CN113594082A - 一种用于防止单颗载具翘曲结构 - Google Patents
一种用于防止单颗载具翘曲结构 Download PDFInfo
- Publication number
- CN113594082A CN113594082A CN202110860084.6A CN202110860084A CN113594082A CN 113594082 A CN113594082 A CN 113594082A CN 202110860084 A CN202110860084 A CN 202110860084A CN 113594082 A CN113594082 A CN 113594082A
- Authority
- CN
- China
- Prior art keywords
- product
- carrier
- carrier body
- holes
- stress release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 239000000969 carrier Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 11
- 239000000047 product Substances 0.000 description 102
- 238000000034 method Methods 0.000 description 10
- 238000009434 installation Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明提供了一种用于防止单颗载具翘曲结构,通过在载具上增加若干应力释放孔,减少了载具在加热过程中的受热面积,避免了因温度不断升高后,载具本身发送翘曲形变,避免了载具在受热翘曲后导致载具与产品在轨道与真空平台所受到的额外受力使得产品从载具上崩飞,降低了产品的报废机率,减少产品被撞碎的可能性及产品加工时加工难度。
Description
技术领域
本发明涉及封装技术领域,具体为一种用于防止单颗载具翘曲结构。
背景技术
对于单颗FCBGA芯片尺寸较大的产品,一般需要通过底部填充来增加其可靠性。在底部填充过程中,需要对产品进行加热处理,来保证填充效果。由于产品需要放在单颗载具内进行加工,这就要求载具具有极好的抗形变能力,而高温是影响载具形变的重要因素之一。当载具受热变形时,首先会影响产品在加热平台上的吸真空的稳定性,从而造成产品加工过程中风险系数的提升。其次,载具受热形变后会影响产品在加热平台上的平整度,这会对产品加工所需设备技术要求大幅度提高,主要影响因素有PR识别困难、laser测量偏差较大。如果载具在加热过程中翘曲程度不断严重,点胶头会直接撞坏芯片,这样不但会导致产品报废,同时也会造成设备备件损坏。此外,受热翘曲会导致载具与产品在轨道与真空平台额外受力,产品加工结束后,破真空应力释放后,产品会从载具上崩飞,容易造成崩缺、崩角等异常。极大增加了产品报废。
发明内容
针对现有技术中载具受热后存在对产品在加热平台上的平整度,增加产品报废的问题,本发明提供一种用于防止单颗载具翘曲结构,该结构简单,使用方便,从载具减少载具受热翘曲应力方面来预防载具翘曲,从而减少产品被撞碎的可能性及产品加工时加工难度。
本发明是通过以下技术方案来实现:
一种用于防止单颗载具翘曲结构,包括载具本体;所述载具本体上设有若干产品定位孔和应力释放孔,产品通过产品定位孔放置在载具本体上,所述应力释放孔在载具本体上分散分布设置,实现在高温中减少载具本体的受热面积,降低载具本体发生翘曲现象。
优选的,若干产品定位孔与若干应力释放孔错位排布在载具本体上设置。
优选的,若干产品定位孔通过阵列方式排布在载具本体上。
优选的,若干应力释放孔通过阵列方式排布在载具本体上。
优选的,所述产品定位孔的结构与产品的安装结构对应设置。
优选的,若干应力释放孔的结构大小均相等。
优选的,应力释放孔的形状包括圆形、矩形、三角形或者梯形。
优选的,若干应力释放孔之间相邻的间距距离均相等。
优选的,载具本体上还设有若干产品位置定位柱,若干产品位置定位柱分别沿着每一个产品定位孔的边沿固定设置。
进一步的,每一个产品定位孔边沿的若干产品位置定位柱的高度均相等。
与现有技术相比,本发明具有以下有益的技术效果:
本发明提供了一种用于防止单颗载具翘曲结构,通过在载具上增加若干应力释放孔,减少了载具在加热过程中的受热面积,避免了因温度不断升高后,载具本身发送翘曲形变,避免了载具在受热翘曲后导致载具与产品在轨道与真空平台所受到的额外受力使得产品从载具上崩飞,降低了产品的报废机率,减少产品被撞碎的可能性及产品加工时加工难度。
进一步的,若干产品定位孔与若干应力释放孔错位排布在载具本体上设置,应力释放孔的放置不影响产品放置在产品定位孔内,在保证产品放置在产品定位孔内的同时利用应力释放孔降低载具发生翘曲现象。
进一步的,若干产品定位孔通过阵列方式排布在载具本体上,便于产品整齐放置在产品定位孔内。
进一步的,若干应力释放孔通过阵列方式排布在载具本体上,当载具本体在受热过程中时,可以大大减少了载具本体的受热面积,降低载具本体发生翘曲现象。
进一步的,产品定位孔的结构与产品的安装结构对应设置,便于产品安装在产品定位孔内。
进一步的,若干应力释放孔的结构大小均相等,便于使得载具本体均匀散热。
进一步的,应力释放孔的形状包括圆形、矩形、三角形或者梯形,应力释放孔根据情况而设计,减少了应力释放孔的设计局限性。
进一步的,若干应力释放孔之间相邻的间距距离均相等,便于应力释放孔均匀散热。
进一步的,载具本体上还设有若干产品位置定位柱,若干产品位置定位柱分别沿着每一个产品定位孔的边沿固定设置,产品位置定位柱对产品在载具本体的位置进行了限定,避免在工作中产品位置移动。
更进一步的,每一个产品定位孔边沿的若干产品位置定位柱的高度均相等,保证了对产品位置限定均匀性,避免因产品位置定位柱的高度不等,而使得产品在产品定位孔内位置倾斜。
附图说明
图1为本发明中一种用于防止单颗载具翘曲结构的俯视图;
图2为本发明中一种用于防止单颗载具翘曲结构的侧视图。
图中:1-载具本体;2-产品定位孔;3-产品位置定位柱;4-应力释放孔。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。
需要说明的是,本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本发明的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
下面结合附图对本发明做进一步详细描述:
参见图1,本发明一个实施例中,提供了一种用于防止单颗载具翘曲结构,该结构简单,使用方便,从载具减少载具受热翘曲应力方面来预防载具翘曲,从而减少产品被撞碎的可能性及产品加工时加工难度。
具体的,该用于防止单颗载具翘曲结构,包括载具本体1;所述载具本体1上设有若干产品定位孔2和应力释放孔4,产品通过产品定位孔2放置在载具本体1上,所述应力释放孔4在载具本体1上分散分布设置,实现在高温中减少载具本体1的受热面积,降低载具本体1发生翘曲现象。
具体的,若干产品定位孔2与若干应力释放孔4错位排布在载具本体1上设置,应力释放孔4的放置不影响产品放置在产品定位孔2内,在保证产品放置在产品定位孔内2的同时利用应力释放孔4降低载具发生翘曲现象。
具体的,若干产品定位孔2通过阵列方式排布在载具本体1上,便于产品整齐放置在产品定位孔2内。
具体的,若干应力释放孔4通过阵列方式排布在载具本体1上,当载具本体1在受热过程中时,可以大大减少了载具本体1的受热面积,降低载具本体1发生翘曲现象。
具体的,产品定位孔2的结构与产品的安装结构对应设置,便于产品安装在产品定位孔2内。
具体的,若干应力释放孔4的结构大小均相等,便于使得载具本体1均匀散热。
具体的,应力释放孔4的形状包括圆形、矩形、三角形或者梯形,应力释放孔根据情况而设计,减少了应力释放孔的设计局限性。
具体的,若干应力释放孔4之间相邻的间距距离均相等,便于应力释放孔4均匀散热。
具体的,载具本体1上还设有若干产品位置定位柱3,若干产品位置定位柱3分别沿着每一个产品定位孔2的边沿固定设置,产品位置定位柱3对产品在载具本体1的位置进行了限定,避免在工作中产品位置移动。
参见图2,每一个产品定位孔2边沿的若干产品位置定位柱3的高度均相等,保证了对产品位置限定均匀性,避免因产品位置定位柱3的高度不等,而使得产品在产品定位孔2内位置倾斜。
实施例1
载具本体1上设有若干产品定位孔2和应力释放孔4,产品通过产品定位孔2放置在载具本体1上,应力释放孔4在载具本体1上分散分布设置,其中应力释放孔4呈圆形结构,当载具本体1在高温过程中,热量通过若干圆形应力释放孔进行散失,使载具本体1的受热面积减少,降低载具本体1发生翘曲现象。
实施例2
载具本体1上设有若干产品定位孔2和应力释放孔4,产品通过产品定位孔2放置在载具本体1上,应力释放孔4在载具本体1上分散分布设置,其中应力释放孔4呈矩形结构,当载具本体1在高温过程中,热量通过若干矩形应力释放孔进行散失,使载具本体1的受热面积减少,降低载具本体1发生翘曲现象。
实施例3
载具本体1上设有若干产品定位孔2和应力释放孔4,产品通过产品定位孔2放置在载具本体1上,应力释放孔4在载具本体1上分散分布设置,其中应力释放孔4呈三角形结构,当载具本体1在高温过程中,热量通过若干三角形应力释放孔进行散失,使载具本体1的受热面积减少,降低载具本体1发生翘曲现象。
实施例4
载具本体1上设有若干产品定位孔2和应力释放孔4,产品通过产品定位孔2放置在载具本体1上,应力释放孔4在载具本体1上分散分布设置,其中应力释放孔4呈梯形结构,当载具本体1在高温过程中,热量通过若干梯形应力释放孔进行散失,使载具本体1的受热面积减少,降低载具本体1发生翘曲现象。
综上所述,本发明提供了一种用于防止单颗载具翘曲结构,通过在载具上增加若干应力释放孔,减少了载具在加热过程中的受热面积,避免了因温度不断升高后,载具本身发送翘曲形变,避免了载具在受热翘曲后导致载具与产品在轨道与真空平台所受到的额外受力使得产品从载具上崩飞,降低了产品的报废机率,减少产品被撞碎的可能性及产品加工时加工难度。
最后应当说明的是:以上实施例仅用以说明本发明的技术方案而非对其限制,尽管参照上述实施例对本发明进行了详细的说明,所属领域的普通技术人员应当理解:依然可以对本发明的具体实施方式进行修改或者等同替换,而未脱离本发明精神和范围的任何修改或者等同替换,其均应涵盖在本发明的权利要求保护范围之内。
Claims (10)
1.一种用于防止单颗载具翘曲结构,其特征在于,包括载具本体(1);所述载具本体(1)上设有若干产品定位孔(2)和应力释放孔(4),产品通过产品定位孔(2)放置在载具本体(1)上,所述应力释放孔(4)在载具本体(1)上分散分布设置,实现在高温中减少载具本体(1)的受热面积,降低载具本体(1)发生翘曲现象。
2.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,若干产品定位孔(2)与若干应力释放孔(4)错位排布在载具本体(1)上设置。
3.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,若干产品定位孔(2)通过阵列方式排布在载具本体(1)上。
4.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,若干应力释放孔(4)通过阵列方式排布在载具本体(1)上。
5.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,所述产品定位孔(2)的结构与产品的安装结构对应设置。
6.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,若干应力释放孔(4)的结构大小均相等。
7.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,所述应力释放孔(4)的形状包括圆形、矩形、三角形或者梯形。
8.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,若干应力释放孔(4)之间相邻的间距距离均相等。
9.根据权利要求1所述的一种用于防止单颗载具翘曲结构,其特征在于,所述载具本体(1)上还设有若干产品位置定位柱(3),若干产品位置定位柱(3)分别沿着每一个产品定位孔(2)的边沿固定设置。
10.根据权利要求9所述的一种用于防止单颗载具翘曲结构,其特征在于,每一个产品定位孔(2)边沿的若干产品位置定位柱(3)的高度均相等。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110860084.6A CN113594082A (zh) | 2021-07-28 | 2021-07-28 | 一种用于防止单颗载具翘曲结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110860084.6A CN113594082A (zh) | 2021-07-28 | 2021-07-28 | 一种用于防止单颗载具翘曲结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113594082A true CN113594082A (zh) | 2021-11-02 |
Family
ID=78251364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110860084.6A Pending CN113594082A (zh) | 2021-07-28 | 2021-07-28 | 一种用于防止单颗载具翘曲结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113594082A (zh) |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001119107A (ja) * | 1999-10-19 | 2001-04-27 | Nec Saitama Ltd | プリント配線板 |
TW549578U (en) * | 2002-12-31 | 2003-08-21 | Ding Zan Prec Mold Ind Co Ltd | Carrier |
KR20070051296A (ko) * | 2007-02-28 | 2007-05-17 | 스펜션 엘엘씨 | 적층형 반도체 장치용 캐리어 구성, 그 제조 방법 및적층형 반도체 장치의 제조 방법 |
WO2008146348A1 (ja) * | 2007-05-25 | 2008-12-04 | Fujitsu Limited | 回路基板および回路基板を有する電子装置 |
JP2013089853A (ja) * | 2011-10-20 | 2013-05-13 | Keihin Corp | プリント配線板 |
CN103313527A (zh) * | 2012-03-13 | 2013-09-18 | 无锡华润安盛科技有限公司 | 一种用于回流焊接的过炉治具 |
KR20140001564U (ko) * | 2012-09-06 | 2014-03-14 | 주식회사 원강테크닉스 | 반도체 패키지 제조용 보트 캐리어 |
CN207851340U (zh) * | 2018-02-09 | 2018-09-11 | 宏丞光电(厦门)有限公司 | 一种反射片 |
CN111988919A (zh) * | 2020-09-29 | 2020-11-24 | 华天科技(西安)有限公司 | 一种克服印制电路板翘曲的方法 |
US20200393624A1 (en) * | 2019-06-14 | 2020-12-17 | Cisco Technology, Inc. | Tray and clip structure for optomechanical components |
CN213240756U (zh) * | 2020-10-12 | 2021-05-18 | 康佳集团股份有限公司 | 一种灯板、背光模组及显示装置 |
CN113007616A (zh) * | 2019-12-20 | 2021-06-22 | 深圳市聚飞光电股份有限公司 | 一种pcb灯板和背光模组 |
-
2021
- 2021-07-28 CN CN202110860084.6A patent/CN113594082A/zh active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001119107A (ja) * | 1999-10-19 | 2001-04-27 | Nec Saitama Ltd | プリント配線板 |
TW549578U (en) * | 2002-12-31 | 2003-08-21 | Ding Zan Prec Mold Ind Co Ltd | Carrier |
KR20070051296A (ko) * | 2007-02-28 | 2007-05-17 | 스펜션 엘엘씨 | 적층형 반도체 장치용 캐리어 구성, 그 제조 방법 및적층형 반도체 장치의 제조 방법 |
WO2008146348A1 (ja) * | 2007-05-25 | 2008-12-04 | Fujitsu Limited | 回路基板および回路基板を有する電子装置 |
JP2013089853A (ja) * | 2011-10-20 | 2013-05-13 | Keihin Corp | プリント配線板 |
CN103313527A (zh) * | 2012-03-13 | 2013-09-18 | 无锡华润安盛科技有限公司 | 一种用于回流焊接的过炉治具 |
KR20140001564U (ko) * | 2012-09-06 | 2014-03-14 | 주식회사 원강테크닉스 | 반도체 패키지 제조용 보트 캐리어 |
CN207851340U (zh) * | 2018-02-09 | 2018-09-11 | 宏丞光电(厦门)有限公司 | 一种反射片 |
US20200393624A1 (en) * | 2019-06-14 | 2020-12-17 | Cisco Technology, Inc. | Tray and clip structure for optomechanical components |
CN113007616A (zh) * | 2019-12-20 | 2021-06-22 | 深圳市聚飞光电股份有限公司 | 一种pcb灯板和背光模组 |
CN111988919A (zh) * | 2020-09-29 | 2020-11-24 | 华天科技(西安)有限公司 | 一种克服印制电路板翘曲的方法 |
CN213240756U (zh) * | 2020-10-12 | 2021-05-18 | 康佳集团股份有限公司 | 一种灯板、背光模组及显示装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5219079A (en) | Wafer jig | |
KR101018850B1 (ko) | 고온 열처리를 위한 서셉터 플레이트 | |
US9673124B2 (en) | Device and method for localized underfill | |
CN201137597Y (zh) | 风扇固定装置 | |
US8125053B2 (en) | Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices | |
CN111788665B (zh) | 用于保护半导体晶粒的封装加强件 | |
EP3159925A1 (en) | Apparatus for plasma dicing | |
US20100129959A1 (en) | Semiconductor Chip Package Fixture | |
US20160365297A1 (en) | Tim strain mitigation in electronic modules | |
KR20130030718A (ko) | 다이 본더 및 본딩 방법 | |
CN113594082A (zh) | 一种用于防止单颗载具翘曲结构 | |
JP5536555B2 (ja) | 拡張テープ収縮装置 | |
TWI307550B (en) | Polygonal, rounded, and circular flip chip ball grid array board | |
US9957187B2 (en) | Brittle plate processing method and brittle plate processing apparatus | |
CN101201775A (zh) | 一种电路板测试夹具 | |
CN215644434U (zh) | 键合机的对准机构 | |
TWI544571B (zh) | 可重複使用的晶片承載盤及晶片承載與挑揀系統 | |
JP2817698B2 (ja) | 半導体基板の冷却装置 | |
CN206375163U (zh) | 托架装置及具有其的运输装置 | |
CN201886404U (zh) | 具有外力压迫保护机制的散热模块 | |
US11974390B2 (en) | Reduction of packaging substrate deformation | |
CN116984814B (zh) | 一种igbt模块焊接夹具 | |
US20020089041A1 (en) | Lead-frame design modification to facilitate removal of resist tape from the lead-frame | |
CN219294557U (zh) | 用于框架注塑的放片治具及框架 | |
CN212570939U (zh) | 一种机台维修晶圆防护专用治具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |