JPH05217479A - Surface mounting type electromagnetic relay - Google Patents

Surface mounting type electromagnetic relay

Info

Publication number
JPH05217479A
JPH05217479A JP4019593A JP1959392A JPH05217479A JP H05217479 A JPH05217479 A JP H05217479A JP 4019593 A JP4019593 A JP 4019593A JP 1959392 A JP1959392 A JP 1959392A JP H05217479 A JPH05217479 A JP H05217479A
Authority
JP
Japan
Prior art keywords
external connection
relay
cover
circuit board
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4019593A
Other languages
Japanese (ja)
Inventor
Yoshio Okamoto
良夫 岡本
Hirotsugu Hanada
曠嗣 花田
Takashi Miura
隆 三浦
Takanori Tanaka
高典 田中
Shinichi Sato
進一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4019593A priority Critical patent/JPH05217479A/en
Publication of JPH05217479A publication Critical patent/JPH05217479A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/58Electric connections to or between contacts; Terminals
    • H01H2001/5888Terminals of surface mounted devices [SMD]

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To suppress deformation, etc., of covers due to the heat at the time of mounting and improve the productivity by making the external connection terminal part visible with eyes and thickening the thickness of the covers without widening the mounting surface area of a realy on a circuit substrate. CONSTITUTION:The external face of circumferential wall of a cover 6 to be mounted on a relay main body 2 is so made as to locate near the region formed in the case the tips of respective external connection terminals 22a-1', 22b-1', 22b-2' of the main body 2 are connected. Also, in the region corresponding to each external connection terminal, a connection region for at least a circuit substrate 4 of each external connection terminal is composed while a recessed part which can be observed with eyes from right above or obliquely above outside is formed. As a result, the thickness of the circumferential wall of the cover 6 except the regions corresponding to the external connection terminals is made thick in the region of the external connection installation, that is, the range of the region where connection electrodes of the substrate 4 are formed. Consequently, deformation and strain and damage of the cover due to the heat at the time of being mounted on the substrate 4 are prevented and the productivity is improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は表面カバーを持つ表面実
装型電磁継電器の構成に係り、特に実装時の熱によるカ
バーとしての変形や歪・破損等を防止して生産性の向上
を図った表面実装型電磁継電器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a surface mount type electromagnetic relay having a surface cover, and in particular, it is intended to improve productivity by preventing deformation, distortion and damage as a cover due to heat during mounting. The present invention relates to a surface mount type electromagnetic relay.

【0002】近年の電子機器分野においては装置の小型
化要求に対応するため、回路基板に搭載する電磁継電器
の該基板に対する実装手段に実装が容易で且つ専有面積
が小さくし得る表面実装技術が多用されるようになって
きている。
In recent years, in the field of electronic equipment, in order to meet the demand for downsizing of devices, surface mounting technology is widely used which can be easily mounted on a mounting means of an electromagnetic relay mounted on a circuit board and can occupy a small occupied area. Is becoming popular.

【0003】[0003]

【従来の技術】図3は従来の表面実装型電磁継電器の構
成例を概略的に説明する図であり、(3-1) は全体構成を
回路基板と共に斜視図で示し(3-2) は回路基板に実装し
た状態を矢示A方向から見た断面で表わしたものであ
る。
2. Description of the Related Art FIG. 3 is a diagram schematically illustrating a configuration example of a conventional surface mount type electromagnetic relay. (3-1) shows the entire configuration together with a circuit board in a perspective view (3-2). 3 is a cross-sectional view of a state of being mounted on a circuit board as seen from the direction of arrow A. FIG.

【0004】なお図では継電器本体が2トランスファタ
イプである場合を例としている。図3で表面実装型電磁
継電器(以下単に継電器とする)1は、継電器本体2と
該継電器本体2に装着される樹脂成形品からなるカバー
3とで構成されている。
In the figure, the case where the relay body is of the two-transfer type is taken as an example. In FIG. 3, a surface mount type electromagnetic relay (hereinafter, simply referred to as a relay) 1 includes a relay body 2 and a cover 3 made of a resin molded product and mounted on the relay body 2.

【0005】この内継電器本体2は、電磁石21と該電磁
石21に通電したときに該電磁石21に発生する吸引力で動
作する2個の接点バネ組22および該電磁石21と接点バネ
組22を固定するベース基板23とで構成されている。
In this inner relay main body 2, an electromagnet 21 and two contact spring sets 22 which are operated by an attractive force generated in the electromagnet 21 when the electromagnet 21 is energized and the electromagnet 21 and the contact spring set 22 are fixed. And a base substrate 23 that

【0006】そして該電磁石21の図示されないコイルに
繋がる2個(図では片側1個のみ記載)の外部接続端子
21a 間に所要の電位を印加することで、該電磁石21に係
合する2個のヨーク片 21b-1,21b-2の片側(図では 21b
-1)に常時接触しているアーマチュア21c (図では往復
動する自由端部のみ記載)が他方のヨーク片 21b-2に吸
引されるようになっている。
Two external connection terminals (only one on each side is shown) connected to a coil (not shown) of the electromagnet 21.
By applying a required electric potential between 21a, one side of the two yoke pieces 21b- 1 and 21b- 2 (21b- 1 in the figure, which are engaged with the electromagnet 21).
The armature 21c (only the free end part that reciprocates in the figure) that is constantly in contact with -1 ) is attracted to the other yoke piece 21b -2 .

【0007】なお、上記コイルに繋がる外部接続端子21
a は該電磁石2を固定するベース基板23を貫通した後外
側に曲げられた表面実装用端子として形成されている。
一方上記ヨーク片 21b-1,21b-2存在領域の両側に位置す
る2個の接点バネ組22は、上記ベース基板23の電磁石21
固定位置の両側に対面するように一端で固定されて配設
されている2個の舌片状の可動接点バネ 22a-1,22a-2
該各可動接点バネ 22a-1,22a-2の自由端近傍の両側に対
面させて配設されている固定接点板 22b -1,22b-2と 22c
-1,22c-2および上記アーマチュア21c に直角に固定され
て共に移動するカード22d とで構成されており、該カー
ド22d 長手方向の上述した可動接点バネ 22a-1,22a-2
対応する位置に形成されている溝に該各可動接点バネが
挿入されて構成されている。
The external connection terminal 21 connected to the coil
a is the outside after penetrating the base substrate 23 for fixing the electromagnet 2.
It is formed as a surface-mounting terminal bent to the side.
On the other hand, the above yoke piece 21b-1, 21b-2Located on both sides of the existence area
The two contact spring sets 22 are the electromagnets 21 of the base substrate 23.
Placed fixed at one end so as to face both sides of the fixed position
Two tongue-shaped movable contact springs 22a-1, 22a-2When
Each movable contact spring 22a-1, 22a-2On both sides near the free end of
Fixed contact plate 22b arranged facing -1, 22b-2And 22c
-1, 22c-2And fixed at a right angle to the armature 21c above
Card 22d that moves with
22d Longitudinal movable contact spring 22a described above-1, 22a-2When
The movable contact springs are provided in the grooves formed at the corresponding positions.
Inserted and configured.

【0008】従って、上記ヨーク片 21b-1,21b-2間をア
ーマチュア21c が往復動したときには該アーマチュア21
c と共に往復動するカード22d によって可動接点バネ 2
2a-1,22a-2を該往復動方向に撓ませることができる。
Therefore, when the armature 21c reciprocates between the yoke pieces 21b- 1 and 21b- 2 , the armature 21c is reciprocated.
Moving contact spring 2 by card 22d reciprocating with c
2a -1 , 22a -2 can be bent in the reciprocating direction.

【0009】そして、上記電磁石21に電位が印加されて
いない常態ではすなわちアーマチュア21c が片側のヨー
ク片 21b-1と接触しているときには可動接点バネ 22
a-1,22a -2はそれぞれ固定接点板 22b-1,22c-1と接触
し、また上記電磁石21に電位が印加されたときにはすな
わちアーマチュア21c が他方のヨーク片 21b-2と接触し
たときには該各可動接点バネ 22a-1,22a-2がそれぞれ固
定接点板 22b-2,22c-2と接触するようになっている。
When a potential is applied to the electromagnet 21,
In the normal state, that is, the armature 21c has a yaw on one side.
Piece 21b-1Movable contact spring 22 when in contact with
a-1, 22a -2Fixed contact plate 22b-1, 22c-1Contact with
In addition, when electric potential is applied to the electromagnet 21,
The armature 21c is the other yoke piece 21b.-2In contact with
When each of the movable contact springs 22a-1, 22a-2Each is solid
Constant contact plate 22b-2, 22c-2To come into contact with.

【0010】なお可動接点バネ 22a-1,22a-2の各外部接
続端子 22a-1′,22a-2′(図では 22a-1′のみ記載)と
各固定接点板 22b-1,22b-2,22c-1,22c-2の外部接続端子
22b -1′,22a-2′,22c-1′,22c-2′(図では 22b-1′,2
2c-1′,22c-2′が記載)とは、いずれも上記コイルに繋
がる外部接続端子21a と同様にベース基板23を貫通した
後外側に曲げられた表面実装用端子に形成されている。
The movable contact spring 22a-1, 22a-2Each external connection
Continuation terminal 22a-1′, 22a-2′ (22a in the figure-1′ Only)
Each fixed contact plate 22b-1, 22b-2, 22c-1, 22c-2External connection terminal
 22b -1′, 22a-2′, 22c-1′, 22c-2′ (22b in the figure-1′, 2
2c-1′, 22c-2'Is written) and both are connected to the above coil.
The same as the external connection terminal 21a
It is formed on the surface-mounting terminal that is bent rearward and outward.

【0011】従って、上記電磁石21に対する電位を印加
しまたはそれを解除することで2回路の回路切り換えを
実現することができる。一方、有底箱形のカバー3はそ
の周壁開口部内側に形成されている段差面3aで上記ベー
ス基板23に位置決め固定し得るように形成されているも
のであり、該段差面3aをベース基板23の周囲に嵌合させ
た後例えば接着等の固定手段を経ることで図に示す継電
器1を構成することができる。
Therefore, by applying or releasing the electric potential to the electromagnet 21, switching between the two circuits can be realized. On the other hand, the bottomed box-shaped cover 3 is formed so that it can be positioned and fixed to the base substrate 23 by the step surface 3a formed inside the opening of the peripheral wall thereof. After fitting around 23, the relay 1 shown in the figure can be constructed by passing through fixing means such as adhesion.

【0012】なお図の4は上記各外部接続端子と対応す
る位置に接続電極4aがパターン形成されている回路基板
であり、該接続電極4aと上記継電器1の各外部接続端子
とを対応させた位置で該継電器1を矢印Bのように降下
させて各接続電極4a上に搭載した後通常のリフロー技術
等による半田付け手段で両者を接続することで(3-2)に
示す如く該継電器1を回路基板4に実装することができ
る。
4 is a circuit board in which connection electrodes 4a are pattern-formed at positions corresponding to the external connection terminals, and the connection electrodes 4a and the external connection terminals of the relay 1 are made to correspond to each other. At the position, the relay 1 is lowered as shown by an arrow B and mounted on each connection electrode 4a, and then the both are connected by a soldering means such as a normal reflow technique, as shown in (3-2). Can be mounted on the circuit board 4.

【0013】かかる構成になる継電器1では、回路基板
4に実装した後の各外部接続端子領域が例えばCの範囲
で目視できるので該領域における接続状態の良否を容易
に検査することができる。
In the relay 1 having such a structure, each external connection terminal area after being mounted on the circuit board 4 can be visually observed in a range of C, for example, so that it is possible to easily inspect the connection state in the area.

【0014】[0014]

【発明が解決しようとする課題】しかし、電子装置の小
型化要求が高まるにつれて種々の電子デバイスひいては
継電器もその大きさを小さくせざるを得ずそのため継電
器本体2をできるだけ小さいカバーに収容しなければな
らない。
However, with the increasing demand for miniaturization of electronic devices, the size of various electronic devices and relays must be reduced, and therefore the relay body 2 must be accommodated in a cover as small as possible. I won't.

【0015】一方、回路基板に対する実装状態を検査す
るには外部接続端子領域が目視し得るように露出してい
なければならない。従って、結果的にカバーとしての肉
厚を例えば1mm程度もしくはそれ以下の如く薄くしてい
る現状にある。
On the other hand, in order to inspect the mounting state on the circuit board, the external connection terminal region must be exposed so as to be visible. Therefore, as a result, the thickness of the cover is reduced to about 1 mm or less.

【0016】しかしかかる肉厚の薄いカバーが装着され
ている継電器では、回路基板への実装時に加わる熱によ
って該カバーの外部接続端子近傍が変形したりカバー全
体としての形状に歪や破損が発生して外観品質の低下を
もたらすことがあると言う問題があり、またこれらの変
形や歪・破損等が該カバーの内面に近接して位置する継
電器本体構成部材と接触したり極端に接近して継電器と
しての特性低下を誘起することがあると言う問題があっ
た。
However, in a relay having such a thin cover, the heat applied during mounting on the circuit board may deform the vicinity of the external connection terminal of the cover or cause distortion or damage to the shape of the cover as a whole. However, such deformation, distortion, damage, etc. may cause contact with or extremely close to the relay body constituent members located close to the inner surface of the cover. However, there is a problem that the deterioration of the characteristics may be induced.

【0017】[0017]

【課題を解決するための手段】上記課題は、継電器本体
から導出される複数の外部接続端子が外側に曲げられた
後実装する回路基板面に沿うように形成され、且つ該継
電器本体の回路基板と対面する領域を除く全周囲が上記
外部接続端子の回路基板に対する接続領域が露出するよ
うに有底箱形の樹脂成形品からなるカバーで覆われて構
成されている表面実装型電磁継電器であって、継電器本
体に装着するカバーの周壁外面が、該継電器本体の各外
部接続端子の先端を繋いだときに形成される領域範囲近
傍に位置するように形成されていると共に、各外部接続
端子と対応する領域では該各外部接続端子の少なくとも
回路基板に対する接続領域が真上または外側斜上方から
目視し得るような凹部を具えて構成されている表面実装
型電磁継電器によって達成される。
SUMMARY OF THE INVENTION The above-mentioned problems are formed so that a plurality of external connection terminals led out from a relay body are bent along the outside and are formed along a surface of a circuit board to be mounted, and a circuit board of the relay body. The surface mount type electromagnetic relay is configured by covering the entire periphery except the area facing with the above with a cover made of a box-shaped resin molded product with a bottom so that the connection area of the external connection terminal to the circuit board is exposed. The outer surface of the peripheral wall of the cover mounted on the relay body is formed so as to be located in the vicinity of the area formed when the tips of the external connection terminals of the relay body are connected, and In the corresponding area, at least the connection area of each of the external connection terminals to the circuit board is provided with a concave portion that can be seen from directly above or obliquely above the outside. It is achieved Te.

【0018】[0018]

【作用】外部接続端子部分を目視可能とした上で継電器
としての回路基板に対する実装面積を拡げることなくカ
バーの肉厚を厚くすると、実装時の熱によるカバーの変
形や歪・破損等の発生を抑制することができる。
[Operation] If the thickness of the cover is increased without increasing the mounting area for the circuit board as a relay after making the external connection terminal visible, the deformation of the cover due to heat during mounting, distortion and damage may occur. Can be suppressed.

【0019】そこで本発明では継電器本体に装着するカ
バーの少なくとも周壁厚さを、該継電器本体の各外部接
続端子の先端を繋いだときに形成される領域を越えない
範囲まで厚くすると共に、その各外部接続端子と対応す
る領域では各外部接続端子が真上または斜上方から目視
し得るように従来とほぼ同じ厚さまでその肉厚を薄くし
て形成している。
Therefore, in the present invention, at least the thickness of the peripheral wall of the cover mounted on the relay main body is increased to the extent that it does not exceed the region formed when the tips of the external connection terminals of the relay main body are connected together. In a region corresponding to the external connection terminals, each external connection terminal is formed so that its thickness is reduced to almost the same thickness as the conventional one so that the external connection terminals can be viewed from directly above or obliquely above.

【0020】従って、継電器としての回路基板に対する
実装面積を拡げることなくまた実装状態の検査作業を抑
制することなくカバーとしての肉厚を増やすことができ
て、上述した外観品質の低下や特性低下等の防止による
生産性の向上を図ることができる。
Therefore, the thickness of the cover can be increased without increasing the mounting area for the circuit board as the relay and without suppressing the inspection work of the mounting state, and the deterioration of the appearance quality and the deterioration of the characteristics described above can be achieved. It is possible to improve productivity by preventing the above.

【0021】[0021]

【実施例】図1は本発明になる継電器の構成例を示す図
であり、図3同様に(1-1) は全体構成を回路基板と共に
斜視図で示し(1-2) は回路基板に実装した状態を矢示A
方向から見た断面で表わしたものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing an example of the structure of a relay according to the present invention. Like FIG. 3, (1-1) is a perspective view of the entire structure together with a circuit board, and (1-2) is a circuit board. Show the mounted state A
It is a cross section viewed from the direction.

【0022】また図2は他の構成例を示す図である。な
お図ではいずれも継電器本体が図3同様の2トランスフ
ァタイプである場合を例としているので、図3と同じ対
象部材には同一の記号を付して表わしていると共に図3
と重複する説明は省略している。
FIG. 2 is a diagram showing another configuration example. In each of the drawings, the case where the relay main body is a two-transfer type similar to that of FIG. 3 is taken as an example, and thus the same target members as those of FIG.
The description overlapping with is omitted.

【0023】図1で継電器5は、図3で説明した継電器
本体2と該継電器本体2に装着される樹脂成形品からな
るカバー6とで構成されている。そして特にこの場合の
該カバー6は、その周壁の外部接続端子導出側の2面の
厚さが該外部接続端子と対応する領域(例えば外部接続
端子 22b-1′には領域,外部接続端子 22b-2′には
領域,外部接続端子 22a-1′には領域)を除く部分で
該カバー6の高さ方向に沿う線状突出部6a1,6a2,6a3,…
として厚く形成されていると共に、これらの各線状突出
部6a1,6a2,6a3 …における外面は上記各外部接続端子 2
2b-1′,22b-2′,22a-1′…の先端部よりも後退した位置
に位置するようになっている。
In FIG. 1, the relay 5 is composed of the relay main body 2 described in FIG. 3 and a cover 6 made of a resin molded product and mounted on the relay main body 2. In particular, in this case, the cover 6 has an area where the thickness of the two surfaces of the peripheral wall on the external connection terminal lead-out side corresponds to the external connection terminal (for example, the area for the external connection terminal 22b- 1 ', the external connection terminal 22b). -2 'is a region, and external connection terminals 22a- 1 ' is a region excluding the region), and linear projections 6a 1 , 6a 2 , 6a 3 , ... along the height direction of the cover 6 are formed.
The outer surface of each of these linear protrusions 6a 1 , 6a 2 , 6a 3 ...
2b -1 ′, 22b -2 ′, 22a -1 ′ ... are located at a position retracted from the tip.

【0024】従ってかかる構成になるカバー6を装着し
た継電器5を矢印D1のように真上から見ると、上記突出
部6a1,6a2,6a3 …の隣接間に外部接続端子 22b-1′,22b
-2′,22a-1′…が目視されることとなる。
Therefore, when the relay 5 equipped with the cover 6 having such a configuration is viewed from directly above as shown by an arrow D 1 , the external connection terminal 22b -1 is provided between the adjacent protruding portions 6a 1 , 6a 2 , 6a 3 ... ′, 22b
-2 ', 22a -1 ' ... will be visually observed.

【0025】そこで、該継電器5の各外部接続端子と図
3で説明した回路基板4上の各接続電極4aとを合致させ
た状態で該継電器5を矢印Bのように降下させて回路基
板4上に載置し、通常のリフロー技術等による半田付け
手段で両者を接続することで(1-2) に示す如く継電器5
を回路基板4に実装することができる。
Therefore, with the external connection terminals of the relay 5 and the connection electrodes 4a on the circuit board 4 described with reference to FIG. Place it on the top of the relay and connect it to each other by soldering means such as ordinary reflow technology as shown in (1-2).
Can be mounted on the circuit board 4.

【0026】かかる継電器5では、カバー6の周壁の外
部接続端子対応領域を除く部分の肉厚が外部接続端子配
置領域ひいては回路基板4の接続電極形成領域の範囲内
で厚く形成されているので、実装時の熱による変形やカ
バー全体としての歪・破損およびこれらに起因する外観
品質の低下や継電器としての特性低下を抑制することが
できると共に、回路基板4に実装した後の各外部接続端
子領域が例えば矢印Eの範囲で目視できるので該領域に
おける接続状態の良否を容易に検査することができる。
In such a relay 5, the thickness of the peripheral wall of the cover 6 excluding the external connection terminal corresponding region is formed thicker within the external connection terminal arrangement region and further within the connection electrode formation region of the circuit board 4. It is possible to suppress deformation due to heat at the time of mounting, distortion / damage of the entire cover, deterioration of appearance quality and deterioration of characteristics as a relay due to these, and each external connection terminal area after mounting on the circuit board 4. Can be visually checked in the range of arrow E, so that the quality of the connection state in the area can be easily inspected.

【0027】他の構成例を示す図2で継電器7は、図3
の継電器本体2と該継電器本体2に装着される樹脂成形
品からなるカバー8とで構成されている。そしてこの場
合の該カバー8は、図1で説明した突出部5a1,5a2,5a3
…等が正面視で底面(図では上面)を連結側とする櫛刃
状になるように図1で説明した周壁面に形成されてい
る。
In FIG. 2 showing another configuration example, the relay 7 is shown in FIG.
The relay main body 2 and the cover 8 made of a resin molded product mounted on the relay main body 2. The cover 8 in this case has the protrusions 5a 1 , 5a 2 , 5a 3 described in FIG.
, Etc. are formed on the peripheral wall surface described in FIG. 1 so as to have a comb-like shape with the bottom surface (upper surface in the figure) as the connecting side when viewed from the front.

【0028】従って、かかるカバー8が装着されている
継電器7では矢印D2の如くその真上から見たときには各
外部接続端子 22b-1′,22b-2′,22a-1′等を目視するこ
とができないが、矢印D3の如き斜め方向からは該各外部
接続端子を目視することができる。
Therefore, in the relay 7 to which the cover 8 is attached, the external connection terminals 22b -1 ′, 22b -2 ′, 22a -1 ′, etc. are visually observed when viewed from directly above the relay 7 as indicated by arrow D 2. Although not possible, the external connection terminals can be visually observed from an oblique direction as indicated by arrow D 3 .

【0029】そこで、図1同様に該継電器7の各外部接
続端子と図3で説明した回路基板4上の各接続電極4aと
を合致させた状態で該継電器7を矢印Bのように降下さ
せて回路基板4上に載置し、通常のリフロー技術等によ
る半田付け手段で両者を接続することで(2-2) に示す如
く継電器7を回路基板4に実装することができる。
Therefore, as in FIG. 1, with the external connection terminals of the relay 7 and the connection electrodes 4a on the circuit board 4 described in FIG. 3 aligned, the relay 7 is lowered as indicated by arrow B. Then, the relay 7 can be mounted on the circuit board 4 as shown in (2-2) by mounting the relay 7 on the circuit board 4 and connecting them by soldering means such as a normal reflow technique.

【0030】かかる継電器7では、カバー8の外部接続
端子近傍領域を除く部分の肉厚が外部接続端子配置領域
ひいては回路基板4の接続電極形成領域の範囲内で厚く
形成されているので、実装時の熱による変形やカバー全
体としての形状の歪・破損およびこれらに起因する外観
品質の低下や継電器としての特性低下を図1の場合より
も更に抑制することができると共に、回路基板4に実装
した後の各外部接続端子領域が例えば矢印Fの範囲で目
視できるので該領域における接続状態の良否を容易に検
査することができる。
In the relay 7, since the thickness of the portion of the cover 8 excluding the area near the external connection terminals is formed thicker within the area of the external connection terminal arrangement area and further, the connection electrode formation area of the circuit board 4, it is mounted. The deformation of the cover due to heat, the distortion and damage of the shape of the entire cover, the deterioration of the appearance quality and the deterioration of the characteristics of the relay due to these can be further suppressed as compared with the case of FIG. 1, and the circuit board 4 is mounted. Since each subsequent external connection terminal area can be visually observed in the range of arrow F, the quality of the connection state in the area can be easily inspected.

【0031】[0031]

【発明の効果】上述の如く本発明により、回路基板への
実装時の熱によるカバーとしての変形や歪・破損等を防
止して生産性の向上を図った表面実装型電磁継電器を提
供することができる。
As described above, according to the present invention, it is possible to provide a surface mount type electromagnetic relay which improves the productivity by preventing the cover from being deformed, distorted or damaged by heat when it is mounted on a circuit board. You can

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明になる継電器の構成例を示す図。FIG. 1 is a diagram showing a configuration example of a relay according to the present invention.

【図2】 他の構成例を示す図。FIG. 2 is a diagram showing another configuration example.

【図3】 従来の表面実装型電磁継電器の構成例を概略
的に説明する図。
FIG. 3 is a diagram schematically illustrating a configuration example of a conventional surface mount type electromagnetic relay.

【符号の説明】[Explanation of symbols]

2 継電器本体 4 回路基板 4a 接続
電極 5,7 表面実装型電磁継電器 6,8 カバー 6a1, 6a2, 6a3 線状突出部 22a-1′,22b-1′,22b-2′ 外部接続端子
2 Relay body 4 Circuit board 4a Connection electrode 5,7 Surface mount type electromagnetic relay 6,8 Cover 6a 1 , 6a 2 , 6a 3 Linear protrusion 22a -1 ′, 22b -1 ′, 22b -2 ′ External connection terminal

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田中 高典 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 佐藤 進一 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Takanori Tanaka, 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Shinichi Sato, 1015, Kamikodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 継電器本体(2) から導出される複数の外
部接続端子(22a-1′,22b-1′,22b-2′…) が外側に曲げ
られた後実装する回路基板面に沿うように形成され、且
つ該継電器本体(2) の回路基板(4) と対面する領域を除
く全周囲が上記外部接続端子(22a-1′,22b-1′,22b-2
…) の回路基板(2) に対する接続領域が露出するように
有底箱形の樹脂成形品からなるカバー(6) で覆われて構
成されている表面実装型電磁継電器であって、 継電器本体(2) に装着するカバー(6) の周壁外面が、該
継電器本体(2) の各外部接続端子(22a-1′,22b-1′,22b
-2′…) の先端を繋いだときに形成される領域範囲近傍
に位置するように形成されていると共に、各外部接続端
子(22a-1′,22b -1′,22b-2′…) と対応する領域では該
各外部接続端子(22a-1′,22b-1′,22b-2′…) の少なく
とも回路基板に対する接続領域が真上または外側斜上方
から目視し得るような凹部を具えて構成されていること
を特徴とした表面実装型電磁継電器。
1. A plurality of outer parts derived from the relay body (2)
Part connection terminal (22a-1′, 22b-1′, 22b-2′…) Is bent outward
Is formed along the surface of the circuit board to be mounted after
The area of the relay body (2) facing the circuit board (4) is removed.
All surroundings are the external connection terminals (22a-1′, 22b-1′, 22b-2
...) so that the connection area for the circuit board (2) is exposed
Covered with a cover (6) consisting of a box-shaped resin molding with a bottom.
The surface mount type electromagnetic relay is made up of: the outer surface of the peripheral wall of the cover (6) mounted on the relay body (2) is
Each external connection terminal (22a-1′, 22b-1′, 22b
-2′…) Near the area range formed when the tips are connected
It is formed so that it is located at
Child (22a-1′, 22b -1′, 22b-2’…)
Each external connection terminal (22a-1′, 22b-1′, 22b-2′…)
The connection area for the circuit board is directly above or obliquely above the outside
Must be configured with a recess that can be seen from the
Surface mount type electromagnetic relay featuring.
JP4019593A 1992-02-05 1992-02-05 Surface mounting type electromagnetic relay Withdrawn JPH05217479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4019593A JPH05217479A (en) 1992-02-05 1992-02-05 Surface mounting type electromagnetic relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4019593A JPH05217479A (en) 1992-02-05 1992-02-05 Surface mounting type electromagnetic relay

Publications (1)

Publication Number Publication Date
JPH05217479A true JPH05217479A (en) 1993-08-27

Family

ID=12003545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4019593A Withdrawn JPH05217479A (en) 1992-02-05 1992-02-05 Surface mounting type electromagnetic relay

Country Status (1)

Country Link
JP (1) JPH05217479A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692805A1 (en) * 1994-07-15 1996-01-17 Siemens Aktiengesellschaft Electric relay
WO2008106862A1 (en) * 2007-03-03 2008-09-12 Shenzhen Zanty Electronics Co., Ltd Relay of patch type bent terminals
CN102122768A (en) * 2010-12-21 2011-07-13 福建捷联电子有限公司 Patch type electronic interface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692805A1 (en) * 1994-07-15 1996-01-17 Siemens Aktiengesellschaft Electric relay
WO2008106862A1 (en) * 2007-03-03 2008-09-12 Shenzhen Zanty Electronics Co., Ltd Relay of patch type bent terminals
CN102122768A (en) * 2010-12-21 2011-07-13 福建捷联电子有限公司 Patch type electronic interface

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