WO2008090972A1 - 携帯端末 - Google Patents

携帯端末 Download PDF

Info

Publication number
WO2008090972A1
WO2008090972A1 PCT/JP2008/051041 JP2008051041W WO2008090972A1 WO 2008090972 A1 WO2008090972 A1 WO 2008090972A1 JP 2008051041 W JP2008051041 W JP 2008051041W WO 2008090972 A1 WO2008090972 A1 WO 2008090972A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
double
sided tape
electronic part
portable terminal
Prior art date
Application number
PCT/JP2008/051041
Other languages
English (en)
French (fr)
Inventor
Junichi Nakao
Hiroyasu Yamada
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to CN200880003197.7A priority Critical patent/CN101601261B/zh
Priority to US12/524,339 priority patent/US8102661B2/en
Priority to EP08703868.3A priority patent/EP2124421B1/en
Publication of WO2008090972A1 publication Critical patent/WO2008090972A1/ja
Priority to US13/346,434 priority patent/US20120106102A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Abstract

　電子部品１３とシールド部品１４が実装された基板１０と、シールド部品１４に接着された両面テープ４０と、両面テープ４０の基板１０側の面の反対面に接着されるとともに、両面テープ４０との接着面の反対面に電子部品２１が実装された基板２０と、基板１０の両面テープ４０側の反対側に配された上ケース３ａと、電子部品２１の基板２０側の反対側に配されるとともに、上ケース３ａと組み合わされる下ケース３ｂと、基板２０と下ケース３ｂの間に配設されるとともに、電子部品２１と対応する位置に開口部３０ａを有するフレーム３０と、を備える。基板１０、両面テープ４０、基板２０よりなる組立体は、上ケース３ａと下ケース３ｂによって挟持されている。基板２０は、フレーム３０によって基板１０側に押し付けられている。
PCT/JP2008/051041 2007-01-25 2008-01-25 携帯端末 WO2008090972A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880003197.7A CN101601261B (zh) 2007-01-25 2008-01-25 便携式终端
US12/524,339 US8102661B2 (en) 2007-01-25 2008-01-25 Portable terminal
EP08703868.3A EP2124421B1 (en) 2007-01-25 2008-01-25 Portable terminal
US13/346,434 US20120106102A1 (en) 2007-01-25 2012-01-09 Portable terminal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-014550 2007-01-25
JP2007014550A JP5302509B2 (ja) 2007-01-25 2007-01-25 携帯端末

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/346,434 Continuation US20120106102A1 (en) 2007-01-25 2012-01-09 Portable terminal

Publications (1)

Publication Number Publication Date
WO2008090972A1 true WO2008090972A1 (ja) 2008-07-31

Family

ID=39644546

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051041 WO2008090972A1 (ja) 2007-01-25 2008-01-25 携帯端末

Country Status (5)

Country Link
US (2) US8102661B2 (ja)
EP (1) EP2124421B1 (ja)
JP (1) JP5302509B2 (ja)
CN (1) CN101601261B (ja)
WO (1) WO2008090972A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5771350B2 (ja) 2009-04-28 2015-08-26 レノボ・イノベーションズ・リミテッド（香港） 携帯型電子機器のケース構造、携帯型電子機器及びその製造方法
JP5435816B2 (ja) * 2011-03-15 2014-03-05 パナソニック株式会社 携帯端末
CN102612260B (zh) * 2012-03-29 2014-12-17 上海华勤通讯技术有限公司 补强fpc板及制造方法
JP6028654B2 (ja) * 2013-03-27 2016-11-16 富士通株式会社 充電端子付筺体及び該筺体を備える電子装置
KR102452781B1 (ko) * 2015-12-15 2022-10-12 삼성전자주식회사 차폐 구조를 포함하는 전자 장치
TWI696867B (zh) * 2019-03-22 2020-06-21 友達光電股份有限公司 膠帶結構及使用其之顯示面板和顯示裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05333362A (ja) * 1992-06-03 1993-12-17 Matsushita Electric Ind Co Ltd 機器の表示装置
JPH10145476A (ja) * 1996-11-08 1998-05-29 Casio Comput Co Ltd 表示部及び操作部付き電子機器
JP2006352618A (ja) * 2005-06-17 2006-12-28 Sony Ericsson Mobilecommunications Japan Inc 携帯端末装置
JP2007014550A (ja) 2005-07-07 2007-01-25 Nagase Kogyosho:Kk シリコーンゴム成形体からなるカバー

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000078253A (ja) 1998-09-02 2000-03-14 Nec Shizuoka Ltd 移動体携帯端末
JP2000208905A (ja) * 1999-01-14 2000-07-28 Nec Corp プリント基板
CN100473076C (zh) * 2000-08-04 2009-03-25 松下电器产业株式会社 折叠式便携蜂窝电话
JP2002290065A (ja) * 2001-03-27 2002-10-04 Toshiba Corp 移動通信端末装置
JP2003229938A (ja) * 2002-02-04 2003-08-15 Matsushita Electric Ind Co Ltd 折畳式携帯電話装置
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法
EP2077657B1 (en) * 2004-05-28 2010-09-22 Research In Motion Limited Keypad and microphone arrangement
US7414855B1 (en) * 2005-10-05 2008-08-19 Kyocera Wireless Corp. Modular portable communication device with interchangeable outer housing assembly
WO2007086579A1 (ja) * 2006-01-30 2007-08-02 Kyocera Corporation 表示器保持部品、携帯電子機器及び表示器保持部品の組み付け方法
KR101243669B1 (ko) * 2006-10-18 2013-03-25 엘지전자 주식회사 휴대 단말기
CN101453826B (zh) * 2007-11-28 2011-12-21 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05333362A (ja) * 1992-06-03 1993-12-17 Matsushita Electric Ind Co Ltd 機器の表示装置
JPH10145476A (ja) * 1996-11-08 1998-05-29 Casio Comput Co Ltd 表示部及び操作部付き電子機器
JP2006352618A (ja) * 2005-06-17 2006-12-28 Sony Ericsson Mobilecommunications Japan Inc 携帯端末装置
JP2007014550A (ja) 2005-07-07 2007-01-25 Nagase Kogyosho:Kk シリコーンゴム成形体からなるカバー

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2124421A4

Also Published As

Publication number Publication date
CN101601261A (zh) 2009-12-09
EP2124421A1 (en) 2009-11-25
US20090323298A1 (en) 2009-12-31
US8102661B2 (en) 2012-01-24
EP2124421A4 (en) 2012-08-29
JP5302509B2 (ja) 2013-10-02
CN101601261B (zh) 2012-12-12
EP2124421B1 (en) 2013-07-31
US20120106102A1 (en) 2012-05-03
JP2008182501A (ja) 2008-08-07

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