WO2008102617A1 - 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法 - Google Patents

固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法 Download PDF

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Publication number
WO2008102617A1
WO2008102617A1 PCT/JP2008/051337 JP2008051337W WO2008102617A1 WO 2008102617 A1 WO2008102617 A1 WO 2008102617A1 JP 2008051337 W JP2008051337 W JP 2008051337W WO 2008102617 A1 WO2008102617 A1 WO 2008102617A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
solid
state imaging
adhesive tape
protective adhesive
Prior art date
Application number
PCT/JP2008/051337
Other languages
English (en)
French (fr)
Inventor
Akira Shouji
Akihisa Murata
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2008102617A1 publication Critical patent/WO2008102617A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Studio Devices (AREA)

Abstract

　高温雰囲気下における固体撮像デバイスの製造工程において、映像センサ表面を異物による汚染、傷つきから保護するとともに、映像センサから、粘着テープが剥離しない固体撮像デバイス用表面保護用粘着テープ、およびこの粘着テープを用いた固体撮像デバイスの実装方法を提供すること。基材の片面に粘着剤層を有する固体撮像デバイス用表面保護粘着テープであって、前記粘着剤層が親油性層状粘土鉱物を含有することを特徴とする固体撮像デバイス用表面保護粘着テープ。
PCT/JP2008/051337 2007-02-20 2008-01-30 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法 WO2008102617A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007039641A JP2008201899A (ja) 2007-02-20 2007-02-20 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法
JP2007-039641 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102617A1 true WO2008102617A1 (ja) 2008-08-28

Family

ID=39709896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051337 WO2008102617A1 (ja) 2007-02-20 2008-01-30 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法

Country Status (3)

Country Link
JP (1) JP2008201899A (ja)
TW (1) TW200838971A (ja)
WO (1) WO2008102617A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6006936B2 (ja) * 2011-12-26 2016-10-12 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
WO2014034579A1 (ja) * 2012-08-31 2014-03-06 日東電工株式会社 表面保護用シート
WO2016002974A2 (ja) * 2014-07-03 2016-01-07 リンテック株式会社 表面保護フィルム
GB201718470D0 (en) 2017-11-08 2017-12-20 Provost Fellows Found Scholars And The Other Members Of Board Of The College Of The Holy And Undivid Adhesive formulations
JP7491717B2 (ja) 2020-04-01 2024-05-28 日東電工株式会社 発泡複合体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002138207A (ja) * 2000-08-25 2002-05-14 Sekisui Chem Co Ltd テープ基材用樹脂組成物、それを用いたテープ基材及びそれを用いた粘着テープ
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2005322885A (ja) * 2004-04-07 2005-11-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006332419A (ja) * 2005-05-27 2006-12-07 Nitto Denko Corp 固体撮像デバイス保護用粘着テープおよびそれを用いた映像センサの実装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002138207A (ja) * 2000-08-25 2002-05-14 Sekisui Chem Co Ltd テープ基材用樹脂組成物、それを用いたテープ基材及びそれを用いた粘着テープ
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2005322885A (ja) * 2004-04-07 2005-11-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006332419A (ja) * 2005-05-27 2006-12-07 Nitto Denko Corp 固体撮像デバイス保護用粘着テープおよびそれを用いた映像センサの実装方法

Also Published As

Publication number Publication date
JP2008201899A (ja) 2008-09-04
TW200838971A (en) 2008-10-01

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