WO2008106862A1

WO2008106862A1 - Relay of patch type bent terminals

Info

Publication number: WO2008106862A1
Application number: PCT/CN2008/000412
Authority: WO
Inventors: Hui Yu
Original assignee: Shenzhen Zanty Electronics Co., Ltd
Priority date: 2007-03-03
Filing date: 2008-02-29
Publication date: 2008-09-12
Also published as: CN201017822Y

Abstract

A relay (13) which has patch type bent terminals (14) is suited to surface mounting technology. The terminals (6,8,11,12) of the relay (13) are of curved shape in which the bending angle is from 87 degree to 90 degree. The bent terminals (6,8,11,12) of the relay (13) are sheet structures and are suited to surface mounting technology.

Description

SMD type foot relay

Technical field

The utility model relates to an electronic accessory product, in particular to a patch type bending foot relay. Background technique

At present, the general relays use rigid pins for the board of the jack. However, with the continuous advancement and development of the electronics industry, surface mount technology (SMT) is constantly improving. Surface Mount Technology (SMT) is a miniature, lead-free or short-lead component that is directly attached to a printed circuit board. It is the key to miniaturization and integration of electronic systems. Currently the most popular electronic installation technology, surface mount technology (SMT) has replaced through-hole mounting (THT) technology in many fields. It is expected that more than 90% of electronic products will adopt surface mount technology in the future. SMT). The surface mount technology has high assembly density, small electronic product volume and light weight. The size and weight of the chip components are only about 1/10 of that of conventional plug-in components. Generally, after using this technology, the volume of electronic products can be reduced by 40%-60. %, the weight can be reduced by 60%-80% _; its stability and reliability are high, the vibration resistance is strong, the defect rate is low; the high frequency characteristics are good, the electromagnetic and radio frequency interference can be reduced, the automation is easy, and the production efficiency is improved. . For this reason, the through-hole mounting technology is also less and less, and the vertical pin structure of various electrical components needs to be improved.

The content of the utility model

The purpose of the present invention is to provide a patch-type bending foot relay suitable for surface mounting technology in view of the deficiencies of the prior art.

The purpose of the utility model is achieved by the following technical solutions:

The utility model relates to a patch type bending foot relay, which is composed of a relay and a pin connected thereto. The utility model is characterized in that the pin of the relay is set to a bent structure; the bending angle of the relay pin is 87°. To 90°, the bent pins of the relay are in a sheet-like structure.

The A and B feet of the bent pin of the relay are laterally fitted into the skeleton hole of the relay.

The reed pins and the reeds of the bent pins of the relay are clicked and inserted into the relay frame holes.

The C pin of the bent pin of the relay is pressed into the relay frame and wound around the C pin of the bent pin of the relay. The enameled wire drawn from the wiring package. All bending pins have a flatness of 1.17 ± 0.30 mm. The curved pin plane is 1.30 ± 0.50 mm from the skeleton height.

The features of the present invention, as well as the objects and advantages thereof, will be described in detail with reference to the accompanying drawings. DRAWINGS

1 is a schematic view showing the overall structure of a patch type bending foot relay;

Figure 2 is a view showing the internal structure of a patch type bending foot relay;

Figure 3 is a bottom view of a patch type foot relay;

4 is a schematic side view showing the appearance of a patch type bending foot relay;

Figure 5 is a schematic structural view of the A foot;

Figure 6 is a schematic structural view of the B-foot;

Figure 7 is a schematic structural view of a reed pin;

Figure 8 is a schematic view showing the structure of the C-pin.

Description of the reference numerals:

(1) outer casing; (2) armature; (3) yoke; (4) skeleton; (5) reed; (6) C-foot; (7) iron core; (8) A-foot; (9) static touch (10) moving contact; (11) B-foot; (12) reed pin; (13) relay; (14) patch-type bent foot.

detailed description

The present invention will be further described below in conjunction with the drawings and specific embodiments:

As shown in FIG. 1 to FIG. 8, the patch type bending foot relay of the present invention is composed of a relay (13) and a patch type bending leg (14) connected thereto, and a foot A is inserted into the relay frame (4). (8), B pin (11), reed pin (12), C pin (6), so that the two positions on the side of the relay frame (4), the two feet are named A foot (8 ), B (11), three feet on the other side, one of the legs is a reed pin (12), and the other two sides are a C pin (6).

The A-pin (8) is laterally assembled into the hole of the relay frame (4). After the A-pin (8) is pressed, the angle is bent outward by 87° to 90°. This bent-leg portion is suitable for the PCB board. Solder together to facilitate patching.

The B-foot (11) is assembled laterally into the hole of the relay frame (4). After the B-pin (11) is pressed, the angle is bent outward by 87° to 90°. This bent foot part is suitable for the PCB. The plates are welded together to facilitate the placement. The reed pin (12) is twisted together with the reed (5) to increase the pin strength without damaging the pin and is inserted into the hole in the relay frame (4) so that the angle is bent 87° to the outside. -90°, this bent foot part is suitable for splicing with the PCB board to facilitate the patch.

C pin (6) is pressed into the hole of the relay frame (4), and the enameled wire drawn from both ends of the wiring package on the C pin (6) is convenient for inputting the voltage, and the angle is bent outward by 87° ~ 90°. This bent foot portion is suitable for soldering to the PCB board and is suitable for surface mount assembly processes.

The flatness of all bent pins is 1.17 ± 0.30mm. The curved pin plane is 1.30 ± 0.50 mm from the skeleton height.

The length, width and height of the chip-type foot relay housing can be set as follows: The length of the housing is 20.3 ± 0.30mm, the width is 16.54 ± 0.30mm, and the height is 21.5 ± 0.30mm. The size of the housing can also be set according to actual needs.

The utility model has the advantages that: the patch type bending foot relay can be applied to the surface mounting process flow, and the patch type bending foot relay has high reliability and strong anti-vibration capability after the patch welding, and the solder joint The defect rate is low, the yield of the finished product is high, and it is easy to automate and improve production efficiency.

The above description is only a preferred embodiment of the patch type bending foot relay of the present invention, and does not impose any limitation on the technical scope of the present invention, and all the embodiments are made according to the technical essence of the present invention. Any minor modifications, equivalent changes and modifications are still within the scope of the technical solutions of the present invention.

Claims

A patch type bending foot relay comprising a relay and a pin connected thereto, and the utility model is characterized in that the pin of the relay is set to a bent shape.

2. A patch-type bent foot relay according to claim 1, wherein the bent pin of the relay has a bending angle of 87 to 90

3. A patch type foot relay according to claim 1, wherein the bent pin of the relay is a sheet-like structure.

4. A patch type foot relay according to claim 1, wherein the A and B feet of the bent pin of the relay are laterally fitted into the skeleton hole of the relay.

5. A patch-type foot relay according to claim 1, wherein the reed pin of the bent pin of the relay is spot-welded with the reed and inserted into the hole of the relay frame.

6. A patch-type foot relay according to claim 1, wherein the C-pin of the bent pin of the relay is pressed into the relay frame.

7. A patch-type bent foot relay according to claim 1, wherein the enameled wire of the wiring package is wound around the bent pin of the relay.

8. A patch-type foot relay according to claim 1, wherein all of the curved pins have a flatness of 1.17±0. 30.

9. The patch type foot relay according to claim 1, wherein the bending pin plane distance skeleton height is 1.30±0. 50.