WO2008078791A1 - Method of producing light emission device - Google Patents

Method of producing light emission device Download PDF

Info

Publication number
WO2008078791A1
WO2008078791A1 PCT/JP2007/075021 JP2007075021W WO2008078791A1 WO 2008078791 A1 WO2008078791 A1 WO 2008078791A1 JP 2007075021 W JP2007075021 W JP 2007075021W WO 2008078791 A1 WO2008078791 A1 WO 2008078791A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
electric conductor
color
light emission
green
Prior art date
Application number
PCT/JP2007/075021
Other languages
French (fr)
Japanese (ja)
Inventor
Shuichi Naijo
Hajime Takasaki
Akihiko Narisawa
Original Assignee
Showa Denko K.K.
Akita Electronics Systems Co. Ltd.
Renesas Technology Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K., Akita Electronics Systems Co. Ltd., Renesas Technology Corp. filed Critical Showa Denko K.K.
Priority to JP2008551141A priority Critical patent/JPWO2008078791A1/en
Publication of WO2008078791A1 publication Critical patent/WO2008078791A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

To produce a light source coupler, a lead frame (80) is formed by connecting an electric conductor (41) for red, an electric conductor (42) for first green, and an electric conductor (43) for second green to a first electric conductor (51) and second heat conductor (52). A connection section (81) is used for the above connection, and the lead frame (80) is used as the starting material. A reflector member (60) is formed by resin molding, at a position where a light emission section (32) is formed, a red LED (61) and a first green LED (62) are installed on a first projection (54) provided on the first heat conductor (51), and a second green LED (63) and a blue LED (64) are installed on a second projection (55) provided on the second heat conductor (52). Then, the LED of each color and the electric conductor for each color are electrically connected by a bonding wire (not shown), and after that, the connection section (81) is punched to electrically separate connection between the LED of each color and the electric conductor for each color. Thus, a light emission device having the conductors for transmitting electricity and the conductors for transmitting heat is produced by the simpler method.
PCT/JP2007/075021 2006-12-27 2007-12-26 Method of producing light emission device WO2008078791A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008551141A JPWO2008078791A1 (en) 2006-12-27 2007-12-26 Method for manufacturing light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006353500 2006-12-27
JP2006-353500 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008078791A1 true WO2008078791A1 (en) 2008-07-03

Family

ID=39562582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075021 WO2008078791A1 (en) 2006-12-27 2007-12-26 Method of producing light emission device

Country Status (3)

Country Link
JP (1) JPWO2008078791A1 (en)
TW (1) TW200849662A (en)
WO (1) WO2008078791A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125839A1 (en) * 2009-04-28 2010-11-04 シャープ株式会社 Lighting device and displaying device
JP2011003814A (en) * 2009-06-22 2011-01-06 Toyoda Gosei Co Ltd Light-emitting device and method of manufacturing the same
WO2011136236A1 (en) * 2010-04-26 2011-11-03 パナソニック電工株式会社 Leadframe, wiring board, light emitting unit, and illuminating apparatus
JP2011249737A (en) * 2010-04-26 2011-12-08 Panasonic Electric Works Co Ltd Lead frame, wiring board, and led unit using the same
JP2012104445A (en) * 2010-11-12 2012-05-31 Iina:Kk Led lamp structure
JP2012244086A (en) * 2011-05-24 2012-12-10 Dainippon Printing Co Ltd Led lead frame with reflector, and method of manufacturing semiconductor device using the same
JP2013143350A (en) * 2012-01-12 2013-07-22 Ccs Inc Line light irradiation device
WO2014207620A1 (en) * 2013-06-28 2014-12-31 Koninklijke Philips N.V. Bonding led die to lead frame strips
JP2015032699A (en) * 2013-08-02 2015-02-16 大日本印刷株式会社 Multifaceted body of lead frame, multifaceted body of lead frame with resin, multifaceted body of optical semiconductor device, lead frame, lead frame with resin, and optical semiconductor device
US10573789B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005740A (en) * 1999-03-15 2005-01-06 Gentex Corp Semiconductor radiation emitter package
JP2005056653A (en) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd Light source device
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module
JP2005317480A (en) * 2004-04-30 2005-11-10 Sony Corp Heat sink for light emitting unit and backlight device
JP2007214522A (en) * 2006-02-10 2007-08-23 Intekkusu Kk Light source device and illuminator using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005740A (en) * 1999-03-15 2005-01-06 Gentex Corp Semiconductor radiation emitter package
JP2005056653A (en) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd Light source device
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module
JP2005317480A (en) * 2004-04-30 2005-11-10 Sony Corp Heat sink for light emitting unit and backlight device
JP2007214522A (en) * 2006-02-10 2007-08-23 Intekkusu Kk Light source device and illuminator using same

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11094854B2 (en) 2008-09-03 2021-08-17 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10700241B2 (en) 2008-09-03 2020-06-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573788B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573789B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
WO2010125839A1 (en) * 2009-04-28 2010-11-04 シャープ株式会社 Lighting device and displaying device
JP2011003814A (en) * 2009-06-22 2011-01-06 Toyoda Gosei Co Ltd Light-emitting device and method of manufacturing the same
WO2011136236A1 (en) * 2010-04-26 2011-11-03 パナソニック電工株式会社 Leadframe, wiring board, light emitting unit, and illuminating apparatus
JP2011249737A (en) * 2010-04-26 2011-12-08 Panasonic Electric Works Co Ltd Lead frame, wiring board, and led unit using the same
US8967827B2 (en) 2010-04-26 2015-03-03 Panasonic Intellectual Property Management Co., Ltd. Lead frame, wiring board, light emitting unit, and illuminating apparatus
JP2012104445A (en) * 2010-11-12 2012-05-31 Iina:Kk Led lamp structure
JP2012244086A (en) * 2011-05-24 2012-12-10 Dainippon Printing Co Ltd Led lead frame with reflector, and method of manufacturing semiconductor device using the same
JP2013143350A (en) * 2012-01-12 2013-07-22 Ccs Inc Line light irradiation device
US9905544B2 (en) 2013-06-28 2018-02-27 Lumileds Llc Bonding LED die to lead frame strips
CN109237319A (en) * 2013-06-28 2019-01-18 皇家飞利浦有限公司 By the engagement of LED bare and lead-frame ribbon
US9530949B2 (en) 2013-06-28 2016-12-27 Koninklijke Philips N.V. Bonding LED die to lead frame strips
KR20160027064A (en) * 2013-06-28 2016-03-09 코닌클리케 필립스 엔.브이. Bonding led die to lead frame strips
KR102168935B1 (en) 2013-06-28 2020-10-23 루미리즈 홀딩 비.브이. Bonding led die to lead frame strips
WO2014207620A1 (en) * 2013-06-28 2014-12-31 Koninklijke Philips N.V. Bonding led die to lead frame strips
JP2015032699A (en) * 2013-08-02 2015-02-16 大日本印刷株式会社 Multifaceted body of lead frame, multifaceted body of lead frame with resin, multifaceted body of optical semiconductor device, lead frame, lead frame with resin, and optical semiconductor device

Also Published As

Publication number Publication date
TW200849662A (en) 2008-12-16
JPWO2008078791A1 (en) 2010-04-30

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