールA型ジグリシジルエーテル、ビスフェノールF型ジグリシジルエーテル、ビフェノール型ジグリシジルエーテル、フェノールノボラック型ジグリシジルエーテル、クレゾールノボラック型ジグリシジルエーテル等の芳香族グリシジルエーテル;下記式(b")で表される化合物等が挙げられる。
Figure JPOXMLDOC01-appb-C000014
Examples of the compound having two or more ethylene oxide groups in one molecule include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated biphenol diglycidyl ether, and hydrogenated phenol novolac diglycidyl. Alicyclic glycidyl ethers such as ethers and hydrogenated cresol novolac diglycidyl ethers; bisphenol A diglycidyl ethers, bisphenol F diglycidyl ethers, biphenol diglycidyl ethers, phenol novolac diglycidyl ethers, cresol novolac diglycidyl ethers Aromatic glycidyl ethers such as ethers; compounds represented by the following formula (b″) and the like can be mentioned.
Figure JPOXMLDOC01-appb-C000014
 式(b")中、R"は、p価のアルコールの構造式からp個の水酸基(-OH)を除いた基(p価の有機基)であり、p、n9はそれぞれ自然数を表す。p価のアルコール[R"(OH)p]としては、2,2-ビス(ヒドロキシメチル)-1-ブタノール等の多価アルコール(炭素数1~15の多価アルコール等)等が挙げられる。pは1~6が好ましく、n9は1~30が好ましい。pが2以上の場合、それぞれの[ ]内(外側の角括弧内)の基におけるn9は同一でもよく異なっていてもよい。上記式(b")で表される化合物としては、具体的には、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン付加物[例えば、商品名「EHPE3150」((株)ダイセル製)等]等が挙げられる。 In the formula (b"), R" is a group (p-valent organic group) obtained by removing p hydroxyl groups (-OH) from the structural formula of p-valent alcohol, and p and n 9 each represent a natural number. .. Examples of the p-valent alcohol [R″(OH) p ] include polyhydric alcohols such as 2,2-bis(hydroxymethyl)-1-butanol (polyhydric alcohols having 1 to 15 carbon atoms) and the like. p is preferably 1 to 6, n 9 is 1 to case 30 is preferably .p is 2 or more, n 9 in groups in each [] (outside the square brackets) may be different may be the same Specific examples of the compound represented by the above formula (b″) include a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol. [For example, a trade name "EHPE3150" (manufactured by Daicel Corporation) and the like can be mentioned.
 脂環式エポキシ基とエチレンオキシド基を1分子中にそれぞれ1個以上有する化合物としては、例えば、1,2:8,9-ジエポキシリモネン等が挙げられる。 Examples of the compound having at least one alicyclic epoxy group and at least one ethylene oxide group in one molecule include 1,2:8,9-diepoxylimonene.
 エポキシ化合物(B)としては、脂環式エポキシ基を1分子中に2個以上有する化合物(特に、式(b’)で表される化合物)を含有することが、速硬化性を有し、高硬度の硬化物が得られる点で好ましい。 As the epoxy compound (B), containing a compound having two or more alicyclic epoxy groups in one molecule (particularly, a compound represented by the formula (b′)) has fast curing property, It is preferable in that a cured product with high hardness can be obtained.
 (オキセタン化合物(C))
 前記接着剤(1)は、カチオン重合性モノマーとして、上述の化合物(I)以外にも、オキセタニル基を1分子中に少なくとも1個有し、且つ水酸基を有さない化合物(ビニルエーテル基及び/又はエポキシ基を有する化合物を除く;本明細書においては「オキセタン化合物(C)」と称する場合がある)を1種又は2種以上含有していてもよい。
(Oxetane compound (C))
The adhesive (1) has, as a cationically polymerizable monomer, a compound having at least one oxetanyl group in one molecule other than the compound (I) and having no hydroxyl group (vinyl ether group and/or Except for compounds having an epoxy group; in the present specification, it may be referred to as "oxetane compound (C)"), and may contain one or more kinds.
 オキセタン化合物(C)は、例えば、下記式(c)で表される。
Figure JPOXMLDOC01-appb-C000015
(式中、Raは1価の有機基を示し、Rbは水素原子又はエチル基を示す。mは0以上の整数を示す)
The oxetane compound (C) is represented by, for example, the following formula (c).
Figure JPOXMLDOC01-appb-C000015
(In the formula, R a represents a monovalent organic group, R b represents a hydrogen atom or an ethyl group, and m represents an integer of 0 or more.)
 前記Raにおける1価の有機基には1価の炭化水素基、1価の複素環式基、置換オキシカルボニル基(アルコキシカルボニル基、アリールオキシカルボニル基、アラルキルオキシカルボニル基、シクロアルキルオキシカルボニル基等)、置換カルバモイル基(N-アルキルカルバモイル基、N-アリールカルバモイル基等)、アシル基(アセチル基等の脂肪族アシル基;ベンゾイル基等の芳香族アシル基等)、及びこれらの2個以上が単結合又は連結基を介して結合した1価の基が含まれる。 The monovalent organic group for R a is a monovalent hydrocarbon group, a monovalent heterocyclic group, a substituted oxycarbonyl group (alkoxycarbonyl group, aryloxycarbonyl group, aralkyloxycarbonyl group, cycloalkyloxycarbonyl group. Etc.), substituted carbamoyl groups (N-alkylcarbamoyl groups, N-arylcarbamoyl groups, etc.), acyl groups (aliphatic acyl groups such as acetyl groups; aromatic acyl groups such as benzoyl groups), and two or more of these. Include a monovalent group bonded through a single bond or a linking group.
 前記1価の炭化水素基、及び1価の複素環式基としては、上記Raにおける2価の炭化水素基及び2価の複素環式基に対応する1価の基が挙げられる。前記連結基としては、上記Raにおける連結基と同様の例が挙げられる。これらの基は置換基を有していてもよく、置換基としてはRaにおける炭化水素基が有していてもよい置換基と同様の例が挙げられる。 Examples of the monovalent hydrocarbon group and the monovalent heterocyclic group include monovalent groups corresponding to the divalent hydrocarbon group and the divalent heterocyclic group in R a above. Examples of the linking group include the same examples as the linking group for R a . These groups may have a substituent, and examples of the substituent include the same examples as the substituent which the hydrocarbon group for R a may have.
 前記mは0以上の整数を示し、例えば0~20の整数、好ましくは0~1の整数である。 The above-mentioned m represents an integer of 0 or more, and is, for example, an integer of 0 to 20, preferably an integer of 0 to 1.
 オキセタン化合物(C)としては、なかでも、オキセタニル基を1分子中に2個以上有する化合物を使用することが、速硬化性を有し、高硬度の硬化物が得られる点で好ましく、例えば、下記式(c-1)で表される化合物、及び下記式(c-2)で表される化合物等が好ましい。本発明においては、例えば、「アロンオキセタンOXT-221」、「アロンオキセタンOXT-121」(以上、東亞合成(株)製)等の市販品を使用することができる。
Figure JPOXMLDOC01-appb-C000016
As the oxetane compound (C), it is preferable to use, among others, a compound having two or more oxetanyl groups in one molecule from the viewpoint of having a fast curing property and a cured product having a high hardness. A compound represented by the following formula (c-1), a compound represented by the following formula (c-2), and the like are preferable. In the present invention, commercially available products such as "Aron oxetane OXT-221" and "Aron oxetane OXT-121" (all manufactured by Toagosei Co., Ltd.) can be used.
Figure JPOXMLDOC01-appb-C000016
 前記接着剤(1)は、カチオン重合性モノマーを、接着剤全量(100重量%)の、例えば50~99.9重量%(好ましくは70~98重量%)含有する。前記接着剤(1)は、カチオン重合性モノマーとして、上記化合物(I)及び化合物(b)を少なくとも含有し、更に、上記ビニルエーテル化合物(A)、エポキシ化合物(B)、及びオキセタン化合物(C)から選択される1種又は2種以上を含有していてもよい。 The adhesive (1) contains, for example, 50 to 99.9% by weight (preferably 70 to 98% by weight) of the cationically polymerizable monomer, based on the total amount (100% by weight) of the adhesive. The adhesive (1) contains at least the compound (I) and the compound (b) as a cationically polymerizable monomer, and further, the vinyl ether compound (A), the epoxy compound (B), and the oxetane compound (C). You may contain 1 type(s) or 2 or more types selected from.
 上記化合物(I)の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の10重量%以上(例えば10~65重量%)が好ましく、特に樹脂フィルムへの密着性に優れる硬化物が得られる点で、下限は25重量%が好ましく、より好ましくは30重量%、特に好ましくは33重量%、最も好ましくは35重量%である。また、特に高硬度を有する硬化物が得られる点で、上限は55重量%が好ましく、特に好ましくは50重量%、最も好ましくは45重量%である。化合物(I)の含有量が上記範囲を下回ると、ガラスに対する密着性が低下する傾向がある。 The content of the compound (I) is preferably 10% by weight or more (for example, 10 to 65% by weight) of the total amount of the cationically polymerizable monomer contained in the adhesive (1), and a cured product having particularly excellent adhesion to a resin film. The lower limit is preferably 25% by weight, more preferably 30% by weight, particularly preferably 33% by weight, and most preferably 35% by weight. In addition, the upper limit is preferably 55% by weight, particularly preferably 50% by weight, and most preferably 45% by weight from the viewpoint of obtaining a cured product having particularly high hardness. If the content of the compound (I) is less than the above range, the adhesion to glass tends to decrease.
 ビニルエーテル基を少なくとも1個と水酸基を少なくとも1個有する化合物(i-1-1)及びオキセタニル基を少なくとも1個と水酸基を少なくとも1個有する化合物(i-3-1)の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の25重量%以上(例えば、25~65重量%)であることが、樹脂フィルムへの密着性に優れ、高硬度を有する硬化物が得られる点で好ましく、特に硬化性に優れる点で25重量%以上、60重量%未満が好ましく、最も好ましくは25~55重量%、とりわけ好ましくは25~45重量%である。 The content of the compound (i-1-1) having at least one vinyl ether group and at least one hydroxyl group and the compound (i-3-1) having at least one oxetanyl group and at least one hydroxyl group is an adhesive agent. It is 25% by weight or more (for example, 25 to 65% by weight) based on the total amount of the cationically polymerizable monomer contained in (1), because a cured product having excellent adhesion to a resin film and high hardness can be obtained. From the standpoint of excellent curability, it is preferably 25% by weight or more and less than 60% by weight, most preferably 25 to 55% by weight, and particularly preferably 25 to 45% by weight.
 ビニルエーテル基1個と水酸基1個とを有する化合物(i-1-1)の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の例えば30重量%以下、好ましくは25重量%以下、特に好ましくは18重量%以下である。 The content of the compound (i-1-1) having one vinyl ether group and one hydroxyl group is, for example, 30% by weight or less, preferably 25% by weight or less of the total amount of the cationically polymerizable monomer contained in the adhesive (1). And particularly preferably 18% by weight or less.
 オキセタニル基1個と水酸基1個とを有する化合物(i-3-1)の含有量は、樹脂フィルムへの密着性に優れ、高硬度を有する硬化物が得られる点で、接着剤(1)に含まれるカチオン重合性モノマー全量の15重量%以上であることが好ましく、より好ましくは20重量%以上、特に好ましくは25重量%以上である。また、硬化性の観点から、含有量の上限は、例えば55重量%、好ましくは45重量%、特に好ましくは40重量%である。 The content of the compound (i-3-1) having one oxetanyl group and one hydroxyl group is excellent in adhesiveness to a resin film, and a cured product having high hardness is obtained, and thus the adhesive (1) The amount is preferably 15% by weight or more, more preferably 20% by weight or more, and particularly preferably 25% by weight or more based on the total amount of the cationically polymerizable monomer contained in. From the viewpoint of curability, the upper limit of the content is, for example, 55% by weight, preferably 45% by weight, and particularly preferably 40% by weight.
 上記化合物(b)の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の5重量%以上が好ましく、速硬化性を有し、ガラスに対して優れた密着性を有する高硬度の硬化物が得られる点で、より好ましくは5~45重量%、特に好ましくは12~40重量%、最も好ましくは18~30重量%である。化合物(b)の含有量が上記範囲を下回ると、得られる硬化物の耐クラック性が低下して、脆くなる傾向がある。 The content of the compound (b) is preferably 5% by weight or more based on the total amount of the cationically polymerizable monomer contained in the adhesive (1), has fast curing property, and has high hardness with excellent adhesion to glass. From the viewpoint of obtaining a cured product of, the content is more preferably 5 to 45% by weight, particularly preferably 12 to 40% by weight, and most preferably 18 to 30% by weight. When the content of the compound (b) is less than the above range, the obtained cured product tends to have low crack resistance and become brittle.
 上記化合物(I)/化合物(b)の重量比は、ガラスに対して優れた密着性を有する硬化物が得られる点で、例えば0.5以上、好ましくは1.0以上、特に好ましくは1.1以上、最も好ましくは1.3以上である。また、前記重量比の上限は、例えば6.5、好ましくは5.5、特に好ましくは3.0、最も好ましくは2.5、とりわけ好ましくは2.0である。 The compound (I)/compound (b) weight ratio is, for example, 0.5 or more, preferably 1.0 or more, and particularly preferably 1 from the viewpoint of obtaining a cured product having excellent adhesion to glass. 0.1 or more, and most preferably 1.3 or more. The upper limit of the weight ratio is, for example, 6.5, preferably 5.5, particularly preferably 3.0, most preferably 2.5, and particularly preferably 2.0.
 上記化合物(I)、及び化合物(b)以外の化合物であって、1分子中に、ビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を2個以上有する化合物の含有量は、硬化性の観点から、接着剤(1)に含まれるカチオン重合性モノマー全量の例えば15重量%以上、好ましくは20重量%以上、特に好ましくは25重量%以上、最も好ましくは30重量%以上である。尚、含有量の上限は、高硬度、且つガラスに対して優れた密着性を有する硬化物が得られる点で、例えば55重量%、好ましくは50重量%である。 The content of the compound other than the compound (I) and the compound (b), which has two or more cationically polymerizable groups selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule, is From the viewpoint of curability, for example, 15% by weight or more, preferably 20% by weight or more, particularly preferably 25% by weight or more, and most preferably 30% by weight or more of the total amount of the cationically polymerizable monomer contained in the adhesive (1). is there. The upper limit of the content is, for example, 55% by weight, preferably 50% by weight, from the viewpoint of obtaining a cured product having high hardness and excellent adhesion to glass.
 上記化合物(b)以外の化合物であって、エポキシ基を1分子中に2個以上有し、且つ水酸基を有さない化合物(好ましくは脂環式エポキシ基を1分子中に2個以上有する化合物、特に好ましくは式(b’)で表される化合物)の含有量は、速硬化性を有し、高硬度の硬化物が得られる点で、接着剤(1)に含まれるカチオン重合性モノマー全量の10重量%以上が好ましく、より好ましくは20重量%以上、特に好ましくは25重量%以である。尚、含有量の上限は、高硬度、且つガラスに対して優れた密着性を有する硬化物が得られる点で、例えば50重量%、好ましくは45重量%、特に好ましくは43重量%である。 A compound other than the compound (b), which has two or more epoxy groups in one molecule and has no hydroxyl group (preferably a compound having two or more alicyclic epoxy groups in one molecule). , Particularly preferably the content of the compound represented by the formula (b′)) is a cationically polymerizable monomer contained in the adhesive (1) in that it has fast curing property and a cured product with high hardness is obtained. The total amount is preferably 10% by weight or more, more preferably 20% by weight or more, and particularly preferably 25% by weight or more. The upper limit of the content is, for example, 50% by weight, preferably 45% by weight, and particularly preferably 43% by weight from the viewpoint of obtaining a cured product having high hardness and excellent adhesion to glass.
 ビニルエーテル基を1分子中に2個以上有し、且つ水酸基を有さない化合物の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の、例えば20重量%以下であり、好ましくは15重量%以下である。 The content of the compound having two or more vinyl ether groups in one molecule and having no hydroxyl group is, for example, 20% by weight or less of the total amount of the cationically polymerizable monomers contained in the adhesive (1), and preferably It is 15% by weight or less.
 オキセタニル基を1分子中に2個以上有し、且つ水酸基を有さない化合物の含有量は、接着剤(1)に含まれるカチオン重合性モノマー全量の、例えば20重量%以下であり、好ましくは15重量%以下である。 The content of the compound having two or more oxetanyl groups in one molecule and having no hydroxyl group is, for example, 20% by weight or less of the total amount of the cationically polymerizable monomer contained in the adhesive (1), and preferably It is 15% by weight or less.
 1分子中に、ビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を1個有し、且つ水酸基を有さない化合物の含有量は、硬化性の観点から、接着剤(1)に含まれるカチオン重合性モノマー全量の30重量%未満であることが好ましく、より好ましくは20重量%以下、特に好ましくは10重量%以下、最も好ましくは5重量%以下、とりわけ好ましくは1重量%以下である。 The content of the compound having one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule and having no hydroxyl group is, from the viewpoint of curability, an adhesive (1 Is less than 30% by weight, more preferably 20% by weight or less, particularly preferably 10% by weight or less, most preferably 5% by weight or less, particularly preferably 1% by weight. It is as follows.
 (硬化触媒)
 前記硬化触媒には、公知乃至慣用の光カチオン重合開始剤及び光ラジカル重合開始剤が含まれる。前記カチオン硬化型接着剤は、硬化触媒として少なくとも光カチオン重合開始剤を含有することが好ましく、特に光カチオン重合開始剤と光ラジカル重合開始剤を共に含有することが、接着剤の硬化反応をより効率的に進行させることができ、とりわけ高硬度を有する硬化物が得られる点で好ましい。
(Curing catalyst)
The curing catalyst includes known or conventional photocationic polymerization initiators and photoradical polymerization initiators. It is preferable that the cationically curable adhesive contains at least a photocationic polymerization initiator as a curing catalyst, and in particular, it is preferable that both the cationic photopolymerization initiator and the photoradical polymerization initiator are contained so that the curing reaction of the adhesive may be further improved. It is preferable in that it can be efficiently progressed, and a cured product having particularly high hardness can be obtained.
 前記カチオン硬化型接着剤は硬化触媒として光カチオン重合開始剤を使用することが好ましく、その使用量は、カチオン重合性モノマー100重量部に対して、例えば0.1~20重量部、好ましくは0.5~20重量部、特に好ましくは1~10重量部である。 The cationically curable adhesive preferably uses a photocationic polymerization initiator as a curing catalyst, and the amount thereof is, for example, 0.1 to 20 parts by weight, preferably 0 based on 100 parts by weight of the cationically polymerizable monomer. 0.5 to 20 parts by weight, particularly preferably 1 to 10 parts by weight.
 また、硬化触媒として光ラジカル重合開始剤を光カチオン重合開始剤と共に使用する場合、光ラジカル重合開始剤の使用量は、カチオン重合性モノマー100重量部に対して、0.1~5重量部が好ましく、特に好ましくは0.5~3重量部、最も好ましくは0.5~2重量部である。 When a photoradical polymerization initiator is used as a curing catalyst together with a photocationic polymerization initiator, the amount of the photoradical polymerization initiator used is 0.1 to 5 parts by weight based on 100 parts by weight of the cationically polymerizable monomer. It is particularly preferably 0.5 to 3 parts by weight, most preferably 0.5 to 2 parts by weight.
 前記光カチオン重合開始剤としては、例えば、ジアゾニウム塩系化合物、ヨードニウム塩系化合物、スルホニウム塩系化合物、ホスホニウム塩系化合物、セレニウム塩系化合物、オキソニウム塩系化合物、アンモニウム塩系化合物、臭素塩系化合物等が挙げられる。本発明においては、例えば、商品名「CPI-101A」、「CPI-100P」、「CPI-110P」(以上、サンアプロ(株)製)、商品名「CYRACURE UVI-6990」、「CYRACURE UVI-6992」(以上、ダウ・ケミカル社製)、商品名「UVACURE1590」(ダイセル・オルネクス(株)製)、商品名「CD-1010」、「CD-1011」、「CD-1012」(以上、米国サートマー製);商品名「イルガキュア-264」(BASF社製)、商品名「CIT-1682」(日本曹達(株)製)、商品名「PHOTOINITIATOR 2074」(ローディアジャパン(株)製)等の市販品を好ましく使用することができる。これらは、一種を単独で、又は二種以上を組み合わせて使用することができる。 Examples of the cationic photopolymerization initiator include diazonium salt compounds, iodonium salt compounds, sulfonium salt compounds, phosphonium salt compounds, selenium salt compounds, oxonium salt compounds, ammonium salt compounds, bromine salt compounds. Etc. In the present invention, for example, product names “CPI-101A”, “CPI-100P”, “CPI-110P” (above, manufactured by San Apro Co., Ltd.), product names “CYRACURE UVI-6990”, “CYRACURE UVI-6992”. "(Above, Dow Chemical Co.), trade name "UVACURE1590" (manufactured by Daicel Ornex Co., Ltd.), trade names "CD-1010", "CD-1011", "CD-1012" (above US Sartomer Product name: “Irgacure-264” (manufactured by BASF), product name “CIT-1682” (manufactured by Nippon Soda Co., Ltd.), product name “PHOTOINITIATOR 2074” (manufactured by Rhodia Japan Co., Ltd.), etc. Can be preferably used. These can be used alone or in combination of two or more.
 前記光ラジカル重合開始剤としては、例えば、1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、ジエトキシアセトフェノン、1-(4-イソプロピルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、1-(4-ドデシルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、4-(2-ヒドロキシエトキシ)-フェニル(2-ヒドロキシ-2-プロピル)ケトン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノプロパン-1-オン、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン-n-ブチルエーテル、ベンゾインフェニルエーテル、ベンジルジメチルケタール、ベンゾフェノン、ベンゾイル安息香酸、ベンゾイル安息香酸メチル、4-フェニルベンゾフェノン-4-メトキシベンゾフェノン、チオキサンソン、2-クロロチオキサンソン、2-メチルチオキサンソン、2,4-ジメチルチオキサンソン、イソプロピルチオキサンソン、2,4-ジクロロチオキサンソン、2,4-ジエチルチオキサンソン、2,4-ジイソプロピルチオキサンソン、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキサイド、メチルフェニルグリオキシレート、ベンジル、カンファーキノン等が挙げられる。本発明においては、例えば、商品名「イルガキュア-184」、「イルガキュア-127」、「イルガキュア-149」、「イルガキュア-261」、「イルガキュア-369」、「イルガキュア-500」、「イルガキュア-651」、「イルガキュア-754」、「イルガキュア-784」、「イルガキュア-819」、「イルガキュア-907」、「イルガキュア-1116」、「イルガキュア-1173」、「イルガキュア-1664」、「イルガキュア-1700」、「イルガキュア-1800」、「イルガキュア-1850」、「イルガキュア-2959」、「イルガキュア-4043」、「ダロキュア-1173」、「ダロキュア-MBF」(BASF社製)等の市販品を好ましく使用することができる。これらは、一種を単独で、又は二種以上を組み合わせて使用することができる。 Examples of the photoradical polymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, 1-(4-isopropylphenyl)-2- Hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)-phenyl(2-hydroxy-2- Propyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoinphenyl Ether, benzyl dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone-4-methoxybenzophenone, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone , Isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, methylphenylglyoxylate , Benzyl, camphorquinone and the like. In the present invention, for example, trade names “Irgacure-184”, “Irgacure-127”, “Irgacure-149”, “Irgacure-261”, “Irgacure-369”, “Irgacure-500”, “Irgacure-651” , "Irgacure-754", "Irgacure-784", "Irgacure-819", "Irgacure-907", "Irgacure-1116", "Irgacure-1173", "Irgacure-1664", "Irgacure-1700", "Irgacure-1704" Commercially available products such as "Irgacure-1800", "Irgacure-1850", "Irgacure-2959", "Irgacure-4043", "Darocure-1173" and "Darocure-MBF" (manufactured by BASF) can be preferably used. .. These can be used alone or in combination of two or more.
 (ラジカル硬化型接着剤)
 ラジカル硬化型接着剤としては、例えば、アクリル系接着剤が挙げられる。アクリル系接着剤は、(メタ)アクリル系共重合体と架橋剤を含有する。
(Radical curable adhesive)
Examples of the radical-curable adhesive include acrylic adhesives. The acrylic adhesive contains a (meth)acrylic copolymer and a crosslinking agent.
 (メタ)アクリル系共重合体は、例えば、1種又は2種以上のアクリル系モノマーを光又は熱ラジカル重合開始剤の存在下で反応させることにより製造することができる。 The (meth)acrylic copolymer can be produced, for example, by reacting one or more acrylic monomers in the presence of a photo or thermal radical polymerization initiator.
 (メタ)アクリル系共重合体の重量平均分子量(標準ポリスチレン換算)は、例えば10万~500万程度である。 The weight average molecular weight (converted to standard polystyrene) of the (meth)acrylic copolymer is, for example, about 100,000 to 5,000,000.
 前記アクリル系モノマーとしては、例えば、アクリル酸エチル、アクリル酸ブチル、アクリル酸イソブチル、アクリル酸t-ブチル、アクリル酸2-エチルへキシル等のアクリル酸C1-10アルキルエステル、及びこれらに対応するメタクリル酸エステル等の(メタ)アクリル酸エステルが挙げられる。これらは1種を単独で、又は2種以上を組み合わせて使用することができる。 Examples of the acrylic monomer include ethyl acrylate, butyl acrylate, isobutyl acrylate, t-butyl acrylate, and acrylic acid C 1-10 alkyl esters such as 2-ethylhexyl acrylate, and the like. Examples thereof include (meth)acrylic acid esters such as methacrylic acid esters. These can be used individually by 1 type or in combination of 2 or more types.
 また、前記アクリル系モノマーとしては、前記(メタ)アクリル酸エステル以外にも、(メタ)アクリル酸エステルと共重合可能な他のラジカル重合性モノマーを使用することができる。他のラジカル重合性モノマーとしてはカルボキシル基含有モノマーやヒドロキシル基含有モノマーが挙げられる。これらは、1種を単独で、又は2種以上を組み合わせて使用することができる。 Further, as the acrylic monomer, other radical polymerizable monomers copolymerizable with the (meth)acrylic acid ester can be used in addition to the (meth)acrylic acid ester. Other radically polymerizable monomers include carboxyl group-containing monomers and hydroxyl group-containing monomers. These can be used individually by 1 type or in combination of 2 or more types.
 前記カルボキシル基含有モノマーとしては、例えば、(メタ)アクリル酸、クロトン酸、イソクロトン酸等のモノカルボン酸;イタコン酸、マレイン酸、フマル酸等の多価カルボン酸;無水マレイン酸、無水イタコン酸等の多価カルボン酸の無水物;前記多価カルボン酸のモノアルキルエステル(例えば、メチルエステル、エチルエステル、プロピルエステル、ブチルエステル、ヘキシルエステル、オクチルエステル、ラウリルエステル等のC1-16アルキルエステル等が挙げられる。 Examples of the carboxyl group-containing monomer include monocarboxylic acids such as (meth)acrylic acid, crotonic acid and isocrotonic acid; polyvalent carboxylic acids such as itaconic acid, maleic acid and fumaric acid; maleic anhydride and itaconic anhydride. An anhydride of polyvalent carboxylic acid; a monoalkyl ester of the polyvalent carboxylic acid (for example, a C 1-16 alkyl ester such as methyl ester, ethyl ester, propyl ester, butyl ester, hexyl ester, octyl ester, lauryl ester, etc.) Are listed.
 前記ヒドロキシル基含有モノマーとしては、例えば、(メタ)アクリル酸2-ヒドロキシエチル、(メタ)アクリル酸3-ヒドロキシプロピル、(メタ)アクリル酸4-ヒドロキシブチル、(メタ)アクリル酸6-ヒドロキシヘキシル、ビニルアルコール、アリルアルコール等が挙げられる。 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, Examples thereof include vinyl alcohol and allyl alcohol.
 他のラジカル重合性モノマーとしては、上記以外にも更に、オレフィン[例えばエチレン、プロピレン、1-ブテン、ブタジエン等の鎖状オレフィン(特に、C2-12アルケン);シクロペンテン、シクロヘキセン、シクロヘプテン、ノルボルネン、5-メチル-2-ノルボルネン、テトラシクロドデセン等の環状オレフィン]、芳香族ビニル化合物(例えば、スチレン、ビニルトルエン、α-メチルスチレン、1-プロペニルベンゼン、1-ビニルナフタレン、2-ビニルナフタレン、3-ビニルピリジン、3-ビニルフラン、3-ビニルチオフェン、3-ビニルキノリン等のC6-14芳香族ビニル化合物);ウレタン(メタ)アクリレート(例えば、2,4-トリレンジイソシアネート、1,3-キシレンジイソシアネート、キシリレンジイソシアネート、1,5-ナフタレンジイソシアネート、ジフェニルメタンジイソシアネート、4,4'-ジフェニルメタンジイソシアネート、イソホロンジイソシアネート、1,6-ヘキサメチレンジイソシアネート、ジシクロヘキシルメタンジイソシアネート、2,2,4-トリメチルヘキサメチレンジイソシアネート等のポリイソシアネート化合物と、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、エチレングリコールモノ(メタ)アクリレート、プロピレングリコールモノ(メタ)アクリレート、2-ヒドロキシ-3-メトキシプロピル(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、N-メチロール(メタ)アクリルアミド、N-ヒドロキシ(メタ)アクリルアミド等の活性水素を有する(メタ)アクリル系モノマーとの反応物);ビニルエステル(例えば、酢酸ビニル、プロピオン酸ビニル、カプリル酸ビニル、カプロン酸ビニル等のC1-16脂肪酸ビニルエステル等)、マレイン酸エステル又はフマル酸エステル(例えば、マレイン酸ジエチル、マレイン酸ジブチル、マレイン酸ジオクチル、マレイン酸ジ(2-エチルへキシル)等のマレイン酸ジC1-10アルキルエステル、及びこれらに対応するフマル酸ジエステル等)、インデン類(例えば、インデン、メチルインデン、エチルインデン、ジメチルインデン等のアルキルインデン;クロロインデン、ブロモインデン等のハロゲン化インデン等)等が挙げられる。 In addition to the above, other radically polymerizable monomers include olefins [eg chain olefins such as ethylene, propylene, 1-butene and butadiene (especially C 2-12 alkenes); cyclopentene, cyclohexene, cycloheptene, norbornene, Cyclic olefins such as 5-methyl-2-norbornene and tetracyclododecene], aromatic vinyl compounds (eg, styrene, vinyltoluene, α-methylstyrene, 1-propenylbenzene, 1-vinylnaphthalene, 2-vinylnaphthalene, C 6-14 aromatic vinyl compounds such as 3-vinylpyridine, 3-vinylfuran, 3-vinylthiophene and 3-vinylquinoline; urethane (meth)acrylates (eg 2,4-tolylene diisocyanate, 1,3 -Xylylene diisocyanate, xylylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, 2,2,4-trimethylhexamethylene Polyisocyanate compound such as diisocyanate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, ethylene glycol mono(meth)acrylate, propylene glycol mono(meth)acrylate, 2-hydroxy-3-methoxypropyl (Meth)acrylate, pentaerythritol tri(meth)acrylate, N-methylol(meth)acrylamide, N-hydroxy(meth)acrylamide, etc. (reaction product with (meth)acrylic monomer having active hydrogen); vinyl ester (eg, , C 1-16 fatty acid vinyl esters such as vinyl acetate, vinyl propionate, vinyl caprylate, and vinyl caproate), maleic acid esters or fumaric acid esters (eg, diethyl maleate, dibutyl maleate, dioctyl maleate, maleic acid) Maleic acid di-C 1-10 alkyl esters such as acid di(2-ethylhexyl), and fumaric acid diesters corresponding thereto, and indenes (eg, indene, methyl indene, ethyl indene, dimethyl indene, etc.) Indene; halogenated indene such as chloroindene and bromoindene) and the like.
 前記架橋剤としては、イソシアネート系架橋剤、エポキシ系架橋剤等が挙げられる。前記イソシアネート系架橋剤としては、例えば、1,6-ヘキサメチレンジイソシアネート等の脂肪族ポリイソシアネート;シクロペンチレンジイソシアネート、シクロへキシレンジイソシアネート、イソホロンジイソシアネート等の脂環式ポリイソシアネート;トルエンジイソシアネート、キシリレンジイソシアネート等の芳香族ポリイソシアネート化合物;が挙げられる。前記エポキシ系架橋剤としては、例えば、1,3-ビス(N,N’-ジグリシジルアミノメチル)シクロヘキサン、レゾルシンジグリシジルエーテル等が挙げられる。これらは1種を単独で、又は2種以上を組み合わせて使用することができる。 Examples of the cross-linking agent include isocyanate cross-linking agents and epoxy cross-linking agents. Examples of the isocyanate-based cross-linking agent include aliphatic polyisocyanates such as 1,6-hexamethylene diisocyanate; cycloaliphatic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; toluene diisocyanate and xylylene diisocyanate. And other aromatic polyisocyanate compounds; Examples of the epoxy cross-linking agent include 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane and resorcin diglycidyl ether. These can be used individually by 1 type or in combination of 2 or more types.
 架橋剤の含有量は、(メタ)アクリル系共重合体100重量部に対して、例えば、0.001~10重量部である。 The content of the cross-linking agent is, for example, 0.001 to 10 parts by weight with respect to 100 parts by weight of the (meth)acrylic copolymer.
 (熱可塑性接着剤)
 熱可塑性接着剤は、少なくとも1種の熱可塑性樹脂を含有する。
(Thermoplastic adhesive)
The thermoplastic adhesive contains at least one thermoplastic resin.
 前記熱可塑性樹脂としては、例えば、(メタ)アクリル酸エステルの単独又は共重合体、(メタ)アクリル・ウレタン共重合体(特に、(メタ)アクリル・ウレタングラフト共重合体)、スチレン-(メタ)アクリル酸エステル共重合体、酢酸ビニル-(メタ)アクリル酸エステル共重合体、エチレン-(メタ)アクリル酸エステル共重合体、エチレン-(メタ)アクリル酸共重合体、(メタ)アクリル酸エステル-(メタ)アクリル酸共重合体、スチレン-アクリロニトリル-(メタ)アクリル酸エステル共重合体、スチレン-(メタ)アクリル酸エステル-(メタ)アクリル酸共重合体、スチレン-アクリロニトリル-(メタ)アクリル酸エステル-(メタ)アクリル酸共重合体、エチレン-酢酸ビニル-(メタ)アクリル酸エステル共重合体、ビニルピロリドン-(メタ)アクリル酸エステル共重合体、スチレン-ブタジエン-(メタ)アクリル酸共重合体などの(メタ)アクリル酸又はそのエステルを単量体として含むアクリル系重合体;酢酸ビニル樹脂、エチレン-酢酸ビニル共重合体などの酢酸ビニルを単量体として含む酢酸ビニル系重合体;スチレン-ブタジエン共重合体、イソブチレン樹脂、イソブチレン-イソプレン共重合体、ブタジエン樹脂、スチレン-イソプレン共重合体、アクリロニトリル-ブタジエン共重合体などの合成ゴム;天然ゴム;エチレン-塩化ビニル共重合体、塩化ビニル-塩化ビニリデン共重合体、ビニルピロリドン-スチレン共重合体、塩素化プロピレン樹脂、ウレタン樹脂、エチルセルロース等が挙げられる。 Examples of the thermoplastic resin include (meth)acrylic acid ester homopolymers or copolymers, (meth)acrylic/urethane copolymers (particularly, (meth)acrylic/urethane graft copolymers), styrene-(meth) ) Acrylic ester copolymer, vinyl acetate-(meth)acrylic acid ester copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-(meth)acrylic acid copolymer, (meth)acrylic acid ester -(Meth)acrylic acid copolymer, styrene-acrylonitrile-(meth)acrylic acid ester copolymer, styrene-(meth)acrylic acid ester-(meth)acrylic acid copolymer, styrene-acrylonitrile-(meth)acrylic Acid ester-(meth)acrylic acid copolymer, ethylene-vinyl acetate-(meth)acrylic acid ester copolymer, vinylpyrrolidone-(meth)acrylic acid ester copolymer, styrene-butadiene-(meth)acrylic acid copolymer Acrylic polymer containing (meth)acrylic acid or its ester as a monomer such as polymer; Vinyl acetate polymer containing vinyl acetate as a monomer such as vinyl acetate resin and ethylene-vinyl acetate copolymer; Synthetic rubbers such as styrene-butadiene copolymer, isobutylene resin, isobutylene-isoprene copolymer, butadiene resin, styrene-isoprene copolymer, acrylonitrile-butadiene copolymer; natural rubber; ethylene-vinyl chloride copolymer, chloride Examples thereof include vinyl-vinylidene chloride copolymer, vinylpyrrolidone-styrene copolymer, chlorinated propylene resin, urethane resin and ethyl cellulose.
 熱可塑性接着剤としては、(メタ)アクリル・ウレタン共重合体を含むアクリルウレタン系接着剤(2)、又は酢酸ビニル系重合体を含む酢酸ビニル系接着剤(3)(特に、エチレン-酢酸ビニル共重合体)が、屈曲耐久性に優れるカバー部材が得られる点で好ましい。 As the thermoplastic adhesive, an acrylic urethane adhesive (2) containing a (meth)acrylic/urethane copolymer or a vinyl acetate adhesive (3) containing a vinyl acetate polymer (especially ethylene-vinyl acetate (Copolymer) is preferable in that a cover member having excellent bending durability can be obtained.
 前記接着剤は更に溶剤を含有しても良いが、無溶剤系であること、即ち溶剤を含有しないことが、乾燥性を向上することができる点、溶剤により劣化し易い樹脂フィルムにも適用可能となる点、及び溶剤の揮発による臭気の発生を防止することができる点で好ましく、溶剤の含有量は接着剤全量(100重量%)の例えば10重量%以下であり、好ましくは5重量%以下、特に好ましくは1重量%以下である。 The adhesive may further contain a solvent, but if it is solvent-free, that is, if it does not contain a solvent, the drying property can be improved, and it can be applied to a resin film that is easily deteriorated by the solvent. Is preferable, and the generation of odor due to volatilization of the solvent can be prevented. The content of the solvent is, for example, 10% by weight or less, preferably 5% by weight or less of the total amount of the adhesive (100% by weight). It is particularly preferably 1% by weight or less.
 前記接着剤には、酸化防止剤、消泡剤、レベリング剤、シランカップリング剤、充填剤、難燃剤、安定化剤(例えば、アミン類等)等の添加剤を必要に応じて添加することができる。 If necessary, additives such as an antioxidant, a defoaming agent, a leveling agent, a silane coupling agent, a filler, a flame retardant, and a stabilizer (for example, amines) may be added to the adhesive. You can
 前記接着剤がカチオン硬化型接着剤である場合には、更に、周知慣用の増感剤(例えば、アクリジン化合物、ベンゾフラビン類、ペリレン類、アントラセン類、チオキサントン化合物類、レーザ色素類等)、増感助剤等を添加することができる。特に、前記接着剤をUV-LEDを照射して硬化させる用途に使用する場合には、増感剤を含有することが、硬化触媒の紫外線光吸収率を向上して硬化性を向上することができる点で好ましく、増感剤の含有量(2種以上含有する場合はその総量)は、モノマー100重量部に対して、例えば0.05~10重量部、好ましくは0.1~5重量部である。 When the adhesive is a cation-curable adhesive, a well-known and commonly used sensitizer (for example, acridine compound, benzoflavins, perylenes, anthracenes, thioxanthone compounds, laser dyes, etc.) A sensitizer or the like can be added. In particular, when the adhesive is used for the purpose of curing by irradiating UV-LED, the inclusion of a sensitizer improves the ultraviolet light absorption of the curing catalyst and improves the curability. The content of the sensitizer (the total amount of two or more kinds) is, for example, 0.05 to 10 parts by weight, preferably 0.1 to 5 parts by weight, relative to 100 parts by weight of the monomer. Is.
 また、増感剤として、下記式(d-1)で表される化合物と下記式(d-2)で表される化合物を併用すると、得られる硬化物の着色を極めて低くまで抑制することができる点で好ましく、これらの化合物の併用割合[式(d-1)で表される化合物/式(d-2)で表される化合物;重量比]は、例えば0.01~1.0、好ましくは0.1~0.5、特に好ましくは0.2~0.5である。尚、下記式(d-1)で表される化合物としては、例えば商品名「アントラキュアー UVS-1331」(川崎化成工業(株)製)を使用することができる。また、下記式(d-2)で表される化合物としては、例えば商品名「アントラキュアー UVS-581」(川崎化成工業(株)製)を使用することができる。
Figure JPOXMLDOC01-appb-C000017
Further, when a compound represented by the following formula (d-1) and a compound represented by the following formula (d-2) are used together as a sensitizer, the coloration of the obtained cured product can be suppressed to an extremely low level. It is preferable from the viewpoint that it can be used, and the combined ratio of these compounds [the compound represented by the formula (d-1)/the compound represented by the formula (d-2); the weight ratio] is, for example, 0.01 to 1.0, It is preferably 0.1 to 0.5, particularly preferably 0.2 to 0.5. As the compound represented by the following formula (d-1), for example, a trade name "ANTRACURE UVS-1331" (manufactured by Kawasaki Kasei Co., Ltd.) can be used. Further, as the compound represented by the following formula (d-2), for example, a trade name “ANTRACURE UVS-581” (manufactured by Kawasaki Kasei Co., Ltd.) can be used.
Figure JPOXMLDOC01-appb-C000017
 前記接着剤の表面張力(30℃、1気圧下における)は、例えば10~50mN/mが好ましい。また、前記接着剤の粘度[25℃、せん断速度100(1/s)における]は、流動性に優れ、インクジェット印刷機等を用いて塗布する場合は吐出性に優れる点で、1~1000mPa・sが好ましく、より好ましくは5~500mPa・s、特に好ましくは10~100mPa・s、最も好ましくは10~50mPa・s、とりわけ好ましくは10~30mPa・sである。
 尚、接着剤の表面張力は、例えば高精度表面張力計「DY-700」(協和界面科学(株)製)を使用し、Wilhelmy法(プレート法)にて測定することができる。
The surface tension (at 30° C. and 1 atmospheric pressure) of the adhesive is preferably 10 to 50 mN/m, for example. The viscosity of the adhesive [at 25° C. and a shear rate of 100 (1/s)] is 1 to 1000 mPa·s because it has excellent fluidity and excellent dischargeability when applied using an inkjet printing machine or the like. s is preferable, more preferably 5 to 500 mPa·s, particularly preferably 10 to 100 mPa·s, most preferably 10 to 50 mPa·s, and particularly preferably 10 to 30 mPa·s.
The surface tension of the adhesive can be measured by the Wilhelmy method (plate method) using, for example, a high precision surface tensiometer “DY-700” (manufactured by Kyowa Interface Science Co., Ltd.).
 本発明のカバー部材は、例えば、上述のガラス板と樹脂フィルムとを接着剤で貼り合わせ、その後、接着剤を硬化させることにより製造することができる。 The cover member of the present invention can be manufactured, for example, by bonding the above-mentioned glass plate and resin film with an adhesive, and then curing the adhesive.
 本発明のカバー部材(詳細には、屈曲機能を備えたカバー部材)の製造工程において、樹脂フィルムをガラス板上に積層する際には、樹脂フィルムのMD方向が、カバー部材の屈曲方向(若しくは、優れた屈曲耐久性を示す屈折方向)に沿うように、若しくはカバー部材の屈折方向とほぼ平行(樹脂フィルムのMD方向とカバー部材の屈曲方向の交差角は、例えば30°以下、好ましくは20°以下、特に好ましくは10°以下、最も好ましくは5°以下)となるように、又は樹脂フィルムのMD方向がカバー部材を屈曲方向に折り曲げた場合に生じる折線とほぼ垂直(樹脂フィルムのMD方向と前記折線の交差角は、例えば60~120°、好ましくは70~110°、特に好ましくは80~100°、最も好ましくは85~95°)に交わるように、貼り合わせ方向を調整して積層することが、屈曲耐久性に特に優れるカバー部材が得られる点で好ましい(図4参照)。尚、MD方向とは、樹脂フィルムを射出成形により製造する際に溶融樹脂が流れる方向であり、TD方向に比べて機械的強度に優れる傾向がある。樹脂フィルムのMD方向、及びTD方向は、例えば2次元複屈折装置(PA-100、(株)フォトニックラティス製)を用いて計測される、複屈折の配向方向によって確認できる。 In the manufacturing process of the cover member (specifically, a cover member having a bending function), when the resin film is laminated on the glass plate, the MD direction of the resin film is the bending direction of the cover member (or , Along the bending direction showing excellent bending durability) or substantially parallel to the bending direction of the cover member (the crossing angle between the MD direction of the resin film and the bending direction of the cover member is, for example, 30° or less, preferably 20). 0° or less, particularly preferably 10° or less, most preferably 5° or less), or the MD direction of the resin film is substantially perpendicular to the fold line generated when the cover member is bent in the bending direction (MD direction of the resin film). The laminating direction is adjusted so that the crossing angle of the fold line and the fold line intersects, for example, 60 to 120°, preferably 70 to 110°, particularly preferably 80 to 100°, and most preferably 85 to 95°. Is preferable in that a cover member having particularly excellent bending durability can be obtained (see FIG. 4 ). The MD direction is the direction in which the molten resin flows when the resin film is manufactured by injection molding, and tends to have better mechanical strength than the TD direction. The MD direction and the TD direction of the resin film can be confirmed by the birefringence orientation direction measured using, for example, a two-dimensional birefringence device (PA-100, manufactured by Photonic Lattice Co., Ltd.).
 ガラス板及び/又は樹脂フィルムに接着剤を塗布する方法としては、特に制限がなく、例えば、印刷法、コーティング法等により行うことができる。具体的には、スクリーン印刷法、マスク印刷法、オフセット印刷法、インクジェット印刷法、フレキソ印刷法、グラビア印刷法、スキージ印刷法、シルクスクリーン印刷法、スタンピング、ディスペンス、噴霧、刷毛塗り等が挙げられる。 The method of applying the adhesive to the glass plate and/or the resin film is not particularly limited, and may be, for example, a printing method, a coating method, or the like. Specifically, screen printing, mask printing, offset printing, inkjet printing, flexo printing, gravure printing, squeegee printing, silk screen printing, stamping, dispensing, spraying, brushing, etc. ..
 接着剤の硬化は、接着剤の種類に応じた方法で行うことができる。例えば接着剤として紫外線硬化型接着剤を使用する場合は、紫外線を照射することにより硬化させることができ、接着剤として熱可塑性接着剤を使用する場合は、加熱により軟化した接着剤を冷却することにより硬化(若しくは、固化)させることができる。 Curing of the adhesive can be performed by a method according to the type of adhesive. For example, when using an ultraviolet curable adhesive as the adhesive, it can be cured by irradiating it with ultraviolet rays, and when using a thermoplastic adhesive as the adhesive, cool the adhesive softened by heating. Can be cured (or solidified).
 前記紫外線の光源としては、例えば、UV-LED、低、中、又は高圧水銀ランプのような水銀ランプ、水銀キセノンランプ、メタルハライドランプ、タングステンランプ、アーク灯、エキシマランプ、エキシマレーザ、半導体レーザ、YAGレーザ、レーザと非線形光学結晶とを組み合わせたレーザシステム、高周波誘起紫外線発生装置等を使用することができる。紫外線照射量(積算光量)は、例えば10~5000mJ/cm2である。 Examples of the ultraviolet light source include a UV-LED, a mercury lamp such as a low, medium or high pressure mercury lamp, a mercury xenon lamp, a metal halide lamp, a tungsten lamp, an arc lamp, an excimer lamp, an excimer laser, a semiconductor laser, and a YAG. A laser, a laser system in which a laser and a nonlinear optical crystal are combined, a high frequency induced ultraviolet ray generator, or the like can be used. The ultraviolet irradiation amount (integrated light amount) is, for example, 10 to 5000 mJ/cm 2 .
 また、紫外線照射に加えて加熱処理を施してもよい。加熱処理を施すことにより、硬化度をより一層向上させることができる。加熱処理を施す場合、加熱温度は40~200℃程度であり、加熱時間は1分~15時間程度である。また、紫外線を照射した後に、室温(20℃)で1~48時間程度静置することでも硬化度を向上させることができる。 Also, heat treatment may be applied in addition to UV irradiation. By performing the heat treatment, the degree of curing can be further improved. When the heat treatment is performed, the heating temperature is about 40 to 200° C., and the heating time is about 1 minute to 15 hours. Further, the curing degree can be improved by leaving still for 1 to 48 hours at room temperature (20° C.) after irradiation with ultraviolet rays.
 [ディスプレイ]
 本発明のディスプレイは、上記カバー部材を備える。前記ディスプレイには液晶ディスプレイやプラズマディスプレイ等が含まれる。また、前記ディスプレイにはタッチパネルディスプレイやフレキシブルディスプレイ等が含まれる。
[display]
The display of the present invention includes the cover member. The display includes a liquid crystal display and a plasma display. Further, the display includes a touch panel display, a flexible display and the like.
 本発明のディスプレイとして例えば液晶ディスプレイは、上記カバー部材を、パネル表面を被覆する部材として備える。また、本発明のディスプレイとして例えばプラズマディスプレイは、上記カバー部材を電極保護膜として備える。 A liquid crystal display, for example, as the display of the present invention includes the cover member as a member for covering the panel surface. Further, for example, a plasma display as a display of the present invention includes the cover member as an electrode protective film.
 本発明のディスプレイは上記カバー部材を備えるため、ガラスに由来する特性(上質な手触り、透明性、平滑性、熱的安定性、電気絶縁性、化学的安定性、高硬度、及び捻れにくさ等)を備えると共に、可とう性及び耐衝撃性を備える。更に、上記カバー部材が特定の接着層(好ましくは、上述の接着剤(1)の硬化物からなる接着層)を有する場合は、繰り返し屈曲させてもクラックが生じることがない。 Since the display of the present invention includes the above-mentioned cover member, it has characteristics derived from glass (fine texture, transparency, smoothness, thermal stability, electrical insulation, chemical stability, high hardness, resistance to twisting, etc.). ), and also has flexibility and impact resistance. Furthermore, when the cover member has a specific adhesive layer (preferably an adhesive layer made of a cured product of the adhesive (1) described above), cracks do not occur even when repeatedly bent.
 上記カバー部材を備えるタッチパネルディスプレイ(例えば、静電容量方式や、抵抗膜方式のタッチパネルディスプレイ)は、ガラスに由来する上質な手触りを有する。また、ガラスはプラスチックに比べて比誘電率が高いため、上記カバー部材を備えるタッチパネルディスプレイは、プラスチックフィルムで形成された従来のタッチパネルディスプレイに比べてタッチ検出感度に優れる。更に、本発明のカバー部材は薄くても、硬度が高く、耐衝撃性に優れるため、カバー部材を薄膜化することができ、これにより、電荷量を多くすることができ、タッチ検出感度を一層高めることができる。更に、前記の通り硬度が高く、耐衝撃性に優れるため、ディスプレイ表面に衝撃が加わってもクラックが生じ難く、取扱が容易である。また、化学的安定性に優れるため、洗剤等を用いて拭いてもディスプレイの表面が白く濁ることがない。 A touch panel display (for example, a capacitance type or a resistance film type touch panel display) provided with the cover member has a high-quality touch derived from glass. Further, since glass has a higher relative permittivity than plastic, a touch panel display including the cover member is superior in touch detection sensitivity to a conventional touch panel display formed of a plastic film. Further, even though the cover member of the present invention is thin, it has high hardness and excellent impact resistance, so that the cover member can be made into a thin film, whereby the charge amount can be increased and the touch detection sensitivity can be further improved. Can be increased. Furthermore, since the hardness is high and the impact resistance is excellent as described above, even if an impact is applied to the display surface, cracks hardly occur and the handling is easy. Further, since it has excellent chemical stability, the surface of the display does not become white and turbid even when it is wiped with a detergent or the like.
 上記カバー部材(好ましくは、上述の接着剤(1)の硬化物からなる接着層を有するカバー部材)を備えるフレキシブルディスプレイは、可とう性に優れ、繰り返し屈曲させてもクラックが生じることがなく、ディスプレイ表面が白く濁ることもない。また、ガラスに由来する上質な手触りを有する。さらに、硬度が高く、耐衝撃性に優れるため、ディスプレイ表面に衝撃が加わってもクラックが生じ難く、取扱が容易である。さらにまた、化学的安定性に優れるため、洗剤等を用いて拭いてもディスプレイの表面が白く濁ることがない。 The flexible display provided with the cover member (preferably, the cover member having the adhesive layer made of the cured product of the adhesive (1)) is excellent in flexibility and does not crack even when repeatedly bent, The display surface does not turn white. In addition, it has a good texture derived from glass. Further, since the hardness is high and the shock resistance is excellent, even if an impact is applied to the display surface, cracks are less likely to occur and the handling is easy. Furthermore, since it has excellent chemical stability, the surface of the display does not become cloudy even when it is wiped with a detergent or the like.
 プラズマディスプレイは、前面基板と背面基板の2枚のガラス基板を貼り合わせた構造を有する。そして、前面基板には表示電極と誘電体層、保護層などが形成され、背面基板にはアドレス電極、隔壁、蛍光体層などが形成される。電極保護膜は、前記前面基板の誘電体表面を覆い、プラズマディスプレイの電子放出源として働く部材である。そして、上記カバー部材を電極保護膜として備えるプラズマディスプレイは、前記カバー部材がガラス由来の特性により化学的安定性に優れるため、低電圧特性を安定的に維持することができ、省電力化に資する。 Plasma displays have a structure in which two glass substrates, a front substrate and a rear substrate, are bonded together. Display electrodes, a dielectric layer, a protective layer, and the like are formed on the front substrate, and address electrodes, barriers, phosphor layers, and the like are formed on the rear substrate. The electrode protection film is a member that covers the dielectric surface of the front substrate and serves as an electron emission source of the plasma display. In the plasma display including the cover member as an electrode protective film, since the cover member has excellent chemical stability due to the characteristics derived from glass, low voltage characteristics can be stably maintained, which contributes to power saving. ..
 [電子機器]
 本発明の電子機器は、上記ディスプレイを備える。より詳細には、上記カバー部材がパネル表面を被覆してなるディスプレイを備える。若しくは、上記カバー部材を電極保護膜として有するディスプレイを備える。
[Electronics]
An electronic device of the present invention includes the above display. More specifically, the display includes a display in which the cover member covers the panel surface. Alternatively, it includes a display having the cover member as an electrode protective film.
 本発明の電子機器は前記構成を有するため、ガラスに由来する特性(上質な手触り、透明性、平滑性、熱的安定性、電気絶縁性、化学的安定性、高硬度、及び捻れにくさ等)を備えると共に、可とう性及び耐衝撃性を備える。更に、上記ディスプレイが、上述の接着剤(1)の硬化物からなる接着層を有するカバー部材を備える場合は、屈曲耐久性に優れ、繰り返し屈曲させてもクラックが生じることがない。従って、本発明の電子機器は、高性能であり、取扱が容易であり、且つ耐衝撃性にも優れる。 Since the electronic device of the present invention has the above-mentioned constitution, it has characteristics derived from glass (fine texture, transparency, smoothness, thermal stability, electrical insulation, chemical stability, high hardness, and resistance to twisting, etc.). ), and also has flexibility and impact resistance. Furthermore, when the display includes a cover member having an adhesive layer made of the cured product of the adhesive (1), it has excellent bending durability and does not crack even when repeatedly bent. Therefore, the electronic device of the present invention has high performance, is easy to handle, and has excellent impact resistance.
 [有機エレクトロルミネッセンスデバイス]
 本発明の有機ELデバイスは、上記カバー部材を備える。より詳細には、上記カバー部材を、基板部材及び/又は封止部材として備える。
[Organic electroluminescence device]
The organic EL device of the present invention includes the cover member. More specifically, the cover member is provided as a substrate member and/or a sealing member.
 有機ELデバイスに使用される有機素材や電極はごく微量の水分や酸素で劣化するが、上記カバー部材は、ガラスに由来する高いガスバリア性と高い水蒸気バリア性(23℃、50%RHにおける水蒸気透過率は、例えば10-5g/m2/day以下である)を有するため、有機素材や電極が水分や酸素により劣化するのを防止することができる。更に、上記カバー部材は可とう性をも有する。 Although the organic materials and electrodes used for organic EL devices are deteriorated by a very small amount of water and oxygen, the cover member has a high gas barrier property derived from glass and a high water vapor barrier property (water vapor permeation at 23° C. and 50% RH). Since the rate is, for example, 10 −5 g/m 2 /day or less), it is possible to prevent the organic material and the electrode from being deteriorated by moisture or oxygen. Further, the cover member also has flexibility.
 従って、本発明の有機ELデバイスによれば、薄型・軽量なフレキシブル有機ELデバイスを実現することができる。また、有機EL素子の劣化を防止して、長寿命を実現ですることができる。尚、前記有機ELデバイスには、有機ELディスプレイや、有機EL照明などが含まれる。 Therefore, according to the organic EL device of the present invention, a thin and lightweight flexible organic EL device can be realized. In addition, it is possible to prevent deterioration of the organic EL element and realize a long life. The organic EL device includes an organic EL display and an organic EL lighting.
 [有機薄膜太陽電池]
 本発明の有機薄膜太陽電池は、上記カバー部材を備える。より詳細には、上記カバー部材を、基板部材及び/又は封止部材として備える。
[Organic thin film solar cell]
The organic thin film solar cell of the present invention includes the cover member. More specifically, the cover member is provided as a substrate member and/or a sealing member.
 前記有機薄膜太陽電池を構成する素子(表面電極/正孔輸送層/光電変換層/背面電極)はごく微量の水分や酸素で劣化するが、上記カバー部材は、ガラスに由来する高いガスバリア性と高い水蒸気バリア性(23℃、50%RHにおける水蒸気透過率は、例えば10-5g/m2/day以下である)を有するため、素子が水分や酸素により劣化するのを防止することができる。更に、上記カバー部材は可とう性をも有する。 The element (surface electrode/hole transport layer/photoelectric conversion layer/back electrode) constituting the organic thin-film solar cell is deteriorated by a very small amount of water or oxygen, but the cover member has a high gas barrier property derived from glass. Since it has a high water vapor barrier property (the water vapor transmission rate at 23° C. and 50% RH is, for example, 10 −5 g/m 2 /day or less), it is possible to prevent the element from being deteriorated by moisture or oxygen. .. Further, the cover member also has flexibility.
 従って、本発明の有機薄膜太陽電池によれば、薄型・軽量なフレキシブル有機薄膜太陽電池を実現することができる。また、素子の劣化を防止して、長寿命を実現ですることができる。 Therefore, according to the organic thin film solar cell of the present invention, a thin and lightweight flexible organic thin film solar cell can be realized. In addition, deterioration of the element can be prevented and a long life can be realized.
 本発明の有機薄膜太陽電池は、モバイル用充電機器等に好適に使用することができる。 The organic thin film solar cell of the present invention can be suitably used for mobile charging devices and the like.
 [指紋認証センサー]
 本発明の指紋認証センサーは、上記カバー部材を、指紋認証センサーの表面を被覆する保護膜として備える。本発明の指紋認証センサーは、例えば、タッチパネル、ディスプレイ、カードキー、クレジットカード等の個人認証機能を備えることが望まれる電子機器(ICカードを含む)に利用できる。
[Fingerprint authentication sensor]
The fingerprint authentication sensor of the present invention includes the cover member as a protective film that covers the surface of the fingerprint authentication sensor. INDUSTRIAL APPLICABILITY The fingerprint authentication sensor of the present invention can be used for electronic devices (including IC cards) desired to have a personal authentication function such as a touch panel, a display, a card key, and a credit card.
 指紋認証センサーは、第一の基板の上に電極が形成され、その上に第二の基板が重ねられた構成を有する。そして、本発明の指紋認証センサーは、上記カバー部材を、第1の基板及び/又は第2の基板として備える。 The fingerprint authentication sensor has a structure in which an electrode is formed on the first substrate and the second substrate is stacked on it. The fingerprint authentication sensor of the present invention includes the cover member as the first substrate and/or the second substrate.
 本発明の指紋認証センサーは前記構成を有するため、ガラスに由来する上質な手触りを有する。また、ガラスはプラスチックに比べて比誘電率が高い。そのため、指紋認証センサーはプラスチックフィルムを基板とする従来品に比べて静電容量を大きくすることができ、高感度を有する。そして、硬度が高く、耐衝撃性に優れるため、表面に衝撃が加わってもクラックが生じ難く、取扱が容易である。また、化学的安定性に優れるため、洗剤等を用いて拭いてもディスプレイの表面が白く濁ることがない。 Since the fingerprint authentication sensor of the present invention has the above-mentioned configuration, it has a high-quality touch derived from glass. Further, glass has a higher relative dielectric constant than plastic. Therefore, the fingerprint authentication sensor can have a larger capacitance and higher sensitivity than a conventional product using a plastic film as a substrate. Further, since the hardness is high and the impact resistance is excellent, even if an impact is applied to the surface, cracks are less likely to occur and the handling is easy. Further, since it has excellent chemical stability, the surface of the display does not become white and turbid even when it is wiped with a detergent or the like.
 [個人認証機能付き電子機器]
 本発明の個人認証機能付き電子機器は、上記指紋認証センサーを備える電子機器(ICカードを含む)であり、例えば、個人認証機能付きタッチパネル、個人認証機能付きディスプレイ、個人認証機能付きカードキー、個人認証機能付きクレジットカード等が挙げられる。
[Electronic devices with personal authentication function]
An electronic device with a personal authentication function of the present invention is an electronic device (including an IC card) provided with the fingerprint authentication sensor, and includes, for example, a touch panel with a personal authentication function, a display with a personal authentication function, a card key with a personal authentication function, and an individual. Examples include credit cards with an authentication function.
 本発明の個人認証機能付き電子機器は、上記カバー部材を備える指紋認証センサーを備えるため、高感度を有し、高品質である。更に、取扱が容易である。 Since the electronic device with a personal authentication function of the present invention includes the fingerprint authentication sensor including the cover member, it has high sensitivity and high quality. Furthermore, it is easy to handle.
 以下、実施例により本発明をより具体的に説明するが、本発明はこれらの実施例により限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to these Examples.
 調製例1(接着剤の調製)
 表1(単位は重量部)に記載の処方通りに各成分を混合して接着剤を得た。得られた接着剤の25℃、せん断速度100(1/s)における粘度を、E型粘度計(商品名「VISCOMETER TV-25」、東機産業(株)製)を用いて測定したところ、22.6mPa・sであった。
Preparation Example 1 (Preparation of adhesive)
Each component was mixed according to the formulation shown in Table 1 (unit is parts by weight) to obtain an adhesive. The viscosity of the obtained adhesive at 25° C. and a shear rate of 100 (1/s) was measured using an E-type viscometer (trade name “VISCOMETER TV-25”, manufactured by Toki Sangyo Co., Ltd.), It was 22.6 mPa·s.
 調製例2~31、比較調製例1~3(接着剤の調製)
 表1(単位は重量部)に記載の通りに処方を変更した以外は調製例1と同様にして接着剤を得た。
Preparation Examples 2 to 31, Comparative Preparation Examples 1 to 3 (preparation of adhesive)
An adhesive was obtained in the same manner as in Preparation Example 1 except that the formulation was changed as shown in Table 1 (unit is parts by weight).
 (密着性評価)
 調製例及び比較調製例で得られた接着剤をガラス板(商品名「S9112」、松浪硝子工業(株)製)に塗布し(塗膜厚み:5μm)、空気雰囲気下、光源としてLED照射器を使用して365nmの光を照射して硬化物/ガラス板積層体を得た。
 得られた積層体を、密着性試験(クロスカット法;JIS K5600-5-6(ISO2409)に準拠)に付し、6段階分類試験によって密着性を評価した。
(Adhesion evaluation)
The adhesive obtained in the preparation example and the comparative preparation example was applied to a glass plate (trade name "S9112", manufactured by Matsunami Glass Industry Co., Ltd.) (coating thickness: 5 μm), and an LED irradiator as a light source under an air atmosphere. Was irradiated with light having a wavelength of 365 nm to obtain a cured product/glass plate laminate.
The obtained laminate was subjected to an adhesion test (cross-cut method; conforming to JIS K5600-5-6 (ISO2409)), and the adhesion was evaluated by a 6-step classification test.
 (耐カール性評価(1))
 調製例及び比較調製例で得られた接着剤を、樹脂フィルムとしてのPETフィルム(サイズ:縦×横=1cm×7cm、厚み:100μm)に塗布し(塗膜厚み:10μm)、空気雰囲気下、LED照射器を用いて365nmの光を、タック性がなくなるまで照射して硬化物/PET積層体を得た。
 得られた硬化物/PET積層体(サイズ:縦×横=1cm×7cm)を試験片とし、これを水平面に置き、試験片の短辺の一方を押さえた際に短辺のもう一方が水平面から浮く量を測定し、下記基準で耐カール性を評価した(図1)。尚、浮き量が少ない方が耐カール性に優れる。
 ◎(非常に良好):浮き量が1mm未満
 ○(良好):浮き量が1mm以上、2mm未満
 △(可):浮き量が2mm以上、5mm未満
 ×(不良):浮き量が5mm以上
(Curl resistance evaluation (1))
The adhesive obtained in Preparation Example and Comparative Preparation Example was applied to a PET film (size: length×width=1 cm×7 cm, thickness: 100 μm) as a resin film (coating film thickness: 10 μm), and in an air atmosphere, Light of 365 nm was irradiated using an LED irradiator until tackiness disappeared to obtain a cured product/PET laminate.
The obtained cured product/PET laminate (size: length×width=1 cm×7 cm) was used as a test piece, which was placed on a horizontal surface, and when one of the short sides of the test piece was pressed, the other short side was a horizontal surface. The amount of floating was measured and the curl resistance was evaluated according to the following criteria (FIG. 1). The smaller the floating amount, the better the curl resistance.
◎ (Very good): Lifting amount is less than 1 mm ○ (Good): Lifting amount is 1 mm or more and less than 2 mm △ (Fair): Lifting amount is 2 mm or more and less than 5 mm × (Poor): Lifting amount is 5 mm or more
 結果を下記表にまとめて示す。
Figure JPOXMLDOC01-appb-T000018
The results are summarized in the table below.
Figure JPOXMLDOC01-appb-T000018
 尚、表中の略号を以下に説明する。
<化合物(I)>
 HEVE:エチレングリコールモノビニルエーテル
 HBVE:4-ヒドロキシブチルビニルエーテル
 DEGMVE:ジエチレングリコールモノビニルエーテル
 OXT101:3-エチル-3-ヒドロキシメチルオキセタン、商品名「アロンオキセタン OXT-101」、東亞合成(株)製
<化合物(b)>
 1,6-HDGE:1,6-ヘキサンジオールジグリシジルエーテル
 1,4-BDGE:1,4-ブタンジオールジグリシジルエーテル
 1,2-EDGE:エチレングリコールジグリシジルエーテル
 NPGDGE:ネオペンチルグリコールジグリシジルエーテル
 YH300:トリメチロールプロパントリグリシジルエーテル
<その他のカチオン重合性モノマー>
 ISBDVE:イソソルビドジビニルエーテル、商品名「ISB-DVE」、(株)ダイセル製
 ONBDVE:オキサノルボルネンジビニルエーテル
 CHDVE:1,4-シクロヘキサンジオールジビニルエーテル
 2021P:3,4-エポキシシクロヘキシルメチル(3,4-エポキシ)シクロヘキサンカルボキシレート、商品名「セロキサイド2021P」、(株)ダイセル製
 b’-1:(3,4,3’,4’-ジエポキシ)ビシクロヘキシル
 2-EHVE:2-エチルヘキシルビニルエーテル
 TEGDVE:トリエチレングリコールジビニルエーテル
 OXT212:3-エチル-3-[(2-エチルヘキシルオキシ)メチル]オキセタン、商品名「アロンオキセタン OXT-212」、東亞合成(株)製
 OXT221:ビス[1-エチル(3-オキセタニル)]メチルエーテル、商品名「アロンオキセタン OXT-221」、東亞合成(株)製
<ラジカル重合性モノマー>
 DCPA:トリシクロデカンジメタノールジアクリレート
 DPGDA:ジプロピレングリコールジアクリレート
 VEEA:アクリル酸2-(2-ビニロキシエトキシ)エチル
<硬化触媒>
 CPI-110P:ジフェニル[4-(フェニルチオ)フェニル]スルホニウム ヘキサフルオロホスファートおよびチオジ-p-フェニレンビス(ジフェニルスルホニウム) ビス(ヘキサフルオロホスファート)の混合物(99.5/0.5)、商品名「CPI-110P」、サンアプロ(株)製
 Irg184:1-ヒドロキシ-シクロヘキシル-フェニル-ケトン、商品名「イルガキュア-184」、BASF社製
<増感剤>
 UVS1331:9,10-ジブトキシアントラセン、商品名「アントラキュアー UVS-1331」、川崎化成工業(株)製
 UVS581:9,10-ジ(カプリロイルオキシ)アントラセン、商品名「アントラキュアー UVS-581」、川崎化成工業(株)製
The abbreviations in the table are explained below.
<Compound (I)>
HEVE: ethylene glycol monovinyl ether HBVE: 4-hydroxybutyl vinyl ether DEGMVE: diethylene glycol monovinyl ether OXT101: 3-ethyl-3-hydroxymethyl oxetane, trade name "Aron Oxetane OXT-101", manufactured by Toagosei Co., Ltd. <Compound (b )>
1,6-HDGE: 1,6-hexanediol diglycidyl ether 1,4-BDGE: 1,4-butanediol diglycidyl ether 1,2-EDGE: ethylene glycol diglycidyl ether NPGDGE: neopentyl glycol diglycidyl ether YH300 : Trimethylolpropane triglycidyl ether <Other cationically polymerizable monomers>
ISBDVE: isosorbide divinyl ether, trade name "ISB-DVE", manufactured by Daicel Corporation ONBDVE: oxanorbornene divinyl ether CHDVE: 1,4-cyclohexanediol divinyl ether 2021P: 3,4-epoxycyclohexylmethyl (3,4-epoxy) ) Cyclohexanecarboxylate, trade name "Ceroxide 2021P", manufactured by Daicel Corporation b'-1: (3,4,3',4'-diepoxy)bicyclohexyl 2-EHVE: 2-ethylhexyl vinyl ether TEGDVE: triethylene glycol Divinyl ether OXT212: 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane, trade name "Aron Oxetane OXT-212", Toagosei Co., Ltd. OXT221: Bis[1-ethyl(3-oxetanyl)] Methyl ether, trade name "Aron Oxetane OXT-221", manufactured by Toagosei Co., Ltd. <Radical polymerizable monomer>
DCPA: tricyclodecane dimethanol diacrylate DPGDA: dipropylene glycol diacrylate VEEA: 2-(2-vinyloxyethoxy)ethyl acrylate <Curing catalyst>
CPI-110P: a mixture of diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate and thiodi-p-phenylenebis(diphenylsulfonium)bis(hexafluorophosphate) (99.5/0.5), trade name "CPI-110P", Irg184: 1-hydroxy-cyclohexyl-phenyl-ketone manufactured by San-Apro Co., Ltd., trade name "Irgacure-184", manufactured by BASF <sensitizer>
UVS1331:9,10-dibutoxyanthracene, trade name "Anthracure UVS-1331", Kawasaki Kasei Co., Ltd. UVS581:9,10-di(capryloyloxy)anthracene, trade name "Anthracure UVS-581" Manufactured by Kawasaki Chemical Industry Co., Ltd.
 実施例1
 調製例8で得られた接着剤を、トリアセチルセルロースフィルム(TAC、サイズ:縦×横=1cm×7cm、厚み:60μm)上に乾燥後の厚みが15μmとなるよう塗布し、ガラス板(商品名「G-leaf」、日本電気硝子(株)製、厚み50μm)を貼り合わせた後、空気雰囲気下、LED照射器を用いて365nmの光を照射(照射量:2000mJ/cm2)してTAC/接着層/G-leaf積層体を得た。得られた積層体のG-leaf表面の鉛筆硬度を、JIS K5600-5-4(ISO/DIN15184)に準拠した方法で測定したところ、9Hであった。
Example 1
The adhesive obtained in Preparation Example 8 was applied onto a triacetyl cellulose film (TAC, size: length×width=1 cm×7 cm, thickness: 60 μm) so that the thickness after drying was 15 μm, and a glass plate (product After the name "G-leaf", manufactured by Nippon Electric Glass Co., Ltd., thickness 50 μm) is stuck, it is irradiated with light of 365 nm (irradiation amount: 2000 mJ/cm 2 ) using an LED irradiator in an air atmosphere. A TAC/adhesive layer/G-leaf stack was obtained. The pencil hardness of the G-leaf surface of the obtained laminate was measured by the method according to JIS K5600-5-4 (ISO/DIN15184) and found to be 9H.
 実施例2
 トリアセチルセルロースフィルムに代えてPETフィルム(品番:A4300、東洋紡(株)製、サイズ:縦×横=1cm×7cm、厚み:75μm)を使用した以外は実施例1と同様にして、PET/接着層/G-leaf積層体を得た。得られた積層体のG-leaf表面の鉛筆硬度は9Hであった。
Example 2
PET/adhesion was performed in the same manner as in Example 1 except that a PET film (product number: A4300, manufactured by Toyobo Co., Ltd. size: length×width=1 cm×7 cm, thickness: 75 μm) was used instead of the triacetyl cellulose film. A layer/G-leaf stack was obtained. The pencil hardness of the G-leaf surface of the obtained laminate was 9H.
 実施例3
 PETフィルム(厚み:75μm)をPETフィルム(厚み:38μm)に代えた以外は実施例2と同様にして積層体を得た。
Example 3
A laminate was obtained in the same manner as in Example 2 except that the PET film (thickness: 75 μm) was replaced with the PET film (thickness: 38 μm).
 実施例4
 50μm厚さのガラス板から100μm厚さのガラス板に変更した以外は実施例3と同様に行って積層体を得た。
Example 4
A laminate was obtained in the same manner as in Example 3 except that the glass plate having a thickness of 50 μm was changed to the glass plate having a thickness of 100 μm.
 実施例5
 50μm厚さのガラス板から150μm厚さのガラス板に変更した以外は実施例3と同様に行って積層体を得た。
Example 5
A laminate was obtained in the same manner as in Example 3 except that the glass plate having a thickness of 50 μm was changed to the glass plate having a thickness of 150 μm.
 実施例6
 ガラス板(商品名「G-leaf」、日本電気硝子(株)製、厚み50μm)に、アクリル系接着層付きPETフィルム(接着層厚み:25μm、PET厚み:50μm、商品名「ASF50 527ALF」、(株)ダイセル製)を貼り合わせて、PET/アクリル系接着層/G-leaf積層体を得た。
Example 6
PET plate with acrylic adhesive layer (adhesive layer thickness: 25 μm, PET thickness: 50 μm, product name “ASF50 527ALF”) on a glass plate (trade name “G-leaf”, manufactured by Nippon Electric Glass Co., Ltd., thickness 50 μm) (Manufactured by Daicel Co., Ltd.) were stuck together to obtain a PET/acrylic adhesive layer/G-leaf laminate.
 実施例7
 50μm厚さのガラス板から100μm厚さのガラス板に変更した以外は実施例6と同様にして積層体を得た。
Example 7
A laminate was obtained in the same manner as in Example 6 except that the glass plate having a thickness of 50 μm was changed to the glass plate having a thickness of 100 μm.
 実施例8
 50μm厚さのガラス板から150μm厚さのガラス板に変更した以外は実施例6と同様にして積層体を得た。
Example 8
A laminate was obtained in the same manner as in Example 6 except that the glass plate having a thickness of 50 μm was changed to the glass plate having a thickness of 150 μm.
 比較例1
 積層体に代えて、G-leaf(厚み:50μm)のみを使用した。尚、G-leaf表面の鉛筆硬度は9Hであった。
Comparative Example 1
Instead of the laminate, only G-leaf (thickness: 50 μm) was used. The pencil hardness of the G-leaf surface was 9H.
 比較例2
 積層体に代えて、100μm厚さのガラス板のみを使用した。
Comparative example 2
Instead of the laminate, only a glass plate with a thickness of 100 μm was used.
 比較例3
 積層体に代えて、150μm厚さのガラス板のみを使用した。
Comparative Example 3
Instead of the laminate, only a glass plate having a thickness of 150 μm was used.
 (全光線透過率)
 積層体(比較例では、ガラス板)の透明性を、全光線透過率を測定(JIS-K7361準拠)することで評価した。
(Total light transmittance)
The transparency of the laminate (in the comparative example, a glass plate) was evaluated by measuring the total light transmittance (in accordance with JIS-K7361).
 (可とう性評価)
 25℃において、ガラス板面が凹となるよう積層体(比較例では、ガラス板)を折り曲げて万力の口金に挟み、ハンドルを回して徐々に締め付け、初めて積層体に割れが生じた時点における積層体の曲げ半径を、最小曲げ半径(mm)とした。
(Flexibility evaluation)
At 25° C., the laminate (a glass plate in the comparative example) was bent so as to have a concave glass plate surface, sandwiched between the vices of a vise, and a handle was turned to gradually tighten the laminate at the time when the laminate cracked for the first time. The bending radius of the laminate was defined as the minimum bending radius (mm).
 (屈曲耐久性評価(1))
 積層体(比較例では、ガラス板)を試験片として使用し、25℃において、前記試験片を平面上に水平に設置して伸ばした状態から、その中心部において、試験片をガラス板の面が凹となる方向に、且つ、50μm厚さのガラス板を使用した場合は屈曲半径を3mm、100μm厚さのガラス板を使用した場合は屈曲半径を15mm、150μm厚さのガラス板を使用した場合は屈曲半径を35mmとして、180°折り曲げ、その後、再び伸ばして元に戻す動作を1セットとし、1分間に43セットの速さで前記動作を行い、試験片にクラックが生じるまでのセット数を屈曲耐久性の指標とした(図2、3参照)。
(Bending durability evaluation (1))
Using the laminate (in the comparative example, a glass plate) as a test piece, at 25° C., the test piece was placed horizontally on a flat surface and stretched. When the glass plate having a thickness of 50 μm is used in the direction in which is concave, the bending radius is 3 mm, and when the glass plate having a thickness of 100 μm is used, the glass plate having a bending radius of 15 mm and a thickness of 150 μm is used. In this case, set the bending radius to 35 mm, bend 180°, and then extend again to return it to one set, and perform the above-mentioned operation at a speed of 43 sets per minute, and set the number of sets until cracks occur in the test piece. Was used as an index of bending durability (see FIGS. 2 and 3).
 (耐衝撃性評価)
 積層体(比較例では、ガラス板)を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペン(ZEBRAニュークリスタルケアS キャップなし)を、ペン先を下に向けた状態で、積層体の表面に向けて自然落下させ、ガラス板にクラックが生じた最も低い落下高さ(cm)を耐衝撃性の指標とする。尚、落下高さはボールペンのペン先位置の高さである。落下高さは、1cmから開始し、1cm刻みで増加させた。
(Impact resistance evaluation)
The laminated body (in the comparative example, a glass plate) was placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g (without ZEBRA New Crystal Care S cap) was placed. With the pen tip facing downward, the laminate is naturally dropped toward the surface of the laminate, and the lowest drop height (cm) at which a glass plate is cracked is used as an index of impact resistance. The drop height is the height of the pen tip position of the ballpoint pen. The drop height started from 1 cm and increased in 1 cm increments.
 (比誘電率)
 積層体(接着層を含まない構成)の比誘電率を算出した。尚、ガラス板の比誘電率を5.8(1MHz、20℃)、PETフィルムの比誘電率を3.2(1MHz、20℃)とし、これら2つの誘電体材料を直列接続したとして算出した。
(Relative permittivity)
The relative permittivity of the laminate (a structure not including the adhesive layer) was calculated. Note that the relative permittivity of the glass plate was 5.8 (1 MHz, 20° C.), the relative permittivity of the PET film was 3.2 (1 MHz, 20° C.), and these two dielectric materials were connected in series for calculation. ..
 (耐カール性評価(2))
 積層体(比較例では、ガラス板)について、上記耐カール性評価(1)と同様の方法で評価した。
(Curl resistance evaluation (2))
The laminate (glass plate in the comparative example) was evaluated by the same method as the above-mentioned curl resistance evaluation (1).
 結果を下記表にまとめて示す。
Figure JPOXMLDOC01-appb-T000019
The results are summarized in the table below.
Figure JPOXMLDOC01-appb-T000019
 実施例9~17(積層体の調製)
 調製例8で得られた接着剤を、下記表に記載の樹脂フィルム上に乾燥後の厚みが15μmとなるよう塗布し、下記表に記載の最小曲げ半径を有するガラス板(商品名「G-leaf」、日本電気硝子(株)製、厚み50μm)上に、これから得ようとする積層体の屈曲方向が、前記樹脂フィルムのMD方向、TD方向、若しくは複屈折の配向方向に対して45°の方向と平行になるよう貼り合わせた後、空気雰囲気下、LED照射器を用いて365nmの光を照射(照射量:2000mJ/cm2)して樹脂フィルム/接着層/G-leaf積層体(各実施例につきサンプル数10)を得た。尚、最小曲げ半径は上記(可とう性評価)と同様の方法で測定した。
Examples 9 to 17 (Preparation of laminate)
The adhesive obtained in Preparation Example 8 was applied onto the resin films shown in the table below so that the thickness after drying was 15 μm, and the glass plate having the minimum bending radius shown in the table below (trade name “G- ”Leaf”, manufactured by Nippon Electric Glass Co., Ltd., thickness 50 μm), the bending direction of the laminate to be obtained is 45° with respect to the MD direction, the TD direction, or the birefringence orientation direction of the resin film. After being laminated so as to be parallel to the direction of, a light of 365 nm was irradiated (irradiation amount: 2000 mJ/cm 2 ) using an LED irradiator in an air atmosphere to obtain a resin film/adhesive layer/G-leaf laminate ( A sample number of 10) was obtained for each example. The minimum bending radius was measured by the same method as the above (evaluation of flexibility).
 (屈曲耐久性評価(2))
 得られた積層体(各実施例につき、サンプル数10)を平面上に水平に設置して伸ばした状態から、その中心部において、試験片をG-leafの面が凹となる方向に、屈曲半径が3mmとなるように180°折り曲げ、その後、再び伸ばして元に戻す動作を1セットとし、1分間に43セットの速さで2000セット行い、試験片にクラックが生じなかったサンプルの割合から屈曲耐久性を評価した。
(Flexibility durability evaluation (2))
The obtained laminate (10 samples in each example) was placed horizontally on a flat surface and stretched, and at the center thereof, the test piece was bent in a direction in which the surface of the G-leaf was concave. Bending 180° so that the radius becomes 3 mm, and then stretching again and returning it to 1 set, 1 set is performed 2000 sets at a speed of 43 sets, and from the ratio of the sample in which no crack was generated in the test piece The bending durability was evaluated.
 結果を下記表にまとめて示す。
Figure JPOXMLDOC01-appb-T000020
The results are summarized in the table below.
Figure JPOXMLDOC01-appb-T000020
 表中の略号を以下に説明する。
<樹脂フィルム>
 PET:二軸延伸PETフィルム、商品名「コスモシャインA4300」、東洋紡(株)製
 TAC:二軸延伸トリアセチルセルロースフィルム、商品名「フジタックTG60UL」、富士フィルム(株)製
 PEN:二軸延伸ポリエチレンナフタレートフィルム、商品名「テオネックスQ65HA」、帝人フィルムソリューション(株)製
 PAI:二軸延伸ポリアミドイミドフィルム、商品名「Taimide OT-050」、Taimide Tech. Inc.社製
The abbreviations in the table are explained below.
<Resin film>
PET: Biaxially stretched PET film, trade name "Cosmo Shine A4300", Toyobo Co., Ltd. TAC: Biaxially stretched triacetyl cellulose film, trade name "Fujitac TG60UL", Fuji Film Co., Ltd. PEN: Biaxially stretched polyethylene Naphthalate film, trade name "Teonex Q65HA", manufactured by Teijin Film Solutions Ltd. PAI: Biaxially oriented polyamideimide film, trade name "Taimide OT-050", manufactured by Taimide Tech. Inc.
 実施例18~24、比較例4(積層体の調製)
 下記表に記載の接着剤を、PETフィルム(二軸延伸PETフィルム、商品名「コスモシャインA4300」、東洋紡(株)製)上に、乾燥後の厚みが下記表に記載の通りとなるよう塗布し、最小曲げ半径が3mm以下であるガラス板(商品名「G-leaf」、日本電気硝子(株)製、厚み50μm)を、前記PETフィルムのMD方向が、これから得ようとする積層体の屈曲方向と平行になるよう貼り合わせた後、前記接着剤を下記方法で硬化させてPET/接着層/G-leaf積層体を得た。
<硬化方法>
 実施例18、21、23、24:溶剤を加熱乾燥することにより硬化させた
 実施例19:紫外線を照射して硬化させた
 実施例20:溶剤を加熱乾燥させた後、紫外線を照射して硬化させた
 実施例22:シート状接着剤をガラスとPETの間に挟みこんだ後、真空加熱圧着することにより硬化させた
 比較例4:常温で24時間静置して、硬化させた
Examples 18 to 24, Comparative Example 4 (Preparation of laminate)
The adhesive described in the following table was applied onto a PET film (biaxially stretched PET film, trade name "Cosmo Shine A4300", manufactured by Toyobo Co., Ltd.) so that the thickness after drying was as described in the following table. Then, a glass plate having a minimum bending radius of 3 mm or less (trade name “G-leaf”, manufactured by Nippon Electric Glass Co., Ltd., thickness: 50 μm) is used to obtain a laminate from which the MD direction of the PET film is to be obtained. After bonding so as to be parallel to the bending direction, the adhesive was cured by the following method to obtain a PET/adhesive layer/G-leaf laminate.
<Curing method>
Examples 18, 21, 23, 24: Cured by heating and drying a solvent Example 19: Curing by irradiating ultraviolet rays Example 20: Curing by irradiating ultraviolet rays after heating and drying a solvent Example 22: The sheet-like adhesive was sandwiched between glass and PET and then cured by vacuum pressure bonding. Comparative Example 4: Cured by standing at room temperature for 24 hours
 尚、接着層の貯蔵弾性率及びTg測定は、接着剤の硬化物(厚み:0.5mm)を幅4mm、長さ3cmに切り出し、これを動的粘弾性測定(DMA)のサンプルとして使用し、下記の条件で実施した。
<測定装置及び測定条件>
測定装置:固体粘弾性測定装置(「RSAIII」、TA INSTRUMENTS社製)
雰囲気:窒素
温度範囲:20~350℃
昇温温度:5℃/分
変形モード:引っ張りモード
In addition, the storage elastic modulus and Tg of the adhesive layer were measured by cutting a cured adhesive (thickness: 0.5 mm) into a width of 4 mm and a length of 3 cm, and using this as a sample for dynamic viscoelasticity measurement (DMA). , Was carried out under the following conditions.
<Measuring device and measuring conditions>
Measuring device: Solid viscoelasticity measuring device (“RSAIII”, manufactured by TA INSTRUMENTS)
Atmosphere: Nitrogen temperature range: 20~350℃
Temperature rise: 5℃/min Deformation mode: Tensile mode
 実施例18~24、及び比較例4で得られた積層体を試験片として使用し、その屈曲耐久性の評価を上記屈曲耐久性評価(1)と同様の方法で行った。 The laminates obtained in Examples 18 to 24 and Comparative Example 4 were used as test pieces, and the bending durability was evaluated by the same method as the bending durability evaluation (1).
 また、実施例19で得られた積層体について、以下の方法で耐衝撃性を評価した。
 (耐衝撃性評価)
 積層体(比較例では、ガラス板)を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペン(ZEBRAニュークリスタルケアS キャップなし)を、ペン先を下に向けた状態で、積層体の表面に向けて自然落下させ、ガラス板にクラックが生じた最も低い落下高さ(cm)を耐衝撃性の指標とする。尚、落下高さはボールペンのペン先位置の高さである。落下高さは、1cmから開始し、1cm刻みで増加させた。
Further, the impact resistance of the laminate obtained in Example 19 was evaluated by the following method.
(Impact resistance evaluation)
The laminated body (in the comparative example, a glass plate) was placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g (without ZEBRA New Crystal Care S cap) was used. With the pen tip facing downward, the laminate is naturally dropped toward the surface of the laminate, and the lowest drop height (cm) at which a glass plate is cracked is used as an index of impact resistance. The drop height is the height of the pen tip position of the ballpoint pen. The drop height started from 1 cm and increased in 1 cm increments.
 結果を下記表にまとめて示す。
Figure JPOXMLDOC01-appb-T000021
The results are summarized in the table below.
Figure JPOXMLDOC01-appb-T000021
 表中の略号を以下に説明する。
<接着剤>
 UA1:ウレタン変性アクリルポリマーと溶剤(酢酸エチル/イソプロピルアルコール)を含む組成物(商品名「アクリット8UA-017」、大成ファインケミカル(株)製)
 UA2:UV硬化型ウレタンアクリレート(商品名「アクリット8UX-077A」、大成ファインケミカル(株)製)100重量部に、イルガキュア-184を5重量部配合して得られる組成物
 UA3:UV硬化型ウレタンアクリルポリマー(商品名「アクリット8BR-600」、大成ファインケミカル(株)製)100重量部に、イルガキュア-184を0.2重量部配合して得られる組成物
 EVA1:酢酸ビニルとエチレン-酢酸ビニル共重合体と溶剤(水)を含む組成物(商品名「セビアン-A 56094」、ダイセルファインケム(株)製)
 EVA2:変性エチレン-酢酸ビニル共重合体からなるシート状接着剤(商品名「メルセンG」、東ソー・ニッケミ(株)製)
 EVA3:酢酸ビニルとエチレン-酢酸ビニル共重合体と酢酸ビニル・アクリル酸アルキルエステル系共重合体の配合物と溶剤(水/メチルシクロヘキサノン)を含む組成物(商品名「セビアン-A 56148」、ダイセルファインケム(株)製)
 EVA4:酢酸ビニルとエチレン-酢酸ビニル共重合体とスチレン-ブタジエン共重合体と溶剤(水/メチルシクロヘキサノン)を含む組成物(商品名「セビアン-A 609」、ダイセルファインケム(株)製)
 SL:シリコーン系弾性接着剤、商品名「セメダインスーパーXハイパーワイド」、セメダイン(株)製
The abbreviations in the table are explained below.
<Adhesive>
UA1: Composition containing urethane-modified acrylic polymer and solvent (ethyl acetate/isopropyl alcohol) (Brand name "Akrit 8UA-017", manufactured by Taisei Fine Chemicals Co., Ltd.)
UA2: UV-curable urethane acrylate (commercial name "Acryt 8UX-077A", manufactured by Taisei Fine Chemicals Co., Ltd.) 100 parts by weight, and 5 parts by weight of Irgacure-184 are mixed together UA3: UV-curable urethane acrylic A composition obtained by mixing 0.2 parts by weight of Irgacure-184 with 100 parts by weight of a polymer (trade name "Akrit 8BR-600", manufactured by Taisei Fine Chemical Co., Ltd.) EVA1: Vinyl acetate and ethylene-vinyl acetate co-weight Composition containing coalesce and solvent (water) (trade name "Cevian-A 56094", manufactured by Daicel Finechem Co., Ltd.)
EVA2: Sheet-like adhesive composed of modified ethylene-vinyl acetate copolymer (trade name "Mersen G", manufactured by Tosoh Nikkemi Co., Ltd.)
EVA3: A composition containing a blend of vinyl acetate, an ethylene-vinyl acetate copolymer, a vinyl acetate/alkyl acrylate copolymer, and a solvent (water/methylcyclohexanone) (trade name "Sebian-A 56148", Daicel Fine Chem Co., Ltd.)
EVA4: A composition containing vinyl acetate, an ethylene-vinyl acetate copolymer, a styrene-butadiene copolymer, and a solvent (water/methylcyclohexanone) (trade name "Sebian-A 609", manufactured by Daicel Finechem Co., Ltd.)
SL: Silicone type elastic adhesive, trade name "Cemedine Super X Hyper Wide", manufactured by Cemedine Co., Ltd.
 以上のまとめとして、本発明の構成およびそのバリエーションを以下に付記する。
[1] 厚みが500μm以下であるガラス板と、樹脂フィルムとが接着層を介して積層された構成を有する部材。
[2] 下記試験による耐衝撃性が4cm以上である、[1]に記載の部材。
耐衝撃性試験:
カバー部材を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペンをペン先からカバー部材の表面に向けて自然落下させ、ガラス板にクラックが生じるまでの落下高さ(cm)を耐衝撃性の指標とする
[3] 最小曲げ半径が250mm以下である、[1]又は[2]に記載の部材。
[4] 総厚みが1000μm以下である、[1]~[3]の何れか1つに記載の部材。
[5] 接着層が、下記接着剤(1)の硬化物である、[1]~[4]の何れか1つに記載の部材。
 接着剤(1):カチオン重合性モノマーと硬化触媒とを含有し、前記カチオン重合性モノマーとして、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物をカチオン重合性モノマー全量の10重量%以上含有し、式(b)で表される化合物をカチオン重合性モノマー全量の5重量%以上含有する。
[6] 1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物が、式(i-1-1)~(i-1-3)(i-3-1)で表される化合物から選択される少なくとも1種である、[5]に記載の部材。
[7] 1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物が、式(i-3-1)で表される化合物である、[5]に記載の部材。
[8] 式(b)で表される化合物が、式(b-1)~(b-5)で表される化合物から選択される少なくとも1種の化合物である、[5]~[7]の何れか1つに記載の部材。
[9] 式(b)で表される化合物が、式(b-1)~(b-4)で表される化合物から選択される少なくとも1種の化合物である、[5]~[7]の何れか1つに記載の部材。
[10] 接着剤(1)が、カチオン重合性モノマーとして、式(b’)で表される化合物をカチオン重合性モノマー全量の10重量%以上含有する、[5]~[9]の何れか1つに記載の部材。
[11] 式(b’)で表される化合物が、3,4-エポキシシクロヘキシルメチル(3,4-エポキシ)シクロヘキサンカルボキシレート、(3,4,3’,4’-ジエポキシ)ビシクロヘキシル、ビス(3,4-エポキシシクロヘキシルメチル)エーテル、1,2-エポキシ-1,2-ビス(3,4-エポキシシクロヘキサン-1-イル)エタン、2,2-ビス(3,4-エポキシシクロヘキサン-1-イル)プロパン、および1,2-ビス(3,4-エポキシシクロヘキサン-1-イル)エタンから選択される少なくとも1種の化合物である、[10]に記載の部材。
[12] 接着剤(1)が、カチオン重合性モノマーとして、式(c-1)で表される化合物及び/又は式(c-2)で表される化合物を含有する、[5]~[11]の何れか1つに記載の部材。
[13] 接着層が、ウレタン(メタ)アクリレート又はその重合体を含むアクリルウレタン系接着剤(2)の硬化物である、[1]~[4]の何れか1つに記載の部材。
[14] 接着層が酢酸ビニル系重合体を含む酢酸ビニル系接着剤(3)の硬化物である、[1]~[4]の何れか1つに記載の部材。
[15] 樹脂フィルムのMD方向が部材の屈曲方向に沿うように積層されてなる、[1]~[14]の何れか1つに記載の部材。
[16] カバー部材である、[1]~[15]の何れか1つに記載の部材。
[17] タッチパネルディスプレイ用カバー部材である、[1]~[15]の何れか1つに記載の部材。
[18] フレキシブルディスプレイ用カバー部材である、[1]~[15]の何れか1つに記載の部材。
[19] 指紋認証センサー用カバー部材である、[1]~[15]の何れか1つに記載の部材。
[20] [1]~[15]の何れか1つに記載の部材の、カバー部材としての使用。
[21] [1]~[15]の何れか1つに記載の部材の、タッチパネルディスプレイ用カバー部材としての使用。
[22] [1]~[15]の何れか1つに記載の部材の、フレキシブルディスプレイ用カバー部材としての使用。
[23] [1]~[15]の何れか1つに記載の部材の、指紋認証センサー用カバー部材としての使用。
[24] [1]~[15]の何れか1つに記載の部材を使用してカバー部材を得る、カバー部材の製造方法。
[25] [1]~[15]の何れか1つに記載の部材を使用してタッチパネルディスプレイ用カバー部材を得る、タッチパネルディスプレイ用カバー部材の製造方法。
[26] [1]~[15]の何れか1つに記載の部材を使用してフレキシブルディスプレイ用カバー部材を得る、フレキシブルディスプレイ用カバー部材の製造方法。
[27] [1]~[15]の何れか1つに記載の部材を使用して指紋認証センサー用カバー部材を得る、指紋認証センサー用カバー部材の製造方法。
[28] [1]~[15]の何れか1つに記載の部材を備えるタッチパネルディスプレイ。
[29] [1]~[15]の何れか1つに記載の部材を備えるフレキシブルディスプレイ。
[30] [28]又は[29]に記載のディスプレイを備える電子機器。
[31] [1]~[15]の何れか1つに記載の部材を備える有機エレクトロルミネッセンスデバイス。
[32] [1]~[15]の何れか1つに記載の部材を備える有機薄膜太陽電池。
[33] [1]~[15]の何れか1つに記載の部材を備える指紋認証センサー。
[34] [33]に記載の指紋認証センサーを備える、個人認証機能付き電子機器。
As a summary of the above, the configuration of the present invention and its variations are additionally described below.
[1] A member having a structure in which a glass plate having a thickness of 500 μm or less and a resin film are laminated via an adhesive layer.
[2] The member according to [1], which has an impact resistance of 4 cm or more according to the following test.
Impact resistance test:
The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate. [3] The member according to [1] or [2], which has a drop height (cm) until a crack is generated as an index of impact resistance [3] and has a minimum bending radius of 250 mm or less.
[4] The member according to any one of [1] to [3], which has a total thickness of 1000 μm or less.
[5] The member according to any one of [1] to [4], wherein the adhesive layer is a cured product of the following adhesive (1).
Adhesive (1): containing a cationically polymerizable monomer and a curing catalyst, and as the cationically polymerizable monomer, at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule. And 10% by weight or more of the compound having at least one hydroxyl group in the total amount of the cationically polymerizable monomer, and 5% by weight or more of the total amount of the cationically polymerizable monomer in the compound represented by the formula (b).
[6] A compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule is represented by formulas (i-1-1) to (i -1-3) The member according to [5], which is at least one selected from the compounds represented by (i-3-1).
[7] A compound having at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group and at least one hydroxyl group in one molecule is represented by the formula (i-3-1). The member according to [5], which is a compound.
[8] The compound represented by the formula (b) is at least one compound selected from compounds represented by the formulas (b-1) to (b-5), [5] to [7] The member according to any one of 1.
[9] The compound represented by the formula (b) is at least one compound selected from compounds represented by the formulas (b-1) to (b-4), [5] to [7] The member according to any one of 1.
[10] Any of [5] to [9], wherein the adhesive (1) contains, as a cationically polymerizable monomer, a compound represented by the formula (b′) in an amount of 10% by weight or more based on the total amount of the cationically polymerizable monomer. The member according to one.
[11] The compound represented by the formula (b′) is 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, (3,4,3′,4′-diepoxy)bicyclohexyl, bis. (3,4-epoxycyclohexylmethyl) ether, 1,2-epoxy-1,2-bis(3,4-epoxycyclohexane-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexane-1) -Yl) propane and at least one compound selected from 1,2-bis(3,4-epoxycyclohexane-1-yl)ethane.
[12] The adhesive (1) contains the compound represented by the formula (c-1) and/or the compound represented by the formula (c-2) as a cationically polymerizable monomer, [5] to [5] 11] The member according to any one of [11].
[13] The member according to any one of [1] to [4], wherein the adhesive layer is a cured product of an acrylic urethane adhesive (2) containing urethane (meth)acrylate or a polymer thereof.
[14] The member according to any one of [1] to [4], wherein the adhesive layer is a cured product of a vinyl acetate adhesive (3) containing a vinyl acetate polymer.
[15] The member according to any one of [1] to [14], wherein the resin films are laminated so that the MD direction is along the bending direction of the member.
[16] The member according to any one of [1] to [15], which is a cover member.
[17] The member according to any one of [1] to [15], which is a cover member for a touch panel display.
[18] The member according to any one of [1] to [15], which is a cover member for a flexible display.
[19] The member according to any one of [1] to [15], which is a cover member for a fingerprint authentication sensor.
[20] Use of the member according to any one of [1] to [15] as a cover member.
[21] Use of the member according to any one of [1] to [15] as a cover member for a touch panel display.
[22] Use of the member according to any one of [1] to [15] as a cover member for a flexible display.
[23] Use of the member according to any one of [1] to [15] as a cover member for a fingerprint authentication sensor.
[24] A method for manufacturing a cover member, using the member according to any one of [1] to [15] to obtain a cover member.
[25] A method for manufacturing a cover member for a touch panel display, using the member according to any one of [1] to [15] to obtain a cover member for a touch panel display.
[26] A method for manufacturing a cover member for flexible display, which comprises using the member according to any one of [1] to [15] to obtain a cover member for flexible display.
[27] A method for manufacturing a cover member for a fingerprint authentication sensor, which comprises using the member according to any one of [1] to [15] to obtain a cover member for a fingerprint authentication sensor.
[28] A touch panel display including the member according to any one of [1] to [15].
[29] A flexible display provided with the member according to any one of [1] to [15].
[30] An electronic device including the display according to [28] or [29].
[31] An organic electroluminescent device including the member according to any one of [1] to [15].
[32] An organic thin-film solar cell including the member according to any one of [1] to [15].
[33] A fingerprint authentication sensor including the member according to any one of [1] to [15].
[34] An electronic device with a personal authentication function, comprising the fingerprint authentication sensor according to [33].
 本発明のカバー部材は、透明性、ガスバリア性、水蒸気バリア性、化学的安定性、熱的安定性、電気絶縁性、表面平滑性、高硬度、及び耐カール性に優れ、良好な質感を備えると共に、可とう性、及び耐衝撃性を兼ね備える。そのため、ディスプレイのカバーガラスや、指紋認証センサーの保護膜として好適に使用することができる。 The cover member of the present invention is excellent in transparency, gas barrier properties, water vapor barrier properties, chemical stability, thermal stability, electrical insulation properties, surface smoothness, high hardness, and curl resistance, and has a good texture. At the same time, it has both flexibility and impact resistance. Therefore, it can be suitably used as a cover glass for a display or a protective film for a fingerprint authentication sensor.
1   カバー部材
2   浮き量
3   水平面
4   ガラス板
5   接着層
6   樹脂フィルム
1 cover member 2 floating amount 3 horizontal surface 4 glass plate 5 adhesive layer 6 resin film

Claims (19)

  1.  厚みが500μm以下であるガラス板と、樹脂フィルムとが接着層を介して積層された構成を有する、カバー部材。 A cover member having a structure in which a glass plate having a thickness of 500 μm or less and a resin film are laminated via an adhesive layer.
  2.  下記試験による耐衝撃性が4cm以上である、請求項1に記載のカバー部材。
    耐衝撃性試験:
    カバー部材を、ガラス板側表面が上になるよう平面上に配置し、ボール径0.7mm、重さ5.7gのボールペンをペン先からカバー部材の表面に向けて自然落下させ、ガラス板にクラックが生じるまでの落下高さ(cm)を耐衝撃性の指標とする
    The cover member according to claim 1, which has an impact resistance of 4 cm or more according to the following test.
    Impact resistance test:
    The cover member is placed on a flat surface with the glass plate side surface facing upward, and a ballpoint pen having a ball diameter of 0.7 mm and a weight of 5.7 g is naturally dropped from the pen tip toward the surface of the cover member to form a glass plate. The drop height (cm) before cracking is used as an index of impact resistance
  3.  最小曲げ半径が250mm以下である、請求項1又は2に記載のカバー部材。 The cover member according to claim 1 or 2, which has a minimum bending radius of 250 mm or less.
  4.  総厚みが1000μm以下である、請求項1~3の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 3, having a total thickness of 1000 µm or less.
  5.  接着層が、下記接着剤(1)の硬化物である、請求項1~4の何れか1項に記載のカバー部材。
     接着剤(1):カチオン重合性モノマーと硬化触媒とを含有し、前記カチオン重合性モノマーとして、1分子中にビニルエーテル基、エポキシ基、及びオキセタニル基から選択されるカチオン重合性基を少なくとも1個と、水酸基を少なくとも1個有する化合物をカチオン重合性モノマー全量の10重量%以上含有し、下記式(b)
    Figure JPOXMLDOC01-appb-C000001
    (式中、Rは、s価の直鎖状又は分岐鎖状飽和脂肪族炭化水素基、又は2個以上の直鎖状又は分岐鎖状飽和脂肪族炭化水素基がエーテル結合を介して結合したs価の基を示し、sは2以上の整数を示す)
    で表される化合物をカチオン重合性モノマー全量の5重量%以上含有する。
    The cover member according to any one of claims 1 to 4, wherein the adhesive layer is a cured product of the following adhesive (1).
    Adhesive (1): containing a cationically polymerizable monomer and a curing catalyst, and as the cationically polymerizable monomer, at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group in one molecule. And 10% by weight or more of the compound having at least one hydroxyl group based on the total amount of the cationically polymerizable monomer,
    Figure JPOXMLDOC01-appb-C000001
    (In the formula, R is an s-valent linear or branched saturated aliphatic hydrocarbon group, or two or more linear or branched saturated aliphatic hydrocarbon groups bonded via an ether bond. s represents a valent group, and s represents an integer of 2 or more)
    The compound represented by 5 wt% or more of the total amount of the cationically polymerizable monomer is contained.
  6.  接着剤(1)が、カチオン重合性モノマーとして、更に、下記式(b’)
    Figure JPOXMLDOC01-appb-C000002
    (式中、Xは単結合又は連結基を示す)
    で表される化合物をカチオン重合性モノマー全量の10重量%以上含有する、請求項5に記載のカバー部材。
    The adhesive (1) further comprises the following formula (b′) as a cationically polymerizable monomer.
    Figure JPOXMLDOC01-appb-C000002
    (In the formula, X represents a single bond or a linking group)
    The cover member according to claim 5, which contains the compound represented by 10% by weight or more of the total amount of the cationically polymerizable monomer.
  7.  接着層が、ウレタン(メタ)アクリレート又はその重合体を含むアクリルウレタン系接着剤(2)の硬化物である、請求項1~4の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 4, wherein the adhesive layer is a cured product of an acrylic urethane adhesive (2) containing urethane (meth)acrylate or a polymer thereof.
  8.  接着層が酢酸ビニル系重合体を含む酢酸ビニル系接着剤(3)の硬化物である、請求項1~4の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 4, wherein the adhesive layer is a cured product of a vinyl acetate adhesive (3) containing a vinyl acetate polymer.
  9.  樹脂フィルムのMD方向がカバー部材の屈曲方向に沿うように積層されてなる請求項1~8の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 8, wherein the resin film is laminated so that the MD direction is along the bending direction of the cover member.
  10.  タッチパネルディスプレイ用である、請求項1~9の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 9 for a touch panel display.
  11.  フレキシブルディスプレイ用である、請求項1~9の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 9 for a flexible display.
  12.  指紋認証センサー用である、請求項1~9の何れか1項に記載のカバー部材。 The cover member according to any one of claims 1 to 9 for a fingerprint authentication sensor.
  13.  請求項1~9の何れか1項に記載のカバー部材を備えるタッチパネルディスプレイ。 A touch panel display comprising the cover member according to any one of claims 1 to 9.
  14.  請求項1~9の何れか1項に記載のカバー部材を備えるフレキシブルディスプレイ。 A flexible display provided with the cover member according to any one of claims 1 to 9.
  15.  請求項13又は14に記載のディスプレイを備える電子機器。 An electronic device comprising the display according to claim 13 or 14.
  16.  請求項1~9の何れか1項に記載のカバー部材を備える有機エレクトロルミネッセンスデバイス。 An organic electroluminescent device comprising the cover member according to any one of claims 1 to 9.
  17.  請求項1~9の何れか1項に記載のカバー部材を備える有機薄膜太陽電池。 An organic thin film solar cell comprising the cover member according to any one of claims 1 to 9.
  18.  請求項1~9の何れか1項に記載のカバー部材を備える指紋認証センサー。 A fingerprint authentication sensor including the cover member according to any one of claims 1 to 9.
  19.  請求項18に記載の指紋認証センサーを備える、個人認証機能付き電子機器。 An electronic device with a personal authentication function, comprising the fingerprint authentication sensor according to claim 18.
PCT/JP2020/001528 2019-01-25 2020-01-17 Cover member WO2020153259A1 (en)

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Cited By (6)

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