WO2008044308A1

WO2008044308A1 - Circuit board and process for producing the same

Info

Publication number: WO2008044308A1
Application number: PCT/JP2006/320453
Authority: WO
Inventors: Hiroyasu Inagaki; Noriyuki Kawanishi
Original assignee: Manac Inc.
Priority date: 2006-10-13
Filing date: 2006-10-13
Publication date: 2008-04-17
Also published as: JPWO2008044382A1; JP4438890B2; WO2008044382A1

Abstract

A circuit board including a conductor prefabricated so as to have a given pattern and a resin base material resulting from transfer of the conductor to a surface layer of thermosetting resin and hardening of the thermosetting resin, characterized in that the surface of the conductor and the surface of the resin base material constitute one plane. Further, there is provided a process for producing the circuit board.

Description

Circuit board and manufacturing method thereof

Technical field

TECHNICAL FIELD [0001] The present invention relates to a circuit board and a method for manufacturing the circuit board. Specifically, a conductor formed in advance so as to have a certain pattern and a resin substrate obtained by curing a thermosetting resin. The present invention relates to a circuit board including a circuit board in which a surface of the conductor and a surface of the resin board are flush with each other, and a method for manufacturing the circuit board.

Background art

[0002] With recent reductions in size and weight of electronic devices and higher performance, there is an increasing demand for mounting semiconductor elements on electronic components at high density. In particular, with the spread of mobile devices such as mobile phones, it is expected that electronic components will be further reduced in size and weight. For this reason, there is a need for technology for mounting electronic components on both sides of a circuit board or in a three-dimensional direction. For this purpose, it is required that the substrate surface and the circuit surface be flush with each other in the method in which the circuit (conductor) is placed on the insulating substrate.

[0003] With the practical application of optical communication systems through the development of low-loss optical fibers, development of various optical communication devices is desired. Wiring technology for mounting these optical devices at high density, especially the establishment of optical waveguide technology, is required.

[0004] Conventionally, as a multilayer wiring board that increases the miniaturization of boards and the mounting density of elements, the surface of a soft insulating sheet containing a thermosetting resin (B-stage state) has a certain pattern of copper foil or the like. There has been proposed a method of forming a pattern groove for incorporating a component by pressing a film on which a circuit is drawn in advance, transferring the circuit by thermocompression bonding, and three-dimensionally combining these sheets (for example, Japanese Patent Laid-Open 11 45955). This method is problematic because it requires an extremely large number of steps as means for forming a groove for circuit or component incorporation on the sheet.

[0005] Further, in the above film transfer method, it is necessary to prepare a transfer film in which a circuit having a certain pattern is drawn in advance. However, since the transfer film does not conform to the curved surface and corners of the mold, there is a limit to the formability of the film and the shape of the molded product is limited. There are many issues.

[0006] On the other hand, in the conventional method for producing a buried organic optical waveguide, for example, a varnish spin coating and a drying process are necessary to obtain a cladding layer and a core layer, and the pattern of the core layer is dry. This is a method having many steps, such as being formed by etching, and is costly (see, for example, Japanese Patent Application Laid-Open No. 2003-103738).

[0007] Furthermore, using a stamper having a pattern opposite to the wiring pattern, the wiring pattern is transferred to the resin on the surface of the substrate to form a grooved wiring pattern, and then the resin including the groove part. A method of forming a circuit by providing a copper plating layer over the entire surface and finally polishing until the grease portion between the grooves is exposed (see, for example, JP-A-2001-32015), Alternatively, fine mold processing is performed on the mold material to manufacture a mold having a predetermined wiring pattern, and then the wiring pattern on the mold is transferred to have a non-conductive groove pattern. There has also been proposed a method of manufacturing a substrate and finally forming a wiring by injecting a conductive material into these grooves (see, for example, JP-A-2004-356255). However, any of these methods is a method in which a groove-like wiring pattern is formed on a substrate, and a conductive material is coated or injected into the groove, and the conductive material adhered to a portion other than the groove. The process is complicated, such as having to be removed.

Disclosure of the invention

Problems to be solved by the invention

[0008] The present invention is in a situation where mounting of electronic components on both sides of a circuit board or in a three-dimensional direction is required! A circuit board including a conductor formed in advance so as to have a predetermined pattern and a resin substrate obtained by curing a thermosetting resin, the surface of the conductor and the resin substrate described above An object of the present invention is to provide a circuit board having a flush surface and a manufacturing method thereof. Since the circuit board of the present invention is obtained by a simple production method that does not use a transfer film and does not have an etching process or a varnish coating process, it solves the above-described problems of the prior art.

Means for solving the problem

[0009] In the first aspect of the present invention, a conductor formed in advance so as to have a certain pattern and the conductor are transferred to a surface layer of a thermosetting resin, and the thermosetting resin is cured. Goodbye The circuit board is characterized in that the surface of the conductor and the surface of the resin substrate are flush with each other.

Here, the thermosetting resin preferably has a powder form. Further, the preferred thermosetting resin that can be used is represented by the following general formula (1):

[0012] (where

n is 1 to: the number of LOs

Ar ¹ is a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms, or a polycyclic compound in which two or more of the same or different aromatic groups are connected to each other directly or by a bridging member. A tetravalent group of compounds,

Ar ² is a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms, or a polycyclic compound in which two or more of the same or different aromatic groups are connected to each other directly or by a bridging member. A divalent group of compounds,

The crosslinker is: o CO COO OCO-so S -CH

2 2 C (CH) C (CF) — Powerful group force is a divalent group selected, and

3 2 3 2

R \ R ² are each independently be the same, but also different Yogu hydrogen or phenyl group. )

Is an imide oligomer represented by

[0013] The conductor is preferably formed in advance on the surface of the mold. Further, the conductor is formed of a conductive paste containing one or more conductive particles selected from the group consisting of gold, silver, copper, zinc, tin, nickel, palladium, carbon, and the like having a particle size of lOOnm or less. It is preferred to be a conductive circuit.

[0014] Further, the conductor is polyimide, polymethyl methacrylate, polycarbonate, aromatic polyester, polyarylate, epoxy resin, silicone resin, acrylic resin, and these. It is also preferable that the optical waveguide be formed from a resin composition for optical waveguides containing one or more selected fluorinated and deuterated group forces.

[0015] In a second aspect of the present invention, (1) a step of forming a conductor having a certain no-turn on the surface of the mold, (2) a powdery thermosetting resin, and formed on the surface of the mold (3) The mold is pressed and Z or heated together with a thermosetting resin to melt and cure the thermosetting resin, and is formed on the surface of the mold. A method for producing a circuit board, wherein the surface of the conductor and the surface of the resin substrate are flush with each other, including a step of transferring the conductor to the surface of the resin substrate obtained by curing.

[0016] A thermosetting resin suitable for the method of manufacturing a circuit board is an imide oligomer represented by the above general formula (1). The production method of the present invention also includes a conductive paste or a resin composition for an optical waveguide suitable for forming a conductor having a certain pattern, whether it is a conductive circuit or an optical waveguide. is there.

In the method for manufacturing a circuit board, examples of a method for forming a conductor having a certain pattern include an inkjet method, a screen printing method, and a spin coating method. Further, if desired, the mold may be provided with irregularities, and a groove or hole for incorporating a component may be formed at an arbitrary location on the circuit board.

The invention's effect

[0018] According to the present invention, a conductor previously formed to have a certain pattern (preferably on the surface of a mold, etc.) is transferred to the surface layer of a thermosetting resin, which is then thermosetting. When it is hardened together with the resin, the conductor is transferred as it is and embedded in the surface of the resin substrate, so that the surface of the conductor and the surface of the resin substrate can be flush with each other. There is an effect that the mounting of the electronic component in the dimension direction can be facilitated. In addition, in the present invention, since the resin substrate is formed by melting and curing the powdered thermosetting resin, it is difficult for voids to be formed on the curved surfaces and corners of the mold and the conductor. Play. In addition, by using a thermosetting imide oligomer as shown by the general formula (1), the circuit can be efficiently transferred to the surface of the resin surface without steps with few steps. In addition, if desired, grooves or holes for component built-in can be easily set in an arbitrary place in advance, so that it is easy to achieve high-density mounting and a circuit board can be obtained. Brief Description of Drawings

FIG. 1 is a schematic explanatory diagram of a mold and a circuit pattern.

FIG. 2 is a structural diagram of a circuit board using a conductive paste.

FIG. 3 is a structural diagram of a substrate using a resin composition for an optical waveguide.

FIG. 4 is a structural diagram of a circuit board having grooves using conductive paste.

FIG. 5 is a schematic explanatory diagram of a mold and a circuit pattern capable of forming a concave groove on a substrate. BEST MODE FOR CARRYING OUT THE INVENTION

[0020] Embodiments of the present invention will be described below.

In the present invention, the conductor previously formed to have a certain pattern used in the present invention is formed, for example, on the inner surface of a substrate manufacturing mold as shown in FIG. Various types of materials can be used as the mold for manufacturing the substrate. In the present invention, for example, after a circuit pattern diagram formed using a conductive paste is cured, the mold is filled with a powdered thermosetting resin, and this is heated and Z or pressurized. In order to manufacture a fat substrate, a material having excellent heat resistance is suitable. Metal materials, semiconductor materials, inorganic materials, etc. can be used. The dimensions and shape of the mold are not particularly limited, and can be selected according to the circuit board to be produced.

[0021] Formation of a conductor, specifically a conductive circuit, on the surface of the mold can be performed, for example, by the following steps. First, a desired circuit pattern diagram is drawn with a conductive paste on the inner surface of either a convex type or a concave type as shown in FIG. At this time, desired circuit pattern diagrams may be drawn on the internal surfaces of both the convex and concave molds, thereby easily producing a circuit board having conductive circuits on both sides of the resin board. be able to. The drawing method can be appropriately selected from the ink jet method, the screen printing method and the like depending on the properties of the conductive paste to be used.

[0022] A circuit pattern diagram drawn using a conductive paste on the mold is subjected to a curing process together with the mold, whereby a conductive circuit is formed on the mold. The temperature and time conditions for the curing process are appropriately determined depending on the components such as conductive particles, organic resin, and solvent contained in the conductive paste, but usually in the temperature range of 100 ° C to 300 ° C. It takes between 10 and 120 minutes. [0023] The conductive particles contained in the conductive paste used in the present invention are preferably composed of conductive particles having an average particle diameter of lOOnm or less and lnm or more in order to form a fine wiring circuit. In order to reduce the conduction resistance of the wiring circuit, the average particle size is more preferably 50 nm or less and 2 nm or more. As the conductive particles, gold, silver, copper, zinc, tin, nickel, noradium, carbon, or the like can be used. A conductive paste can be prepared by mixing and dispersing these conductive particles, an organic resin, and a solvent. Examples of the organic resin include epoxy resin, phenol resin, polyamide resin, polyimide resin, polyphenylene sulfide resin, and polycarbonate resin. As the organic resin, an imide oligomer represented by the general formula (1) of the present invention can also be used. The weight ratio of the conductive particles to the organic resin is preferably in the range of 70:30 to 99: 1. In addition, a viscosity modifier and a reducing agent may be appropriately added to the conductive base.

[0024] Solvents used for the conductive paste include polyethylene glycol monomethyl ether solvent, polyethylene glycol monomethyl ether acetate solvent, polypropylene glycol monomethyl ether solvent, polypropylene glycol monomethyl ether acetate solvent, alcohol solvent, A hydrocarbon solvent is mentioned. The amount of solvent used is in the range of 30-60% by weight, based on the total weight of the conductive paste, depending on the organic resin used.

On the other hand, the optical waveguide can be formed on the mold by, for example, the following steps.

First, a desired pattern diagram is drawn on the inner surface of either a convex or concave mold as shown in FIG. 1 using a resin composition for an optical waveguide. At this time, desired turn diagrams may be drawn on the inner surfaces of both the convex and concave molds, whereby a circuit board having optical waveguides on both sides of the resin substrate can be easily produced. . The drawing method can be selected from a spin coating method, an ink jet method, a screen printing method and the like depending on the properties of the resin composition for optical waveguide to be used.

An optical waveguide is formed on the mold by subjecting the optical waveguide pattern drawing drawn using the resin composition for an optical waveguide on the mold to heat treatment together with the mold. The temperature and time conditions for the heat treatment are appropriately determined depending on components such as a resin and a solvent contained in the resin composition for an optical waveguide. [0027] Components of the resin composition for optical waveguides include polyimide, polymethylmethallate, polycarbonate, aromatic polyester, polyarylate, epoxy resin, silicon resin, talyl resin and fluorine thereof. And deuterides. A polymer material excellent in heat resistance is preferred, and polyimide is preferred. Further, among polyimides, fluorinated polyimide having excellent light transmission and moisture resistance is most suitable.

Next, in order to bring the conductor into contact with the thermosetting resin (in order to transfer the conductor to the surface layer of the thermosetting resin), for example, a convex mold for manufacturing a substrate as shown in FIG. Place on a concave mold filled with curable resin. However, the conductor may be formed on one or both inner surfaces of the mold in advance as described above. Next, these molds are mounted on a press machine capable of controlling the temperature, and are heated from the glass transition temperature (melting temperature) of the thermosetting resin to a temperature at which the thermosetting is completed while applying a desired pressure. The thermosetting resin is preferably used as it is in the form of a varnish dissolved in a solvent or as a power powder that can be used as it is. Heating above the glass transition temperature softens (melts) the powdered thermosetting resin, and a conductor such as a conductive circuit or an optical waveguide hardens the thermosetting resin. The surface is filled and closely contacted with no gap, and transfer is performed well.

[0029] Next, after the press machine is cooled, the circuit board in which the surface of the conductor is flush with the surface of the resin board can be obtained by removing the mold from the resin board. In the present invention, “level” means that there is substantially no step between the surface of the conductor and the surface of the resin substrate. The thickness is preferably ± 1% or less with respect to the thickness of the substrate, more preferably ± 0.5% or less.

[0030] In addition, a circuit board having a groove or a hole at an arbitrary position using a mold on which irregularities are processed can be produced by the same method as the above-described circuit board production method. .

[0031] As the thermosetting resin of the present invention, an imide oligomer represented by the following general formula (1) is preferable because it has a good heat melting property and a high followability to the uneven portion of the mold.

[0033] In the formula, n is a number of 1 to: L0, and Ar ¹ is a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms, or two or more of the fragrances that are the same or different Ar ² is a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms, and is a tetravalent group of polycyclic compounds in which group groups are connected to each other directly or by a bridge member. Or a divalent group of a polycyclic compound in which two or more of the same or different aromatic groups are connected to each other directly or by a cross-linking member, where the cross-linking members are —O—, —CO —, — Coo—, — oco—, -so one,-

2

A divalent group selected from the group consisting of S—, — CH —, — C (CH) 1, — C (CF) —

2 3 2 3 2

Each R ² is independently hydrogen or a phenyl group, which may be the same or different.

[0034] The "monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms" in Ar ² is preferably a monocyclic or condensed carbon having 6 to 18, more preferably 6 to 12 carbon atoms. It is a condensed polycyclic aromatic compound, and examples thereof include benzene, naphthalene, anthracene, and phenanthrene. Therefore, the “tetravalent group of a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms” in Ar ¹ is preferably a force-induced tetravalent group such as benzene, naphthalene, anthracene, or phenanthrene. The “divalent group of a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms” in Ar ² is preferably a force-induced divalent group such as benzene, naphthalene, anthracene, or phenanthrene. And most preferably o-, m- or p-phenylene. In addition, the “monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms” in Ar ² has a substituent such as an alkyl group having 1 to 4 carbon atoms or a trifluoromethyl group on the aromatic ring. You may have one or more, preferably one or two.

[0035] "A polycyclic compound in which two or more of the same or different aromatic compounds are directly or interconnected by a bridging member" in Ar ² is a simple substance mentioned in the above paragraph. A cyclic or condensed polycyclic aromatic compound is directly or a cross-linking member (where the cross-linking members are one O, one CO, one COO, one OCO, one SO —, one S—, —CH one, one C (CH

2 2 3

) One or C (CF) — selected from the group consisting of)

2 3 2

It means compound. Therefore, the tetravalent group of the polycyclic compound in Ar ¹ includes two or more monocyclic aromatic compounds mentioned in the preceding paragraph, particularly o-, m or p-ferene. Tetravalent groups of polycyclic compounds linked together or directly by a cross-linking member, such as biphenyl, diphenyl ether, benzophenone, benzoic acid phenol, 2,2-diphenylpropane, 2, 2 Diphenyl, 1, 1, 1, 3, 3, 3 Examples include force-induced tetravalent groups such as hexafluoropropane. The divalent group of the polycyclic compound in Ar ² includes two or more monocyclic aromatic compounds mentioned in the preceding paragraph, in particular o-, m or p phenylene forces, directly or bridged And divalent groups of polycyclic compounds connected to each other by members, such as biphenyl-4, 4, dill, biphenyl-2, 2, diyl and the like. In addition, the polycyclic compound in Ar ² has one or more substituents such as an alkyl group having 1 to 4 carbon atoms or a trifluoromethyl group, preferably 1 or 2 on the aromatic ring. It may be.

[0036] The production method of the imide oligomer having a crosslinkable group represented by the general formula (1) may be a known method without any particular limitation. For example, first, an aromatic tetracarboxylic dianhydride and an aromatic carboxylic acid-based molecular sealant having a crosslinkable group are mixed in a primary alcohol having 1 to 3 carbon atoms, preferably methanol or ethanol. Half esterify. The resulting solution is reacted with an aromatic diamine so that n in the general formula (1) is 1 to L0. The concentration of the solution at this time is about 10 to 50% by weight.

[0037] The mixture may contain an imidization catalyst such as 1,2 dimethylimidazole, benzimidazole, isoquinoline, or substituted pyridine. In addition, known additives such as inorganic fillers, organic fillers, inorganic pigments or organic pigments may be added.

[0038] Next, the mixture is evaporated to dryness and further heated to imidize. Regarding heating, it is desirable to heat for 5 to 180 minutes, preferably 60 minutes, within a temperature range below the temperature at which thermosetting starts from around the glass transition temperature of the resulting imide oligomer.

[0039] At the laboratory level, the obtained imide oligomer has an average particle size of 100 μm or less in a mortar or the like. Grind down to powder. The imide oligomer can be used in the form of a varnish by dissolving it in a solvent, but it is desirable to use it as it is from the viewpoint of environmental load.

[0040] Examples of tetracarboxylic dianhydrides used here include pyromellitic dianhydride, 3, 3 ', 4, 4, biphenyl tetracarboxylic dianhydride, 2, 3, 3' , 4, -biphenyltetracarboxylic dianhydride, 2, 2, 3 ', 3, -biphenyltetracarboxylic dianhydride, 4, 4, oxydiphthalic dianhydride, 3,4'-oxydiphthalic dianhydride , 3, 3'-oxydiphthalic dianhydride, 4, 4 '(4,4' isopropylidenediphenoxy) bis (phthalic anhydride), 3, 3 ', 4, 4, monobenzov Enone tetracarboxylic dianhydride, 3, 3 ', 4, 4, 1 diphenyl sulfone tetracarboxylic dianhydride, 2, 2 bis (3,4 dicarboxyphenol) propane dianhydride, 2, 2 Bis (3,4 dicarboxyphenyl) hexafluoropropane dianhydride, 1, 2, 7, 8 naphthalenetetracarboxylic dianhydride Is mentioned. These can be used alone or in combination of two or more.

[0041] Examples of the aromatic diamine used include p-phenylenediamine, m-phenylenediamine, diaminonaphthalene, diaminoanthracene, 4,4, -diaminobiphenyl, 3,4, diaminobiphenyl, 3, 3, 1-diaminobiphenyl, o toridine, m-tolidine, 2, 2, 1-bis (trifluoromethyl) 4, 4, 1-diaminobiphenyl, 4, 4, 1-diaminodiphenyl methane, 3, 4 ' -Diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diaminodiphenylsulfone, 3 , 4'-diaminodiphenyl sulfone, 3, 3, 1-diaminodiphenyl sulfone, 4, 4'-diaminodiphenyl ketone, 3, 4, 1-diaminodiphenyl ketone, 3 , 3, 1-diaminodiphenyl ketone, 2, 2 bis (4 aminophenoxy) propane, 2, 2 bis (3 aminophenoxy) propane, 2— (3 aminophenol) —2— (4 aminophenol) propane, 2, 2 Bis (4aminophenol) hexafluoropropane, 1, 4, —bis (4 aminophenoxy) benzene, 1, 3 bis (4 aminophenoxy) benzene, 1, 3 bis (3 aminophenoxy) benzene, 1, 4 bis ( 4-aminobenzoyl) benzene, 1,4-bis (3-aminobenzoyl) benzene, 1,3-- (4-aminobenzoylbenzene, 1,3-bis (3-aminobenzoyl) benzene, 9,9-bis (4-aminophenol) ) Fluorene, 2, 2 Bis [4— (4 Aminophenoxy) phenol] propane, 4, 4, —Bis (4-aminophenoxy) biphenyl, 4,4, monobis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenol] sulfone, bis [4- (3-aminophenoxy) [Phenol] sulfone, bis [4- (4-aminophenoxy) phenol] ether, bis [4- (3-aminophenoxy) phenol] ether, 4,4'-bis (4-aminophenoxy) benzophenone, 4, 4, 1 bis (3 aminophenoxy) benzophenone, 1, 4 bis [4— (2—, 3—, or 4 aminophenoxy) benzoyl] benzene, 1, 3 bis [4— (2—, 3—, or Is 4 aminophenoxy) benzoyl] benzene, 1,4 bis [3— (2—, 3—, or 4 —aminophenoxy) benzoyl] benzene, 1,3 bis [3— (2—, 3—, or 4 aminophenoxy) Benzyl] benzene, 4, 4, 1 [4— (2—, 3—, or 4 aminophenoxy) benzoyl] diphenyl ether, 4, 4, bis [3— (2—, 3—, or 4 —aminophenoxy) benzoyl] diphenyl ether, 4, 4, 1bis [4- (2—, 3—, or 4 aminophenoxy) benzoyl], 4, 4, 1bis [3— (2—, 3—, or 4 aminophenoxy) benzoyl] Biphenyl, 4, 4, bis [4— (2—, 3—, or 4-aminophenoxy) benzoyl disulfone, 4, 4, bis [3— (2, 3—, or 4 —Aminophenoxy) benzoyl] diphenyl sulfone. These can be used alone or in combination of two or more.

[0042] Examples of the carboxylic acid-based molecular sealing agent having a crosslinkable group to be used include 4-ethynylphthalic anhydride, 4-furethynylphthalic anhydride, or a mixture thereof.

[0043] As the thermoplastic resin of the present invention, in addition to the imide oligomer having a crosslinkable group represented by the general formula (1), an imide oligomer having another crosslinkable group can also be used. Such an imide oligomer can be produced by the same method as described above. However, as a carboxylic acid-based molecular sealant having a crosslinkable group, 3-phenol phthalic anhydride, ethyl naphthalene dicarboxylic acid Anhydride, Phenyl naphthalene dicarboxylic acid anhydride, Ethyl anthracene dicarboxylic acid anhydride, Phenyl ether anthracene dicarboxylic acid anhydride, 4 Naphthyl ether phthalic acid anhydride, 3-Naphthyl chlorophthalic acid Anhydride, 4 Anthracyl tert-phthalic anhydride, 3-Anthracyl tert-phthalic anhydride, Anthracyl naphthalene dicarboxylic acid anhydride, N-acetyl-anthracene dicarboxylic anhydride (hydrogen atoms on these aromatic rings are substituted with alkyl groups having 1 to 6 carbon atoms, alkenyl groups, alkyl groups, alkoxyl groups, radicals, and rogen atoms. Can be used). These may be used alone or in combination of two or more.

[0044] The imide oligomer described above has a glass transition temperature after thermosetting of 200 ° C or higher, preferably 250 ° C, so that processability before curing (thermal meltability) and circuit pattern transferability are improved. The composition of the tetracarboxylic dianhydride, the carboxylic acid anhydride having a bridging group, and the aromatic diamine is arbitrarily selected within the range of the number of repetitions n = l to LO, so as to be C or more.

[0045] The thermosetting resin of the present invention preferably has a hot pressing temperature of 150 ° C to 450 ° C, or preferably 160 when considering the heat resistance of the conductive paste and the resin composition for optical waveguides. It can be cured under curing conditions of ° C to 350 ° C.

Example

Hereinafter, an example of a method for manufacturing a circuit board according to the present invention will be described with reference to the drawings. The gist of the present invention is not limited to these examples.

[0047] Synthesis Example 1

In a 500 ml eggplant-shaped flask, 4, 4, 1 (4, 4, 1-isopropylidenediphenoxy) bis (phthalic anhydride), 15. 6146 g (30 mmol), 4-etulphthalic anhydride 3.4 4 g (2 Ommol) and 100 ml of methanol were added, and the mixture was heated and stirred for 3 hours while refluxing in an oil bath at 80 ° C. to obtain a homogeneous solution. Next, the solution was cooled to 50 ° C., and then 4,0094 ′ (40 mmol) of 4,4′-diaminodiphenyl ether and 40 ml of methanol were added to obtain a homogeneous solution. This solution was concentrated with an evaporator, and the temperature was further increased to 160 ° C., followed by reducing pressure and heating for 1 hour to obtain a solid. Further, this solid was pulverized in a mortar and then dried at 150 ° C. for 5 hours to obtain a thermosetting imide oligomer raw material powder. The glass transition temperature of this oligomer was 165 ° C, and the glass transition temperature was 260 ° C when thermally cured at 300 ° C for 10 minutes.

[0048] Synthesis Example 2

In a 500 ml eggplant-shaped flask, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride 12. 4386 g (28 mmol), 4-etulphthalic anhydride 4. 819 8 g (28 mmol) and 100 ml of methanol were charged, and the mixture was heated and stirred for 3 hours while refluxing in an oil bath at 80 ° C. to obtain a homogeneous solution. Next, the solution was cooled to 50 ° C, and then 2, 2, monobis (trifluoromethyl) 4, 4, monodiaminobiphenyl 8.0094g (42mmol) and methanol 40ml were added to obtain a homogeneous solution. It was. This solution was concentrated with an evaporator, and the temperature was raised to 150 ° C, and the mixture was reduced in pressure and heated for 1 hour to obtain a solid. The solid was pulverized in a mortar and then dried at 150 ° C. for 5 hours to obtain a thermosetting imidoligomer raw material powder. The glass transition temperature of this oligomer was 158 ° C, and the glass transition temperature was not detected when it was thermally cured at 300 ° C for 10 minutes.

[0049] Example 1

A circuit pattern diagram was printed on the convex mold la shown in FIG. 1 by screen printing using a conductive bed (Muromachi Technos, trade name Muromac Bond A-71S) as shown in FIG. . After printing, a heat treatment was performed at 170 ° C for 30 minutes together with the mold la to form a conductive circuit.

[0050] Next, the concave mold lb was filled with the thermosetting imide oligomer powder of Synthesis Example 1, covered with a convex mold la on which a conductive circuit was formed, and mounted on a heat press machine. Heated and pressurized at ° C, 5 MPa for 10 minutes. After that, the heat press machine was cooled, the molds la and lb were removed, and the conductive circuit formed with the conductive paste was transferred onto the surface of the resin without any step. A substrate was obtained. The resistance value of the transferred conductive circuit is 0.036 Ω.

[0051] Jewelery 12

On the convex mold la shown in Fig. 1, a resin composition for optical waveguides (pyromellitic dianhydride and 2, 2'-bis (trifluoromethyl) 4, 4, 1-diaminobiphenyl and potassium A circuit pattern diagram was printed by screen printing with the N, N dimethylacetamide solution of the fluorinated polyamic acid produced (solid concentration 15% by weight). After printing, it was gradually heated with the mold la, heat-treated at 350 ° C for 1 hour, and imidized to form an optical waveguide.

[0052] Next, the concave mold lb was filled with the thermosetting imide oligomer powder of Synthesis Example 2, covered with a convex mold la on which an optical waveguide was formed, and mounted on a heat press machine. Heated and pressurized at ° C, 5 MPa for 10 minutes. After that, the heat press machine was cooled, the molds la and lb were removed, and the optical waveguide formed of the fluorinated polyimide was transferred onto the surface of the resin without any step. The circuit board of Fig. 3 of μm was obtained.

[0053] Example 3

A circuit pattern diagram was printed on the convex mold 6a of FIG. 5 by screen printing using a conductive bed (Muromachi Technos, trade name Muromac Bond A-71S) as shown in FIG. . After printing, a heat treatment was performed at 170 ° C for 30 minutes together with the mold 5a to form a conductive circuit.

[0054] Next, the concave mold 6b is filled with the thermosetting imide oligomer powder of Synthesis Example 1, covered with the convex mold 6a on which the conductive circuit is formed, and mounted on a heat press machine. Heated and pressurized at ° C, 5 MPa for 10 minutes. After that, the heat press machine was cooled and the molds 6a and 6b were removed, and the conductive circuit formed with the conductive paste was transferred onto the surface of the resin without any step. The figure shows the thickness of 200 μm and the groove depth of 100 m. The circuit board shown in 4 was obtained. The resistance value of the transferred conductive circuit was 0.036 Ω.

[0055] Ratio Synthesis Example 1

In a 500 ml eggplant-shaped flask, 4, 4, 1 (4, 4, 1-isopropylidenediphenoxy) bis (phthalic anhydride) 15. 6146 g (30 mmol), maleic anhydride 1. 9612 g (20 mmol), After adding 100 ml of diol, the mixture was heated and stirred for 3 hours while refluxing in an oil bath at 80 ° C to obtain a homogeneous solution. Next, this solution was cooled to 50 ° C., and then 4,0094 ′ (40 mmol) of 4,4′-diaminodiphenyl ether and 40 ml of methanol were added to obtain a homogeneous solution. This solution was concentrated with an evaporator, and the temperature was further increased to 160 ° C., followed by reduced pressure and heating for 1 hour to obtain a solid. Further, the solid was pulverized in a mortar and then dried at 150 ° C. for 5 hours to obtain a thermosetting imide oligomer raw material powder. This oligomer had a glass transition temperature of 160 ° C, and was thermally cured at 300 ° C for 10 minutes, and the glass transition temperature was 220 ° C.

[0056] Comparative Example 1

[0057] Next, the concave mold lb was filled with the thermosetting imide oligomer of Comparative Synthesis Example 1, covered with a convex mold la on which a conductive circuit was formed, and mounted on a heat press machine. ° C, 5MPa, 10 Heated and pressurized in minutes. Thereafter, the heat press machine was cooled and the molds la and lb were removed, but the circuit board with a brittle resin substrate could not be obtained.

Reference numerals in attached FIGS. 1 to 5 indicate the following.

la: convex

lb: concave

2: There is a conductive paste.

3: Resin base

4: Conductive circuit

5: Optical waveguide

6a: Convex type with convex part

6b: concave

Claims

The scope of the claims

[1] A conductor formed in advance so as to have a certain pattern, and a resin substrate formed by transferring the conductor to a surface layer of a thermosetting resin and curing the thermosetting resin. A circuit board, wherein the surface of the conductor and the surface of the resin substrate are flush with each other.

[2] The circuit board according to claim 1, wherein the thermosetting resin is in a powder form.

[3] The thermosetting resin has the following general formula (1):

(1)

Where

n is 1 to: the number of L0

The bridge member is: o CO COO OCO -so S -CH

2 2 C (CH) C (CF) — Powerful group force is a divalent group selected, and

3 2 3 2

R ^{2 s} are each independently the same or different hydrogen or phenyl groups

The circuit board according to claim 1, which is an imide oligomer represented by:

[4] The circuit board according to any one of claims 1 to 3, wherein the conductor is formed in advance on a surface of a mold.

[5] The conductor has a particle diameter of lOOnm or less, gold, silver, copper, zinc, tin, nickel, palladium and The circuit board according to any one of claims 1 to 4, wherein the circuit board is a conductive circuit formed by a conductive paste containing at least one selected conductive particle.

[6] The conductor is a group consisting of polyimide, polymethyl methacrylate, polycarbonate, aromatic polyester, polyarylate, epoxy resin, silicone resin, acrylic resin, and fluorinated and deuterated compounds thereof. The circuit board according to any one of claims 1 to 4, which is an optical waveguide formed of a resin composition for an optical waveguide containing at least one selected from force.

[7] (1) A step of forming a conductor having a certain pattern on the surface of the mold,

(2) contacting a powdery thermosetting resin with a conductor formed on the surface of the mold; and

(3) A resin substrate obtained by pressing and Z or heating the mold together with a thermosetting resin to melt and cure the thermosetting resin, and curing the conductor formed on the surface of the mold Process to transfer to the surface

A method for manufacturing a circuit board, comprising: a conductor surface and a resin substrate surface flush with each other.

[8] The thermosetting resin has the following general formula (1):

Where

n is 1 to: the number of LOs

Ar ² is a monocyclic or condensed polycyclic aromatic compound having 6 to 36 carbon atoms, or a polycyclic compound in which two or more of the same or different aromatic groups are connected to each other directly or by a bridging member. A divalent group of compounds, R \ R ² are each independently be the same, are Yogu hydrogen or phenyl group which may differ

The method for producing a circuit board according to claim 7, which is an imide oligomer represented by:

[9] A conductive paste containing one or more selected conductive particles, wherein the conductor has a particle size of lOOnm or less, gold, silver, copper, zinc, tin, nickel, noradium, and carbon power. 9. The method for manufacturing a circuit board according to claim 7, wherein the circuit board is a conductive circuit formed by the method.

[10] The conductor is composed of polyimide, polymethyl methacrylate, polycarbonate, aromatic polyester, polyarylate, epoxy resin, silicone resin, acrylic resin, and their fluorinated and deuterated forces. The method for producing a circuit board according to claim 7 or 8, wherein the circuit board is an optical waveguide formed of a resin composition for an optical waveguide containing one or more selected.

[11] The method for producing a circuit board according to any one of [7] to [10], wherein the conductor is formed by an inkjet method, a screen printing method, or a spin coating method.

[12] The method for manufacturing a circuit board according to any one of [7] to [11], wherein the mold is provided with irregularities to form a groove or hole for incorporating a component at an arbitrary location on the circuit board.