WO2008146612A1 - 撮像装置の製造方法、撮像装置及び光学素子 - Google Patents
撮像装置の製造方法、撮像装置及び光学素子 Download PDFInfo
- Publication number
- WO2008146612A1 WO2008146612A1 PCT/JP2008/058941 JP2008058941W WO2008146612A1 WO 2008146612 A1 WO2008146612 A1 WO 2008146612A1 JP 2008058941 W JP2008058941 W JP 2008058941W WO 2008146612 A1 WO2008146612 A1 WO 2008146612A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical element
- imaging device
- epoxy
- substrate
- electronic component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
リフロー工程の処理に対応可能で光学性能と耐衝撃性とに優れた撮像装置の製造方法を提供するにあたり、モノマー成分(A)としてエポキシ基含有(メタ)アクリレート、モノマー成分(B)として片末端(メタ)アクリル変性シリコーンオイル、モノマー成分(C)としてエポキシ変性シリコーン、エポキシの硬化剤(D)として酸無水物を含有してなる樹脂組成物を硬化して光学素子を成形する工程、前記光学素子を電子部品とともに基板上に載置する工程、及び、前記光学素子、前記電子部品及び前記基板をリフロー処理に供し、前記光学素子と前記電子部品とを前記基板に実装する工程を有することを特徴とする。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-140504 | 2007-05-28 | ||
JP2007140504 | 2007-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008146612A1 true WO2008146612A1 (ja) | 2008-12-04 |
Family
ID=40074878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058941 WO2008146612A1 (ja) | 2007-05-28 | 2008-05-15 | 撮像装置の製造方法、撮像装置及び光学素子 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008146612A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006307088A (ja) * | 2005-04-28 | 2006-11-09 | Hitachi Chem Co Ltd | 樹脂組成物、及びそれを用いた光学部材とその製造方法 |
JP2006324596A (ja) * | 2005-05-20 | 2006-11-30 | Shin Etsu Chem Co Ltd | Led用シリコーン樹脂レンズ及びその製造方法 |
JP2007067384A (ja) * | 2005-08-01 | 2007-03-15 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
-
2008
- 2008-05-15 WO PCT/JP2008/058941 patent/WO2008146612A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006307088A (ja) * | 2005-04-28 | 2006-11-09 | Hitachi Chem Co Ltd | 樹脂組成物、及びそれを用いた光学部材とその製造方法 |
JP2006324596A (ja) * | 2005-05-20 | 2006-11-30 | Shin Etsu Chem Co Ltd | Led用シリコーン樹脂レンズ及びその製造方法 |
JP2007067384A (ja) * | 2005-08-01 | 2007-03-15 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009117345A3 (en) | Adhesive compositions for use in die attach applications | |
WO2009139584A3 (ko) | 점착제 조성물, 점착 시트 및 반도체 웨이퍼 이면연삭 방법 | |
WO2011025307A3 (ko) | 저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름 | |
EP2276063A3 (en) | Improvement of solder interconnect by addition of copper | |
EP2402795A3 (en) | Optical devices and silicone compositions and processes fabricating the optical devices | |
WO2006135556A3 (en) | B-stageable film, electronic device, and associated process | |
WO2009044801A1 (ja) | 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置 | |
TW200720315A (en) | Molding resin composition for optical semiconductor elements and optical semiconductor device obtained by using the same | |
WO2008153125A1 (ja) | 光半導体素子用封止剤及び光半導体素子 | |
WO2006093671A3 (en) | Method of decorating laminated glass | |
WO2010027890A3 (en) | Mainboard assembly including a package overlying a die directly attached to the mainboard | |
TW200632548A (en) | Photosensitive resin composition | |
WO2010009716A3 (de) | Strahlungsemittierende vorrichtung und verfahren zur herstellung einer strahlungsemittierenden vorrichtung | |
WO2008117619A1 (ja) | 感光性絶縁樹脂組成物 | |
WO2008012416A3 (fr) | Entite electronique a microcircuit | |
WO2007092663A3 (en) | Acrylic resin for use in fluorocarbon coating compositions and method of forming the same | |
WO2009005042A1 (ja) | 金属材料、その製造方法、及びそれを用いた電気電子部品 | |
WO2009004929A1 (ja) | 撮像装置の製造方法、撮像装置及び光学素子 | |
WO2007037858A3 (en) | Thermosetting coating compositions with multiple cure mechanisms | |
TW200613432A (en) | Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member | |
ATE440125T1 (de) | Oberflächenmodifiziertes corund sowie harzzusammensetzung | |
EP1726627A3 (en) | Process for coating a fuser member using a coating composition comprising a fluoroelastomer and a fluorinated copolymer surfactant | |
WO2015036287A3 (de) | Verfahren zum herstellen eines bauelementes | |
WO2008093808A1 (ja) | ヒートスプレッダモジュール、その製法及びヒートシンク | |
WO2009014115A1 (ja) | 電子部品用接着剤、半導体チップの積層方法及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08752799 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08752799 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |