WO2008126549A1 - 固体撮像装置、固体撮像装置の製造方法およびその固体撮像装置を用いた撮影装置 - Google Patents

固体撮像装置、固体撮像装置の製造方法およびその固体撮像装置を用いた撮影装置 Download PDF

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Publication number
WO2008126549A1
WO2008126549A1 PCT/JP2008/054311 JP2008054311W WO2008126549A1 WO 2008126549 A1 WO2008126549 A1 WO 2008126549A1 JP 2008054311 W JP2008054311 W JP 2008054311W WO 2008126549 A1 WO2008126549 A1 WO 2008126549A1
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WIPO (PCT)
Prior art keywords
imaging device
solid imaging
pixel region
effective pixel
glass plate
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PCT/JP2008/054311
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English (en)
French (fr)
Inventor
Renzaburo Miki
Toshiharu Inui
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Sharp Kabushiki Kaisha
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Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008126549A1 publication Critical patent/WO2008126549A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)

Abstract

　本発明の固体撮像装置（１０）は、有効画素領域（１ａ）が形成されたセンサチップ（１）と、有効画素領域（１ａ）と対向するように配置され、かつ有効画素領域（１ａ）と同等の平面寸法を有するガラス板（３）と、有効画素領域（１ａ）と隣接し、かつ有効画素領域（１ａ）を取り囲むように形成された、センサチップ（１）とガラス板（３）とを平行に保持するスペーサ（５）と、センサチップ（１）の一部、該ガラス板（３）の側壁、および該スペーサ（５）の側壁を封止する封止樹脂（７）と、ガラス板（３）上に形成され、かつ透明な樹脂から構成された光学素子（９）と、を備えており、光学素子（９）の一部が封止樹脂（７）表面と接しているので、簡便で安価な方法を用いて小型化および薄型化を達成し、かつ性能を付与した固体撮像装置を提供することができる。
PCT/JP2008/054311 2007-03-30 2008-03-10 固体撮像装置、固体撮像装置の製造方法およびその固体撮像装置を用いた撮影装置 WO2008126549A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094985A JP4153016B1 (ja) 2007-03-30 2007-03-30 固体撮像装置、固体撮像装置の製造方法およびその固体撮像装置を用いた撮影装置
JP2007-094985 2007-03-30

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WO2008126549A1 true WO2008126549A1 (ja) 2008-10-23

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WO (1) WO2008126549A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432017A3 (en) * 2010-09-17 2013-02-27 Kingpak Technology Inc. Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
JP2018180535A (ja) * 2017-04-14 2018-11-15 キヤノン株式会社 レンズ鏡筒、撮像装置、および、レンズ鏡筒の製造方法
CN110957333A (zh) * 2018-09-26 2020-04-03 台湾积体电路制造股份有限公司 晶圆级图像传感器封装件
CN113884493A (zh) * 2021-12-07 2022-01-04 北京艾科瑞医学生物技术有限公司 一种固体表面显微成像装置及成像方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135442A (ja) * 2008-12-02 2010-06-17 Panasonic Corp 固体撮像装置及びその製造方法
US9257467B2 (en) 2009-12-16 2016-02-09 Samsung Electronics Co., Ltd. Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
CN111512444A (zh) 2017-12-28 2020-08-07 索尼半导体解决方案公司 相机封装件、相机封装件的制造方法以及电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329851A (ja) * 2001-05-01 2002-11-15 Canon Inc 撮像モジュールとその製造方法、および撮像モジュールを備えた撮像機器
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329851A (ja) * 2001-05-01 2002-11-15 Canon Inc 撮像モジュールとその製造方法、および撮像モジュールを備えた撮像機器
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432017A3 (en) * 2010-09-17 2013-02-27 Kingpak Technology Inc. Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
US8481343B2 (en) 2010-09-17 2013-07-09 Kingpak Technology Inc. Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
TWI414060B (zh) * 2010-09-17 2013-11-01 Kingpak Tech Inc 模造成型之免調焦距影像感測器構裝結構及其製造方法
JP2018180535A (ja) * 2017-04-14 2018-11-15 キヤノン株式会社 レンズ鏡筒、撮像装置、および、レンズ鏡筒の製造方法
US11320622B2 (en) 2017-04-14 2022-05-03 Canon Kabushiki Kaisha Lens barrel, imaging apparatus, and manufacturing method for lens barrel
JP7175623B2 (ja) 2017-04-14 2022-11-21 キヤノン株式会社 レンズ鏡筒、撮像装置、および、レンズ鏡筒の製造方法
CN110957333A (zh) * 2018-09-26 2020-04-03 台湾积体电路制造股份有限公司 晶圆级图像传感器封装件
CN113884493A (zh) * 2021-12-07 2022-01-04 北京艾科瑞医学生物技术有限公司 一种固体表面显微成像装置及成像方法

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JP2008252043A (ja) 2008-10-16

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