WO2008096796A1 - 光学素子被覆用ガラス及びガラス被覆発光装置 - Google Patents

光学素子被覆用ガラス及びガラス被覆発光装置 Download PDF

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Publication number
WO2008096796A1
WO2008096796A1 PCT/JP2008/051971 JP2008051971W WO2008096796A1 WO 2008096796 A1 WO2008096796 A1 WO 2008096796A1 JP 2008051971 W JP2008051971 W JP 2008051971W WO 2008096796 A1 WO2008096796 A1 WO 2008096796A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
optical element
emitting device
light
teo2
Prior art date
Application number
PCT/JP2008/051971
Other languages
English (en)
French (fr)
Inventor
Syuji Matsumoto
Nobuhiro Nakamura
Original Assignee
Asahi Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Company, Limited filed Critical Asahi Glass Company, Limited
Priority to JP2008557146A priority Critical patent/JPWO2008096796A1/ja
Priority to CNA2008800039911A priority patent/CN101601145A/zh
Priority to KR1020097015609A priority patent/KR20090110316A/ko
Publication of WO2008096796A1 publication Critical patent/WO2008096796A1/ja
Priority to US12/536,538 priority patent/US20090309125A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
    • C03C3/155—Silica-free oxide glass compositions containing boron containing rare earths containing zirconium, titanium, tantalum or niobium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)

Abstract

　５００°C付近で光学素子を封止することができる光学素子被覆用ガラス及びそのガラスで被覆されたガラス被覆発光装置を提供する。 　酸化物基準のモル％表示で、ＴｅＯ２：３５～５５％、Ｂ２Ｏ３：２０～５０％、ＺｎＯ：１０～３０％、Ｙ２Ｏ３、Ｌａ２Ｏ３、Ｇｄ２Ｏ３およびＢｉ２Ｏ３からなる群から選ばれる１種または２種以上の組み合わせ：０．１～５％から本質的になり、（Ｂ２Ｏ３＋ＺｎＯ）／ＴｅＯ２が０．９以上であり、かつフッ素を実質的に含まないガラスであって、ＺｎＯの含有量が１５％以下の場合にはＴｅＯ２の含有量が４６％以下であることを特徴とする光学素子被覆用ガラス。
PCT/JP2008/051971 2007-02-07 2008-02-06 光学素子被覆用ガラス及びガラス被覆発光装置 WO2008096796A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008557146A JPWO2008096796A1 (ja) 2007-02-07 2008-02-06 光学素子被覆用ガラス及びガラス被覆発光装置
CNA2008800039911A CN101601145A (zh) 2007-02-07 2008-02-06 光学元件被覆用玻璃及由玻璃被覆的发光装置
KR1020097015609A KR20090110316A (ko) 2007-02-07 2008-02-06 광학 소자 피복용 유리 및 유리 피복 발광 장치
US12/536,538 US20090309125A1 (en) 2007-02-07 2009-08-06 Glass for encapsulating optical element and light-emitting device encapsulated with glass

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-028143 2007-02-07
JP2007028143 2007-02-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/536,538 Continuation US20090309125A1 (en) 2007-02-07 2009-08-06 Glass for encapsulating optical element and light-emitting device encapsulated with glass

Publications (1)

Publication Number Publication Date
WO2008096796A1 true WO2008096796A1 (ja) 2008-08-14

Family

ID=39681702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051971 WO2008096796A1 (ja) 2007-02-07 2008-02-06 光学素子被覆用ガラス及びガラス被覆発光装置

Country Status (5)

Country Link
US (1) US20090309125A1 (ja)
JP (1) JPWO2008096796A1 (ja)
KR (1) KR20090110316A (ja)
CN (1) CN101601145A (ja)
WO (1) WO2008096796A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010528959A (ja) * 2007-06-27 2010-08-26 株式会社ニコン ガラス組成物、それを用いた光学部材及び光学機器
JP2011093755A (ja) * 2009-10-30 2011-05-12 Ohara Inc 光学ガラス、光学素子及び精密プレス成形用プリフォーム
CN102414138A (zh) * 2009-04-30 2012-04-11 株式会社小原 光学玻璃
JP2012236734A (ja) * 2011-05-11 2012-12-06 Nippon Electric Glass Co Ltd 光学ガラス

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112417A1 (ja) * 2005-04-15 2006-10-26 Asahi Glass Company, Limited ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法
DE102010009456A1 (de) 2010-02-26 2011-09-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit einem Halbleiterchip und einem Konversionselement und Verfahren zu dessen Herstellung
JP2013010661A (ja) * 2011-06-29 2013-01-17 Ohara Inc ガラス組成物
KR101612216B1 (ko) 2012-03-30 2016-04-12 코닝 인코포레이티드 Led 형광체용 비스무트 보레이트 유리 캡슐화제
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
CN103183473B (zh) * 2013-04-10 2016-08-17 中国科学院福建物质结构研究所 用于白光LED 的Ce: YAG微晶玻璃及其制备方法
JP6357937B2 (ja) * 2013-07-30 2018-07-18 旭硝子株式会社 封着材料および封着パッケージ
CN104003619B (zh) * 2014-06-12 2017-01-04 河北大学 一种白光led用铈激活钇铝石榴石微晶玻璃及其制备方法
JP6350126B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003221277A (ja) * 2001-11-21 2003-08-05 Asahi Glass Co Ltd 誘電体形成用ガラス粉末、誘電体形成用ガラスセラミックス組成物および誘電体
JP2005011933A (ja) * 2003-06-18 2005-01-13 Asahi Glass Co Ltd 発光ダイオード素子
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
WO2006112417A1 (ja) * 2005-04-15 2006-10-26 Asahi Glass Company, Limited ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7033966B2 (en) * 2003-05-21 2006-04-25 Asahi Glass Company, Limited Optical glass and lens
KR20070028427A (ko) * 2004-06-24 2007-03-12 아사히 가라스 가부시키가이샤 광학 유리 및 렌즈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003221277A (ja) * 2001-11-21 2003-08-05 Asahi Glass Co Ltd 誘電体形成用ガラス粉末、誘電体形成用ガラスセラミックス組成物および誘電体
JP2005011933A (ja) * 2003-06-18 2005-01-13 Asahi Glass Co Ltd 発光ダイオード素子
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
WO2006112417A1 (ja) * 2005-04-15 2006-10-26 Asahi Glass Company, Limited ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010528959A (ja) * 2007-06-27 2010-08-26 株式会社ニコン ガラス組成物、それを用いた光学部材及び光学機器
CN102414138A (zh) * 2009-04-30 2012-04-11 株式会社小原 光学玻璃
CN102414138B (zh) * 2009-04-30 2015-07-22 株式会社小原 光学玻璃
JP2011093755A (ja) * 2009-10-30 2011-05-12 Ohara Inc 光学ガラス、光学素子及び精密プレス成形用プリフォーム
JP2012236734A (ja) * 2011-05-11 2012-12-06 Nippon Electric Glass Co Ltd 光学ガラス

Also Published As

Publication number Publication date
JPWO2008096796A1 (ja) 2010-05-27
US20090309125A1 (en) 2009-12-17
KR20090110316A (ko) 2009-10-21
CN101601145A (zh) 2009-12-09

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