WO2008040596A3 - Kühlkörper zur kühlung eines elektrischen bauelementes - Google Patents

Kühlkörper zur kühlung eines elektrischen bauelementes Download PDF

Info

Publication number
WO2008040596A3
WO2008040596A3 PCT/EP2007/058822 EP2007058822W WO2008040596A3 WO 2008040596 A3 WO2008040596 A3 WO 2008040596A3 EP 2007058822 W EP2007058822 W EP 2007058822W WO 2008040596 A3 WO2008040596 A3 WO 2008040596A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
cooling
electrical component
cooling device
combining
Prior art date
Application number
PCT/EP2007/058822
Other languages
English (en)
French (fr)
Other versions
WO2008040596A2 (de
Inventor
Reinhold Dillig
Bernhard Foecking
Manfred Lehner
Ralf Schweigert
Original Assignee
Siemens Ag
Reinhold Dillig
Bernhard Foecking
Manfred Lehner
Ralf Schweigert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Reinhold Dillig, Bernhard Foecking, Manfred Lehner, Ralf Schweigert filed Critical Siemens Ag
Publication of WO2008040596A2 publication Critical patent/WO2008040596A2/de
Publication of WO2008040596A3 publication Critical patent/WO2008040596A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Die Erfindung betrifft einen Kühlkörper (1) zur Kühlung eines elektrischen Bauelementes. Der Kühlkörper (1) wird insbesondere bei einem Stromrichtergerät (21) zumindest zur Kühlung der dort vorhandenen Leistungshalbleiter (53) verwendet. Der erfindungsgemäße Kühlkörper (1) dient der Kombination zweier Kühleinrichtungen. Hierfür ist der Kühlkörper derart ausgestaltet, dass dieser eine erste Kühleinrichtung (5) und eine Kontaktfläche (9) aufweist, welche zur Abgabe von Wärmeenergie an eine zweite Kühleinrichtung (15) vorgesehen ist oder dass der Kühlkörper (1) die erste Kühleinrichtung (5) und eine zweite Kühleinrichtung (15) aufweist.
PCT/EP2007/058822 2006-09-29 2007-08-24 Kühlkörper zur kühlung eines elektrischen bauelementes WO2008040596A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006046194.0 2006-09-29
DE200610046194 DE102006046194A1 (de) 2006-09-29 2006-09-29 Kühlkörper zur Kühlung eines elektrischen Bauelementes

Publications (2)

Publication Number Publication Date
WO2008040596A2 WO2008040596A2 (de) 2008-04-10
WO2008040596A3 true WO2008040596A3 (de) 2008-05-22

Family

ID=39134316

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/058822 WO2008040596A2 (de) 2006-09-29 2007-08-24 Kühlkörper zur kühlung eines elektrischen bauelementes

Country Status (2)

Country Link
DE (1) DE102006046194A1 (de)
WO (1) WO2008040596A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101970735B (zh) * 2008-03-17 2012-09-26 阿姆斯勒纺织公司 用于生产花式纱线的具有冷却的动力单元的设备
DE202012007882U1 (de) 2012-08-20 2012-10-29 Entwicklung und Fertigung Eßbach GmbH & Co. KG Vorrichtung zum Kühlen von elektronischen Bauteilen in einem Gehäuse
JP5785203B2 (ja) * 2013-02-26 2015-09-24 ファナック株式会社 ヒートシンクを含む冷却構造部を備えるサーボアンプ
EP3649838B1 (de) * 2017-07-04 2024-01-10 Weidmüller Interface GmbH & Co. KG Steuerung und modulares steuerungssystem eines industriellen automatisierungssystems
DE202019100078U1 (de) * 2019-01-09 2020-04-15 Weidmüller Interface GmbH & Co. KG Steuerung und modulares Steuerungssystem eines industriellen Automatisierungssystems

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US20020159237A1 (en) * 2001-04-30 2002-10-31 Patel Chandrkant D. Cooling arrangement for high density packaging of electronic components
DE10310568A1 (de) * 2003-03-11 2004-09-23 Bleckmann Gmbh Kühlvorrichtung für Hochleistungs-Mikroprozessoren
DE202004019985U1 (de) * 2004-12-27 2005-06-09 Lee, Frederick Struktur zur Verringerung des Wärmeübergangswiderstands zwischen zwei aufeinander stoßenden Flächen
DE102004019442A1 (de) * 2004-04-19 2005-10-06 Siemens Ag An planarer Verbindung angeordneter Kühlkörper
US20050252640A1 (en) * 2004-05-13 2005-11-17 Juei-Chi Chang Finned heat dissipation module having flow guide
EP1628342A1 (de) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Kühlkörper und Kühlkörperanordnung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US20020159237A1 (en) * 2001-04-30 2002-10-31 Patel Chandrkant D. Cooling arrangement for high density packaging of electronic components
DE10310568A1 (de) * 2003-03-11 2004-09-23 Bleckmann Gmbh Kühlvorrichtung für Hochleistungs-Mikroprozessoren
DE102004019442A1 (de) * 2004-04-19 2005-10-06 Siemens Ag An planarer Verbindung angeordneter Kühlkörper
US20050252640A1 (en) * 2004-05-13 2005-11-17 Juei-Chi Chang Finned heat dissipation module having flow guide
EP1628342A1 (de) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Kühlkörper und Kühlkörperanordnung
DE202004019985U1 (de) * 2004-12-27 2005-06-09 Lee, Frederick Struktur zur Verringerung des Wärmeübergangswiderstands zwischen zwei aufeinander stoßenden Flächen

Also Published As

Publication number Publication date
WO2008040596A2 (de) 2008-04-10
DE102006046194A1 (de) 2008-04-03

Similar Documents

Publication Publication Date Title
IL183311A0 (en) Heat sink with microchannel cooling for power devices
TW200951392A (en) Plasma-driven cooling heat sink
EP2337069A3 (de) Halbleitervorrichtung
TW200626059A (en) Systems to cool multiple electrical components
WO2008057493A3 (en) Photovoltaic connection system
WO2009074788A3 (en) Apparatus for hot and cold processing
NO20084351L (no) Baererlegeme for komponenter og kretser
TW200610016A (en) Semiconductor device
EP2192827A3 (de) Verfahren und Vorrichtung zur Kühlung von Elektronik
EP2348798A3 (de) Stromrichter
WO2010010520A3 (en) Integrated seebeck device
EP2109886A1 (de) Halbleiterbauelement
DE502007004414D1 (de) Steuergerät, insbesondere in der art eines elektrischen schalters für elektrohandwerkzeuge
TW200723484A (en) Laser fuse with efficient heat dissipation
WO2010037474A3 (en) A semiconductor device comprising an in-chip active heat transfer system
EP1988761A3 (de) Mit Phasenwechsel gekühlte elektrische Verbindungen für elektroniche Leistungsvorrichtungen
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
WO2008040596A3 (de) Kühlkörper zur kühlung eines elektrischen bauelementes
TW200709456A (en) Semiconductor chip package and application device thereof
ATE538345T1 (de) Elektrische schaltungsanordnung
WO2003085500A3 (de) Wärmeabfuhr bei geräten mit interner energieversorgung
WO2012038359A3 (de) Fahrzeug mit elektrischem energiespeicher und vorrichtung sowie verfahren zu dessen kühlung
WO2005112112A3 (en) Captive socket actuator
TW200516746A (en) Direct contact semiconductor cooling
BRPI0604775A (pt) dispositivo de circuito, especialmente para conversor de freqüência

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07802870

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07802870

Country of ref document: EP

Kind code of ref document: A2