WO2008123669A1

WO2008123669A1 - Barrier rib composition for plasma display panel and plasma display panel including the same

Info

Publication number: WO2008123669A1
Application number: PCT/KR2008/001766
Authority: WO
Inventors: Woong Choi; Euntae Lee
Original assignee: Lg Electronics Inc.
Priority date: 2007-04-04
Filing date: 2008-03-28
Publication date: 2008-10-16

Abstract

A barrier rib composition for a plasma display panel and a plasma display panel including the same are disclosed. The barrier rib composition includes about 30 to 61 parts by weight of ZnO, about 20 to 40 parts by weight of B 2O3, and about 5 to 20 parts by weight of P2O5.

Description

BARRIER RIB COMPOSITION FOR PLASMA DISPLAY PANEL AND PLASMA DISPLAY PANEL INCLUDING THE SAME

Technical Field

[1] An exemplary embodment relates to a display apparatus, and more particularly, to a barrier rib composition for a plasma display panel and a plasma display panel including the barrier rib composition. Background Art

[2] A plasma display panel has generally the structure in which barrier ribs formed between a front substrate and a rear substrate form unit discharge cell or discharge cells. Each discharge cell is filled with an inert gas containing a main discharge gas such as neon (Ne), helium (He) or a mixture of Ne and He, and a small amount of xenon (Xe).

[3] When the plasma display panel is discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays, which thereby cause phosphors formed between the barrier ribs to emit light, thus displaying an image. Since the plasma display panel can be manufactured to be thin and large and also can provide the greatly improved image quality by the recently technological development, it has attracted attention as a next generation display device.

[4] A sandblast method and a wet chemical etching method have been mainly used to form the barrier rib on the rear substrate. In the sandblast method, a colored material is coated on a glass substrate with a predetermined thickness, and then dried. Next, a mask with a sandblasting resistance is formed thereon in the form of a pattern, and then a sandblasting process is performed on the mask pattern to remove the remaining portion except the barrier rib from the mask pattern. The barrier rib structure is fired to form the barrier rib.

[5] In the wet chemical etching method, a two-colored material is coated on a glass substrate and then fired at a high temperature higher than 500 ⁰C. Next, an add resistance mask pattern is formed, and then the add resistance mask pattern is selectively etched using an acid-based liquid composition to form the barrier rib.

[6] In addition to the sandblast method and the wet chemical etching method, a screen printing method, an additive method, a molding method, and so on, may be used to form the barrier rib. Disclosure of Invention Technical Problem

[7] A barrier rib material used to form the barrier rib has mainly used a paste obtained by mixing a glass powder containing more than 50 wt% of PbO with an organic material. However, it is known that PbO is harmful to the human body and the environment. Accordingly, an additional environment equipment is necessary to manufacture and use the glass powder, thereby reducing the process effidency and increasing the manufacturing cost.

[8] Because an etch rate of the existing glass powder for barrier rib including PbO is low, an etching method that adjusts an inclination and a shape of the barrier rib by forming, firing, and etching a barrier rib layer of two or more layers is lower than a process for forming a barrier rib layer using a single layer in the manufacturing cost and the efficiency. When a barrier rib material of which the etch rate is reduced is used, an acid-based composition of a high concentration has to be used in a chemical etching process. However, the acid-based composition of a high concentration is harmful to the environment.

[9] Up to now, a glass composition containing a large amount of PbO has been used in the application of most of electronic parts for a long time. The glass composition containing PbO has been widely used in the electronic parts because of its high refraction index and low melting point. However, the use of PbO causing environmental problems has been on the rise as a problem which has to be urgently solved. Technical Solution

[10] An exemplary embodiment provides an environmentally-friendly plasma display panel using a barrier rib composition not including PbQ

[11] In one aspect, a barrier rib composition for a plasma display panel comprises about

30 to 61 parts by weight of ZnO, about 20 to 40 parts by weight of B ₂O₃, and about 5 to 20 parts by weight of P ₂O₅.

[12] In another aspect, a plasma display panel comprises a front substrate, a rear substrate positioned opposite the front substrate, and a barrier rib positioned between the front substrate and the rear substrate, the barrier rib including about 30 to 61 parts by weight of ZnO, about 20 to 40 parts by weight of B ₂O₃, and about 5 to 20 parts by weight of P ₂ O₅. Advantageous Effects

[13] Because the plasma display panel according to the exemplary embodiment includes the barrier rib not inducing PbO, the environmentally-friendly plasma display panel capable of representing the characteristics similar to the barrier rib inducing PbO can be provided.

[14] Further, because the barrier rib according to the exemplary embodment has the permittivity lower than the permittivity of the related art barrier rib including Pb, the plasma display panel with the excellent power consumption can be provided. Brief Description of the Drawings

[15] FIG. 1 shows a plasma display panel according to an exemplary embodiment; and

[16] FIGs. 2 to 4 show processes for manufacturing a barrier rib of the plasma display panel according to the exemplary embodiment. Best Mode for Carrying Out the Invention

[17] Reference will now be made in detail embodiments of the invention examples of which are illustrated in the accompanying drawings.

[18] FIG. 1 shows a plasma display panel according to an exemplary embodiment.

[19] As shown in FIG. 1, the plasma display panel according to the exemplary embodiment includes a front panel 100 and a rear panel 110 which are positioned parallel to each other at a given distance therebetween. The front panel 100 includes a front substrate 101 on which a plurality of scan electrodes 102 and a plurality of sustain electrodes 103 are formed. The rear panel 110 includes a rear substrate 111 on which a plurality of address electrodes 113 are formed to intersect the scan electrodes 102 and the sustain electrodes 103.

[20] The scan electrode 102 and the sustain electrode 103 generate a mutual discharge therebetween in one discharge cell and maintain light-emissions of discharge cells. More specifically, the scan electrode 102 and the sustain electrode 103 may each include transparent electrodes 102a and 103a made of a transparent indium-tin-oxide (ITO) material and bus electrodes 102b and 103b made of an opaque metal material.

[21] The scan electrode 102 and the sustain electrode 103 are covered with an upper dielectric layer 104 for limiting a discharge current of the scan electrode 102 and the sustain electrode 103 and providing insulation between the scan electrode 102 and the sustain electrode 103. A protective layer 105 with a deposit of MgO may be positioned on the upper dielectric layer 104 to facilitate discharge concMons.

[22] The rear panel 110 may include a plurality of stripe-type or well- type barrier ribs 112 for partitioning a plurality of discharge spaces (i.e., a plurality of discharge cells).

[23] Red (R), green (G), and blue (ζ) phosphors 114 for emitting viable light for an image display during the generation of an address discharge are positioned inside the discharge cells partitioned by the barrier ribs 112.

[24] A lower dielectric layer 115 is formed between the address electrodes 113 and the phosphors 114 to protect the address electrodes 113.

[25] Although FIG. 1 has shown and described the case where the upper dielectric layer

104 and the lower dielectric layer 115 are formed on the front substrate 101 and the rear substrate 111, respectively, the exemplary embodiment is not limited thereto. For instance, the upper dielectric layer 104 and the lower dielectric layer 115 may be formed on the rear substrate 111 and the front substrate 101, respectively.

[26] FIG. 1 has shown and described only an example of the plasma display panel, and thus the exemplary embodiment is not limited to the structure of the plasma display panel illustrated in FIG. 1. For instance, although the plasma display panel illustrated in FIG. 1 includes the scan electrode 102, the sustain electrode 103, and the address electrode 113, at least one of the scan electrode 102, the sustain electrode 103 or the address electrode 113 may be omitted.

[27] Although FIG. 1 has shown and described the case where the barrier rib 112 for partitioning the discharge cell is formed on the rear substrate 111, the exemplary embodiment is not limited thereto. For instance, the barrier rib 112 may be formed on the front substrate 101, or both the front substrate 101 and the rear substrate 111.

[28] In other words, the structure of the plasma display panel according to the exemplary embodiment may be variously changed, as long as the barrier rib 112 is formed between the front substrate 101 and the rear substrate 111 and the barrier rib 112 is formed using a barrier rib material not including PbQ

[29] A barrier rib composition for the plasma display panel according to the exemplary embodiment will be described in detail below.

[30] The barrier rib composition for the plasma display panel according to the exemplary embodiment does not include PbO, and is a lead-free glass composition including ZnO, B₂O₃, and P₂O₅ as a principal component.

[31] The barrier rib composition includes ZnO, B ₂O₃, and P₂O₅ as a principal component and may further include at least one selected from the group consisting of BaO, CaO, and SiO₂.

[32] The barrier rib composition may further include at least one selected from the group conasting of Al ₂O₃, NaO, and LiO₂ as an additive.

[33] The barrier rib composition may include about 30 to 61 parts by weight of ZnQ ZnO serves as a glass modfier. ZnO lowers a glass transition temperature, a permittivity, a thermal expansion coeffident, and a gelation level of the barrier rib, and improves an etch rate of the barrier rib.

[34] Accordingly, when a ZnO content is equal to or more than 30 parts by weight based on total weight of the barrier rib composition, the etch rate can be improved. When the ZnO content is equal to or less than 61 parts by weight based on total weight of the barrier rib composition, a loss of a function of the barrier rib can be prevented because the permittivity of the barrier rib is lowered.

[35] The barrier rib composition may include about 20 to 40 parts by weight of B ₂O₃. B₂O

3 is a light-colored glass former. B ₂O₃ raise a glass transition temperature of the barrier rib, lowers a thermal expansion coeffident of the barrier rib, and raise an etch rate and a gelation level of the barrier rib.

[36] Accordingly, when a B ₂O₃ content is equal to or more than 20 parts by weight based on total weight of the barrier rib composition, the etch rate can be improved. When the B₂O₃ content is equal to or less than 40 parts by weight based on total weight of the barrier rib composition, an excessive rise in the glass transition temperature can be prevented.

[37] The barrier rib composition may include about 5 to 20 parts by weight of P ₂O₅. P₂O₅ is a light-colored glass former. P ₂O₅ slightly raise a glass transition temperature and an etch rate of the barrier rib, lowers a permittivity of the barrier rib, and slightly lowers a thermal expansion coeffident and a gelation level of the barrier rib.

[38] Accordingly, when a P₂O₅ content is equal to or more than 5 parts by weight based on total weight of the barrier rib composition, the etch rate can be improved. When the P₂O₅ content is equal to or less than 20 parts by weight based on total weight of the barrier rib composition, a fall in the permittivity can be prevented.

[39] As above, the barrier rib composition according to the exemplary embodiment may include ZnO, B₂O₃, and P₂O₅.

[40] The barrier rib composition may further include BaQ A BaO content may be more than 0 and equal to or less than about 30 parts by weight. BaO is a dark-colored glass modifier. BaO lowers a glass transition temperature of the barrier rib, and raises an etch rate, a permittivity, a thermal expansion coeffident, and a gelation level of the barrier rib.

[41] Accordingly, when the BaO content is more than 0 based on total weight of the barrier rib composition, the etch rate can be improved. When the BaO content is equal to or less than 30 parts by weight based on total weight of the barrier rib composition, a reduction in the form stability of the barrier rib can be prevented because the thermal expansion coeffident increases.

[42] The barrier rib composition may further include CaQ A CaO content may be more than 0 and equal to or less than about 18 parts by weight. The CaO is a light-colored glass modfier. CaO slightly raises a glass transition temperature of the barrier rib, slightly lowers a thermal expansion coeffident of the barrier rib, and lowers an etch rate and a gelation level of the barrier rib.

[43] Accordingly, when the CaO content is more than 0 based on total weight of the barrier rib composition, a reduction in the form stability of the barrier rib can be prevented because the thermal expansion coeffident increases. When the CaO content is equal to or less than 18 parts by weight based on total weight of the barrier rib composition, a reduction in the etch rate can be prevented.

[44] The barrier rib composition may further include SiO ₂. A SiO₂ content may be more than O and equal to or less than about 5 parts by weight. SiO₂ is a light-colored glass former. SiO₂ raises a glass transition temperature of the barrier rib, sharply lowers a thermal expansion coeffident and an etch rate of the barrier rib, and lowers a gelation level of the barrier rib.

[45] Accordingly, when the SiO₂ content is more than O based on total weight of the barrier rib composition, the reliability of the barrier rib can be improved because the barrier rib has the proper glass transition temperature. When the SiO ₂ content is equal to or less than 5 parts by weight based on total weight of the barrier rib composition, an excessive rise in the glass transition temperature and a sharp fall in the etch rate can be prevented.

[46] The barrier rib composition may further include an additive. Examples of the additive include Al ₂O₃, NaO, and LiO₂. A sum of a content of at least one selected from the group conssting of Al ₂O₃, NaO, and LiO₂ may be more than O and equal to or less than about 5 parts by weight.

[47] Al₂O₃ is a white glass stabilization agent. Al ₂O₃ may raise a glass transition temperature and a permittivity of the barrier rib, and may lower a thermal expansion coeffident, an etch rate, and a gelation frequency of the barrier rib.

[48] NaO and LiO₂ are a yellow glass modifier. NaO and LiO ₂ can control a firing temperature by lowering a glass transition temperature of the barrier rib, and can raise a permittivity, a thermal expansion coeffident, and an etch rate of the barrier rib.

[49] Accordingly, when the sum of a content of at least one selected from the group conasting of Al ₂O₃, NaO, and LiO₂ is more than O based on total weight of the barrier rib composition, a reduction in the permittivity can be prevented. When the sum of a content of at least one selected from the group conssting of Al ₂O₃, NaO, and LiO₂ is equal to or more than 5 parts by weight based on total weight of the barrier rib composition, a firing process can be easily performed due to a proper glass transition temperature.

[50] Accordingly, the barrier rib composition according to the exemplary embodiment may include ZnO, B₂O₃, and P₂O₅, and may further include BaO, CaO, and SiO₂. In addition to these, the barrier rib composition according to the exemplary embodiment may further include Al₂O₃, NaO, and LiO₂ as an additive.

[51] A method of manufacturing the above-described barrier rib composition according to the exemplary embodiment will be described below.

[52] The barrier rib composition can be manufactured using a general process for manufacturing a glass powder. More specifically, about 30 to 61 parts by weight of ZnO, about 20 to 40 parts by weight of B ₂O₃, about 5 to 20 parts by weight of P ₂O₅, about up to 30 parts by weight of BaO, about up to 18 parts by weight of CaO, about up to 5 parts by weight of SiO₂, and at least one selected from the group conasting of Al ₂O₃, NaO, and LiO₂, of which a sum of a content is about more than 0 and equal to or less than 5 parts by weight, are provided and are mixed with one another. Then, the mixture is melted at a temperature of about 1000 to 1,500 ⁰C for about 10 to 60 minutes, and thus can uniformly mixed in a melting state.

[53] The melted mixture is rapidly cooled and then ground. The rapid cooling process may be performed in a dry or wet manner, and water may be used in the wet manner. After the rapid cooling process, the grinding process may be performed in a dry or wet manner, and water or an organic solvent may be used in the wet grinding process.

[54] Examples of the organic solvent include ethanol, methanol, ethyl acetate, toluene or isopropyl alcohol. Water or the organic solvent may be used independently, and may be mixed with each other. A gelation level of the barrier rib powder and a color of the barrier rib powder after firing the barrier rib powder can be controlled depending on kinds of the organic solvent.

[55] The ground barrier rib powder is filtered, dried, and disintegrated to manufacture a barrier rib powder having a small particle diameter, for example, a particle diameter of 0.1 to 10 μm.

[56] A method of manufacturing the barrier rib of the plasma display panel according to the exemplary embodiment using the barrier rib powder thus manufactured will be described below with reference to FIGs. 2 to 4.

[57] FIGs. 2 to 4 show processes for manufacturing a barrier rib of the plasma display panel according to the exemplary embodment.

[58] As shown in FIG. 2, a barrier rib paste 20 is coated on the rear substrate 111, on which the lower dielectric layer 115 is formed, as high as 150 μm to 200 μm.

[59] The barrier rib paste 20 may be formed by mixing the barrier rib powder, a binder, and an organic solvent. The barrier rib powder, as described above, may be obtained by mixing, melting, rapidly cooling, filtering, drying, and disintegrating the barrier rib composition including about 30 to 61 parts by weight of ZnO, about 20 to 40 parts by weight of B ₂O₃, about 5 to 20 parts by weight of P₂O₅, about up to 30 parts by weight of BaO, about up to 18 parts by weight of CaO, about up to 5 parts by weight of SiO ₂, and at least one selected from the group consisting of Al ₂O₃, NaO, and LiO₂, of which a sum of a content is about more than 0 and equal to or less than 5 parts by weight.

[60] The binder may use a general binder used to manufacture the barrier rib. For instance, at least one polymer resin of acrylic-based resin, epoxy-based resin, or ethyl cellulose-based resin may be used.

[61] The organic solvent may use a general organic solvent used to manufacture the barrier rib. For instance, at least one of butyl cellosolve (BC), butyl carbitol acetate (BCA), terpineol (TP) or texanol may be used.

[62] A filler may be additionally mixed with the barrier rib paste 20. For instance, CrO,

CuO, MgO, Al₂O₃, ZnO, TiO₂, 3Al₂O₃SiO₂ may be used as the filler.

[63] As shown in FIG. 2, a photosensitive material 21 is coated on the barrier rib paste 20.

Then, an exposure process and a development process are performed on the barrier rib paste 20 coated with the photosensitive material 21 using a mask 22 to form a photosensitive material pattern 21.

[64] As shown in FIGs. 3 and 4, nitric acid as an etchant is injected into the photosensitive material pattern 21, and then the barrier rib paste 20 of an area where the photosensitive material pattern 21 is not formed is removed. Next, the photosensitive material pattern 21 is removed to form the barrier rib.

[65] The exemplary embodiment has described the case where the barrier rib is formed using a wet etching method using acid such as nitric acid, hydrochloric acid, sulfuric add, or fluoric add. However, a sandblast method may be used to form the barrier rib. In the sandblast method, a colored material is coated on a glass substrate with a predetermined thickness and then dried. Next, a mask with a sandblasting resistance is formed thereon in the form of a pattern, and then a sandblasting process is performed on the mask pattern to form the barrier rib. Mode for the Invention

[66] Various experimental examples of a method of manufacturing the barrier rib of the plasma display panel will be described below. The following experimental examples are only one example of the exemplary embodiment, and thus the exemplary embodiment is not limited thereto.

[67] Experimental example 1>

[68] ZnO of 61g, B₂O₃ of 25g, P₂O₅ of 8.9g, and SiO₂ of 2.5g were mixed with one another, and the mixture was melted in a furnace at 1200 ⁰C. The melted mixture was dried, rapidly cooled, and then ground to form a barrier rib powder.

[69] The manufactured barrier rib powder of 94g, ethyl cellulose of 3g, and butyl carbitol acetate (BCA) of 3g were mixed with one another to manufacture a barrier rib paste.

[70] The barrier rib paste was coated on the rear substrate on which the address electrode and the dielectric layer are formed, at a thickness of 150 to 200 /M, and then dried.

[71] The dried barrier rib paste was fired at 500 ⁰C to form a barrier rib layer. Then, a photosensitive material was coated on the barrier rib layer, and then an exposure process and a development process were performed on the barrier rib layer coated with the photosensitive material to form a photosensitive material pattern.

[72] A wet etching process was performed on the barrier rib layer with the photosensitive material pattern to manufacture a barrier rib.

[73] Experimental example 2>

[74] A barrier rib of the experimental example 2 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 50.6g, B ₂O₃ of 25g, P₂O₅ of 8.9g, BaO of 1Og, CaO of Ig, SiO₂ of 2.5g, and NaO of 2g.

[75] Experimental example 3>

[76] A barrier rib of the experimental example 3 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 41.5g, B ₂O₃ of 2Og, P₂O₅ of 8.3g, BaO of 3Og, and SiO₂ of 0.5g.

[77] Experimental example 4>

[78] A barrier rib of the experimental example 4 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 39g, B ₂O₃ of 37g, P₂O₅ of 15g, BaO of 3g, CaO of 3g, and SiO₂ of 3g.

[79] Experimental example 5> [80] A barrier rib of the experimental example 5 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 39g, B ₂O₃ of 35g, P₂O₅ of 15g, BaO of 3g, CaO of 3g, SiO₂ of 3g, and Al₂O₃ of Ig.

[81] Experimental example 6>

[82] A barrier rib of the experimental example 6 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 39g, B ₂O₃ of 35g, P₂O₅ of 15g, BaO of 3g, CaO of 3g, and SiO₂ of 5g.

[83] Experimental example 7>

[84] A barrier rib of the experimental example 7 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 36g, B ₂O₃ of 23g, P₂O₅ of 8.3g, BaO of 17g, SiO₂ of 0.5g, NaO of 1.4g, and LiO₂ of 1.8g.

[85] Experimental example 8>

[86] A barrier rib of the experimental example 8 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 3Og, B ₂O₃ of 35g, P₂O₅ of 2Og, and CaO of 15g.

[87] Experimental example 9>

[88] A barrier rib of the experimental example 9 was manufactured under the same conditions as the above experimental example 1, except a barrier rib composition forming a barrier rib powder. The barrier rib composition included ZnO of 3Og, B ₂O₃ of 3Og, P₂O₅ of 18g, BaO of 3g, and CaO of 18g.

[89] <Comparative example>

[90] A barrier rib of the comparative example was manufactured using a marketing mother glass including PbO under the same conditions as the above experimental example 1.

[91] A glass transition temperature, a glass softening temperature, an etch rate, and a permittivity of each of the barrier ribs of the experimental examples 1 to 9 and the barrier ribs of the comparative example were measured and indfcated in the following table 1.

[92] Table 1 [Table 1] [Table ]

[93] As indicated in the above table 1, the barrier rib of the plasma display panel accordng to the exemplary embodment had thermal characteristics (i.e., the glass transition temperature and the glass softening temperature) and the etch rate similar to the barrier rib of the comparative example including PbQ

[94] Furthermore, because the barrier rib according to the exemplary embodiment has the permittivity of 7 to 10 C ²/Nm² lower than the permittivity of the barrier rib of the comparative example including PbO, the effidency of power consumption of the plasma ctisplay panel can increase. [95]

Claims

[1] A barrier rib composition for a plasma display panel comprising: about 30 to 61 parts by weight of ZnO; about 20 to 40 parts by weight of B ₂O₃; and about 5 to 20 parts by weight of P₂O₅. [2] The barrier rib composition of claim 1, farther comprising at least one selected from the group consisting of BaO, CaO, and SiO ₂. [3] The barrier rib composition of claim 2, wherein a BaO content is more than 0 and equal to or less than about 30 parts by weight, a CaO content is more than 0 and equal to or less than about 18 parts by weight, and a SiO₂ content is more than 0 and equal to or less than about 5 parts by weight. [4] The barrier rib composition of claim 2, farther comprising at least one selected from the group consisting of Al ₂O₃, NaO, and LiO₂. [5] The barrier rib composition of claim 4, wherein a sum of a content of at least one selected from the group consisting of Al ₂O₃, NaO, and LiO₂ is more than 0 and equal to or less than about 5 parts by weight. [6] The barrier rib composition of claim 1, wherein a barrier rib formed of the barrier rib composition has substantially a glass transition temperature of 445 ⁰C to 562 ⁰C. [7] The barrier rib composition of claim 1, wherein a barrier rib formed of the barrier rib composition has substantially a glass softening temperature of 460 ⁰C to 630 ⁰C. [8] The barrier rib composition of claim 1, wherein a barrier rib formed of the barrier rib composition has substantially an etch rate of 10 /M/min to 25 /M/min. [9] The barrier rib composition of claim 1, wherein a barrier rib formed of the barrier rib composition has substantially a permittivity of 7 C ²/Nnf to 10 C²/Nnf [10] A plasma display panel comprising : a front substrate; a rear substrate positioned opposite the front substrate; and a barrier rib positioned between the front substrate and the rear substrate, the barrier rib including: about 30 to 61 parts by weight of ZnO; about 20 to 40 parts by weight of B ₂O₃; and about 5 to 20 parts by weight of P₂O₅. [11] The plasma display panel of claim 10, wherein the barrier rib further includes at least one selected from the group consisting of BaO, CaO, and SiO ₂. [12] The plasma display panel of claim 11, wherein a BaO content is more than 0 and equal to or less than about 30 parts by weight, a CaO content is more than 0 and equal to or less than about 18 parts by weight, and a SiO₂ content is more than 0 and equal to or less than about 5 parts by weight. [13] The plasma display panel of claim 11, wherein the barrier rib further includes at least one selected from the group consisting of Al ₂O₃, NaO, and LiO₂. [14] The plasma display panel of claim 13, wherein a sum of a content of at least one selected from the group consisting of Al ₂O₃, NaO, and LiO₂ is more than 0 and equal to or less than about 5 parts by weight. [15] The plasma display panel of claim 10, wherein the barrier rib has substantially a glass transition temperature of 445 ⁰C to 562 ⁰C. [16] The plasma display panel of claim 10, wherein the barrier rib has substantially a glass softening temperature of 460 ⁰C to 630 ⁰C. [17] The plasma display panel of claim 10, wherein the barrier rib has substantially an etch rate of 10 μm/min to 25 μm/min. [18] The plasma display panel of claim 10, wherein a barrier rib formed of the barrier rib composition has substantially a permittivity of 7 C ²/Nm² to 10 C²/Nm².