WO2008114674A1 - Insulating composite body, method for producing the same, and use of insulating composite body - Google Patents

Insulating composite body, method for producing the same, and use of insulating composite body Download PDF

Info

Publication number
WO2008114674A1
WO2008114674A1 PCT/JP2008/054580 JP2008054580W WO2008114674A1 WO 2008114674 A1 WO2008114674 A1 WO 2008114674A1 JP 2008054580 W JP2008054580 W JP 2008054580W WO 2008114674 A1 WO2008114674 A1 WO 2008114674A1
Authority
WO
WIPO (PCT)
Prior art keywords
composite body
insulating composite
fiber base
forming
varnish
Prior art date
Application number
PCT/JP2008/054580
Other languages
French (fr)
Japanese (ja)
Inventor
Masashi Kawasaki
Yosuke Fujito
Koji Kinoshita
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2009505164A priority Critical patent/JP5267453B2/en
Publication of WO2008114674A1 publication Critical patent/WO2008114674A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is an insulating composite body which is obtained by applying a varnish (1) having a composition for forming a cured product excellent in fine wiring pattern formability over one side of a fiber base and applying a varnish (2) having a composition for forming a cured product excellent in characteristics such as flame retardancy and containing a polymer of a specific molecular weight over the other side of the fiber base, and then removing the organic solvent therefrom and forming thermosetting compositions supported by the fiber base. This insulating composite body is excellent in flame retardancy, electrical insulation and crack resistance, and suitable for production of a multilayer circuit board having a fine wiring pattern.
PCT/JP2008/054580 2007-03-14 2008-03-13 Insulating composite body, method for producing the same, and use of insulating composite body WO2008114674A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505164A JP5267453B2 (en) 2007-03-14 2008-03-13 Insulating composite, method for producing the same, and use of insulating composite

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-065761 2007-03-14
JP2007065761 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008114674A1 true WO2008114674A1 (en) 2008-09-25

Family

ID=39765782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054580 WO2008114674A1 (en) 2007-03-14 2008-03-13 Insulating composite body, method for producing the same, and use of insulating composite body

Country Status (2)

Country Link
JP (1) JP5267453B2 (en)
WO (1) WO2008114674A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012012605A (en) * 2010-07-05 2012-01-19 Samsung Fine Chemicals Co Ltd Composition for manufacturing thermosetting resin and cured product thereof, prepreg and prepreg lamination object containing the cured product, and metal foil laminated board and printed wiring board adopting the prepreg or prepreg lamination object
WO2013047726A1 (en) * 2011-09-30 2013-04-04 日本ゼオン株式会社 Insulating adhesive film, prepreg, laminate, cured product, and composite body
JP2014116593A (en) * 2012-11-13 2014-06-26 Mitsubishi Gas Chemical Co Inc Metal clad laminated plate, manufacturing method of the same, printed wiring board using the same, and manufacturing method of printed wiring board
JP7484422B2 (en) 2020-05-26 2024-05-16 株式会社レゾナック Prepreg, laminate, metal-clad laminate and semiconductor package, and method for manufacturing laminate and metal-clad laminate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06336528A (en) * 1993-05-28 1994-12-06 Sumitomo Bakelite Co Ltd Single-copper-clad laminate for printed circuit
JP2002225056A (en) * 2001-01-29 2002-08-14 Sumitomo Bakelite Co Ltd Method for producing composite laminated plate
JP2003069221A (en) * 2001-08-30 2003-03-07 Shin Kobe Electric Mach Co Ltd Method for manufacturing multilayer circuit board
JP2005264076A (en) * 2004-03-19 2005-09-29 Nippon Zeon Co Ltd Thermosetting slurry and electric insulating film using the same
WO2007023944A1 (en) * 2005-08-26 2007-03-01 Zeon Corporation Composite resin molded article, laminate, multi-layer circuit board, and electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004086833A1 (en) * 2003-03-27 2004-10-07 Zeon Corporation Printed wiring board, its manufacturing method, and curing resin molded article with support

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06336528A (en) * 1993-05-28 1994-12-06 Sumitomo Bakelite Co Ltd Single-copper-clad laminate for printed circuit
JP2002225056A (en) * 2001-01-29 2002-08-14 Sumitomo Bakelite Co Ltd Method for producing composite laminated plate
JP2003069221A (en) * 2001-08-30 2003-03-07 Shin Kobe Electric Mach Co Ltd Method for manufacturing multilayer circuit board
JP2005264076A (en) * 2004-03-19 2005-09-29 Nippon Zeon Co Ltd Thermosetting slurry and electric insulating film using the same
WO2007023944A1 (en) * 2005-08-26 2007-03-01 Zeon Corporation Composite resin molded article, laminate, multi-layer circuit board, and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012012605A (en) * 2010-07-05 2012-01-19 Samsung Fine Chemicals Co Ltd Composition for manufacturing thermosetting resin and cured product thereof, prepreg and prepreg lamination object containing the cured product, and metal foil laminated board and printed wiring board adopting the prepreg or prepreg lamination object
WO2013047726A1 (en) * 2011-09-30 2013-04-04 日本ゼオン株式会社 Insulating adhesive film, prepreg, laminate, cured product, and composite body
US9453145B2 (en) 2011-09-30 2016-09-27 Zeon Corporation Insulating adhesive film, prepreg, laminate, cured article, and composite article
JP2014116593A (en) * 2012-11-13 2014-06-26 Mitsubishi Gas Chemical Co Inc Metal clad laminated plate, manufacturing method of the same, printed wiring board using the same, and manufacturing method of printed wiring board
JP7484422B2 (en) 2020-05-26 2024-05-16 株式会社レゾナック Prepreg, laminate, metal-clad laminate and semiconductor package, and method for manufacturing laminate and metal-clad laminate

Also Published As

Publication number Publication date
JPWO2008114674A1 (en) 2010-07-01
JP5267453B2 (en) 2013-08-21

Similar Documents

Publication Publication Date Title
EP3112422B1 (en) Halogen-free flame retardant type resin composition
JP6335384B2 (en) Resin composition, prepreg, metal-clad laminate and wiring board
CN108291008B (en) Resin composition and multilayer substrate
JP5093059B2 (en) Resin composition, prepreg, laminate and printed circuit board
KR101965940B1 (en) Resin composition and uses thereof in high-frequency circuit board
EP2291061A3 (en) Composite material, high frequency circuit substrate made therefrom and making method thereof
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
JP6749055B2 (en) Resin composition, prepreg, metal-clad laminate and wiring board
EP1985654A4 (en) Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same
TW200620334A (en) Multi-layer insulated wire, processes for preparing the same, and its applications
JP5863216B2 (en) Polymer resin composition, polyimide resin film, method for producing polyimide resin film, metal laminate and circuit board
WO2012020713A3 (en) Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
EP1517595A3 (en) Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
TWI617619B (en) Resin composition, prepreg, metal-clad laminate, and wiring board
CN105153234A (en) Phenoxy cyclotriphosphazene active ester, halogen free resin composition and application thereof
TW201008987A (en) Prepreg comprising thin layer quartz glass cloth, and wiring plate using the same
ATE509508T1 (en) LINEAR ACCELERATOR WITH CAST DIELECTRIC COMPOSITE
WO2008114674A1 (en) Insulating composite body, method for producing the same, and use of insulating composite body
US20140072701A1 (en) Composition for an fpcb coverlay and method for producing the same
MY157363A (en) Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition
CN109957203A (en) Resin combination, prepreg and copper clad laminate
CN105131597B (en) A kind of halogen-free resin composition and use its prepreg and laminate for printed circuits
JP2010275374A (en) Resin composition for flexible printed wiring board, resin film, prepreg, metal foil with resin, and flexible printed wiring board
CN106189083B (en) A kind of copper-clad plate of glass fabric enhancing
JP7550176B2 (en) Resin composition, prepreg, metal-clad laminate, and wiring board

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738651

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009505164

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738651

Country of ref document: EP

Kind code of ref document: A1