WO2008111598A1 - Composition durcissable - Google Patents
Composition durcissable Download PDFInfo
- Publication number
- WO2008111598A1 WO2008111598A1 PCT/JP2008/054445 JP2008054445W WO2008111598A1 WO 2008111598 A1 WO2008111598 A1 WO 2008111598A1 JP 2008054445 W JP2008054445 W JP 2008054445W WO 2008111598 A1 WO2008111598 A1 WO 2008111598A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- curable composition
- lewis acid
- disclosed
- suppressed
- complex
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
- C08K5/31—Guanidine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/08—Crosslinking by silane
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
L'invention porte sur une composition durcissable ayant une excellente aptitude au durcissement sans contenir de catalyseur de durcissement d'organo-étain toxique. Cette composition durcissable permet d'obtenir un produit durci ayant une excellente résistance mécanique et un collant de surface diminué. De façon spécifique, l'invention porte sur une composition durcissable caractérisée par le fait qu'elle contient (A) un polymère organique ayant un groupe de silicium réactif, (B) un composé de guanidine ayant une structure spécifique et (C) un acide de Lewis et/ou un complexe d'un acide de Lewis.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009504062A JP5476119B2 (ja) | 2007-03-12 | 2008-03-12 | 硬化性組成物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007062217 | 2007-03-12 | ||
JP2007-062217 | 2007-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008111598A1 true WO2008111598A1 (fr) | 2008-09-18 |
Family
ID=39759532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/054445 WO2008111598A1 (fr) | 2007-03-12 | 2008-03-12 | Composition durcissable |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5476119B2 (fr) |
WO (1) | WO2008111598A1 (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010035820A1 (fr) * | 2008-09-29 | 2010-04-01 | 株式会社カネカ | Composition durcissable et produit durci obtenu à partir de celle-ci |
JP2010260910A (ja) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | 硬化性シリコーン系樹脂組成物 |
JP2010260909A (ja) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | 硬化性シリコーン系樹脂組成物 |
JP4672809B1 (ja) * | 2010-09-07 | 2011-04-20 | コニシ株式会社 | シーリング材組成物 |
JP2016175965A (ja) * | 2015-03-18 | 2016-10-06 | シャープ化学工業株式会社 | 非接着性湿気硬化型樹脂組成物 |
US11028230B1 (en) | 2018-08-24 | 2021-06-08 | Dow Silicones Corporation | Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes |
US11136436B2 (en) | 2018-08-24 | 2021-10-05 | Dow Silicones Corporation | Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes |
US11666888B2 (en) | 2018-02-05 | 2023-06-06 | Bio-Rad Laboratories, Inc. | Chromatography resin having an anionic exchange-hydrophobic mixed mode ligand |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05255584A (ja) * | 1992-03-10 | 1993-10-05 | Shin Etsu Chem Co Ltd | 室温硬化性組成物 |
JP2005248175A (ja) * | 2004-02-05 | 2005-09-15 | Yokohama Rubber Co Ltd:The | 硬化性組成物 |
JP2006199721A (ja) * | 2005-01-18 | 2006-08-03 | Konishi Co Ltd | 硬化性シリコーン系樹脂の硬化触媒、及び硬化性シリコーン系樹脂組成物 |
JP2006199730A (ja) * | 2005-01-18 | 2006-08-03 | Konishi Co Ltd | 硬化性樹脂組成物及び湿気硬化型接着剤 |
JP2007039568A (ja) * | 2005-08-03 | 2007-02-15 | Yokohama Rubber Co Ltd:The | 硬化性組成物 |
-
2008
- 2008-03-12 JP JP2009504062A patent/JP5476119B2/ja active Active
- 2008-03-12 WO PCT/JP2008/054445 patent/WO2008111598A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05255584A (ja) * | 1992-03-10 | 1993-10-05 | Shin Etsu Chem Co Ltd | 室温硬化性組成物 |
JP2005248175A (ja) * | 2004-02-05 | 2005-09-15 | Yokohama Rubber Co Ltd:The | 硬化性組成物 |
JP2006199721A (ja) * | 2005-01-18 | 2006-08-03 | Konishi Co Ltd | 硬化性シリコーン系樹脂の硬化触媒、及び硬化性シリコーン系樹脂組成物 |
JP2006199730A (ja) * | 2005-01-18 | 2006-08-03 | Konishi Co Ltd | 硬化性樹脂組成物及び湿気硬化型接着剤 |
JP2007039568A (ja) * | 2005-08-03 | 2007-02-15 | Yokohama Rubber Co Ltd:The | 硬化性組成物 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010035820A1 (fr) * | 2008-09-29 | 2010-04-01 | 株式会社カネカ | Composition durcissable et produit durci obtenu à partir de celle-ci |
CN102165016B (zh) * | 2008-09-29 | 2014-03-12 | 株式会社钟化 | 固化性组合物及其固化物 |
US8853309B2 (en) | 2008-09-29 | 2014-10-07 | Kaneka Corporation | Curable composition and cured product thereof |
JP2010260910A (ja) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | 硬化性シリコーン系樹脂組成物 |
JP2010260909A (ja) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | 硬化性シリコーン系樹脂組成物 |
JP4672809B1 (ja) * | 2010-09-07 | 2011-04-20 | コニシ株式会社 | シーリング材組成物 |
JP2012057002A (ja) * | 2010-09-07 | 2012-03-22 | Konishi Co Ltd | シーリング材組成物 |
JP2016175965A (ja) * | 2015-03-18 | 2016-10-06 | シャープ化学工業株式会社 | 非接着性湿気硬化型樹脂組成物 |
US11666888B2 (en) | 2018-02-05 | 2023-06-06 | Bio-Rad Laboratories, Inc. | Chromatography resin having an anionic exchange-hydrophobic mixed mode ligand |
US11028230B1 (en) | 2018-08-24 | 2021-06-08 | Dow Silicones Corporation | Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes |
US11136436B2 (en) | 2018-08-24 | 2021-10-05 | Dow Silicones Corporation | Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes |
Also Published As
Publication number | Publication date |
---|---|
JP5476119B2 (ja) | 2014-04-23 |
JPWO2008111598A1 (ja) | 2010-06-24 |
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