WO2008139955A1 - Projecting exposure method, alignment method and projecting exposure device - Google Patents

Projecting exposure method, alignment method and projecting exposure device Download PDF

Info

Publication number
WO2008139955A1
WO2008139955A1 PCT/JP2008/058366 JP2008058366W WO2008139955A1 WO 2008139955 A1 WO2008139955 A1 WO 2008139955A1 JP 2008058366 W JP2008058366 W JP 2008058366W WO 2008139955 A1 WO2008139955 A1 WO 2008139955A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
projecting exposure
exposure
projecting
error
Prior art date
Application number
PCT/JP2008/058366
Other languages
French (fr)
Japanese (ja)
Inventor
Ichiyo Kotani
Original Assignee
Mejiro Precision, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2007/059466 external-priority patent/WO2007129688A1/en
Application filed by Mejiro Precision, Inc. filed Critical Mejiro Precision, Inc.
Priority to JP2009514111A priority Critical patent/JPWO2008139955A1/en
Publication of WO2008139955A1 publication Critical patent/WO2008139955A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A projecting exposure device and a projecting exposure method are provided for making it possible to set a substrate at a proper position without using a position measurement device such as an interferometer to measure a position of a stage. Further, a projecting exposure device and a projecting exposure method are provided for making it possible to carry out a high speed accurate alignment even for a printed circuit board with a large non-linear error. Based on a position of a standard substrate mark formed at the standard substrate, an arithmetic operation for table position correcting data to correct a position error of the table is carried out and, based on the table position correcting data and an exposure substrate standard mark formed at an exposure substrate, an arithmetic operation for linear error correcting data to correct a linear component error of a position of the exposure standard substrate mark is carried out by using a least-squares method.
PCT/JP2008/058366 2007-05-07 2008-05-01 Projecting exposure method, alignment method and projecting exposure device WO2008139955A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009514111A JPWO2008139955A1 (en) 2007-05-07 2008-05-01 Projection exposure method, alignment method, and projection exposure apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/059466 WO2007129688A1 (en) 2006-05-10 2007-05-07 Projection exposure device and projection exposure method
JPPCT/JP2007/059466 2007-05-07

Publications (1)

Publication Number Publication Date
WO2008139955A1 true WO2008139955A1 (en) 2008-11-20

Family

ID=40003089

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058366 WO2008139955A1 (en) 2007-05-07 2008-05-01 Projecting exposure method, alignment method and projecting exposure device

Country Status (2)

Country Link
JP (1) JPWO2008139955A1 (en)
WO (1) WO2008139955A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038759A (en) * 2010-08-03 2012-02-23 Hitachi High-Technologies Corp Exposure apparatus and exposure method, and display panel substrate manufacturing apparatus and display panel substrate manufacturing method
JP2016090444A (en) * 2014-11-06 2016-05-23 キヤノン株式会社 Measurement device, lithography device, and article manufacturing method
CN111694220A (en) * 2019-03-11 2020-09-22 苏州微影激光技术有限公司 Synchronous method for scanning type laser direct imaging
US10824071B2 (en) 2018-10-08 2020-11-03 Samsung Electronics Co., Ltd. Method of exposing a semiconductor structure, apparatus for controlling a lithography process performed by a lithography apparatus across a semiconductor structure, non-transitory computer readable medium having instructions stored thereon for generating a weight function

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982615A (en) * 1995-09-19 1997-03-28 Ushio Inc Method and device for alignment of mask and work
JPH09330862A (en) * 1996-06-07 1997-12-22 Nikon Corp Method for adjusting aligner
JPH1022190A (en) * 1996-06-28 1998-01-23 Nikon Corp Method for correcting alignment error in aligner and aligner using it
JP2002353121A (en) * 2001-05-28 2002-12-06 Nikon Corp Exposure method and device-manufacturing method
JP2005311145A (en) * 2004-04-23 2005-11-04 Canon Inc Aligner, exposure method, device manufacturing method, pattern forming device, and aligning method
JP2006285144A (en) * 2005-04-05 2006-10-19 Sharp Corp Exposure device and exposure control method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982615A (en) * 1995-09-19 1997-03-28 Ushio Inc Method and device for alignment of mask and work
JPH09330862A (en) * 1996-06-07 1997-12-22 Nikon Corp Method for adjusting aligner
JPH1022190A (en) * 1996-06-28 1998-01-23 Nikon Corp Method for correcting alignment error in aligner and aligner using it
JP2002353121A (en) * 2001-05-28 2002-12-06 Nikon Corp Exposure method and device-manufacturing method
JP2005311145A (en) * 2004-04-23 2005-11-04 Canon Inc Aligner, exposure method, device manufacturing method, pattern forming device, and aligning method
JP2006285144A (en) * 2005-04-05 2006-10-19 Sharp Corp Exposure device and exposure control method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038759A (en) * 2010-08-03 2012-02-23 Hitachi High-Technologies Corp Exposure apparatus and exposure method, and display panel substrate manufacturing apparatus and display panel substrate manufacturing method
JP2016090444A (en) * 2014-11-06 2016-05-23 キヤノン株式会社 Measurement device, lithography device, and article manufacturing method
US10824071B2 (en) 2018-10-08 2020-11-03 Samsung Electronics Co., Ltd. Method of exposing a semiconductor structure, apparatus for controlling a lithography process performed by a lithography apparatus across a semiconductor structure, non-transitory computer readable medium having instructions stored thereon for generating a weight function
CN111694220A (en) * 2019-03-11 2020-09-22 苏州微影激光技术有限公司 Synchronous method for scanning type laser direct imaging

Also Published As

Publication number Publication date
JPWO2008139955A1 (en) 2010-08-05

Similar Documents

Publication Publication Date Title
WO2013178404A3 (en) A method to determine the usefulness of alignment marks to correct overlay, and a combination of a lithographic apparatus and an overlay measurement system
TW200738379A (en) Boring method and boring device
WO2007123249A3 (en) Alignment method, imprint method, alignment apparatus, and position measurement method
WO2006078068A3 (en) Electronic component mounting system and electronic component mounting method
EP1806773A4 (en) Exposure device, exposure method, and device manufacturing method
TW200735177A (en) Writing method and writing apparatus of charged particle beam, positional deviation measuring method, and position measuring apparatus
ATE557576T1 (en) CIRCUIT BOARD WITH ELECTRONIC COMPONENT
DK2218315T3 (en) Device and method for mounting printed circuit boards with contact pins
EP2765458A3 (en) Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
TW200707133A (en) Lithographic apparatus and positioning apparatus
MY147294A (en) A method and device for aligning components
WO2008139955A1 (en) Projecting exposure method, alignment method and projecting exposure device
WO2006088113A3 (en) Electronic component mounting system and electronic component mounting method
EP2458441A3 (en) Measuring method, apparatus and substrate
SG11201902847PA (en) Optical measurement device and method
ATE528871T1 (en) COHERENT OPTICAL DIGITAL RECEIVER
ATE496977T1 (en) TOPCOAT COMPOSITION, ALKALINE DEVELOPER SOLUBLE TOPCOAT FILM COMPRISING THE COMPOSITION AND PATTERN FORMING METHOD USING THERETO
TW200625016A (en) Lithographic apparatus and device manufacturing method
TW200643659A (en) Device for aligning substrate with mask and method using the same
WO2008116743A8 (en) A method and apparatus for generating a model of an object
JP2002524884A (en) Method and apparatus for calibrating the moving distance and / or angular position of a holding device provided in a manufacturing apparatus for an electrical component group, and a calibration substrate
TW200834247A (en) Lamination apparatus of liquid crystal panel and lamination method of lamination of a liquid crystal panel
SG11201808608UA (en) Projection exposure apparatus and method
MX2018006367A (en) Method for correcting printing misalignment in printing apparatus.
TW200641329A (en) Overlay measurement apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08741000

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009514111

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08741000

Country of ref document: EP

Kind code of ref document: A1