WO2008084812A1 - 撮像装置、その製造方法及び携帯端末装置 - Google Patents

撮像装置、その製造方法及び携帯端末装置 Download PDF

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Publication number
WO2008084812A1
WO2008084812A1 PCT/JP2008/050143 JP2008050143W WO2008084812A1 WO 2008084812 A1 WO2008084812 A1 WO 2008084812A1 JP 2008050143 W JP2008050143 W JP 2008050143W WO 2008084812 A1 WO2008084812 A1 WO 2008084812A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
manufacturing
portable terminal
substrate
dusts
Prior art date
Application number
PCT/JP2008/050143
Other languages
English (en)
French (fr)
Inventor
Kiyohiko Yamada
Makoto Imai
Hiroshi Nishizawa
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007001678A external-priority patent/JP2008172350A/ja
Priority claimed from JP2007001677A external-priority patent/JP2008172349A/ja
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/521,092 priority Critical patent/US20100025792A1/en
Publication of WO2008084812A1 publication Critical patent/WO2008084812A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

　撮像装置の内部空間にゴミの侵入や移動によって撮像画像の劣化が発生する。ゴミを捕捉することにより画質の劣化を低減させた撮像装置を提供する。 　レンズ２を内蔵したレンズブロック１９と、基板１の一面に実装される半導体撮像素子４と、他面に実装される透光性部材５とを有する撮像装置１８において、前記半導体撮像素子４と透光性部材５と基板１により囲まれる空間の外側で光学的な有効範囲外に、粘着剤を溶解した溶液２３が浸透可能とした間隙２４を有することを特徴とする撮像装置。
PCT/JP2008/050143 2007-01-09 2008-01-09 撮像装置、その製造方法及び携帯端末装置 WO2008084812A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/521,092 US20100025792A1 (en) 2007-01-09 2008-01-09 Image pickup apparatus, manufacturing method thereof, and mobile terminal

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007001678A JP2008172350A (ja) 2007-01-09 2007-01-09 撮像装置、その製造方法及び携帯端末装置
JP2007-001678 2007-01-09
JP2007001677A JP2008172349A (ja) 2007-01-09 2007-01-09 撮像装置、その製造方法及び携帯端末装置
JP2007-001677 2007-01-09

Publications (1)

Publication Number Publication Date
WO2008084812A1 true WO2008084812A1 (ja) 2008-07-17

Family

ID=39608700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050143 WO2008084812A1 (ja) 2007-01-09 2008-01-09 撮像装置、その製造方法及び携帯端末装置

Country Status (2)

Country Link
US (1) US20100025792A1 (ja)
WO (1) WO2008084812A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101405872B (zh) * 2006-03-22 2011-04-20 株式会社村田制作所 红外传感器及其制造方法
CN102444860B (zh) * 2010-09-30 2016-12-07 欧司朗股份有限公司 透镜、具有透镜的照明装置以及照明装置的制造方法
US10663714B2 (en) * 2010-10-28 2020-05-26 Endochoice, Inc. Optical system for an endoscope
US9197796B2 (en) * 2011-11-23 2015-11-24 Lg Innotek Co., Ltd. Camera module
TWI552318B (zh) * 2012-09-07 2016-10-01 光寶電子（廣州）有限公司 防塵之晶片模組結構
US8872296B2 (en) * 2012-11-01 2014-10-28 Lite-On Technology Corporation Chip module structure for particles protection
JP6035687B2 (ja) * 2014-08-29 2016-11-30 Smk株式会社 カメラモジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037256A (ja) * 2001-07-25 2003-02-07 Toppan Printing Co Ltd パッケージ型固体撮像素子
JP2005316127A (ja) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd カメラモジュール
JP4064431B1 (ja) * 2006-09-26 2008-03-19 シャープ株式会社 固体撮像装置およびその製造方法ならびに製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037256A (ja) * 2001-07-25 2003-02-07 Toppan Printing Co Ltd パッケージ型固体撮像素子
JP2005316127A (ja) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd カメラモジュール
JP4064431B1 (ja) * 2006-09-26 2008-03-19 シャープ株式会社 固体撮像装置およびその製造方法ならびに製造装置

Also Published As

Publication number Publication date
US20100025792A1 (en) 2010-02-04

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