WO2008146612A1 - 撮像装置の製造方法、撮像装置及び光学素子 - Google Patents

撮像装置の製造方法、撮像装置及び光学素子 Download PDF

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Publication number
WO2008146612A1
WO2008146612A1 PCT/JP2008/058941 JP2008058941W WO2008146612A1 WO 2008146612 A1 WO2008146612 A1 WO 2008146612A1 JP 2008058941 W JP2008058941 W JP 2008058941W WO 2008146612 A1 WO2008146612 A1 WO 2008146612A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
imaging device
epoxy
substrate
electronic component
Prior art date
Application number
PCT/JP2008/058941
Other languages
English (en)
French (fr)
Inventor
Mika Wachi
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Publication of WO2008146612A1 publication Critical patent/WO2008146612A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

　リフロー工程の処理に対応可能で光学性能と耐衝撃性とに優れた撮像装置の製造方法を提供するにあたり、モノマー成分（Ａ）としてエポキシ基含有（メタ）アクリレート、モノマー成分（Ｂ）として片末端（メタ）アクリル変性シリコーンオイル、モノマー成分（Ｃ）としてエポキシ変性シリコーン、エポキシの硬化剤（Ｄ）として酸無水物を含有してなる樹脂組成物を硬化して光学素子を成形する工程、前記光学素子を電子部品とともに基板上に載置する工程、及び、前記光学素子、前記電子部品及び前記基板をリフロー処理に供し、前記光学素子と前記電子部品とを前記基板に実装する工程を有することを特徴とする。
PCT/JP2008/058941 2007-05-28 2008-05-15 撮像装置の製造方法、撮像装置及び光学素子 WO2008146612A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-140504 2007-05-28
JP2007140504 2007-05-28

Publications (1)

Publication Number Publication Date
WO2008146612A1 true WO2008146612A1 (ja) 2008-12-04

Family

ID=40074878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058941 WO2008146612A1 (ja) 2007-05-28 2008-05-15 撮像装置の製造方法、撮像装置及び光学素子

Country Status (1)

Country Link
WO (1) WO2008146612A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006307088A (ja) * 2005-04-28 2006-11-09 Hitachi Chem Co Ltd 樹脂組成物、及びそれを用いた光学部材とその製造方法
JP2006324596A (ja) * 2005-05-20 2006-11-30 Shin Etsu Chem Co Ltd Ｌｅｄ用シリコーン樹脂レンズ及びその製造方法
JP2007067384A (ja) * 2005-08-01 2007-03-15 Matsushita Electric Ind Co Ltd 固体撮像装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006307088A (ja) * 2005-04-28 2006-11-09 Hitachi Chem Co Ltd 樹脂組成物、及びそれを用いた光学部材とその製造方法
JP2006324596A (ja) * 2005-05-20 2006-11-30 Shin Etsu Chem Co Ltd Ｌｅｄ用シリコーン樹脂レンズ及びその製造方法
JP2007067384A (ja) * 2005-08-01 2007-03-15 Matsushita Electric Ind Co Ltd 固体撮像装置

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