WO2008114551A1 - 電子写真印刷法によるビアホールの形成方法 - Google Patents

電子写真印刷法によるビアホールの形成方法 Download PDF

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Publication number
WO2008114551A1
WO2008114551A1 PCT/JP2008/052291 JP2008052291W WO2008114551A1 WO 2008114551 A1 WO2008114551 A1 WO 2008114551A1 JP 2008052291 W JP2008052291 W JP 2008052291W WO 2008114551 A1 WO2008114551 A1 WO 2008114551A1
Authority
WO
WIPO (PCT)
Prior art keywords
green sheet
via hole
toner
electrophotographic printing
protrusion
Prior art date
Application number
PCT/JP2008/052291
Other languages
English (en)
French (fr)
Inventor
Kazuhiro Isebo
Norio Sakai
Kenji Kawakami
Nobuaki Ogawa
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to DE112008000704T priority Critical patent/DE112008000704T5/de
Priority to JP2009505099A priority patent/JP4947137B2/ja
Publication of WO2008114551A1 publication Critical patent/WO2008114551A1/ja
Priority to US12/559,589 priority patent/US8012287B2/en
Priority to US13/182,465 priority patent/US8308887B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/221—Machines other than electrographic copiers, e.g. electrophotographic cameras, electrostatic typewriters
    • G03G15/224—Machines for forming tactile or three dimensional images by electrographic means, e.g. braille, 3d printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Textile Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　工程を短縮して良品率を向上することができる、ビアホールの形成方法及び多層基板の製造方法を提供する。 　（１）導電性材料を含み突起部１０ｂを有するトナー１０を、突起部１０ｂが外側を向くように、第１の感光体３０の表面３１に付着させてトナー像を形成する、第１の工程と、（２）絶縁性材料を含むグリーンシート２の一方主面２ａに感光体３０の表面３１を対向させてトナー像をグリーンシート２の一方主面２ａに転写して、グリーンシート２に突き刺したトナー１０の突起部１０ｂがグリーンシート２の他方主面２ｂに達し、トナー１０がグリーンシート２に埋め込まれるようにする、第２の工程とを備え、電子写真印刷法を用いてビアホール３を形成する。
PCT/JP2008/052291 2007-03-22 2008-02-13 電子写真印刷法によるビアホールの形成方法 WO2008114551A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112008000704T DE112008000704T5 (de) 2007-03-22 2008-02-13 Kontaktlochbildungsverfahren, das ein elektrophotographisches Druckverfahren verwendet
JP2009505099A JP4947137B2 (ja) 2007-03-22 2008-02-13 電子写真印刷法によるビアホール導体の形成方法
US12/559,589 US8012287B2 (en) 2007-03-22 2009-09-15 Via hole forming method using electrophotographic printing method
US13/182,465 US8308887B2 (en) 2007-03-22 2011-07-14 Via hole forming method using electrophotographic printing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007075160 2007-03-22
JP2007-075160 2007-03-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/559,589 Continuation US8012287B2 (en) 2007-03-22 2009-09-15 Via hole forming method using electrophotographic printing method

Publications (1)

Publication Number Publication Date
WO2008114551A1 true WO2008114551A1 (ja) 2008-09-25

Family

ID=39765666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052291 WO2008114551A1 (ja) 2007-03-22 2008-02-13 電子写真印刷法によるビアホールの形成方法

Country Status (4)

Country Link
US (2) US8012287B2 (ja)
JP (1) JP4947137B2 (ja)
DE (1) DE112008000704T5 (ja)
WO (1) WO2008114551A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011247931A (ja) * 2010-05-24 2011-12-08 Murata Mfg Co Ltd 画像形成方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2437581A1 (de) 2010-09-30 2012-04-04 Odelo GmbH Leuchtdiode auf Keramiksubstratbasis
US11799183B2 (en) * 2019-07-17 2023-10-24 Xerox Corporation System, apparatus, and method for producing printed electrically conductive lines

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04177793A (ja) * 1990-11-09 1992-06-24 Nec Corp ビアフィル形成方法
JPH11298118A (ja) * 1998-04-08 1999-10-29 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JP2004047816A (ja) * 2002-07-12 2004-02-12 Dt Circuit Technology Co Ltd 多層配線板の製造方法、多層配線板
JP2004048030A (ja) * 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JPH0685457A (ja) 1992-08-31 1994-03-25 Kyocera Corp セラミック多層回路基板及びその製造方法
CA2109687A1 (en) * 1993-01-26 1995-05-23 Walter Schmidt Method for the through plating of conductor foils
DE69419219T2 (de) 1993-09-03 2000-01-05 Kabushiki Kaisha Toshiba, Kawasaki Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
JP3474894B2 (ja) * 1993-09-03 2003-12-08 株式会社東芝 印刷配線板およびその製造方法
JP3474937B2 (ja) * 1994-10-07 2003-12-08 株式会社東芝 実装用配線板の製造方法、半導体パッケージの製造方法
JP3183653B2 (ja) * 1999-08-26 2001-07-09 ソニーケミカル株式会社 フレキシブル基板
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
JP3994795B2 (ja) 2002-05-27 2007-10-24 株式会社村田製作所 積層型セラミック電子部品およびその製造方法
US7001662B2 (en) * 2003-03-28 2006-02-21 Matsushita Electric Industrial Co., Ltd. Transfer sheet and wiring board using the same, and method of manufacturing the same
US7560215B2 (en) * 2004-10-04 2009-07-14 Hewlett-Packard Development Company, L.P. Printed circuit board printing system and method using liquid electrophotographic printing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04177793A (ja) * 1990-11-09 1992-06-24 Nec Corp ビアフィル形成方法
JPH11298118A (ja) * 1998-04-08 1999-10-29 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JP2004047816A (ja) * 2002-07-12 2004-02-12 Dt Circuit Technology Co Ltd 多層配線板の製造方法、多層配線板
JP2004048030A (ja) * 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011247931A (ja) * 2010-05-24 2011-12-08 Murata Mfg Co Ltd 画像形成方法

Also Published As

Publication number Publication date
US8308887B2 (en) 2012-11-13
JP4947137B2 (ja) 2012-06-06
US8012287B2 (en) 2011-09-06
US20090320986A1 (en) 2009-12-31
DE112008000704T5 (de) 2010-04-29
JPWO2008114551A1 (ja) 2010-07-01
US20110265948A1 (en) 2011-11-03

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