JP2005177806A - Diamond die for super-extra fine wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a diamond die for drawing a wire capable of forming a hole with high accuracy even by a die for an extra fine wire in which the minimum diameter of the hole is ≤ 20 μm. <P>SOLUTION: The diamond die comprises a diamond having a hole for working a wire of the wire diameter of ≤ 20 μm, a case member with the diamond fixed thereto, and a fixing member to fix the diamond to the case member, and an outlet side of the hole in the diamond is formed of only a back relief. Further, a single crystal diamond is used for the diamond, the case member is provided on an inlet side of the hole, and the diamond is fixed by providing the fixing member on the outlet side of the hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a die for performing wire drawing of a wire, and more particularly to a diamond die used for drawing a superfine wire having a wire diameter of 20 μm or less using diamond at a processing site.

Conventionally, dies are used for wire drawing, especially in processing that places importance on accuracy and life, those using natural diamond for processing parts, those using artificial single crystal diamond, and diamond The thing using a sintered compact is used. In these diamond dies, as shown in FIG. 3, the diamond is integrally fixed to a case member made of metal such as stainless steel, and a fixing member such as a sintered alloy is used for fixing the diamond die. Has a hole for drawing through the wire. This structure is also described in JISB4132 and JISB4133, but the diamond with the outlet side of the hole down is placed in the recess of the cup-shaped case member, and the periphery of the diamond in the recess of the case member as a fixing member Is filled with a metal powder, and a sintered alloy obtained by sintering the metal powder is provided. As a hole processing method, for example, there is a method of finishing the inner surface of a hole into a predetermined shape by a method of drilling with a laser and performing ultrasonic polishing with a polishing needle. Also, as shown in Fig. 4, the shape of the hole consists of bell, approach, reduction, bearing, back relief, and exit parts in order from the wire entrance side, and the diameter of the wire after wire drawing is Determined by the bearing. As an example of such a diamond die, a diamond die having a bearing inner diameter D of 50 μm or less is formed with a concave curved exit, a reduction angle of 10 to 16 degrees, and a bearing length of 0.2 D to 0. .7D, with a back relief angle of 10 to 20 degrees. (For example, see Patent Document 1)
JP 2002-102917 A

  Recently, for example, as a wire used for a net for printing on a printed circuit board, a demand for an extra fine wire of 20 μm or less has begun to appear. In order to perform such wire drawing processing, if an attempt is made to manufacture the above-mentioned diamond die with a bearing diameter of 20 μm or less, there are the following problems. That is, when trying to provide each shape from the bell to the exit, a diamond thickness of about 500 μm is required, and an extremely fine hole having a minimum diameter of 20 μm or less is polished to such a thickness. This is not easy, and there is a problem that high-precision polishing cannot be performed. Furthermore, if there are many parts to be processed from the bell to the exit, processing defects are likely to occur, and the time and effort of the processing will increase, thus causing problems in terms of yield and cost. Therefore, the diamond die of the present invention provides a diamond die capable of highly accurate hole processing even if it is a die for an ultrafine wire having a minimum hole diameter of 20 μm or less.

In order to solve the above problems, the diamond die of the present invention has the following characteristics.
As a first feature, a diamond die comprising a diamond having a wire processing hole with a wire diameter of 20 μm or less, a case member for holding the diamond, and a fixing member for fixing the diamond to the case member,
The exit side of the diamond hole is formed only by back relief.

  By forming the exit side of the hole formed in the diamond only by the back relief and eliminating the exit, the thickness of the diamond can be reduced, and the bearing can be polished with high accuracy. In particular, the distance from the outlet side of the hole to the bearing portion is extremely shortened, greatly contributing to high-precision polishing. In general, the exit is required to ensure the strength of the exit side of the diamond hole. However, in the wire drawing processing with a wire diameter of 20 μm or less as in the present invention, the resistance applied to the bearing portion is small and the diamond is not cracked. For this reason, the exit side eliminates the exit and uses only the back relief to facilitate high-precision polishing.

  As a second feature, the diamond is a single crystal diamond.

  Some diamond dies use sintered diamond, but it is desirable to use single crystal diamond in the case of a very fine wire having a wire diameter of 20 μm or less. This is because, in the case of sintered diamond, the diamond constituting the sintered body has a large particle size and cannot be processed in units of 1 μm, so that high-precision processing is difficult.

  A third feature is that the case member is provided on the inlet side of the hole, and a fixing member is provided on the outlet side of the hole to fix the diamond.

  As described above, the conventional general diamond die is arranged so that the outlet side of the diamond hole is in contact with the cup-shaped case member, and then fixed by providing a fixing member on the inlet side of the hole. On the other hand, in the diamond die of the present invention, the diamond die is fixed after being arranged so that the diamond is upside down with respect to the case member. By doing so, the resistance applied to the diamond at the time of wire drawing is received by the fixing member. By appropriately selecting the material of the fixing member, elastic deformation due to stress from the diamond is eliminated, and the diamond is firmly Can hold. By holding the diamond in this way, it is possible to more effectively prevent the problem that the diamond breaks even if there is no exit.

  As a fourth feature, the fixing member is a sintered alloy having a Young's modulus higher than that of the case member. By using a sintered alloy, the diamond and the fixing member can be in close contact with each other, so that the stress from the diamond can be more uniformly dispersed and received. The case member has a low Young's modulus for the purpose of facilitating processing of the outer diameter, etc., and at least the Young's modulus of the fixing member that receives the stress applied to the diamond is made as high as possible. The effect of prevention can be improved to the maximum.

  Since the diamond die of the present invention eliminates the exit on the outlet side of the hole and uses only the back relief, the thickness of the diamond can be reduced, and even a bearing portion of a very fine wire having a wire diameter of 20 μm or less is highly accurate. Can be polished. In addition, by receiving the stress at the time of wire drawing processing that the diamond receives by the fixing member, the fixing member can be appropriately selected to make the material difficult to be elastically deformed by the stress received by the diamond, and the diamond can be prevented from cracking.

  FIG. 1 shows a cross section of the diamond die of the present invention, and FIG. 2 shows a partially enlarged cross section around the hole formed in the diamond of the diamond die of the present invention. Referring to FIG. 1, diamond 1 is held by being fixed to case member 3 by fixing member 2. The case member 3 is made of metal, and for example, stainless steel is used. The fixing member 2 is made of a sintered alloy or the like. After the diamond 1 is set on the case member 3, the diamond 1 is fixed to the case member 3 by filling and sintering the alloy powder. In the case of using a sintered alloy, the diamond 1 is also heated at the same time. Therefore, it is preferable to use a component that can increase the Young's modulus as much as possible and that can produce a liquid phase at the lowest possible temperature. For example, a Ni-based component mixed with Cu, Ag, Sn or the like can be used.

  Referring to FIG. 2, a hole is formed in diamond 1, the upper side is an entrance side, the lower side is an exit side, and the entrance side surface of diamond 1 is fixed so as to be in contact with case member 3. Surfaces other than the side surface are in contact with the fixing member 2. Therefore, the surface on the outlet side is held by the fixing member 2. When the wire is drawn, the wire is supplied from the inlet side, and the resistance applied to the diamond 1 at the time of the drawing is received by the fixing member 2. In the hole of diamond 1, a bell 1a, an approach 1b, a reduction 1c, a bearing 1d, and a back relief 1e are formed in this order from the entrance side. In FIGS. 2 and 4, the shape of the hole is shown as a straight line so that each part of the hole is easy to understand, but in reality, it is formed with a gentle curved surface, and the boundary part of each part of the hole is also a smooth curved surface. Is formed.

  As the diamond die of the present invention, the following was manufactured, and a gold wire was drawn (hereinafter referred to as Invention Example 1). Diamond 1 made of 0.4 mm thick single crystal diamond polished to a predetermined shape was placed in a concave portion of a cup-shaped case member 3 made of stainless steel, and the concave portion was filled with metal powder. This metal powder is obtained by adding Cu, Ag, and Sn to a Ni-based component. This was put into a furnace and sintered to obtain an integrated object. Next, tapered concave portions were formed by cutting on both the front and back sides of the central portion of the integral body. By this processing, a part of the entrance side and exit side surfaces of the diamond 1 were exposed. Next, a hole having a minimum diameter of 10 μm was formed in the diamond 1 by laser processing. In order to form this hole, the side of the diamond 1 in contact with the case member 3 was processed so as to be the inlet side. And in order to make it into a predetermined shape and to make the diameter of a bearing part into 15 micrometers, it grind | polished using the loose abrasive grain.

  For comparison, a diamond die having an exit was also manufactured (hereinafter referred to as a comparative example). As for the manufacturing method, the processing of Example 1 of the present invention is added with the processing of the exit, and the diamond die is different only in the thickness of the diamond and the shape of the hole. Table 1 shows the sizes of the hole portions. In addition, the length in this table | surface represents the length of the thickness direction of the diamond 1. FIG.

  As a result of manufacturing the above-described inventive example 1 and the comparative example, the defect such as cracking of diamond during processing is about 1/3 of the comparative example, and the inventive example 1 has high accuracy of the hole. As a result, it was approximately three times that of the comparative example in the first example of the present invention.

  Next, as a second example of the diamond die according to the present invention, a case where the positions of the case member 3 and the fixing member 2 are reversed from those of the above-described diamond die according to the present invention example 1 (hereinafter referred to as the present invention example 2). ). The positional relationship among diamond 1, fixing member 2, and case member 3 is the same as that shown in FIG. The manufacturing method is the same as that of Example 1 of the present invention in most cases, and in order to form a hole in diamond 1 by laser processing, processing is performed so that the side in contact with fixing member 2 of diamond 1 becomes the inlet side. Only different.

  As a result of wire drawing using the diamond dies of Invention Example 1 and Invention Example 2, diamond breakage during wire drawing did not occur in Invention Example 1, but slightly in Invention Example 2. Occurred. From this, it was found that holding the diamond with a fixing member having a high Young's modulus has a higher effect of preventing the diamond from cracking.

  INDUSTRIAL APPLICABILITY The present invention can be used in a diamond die for wire drawing, particularly for an ultrafine wire processing diamond die having a small wire diameter.

Sectional drawing which showed the diamond die of this invention. The expanded partial sectional view of the hole periphery formed in the diamond of the diamond die of this invention. Sectional drawing which showed the conventional diamond die. The expanded fragmentary sectional view around the hole formed in the diamond of the conventional diamond die.

Explanation of symbols

1 Diamond 2 Fixing member 3 Case member

Claims (4)

A diamond die comprising a diamond having a wire processing hole with a wire diameter of 20 μm or less, a case member to which the diamond is fixed, and a fixing member for fixing the diamond to the case member,
The diamond die is characterized in that an exit side of the diamond hole is formed only by a back relief.   The diamond die according to claim 1, wherein the diamond is a single crystal diamond.   The diamond die according to claim 1, wherein the case member is provided on an inlet side of the hole, and a fixing member is provided on an outlet side of the hole to fix the diamond.   The diamond die according to claim 3, wherein the fixing member is a sintered alloy having a Young's modulus higher than that of the case member.

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