WO2008146738A1 - 基板搬送システム - Google Patents

基板搬送システム Download PDF

Info

Publication number
WO2008146738A1
WO2008146738A1 PCT/JP2008/059538 JP2008059538W WO2008146738A1 WO 2008146738 A1 WO2008146738 A1 WO 2008146738A1 JP 2008059538 W JP2008059538 W JP 2008059538W WO 2008146738 A1 WO2008146738 A1 WO 2008146738A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
carry
ascending
brought
side wall
Prior art date
Application number
PCT/JP2008/059538
Other languages
English (en)
French (fr)
Inventor
Teruo Asakawa
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2008146738A1 publication Critical patent/WO2008146738A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

　載置台の載置部に載置された基板収容容器の蓋体は、昇降部の上昇によって持ち上げられる。昇降部の上昇によって筒体部が上昇して搬入出部を覆うシャッター板が上方へ移動し、開口部と搬入出部とが正対する。側壁における搬入出部の周辺に形成された溝から周囲の雰囲気が吸引され、これによって、シャッター板と側壁との間の空隙から、処理装置空間の雰囲気がクリーンルーム内に漏出することが防止される。
PCT/JP2008/059538 2007-05-25 2008-05-23 基板搬送システム WO2008146738A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007138564A JP2008294248A (ja) 2007-05-25 2007-05-25 基板搬送システム
JP2007-138564 2007-05-25

Publications (1)

Publication Number Publication Date
WO2008146738A1 true WO2008146738A1 (ja) 2008-12-04

Family

ID=40074988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059538 WO2008146738A1 (ja) 2007-05-25 2008-05-23 基板搬送システム

Country Status (2)

Country Link
JP (1) JP2008294248A (ja)
WO (1) WO2008146738A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021061A (ja) * 2011-07-08 2013-01-31 Tdk Corp ロードポート装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101740613B1 (ko) * 2012-09-27 2017-05-26 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 기판 처리 방법 및 반도체 장치의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116876A (ja) * 1996-07-12 1998-05-06 Fusion Syst Corp 制御された環境の間で物品を転送するシステム
JP2001102426A (ja) * 1999-10-01 2001-04-13 Hirata Corp 物品容器開閉・転送装置および物品容器開閉・転送方法
JP2002329661A (ja) * 2001-04-27 2002-11-15 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法
JP2004273603A (ja) * 2003-03-06 2004-09-30 Tdk Corp シール部材およびシール構造
WO2006030849A1 (ja) * 2004-09-15 2006-03-23 Hitachi Kokusai Electric Inc. 半導体製造装置および半導体装置の製造方法
JP2006352010A (ja) * 2005-06-20 2006-12-28 Nissin Ion Equipment Co Ltd 真空処理装置およびその運転方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116876A (ja) * 1996-07-12 1998-05-06 Fusion Syst Corp 制御された環境の間で物品を転送するシステム
JP2001102426A (ja) * 1999-10-01 2001-04-13 Hirata Corp 物品容器開閉・転送装置および物品容器開閉・転送方法
JP2002329661A (ja) * 2001-04-27 2002-11-15 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法
JP2004273603A (ja) * 2003-03-06 2004-09-30 Tdk Corp シール部材およびシール構造
WO2006030849A1 (ja) * 2004-09-15 2006-03-23 Hitachi Kokusai Electric Inc. 半導体製造装置および半導体装置の製造方法
JP2006352010A (ja) * 2005-06-20 2006-12-28 Nissin Ion Equipment Co Ltd 真空処理装置およびその運転方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021061A (ja) * 2011-07-08 2013-01-31 Tdk Corp ロードポート装置

Also Published As

Publication number Publication date
JP2008294248A (ja) 2008-12-04

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