WO2008032749A1

WO2008032749A1 - Resin composition and radiating spacer formed from the same

Info

Publication number: WO2008032749A1
Application number: PCT/JP2007/067761
Authority: WO
Inventors: Jyunji Sugino; Hiroaki Sawa; Mitsuru Shiiba; Keiji Takano
Original assignee: Denki Kagaku Kogyo Kabushiki Kaisha
Priority date: 2006-09-13
Filing date: 2007-09-12
Publication date: 2008-03-20
Also published as: TW200831579A

Abstract

A resin composition for use as a thermally conductive member, radiating spacer, etc. which are inexpensive and have satisfactory thermal conductivity and excellent flame retardancy; and a thermally conductive member and a radiating spacer each formed from the resin composition. The resin composition contains a thermally conductive filler in an amount of 45-60 vol.% based on the whole resin composition, the thermally conductive filler comprising an aluminum hydroxide power having a particle size distribution in which the frequency maximum is preferably at 5-70 µm. The filler more desirably contains silicon dioxide. The radiating spacer is obtained by preparing a slurry from a resin composition comprising a thermally conductive filler comprising aluminum hydroxide and a silicone resin, applying the slurry to a resin film to form a coating film, and then heating and curing it to form a sheet. The spacer has a thickness of preferably 0.3-5.0 mm and a thermal conductivity of preferably 0.8 W/m•K or higher.

Description

Specification

Resin composition and heat dissipation spacer using the same

Technical field

[0001] The present invention relates to a resin composition used as a heat dissipation spacer and the like, and a heat conduction member using the same and a heat dissipation spacer.

Background art

[0002] With recent high integration of electronic circuits and higher frequency of electric signals transmitted through the circuit, the heat generation amount of CPU and semiconductor memory for circuit control has increased, and heat dissipation spacers as heat dissipation members Demand is increasing. A heat-dissipating sheet used in an electronic circuit is required to have flame retardancy, and a flame-retardant resin such as silicone rubber filled with a heat conductive filler is disclosed (for example, Patent Document 1).

[0003] In order to reduce the manufacturing cost of home appliances, etc., there is a need for constituent members that are inexpensive and that meet the required level in terms of heat dissipation performance. The resin composition and heat dissipation space of the present invention are required. The first is no exception.

[0004] A method of manufacturing a heat dissipating spacer has already been disclosed (for example, Patent Document 2) in which a slurry in which an addition polymerization type liquid silicone rubber is filled with a filler is heated and cured. In addition, the present inventors have proposed a method of obtaining a heat dissipating spacer that recommends the use of silicone gel and spherical filler, with the aim of improving the filler fillability and improving the thermal conductivity of the heat dissipating sheet. (Patent Document 3). However, spherical fillers are expensive because the manufacturing process is complicated, and this is the main cause of the high cost of heat dissipating spacers.

[0005] As a solution to this problem, it has been proposed to use a filler having a low sphericity (Patent Document 4). The proposal is intended for thin sheets of about 100 m thickness and recommends limiting the maximum particle size. However, the product thickness of the heat dissipating spacer targeted by the present invention is assumed to be in the range of 0.3 to 5. Omm, and there is no necessity of eliminating top particles by classification or the like.

In addition, it has been proposed that aluminum hydroxide is used as a heat conductive filler because it is widely distributed in the market as an inexpensive filler (Patent Document 5 and Patent Document 6). In the proposal Has improved the flame retardancy of the obtained sheet by using aluminum hydroxide. However, in any of the proposals, inorganic fillers such as an aluminum oxide, boron nitride, and aluminum nitride, which are not used with aluminum hydroxide alone, are used as the second component.

[0006] Furthermore, aluminum hydroxide has a property of dehydrating and decomposing rapidly at 200 to 300 ° C. to cause a large endothermic reaction, thereby cooling the burning object and exhibiting flame retardancy. In addition, the gas released during the dehydration decomposition is water vapor, and the release of the water vapor reduces the mass of aluminum hydroxide after the dehydration decomposition compared to before the start of the reaction. As described above, the dehydration decomposition reaction of aluminum hydroxide takes place rapidly at 200 to 300 ° C. The dehydration decomposition reaction of aluminum hydroxide begins gradually even at temperatures below 1S (eg, around 150 ° C). .

If this state continues for a long period of time, the dehydration decomposition reaction of aluminum hydroxide further proceeds, and water vapor continues to be released, so that the mass reduction of aluminum hydroxide also proceeds. In addition, the mass reduction rate associated with the dehydration / decomposition reaction is more remarkable as the particle size of aluminum hydroxide is larger / larger.

[0007] On the other hand, the heat generation temperature from a semiconductor element, which is one of the usage targets of a thermally conductive molded body, is 10

It is assumed that the temperature is 0 to 120 ° C, and the calorific value is increasing year by year. The heat dissipating spacers used for these are required to have long-term reliability under conditions above the assumed temperature. Specifically, heat dissipation characteristics after being left for a long time in an atmosphere of 150 ° C, flame retardancy, flexibility, and other characteristics are required, and the mass reduction rate of the heat dissipation spacer itself is the same.

Patent Document 1: Japanese Patent No. 2704732

Patent Document 2: Japanese Patent Application Laid-Open No. 57-137356

Patent Document 3: Japanese Patent Publication No. 2000-95896

Patent Document 4: Japanese Patent Laid-Open No. 2005-306718

Patent Document 5: Japanese Patent Laid-Open No. 2002-138205

Patent Document 6: Japanese Patent Laid-Open No. 5-140456

Disclosure of the invention

Problems to be solved by the invention [0008] The present invention has been made in view of the above, and is a thermally conductive filler containing an aluminum hydroxide powder, preferably silicon dioxide, which is circulated at low cost on the market, and a silicone resin. And a heat conductive spacer that is excellent in flame retardancy and has a reduced mass reduction rate after being left at high temperature for a long period of time by using the resin composition. The purpose is to provide.

Means for solving the problem

That is, the present invention has the following gist.

(1) In a resin composition comprising a thermally conductive filler containing aluminum hydroxide having a frequency maximum in the particle size distribution of 5 to 70,1 m, and a silicone resin, it contains a thermally conductive filler. A resin composition characterized in that the amount is 45 to 60% by volume of the entire resin composition.

(2) The heat conductive filler includes aluminum hydroxide and silicon dioxide, and the content of the aluminum hydroxide is 30 to 50% by mass with respect to the entire resin composition. Resin composition.

(3) The resin composition according to the above (2), wherein the silicon dioxide is crystalline silicon dioxide.

(4) A heat conducting member using the resin composition according to any one of! / And (1) to (3) above.

(5) A heat dissipation spacer using the resin composition according to any one of (1) to (3) above.

Yes

(6) A sheet having a thickness of 0.3 to 5. Omm using the resin composition according to any one of (1) to (3) above.

(7) The resin composition according to any one of the above (1) to (3) is applied on a resin film, formed into a coating film, and then heat-cured and then a resin composition is formed on one side. Or a sheet on both sides.

(8) The sheet according to (6) or (7), wherein the thermal conductivity is 0.8 W / m′K or more.

(9) A heat conducting member using the sheet according to any one of (6) to (8) above.

(10) A heat dissipation spacer using the sheet according to any one of (6) to (8).

(11) The heat release spacer according to (5) or (10) above, wherein the flame retardancy is flame retardancy standard UL94V-0 level.

(12) The heat conducting member according to (4) or (9) above, any one of (5), (10) and (11) above An electronic circuit component using the heat dissipating spacer according to one item,! / Of the above (6) to (8), or the sheet according to any one of the above items as a heat conducting member.

(13) Household electrical appliances, OA equipment, or automobiles incorporating the electronic circuit component described in (12) above.

The invention's effect

[0010] The heat dissipating spacer of the present invention can be manufactured by a simple method with a low raw material unit price, and improves the flame retardancy of the obtained heat dissipating spacer. The rate of mass decrease after high-temperature storage during the period is small.

BEST MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, the present invention will be described in more detail.

[0012] The resin composition in the present invention contains a heat conductive filler and a silicone resin, and a heat dissipation spacer is produced using the resin composition.

The heat conductive filler of the present invention includes a force containing aluminum hydroxide alone, and aluminum hydroxide and silicon dioxide.

[0013] Aluminum hydroxide as a thermally conductive filler used in the present invention is a powder having a frequency maximum value in the particle size distribution preferably in the range of 5 to 70 m, and the frequency maximum value is preferable. Is present in the range of 10 to 70 111, particularly preferably 30 to 50 111. As long as the aluminum hydroxide has a frequency maximum value in the particle size distribution within the above range, one or more kinds may be mixed and used at an appropriate ratio.

The particle size distribution and frequency maximum value of aluminum hydroxide used were measured using a laser diffraction particle size distribution measuring device “SALD-2200” manufactured by Shimadzu Corporation.

[0014] When the frequency maximum value in the particle size distribution of aluminum hydroxide is less than 5 m, the viscosity of the slurry is significantly increased when mixed with the silicone resin. When applying a slurry with increased viscosity due to these factors to the resin film, the slurry will flow and avoid entrainment of bubbles! /.

[0015] If the frequency maximum value in the particle size distribution of aluminum hydroxide exceeds 70,1 m, the fluidity of aluminum hydroxide in the slurry becomes poor. Therefore, aluminum hydroxide and shi When a coating film is formed with a slurry containing a riconic resin, the surface becomes rusted and the surface smoothness is impaired. In addition, the mass reduction rate associated with dehydration decomposition reaction becomes more prominent and larger as the particle size of aluminum hydroxide increases, so the mass reduction rate after standing at high temperature for a long time cannot be reduced.

[0016] One of the thermally conductive fillers used in the present invention is silicon dioxide that is widely distributed in the market as an inexpensive filler that has insulating properties and relatively good thermal conductivity. The particle size of silicon dioxide is the frequency maximum value in the particle size distribution, preferably in the range of 5 to 50 111, more preferably 6 to 35 111. The purpose of silicon dioxide is to improve the content of the thermal conductive filler, to optimize the slurry viscosity, to optimize the moldability, and to adjust various properties such as the thermal conductivity and hardness after adhesion. The density of the silicon dioxide 2. a 2 (g / cm ^3), aluminum oxide Niumu (density; 3. 9g / cm ³⁾ or zinc oxide (density; 5. 6g / cm ³⁾ as compared to the molded The mass of the heat dissipation spacer obtained later can be reduced. Furthermore, although silicon dioxide includes crystalline silicon dioxide and amorphous silicon dioxide, crystalline silicon dioxide is preferred from the viewpoint of thermal conductivity, economy and the like of the thermal conductive filler itself.

[0017] The addition amount of the heat conductive filler in the resin composition in the present invention is 45 to 60% by volume, more preferably 50 to 55% by volume. If the amount of addition is less than 5% by volume, the improvement of the thermal conductivity and flame retardance of the obtained heat-dissipating spacer is small. If it exceeds 60% by volume, the moldability becomes worse.

[0018] When the heat conductive filler contains silicon dioxide, the content of the aluminum hydroxide of the present invention is 30 to 50% by mass, more preferably 35 to 45% by mass, based on the entire resin composition. It is. If the content is less than 30% by mass, the improvement in flame retardancy of the obtained heat-dissipating spacer tends to be small, and if it exceeds 50% by mass, the mass reduction rate after standing at high temperature for a long time It is difficult to reduce.

The content of silicon dioxide is preferably 25 to 70% by volume, particularly preferably 35 to 60% by volume, based on the thermally conductive filler. When the content of silicon dioxide is less than 25% by volume, the thermal conductivity is low. On the other hand, when the content is more than 70% by volume, the flame retardancy deteriorates.

[0019] The aluminum hydroxide of the present invention is obtained by performing a surface treatment with a silane coupling agent or the like. Thus, it is possible to further improve the thermal conductivity by reducing the water absorption rate of the powder, increasing the strength of the resin composition, and further reducing the interface resistance between the resin and the powder.

[0020] The silicone resin in the present invention is preferably at least one of an addition reaction type silicone gel or a condensation reaction type silicone gel. Furthermore, it is preferable that the silicone gel is at least one of an addition reaction type liquid silicone gel and a condensation reaction type liquid silicone gel in which the liquid is a liquid. If necessary, a portion of the silicone gel component may be replaced with silicone rubber. The silicone rubber is preferably at least one of addition reaction type silicone rubber or peroxide vulcanization type silicone rubber.

In any of these silicone gels or silicone rubbers, the average composition formula is Rl SiO (wherein R1 is the same or different unsubstituted or substituted monovalent hydrocarbon group and n (4-n) / 2

And n is a positive number between 1 · 98 and 2 · 02. The base polymer is preferably an organopolysiloxane represented by

[0021] Specific examples of the addition reaction type liquid silicone include, for example, a one-part silicone having both a bull group and a Si-Si group in one molecule, or an organopolysiloxane having a bull group at the terminal or side chain. And two-part silicone. Examples of commercially available products of such addition reaction type liquid silicone include those manufactured by GE Toshiba Silicone Co., Ltd. under the trade name “YE5822”, etc. There are product names such as “XE14-B8530” and “TSE-3062”.

[0022] In addition, there is a method of adding platinum or a platinum compound as a means for improving the flame retardancy of the silicone resin. Usually, platinum or a platinum compound is used as a catalyst for the addition reaction of silicone. Therefore, commercially available addition reaction type liquid silicone is often already added with less than 1% platinum compound. Platinum compounds used are, for example, platinum black, chloroplatinic acid, chloroplatinic acid alcohol modified products, complexes of chloroplatinic acid and olefin, complexes of chloroplatinic acid and aldehyde, chloroplatinic acid and bursiloxane or acetylene. Examples thereof include a complex with alcohol, a complex of chloroplatinic acid and isopropyl alcohol, and the like. However, the amount of addition is very small, and adding a large amount only adds cost and flame retardancy is low. Not much improvement. In the present invention, since aluminum hydroxide powder having a function as a flame retardant is used as a heat conductive filler, it is not necessary to add platinum or a platinum compound in order to improve the flame retardancy of the entire system. .

[0023] The mixing method of the heat conductive filler and the silicone resin is not particularly limited. Forces that can be mixed by hand in the case of small amounts General mixers such as planetary mixers, hybrid mixers, Henschel mixers, kneaders, ball mills, and mixing rolls may be used.

By the above mixing method, a slurry used as the heat conducting member, the heat radiating spacer, etc. of the present invention is produced.

The resin composition of the present invention can be used as a heat conductive member, a heat dissipation spacer, and the like.

[0024] The heat conducting member and the heat dissipating spacer of the present invention are usually a thin molded body such as a sheet shape, and the processing method thereof is a conventionally known method such as a doctor blade method, a comma coater method, Examples include coating by a lip coater method. In the present invention, the slurry is applied on a resin film, and after forming a coating film, it is cured by heating and formed into a sheet shape. Coating by a doctor blade method or a comma coater method is preferable.

[0025] The thickness of the sheet-shaped heat dissipation spacer in the present invention is 0.3 to 5. Omm, and preferably 0.5 to 3. Omm. When the thickness is less than 3 mm, the smoothness of the sheet surface cannot be maintained because the shape of the filler is greatly affected by the smoothness of the sheet surface. In addition, when the thickness exceeds 5. Omm, when the slurry is applied onto the resin film, the slurry flows on the resin film, making it difficult to control the thickness.

[0026] If the heat conductivity of the heat conducting member and the heat dissipating spacer of the present invention is 0.8 W / m'K or more, the function as the heat conducting member can be satisfied. The thermal conductivity is usually from 0.8 to 2.0 W / m′K, preferably from 1 · 0 to 2 · OW / m′K.

Hereinafter, the present invention will be described in detail by way of examples, but is not construed as being limited thereto.

Example [0027] Each material used is shown below.

1) Silicon dioxide powder (Keiwa Furnace Co., Ltd.)

Silica B fine (crystalline, frequency maximum peak value in the particle size distribution: 8 111, ^{density: 2. 2 (g / cm:} ))

2) Aluminum hydroxide powder (manufactured by Nippon Light Metal Co., Ltd.)

B--303 (Maximum frequency in particle size distribution: 30 m 4 (g / cm)

B--103 (frequency maximum in particle size distribution: 6 111 2 · 4 (g / cm ³ ))

B- ■ 53 (Frequency maximum in particle size distribution: 60 m 2 · 4 (g / cm ³ ))

B--703 (frequency maximum in particle size distribution: 2 111 2 · 4 (g / cm ³ ))

B- ■ 73 (Frequency maximum in particle size distribution: 80 m 2 · 4 (g / cm ³ ))

3) Silicone resin

Silicone gel (GE Toshiba Silicone Co., Ltd.) XE14— B8530 (2-component mixed type, density: 0.9)

In addition, a curing agent (manufactured by Dow Corning, RD-1) and / or a retarder (manufactured by Kanto Chemical Co., dimethyl maleate) was added as necessary to adjust the curing time.

[0028] Table 1 shows the blending ratios of aluminum hydroxide and silicone resin used in Examples and Table 2 in Comparative Examples. As the silicone resin, silicone gel (GE Toshiba Silicone, XE14-B8530, two-component mixed type) was used. Further, as necessary, a small amount (0.01 mass%) of a curing agent (Toray Industries, Inc., RD-1) and / or a retarder (manufactured by Kanto Chemical Co., Ltd., dimethyl maleate) was added. Mix each of the blending amounts shown in Table 1 and Table 2 using a hybrid mixer (Keyence Corporation, HM-500) to make a slurry.

; ^^

[0029] The produced slurry was put in a vacuum dryer and the pressure was reduced for 1 hour to degas the melt dissolved in the slurry.

[0030] A coating film having a predetermined thickness was prepared on a PET substrate having a thickness of 100 πι by using the doctor blade method for each of the slurries of Examples and Comparative Examples degassed by the above-described method. Was heated and cured at 120 ° C. for 2 hours to obtain a sheet-like molded body having a thickness of 1. Omm. Further, a sheet-like molded article having a thickness of 0.3 mm was obtained for evaluation of flame retardancy described later. Each evaluation result of the obtained sheet These are shown in Tables 1 and 2.

[0031] Evaluation items and evaluation methods of the obtained sheet are described below.

Sheet formability: The sheet formability using the slurry mixed at the blending ratios shown in Table 1, Table 2, Table 11 and Table 12 was evaluated in three stages according to the following criteria.

○: The slurry viscosity is moderate, and there is no problem in the formability of the sheet.

Δ: There is a slight problem in the formability of the sheet having a slightly higher slurry viscosity.

X: There is a problem in the formability of the sheet having a high slurry viscosity.

[0032] Thermal conductivity measurement: The obtained heat dissipating spacer was sandwiched between a TO-3 type copper heater case and a copper plate, and after compressing 10% of the spacer thickness, the copper heater case was supplied with electric power of 5W. Hold for 4 minutes, measure the temperature difference between the copper heater case and the copper plate,

Thermal conductivity (W / m.K) =

The thermal conductivity was calculated by {Power (W) X Thickness (m)} / {Temperature Difference (K) X Measurement Area (m ² )}.

[0033] Surface condition: The surface condition of the obtained heat dissipating spacer was evaluated in three stages according to the following criteria.

◯: The surface of the sheet is smooth and there is no roughness.

Δ: The sheet has local roughness, but there is no practical problem.

X: The surface of the sheet is very rough and has problems in use.

[0034] Flame retardancy evaluation: The flame retardancy of the obtained heat dissipating spacer was evaluated by the flame test method of flame retardancy standard UL94V.

Mass reduction ratio: After measuring the mass (A) of the obtained sheet, it was left in an oven maintained at 150 ° C. for 1000 hours. The sample was taken out after a predetermined time and the mass (B) was measured again.

Mass reduction rate (%) = {mass (A) —mass (B)} / mass (A) X 100,

The mass reduction rate was calculated at The mass reduction rate is desirably 1.5% or less.

[0035] As shown in Table 1, Examples;! To 4 can be formed into a sheet, the sheet surface is good, and the product is good. In addition, the thermal conductivity is 0.8 W / m'K or more, and the flame retardancy is also the flame retardance standard UL94V-0 level.

[0036] In Comparative Example 1, the frequency maximum value of aluminum hydroxide was less than 5 m. Therefore, there is a problem in sheet formability with high slurry viscosity. In addition, bubbles are unavoidably mixed, and the obtained sheet has traces of bubbles and the surface is extremely rough.

[0037] In Comparative Example 2, since the frequency maximum value of aluminum hydroxide exceeds 70 m, the slurry viscosity is low and the formability of the sheet is improved compared to Comparative Example 1. However, the obtained sheet had a problem that the surface was crusted and the roughness was severe.

[0038] In Comparative Example 3, the amount of aluminum hydroxide added to the silicone resin is 0 vol%. Although the slurry viscosity is low and the formability of the sheet is good, the heat dissipation spacer obtained has a thermal conductivity of 0.8 W / m'K or less, and the flame resistance is also at the level of UL94V-1 level. is there

[0039] In Comparative Example 4, the amount of aluminum hydroxide added to the silicone resin is 65 vol%. There is a problem in sheet formability with high slurry viscosity. Further, the obtained sheet has a rough surface and has a problem in use.

[0040] As described above, the formability of the sheet is improved by optimizing the frequency maximum value of aluminum hydroxide and the amount added to the silicone resin, and the heat dissipation spacer obtained is The surface condition was smooth, the thermal conductivity was 0.8 W / m'K or more, and the flame retardancy was UL94V-0 level.

[0041] [Table 1]

丽 Table

Next, an example in which silicon dioxide is used in combination in a thermally conductive filler is shown.

Tables 11 and 12 show the blending ratios of silicon dioxide, aluminum hydroxide, and silicone resin used in Examples and Comparative Examples.

Each material was mixed using a hybrid mixer (manufactured by Keyence Corporation, HM-500) at a blending ratio described in Table 11 and Table 12 to prepare a slurry.

The prepared slurry is put in a vacuum dryer and decompressed for 1 hour, and is dissolved in the slurry. Air was degassed.

[0044] Each slurry of Examples and Comparative Examples degassed by the above method was applied to a PET substrate having a thickness of 100 πι by a doctor blade method to a predetermined thickness. After coating, a coating film was formed, and then heat-cured at 120 ° C. for 2 hours to obtain a sheet-like molded body having a thickness of 1. Omm. In addition, a sheet-like molded article having a thickness of 0.3 mm was obtained for evaluation of flame retardance described later. The obtained sheet was evaluated for each item described above. The results are shown in Tables 11 and 12.

[0045] Examples as described in Table 11; ;! To 16 can be formed into a sheet, the sheet surface is good, and the product is good. In addition, the thermal conductivity is 0.8 W / m'K or more, the flame retardancy is also the flame retardancy standard UL94V-0 level, and the mass reduction rate after being left for 1000 hours in an atmosphere of 150 ° C is 1. 5% or less.

[0046] In Comparative Example 11, the content of the thermally conductive filler (total of silicon dioxide and aluminum hydroxide) is 40% by volume of the entire resin composition, and the content of aluminum hydroxide is the entire resin composition. Of 50% by mass. Although the slurry viscosity is low and the formability of the sheet is good, the thermal conductivity of the obtained sheet is 0.8 W / m.K or less.

[0047] In Comparative Example 12, the content of the heat conductive filler (total of silicon dioxide and aluminum hydroxide) is 40% by volume of the entire resin composition, and the content of aluminum hydroxide is the resin composition. 30% by mass of the total. Although the slurry viscosity is low and the formability of the sheet is good, the thermal conductivity of the obtained sheet is 0.8 W / m'K or less, and the flame retardancy is also at the level of UL94V-1 flame retardancy.

[0048] In Comparative Example 13, the content of the heat conductive filler (total of silicon dioxide and aluminum hydroxide) was 65% by volume of the entire resin composition, and the content of aluminum hydroxide was the resin composition. It is 50% by mass of the whole. Thermal conductivity and flame retardancy are good, but slurry viscosity is high. There is a problem with sheet formability. The obtained sheet had problems force ^s on the use severely roughened surface.

[0049] In Comparative Example 14, the content of the heat conductive filler (total of silicon dioxide and aluminum hydroxide) was 65% by volume of the entire resin composition, and the content of aluminum hydroxide was the resin composition. 30% by mass of the total. Thermal conductivity and flame retardancy are good, but slurry viscosity is high. There is a problem with sheet formability. Also, the obtained sheet has a rough surface and is a problem in use. A force ^S.

[0050] Comparative Example 15 has a problem in the sheet formability where the slurry viscosity is high because the aluminum hydroxide filler having a frequency maximum in the particle size distribution of less than 5 m is used.

Moreover, the obtained sheet has a problem in use that the surface roughness is severe.

[0051] Comparative Example 16, the frequency maxima in the particle size distribution is 70 power using in greater hydroxide Arumiyuu Mufuira one S, problems force on the obtained sheet is rough on the surface Hidogu use ^s .

[0052] [Table 3]

[] D0053 Table

Item Unit Example 1 1 Example 1 2 Example 1 3 Silicone gel XE14-B8530 [volume%] 55 55 40

For silicon dioxide [vol.%] 12 25 23 B-303 [vol.%] 33 20 37 Aluminum hydroxide: um

[Mass%] 50 30 50 material B-103 [volume%]---Aluminum hydroxide: 厶

[% By mass]---Material B-53 [% by volume]---Aluminum hydroxide: UM

[Mass%]---Sheet Thickness after sheet forming [mm] 1 1 1 Sheet formability Slurry formability [-] 〇〇〇 Thermal conductivity T0-3 type Measurement method [W / m-k] 0.92 0.91 1.38 Surface state Surface state observation [] ○ ○ ○ Value Flame retardant UL94 V standard [1] V-0 V-0 V-0 Mass reduction rate 150. C, 1000 hours [%] 1.2 0.8 1.3

By using a thermal conductive filler of aluminum hydroxide and silicon dioxide in combination and optimizing the blending amount of the thermal conductive filler and silicone resin, the thermal conductivity is 0.8 W / m'K or more, flame retardant A resin composition having the flame retardancy standard UL94V-0 level was obtained. The heat dissipating spacer of the embodiment of the present invention can be used for an electronic circuit component as a heat conducting member, and the electronic circuit component can contribute to high performance by being incorporated in an electric appliance for home appliances, an OA device, or an automobile.

Industrial applicability

The resin composition of the present invention is excellent in flame retardancy by using a powder of aluminum hydroxide, which is circulated at a low price in a factory, as a heat conductive filler and in combination with silicon dioxide, and has a long-term high temperature. Provided is a heat dissipating spacer having a reduced mass reduction rate after being left. This heat release spacer can be used as an electronic circuit component as a heat conduction member, and the electronic circuit component can be incorporated into an electric appliance for home appliances, an OA device, or an automobile. The specifications, claims, and abstract of Japanese Patent Application 2006-247494 filed on September 13, 2006 and Japanese Patent Application 2006- 288072 filed on October 23, 2006 Is hereby incorporated by reference as a disclosure of the specification of the present invention.

Claims

The scope of the claims

In a resin composition comprising a heat conductive filler containing aluminum hydroxide having a frequency maximum in the particle size distribution of 5 to 70,1 m and a silicone resin, the content of the heat conductive filler is 45 to 60% by volume of the entire resin composition.

2. The resin composition according to claim 1, wherein the thermally conductive filler includes aluminum hydroxide and silicon dioxide, and the content of the aluminum hydroxide is 30 to 50% by mass of the entire resin composition.

The resin composition according to claim 2, wherein the silicon dioxide is crystalline silicon dioxide. The heat conductive member using the resin composition as described in any one of Claims 1 thru | or 3.

A heat dissipating spacer using the resin composition according to any one of claims 1 to 3. A sheet using the resin composition according to any one of claims 1 to 3 and having a thickness of 0.3 to 5.0 mm.

The sheet | seat which has the resin composition formed by apply | coating the resin composition as described in any one of Claim 1 thru | or 3 on a resin film, making it a coating film, and heat-hardening it on one side or both sides.

The sheet according to claim 6 or 7, having a thermal conductivity of 0.8 W / m'K or more.

A heat conductive member using the sheet according to claim 6.

A heat dissipating spacer using the sheet according to claim 6.

The heat dissipation spacer according to claim 5 or 10, wherein the flame retardancy is a flame retardancy standard UL94V-0 level.

The heat conducting member according to claim 4 or 9, the heat dissipation spacer according to any one of claims 5, 10 and 11, and the sheet according to any one of claims 6 to 8. Electronic circuit parts used as heat conduction materials.

An electrical appliance for home use, an OA device, or an automobile incorporating the electronic circuit component according to claim 12.