WO2008110061A1 - Système d'auto-test de substrat plan et procédé afférent - Google Patents

Système d'auto-test de substrat plan et procédé afférent Download PDF

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Publication number
WO2008110061A1
WO2008110061A1 PCT/CN2008/000439 CN2008000439W WO2008110061A1 WO 2008110061 A1 WO2008110061 A1 WO 2008110061A1 CN 2008000439 W CN2008000439 W CN 2008000439W WO 2008110061 A1 WO2008110061 A1 WO 2008110061A1
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WO
WIPO (PCT)
Prior art keywords
substrate
light
planar
lens
illumination
Prior art date
Application number
PCT/CN2008/000439
Other languages
English (en)
Chinese (zh)
Inventor
Zheng Yan
Bo Li
Wayne Chen
Tony Young
Ning Ll
Jianbo Gao
Original Assignee
3I Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3I Systems Corp filed Critical 3I Systems Corp
Priority to KR1020097020292A priority Critical patent/KR101174081B1/ko
Publication of WO2008110061A1 publication Critical patent/WO2008110061A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G01N21/5907—Densitometers
    • G01N2021/5957—Densitometers using an image detector type detector, e.g. CCD
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs

Definitions

  • the present invention is in the field of inspection systems, and in particular, systems and methods for detecting defects in engraved graphics on a planar substrate.
  • Flat-panel displays are mainly used in personal laptops, computer flat-panel displays, cell phone and digital instrument displays, car navigation systems, video cameras, projection televisions and LCD TVs, as well as large and small displays on many instruments.
  • the flat display consists of two transparent substrates (typically glass). A control circuit and an optical filter are engraved on the substrate, and the two substrates are filled with liquid crystal.
  • the processing of flat panel display products is very complicated and must be carried out in an ultra-clean environment, otherwise it is easily affected by various defects in the processing process, and the manufacturer may have to repair or scrap the defective display. This will reduce yield and increase cost, so the success of the manufacturer depends to a large extent on the control and detection of substrate defects.
  • defects there are many types of defects in the processing of flat panel displays.
  • the defects include but are not limited to: falling dust (foreign matter falling on the substrate), open circuit and short circuit, chemical residue (chemicals remaining on the surface of the substrate), through holes (connecting upper and lower Hole in the layer, which may cause a short circuit). These defects may cause certain pixels of the substrate to not work or the entire substrate to be inoperative. ;
  • Substrate inspection during production helps with quality control and process control, and helps reduce material loss due to defects.
  • Flat panel display faces special technical challenges because the substrate uses transparent materials, the surface of the reticle has a multi-layer structure, the engraved pattern is dense, the size of the defect is very small (on the order of micrometers), the substrate area is too large, and the detection time Very short.
  • Automated optical inspection systems are used in the processing of planar transistor liquid crystal display substrates and semiconductor integrated circuits to diagnose product quality, improve yield, and reduce production costs.
  • the performance of an automated optical inspection system is primarily determined by the speed and sensitivity of the inspection.
  • the continuous updating of processing technology has greatly increased the production speed, the substrate has been continuously enlarged, and the line width of the pattern printed on the substrate has become smaller and smaller. All of these require an automatic optical inspection system with higher detection speed and higher sensitivity.
  • the requirements for automated optical inspection systems and methods are now the ability to analyze large planar substrates (planar liquid crystal display substrates, semiconductor wafers, etc.) at high speed, while the detectors of the inspection system must be highly sensitive and provide high resolution images. . Purpose of the invention
  • the present invention provides an automatic detection system and method for a flat substrate, which is capable of analyzing a large-scale planar substrate at a high speed, has high sensitivity, and can provide a high-resolution image.
  • a planar substrate automatic detecting system comprising: an illumination component;
  • the lens group is used to guide the light beam of the illumination assembly to a specific area of the substrate, the lens group includes at least one Fresnel lens: and a camera for receiving the reflected light after the illumination light acts on the substrate surface, the camera includes a time delay integral (TDI) ) Sensor.
  • TDI time delay integral
  • the automated optical inspection system and method described below is used for the detection, determination and classification of imprinted pattern defects on a flat display substrate.
  • the flat panel display includes a liquid crystal display, an organic light emitting diode substrate, a reticle, and a semiconductor wafer.
  • the automated optical inspection system and method is referred to herein as the AOI system, which is comprised of optical modules.
  • the optical module includes an illumination source and an array of lenses for projecting light from the source onto the surface of the substrate.
  • the lens array of the present invention includes at least one Fresnel lens.
  • the optical module also includes a camera for receiving a reflective portion, a scattering portion or a transmissive portion of the light projected onto the substrate.
  • the camera includes a time delay integration sensor or a linear scan charge coupled device (CCD).
  • a telecentric lens projects the reflected, scattered or transmitted light from the substrate onto the camera.
  • the illumination section has a controller that controls a plurality of light emitting diode (LED) sources, and the different LEDs emit light of different wavelengths.
  • the controller can individually control each LED source.
  • the illumination portion includes a front illumination source and a backlight illumination source, each of which includes a bright field and a dark field source.
  • Another example of an automated optical inspection system described herein includes a single LED source that can generate light waves of different wavelengths.
  • a feedback system is coupled to the output of the camera, which controls the intensity of the illumination and the gain of the camera.
  • the camera is connected to the image acquisition and processing system using a cable or fiber optic cable.
  • the invention has high sensitivity and can provide high-resolution images, and the defect detection sensitivity can be optimized by adjusting different wavelengths - the output light intensity of the LED lamp, and the lens thickness can be reduced by using a Fresnel lens to reduce weight and volume by using TDI the camera may be relatively short; the acquisition of a large number of signal sampling time, as compared with other video scanning method, the scanning line may be provided having a higher response speed.
  • FIG. 1 is a schematic view showing an example of an optical module of an automatic optical inspection system of the present invention
  • Figure 2 is a schematic view showing another example of the optical module of the moving optical detecting system of the present invention.
  • FIG. 3 is a structural diagram of a sample example of a Fresnel lens in an optical module of the automatic optical inspection system of the present invention
  • FIG. 4 is a schematic view showing an example of a method of using dark field detection in an automatic optical inspection system of the present invention
  • Figure 5 is a schematic illustration of an example of bright field and dark field detection of an optical module in an automated optical inspection system of the present invention
  • Figure 6 is a schematic illustration of an example of an optical module with backlight illumination in an automated optical inspection system of the present invention
  • FIG. 7 is a schematic view showing an example of an optical module using a mirror for backlighting in the S-moving optical detection system of the present invention.
  • Figure 8 is a combination of positive light, backlight illumination, bright field and dark field detection of the optical module in the automatic optical inspection system of the present invention.
  • Figure 9 is a schematic illustration of an example of an optical module with a feedback system of the automated optical inspection system of the present invention.
  • Figure 10 is a schematic illustration of an example of an automatic optical inspection system module of the present invention.
  • Figure 11 is a schematic view of the automatic optical inspection system of the present invention, which is composed of different optical modules and has different supervisions.
  • Figure 12 is a schematic view showing an example of an automatic optical detecting system for detecting a large substrate of the present invention
  • Figure 13 is a schematic illustration of an example of a high speed actuator of the detection system of the present invention.
  • the optical module 605 is used to detect the substrate and to determine and locate defects, which can be achieved by detecting a defect signal proportional to the incident light intensity and the integral time product.
  • the optical module 605 includes a plurality of LED light sources, each of which emits light of a different wavelength onto the planar substrate being inspected. Although the optical module 605 has three LED sources for generating three wavelengths of light in this example, a different number of LEDs or wavelengths can be used in practical applications.
  • the multi-source optical module 605 includes LED 301 to generate light of wavelength ⁇ , LED 302 to generate light of wavelength ⁇ , LED 303 to generate light of wavelength Ij, and the output beam of LED is collimated by lenses 311, 312 and 313, and The dichroic beamsplitters 314 and 315 are combined.
  • the dichroic beam splitter 314 reflects light having a wavelength of ⁇ and light having a wavelength of 4.
  • the dichroic beam splitter 315 transmits light of wavelength A and reflects light of wavelength ⁇ .
  • the control unit 330 independently controls the light intensity of the three wavelengths of light.
  • the intensity of the surface of the sample I is given by the formula:
  • / /, + /, + I
  • / 2 , and / 3 are the output light intensities of the LED light source with wavelengths ⁇ , ⁇ , , ⁇ respectively.
  • the intensity of the LED source 3CH-303, / 2 , and / 3 can be individually adjusted from 0 to 100%, which optimizes the sensitivity of defect detection for different sample surfaces.
  • the optical properties and thickness of a film plated on a substrate can affect the reflectivity of light at different wavelengths.
  • light of certain wavelengths has higher defect detection sensitivity than light of other wavelengths.
  • the adjustability of the relative intensity of light at different wavelengths optimizes defect detection sensitivity, but this is very difficult to achieve with conventional fiber optic sources.
  • the optical module 605 can compensate for the non-uniformity of the optical system for different spectral transmissions and the optical response of the CCD sensor. Therefore, the optical module 605 can provide a true flat illumination spectrum, which is very important for detecting a substrate that generates a lot of noise due to uneven thickness of the surface coating.
  • adding another source can also illuminate and image the dark field (not shown), such as illuminating the surface at an oblique angle with a laser.
  • the optical module 605 between the color filter 315 and the beam splitter 307 on the illumination light path, there is a cylindrical lens 202 and a spherical lens 203.
  • the lenticular lens 202 and the spherical lens 203 are configured and positioned for controlling the shape formed by the light of each of the LED output light sources projected on the substrate.
  • the illumination area collected on the surface of the substrate is a narrow linear region.
  • the illumination area should also be optimized to match at least one or all of the aspect ratio, size, and field of view of the imaging sensor on the substrate.
  • Optical module 605 also contains The imaging lens 205 on the reflection path of the beam splitter 307; the beam splitting mirror 308 of the beam splitter 307 faces the imaging lens 205 such that the light beam from the sample surface 204 or the substrate is not imaged by the beam splitter 307.
  • the optical module 605 specifically achieves the elimination of aberrations caused by the thickness of the beam splitter.
  • Light from the imaging lens 205 is directed to a camera 206 equipped with a linear scanning charge coupled device (CCD) or a time delay integrator (TDD), as described below.
  • CCD linear scanning charge coupled device
  • TDD time delay integrator
  • the optical module 200 of the automated optical inspection system includes a plurality of LED light sources, each of which is configured to output light of different wavelengths. Although there are three LED sources in the optical module 200 in this example and each of which can output three wavelengths of light, the device can be configured with different LED sources and/or wavelengths.
  • the optical module 200 having a plurality of light sources includes an LED 301 output source having a wavelength of Aj, an LED 302 output source having a wavelength of ⁇ , and an LED 303 output source having a wavelength of ⁇ .
  • the output light source is calibrated via lenses 31 1 , 312 and 313 and combined by dichroic beamsplitters 314 and 315.
  • the dichroic beam splitter 314 reflects light of a wavelength of 12 and a light of a wavelength of four.
  • the dichroic beam splitter 315 transmits light of wavelengths ⁇ and ⁇ , and reflects light of wavelength 4.
  • the control unit 330 independently controls the light intensity of the light sources of the three wavelengths.
  • the calculation of the surface illumination intensity of the sample is as shown in Figure 1 above.
  • the light intensity /, 1 2 , and / 3 of the LED light sources 301-303 can be independently adjusted from 0 to 100% light intensity to optimize the sensitivity of surface defect detection of different samples: degree.
  • the optical module 200 includes a lenticular lens 202 and a ball-shaped lens 203 between the color filter 315 and the beam splitter 307 on the illumination light path.
  • the lenticular lens 202 and the spherical lens 203 are configured and positioned to control the shape of the light output from the LED output source onto the base plate.
  • the illumination area collected on the surface of the substrate is a narrow linear area. The illumination area should be optimized to match at least one or all of the aspect ratio, size, and field of view of the imaging sensor on the substrate.
  • the optical module 200 includes an imaging lens 205 on a path of light between the beam splitter .307 and the sample surface 204; the beam splitting mirror of the beam splitter 307 faces the camera 206, which directly reflects the light 308 from the sample surface 204 to a linear
  • the camera 206 of the charge coupled device (CCD) or time delay integrator (TDI) is scanned such that the beam from the sample surface 204 or substrate does not pass through the beam splitter 307.
  • the light module 200 includes lenses 311, 3 12, 313, 316, 202 and 203 between the light source and the beam splitter 307 on the optical path.
  • Each of the lenses 31 1, 312, 313, 3 16, 202 and 203 is configured to collect and direct light from the light sources 301-303 to the substrate surface 204, each lens 31 1 , 312 , 313 , 316 , 202 and 203 It is a Fresnel lens.
  • FIG. 3 shows an example of a Fresnel lens 300 included in the optical module 200.
  • the optical module 200 replaces the conventional lens with a polypropylene resin Fresnel lens 300.
  • the Fresnel lens 300 replaces the large amount of material required for conventional lens production with a light and thin plastic sheet that is directly laminated.
  • the Fresnel lens 300 can have a large aperture and a short focal length without the need for a very heavy and bulky material like other lenses. versus Compared to other types of lenses, the Fresnel lens 300 is lighter and has a higher light transmittance. Because the Fresnel lens is very thin, there is little or no loss of light due to absorption.
  • the Fresnel lens 300 is constructed of a set of concentric annular structures called Fresnel zones, which reduces the amount of material required for conventional spherical lenses. For each Fresnel zone, the overall thickness of the lens is greatly reduced, equivalent to cutting a standard lens with a continuous surface into a set of surfaces having the same curvature but not being continuous. This greatly reduces the lens thickness (thus reducing the weight reduction volume), but at the expense of reduced lens imaging quality.
  • the configuration of the light module 200 can employ the Neel lens 300 because the TDI sensor reads only one pixel at a time in the scanning direction instead of one picture, so the illumination line of the optical module 200 is much wider than the imaging area, so the surface is Only a small, relatively uniform linear region is utilized. Therefore, any degradation in the quality of the image produced by the Fresnel lens does not prevent the Fresnel lens from being used in the optical illumination system of the automated optical inspection system of the present invention.
  • the reflected light 308 from the substrate 204 should be perpendicular to the TDI camera 206 because the movement of the imaging direction coincides with the direction of charge movement (via the sensor of the camera 206).
  • the configuration of the optical module satisfies this requirement by injecting incident light into the substrate surface 204 via the beam splitter 307.
  • the same beam splitter directs the scattered light and/or transmitted light reflected by the substrate 204 into the TDI camera 206.
  • Imaging lens 205 is positioned in the optical path to direct light from substrate surface 204 into TDI camera 206.
  • the light module 200 employs a more compact design with an imaging lens 205 placed between the beam splitter 307 and the substrate surface 204 such that the imaging lens 205 collects and directs reflected light from the substrate 204.
  • the imaging lens 205 in the optical module 200 has a relatively small ⁇ distance.
  • the optical module 200 includes an imaging lens 205 that employs a telecentric lens.
  • the configuration of the telecentric lens is such that the optical axes from all points of the object or image are parallel.
  • the telecentric lens provides coaxial imaging light.
  • the automatic optical detection system of the present invention uses a telecentric lens because the final image has a fixed magnification and geometry, and the telecentric lens makes the size of the object unaffected by the position of the object image in the field of view, even when the object is at a distance from the lens. It doesn't matter if there are some changes.
  • the telecentric lens and the LED light source can be used to optimize the telecentric effect, because the LED is illuminated by a telecentric lens, which can generate parallel beams. Therefore, the incident light and the reflected light from the substrate surface 204 pass through the imaging lens 205 in the same optical path.
  • telecentric lenses have the same magnification for objects at any distance from the lens, so telecentric lenses produce images of the same size for objects of any distance, maintaining a fixed viewing angle over the entire field of view.
  • An object that is too close or too far away from the telecentric lens will cause focus blur, but even a blurred image will have the same size as a sharply focused image.
  • Telecentric lenses applied to machine vision systems thus provide images of fixed size and geometry over a range of distances and throughout the field of view.
  • Automated optical inspection of machine vision systems using telecentric lenses thus overcomes many of the common problems of machine vision systems that use conventional lenses, including but not limited to: Apparent size changes due to object distance changes, due to absence A variant caused by the central area of the field of view (using a conventional lens, the object's view at the edge and the object's viewing angle are different in the central region of the field of view).
  • a substrate to be inspected has two surfaces: a substrate on the bottom layer and a graphic structure on the upper layer.
  • the telecentric lens does not receive a shadow image that is reflected from the underlying layer (such as the underlying graphic structure we are interested in; i-plate); ⁇ is when the incident light is incident on the substrate, The shadow image is just below the graphic structure.
  • the image acquired by TDI is the top view of the substrate. All lower shadows can be blocked by the graphics above them.
  • the shadow image is used as background noise in image processing. Therefore, the use of a telecentric imaging lens can reduce the background noise of the optical module 200 of the automated optical inspection system.
  • the optical module 200 includes a TDI camera 206 for capturing an image of the substrate, as described above.
  • the TDI camera is a linear scanning camera that contains a TDI sensor.
  • TDI cameras can accumulate multiple exposures to the same object, effectively increasing the integration time for collecting incident light.
  • the motion of the object should be synchronized with the exposure of the TDI to ensure image quality.
  • TDI cameras can acquire a large number of signals in a relatively short sampling time, thus providing a linear scan with higher response speed than other video scanning methods.
  • the TDI camera can scan at a high speed or at the same speed in low light conditions.
  • the TD1 sensor contains multiple rows of photodetectors or sensors (eg, photodetectors from 4 rows to 96 rows). When each of the photodetectors in a row of photodetector arrays is struck by photons, a charge proportional to the number of photons is generated.
  • the TDI camera-based system collects images of moving objects by time-delay multiple exposure, so the Hi-op optical detection system moves the detected substrate to synchronize with the linear image acquired by the TDI camera. This movement allows the substrate to pass through the field of view of the TDI lens one line at a time, just as the document passes through the scanner.
  • the acquired linear image (a portion of the K-plate) is sequentially moved from one row of detectors to the next row of detectors. ; The same time, the charge stored in TDI camera movement thereof with movement of the image to be consistent.
  • the charge representative of the substrate image also flows sequentially to the adjacent photodetectors and accumulates. In this way, the TDI sensor accumulates (integrates) linear images on several rows of sensors, allowing the image to acquire more illumination.
  • the TDI camera transmits the linear image to the image capture card, and integrates the pixel information into a complete image.
  • the integrated image signal has better signal-to-noise ratio and dynamic range. More integration time enables faster dynamic image acquisition. Furthermore, because the operation of the TDI camera can effectively average the fluctuation of the intensity of the DC light source, the LED light source can be used instead of the high-power, high-consumption and high-temperature DC halogen lamp, thereby reducing the maintenance cost of the system.
  • the automated optical inspection system herein uses a TDI camera 206, various other highly sensitive detectors are included within the optical module 200 of the automated optical inspection system, such as: Enhanced Charge Coupled Device (ICCD), Photomultiplier Tube (PMT), linear scan charge coupled device, complementary metal oxide semiconductor (CMOS:).
  • ICCD Enhanced Charge Coupled Device
  • PMT Photomultiplier Tube
  • CMOS complementary metal oxide semiconductor
  • the above automatic optical detection system uses the bright field detection principle for substrate detection.
  • the bright field method directly acquires an image of the surface of the substrate from the reflected light of the substrate.
  • Some defects (such as scratches, particles, etc.) A have a strong dark field optical response, and some defects have a strong bright field optical response. Therefore, in order to reliably detect various types of defects, another automatic optical inspection system is designed to detect the substrate by using the dark field method as a complement to the bright field method.
  • Figure 4 is a schematic diagram showing the method of detecting the field of the automatic optical detection system.
  • the incident light 601 is incident obliquely to the substrate by one or more places.
  • the incident light 601 acts on the substrate to generate reflected light 602 and scattered light 603.
  • Lens group 604 is collected from The scattered light 603 on the surface of the substrate is directed to a detector.
  • FIG. 5 is a schematic illustration of an automated optical inspection system optical module 500 that uses brightfield and darkfield detection methods.
  • the configuration and function of the bright field detecting portion of the optical module 500 is as described in the previous Fig. 2 (optical module 200).
  • the optical module 500 includes a dark field source 701 in addition to the bright field LED sources 301-303 described above.
  • the dark field source 701 contains one or more LEDs, bulbs, fiber optic illumination, and laser sources.
  • Lens 702 converges incident light 703 from dark field source 701 onto substrate surface 204.
  • the dark field illumination area and the bright field illumination area should overlap.
  • the incident light 703 acts on the substrate surface 204 to generate reflected light 704 and scattered light 705.
  • Imaging lens 205 collects scattered light 705 and images it on TDI camera 206.
  • Automated optical inspection systems also use backlighting or backside illumination to capture substrate images.
  • the backlight is set to place a light source below the substrate to be imaged.
  • the backlight can achieve high contrast for certain types of defects, such as island defects on glass substrates.
  • the back illumination can detect defects on the glass surface and inside the glass.
  • FIG. 6 is a schematic illustration of an automated optical inspection system employing backlighting.
  • the backlight enhances the detection rate of defects that are difficult to detect with some front light sources.
  • the automated optical inspection system optical module 600 includes a front light source 804 and a backlight 803.
  • the front light source 804 can include all of the aforementioned light sources.
  • the light source can be an LED, a light bulb or a fiber optic source.
  • the numerical aperture of backlight 803 should match front side light source 804 to ensure that as much light as possible enters the TDI camera.
  • Two sources illuminate the same area of the substrate surface.
  • the optical module 600 includes two air bearing brackets 603 with a vacuum, and a region between the brackets 603 is a backlight 803.
  • the bracket includes a compressed air inlet 801 and a vacuum outlet 802, wherein the vacuum provides a downward suction that maintains a stable sorghum movement of the substrate over the air float.
  • FIG. 7 is a schematic illustration of an optical module 700 containing a mirror 903 as an automated optical inspection system for backlight illumination.
  • the light output from the front light source 804 is incident on the mirror 903, and the reflected light from the mirror 903 provides a backlight source.
  • the mirror 903 has a triangular prism shape, but is not limited thereto.
  • Each side of the triangular prism mirror 903 is plated with a film having a different reflectance.
  • a backlight mirror with different reflectivity is selected for different substrates, and different intensity reflected light is used as a backlight by rotating or placing an appropriate triangular prism mirror.
  • the reflected light from the substrate surface and the mirror enters the TDI camera 206.
  • the area under which the mirror is placed under the substrate is much smaller than the area where other light sources (such as LEDs, bulbs, fiber optic lighting) are placed.
  • Another automated optical inspection system is designed to employ any geometry and any reflectivity and/or type of film, as well as different types of illumination sources such as diffuse light sources.
  • FIG. 8 is a schematic illustration of an optical module 800 of an automated optical inspection system employing a front light source and backlight and brightfield and darkfield detection methods.
  • the automated optical inspection system optical module 800 includes a front light source S04 and a backlight 803 for the bright field, as previously described.
  • Front light source 804 and/or backlight 803 can be one or more LEDs, light bulbs, fiber optic illumination.
  • the automated optical inspection system 800 includes a front light source 701 for dark field illumination and a backlight 1001, as previously described.
  • Dark field source 100! Contains one or more LEDs, bulbs, fiber optic illumination, or laser source.
  • the dark field source illumination area is 3 ⁇ 4 in weight with the bright field source illumination area.
  • the front side light source construction and operation in the optical module 800 is similar to the optical module 200 (Fig.
  • optical module 800 is similar to optical module 600 (FIG. 6) and optical module 700 (FIG. 7) described above.
  • the automated optical inspection system is designed with a feedback system that checks and compensates for any LED intensity attenuation through a standard sample. The standard sample is used to periodically measure the intensity of the LED. If the light intensity changes (eg, drops), the feedback system adjusts the LED operating current to provide the desired light intensity for the automated optical inspection system.
  • FIG 9 is a schematic illustration of an optical module 900 of an automated optical inspection system with a feedback system.
  • the optical module 900 in this example includes the optical module 200 previously described in Figure 2, but may also include any of the optical modules described in this patent.
  • the optical module 900 includes a feedback system including a control unit 1 102 that controls the gain output of the TDI camera 206 and the input of the LED power supply 1103.
  • the output of the power supply 1103 is coupled to the LED light sources 301-303 so that it can be controlled The current supplied to the LED light source.
  • the optical module 900 uses the mirror and 101 as a reference plane, and the reflected light from the mirror 101 is used as a standard for automatic calibration.
  • the light reflected back by the mirror 1101 enters the sensor of the TDI camera 206 and is measured and input to the control unit 1102. If the reading of the reflected light is less than the preset value, the control unit generates a signal or command to drive the power supply 1103 to increase the current of the LED source until the intensity reading on the TDI camera 206 returns to the preset value.
  • the standard mirror can also be used for calibration of TD1 cameras.
  • the output of each TDI sensor pixel is not necessarily the same when using reference mirror 1 101.
  • the difference in pixel output may result from the pixel optical response, the unevenness of the imaging lens and the light source.
  • the first step in TDI camera calibration is to measure the output of one pixel after it receives light from reference mirror 1 101.
  • the next step is to repeatedly measure the output at different light intensities. This can be done by reducing the illumination intensity or switching to a mirror with a different reflectivity.
  • the result of the measurement is used to determine the parameters of the two calibrations: ⁇
  • the slope and offset of each pixel or group of pixels When measuring the actual substrate, the output of each pixel is first subtracted from the offset, and then multiplied by the slope of this pixel, in this way to correct the unevenness between pixels.
  • Another feedback system is used to control the gain of the TDI camera 206 sensor to maximize the dynamic range of the sensor.
  • the feedback system controls or adjusts the maximum dynamic range of the TD1 sensor in two steps: first determining the digital output 1 when the TDI sensor is saturated, and then determining the digital output at the maximum of the image signal. 2.
  • the feedback system sets and maintains the value of the TD1 gain. Equal to digital output 1 divided by digital output 2. This gain value allows the sensor to reach the maximum dynamic range.
  • the automatic optical inspection system described in this patent is a projection system that can be newly constructed or increased or decreased to suit the substrate being inspected or the inspection operation.
  • FIG. 10 is a schematic diagram of module 1000.
  • the patch 1000 includes one or more components or combinations of components, such as a module including at least one light source 1201, two lenses 1202 and 1203 for directing light beams to the substrate, and a beam splitter 1204 for reflecting light from the substrate to the TDI camera. 1206.
  • the imaging lens 1205 forms an image of the substrate on the TD1 camera 1206.
  • a cable or fiber 1209 coupled to the lens is used to transmit image information from the TDI camera 1206 to the image capture card 1207.
  • the image capture card 1207 collects and analyzes image data and provides image data to the image processing computer 1208.
  • Each module ⁇ ⁇ ' ⁇ is independent, and the number and / or type of it installed on the system can be based on The specific substrate and inspection process are adjusted.
  • Figure 12 shows an automated optical inspection system that includes three optical modules 605.
  • FIG 11 is a schematic illustration of an automated optical inspection system 1 100 that includes an optical detection module 801 and a review camera, repair, and measurement module 802-806.
  • the automatic optical inspection system 1100 includes a plurality of (eg, three) optical detection modules 801, and an optical review camera module 802, a line width and line alignment measurement module 803, a film thickness measurement module 804, and a number.
  • Line/Alignment (CD/Overlay) measurements are accurate to 50nm or better. Any small vibration of the substrate will cause the measurement to exceed the accuracy range.
  • the airborne vacuum bracket of the automatic optical inspection system guarantees the measurement accuracy of the CD/Overla because it provides a downward suction that allows the glass to move stably at high speed on the air float.
  • a variety of functions can be implemented on the automated optical inspection system 1100. Other designs may employ different combinations of the above described patches.
  • the raw data generated by the TD1 camera of the automatic optical inspection system as described above is sent to an image collection card for image processing.
  • the traditional automatic optical inspection system uses a lens coupling cable to connect the TDI camera and the image acquisition card for image data transmission.
  • Lens coupling is a data transmission protocol that requires a specific cable.
  • the lens-coupled cable is subject to the tightness of the twisted pair, the strict requirements of shielding and length.
  • the cable length between a TDI camera (eg, on a rail located above the platform) and an image capture card (such as on an image processing computer) can reach or exceed 10 meters. Repeaters are needed to maintain signal integrity.
  • the automated optical inspection system uses fiber optics to capture the lens coupling cable between the TD1 camera and the frame grabber. It first converts the TDI camera's signal output into an optical signal, which is then transmitted by the fiber. At the image acquisition card end, the optical signal is converted back to the electrical signal.
  • the fiber is very thin, light and supple, and can be connected to long-distance components without the need for a repeater. H This image capture card or other data processor can be kept away from the automated optical inspection system. It is worth mentioning that the optical signal is not affected by the electrical interference and has a wider bandwidth than the lens-coupled cable (thus allowing for higher data traffic).
  • Figure 12 is an automated optical inspection system 1200 for detecting large size substrates.
  • the automated optical inspection system 1200 includes a platform 601 that includes an air flotation bracket 602 and an air flotation vacuum preload bracket 603.
  • the automated optical inspection system 1200 includes at least one optical module 605 (e.g., three optical modules 605).
  • the automatic optical inspection system 1200 is for detecting a large substrate such as a liquid crystal display (LCD) glass substrate 606, but is not limited thereto.
  • the optical module 605 includes an illumination source and an imaging assembly, as described above (such as the optical module 200 in FIG. 2, the optical module 500 in FIG. 5, the optical projection 600 in FIG. 6, and the optical replacement block 700 in FIG. As shown in Figure 8, optical module 800, as in optical module 900 in Figure 9)
  • each line trigger TD1 generates a pixel-wide substrate image.
  • the long side of the linear image area of one pixel wide is parallel to the linear motor shaft 604 (X-axis) that drives the movement of the optical head.
  • Glass 606 runs parallel to linear motor shaft 607 (y-axis) It is moved by the air flotation bracket 602 and the vacuum preload air flotation bracket 603.
  • the vacuum preload air flotation bracket 603 provides strict flight height control for the glass moving on the thin air float.
  • the linear motor shaft 604 drives the optical module stepwise along the X axis until all of the glass has been detected.
  • FIG. 13 shows a schematic of a detection system using a high speed actuator.
  • High speed actuators 1301 include, but are not limited to, pneumatic actuators, voice coil actuators, linear motor actuators, and solenoids.
  • the high speed actuator ⁇ 0 ⁇ includes an alignment pin 1304 for alignment or positioning of the substrate 1305.
  • the substrate can be loaded onto the alignment peg 1304 by the magazine or by its own weight.
  • the alignment pin 1304 is in contact with the substrate 1305 and is driven by the high speed actuator 1301.
  • the hard stop position 1302 of the alignment pin is controlled by a high resolution actuator 1303.
  • the urging force generated by the high speed actuator 1301 is less than the opposing directional force generated by the high resolution actuator 1303.
  • the hard stop 1302, controlled by the high resolution actuator 1303, determines the accuracy and resolution of the final position or alignment of the alignment peg.
  • the detection systems and methods described herein can be implemented by a variety of programmable circuits, including programmable logic devices (PLDs) such as field programmable gate arrays (FPGAs), programmable array logic (PAL) devices, and electronic Programming logic and memory devices and standard battery-based devices, ASICs should be ffl.
  • PLDs programmable logic devices
  • FPGAs field programmable gate arrays
  • PAL programmable array logic
  • ASICs standard battery-based devices
  • microprocessors with memory such as electronically erasable programmable read-only memory (EEPROM)
  • embedded microprocessors firmware, software, and more.
  • the detection system and method can be simulated by software-based circuits, discrete logic devices (continuous and combined), custom devices, fuzzy logic (in neural networks), quantum devices and a hybrid of the above various devices. to realise.
  • MOSFET metal oxide semiconductor field effect transistor
  • CMOS complementary metal oxide semiconductors
  • ECL emitter-coupled logic devices
  • polymer technology such as silicon-conjugated compounds and metal-conjugated polymers - gold structure
  • analog and digital hybrid devices and so on.
  • the components of the various detection systems and methods of the present invention can be described in terms of data and/or instructions by various computer readable media: from their behavior Ways, register transfers, logic components, transistors, layout, and/or other features.
  • the formatted data and/or instruction set of the computer readable medium includes, but is not limited to, various fixed memory media (such as optical, electromagnetic or semiconductor storage media) and via wireless, optical or cable or combinations thereof.
  • the carrier of the formatted data and/or instruction set can be transmitted.
  • Examples of transmitting such formatted data and/or instructions via carrier are, but are not limited to, merging or connecting one or more data transfer protocols (eg, HTTP, FTP, SMTP, etc.) for transmission (uploading, downloading, dice mail) Wait).
  • the methods of combining or connecting include, but are not limited to, wired connection, wireless connection, wired/wireless hybrid connection.
  • the connection may include, but is not limited to, various network and/or network components (not shown) that provide communication services.
  • the mentioned networks and corresponding network components including but not limited to, local area networks (LANs), Regional networks (MANs), wide area networks (WANs), private networks, terminal networks and the Internet.
  • detection systems and methods are described herein for illustrative purposes, and various modifications are possible within the scope of other detection systems and methods, as will be recognized by those skilled in the relevant art. .
  • teaching of the detection systems and methods provided herein can be applied to other processing systems and methods, not only to the detection systems and methods described above.

Abstract

L'invention concerne un système d'auto-test de substrat plan et un procédé associé. Le système comprend un module optique comprenant un ensemble d'éclairage (301, 302, 303) et des lentilles. Ces lentilles dirigent le faisceau lumineux sur la zone partielle du substrat et les lentilles comprennent au moins une lentille de Fresnel. Le module optique comprend une caméra qui reçoit la lumière réfléchie générée par la réaction des sources de lumière éclairantes et le substrat, et la caméra comprend un capteur intégré à retardement. Une lentille d'imagerie télémétrique (205) dirige la lumière réfléchie qui provient du substrat sur la caméra (206). L'ensemble éclairant (301, 302, 303) comprend une unité de commande (330) qui est raccordée aux sources de lumière DEL à unités multiples (301, 302, 303), et chaque source de lumière DEL (301, 302, 303) peut transmettre des faisceaux lumineux ayant des longueurs d'onde différentes. L'unité de commande (330) commande chaque source de lumière DEL (301, 302, 303) indépendamment.
PCT/CN2008/000439 2007-03-12 2008-03-05 Système d'auto-test de substrat plan et procédé afférent WO2008110061A1 (fr)

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CN101021490A (zh) 2007-08-22
KR101174081B1 (ko) 2012-08-14
KR20090122266A (ko) 2009-11-26

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