WO2008143011A1 - 薄膜センサ、薄膜センサモジュールおよび薄膜センサの製造方法 - Google Patents
薄膜センサ、薄膜センサモジュールおよび薄膜センサの製造方法 Download PDFInfo
- Publication number
- WO2008143011A1 WO2008143011A1 PCT/JP2008/058561 JP2008058561W WO2008143011A1 WO 2008143011 A1 WO2008143011 A1 WO 2008143011A1 JP 2008058561 W JP2008058561 W JP 2008058561W WO 2008143011 A1 WO2008143011 A1 WO 2008143011A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin film
- film sensor
- manufacturing
- substrate
- module
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
Abstract
[課題]複雑な製造工程を経ることなく、基板と白金製感温抵抗体との密着性に優れ、該感温抵抗体の抵抗温度係数が大きい薄膜センサを提供すること。 [解決手段]酸化アルミニウム類の単結晶からなる基板と、該基板に積層された、白金結晶からなる感温抵抗体とを有することを特徴とする薄膜センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008524885A JPWO2008143011A1 (ja) | 2007-05-11 | 2008-05-08 | 薄膜センサ、薄膜センサモジュールおよび薄膜センサの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-126774 | 2007-05-11 | ||
JP2007126774 | 2007-05-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143011A1 true WO2008143011A1 (ja) | 2008-11-27 |
Family
ID=40031723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058561 WO2008143011A1 (ja) | 2007-05-11 | 2008-05-08 | 薄膜センサ、薄膜センサモジュールおよび薄膜センサの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2008143011A1 (ja) |
WO (1) | WO2008143011A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106323493A (zh) * | 2016-08-10 | 2017-01-11 | 清华大学 | 一种温度场、热流密度场测量一体化装置及其制备方法 |
WO2020162237A1 (ja) * | 2019-02-06 | 2020-08-13 | 日東電工株式会社 | 導電フィルム、導電フィルム巻回体およびその製造方法、ならびに温度センサフィルム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63276562A (ja) * | 1987-03-06 | 1988-11-14 | Hitachi Ltd | 厚膜感熱ヘツドの製造方法 |
JPH09102590A (ja) * | 1995-10-05 | 1997-04-15 | Ricoh Co Ltd | 薄膜キャパシタ |
JPH11260609A (ja) * | 1998-02-12 | 1999-09-24 | Guanglei Science Technol Co Ltd | 白金抵抗温度計の検出素子の製造方法及びその方法で製造された検出素子 |
JP2001291607A (ja) * | 2000-04-04 | 2001-10-19 | Mitsui Mining & Smelting Co Ltd | 白金薄膜抵抗体の製造方法 |
JP2003104794A (ja) * | 2001-09-28 | 2003-04-09 | Murata Mfg Co Ltd | ZnO膜及びその製造方法並びに発光素子 |
-
2008
- 2008-05-08 WO PCT/JP2008/058561 patent/WO2008143011A1/ja active Application Filing
- 2008-05-08 JP JP2008524885A patent/JPWO2008143011A1/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63276562A (ja) * | 1987-03-06 | 1988-11-14 | Hitachi Ltd | 厚膜感熱ヘツドの製造方法 |
JPH09102590A (ja) * | 1995-10-05 | 1997-04-15 | Ricoh Co Ltd | 薄膜キャパシタ |
JPH11260609A (ja) * | 1998-02-12 | 1999-09-24 | Guanglei Science Technol Co Ltd | 白金抵抗温度計の検出素子の製造方法及びその方法で製造された検出素子 |
JP2001291607A (ja) * | 2000-04-04 | 2001-10-19 | Mitsui Mining & Smelting Co Ltd | 白金薄膜抵抗体の製造方法 |
JP2003104794A (ja) * | 2001-09-28 | 2003-04-09 | Murata Mfg Co Ltd | ZnO膜及びその製造方法並びに発光素子 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106323493A (zh) * | 2016-08-10 | 2017-01-11 | 清华大学 | 一种温度场、热流密度场测量一体化装置及其制备方法 |
CN106323493B (zh) * | 2016-08-10 | 2020-05-22 | 清华大学 | 一种温度场、热流密度场测量一体化装置及其制备方法 |
WO2020162237A1 (ja) * | 2019-02-06 | 2020-08-13 | 日東電工株式会社 | 導電フィルム、導電フィルム巻回体およびその製造方法、ならびに温度センサフィルム |
JP2020126033A (ja) * | 2019-02-06 | 2020-08-20 | 日東電工株式会社 | 導電フィルム、導電フィルム巻回体およびその製造方法、ならびに温度センサフィルム |
JP7373284B2 (ja) | 2019-02-06 | 2023-11-02 | 日東電工株式会社 | 導電フィルム、導電フィルム巻回体およびその製造方法、ならびに温度センサフィルム |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008143011A1 (ja) | 2010-08-05 |
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