WO2008064993A1 - Heizvorrichtungsanordnung - Google Patents
Heizvorrichtungsanordnung Download PDFInfo
- Publication number
- WO2008064993A1 WO2008064993A1 PCT/EP2007/062239 EP2007062239W WO2008064993A1 WO 2008064993 A1 WO2008064993 A1 WO 2008064993A1 EP 2007062239 W EP2007062239 W EP 2007062239W WO 2008064993 A1 WO2008064993 A1 WO 2008064993A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heating
- heat sink
- unit
- cooling
- heat
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/12—Cooking devices
- H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
- H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
- H05B6/1263—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/12—Cooking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
- H05B2206/02—Induction heating
- H05B2206/022—Special supports for the induction coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
- H05B2213/03—Heating plates made out of a matrix of heating elements that can define heating areas adapted to cookware randomly placed on the heating plate
Definitions
- the invention is based on a heater arrangement, in particular an induction cooker arrangement, according to the preamble of claim 1.
- a heating device in particular an induction hob, is known.
- This comprises a Schuvoriquessan Aunt with heating modules, which each have a radiator and a power unit for supplying the radiator with a heating power.
- the heating device arrangement is provided with a cooling unit.
- the object of the invention is in particular to provide a generic Schufflesan extract in terms of improved cooling properties.
- the invention is based on a heater arrangement, in particular an induction cooker arrangement, with a set of heating modules and a cooling unit for cooling the heating modules.
- the cooling unit has at least one heat sink unit which serves to cool at least three heating modules. It can be achieved by a particularly effective and rapid heat dissipation.
- the heat sink unit has at least one heat sink.
- a "heat sink” may in particular be understood to be a preferably one-piece body which is intended to absorb heat generated by at least one heating module, in particular by power losses, and / or to dissipate it from a heat receiving location by heat conduction a heat-conducting material, such as aluminum, copper, silver, etc.
- the heat sink unit preferably forms a heat receiving surface, which is assigned to at least three heating modules. in the heat receiving surface is expediently facing the heating modules.
- the heat sink unit is also preferably arranged in the region of a heating module to be cooled, wherein the heat sink unit is arranged with a distance of less than 5 cm, preferably less than 3 cm and preferably less than 1 cm to be cooled heating module.
- a heat absorption can take place by means of the contact of the heat sink unit with an air surrounding the heating module to be cooled and / or it can take place by means of a direct contact of the heat sink unit with at least a portion of the heating module.
- a heat generated by the heating module via a thermally conductive material, such as a thermal grease, from the heating module to the heat sink unit are performed.
- a heating module preferably has a heating means for transmitting a heating energy to an object to be heated and a power unit for supplying the heating means with power.
- the heating device arrangement according to the invention is particularly suitable for use in an induction heating device, such as in particular an induction cooking device.
- the heating means of the heating modules are preferably designed as induction heating coils, which cause heating by means of an alternating magnetic field with a heating frequency
- the power units are e.g. designed as an inverter for generating the heating frequency.
- the power units have, for example, electronic switching elements which provide the heating frequency by means of switching operations, which typically generate a large amount of heat during operation due to power losses.
- a particularly advantageous cooling effect can be achieved if the heat sink unit serves for cooling at least six, in particular at least ten, preferably at least twenty heating modules.
- the heat sink unit serves for cooling at least six, in particular at least ten, preferably at least twenty heating modules.
- the heater assembly in which a large number of heating modules are associated with a common heat sink unit, in an operation of the heater, typically not all of the heater modules are operated simultaneously with their maximum power.
- heat generated by heating modules operated with a high output can be dissipated via regions of the heat sink unit which correspond to heating modules which are operated at a lower power or remain undriven.
- the heat sink unit form a coherent heat absorption area for cooling at least three heating modules. This can be achieved over a large volume homogeneous heat conduction.
- the heat absorption area is preferably designed as a coherent heat absorption surface.
- the contiguous heat receiving area may be formed by an integrally formed body.
- a heat receiving surface may be formed by at least one contiguous part of a side surface of the body.
- the coherent heat absorption area can also be achieved by an interaction of at least two bodies which adjoin one another.
- the heat receiving area extends over a portion of the first body and continues without interruption over a portion of the first body adjacent portion of the second body.
- a contiguous heat receiving surface may be formed, for example, by a side surface of the first body and a side surface of the second body adjacent to one another along a line of contact, the heat receiving surface of the first body extending from the side surface of the first body beyond the contact line into the side surface of the second body Body continues.
- the heat sink unit forms a heat absorption area which serves for cooling at least one row of at least three heating modules, whereby a constructive simple heating apparatus arrangement can be achieved.
- a "row" of heating modules may, in particular, be understood to mean a set of heating modules which are arranged following one another along a common row axis.
- the heat sink unit forms a heat receiving area, which serves to cool at least two rows of heating modules, whereby a particularly compact heater arrangement can be achieved.
- the rows preferably each extend along a different row axis, wherein the row axes are advantageously aligned parallel to one another.
- the series axes can be arranged on both sides of the heat sink unit. This is particularly suitable when the heating modules are arranged in a matrix arrangement. In this case, at least two matrix rows and / or at least two matrix columns can be cooled by the heat sink unit.
- the heat sink unit is formed as a one-piece heat sink, whereby a low installation costs and a homogeneous heat dissipation can be achieved.
- the heating device circuit has a control unit which is provided to form a heating group of heating modules designed for heating the object, depending on a position of a heating object relative to the heating modules.
- a control unit which is provided to form a heating group of heating modules designed for heating the object, depending on a position of a heating object relative to the heating modules.
- the heating modules are preferably arranged below a cooking plate.
- a heating group of heating modules is preferably composed of heating modules of the set, which are at least partially covered by the object located on the cooking plate, in particular a cookware.
- the arrangement of the heating modules is preferably designed as a matrix arrangement.
- heating modules of different rows and / or different columns of the matrix arrangement can be at least partially covered by the object placed on the hotplate.
- the heating modules are preferably dimensioned such that a cookware of conventional dimensions, such as a pot with a diameter of at least 8 cm, heating modules of different rows and different columns at least partially covers.
- the set of heating modules defines a contiguous cooking zone of the hotplate surface suitable for heating the article which covers at least a majority of the hotplate surface, advantageously at least 60%, preferably at least 70% and most preferably at least 80% of the hotplate surface.
- the control unit here is preferably provided to adapt the composition of the heating group to a change in the position of the object relative to the heating modules at least partially automatically, advantageously fully automatically.
- a heating device arrangement provided for group operation of the heating modules is preferably provided with a large number of heating modules, in particular with at least six heating modules.
- the Schuvor- device arrangement is preferably provided with a set of at least ten, advantageously at least twenty, more preferably at least forty heating modules.
- the control unit may be at least partially formed integrally with a computing unit, such as a microprocessor or microcontroller.
- the set of heating modules is distributed in heating groups and in groups of undeluted remaining heating modules. If a heating group corresponds to a first region of the heat sink unit and a non-driven group corresponds to a second region of the heat sink unit, heat generated in the operated group can be dissipated quickly and effectively over the second region.
- areas of the heat sink unit which correspond to heating groups and undriven heating groups, are connected to one another via a common heat sink or contact surfaces between different heat sinks, whereby a fast and effective temperature compensation between these areas can be achieved.
- the heat sink unit may be designed to dissipate an amount of heat that is smaller than the amount of heat that would be generated if all the heat modules associated with the heat sink unit were operated together with their respective maximum power.
- the heating modules each have a heating means and a power unit for power supply of the heating means, wherein the heat sink unit forms a heat receiving area, which serves to cool the power units.
- the power units typically represent a major source of power losses during operation of the heater. If, in particular in a heating device designed as an induction cooking device, the power units are configured as inverters for generating a heating frequency, these power losses are caused during switching operations of semiconductor components. By a targeted heat absorption in the field of power units, a particularly high cooling effect and the occurrence of high temperatures can be advantageously avoided.
- the heat sink unit forms a partial area which serves as protection means for protecting at least one part of at least one of the heating modules against an electromagnetic field.
- an advantageous, at least partially electromagnetic shielding can be achieved, wherein components, space, assembly costs and costs can be saved.
- the partial region of the heat sink unit serves to protect the power unit of a heating module, in particular against a heating field generated by a heating unit assigned to one of the power units.
- an "electromagnetic field” can be understood to mean a magnetic and / or electrical field.
- the subregion of the heat sink unit can be made, in particular, of a non-magnetic material, such as a non-ferromagnetic material, thereby providing magnetic shielding of the part of the heating module This sub-area can be advantageously achieved.
- the heat sink unit may further comprise a heat pipe (also called heat pipe), which is filled with a certain amount of heat transfer medium.
- a heat pipe also called heat pipe
- the heat pipe preferably extends in the longitudinal direction of the heat sink unit, whereby a homogeneous temperature distribution over the entire length of the heat sink unit can be achieved.
- the cooling unit has a fan unit, which is provided in cooperation with the heat sink unit for cooling at least three heating modules. It can be further increased by the cooling effect of the cooling unit, with components and space can be saved in the construction of the fan unit.
- a structurally simple embodiment of the cooling unit can be achieved if the fan unit, in cooperation with the heat sink unit, serves to cool a series of at least three heating modules. In this case, a generated air flow can run straight along the row axis of the row.
- a particularly compact design of the heater assembly can be achieved.
- a particularly effective heat dissipation by producing a cooling air flow can be achieved easily if the fan unit has two fans, which are arranged on both sides of the heat sink unit. In this case, one of the fans can be used for blowing a cooling air for interaction with the heat sink unit, while the other fan can be used for sucking the cooling air heated by the alternating direction.
- Fig. 1 shows an induction hob with a hotplate and a set of
- Heating modules and two cooking utensils arranged on the cooking plate Heating modules and two cooking utensils arranged on the cooking plate
- FIG. 2 shows an internal arrangement of the induction hob of Figure 1 with the heating modules and a cooling unit in a view from above,
- FIG. 4 shows a cooling body of the cooling unit from FIG. 2
- FIG. 5 shows the arrangement from FIG. 2 in a sectional view
- FIG. 6 shows an alternative cooling body of the cooling unit
- FIG. 7 shows different suction and discharge directions for a cooling air flow of the cooling unit.
- FIG. 1 shows a heating device 10 designed as an induction hob.
- the heating device 10 has a mounting frame 12 for attachment to a worktop, a cooking plate 14 for placing cookware and a control panel 16 for starting, stopping and setting a heating operation.
- On the hotplate 14 two designed as a pot objects 18, 20 are arranged, which are each shown schematically by a solid circle.
- To carry out a cooking operation of the heating direction 10 this is provided with a set of heating modules 22.
- These each comprise a heating means 24 designed as an induction coil, which is shown schematically in FIG. 1 by means of a dashed rectangle.
- a heating module 22 In an operation of a heating module 22 is formed by the heating means 24 designed as a magnetic alternating field Banksig- signal, which has a heating frequency, for example, is 25 kHz.
- the heating signal H induces electrical currents in the metallic bottom of the articles 18, 20. These electrical currents heat up a food present in the articles 18, 20.
- a heating means 24 in operation of the corresponding heating module 22 is fed to generate the heating signal with an alternating electrical current, which oscillates with the heating frequency.
- the heating modules 22 are each provided with a power unit 26 designed as an inverter. These power units 26 are shown in FIG.
- the heating device 10 is provided for heating the objects 18, 20 by means of a group operation of the heating modules 22.
- the heating modules 22 are each provided with a sensor means 25 shown in Figure 3, can be detected by means of which the heating module 22 of one of the objects 18, 20 is at least partially covered.
- heating groups are formed by heating modules 22, which are each assigned to one of the objects 18, 20. If an operator starts a cooking operation of the heating device 10 by means of the control panel 16, this cooking operation is carried out by means of the heating modules 22 of both heating groups, while the other heating modules 22, which do not belong to any of the heating groups formed remain idle.
- heating groups of heating modules 22 are adapted or newly formed on the basis of the new arrangement of objects to be heated relative to the heating means 24.
- the grouping processes for forming heating groups are carried out by means of a microprocessor-designed control unit 27, which is shown in dashed lines in FIG.
- a heater assembly 28 of the heater 10 is shown in a top view, in which the set of heating modules 22 can be seen.
- the heating modules 22 each have one of the induction coil designed as heating means 24, which are shown schematically in the figure as solid rectangles, and one of Inverter executed, shown by dashed lines power units 26 on.
- These power units 26 generate an alternating current with the heating frequency during operation of the corresponding heating module 22 by means of switching operations which are effected by switching means 30 (FIG. 3).
- switching means 30 are designed as switching transistors.
- the power units 26 each have a pair of switching means 30 configured as an IGBT (Insulated-Gate Bipolar Transistor or Bipolar Transistor).
- switching means 30 such as as FET transistors (field effect transistors)
- FET transistors field effect transistors
- a representation of one of the heating modules 22 with a power unit 26 which has the switching means 30, a heating means 24 designed as an induction coil and one of the sensor means 25 can be taken from FIG.
- the heating modules 22 are further arranged in a matrix arrangement.
- the array has four rows 32.1, 32.2, 32.3, 32.4 and twelve columns. Further embodiments of the matrix arrangement with further combinations of row and column numbers are conceivable.
- the heating means 24 designed as induction coils are accommodated in a carrier means designed as a carrier matrix 38 (see also FIG. 5).
- the heating modules in a row 32.1, 32.2, 32.3, 32.4 each define a row axis, wherein the row axes are aligned parallel to an axis 34.
- the heating modules 22 in a column each define a column axis, wherein the column axes are each aligned parallel to an axis 36 which is perpendicular to the axis 34.
- the heating device arrangement 28 is provided with a cooling unit 40.
- the cooling unit 40 has two heat sink units 42, 44 which, viewed in each case from the hotplate 14, are arranged below the carrier matrix 38.
- the heat sink units 42, 44 each comprise two heat sinks 46, 48 and 50, 52 made of aluminum and made in one piece.
- the heat sink units 42, 44 each serve to cool two rows 32.1, 32.2 and 32.3, 32.4 of heating modules 22, which correspond to two rows of the matrix arrangement.
- the heat sink units 42, 44 serve to cool the power units 26 of the heating modules 22.
- two rows of power units 26 are arranged parallel to the axis 34 of the matrix arrangement on both sides of one of the heat sink units 42, 44.
- the heat sink units 42, 44 are designed identically, so that the description is limited to the heat sink unit 42 below.
- the heat sinks 46, 48 are each formed as a cuboid body (see also Figure 4), which extends in the assembled state of the heater assembly 28 along the axis 34 of the matrix array.
- the heat sinks 46, 48 also each have a contact surface 54 or 56 (see also FIG. 4), via which they rest against one another.
- the contact surfaces 54, 56 are each formed by a side surface of the corresponding heat sink 46 and 48, which is perpendicular to the main extension direction of the heat sink 46 and 48, respectively.
- the contact surfaces 54, 56 are formed identically, whereby an effective heat transfer between the heat sinks 46, 48 can be achieved.
- This heat receiving area 61. 1 is designed as a coherent heat absorption area extending in the main extension direction of the heat sink unit 42.
- a heat absorption via a direct contact by a concern of the power units 26 of the row 32.1 on the heat receiving area 61.1 causes.
- this can be done indirectly by the power units 26 are arranged with a small distance to the heat receiving area 61.1. It is further the use of a heat conducting agent, such. a beideleitpaste, for connecting the power units 26 with the heat receiving area 61.1 conceivable.
- 60.1 side of the heat sink unit 42 forms a side surface 58.2 of the heat sink 46 in cooperation with a side surface 60.2 of the heat sink 48 designed as a coherent heat receiving surface heat receiving area 61.2, for cooling the row 32.2 of heating modules 22nd serves.
- the heat receiving areas 61.1 and 62.2 form a heat receiving area 61 of the heat sink unit 42, which serves to cool the rows 32.1 and 32.2 of heating modules 22.
- the description of the formation of heat receiving areas by the heat sink unit 42 also applies to the heat sink unit 44 and is not repeated.
- the set of heating modules 22 is divided among the heating groups and the remaining, unloaded remaining heating modules 22.
- heat generated by the operated power units 26 of the heating groups can be dissipated over areas of the heat sink units 42, 44 which face inoperative heating modules 22.
- a fast and effective temperature compensation between regions of the heat sink units 42, 44 can be achieved, which correspond to the heating groups on the one hand and undriven heating modules 22 on the other.
- the cooling unit 40 is provided with two fan units 62, 64 which are each associated with a heat sink unit 42 and 44, respectively.
- a fan unit 62, 64 in cooperation with the corresponding heat sink unit 42 and 44 respectively for common cooling of two rows 32 of the array of heating modules 22.
- the fan units 62, 64 each have two fans 66, 68 and 70, 72, which are arranged on both sides of the associated heat sink unit 42 and 44, respectively.
- the fans 66, 68, 70, 72 are each arranged in the region of an end face 74 of a heat sink 46, 48, 50, 52, which extends perpendicular to the axis 34 of the matrix arrangement (see FIG. 4).
- the fan units 62, 64 generate by means of their corresponding pairs of fans during operation of the heater 10 each have a cooling air flow 76 which extends in the main extension direction of the heat sink units 42, 44 parallel to the axis 34 and is schematically represented by a dashed arrow.
- the fans 66, 70 suck in a cool air and blow them into the heat sink units 42 and 44, respectively.
- the fans 68, 72 suck the air heated in the heat sink unit 42 or 44 and discharge it to the outside.
- the fans 66, 68, 70, 72 are each covered by the cooking plate 14 from a portion 78 of a heat sink unit 42, 44 covered, which is designed as a web (see also Figure 4).
- the heat sink 48 has the side surface 60.2 which, in cooperation with the side surface 58.2 of the heat sink 46, forms the heat absorption area 61.2 (see FIG. 2), along which power units 26 of the row 32.2 are arranged in the mounted state of the heating device.
- the heat sink 48 further includes a portion 82 formed as a plateau, which is formed by an upper side O, which faces the heating means 24 in the assembled state of the heating device 10. The plateau 82 continues in the main direction of extension of the heat sink 48 as the web formed as a portion 78, below which the fan 66 is arranged.
- the heating means 24 of the heating modules 22 are each viewed from the hotplate 14 above the plateau 82 arranged. From the plateau 82 openings 84 are further formed, which continue as through the heat sink 48 through-drilled air channels perpendicular to the plateau level. Through these openings 84, an air flow into the heat sink 48 and from the heat sink 48 can be performed. In this case, in particular, an effective cooling of the heating means 24 arranged above the plateau 82 can be achieved.
- An underside 86 of the heat sink 48 which is arranged opposite the plateau 82, furthermore has ribs 88, which form heat removal channels 89 (see also FIG. 5).
- heat removal channels 89 which extend in the main extension direction of the heat sink 48 and in the mounted state of the heater arrangement 28 along the axis 34 of the matrix arrangement, a particularly effective temperature compensation between regions of the heat sink 48 can be achieved.
- the underside of the heat sink 46 is formed identically, so that the heat removal channels 89 formed by the ribs 88 continue in the heat sink 46 and thus extend along the axis 34 over the entire heat sink unit 42.
- FIG. 5 shows a sectional view through a part of the heater arrangement 28 from FIG. 2 along the line VV.
- the heating means 24 of the rows 32.1 and 32.2 as well as the heat sink unit 42 with the heat sink 48 can be seen.
- the heat sink 48 forms, as described above, the heat receiving areas 61.1, 62.2, which serve on both sides of the heat sink 48 respectively for cooling a row 31.1 and 32.2.
- the plateau 82 over which the heating means 24 designed as induction coils are arranged, and the ribs 88 forming the heat removal channels 89 can be seen.
- the power units 26 are connected via a conductor arranged below the heat sink 48.
- plate 90 connected to an unillustrated control electronics of the heater 10.
- the carrier matrix 38 which forms receiving areas 92, in which the heating means 24 are accommodated.
- the carrier matrix 38, the heat sink 48 and the printed circuit board 90 are connected to one another via connecting elements which are not shown in any more detail. Due to the arrangement of the heating means 24 via the plateau 82 and the arrangement of the power units 26 to the heat receiving areas 61.1, 61.2 of the heat sink 48, the power units 26 are partially shielded by the plateau 82 against the heating field generated by the heating means 24.
- partial regions 94, 96 of the heat sink 48 which respectively extend over the region of the heating means 24, serve as protective means for protecting the power units 26 against the heating field.
- the partial regions 94, 96 correspond to regions of the heat sink 48 which are each overlapped by a heating medium 24. These are schematically limited in the figure by dashed lines.
- FIG. 6 shows an alternative embodiment of the cooling unit 40 with the fan unit 62 and a heat sink unit 98.
- the heat sink unit 98 is formed by an integrally embodied heat sink 100, which serves in the installed state of the heater arrangement 28 for cooling the rows 32.1, 32.2 of heating modules 22 over their entire length.
- side surfaces of the heat sink 100 which extend parallel to the main extension direction of the heat sink 100, two heat receiving areas, of which a heat receiving area 102.2 for cooling the row 32.2 is visible in the figure.
- the fan unit 62 has the fans 66, 68, which are arranged on both sides of the heat sink 100.
- an integral heat sink is conceivable which is provided for cooling at least three, in particular at least four rows of the matrix arrangement.
- a heat sink unit can also be formed by an integrally embodied heat sink, which is used to cool at least a predominant part the matrix arrangement of heating modules 22, in particular for cooling the entire matrix arrangement is provided.
- FIG. 7 shows various combinations of suction and discharge directions of air for the cooling air flow 76 by means of the fans 66, 68 of the fan unit 62.
- the suction or discharge direction can be aligned parallel or perpendicular to the main extension direction of the heat sink unit 42.
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- Electromagnetism (AREA)
- Induction Heating Cooking Devices (AREA)
- Electric Stoves And Ranges (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE112007002332T DE112007002332A5 (de) | 2006-11-28 | 2007-11-13 | Heizvorrichtungsanordnung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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ESP200603122 | 2006-11-28 | ||
ES200603122A ES2310961B1 (es) | 2006-11-28 | 2006-11-28 | Disposicion de dispositivo de calentamiento. |
Publications (1)
Publication Number | Publication Date |
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WO2008064993A1 true WO2008064993A1 (de) | 2008-06-05 |
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PCT/EP2007/062239 WO2008064993A1 (de) | 2006-11-28 | 2007-11-13 | Heizvorrichtungsanordnung |
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DE (1) | DE112007002332A5 (de) |
ES (1) | ES2310961B1 (de) |
WO (1) | WO2008064993A1 (de) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2292979A1 (de) * | 2009-09-03 | 2011-03-09 | BSH Bosch und Siemens Hausgeräte GmbH | Kühlvorrichtung für ein Hausgerät sowie Hausgerät, insbesondere Induktionskochfeld, mit einer Kühlvorrichtung |
EP3177108A1 (de) * | 2015-12-02 | 2017-06-07 | Electrolux Appliances Aktiebolag | Induktionskochfeld |
EP2506671B1 (de) | 2011-03-29 | 2017-09-13 | BSH Hausgeräte GmbH | Schaltungsvorrichtung |
EP2679913B1 (de) * | 2012-06-28 | 2019-08-07 | BSH Hausgeräte GmbH | Hausgerät |
EP3544379A1 (de) * | 2018-03-23 | 2019-09-25 | LG Electronics Inc. | Induktionserwärmungsvorrichtung mit verbesserter kühlstruktur |
WO2019197148A1 (en) * | 2018-04-10 | 2019-10-17 | Electrolux Appliances Aktiebolag | Cooking appliance, particularly domestic cooking appliance, more particularly cooking hob, more particularly induction hob with at least two heating elements |
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US4549052A (en) * | 1984-01-12 | 1985-10-22 | The Maytag Company | Cooling system for an induction cooking cartridge |
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DE10163839A1 (de) * | 2001-12-22 | 2003-07-10 | Aeg Hausgeraete Gmbh | Kochmulde, insbesondere Induktionskochmulde |
EP1628506A2 (de) * | 2004-08-16 | 2006-02-22 | LG Electronics, Inc. | Induktiver Kochheizer |
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2006
- 2006-11-28 ES ES200603122A patent/ES2310961B1/es active Active
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2007
- 2007-11-13 WO PCT/EP2007/062239 patent/WO2008064993A1/de active Application Filing
- 2007-11-13 DE DE112007002332T patent/DE112007002332A5/de active Pending
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US4431892A (en) * | 1981-07-17 | 1984-02-14 | Jenn-Air Corporation | Ventilated modular cooktop cartridge |
US4549052A (en) * | 1984-01-12 | 1985-10-22 | The Maytag Company | Cooling system for an induction cooking cartridge |
EP0180458A2 (de) * | 1984-10-29 | 1986-05-07 | Matsushita Electric Industrial Co., Ltd. | Küchenherdbauteil mit innerem Kühlsystem |
DE10163839A1 (de) * | 2001-12-22 | 2003-07-10 | Aeg Hausgeraete Gmbh | Kochmulde, insbesondere Induktionskochmulde |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2292979A1 (de) * | 2009-09-03 | 2011-03-09 | BSH Bosch und Siemens Hausgeräte GmbH | Kühlvorrichtung für ein Hausgerät sowie Hausgerät, insbesondere Induktionskochfeld, mit einer Kühlvorrichtung |
EP2506671B1 (de) | 2011-03-29 | 2017-09-13 | BSH Hausgeräte GmbH | Schaltungsvorrichtung |
EP2679913B1 (de) * | 2012-06-28 | 2019-08-07 | BSH Hausgeräte GmbH | Hausgerät |
EP3177108A1 (de) * | 2015-12-02 | 2017-06-07 | Electrolux Appliances Aktiebolag | Induktionskochfeld |
WO2017093013A1 (en) * | 2015-12-02 | 2017-06-08 | Electrolux Appliances Aktiebolag | Induction cooking hob |
US10912158B2 (en) | 2015-12-02 | 2021-02-02 | Electrolux Appliances Aktiebolag | Induction cooking hob |
EP3544379A1 (de) * | 2018-03-23 | 2019-09-25 | LG Electronics Inc. | Induktionserwärmungsvorrichtung mit verbesserter kühlstruktur |
EP3684142A3 (de) * | 2018-03-23 | 2020-11-11 | LG Electronics Inc. | Induktionserwärmungsvorrichtung mit verbesserter kühlstruktur |
US11672056B2 (en) | 2018-03-23 | 2023-06-06 | Lg Electronics Inc. | Induction heating device having improved cooling structure |
WO2019197148A1 (en) * | 2018-04-10 | 2019-10-17 | Electrolux Appliances Aktiebolag | Cooking appliance, particularly domestic cooking appliance, more particularly cooking hob, more particularly induction hob with at least two heating elements |
Also Published As
Publication number | Publication date |
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DE112007002332A5 (de) | 2009-10-15 |
ES2310961B1 (es) | 2009-10-23 |
ES2310961A1 (es) | 2009-01-16 |
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