WO2008146348A1 - 回路基板および回路基板を有する電子装置 - Google Patents

回路基板および回路基板を有する電子装置 Download PDF

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Publication number
WO2008146348A1
WO2008146348A1 PCT/JP2007/060727 JP2007060727W WO2008146348A1 WO 2008146348 A1 WO2008146348 A1 WO 2008146348A1 JP 2007060727 W JP2007060727 W JP 2007060727W WO 2008146348 A1 WO2008146348 A1 WO 2008146348A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electronic device
print area
foot print
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/060727
Other languages
English (en)
French (fr)
Inventor
Yoshiteru Ochi
Makoto Sakairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/060727 priority Critical patent/WO2008146348A1/ja
Publication of WO2008146348A1 publication Critical patent/WO2008146348A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　プリント配線板１には、部品を実装するためのフットプリント領域３が設けられ、フットプリント領域の対角線を外側へ延長した対角線延長部に穴５～８が設けられる。穴５～８は、フットプリント領域３に実装される部品が歪むことを防止する。
PCT/JP2007/060727 2007-05-25 2007-05-25 回路基板および回路基板を有する電子装置 Ceased WO2008146348A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060727 WO2008146348A1 (ja) 2007-05-25 2007-05-25 回路基板および回路基板を有する電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060727 WO2008146348A1 (ja) 2007-05-25 2007-05-25 回路基板および回路基板を有する電子装置

Publications (1)

Publication Number Publication Date
WO2008146348A1 true WO2008146348A1 (ja) 2008-12-04

Family

ID=40074635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060727 Ceased WO2008146348A1 (ja) 2007-05-25 2007-05-25 回路基板および回路基板を有する電子装置

Country Status (1)

Country Link
WO (1) WO2008146348A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228321A (ja) * 2010-04-15 2011-11-10 Furukawa Electric Co Ltd:The 基板および基板の製造方法
CN113594082A (zh) * 2021-07-28 2021-11-02 华天科技(南京)有限公司 一种用于防止单颗载具翘曲结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119107A (ja) * 1999-10-19 2001-04-27 Nec Saitama Ltd プリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119107A (ja) * 1999-10-19 2001-04-27 Nec Saitama Ltd プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228321A (ja) * 2010-04-15 2011-11-10 Furukawa Electric Co Ltd:The 基板および基板の製造方法
CN113594082A (zh) * 2021-07-28 2021-11-02 华天科技(南京)有限公司 一种用于防止单颗载具翘曲结构

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