CN102586756A - Microporous diamond coating preparation device for drawing dies and coating preparation method - Google Patents
Microporous diamond coating preparation device for drawing dies and coating preparation method Download PDFInfo
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- CN102586756A CN102586756A CN2012100548892A CN201210054889A CN102586756A CN 102586756 A CN102586756 A CN 102586756A CN 2012100548892 A CN2012100548892 A CN 2012100548892A CN 201210054889 A CN201210054889 A CN 201210054889A CN 102586756 A CN102586756 A CN 102586756A
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- wortle
- wire
- heated filament
- diamond coatings
- drawing die
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Abstract
The invention discloses a microporous diamond coating preparation device for drawing dies and a coating preparation method. The microporous diamond coating preparation device for drawing dies comprises a hot wire and drawing dies. The hot wire passes through die holes of the drawing dies and is located on the axis of the drawing dies. Two ends of the hot wire are respectively connected to two electrodes. The drawing dies are arranged on an inclined plane of a support at intervals. The lower end of the hot wire has a fixed connection with the electrode and the upper end of the hot wire has a wrapped connection with the other electrode and then is connected to a high temperature spring. A microporous diamond-coated drawing die treated by the microporous diamond coating preparation device has the characteristics of long service life, high size precision and uniform coating effect.
Description
Technical field
The present invention relates to chemical vapour deposition (being called for short CVD) diamond-coated wire-drawing die technology of preparing, belong to metallurgical metalloid material plating field, especially a kind of micropore diamond coatings device and coating production of wire-drawing die.
Background technology
The technician who is engaged in professional CVD vapour deposition knows that all in the CVD vapour deposition process depositing diamond film production technique, the heated filament distortion burn work piece inner surface under the high temperature is a problem that is difficult to overcome; For example: Chinese patent ZL98110896.2 discloses a kind of diamond-coated wire-drawing die, and it adopts general laterally wear the mould that provisional constitution only is adapted to wide aperture (φ is more than 4.00) and make top coat, but since heated filament will be at high temperature sagging naturally and shake; Though be unlikely to the work piece inner surface of burning; But because heated filament and workpiece axle center, cause the diamond thin quality that influences product in uneven thickness of producing apart from variation has taken place, because laterally there is serious deficiency in the method for installation heated filament; Relevant scientific and technical personnel just invent vertical direction heated filament are installed; For example: Chinese patent ZL200810044524.5 discloses a kind of manufacturing method of small aperture diamond coating drawing die, through vertical direction heated filament is installed, and can make diamond thin at very little aperture surface; But because heated filament is directly to contact with electrode through stainless steel spring; At present, existing spring material can not bear 2000 ℃ high temperature, in the real industry general with the metallic substance molybdenum as high temperature electrode; Because molybdenum be high temperature resistant and electroconductibility good; But, be not available to make spring, so can only make spring electrode with the higher stainless material of nickel content because of Mo is the powder metallurgy material.Result in heated filament like this and often burn out spring electrode, production can't normally be carried out.
Summary of the invention
The present invention is directed to above-mentioned technical problem, provide a kind of coating result good, the micropore diamond coatings device and the coating production of the uniform wire-drawing die of mould internal coating.
For solving the problems of the technologies described above; The technical scheme that the present invention makes the micropore diamond coatings device of wire-drawing die is: a kind of micropore diamond coatings device of wire-drawing die, comprise heated filament, wortle, and the nib that heated filament passes wortle is positioned at the axle center of wortle; The heated filament two ends are connection electrodes respectively; It is characterized in that several wortles are placed on the inclined-plane of support at interval, the heated filament lower end is fixedly connected with an electrode, is connected with high temperature spring behind another electrode of heated filament upper end solderless wrapped connection.
Preferred as the micropore diamond coatings device of wire-drawing die of the present invention; The inclined-plane of support preferably is set to 30 ° ~ 60 °, and the inclined-plane of support preferably is set to 45 °, through 45 ° inclined-plane is set; Prevent that effectively wortle from toppling on the inclined-plane, improved the stability of device.
Further preferred as the micropore diamond coatings device of wire-drawing die of the present invention, the die throat diameter of wortle is 2.0-4.0mm, in order better wortle to be carried out the Buddha's warrior attendant coating, the wortle aperture is preferably 2.0-4.0mm makes its coating more all even fine and closely woven.
Gordian technique of the present invention is that heated filament is stretching with certain angle of inclination degree, and the heated filament lower end directly is connected on the electrode; Is connected with high temperature spring behind another electrode of heated filament upper end solderless wrapped connection, strains, and the heat stretching of the generation in the process of heated filament is transformed within the deformation of high temperature spring through the deformation of high temperature spring; Thereby keep heated filament to remain stretching; Because the temperature that produces at two interelectrode heated filaments is the highest, can decrease through the hot-wire temperature behind the electrode, described high temperature spring be connected through the heated filament behind the electrode; Prevented effectively that high temperature spring Yin Wendu is too high and burnt, improved the success ratio and the efficient of mould coating.
For making the Buddha's warrior attendant coating of above-mentioned wire-drawing die; The preparation method of the micropore diamond coatings of wire-drawing die provided by the invention is: a kind of preparation method of micropore diamond coatings of wire-drawing die; Prepare diamond coatings with hot filament CVD at the wortle bore surface; Comprise that diadust presets the forming core stage and at the growth phase of wortle bore surface deposition one deck diamond thin, it is characterized in that the forming core stage with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-400ml/min, wherein C
3H
6Volume parts accounts for H
2The 30-35% of volume parts,, the wortle substrate temperature is 750-900 ℃, and the hot-wire temperature is 2100-2200 ℃, and the reaction times is 30-60min, and keeps the reaction constant voltage of 2.0-4.0kpa;
At growth phase with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-350ml/min, wherein C
3H
6Volume parts accounts for H
2The 25-30% of volume parts, wortle substrate temperature are 800-950 ℃, and the hot-wire temperature is 2100-2200 ℃, and the ST is 6-8h, and keep the reaction constant voltage of 2.0-4.0kpa.
Characteristics such as the diamond-coated wire-drawing die that utilizes the present invention to prepare has long service life, and dimensional precision is high, and coating is even.
Description of drawings
Fig. 1 is the micropore diamond coatings device cross-sectional view of wire-drawing die of the present invention.
Embodiment
The micropore diamond coatings device of a kind of wire-drawing die as shown in Figure 1 comprises heated filament 1, wortle 2, and the nib that heated filament 1 passes wortle 2 is positioned at the axle center of wortle 2; Heated filament 1 two ends are connection electrodes 3 respectively; Several wortles are placed on the inclined-plane of support 4 at interval, and heated filament 1 lower end is fixedly connected with an electrode 3, and the inclined-plane that is connected support 4 behind heated filament 1 another electrode of upper end solderless wrapped connection with high temperature spring 5 is set to 30 ° ~ 60 °; The inclined-plane is set to 45 °, and the die throat diameter of wortle 2 is 2.0-4.0mm.
A kind of preparation method of micropore diamond coatings of wire-drawing die; Prepare diamond coatings with hot filament CVD at the wortle bore surface; Comprise that diadust presets the forming core stage and at the growth phase of wortle bore surface deposition one deck diamond thin, it is characterized in that the forming core stage with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-400ml/min, wherein C
3H
6Volume parts accounts for H
2The 30-35% of volume parts,, the wortle substrate temperature is 750-900 ℃, and the hot-wire temperature is 2100-2200 ℃, and the reaction times is 30-60min, and keeps the reaction constant voltage of 2.0-4.0kpa;
At growth phase with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-350ml/min, wherein C
3H
6Volume parts accounts for H
2The 25-30% of volume parts, wortle substrate temperature are 800-950 ℃, and the hot-wire temperature is 2100-2200 ℃, and the ST is 6-8h, and keep the reaction constant voltage of 2.0-4.0kpa.
Claims (5)
1. the micropore diamond coatings device of a wire-drawing die; Comprise heated filament, wortle; The nib that heated filament passes wortle is positioned at the axle center of wortle, and the heated filament two ends are connection electrodes respectively, it is characterized in that several wortles are placed on the inclined-plane of support at interval; The heated filament lower end is fixedly connected with an electrode, is connected with high temperature spring behind another electrode of heated filament upper end solderless wrapped connection.
2. the micropore diamond coatings device of a kind of wire-drawing die according to claim 1 is characterized in that the inclined-plane of support is set to 30 ° ~ 60 °.
3. the micropore diamond coatings device of a kind of wire-drawing die according to claim 2 is characterized in that the inclined-plane of support is set to 45 °.
4. the micropore diamond coatings device of a kind of wire-drawing die according to claim 1, the die throat diameter that it is characterized in that wortle is 2.0-4.0mm.
5. according to the preparation method of the micropore diamond coatings of claim 1,2,3, one of 4 described a kind of wire-drawing dies; Prepare diamond coatings with hot filament CVD at the wortle bore surface; Comprise that diadust presets the forming core stage and at the growth phase of wortle bore surface deposition one deck diamond thin, it is characterized in that the forming core stage with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-400ml/min, wherein C
3H
6Volume parts accounts for H
2The 30-35% of volume parts,, the wortle substrate temperature is 750-900 ℃, and the hot-wire temperature is 2100-2200 ℃, and the reaction times is 30-60min, and keeps the reaction constant voltage of 2.0-4.0kpa;
At growth phase with C
3H
6And H
2Gas mixture be source of the gas, general gas flow is 300-350ml/min, wherein C
3H
6Volume parts accounts for H
2The 25-30% of volume parts, wortle substrate temperature are 800-950 ℃, and the hot-wire temperature is 2100-2200 ℃, and the ST is 6-8h, and keep the reaction constant voltage of 2.0-4.0kpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100548892A CN102586756A (en) | 2012-03-05 | 2012-03-05 | Microporous diamond coating preparation device for drawing dies and coating preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100548892A CN102586756A (en) | 2012-03-05 | 2012-03-05 | Microporous diamond coating preparation device for drawing dies and coating preparation method |
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| CN102586756A true CN102586756A (en) | 2012-07-18 |
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ID=46475971
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100548892A Pending CN102586756A (en) | 2012-03-05 | 2012-03-05 | Microporous diamond coating preparation device for drawing dies and coating preparation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104789937A (en) * | 2015-02-15 | 2015-07-22 | 河北一缆通电子商务有限公司 | Production method for drawing mold with nano-scale diamond coating on inner hole surface |
| CN108103477A (en) * | 2018-01-29 | 2018-06-01 | 珠海中纳金刚石有限公司 | The automatic center alignment device and method of a kind of HF CVD chemical vapor deposition |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327084A (en) * | 2001-05-31 | 2001-12-19 | 上海交通大学 | Method for preparing wire drawing mold with diamond compoiste coating |
| WO2008111215A1 (en) * | 2007-03-15 | 2008-09-18 | A.L.M.T. Corp. | Diamond dice and method for producing wire using diamond dice |
| CN101280422A (en) * | 2008-04-02 | 2008-10-08 | 四川中物超硬材料有限公司 | Device for lot manufactureof diamond coating drawing die |
| CN102140626A (en) * | 2010-08-13 | 2011-08-03 | 北京天地东方超硬材料股份有限公司 | Tensile spring structure for preparing diamond film |
| CN202482433U (en) * | 2012-03-05 | 2012-10-10 | 宜兴市景程模具有限公司 | Micro-pore diamond coating device for wire-drawing dies |
-
2012
- 2012-03-05 CN CN2012100548892A patent/CN102586756A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327084A (en) * | 2001-05-31 | 2001-12-19 | 上海交通大学 | Method for preparing wire drawing mold with diamond compoiste coating |
| WO2008111215A1 (en) * | 2007-03-15 | 2008-09-18 | A.L.M.T. Corp. | Diamond dice and method for producing wire using diamond dice |
| CN101280422A (en) * | 2008-04-02 | 2008-10-08 | 四川中物超硬材料有限公司 | Device for lot manufactureof diamond coating drawing die |
| CN102140626A (en) * | 2010-08-13 | 2011-08-03 | 北京天地东方超硬材料股份有限公司 | Tensile spring structure for preparing diamond film |
| CN202482433U (en) * | 2012-03-05 | 2012-10-10 | 宜兴市景程模具有限公司 | Micro-pore diamond coating device for wire-drawing dies |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104789937A (en) * | 2015-02-15 | 2015-07-22 | 河北一缆通电子商务有限公司 | Production method for drawing mold with nano-scale diamond coating on inner hole surface |
| CN108103477A (en) * | 2018-01-29 | 2018-06-01 | 珠海中纳金刚石有限公司 | The automatic center alignment device and method of a kind of HF CVD chemical vapor deposition |
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Application publication date: 20120718 |