WO2008127282A3 - Composition et procédé associé - Google Patents
Composition et procédé associé Download PDFInfo
- Publication number
- WO2008127282A3 WO2008127282A3 PCT/US2007/021442 US2007021442W WO2008127282A3 WO 2008127282 A3 WO2008127282 A3 WO 2008127282A3 US 2007021442 W US2007021442 W US 2007021442W WO 2008127282 A3 WO2008127282 A3 WO 2008127282A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- metal
- decomposition product
- thermally conductive
- associated method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0547—Nanofibres or nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0551—Flake form nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0553—Complex form nanoparticles, e.g. prism, pyramid, octahedron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2865—Adhesive compositions including monomer or polymer of carbohydrate [e.g., starch, dextrin, etc.] Or protein [e.g., casein, animal protein, etc.] Or derivative thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Composite Materials (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
L'invention concerne une composition comprenant un produit de décomposition d'un précurseur de métal. Le précurseur de métal peut comprendre un carbamate et un ou plusieurs métaux choisis dans le groupe consistant en l'argent, l'or, le cuivre et le zinc. Le produit de décomposition peut comprendre une nanoparticule de métal. La nanoparticule de métal peut être présente en une quantité qui est suffisante pour rendre la composition électriquement conductrice, thermiquement conductrice ou à la fois électriquement et thermiquement conductrice. Un article et un procédé associés sont proposés.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/539,411 US20080085410A1 (en) | 2006-10-06 | 2006-10-06 | Composition and associated method |
US11/539,411 | 2006-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008127282A2 WO2008127282A2 (fr) | 2008-10-23 |
WO2008127282A3 true WO2008127282A3 (fr) | 2009-04-16 |
Family
ID=39301792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/021442 WO2008127282A2 (fr) | 2006-10-06 | 2007-10-05 | Composition et procédé associé |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080085410A1 (fr) |
WO (1) | WO2008127282A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105728714A (zh) * | 2014-12-12 | 2016-07-06 | 施耐德电气工业公司 | 银-金属氧化物电触头材料的制备方法、装置以及应用 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7632425B1 (en) * | 2006-10-06 | 2009-12-15 | General Electric Company | Composition and associated method |
JP2008205430A (ja) * | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
US7763187B1 (en) * | 2007-08-23 | 2010-07-27 | Oceanit Laboratories, Inc. | Carbon nanotubes-reinforced conductive silver ink |
JP5504467B2 (ja) * | 2008-03-25 | 2014-05-28 | 独立行政法人理化学研究所 | 3次元ナノ金属構造体の光還元加工法 |
US7789935B2 (en) | 2008-05-23 | 2010-09-07 | Xerox Corporation | Photochemical synthesis of metallic nanoparticles for ink applications |
US8906984B2 (en) * | 2008-08-07 | 2014-12-09 | William Marsh Rice University | Synthesis of metal and metal oxide nanoparticle-embedded siloxane composites |
US9153354B2 (en) * | 2009-11-20 | 2015-10-06 | 3M Innovative Properties Company | Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making |
US8647535B2 (en) * | 2011-01-07 | 2014-02-11 | International Business Machines Corporation | Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates |
JP5704049B2 (ja) * | 2011-10-13 | 2015-04-22 | 信越化学工業株式会社 | 導電性回路形成方法 |
US9950393B2 (en) * | 2011-12-23 | 2018-04-24 | Intel Corporation | Hybrid low metal loading flux |
EP2930722B1 (fr) * | 2012-12-07 | 2019-03-20 | FUJIFILM Corporation | Processus de fabrication d'un film conducteur et carte à câblage imprimé |
US9224412B2 (en) * | 2014-01-31 | 2015-12-29 | HGST Netherlands B.V. | Perpendicular magnetic recording disk with template layer formed of a blend of nanoparticles |
EP3073321A1 (fr) | 2015-03-26 | 2016-09-28 | Centre National de la Recherche Scientifique (C.N.R.S.) | Matériau composite métal-polymère |
KR20180031635A (ko) * | 2015-05-20 | 2018-03-28 | 국립대학법인 야마가타대학 | 은나노 입자 분산체의 제조 방법 및 은나노 입자 잉크의 제조 방법 |
CN105798324B (zh) * | 2016-03-21 | 2017-11-10 | 中山大学 | 一种基于自组装结构模拟酶及其制备方法与应用 |
CN105772705A (zh) * | 2016-03-22 | 2016-07-20 | 苏州捷德瑞精密机械有限公司 | 一种导电银粉及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040191423A1 (en) * | 2000-04-28 | 2004-09-30 | Ruan Hai Xiong | Methods for the deposition of silver and silver oxide films and patterned films |
WO2006076611A2 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production de nanoparticules metalliques |
WO2006083153A1 (fr) * | 2005-02-07 | 2006-08-10 | Inktec Co., Ltd. | Complexes contenant de l'argent organique, procedes de preparation associes et procedes pour former des couches minces |
US20060192183A1 (en) * | 2005-02-28 | 2006-08-31 | Andreas Klyszcz | Metal ink, method of preparing the metal ink, substrate for display, and method of manufacturing the substrate |
WO2006093398A1 (fr) * | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Encres conductrices et procede de fabrication |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6262129B1 (en) * | 1998-07-31 | 2001-07-17 | International Business Machines Corporation | Method for producing nanoparticles of transition metals |
CA2430253C (fr) * | 2000-12-15 | 2011-04-26 | The Arizona Board Of Regents | Procede permettant de realiser le moirage d'un metal a l'aide de precurseurs contenant des nanoparticules |
US7629017B2 (en) * | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
US20060001726A1 (en) * | 2001-10-05 | 2006-01-05 | Cabot Corporation | Printable conductive features and processes for making same |
AU2002363192A1 (en) * | 2001-11-01 | 2003-05-12 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Ink-jet inks containing metal nanoparticles |
DE60334295D1 (de) * | 2002-05-23 | 2010-11-04 | 3M Innovative Properties Co | Elektronische baugruppe und verfahren zur herstellung einer elektronischen baugruppe |
US20050008861A1 (en) * | 2003-07-08 | 2005-01-13 | Nanoproducts Corporation | Silver comprising nanoparticles and related nanotechnology |
BRPI0416114A (pt) * | 2003-10-30 | 2007-01-02 | Mcneil Ppc Inc | materiais compósitos compreendendo nanopartìculas carregadas com metal |
KR101216904B1 (ko) * | 2004-06-07 | 2012-12-28 | 바텔리 메모리얼 인스티튜트 | 비 수성 폴리머 용액 내의 나노입자의 합성 및 그 제조물 |
US7329301B2 (en) * | 2004-09-29 | 2008-02-12 | Eastman Kodak Company | Silver nanoparticles made in solvent |
-
2006
- 2006-10-06 US US11/539,411 patent/US20080085410A1/en not_active Abandoned
-
2007
- 2007-10-05 WO PCT/US2007/021442 patent/WO2008127282A2/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040191423A1 (en) * | 2000-04-28 | 2004-09-30 | Ruan Hai Xiong | Methods for the deposition of silver and silver oxide films and patterned films |
WO2006076611A2 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production de nanoparticules metalliques |
WO2006083153A1 (fr) * | 2005-02-07 | 2006-08-10 | Inktec Co., Ltd. | Complexes contenant de l'argent organique, procedes de preparation associes et procedes pour former des couches minces |
US20060192183A1 (en) * | 2005-02-28 | 2006-08-31 | Andreas Klyszcz | Metal ink, method of preparing the metal ink, substrate for display, and method of manufacturing the substrate |
WO2006093398A1 (fr) * | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Encres conductrices et procede de fabrication |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105728714A (zh) * | 2014-12-12 | 2016-07-06 | 施耐德电气工业公司 | 银-金属氧化物电触头材料的制备方法、装置以及应用 |
CN105728714B (zh) * | 2014-12-12 | 2018-12-04 | 施耐德电气工业公司 | 银-金属氧化物电触头材料的制备方法、装置以及应用 |
Also Published As
Publication number | Publication date |
---|---|
US20080085410A1 (en) | 2008-04-10 |
WO2008127282A2 (fr) | 2008-10-23 |
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