WO2008096792A1 - サーバ装置、情報処理方法、及びプログラム - Google Patents
サーバ装置、情報処理方法、及びプログラム Download PDFInfo
- Publication number
- WO2008096792A1 WO2008096792A1 PCT/JP2008/051965 JP2008051965W WO2008096792A1 WO 2008096792 A1 WO2008096792 A1 WO 2008096792A1 JP 2008051965 W JP2008051965 W JP 2008051965W WO 2008096792 A1 WO2008096792 A1 WO 2008096792A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- judgment
- information
- authority
- request information
- unit
- Prior art date
Links
- 230000010365 information processing Effects 0.000 title 1
- 238000003672 processing method Methods 0.000 title 1
- 238000000034 method Methods 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
- G05B19/4186—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication by protocol, e.g. MAP, TOP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31246—Firewall
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36542—Cryptography, encrypt, access, authorize with key, code, password
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Storage Device Security (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- General Factory Administration (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008557145A JP5097134B2 (ja) | 2007-02-07 | 2008-02-06 | サーバ装置、情報処理方法、及びプログラム |
KR1020097018429A KR101110041B1 (ko) | 2007-02-07 | 2008-02-06 | 서버 장치, 정보 처리 방법 및 프로그램 |
US12/536,862 US8607312B2 (en) | 2007-02-07 | 2009-08-06 | Server, information processing method and program |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007027629 | 2007-02-07 | ||
JP2007-027629 | 2007-02-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/536,862 Continuation US8607312B2 (en) | 2007-02-07 | 2009-08-06 | Server, information processing method and program |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008096792A1 true WO2008096792A1 (ja) | 2008-08-14 |
Family
ID=39681698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/051965 WO2008096792A1 (ja) | 2007-02-07 | 2008-02-06 | サーバ装置、情報処理方法、及びプログラム |
Country Status (5)
Country | Link |
---|---|
US (1) | US8607312B2 (ja) |
JP (1) | JP5097134B2 (ja) |
KR (1) | KR101110041B1 (ja) |
TW (1) | TW200841208A (ja) |
WO (1) | WO2008096792A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011081795A (ja) * | 2009-10-05 | 2011-04-21 | Fisher-Rosemount Systems Inc | プロセス制御環境におけるデータアップロードを管理するための方法および装置 |
WO2012035965A1 (ja) * | 2010-09-17 | 2012-03-22 | 株式会社日立国際電気 | 基板処理システム及び基板処理装置の表示方法 |
CN104597861A (zh) * | 2013-10-31 | 2015-05-06 | 村田机械株式会社 | 设定管理装置、纤维机械、纱线卷绕机及纺纱机 |
CN113424113A (zh) * | 2018-11-30 | 2021-09-21 | 伊利诺斯工具制品有限公司 | 安全系统接口和包括安全系统接口的材料试验系统 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010011657A1 (de) * | 2010-03-17 | 2011-09-22 | Siemens Aktiengesellschaft | Verfahren und Vorrichtung zum Bereitstellen mindestens eines sicheren kryptographischen Schlüssels |
CN102609328B (zh) * | 2012-01-29 | 2015-04-15 | 华为终端有限公司 | 系统差分升级方法和装置、移动终端 |
KR101954707B1 (ko) * | 2018-07-25 | 2019-06-11 | 김영준 | 카메라 컨트롤러를 이용한 반도체 공정 유틸리티 모니터링 시스템 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11186365A (ja) * | 1997-12-24 | 1999-07-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11345751A (ja) * | 1998-03-13 | 1999-12-14 | Samsung Electronics Co Ltd | 工程条件レシピ変更による半導体の工程不良防止方法 |
JP2002027567A (ja) * | 2000-07-12 | 2002-01-25 | Hitachi Kokusai Electric Inc | 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置 |
JP2002050555A (ja) * | 2000-07-31 | 2002-02-15 | Ricoh Co Ltd | 半導体製造システム |
JP2006073845A (ja) * | 2004-09-03 | 2006-03-16 | Hitachi Kokusai Electric Inc | 半導体製造システム |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3543996B2 (ja) | 1994-04-22 | 2004-07-21 | 東京エレクトロン株式会社 | 処理装置 |
JPH08227835A (ja) * | 1995-02-20 | 1996-09-03 | Tokyo Electron Ltd | 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法 |
US6356899B1 (en) * | 1998-08-29 | 2002-03-12 | International Business Machines Corporation | Method for interactively creating an information database including preferred information elements, such as preferred-authority, world wide web pages |
JP3497450B2 (ja) | 2000-07-06 | 2004-02-16 | 東京エレクトロン株式会社 | バッチ式熱処理装置及びその制御方法 |
SE518491C2 (sv) * | 2000-10-12 | 2002-10-15 | Abb Ab | Datorbaserat system och metod för behörighetskontroll av objekt |
SG135048A1 (en) * | 2000-10-18 | 2007-09-28 | Johnson & Johnson Consumer | Intelligent performance-based product recommendation system |
KR100969241B1 (ko) * | 2004-02-13 | 2010-07-09 | 노키아 코포레이션 | 네트워크 상의 데이터 관리 방법 및 시스템 |
JP4384093B2 (ja) * | 2004-09-03 | 2009-12-16 | 株式会社東芝 | プロセス状態管理システム、管理サーバ、プロセス状態管理方法及びプロセス状態管理用プログラム |
US8132225B2 (en) * | 2004-09-30 | 2012-03-06 | Rockwell Automation Technologies, Inc. | Scalable and flexible information security for industrial automation |
US8024770B2 (en) * | 2006-06-21 | 2011-09-20 | Microsoft Corporation | Techniques for managing security contexts |
-
2008
- 2008-02-06 KR KR1020097018429A patent/KR101110041B1/ko active IP Right Grant
- 2008-02-06 WO PCT/JP2008/051965 patent/WO2008096792A1/ja active Application Filing
- 2008-02-06 JP JP2008557145A patent/JP5097134B2/ja not_active Expired - Fee Related
- 2008-02-12 TW TW097104880A patent/TW200841208A/zh not_active IP Right Cessation
-
2009
- 2009-08-06 US US12/536,862 patent/US8607312B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11186365A (ja) * | 1997-12-24 | 1999-07-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11345751A (ja) * | 1998-03-13 | 1999-12-14 | Samsung Electronics Co Ltd | 工程条件レシピ変更による半導体の工程不良防止方法 |
JP2002027567A (ja) * | 2000-07-12 | 2002-01-25 | Hitachi Kokusai Electric Inc | 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置 |
JP2002050555A (ja) * | 2000-07-31 | 2002-02-15 | Ricoh Co Ltd | 半導体製造システム |
JP2006073845A (ja) * | 2004-09-03 | 2006-03-16 | Hitachi Kokusai Electric Inc | 半導体製造システム |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011081795A (ja) * | 2009-10-05 | 2011-04-21 | Fisher-Rosemount Systems Inc | プロセス制御環境におけるデータアップロードを管理するための方法および装置 |
US9164501B2 (en) | 2009-10-05 | 2015-10-20 | Fisher-Rosemount Systems, Inc. | Methods and apparatus to manage data uploading in a process control environment |
WO2012035965A1 (ja) * | 2010-09-17 | 2012-03-22 | 株式会社日立国際電気 | 基板処理システム及び基板処理装置の表示方法 |
CN104597861A (zh) * | 2013-10-31 | 2015-05-06 | 村田机械株式会社 | 设定管理装置、纤维机械、纱线卷绕机及纺纱机 |
CN113424113A (zh) * | 2018-11-30 | 2021-09-21 | 伊利诺斯工具制品有限公司 | 安全系统接口和包括安全系统接口的材料试验系统 |
Also Published As
Publication number | Publication date |
---|---|
KR101110041B1 (ko) | 2012-03-13 |
JPWO2008096792A1 (ja) | 2010-05-27 |
TW200841208A (en) | 2008-10-16 |
KR20090118950A (ko) | 2009-11-18 |
JP5097134B2 (ja) | 2012-12-12 |
US8607312B2 (en) | 2013-12-10 |
US20090300727A1 (en) | 2009-12-03 |
TWI359368B (ja) | 2012-03-01 |
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