WO2008111215A1 - Diamond dice and method for producing wire using diamond dice - Google Patents

Diamond dice and method for producing wire using diamond dice Download PDF

Info

Publication number
WO2008111215A1
WO2008111215A1 PCT/JP2007/055252 JP2007055252W WO2008111215A1 WO 2008111215 A1 WO2008111215 A1 WO 2008111215A1 JP 2007055252 W JP2007055252 W JP 2007055252W WO 2008111215 A1 WO2008111215 A1 WO 2008111215A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
bearing region
hole
inlet
bearing
Prior art date
Application number
PCT/JP2007/055252
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Yukawa
Original Assignee
A.L.M.T. Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A.L.M.T. Corp. filed Critical A.L.M.T. Corp.
Priority to PCT/JP2007/055252 priority Critical patent/WO2008111215A1/en
Priority to CN200780043001A priority patent/CN101547757A/en
Priority to JP2009503855A priority patent/JPWO2008111215A1/en
Publication of WO2008111215A1 publication Critical patent/WO2008111215A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C3/00—Profiling tools for metal drawing; Combinations of dies and mandrels
    • B21C3/02—Dies; Selection of material therefor; Cleaning thereof
    • B21C3/025—Dies; Selection of material therefor; Cleaning thereof comprising diamond parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C3/00—Profiling tools for metal drawing; Combinations of dies and mandrels
    • B21C3/02—Dies; Selection of material therefor; Cleaning thereof
    • B21C3/04—Dies; Selection of material therefor; Cleaning thereof with non-adjustable section

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metal Extraction Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A diamond dice has a bearing region touching a wire inserted via an inlet, a reduction region arranged on the inlet side continuously to the bearing region, and a sidewall defining a hole extending from the inlet to the outlet along the axis so as to penetrate the bearing region and the reduction region. A wire inserted into the hole via the inlet is drawn out from the outlet via the bearing region. Assuming the inside diameter of the hole is D in the bearing region, a line connecting a first point on the sidewall located closer to the inlet side by a length of 1.0D in the axial direction of the hole than the boundary portion between the bearing region and the reduction region, and a second point on the sidewall located closer to the inlet side by a length of 3.0D in the axial direction of the hole than the boundary portion between the bearing region and the reduction region makes an angle ϑ1 of 15-30 degrees with respect to the axial direction on a cross-section appearing when the diamond dice is cut on a plane parallel with the axis and including the axis. The boundary portion between the bearing region and the reduction region has a curved surface.
PCT/JP2007/055252 2007-03-15 2007-03-15 Diamond dice and method for producing wire using diamond dice WO2008111215A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/055252 WO2008111215A1 (en) 2007-03-15 2007-03-15 Diamond dice and method for producing wire using diamond dice
CN200780043001A CN101547757A (en) 2007-03-15 2007-03-15 Diamond dice and method for producing wire using diamond dice
JP2009503855A JPWO2008111215A1 (en) 2007-03-15 2007-03-15 Diamond die and method of manufacturing wire using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055252 WO2008111215A1 (en) 2007-03-15 2007-03-15 Diamond dice and method for producing wire using diamond dice

Publications (1)

Publication Number Publication Date
WO2008111215A1 true WO2008111215A1 (en) 2008-09-18

Family

ID=39759166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055252 WO2008111215A1 (en) 2007-03-15 2007-03-15 Diamond dice and method for producing wire using diamond dice

Country Status (3)

Country Link
JP (1) JPWO2008111215A1 (en)
CN (1) CN101547757A (en)
WO (1) WO2008111215A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274282A (en) * 2009-05-27 2010-12-09 Allied Material Corp Diamond die
CN102586756A (en) * 2012-03-05 2012-07-18 宜兴市景程模具有限公司 Microporous diamond coating preparation device for drawing dies and coating preparation method
CN107470381A (en) * 2017-08-15 2017-12-15 宜昌给立金刚石工业有限公司 The preparation method of artificial synthesized CVD single-crystal diamonds wire-drawing die
CN109351789A (en) * 2018-12-03 2019-02-19 安徽恒明工程技术有限公司 Accurate drawing mould for the forming of minor radius round rectangle enameled wire
CN116213487A (en) * 2023-05-08 2023-06-06 浙江求是半导体设备有限公司 Wire drawing die maintenance method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084438B (en) * 2014-06-24 2016-01-20 浙江金平拉丝模有限公司 Welding wire special diamond mould
US11007558B2 (en) 2015-07-22 2021-05-18 Sumitomo Electric Hardmetal Corp. Diamond die
EP3815806B1 (en) * 2018-06-27 2023-11-29 Sumitomo Electric Hardmetal Corp. Tool with through hole comprising a diamond component
CN110257745B (en) * 2019-07-26 2021-01-05 廊坊市华星钨钼工业有限公司 White tungsten wire and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08108211A (en) * 1994-10-07 1996-04-30 Tokyo Seiko Co Ltd Diamond die for drawing steel
JP2002102917A (en) * 2000-09-27 2002-04-09 Allied Material Corp Diamond die
JP2005177806A (en) * 2003-12-19 2005-07-07 Allied Material Corp Diamond die for super-extra fine wire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08108211A (en) * 1994-10-07 1996-04-30 Tokyo Seiko Co Ltd Diamond die for drawing steel
JP2002102917A (en) * 2000-09-27 2002-04-09 Allied Material Corp Diamond die
JP2005177806A (en) * 2003-12-19 2005-07-07 Allied Material Corp Diamond die for super-extra fine wire

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274282A (en) * 2009-05-27 2010-12-09 Allied Material Corp Diamond die
CN102586756A (en) * 2012-03-05 2012-07-18 宜兴市景程模具有限公司 Microporous diamond coating preparation device for drawing dies and coating preparation method
CN107470381A (en) * 2017-08-15 2017-12-15 宜昌给立金刚石工业有限公司 The preparation method of artificial synthesized CVD single-crystal diamonds wire-drawing die
CN109351789A (en) * 2018-12-03 2019-02-19 安徽恒明工程技术有限公司 Accurate drawing mould for the forming of minor radius round rectangle enameled wire
CN116213487A (en) * 2023-05-08 2023-06-06 浙江求是半导体设备有限公司 Wire drawing die maintenance method
CN116213487B (en) * 2023-05-08 2023-08-08 浙江求是半导体设备有限公司 Wire drawing die maintenance method

Also Published As

Publication number Publication date
JPWO2008111215A1 (en) 2010-06-24
CN101547757A (en) 2009-09-30

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