WO2008123300A1 - Plasma processing apparatus - Google Patents

Plasma processing apparatus Download PDF

Info

Publication number
WO2008123300A1
WO2008123300A1 PCT/JP2008/055707 JP2008055707W WO2008123300A1 WO 2008123300 A1 WO2008123300 A1 WO 2008123300A1 JP 2008055707 W JP2008055707 W JP 2008055707W WO 2008123300 A1 WO2008123300 A1 WO 2008123300A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
generating section
plasma generating
radiating plate
plasma
Prior art date
Application number
PCT/JP2008/055707
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Tachibana
Yasunari Mori
Original Assignee
Mitsui Engineering & Shipbuilding Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Engineering & Shipbuilding Co., Ltd. filed Critical Mitsui Engineering & Shipbuilding Co., Ltd.
Priority to JP2008551372A priority Critical patent/JP4554712B2/en
Publication of WO2008123300A1 publication Critical patent/WO2008123300A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A plasma processing apparatus is provided with a plasma generating section which generates plasma by using an antenna array wherein a plurality of antenna elements, each of which is composed of a bar-like conductor whose surface is coated with a dielectric material, are arranged at prescribed intervals; and a gas radiating section, which is arranged to cover the plasma generating section and has a gas radiating plate arranged above the antenna array. When the antenna element and the radiating plate are viewed from a direction vertical to the surface of the substrate to be processed, a plurality of gas discharge ports opened to the plasma generating section are formed on the radiating plate in a first region that matches with a region between the antenna elements of the plasma generating section, and the gas discharge port is not formed in a second region that matches with the region where the antenna element is positioned. Thus, even when a film forming area is large, film forming speed can be improved, generation of particles is suppressed and films having excellent uniformity in qualities and thickness can be formed.
PCT/JP2008/055707 2007-03-30 2008-03-26 Plasma processing apparatus WO2008123300A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008551372A JP4554712B2 (en) 2007-03-30 2008-03-26 Plasma processing equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-091844 2007-03-30
JP2007091844 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123300A1 true WO2008123300A1 (en) 2008-10-16

Family

ID=39830788

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055707 WO2008123300A1 (en) 2007-03-30 2008-03-26 Plasma processing apparatus

Country Status (3)

Country Link
JP (1) JP4554712B2 (en)
TW (1) TWI360165B (en)
WO (1) WO2008123300A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742632B (en) * 2019-04-26 2021-10-11 日商日新電機股份有限公司 Sputtering device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03122281A (en) * 1989-10-06 1991-05-24 Anelva Corp Cvd device
JP2000331993A (en) * 1999-05-19 2000-11-30 Mitsubishi Electric Corp Plasma processing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4452061B2 (en) * 2003-11-14 2010-04-21 三井造船株式会社 Method of matching antenna for plasma generator and plasma generator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03122281A (en) * 1989-10-06 1991-05-24 Anelva Corp Cvd device
JP2000331993A (en) * 1999-05-19 2000-11-30 Mitsubishi Electric Corp Plasma processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742632B (en) * 2019-04-26 2021-10-11 日商日新電機股份有限公司 Sputtering device

Also Published As

Publication number Publication date
JP4554712B2 (en) 2010-09-29
TWI360165B (en) 2012-03-11
TW200917341A (en) 2009-04-16
JPWO2008123300A1 (en) 2010-07-15

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