WO2008026865A1 - Apparatus and method for depositing organic thin film - Google Patents

Apparatus and method for depositing organic thin film Download PDF

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Publication number
WO2008026865A1
WO2008026865A1 PCT/KR2007/004133 KR2007004133W WO2008026865A1 WO 2008026865 A1 WO2008026865 A1 WO 2008026865A1 KR 2007004133 W KR2007004133 W KR 2007004133W WO 2008026865 A1 WO2008026865 A1 WO 2008026865A1
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WO
WIPO (PCT)
Prior art keywords
raw
organic material
dopant material
spraying unit
supplying
Prior art date
Application number
PCT/KR2007/004133
Other languages
French (fr)
Inventor
Dong Kwon Choi
Original Assignee
Jusung Engineering Co., Ltd.
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Filing date
Publication date
Application filed by Jusung Engineering Co., Ltd. filed Critical Jusung Engineering Co., Ltd.
Publication of WO2008026865A1 publication Critical patent/WO2008026865A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10Glass or silica
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material

Definitions

  • the present disclosure relates to an apparatus and method for depositing an organic thin film, and more particularly, to an apparatus and a method for depositing an organic thin film that supply a host material and dopants from outside of a chamber to improve not only thin film uniformity but also doping uniformity.
  • an organic thin film has been deposited by evaporating raw organic material using an evaporating source provided inside a chamber. That is, the organic thin film has been deposited by disposing the raw organic material inside a crucible and heating the crucible to evaporate the raw material.
  • FIG. 1 is a schematic view of a conventional apparatus for depositing an organic thin film.
  • the apparatus includes a reaction chamber 10, a substrate 20 disposed in the upper portion of the reaction chamber 10, and a first crucible 30 and a second crucible 40 disposed below the substrate 20 to contain a raw organic material and a raw dopant material, respectively.
  • the first and second crucibles 30 and 40 are heated to evaporate the raw organic material and the raw dopant material, so that a doped organic thin film is formed on the substrate 20 provided above the first and second crucibles 30 and 40.
  • a deposited amount of the raw organic material and a deposited amount of the raw dopant material are controlled using a quartz crystal mi- crobalance (QCM).
  • QCM quartz crystal mi- crobalance
  • vapor flow of the raw organic material and the raw dopant material evaporated from the first and second crucibles 30 and 40 are measured using quartz crystal sensors provided above the first and second crucibles 30 and 40, respectively.
  • a doping ratio of the doped organic thin film has been controlled by controlling the vapor flow according to the measurement results.
  • the raw organic material and the raw dopant material are measured using different quartz crystal sensors, respectively, but the quartz crystal sensors are not completely spatially separated. Accordingly, the quartz crystal sensor measuring the vapor flow of the raw organic material and the other quartz crystal sensor measuring the vapor flow of the raw dopant material are interfered with each other by vapor flows of the raw dopant material and raw organic material. However, it is not easy to arrange the quarts crystal sensors inside the chamber to suppress such interference during a deposition process. Disclosure of Invention Technical Problem
  • the present disclosure provides an apparatus and a method for depositing an organic thin film that can improve reproducibility of an doped organic thin film and can improve uniformity of a thin film thickness and doping uniformity by mixing raw organic material powder and raw dopant material powder at a predetermined ratio outside a chamber, and supplying the mixture into the chamber to control a dopant amount within an organic thin film formed on a substrate to a constant level.
  • an apparatus for depositing an organic thin film includes: a chamber; a substrate seating unit disposed inside the chamber; a spraying unit configured to evaporate and spray a raw organic material and a raw dopant material; heaters configured to heat the spraying unit; and a deposition source supplying module configured to supply the raw organic material and the raw dopant material to the spraying unit.
  • the spraying unit may include: a body having an inner space; and a plurality of nozzles provided to the body, and the inner space of the body being heated by the heaters.
  • the heater may be provided at least inside a portion of the body where the nozzles are formed.
  • the apparatus may further include: a rotational shaft connected to the spraying unit; a housing configured to fix the rotational shaft; and a rotating member configured to rotate the rotational shaft, and the housing may be connected to the deposition source supplying module to receive the raw organic material and the raw dopant material, and the rotational shaft may supply the raw organic material and the raw dopant material to the spraying unit via a transfer path provided inside the rotational shaft.
  • the deposition source supplying module may include: a carrier gas supplying part configured to supply a carrier gas; a raw organic material supplying part configured to supply the raw organic material; a raw dopant material supplying part configured to supply the raw dopant material; and a transfer part configured to supply the raw organic material and the raw dopant material to the spraying unit using the carrier gas.
  • the raw organic material supplying part may include: a storage configured to store the raw organic material of powder form; and a raw organic material controller configured to control a supplying amount of the raw organic material.
  • the raw dopant material supplying part may include: a storage configured to store the raw dopant material of powder form; and a raw dopant material controller configured to control a supplying amount of the raw dopant material.
  • the raw dopant material supplying part may further include a storing space connected to the transfer part and configured to store a portion of the raw dopant material of powder form discharged from a storage.
  • the deposition source supplying module may mix the raw organic material of powder form with the raw dopant material of powder form to supply the mixture.
  • Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%.
  • the substrate seating unit may rotate.
  • a method for depositing an organic thin film includes: loading a substrate into a chamber; heating and rotating a spraying unit located inside the chamber; and supplying a raw organic material and a raw dopant material to the spraying unit, and evaporating and spraying the raw organic material and the raw dopant material supplied to the spraying unit.
  • Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%.
  • the raw organic material and the raw dopant material of powder form may be supplied to the spraying unit using a carrier gas.
  • the method may further include mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
  • a method for depositing an organic thin film includes: loading a substrate onto a substrate seating unit located inside a chamber; rotating the substrate seating unit; heating a spraying unit located inside the chamber; and supplying a raw organic material and a raw dopant material to the spraying unit, and evaporating and spraying the raw organic material and the raw dopant material to the spraying unit.
  • Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%.
  • the raw organic material and the raw dopant material of powder form may be supplied to the spraying unit using a carrier gas.
  • the method may further include mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
  • an organic thin film having targeted doping concentration can be manufactured by controlling amounts of a raw organic material and a raw dopant material of powder form supplied into a chamber.
  • the doping ratio of a doped organic thin film can be controlled accurately and quantitatively by controlling supplying amounts of a raw organic material and a raw dopant material.
  • doping of dopants can be optimized by simultaneously evaporating a raw organic material and a raw dopant material supplied from the outside in the inside of a spraying unit.
  • the amounts of the raw organic material and the raw dopant material supplied into a chamber are maintained constant while a plurality of processes is performed, so that reproducibility of the organic thin film containing dopants can be improved.
  • FIG. 1 is a schematic view of a conventional apparatus for depositing an organic thin film
  • FIG. 2 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a first embodiment
  • FIG. 3 is a schematic view of a deposition source supplying module in accordance with the first exemplary embodiment
  • FIG. 4 is a schematic view of a deposition source supplying module in accordance with an exemplary modification of the first embodiment
  • FIG. 5 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a second exemplary embodiment
  • FIG. 6 is a schematic view of a deposition source supplying module in accordance with the second exemplary embodiment.
  • FIG. 7 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a third exemplary embodiment. Best Mode for Carrying Out the Invention
  • FIG. 2 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a first exemplary embodiment
  • FIG. 3 is a schematic view of a deposition source supplying module in accordance with the first exemplary embodiment
  • FIG. 4 is a schematic view of a deposition source supplying module in accordance with a modification of the first exemplary embodiment.
  • the apparatus in accordance with an exemplary embodiment includes: a deposition source supplying module 201: 210, 220, 230, and 240 to supply a deposition material containing dopants; a chamber 100 having a spraying unit 120 to evaporate and spray the deposition material containing dopants; and a driving module 130, 140, 150 and 160 to supply the deposition material containing dopants from the deposition source supplying module 201 to the spraying unit 120, and to rotate the spraying unit 120.
  • a deposition source supplying module 201 210, 220, 230, and 240 to supply a deposition material containing dopants
  • a chamber 100 having a spraying unit 120 to evaporate and spray the deposition material containing dopants
  • a driving module 130, 140, 150 and 160 to supply the deposition material containing dopants from the deposition source supplying module 201 to the spraying unit 120, and to rotate the spraying unit 120.
  • the chamber 100 includes a substrate seating unit 110 disposed in a lower portion of the inside of the chamber 100, and a spraying unit 120 disposed above the substrate seating unit 110. Also, the chamber 100 further includes an entry unit (not shown) for entry of a substrate 113, and a separate exhaust unit 101 to exhaust a gas in the chamber 120.
  • the substrate seating unit 110 includes a seating part 111 on which the substrate
  • the substrate seating unit 110 may further include a plurality of lift pins (not shown) to assist loading and unloading of the substrate 113.
  • the substrate 113 in accordance with the exemplary embodiment may be a tetragonal plate shaped light transmissive substrate. Accordingly, the seating part 111 may also have a tetragonal shape corresponding to the substrate 113.
  • the spraying unit 120 includes a body 121 having a predetermined inner space 122, a plurality of nozzles 123 provided in the body 121, and heaters 124 heating the inner space 122.
  • the spraying unit 120 receives a deposition material containing dopants of powder form, and heats and evaporates the deposition material using the heaters 124 to spray the same onto the substrate 113 on the substrate seating unit 110.
  • the spraying unit 120 in accordance with the exemplary embodiment includes the heaters 124 to evaporate the deposition material containing dopants of powder form right before the deposition material is sprayed onto the substrate 113.
  • the heater 124 includes a heat emitting member disposed inside the body 121, and an energy supplier for supplying energy to the heat emitting member. At this point, a coil can be used as the heat emitting member, and a power source can be used as the energy supplier for supplying electrical energy.
  • the heater 124 is not limited thereto, but a variety of heaters for manufacturing a thin film can be used as the heater 124.
  • the heat emitting member may be uniformly distributed over the entire region of the body 121 of the spraying unit 120, or concentrated on regions of the nozzles 123. By doing so, the deposition material containing dopants of powder form can be evaporated right before it is sprayed onto the substrate 113 as described above.
  • the body 121 is connected to the rotational shaft 130 of the driving module
  • the deposition material evaporated and sprayed within the spraying unit 120 is uniformly supplied to the entire substrate 113.
  • an organic thin film containing dopants can be deposited with a uniform thickness over the entire substrate 113. Also, since the deposition material containing dopants is used, doping concentration inside the organic thin film can be maintained uniform.
  • the driving module connected to the spraying unit 120 to rotate the spraying unit 120 includes the rotational shaft 130 connected to the spraying unit 120, a housing 140 fixedly supporting the rotational shaft 130, and the rotating member 150 rotating the rotational shaft 130.
  • An injection hole 141 through which the deposition material containing dopants is injected is provided on one side of the housing 140. Referring to FIG. 2, the housing 140 is fixed on the chamber 100. Also, the rotational shaft 130 is provided in the central region of the housing 140.
  • One end of the rotational shaft 130 is connected to the rotating member 150, and the other end is connected to the spraying unit 120.
  • the rotating member 150 may be a motor.
  • a transfer path 131 transferring the deposition material containing dopants of powder form is provided inside the rotational shaft 130.
  • the transfer path 131 com- municates with the inner space 122 of the spraying unit 120.
  • an end of the transfer path 131 is formed at a region corresponding to the injection hole 141 of the housing 140.
  • the deposition material containing dopants of powder form is injected through the injection hole 141 of the housing 140 to pass through a separation space between the housing 140 and the rotational shaft 130, and then is supplied to the spraying unit 120 through the transfer path 131 inside the rotational shaft 130.
  • the deposition material containing dopants of powder form may fall down into the chamber 100 through the separated space between the housing 140 and the rotational shaft 130. Therefore, to prevent the deposition material from falling down, sealing members 160 such as a bearing and magnetic fluid are disposed in the separation space between the housing 140 and the rotational shaft 130 in accordance with the exemplary embodiment.
  • the sealing members 160 may be disposed at the upper and lower portions of the injection hole of the housing 140 as illustrated in FIG. 2.
  • the sealing member 160 can also fixedly support the rotational shaft 130 inside the housing 140.
  • the deposition material containing dopants of powder form injected through the injection hole 141 of the housing 140 fills the separation space between the housing 140 and the rotational shaft 130.
  • the deposition material containing dopants of powder form is supplied to the inner space 122 of the spraying unit 120 inside the chamber 100 through the transfer path 131 of the rotational shaft 130.
  • the deposition source supplying module 201 supplying the deposition material containing dopants to the injection hole 141 of the housing 140 will be described below.
  • the deposition source supplying module 201 includes a carrier gas supplying part
  • the transfer part 240 mixes the raw organic material with the raw dopant material to prepare the deposition material containing dopants, and provides the deposition material containing dopants to the driving module 130, 140, 150 and 160 using the carrier gas.
  • the carrier gas supplying part 210 may include a storage tank for storing the carrier gas CG and a sprayer for spraying the carrier gas at high pressure. Also, the carrier gas supplying part 210 may further include a controller 211 for controlling a sprayed amount of the carrier gas. The controller 211 may be a valve as illustrated in FIG. 3. The carrier gas may be an inert gas.
  • the transfer part 240 provides the deposition material containing dopants to the driving module 130, 140, 150 and 160 using the carrier gas. [56]
  • the transfer part 240 includes a pipe 242 through which the carrier gas passes. Also, the raw organic material supplying part 220 and the raw dopant material supplying part 230 are connected to the pipe 242.
  • the raw organic material is mixed with the raw dopant material inside the pipe 242 to prepare the deposition material containing dopants.
  • the structure is not limited thereto, but a predetermined mixing region (not shown) may be provided inside the transfer part 240, the raw organic material supplying part 220 and the raw dopant material supplying part 230 being connected to the mixing region. Accordingly, the raw organic material and the raw dopant material are mixed in the separate mixing region to prepare the deposition material containing dopants.
  • the transfer part 240 may further include a control valve 241 for controlling supplying of the deposition material containing dopants supplied through the pipe 242.
  • the raw organic material supplying part 220 includes a raw organic material storage
  • a raw organic material controller 222 for controlling a supplying amount of the raw organic material.
  • the raw dopant material supplying part 230 includes a dopant storage 231 for storing the raw dopant material of powder form and supplying the raw dopant material to the transfer part 240, and a raw dopant material controller 232 for controlling a supplying amount of the raw dopant material.
  • a separate storing space for storing the raw dopant material may be further provided between the dopant storage 231 and the transfer part 240.
  • a small amount of raw dopant materials may be stored in the separate storing space from the dopant storage 231 in advance, and then may be delivered to the transfer part 240 by the carrier gas.
  • the amount of the raw dopant materials to be stored in the separate storing space may be as much as that to be used for doping the organic thin film formed on the substrate 113.
  • the amount of the dopants doped inside the doped organic thin film formed on each substrate 113 may be maintained constant by keeping the amount of raw dopant materials stored in the separate storing space uniform when the doped organic thin films are formed on a plurality of substrates.
  • a valve may be used for the raw organic material controller 222 and the raw dopant material controller 232.
  • the raw organic material controller 222 and the raw dopant material controller 232 are not limited thereto, but a variety of controllers that can control a supplying amount of raw materials of powder form may be used. Examples of the controller include a pump and a dispenser discharging a predetermined amount of the raw organic material or the raw dopant material of powder form.
  • the supplying amounts of the raw organic material and the raw dopant material discharged to the transfer part 240 through the raw organic material controller 222 and the raw dopant material controller 232 can be controlled to various amounts. Through this mechanism, an amount of dopants in the deposition material containing dopants can be easily controlled to a targeted amount.
  • a dopant doping ratio of the organic thin film formed on the substrate 113 is controlled by controlling a mixed amount of the raw organic material and the raw dopant material within the deposition material containing dopants.
  • the supplying amounts of the raw organic material and the raw dopant material supplied to the transfer part 240 may be controlled.
  • the supplying amounts of the raw organic material and the raw dopant material may change variously depending on the doped amount of the organic thin film to be formed on the substrate 113.
  • mole ratio of the raw dopant material to the raw organic material may be controlled to be about 0.3% to 20%.
  • the raw organic material of powder form and a small amount of the raw dopant material of powder form are supplied into the pipe 242 through which the carrier gas flows.
  • the raw organic material and a small amount of the raw dopant material carried by the carrier gas move along the pipe 242.
  • the raw organic material and the raw dopant material of powder form are mixed to prepare the deposition material containing dopants inside the pipe 242.
  • the deposition material containing dopants in the pipe 242 is supplied to the injection hole 141 of the housing 140 by the carrier gas and supplied to the inner space 122 of the spraying unit 120 through the transfer path 131 of the rotational shaft 130.
  • a raw organic material is transferred through a first pipe 243, and a raw dopant material is transferred through a second pipe 244. Also, the raw organic material and the raw dopant material are mixed with each other to form a deposition material containing dopants using a third pipe 245 where the first and second pipes 243 and 244 merges. The deposition material is then supplied to a spraying unit 120 of a chamber 100.
  • An inlet and an outlet of a raw organic material storage 221 communicate with the first pipe 243.
  • a first pressure controller 223 is provided on one side of the raw organic material storage 221.
  • a first valve Vl and a second valve V2 are provided on the outlet and the inlet, respectively.
  • a third valve V3 is provided in a portion of the first pipe 243 that is located between the inlet and the outlet.
  • a first block part 224 preventing backflow of the raw organic material of solid powder form is provided inside the raw organic material storage 221.
  • the second valve V2 controls an amount of a carrier gas CGl flowing into the raw organic material storage 221.
  • the first valve Vl controls discharging of the organic deposition raw material of powder form stored inside the raw organic material storage 221.
  • a dopant storage 231 has the same structure as that of the above-described raw organic material storage 221. That is, an inlet and an outlet of the dopant storage 231 communicate with the second pipe 244. A first valve V4 and a second valve V5 are provided on the outlet and the inlet, respectively. A second pressure controller 233 is provided on one side of the dopant storage 231, and a block part 234 is disposed inside the dopant storage 231.
  • the raw organic material of powder form is supplied to the first pipe 243 depending on the inner state (that is, laminar flow mode or turbulence flow mode) of the raw organic material storage 221.
  • the laminar flow mode is described first.
  • the first and second valves Vl and V2 are opened and the third valve V3 is closed with the pressure of the first pressure controller 223 maintained constant, the raw organic material of powder form stored in the raw organic material storage 221 conveyed by the carrier gas CG2 is supplied to the first pipe 243.
  • an amount of the raw organic material supplied to the first pipe 243 can be controlled by controlling the pressure of the first pressure controller 223 or controlling an amount of the introduced carrier gas CG2.
  • the third valve V3 when the third valve V3 is opened, an amount of the carrier gas flowing into the second valve V2 can be controlled, so that a supplying amount of the raw organic material can be controlled.
  • the turbulence flow mode is described.
  • the second valve V2 When the second valve V2 is opened, the first valve Vl is opened/closed with a predetermined time interval, and the third valve V3 is closed, turbulence is generated inside the raw organic material storage 221 due to a pressure difference between the inner pressure of the first pipe 243 and the inner pressure of the raw organic material storage 221.
  • This turbulence allows the raw organic material of powder form to be supplied to the first pipe 243.
  • a supplying amount of the raw organic material can be controlled by controlling an opening time of the first valve Vl.
  • the supplying amount of the raw organic material can be controlled by controlling a pressure difference between the inner pressure of the first pipe 243 and the inner pressure of the raw organic material storage 221.
  • the amounts of the raw organic material and the dopnat raw material supplied to the first pipe 243 and the second pipe 244, respectively, can be controlled variously using the above-described control method.
  • the substrate 113 is loaded into the chamber 100 and is seated on the substrate seating unit 110.
  • the spraying unit 120 is heated to a predetermined temperature, and rotational force of the rotating member 150 is applied to the spraying unit 120 through the rotational shaft 130. By dosing so, the spraying unit 120 is allowed to rotate inside the chamber 100.
  • the carrier gas CG is supplied into the pipe 242 of the transfer part 240 through the carrier gas supplying part 210.
  • the raw organic material and the raw dopant material are supplied together to the transfer part 240.
  • the amounts of the raw organic material and the raw dopant material supplied into the transfer part 240 are controlled by controlling supplying amounts of the raw organic material supplying part 220 and the raw dopant material supplying part 230.
  • the raw organic material and the raw dopant material are mixed to form the deposition material containing dopants within the transfer part 240.
  • This deposition material is supplied to the injection hole 141 of the housing 140 through the transfer part 240 and provided to the spraying unit 120 rotating within the chamber 100.
  • the deposition raw material containing dopants supplied to the spraying unit 120 is evaporated within the spraying unit 120 and sprayed onto the substrate 113 through the nozzles 123 of the spraying unit 120 to form the organic thin film containing dopants on the substrate 113.
  • the raw organic material and the raw dopant material are supplied at a predetermined ratio, and these materials are evaporated right before they are sprayed onto the substrate 113 to form the organic thin film having excellent layer quality, and an amount of dopants within the organic thin film can be made uniform. Since the amounts of the raw organic material and the raw dopant material supplied into the chamber 110 can be maintained uniform even when the above-descried process is repeated a plurality of times, dopant concentration of the organic thin films can be maintained uniform for the respective substrates 113 through a plurality of processes. Also, the spraying unit 120 rotates to supply the uniform deposition material onto the substrate 113, so that the organic thin film having a uniform thickness can be formed on the entire substrate 113.
  • the raw organic material and the raw dopant material of powder form are not mixed within the carrier gas and the transfer part, but instead, the raw organic material and the raw dopant material of powder form are mixed separately, and then these materials can be supplied to the spraying unit within the chamber using the carrier gas.
  • FIG. 5 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a second exemplary embodiment
  • FIG. 6 is a schematic view of a deposition source supplying module in accordance with the second exemplary embodiment.
  • the apparatus includes a chamber 100 having a predetermined reaction space, a substrate seating unit 110 and a spraying unit 120 disposed inside the reaction space, and a housing 140, a rotational shaft 130, and a rotating member 160 for rotating the spraying unit 120.
  • the apparatus for depositing the organic thin film further includes a dopant-contained deposition material supplying part 200 for supplying dopant-contained deposition material which includes a raw organic material of powder form is mixed with a raw dopant material of powder form to the spraying unit 120, and a carrier gas supplying part 210 supplying a carrier gas CG for transferring the deposition material containing dopants of powder form to the spraying unit 120.
  • the apparatus for depositing the organic thin film further includes a transfer part 240 through which the dopants of powder form and the carrier gas pass.
  • the dopant-dontained deposition material supplying part 200 includes a deposition material storage 201 in which the raw organic material and the raw dopant material of powder form are mixed in advance and stored in the form of the deposition material containing dopants, and a deposition material supplier 202 receiving the deposition material containing dopants from the deposition material storage 201 to supply the deposition material to the spraying unit 120 inside the chamber 100 through the carrier gas CG and the transfer part 240.
  • a predetermined controller for controlling a supplying amount of a deposition material can be provided to the deposition material storage 201.
  • the deposition material supplier 202 may be provided between the deposition material storage 201, the transfer part 240, and the carrier gas supplying part 210.
  • the raw organic material and the raw dopant material of powder form are mixed in advance to prepare the deposition material containing dopants.
  • the deposition material is stored in the deposition material storage 201, and then supplied to the deposition material supplier 202 as much as a necessary amount every process. Since the raw organic material and the raw dopant material of powder form are mixed, the mixing can be performed effectively and a composition ratio of the raw dopant material to the raw organic material can be accurately controlled as well. By doing so, a doping ratio of the doped organic thin film can be quantitatively controlled. Also, at least two precursors can be mixed for manufacturing a polymer thin film. By doing so, a polymer thin film of polyimide or polyamide can be formed.
  • the present disclosure is not limited to the above description.
  • the spraying unit may be fixed and the substrate may rotate to form an organic thin film doped with dopants having a uniform thickness.
  • An apparatus for depositing an organic thin film will be described in accordance with a third exemplary embodiment with reference to the accompanying drawings. In the following descriptions, the descriptions for the same parts as those of the previous embodiment are omitted. Technology of the following description can be applied to the previous embodiment.
  • FIG. 7 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with the third exemplary embodiment.
  • the apparatus includes a chamber 100, a substrate seating unit
  • a spraying unit 120 for evaporating a deposition material containing dopants and supplying the deposition material into the chamber 100
  • a deposition source supplying module 201 210, 220, 230, and 240 for supplying the deposition material to the spraying unit 120.
  • the substrate seating unit 110 includes a seating part 111 and a driving part 114 rotating the seating part 111.
  • the driving part 114 includes a driving shaft connected to the seating part 111 for rotating the seating part 111, and a driver for rotating the driving shaft.
  • the driving part 114 can rotate the seating part 111 on which a substrate 113 is seated, so that the deposition material supplied through the spraying unit 120 can be uniformly distributed on the substrate 113. Therefore, the thickness of a thin film formed on the substrate 113 can be prepared uniform.
  • the spraying unit 120 includes a body 121 having an inner space 122, nozzles 123, and heaters 124.
  • the deposition source supplying module 201 includes a raw organic material supplying part 220 for supplying a raw organic material, and a raw dopant material supplying part 230 for supplying a raw dopant material to an inner space 121 of the spraying unit 120. At this point, the raw organic material and the raw dopant material of powder form are supplied to a predetermined transfer part 240, conveyed by a carrier gas CG within the transfer part 240, and supplied to the spraying unit 120. Also, the deposition source supplying module 201 includes a carrier gas supplying part 210 for supplying a carrier gas CG. In accordance with the exemplary embodiment, the raw material in the deposition source supplying module 201 can be directly supplied to the spraying unit 120. In accordance with the exemplary embodiment, a doped organic thin film having targeted doping concentration can be manufactured by controlling supplying amounts of a raw organic material and a raw dopant material.

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Abstract

Provided are an apparatus and a method for depositing an organic thin film. The apparatus includes: a chamber, a substrate seating unit disposed inside the chamber, a spraying unit for evaporating and spraying a raw organic material and a raw dopant material, and a deposition source supplying module configured for supplying the raw organic material and the raw dopant material to the spraying unit. An organic thin film having targeted doping concentration can be manufactured by controlling amounts of a raw organic material and a raw dopant material of powder form supplied into a chamber. And the amounts of the raw organic material and the raw dopant material supplied into a chamber are maintained constant while a plurality of processes is performed, so that reproducibility of the organic thin film containing dopants can be improved.

Description

Description
APPARATUS AND METHOD FOR DEPOSITING ORGANIC
THIN FILM
Technical Field
[1] The present disclosure relates to an apparatus and method for depositing an organic thin film, and more particularly, to an apparatus and a method for depositing an organic thin film that supply a host material and dopants from outside of a chamber to improve not only thin film uniformity but also doping uniformity. Background Art
[2] Generally, an organic thin film has been deposited by evaporating raw organic material using an evaporating source provided inside a chamber. That is, the organic thin film has been deposited by disposing the raw organic material inside a crucible and heating the crucible to evaporate the raw material.
[3] To form a dopant-doped layer inside the organic thin film, two crucibles containing a raw organic material and an raw dopant material, respectively, are disposed inside a chamber, and the two crucibles are heated to evaporate the raw organic material and the raw dopant material to deposit the organic thin film containing dopants on a substrate.
[4] FIG. 1 is a schematic view of a conventional apparatus for depositing an organic thin film.
[5] Referring to FIG. 1, the apparatus includes a reaction chamber 10, a substrate 20 disposed in the upper portion of the reaction chamber 10, and a first crucible 30 and a second crucible 40 disposed below the substrate 20 to contain a raw organic material and a raw dopant material, respectively.
[6] After the raw organic material and raw dopant material are put to the first and second crucibles 30 and 40, respectively, the first and second crucibles 30 and 40 are heated to evaporate the raw organic material and the raw dopant material, so that a doped organic thin film is formed on the substrate 20 provided above the first and second crucibles 30 and 40.
[7] At this point, amount of the two different material components of the doped organic thin film are controlled. That is, a deposited amount of the raw organic material and a deposited amount of the raw dopant material are controlled using a quartz crystal mi- crobalance (QCM). In detail, vapor flow of the raw organic material and the raw dopant material evaporated from the first and second crucibles 30 and 40 are measured using quartz crystal sensors provided above the first and second crucibles 30 and 40, respectively. Also, a doping ratio of the doped organic thin film has been controlled by controlling the vapor flow according to the measurement results.
[8] However, since the vapor amounts of the raw organic material and the raw dopant material are measured using the quartz crystal sensors and controlled using the measurement results, the doping ratio highly depends on the sensitivity and life of the quartz crystal sensor. Therefore, process reproducibility and mass production may be impeded.
[9] Also, the raw organic material and the raw dopant material are measured using different quartz crystal sensors, respectively, but the quartz crystal sensors are not completely spatially separated. Accordingly, the quartz crystal sensor measuring the vapor flow of the raw organic material and the other quartz crystal sensor measuring the vapor flow of the raw dopant material are interfered with each other by vapor flows of the raw dopant material and raw organic material. However, it is not easy to arrange the quarts crystal sensors inside the chamber to suppress such interference during a deposition process. Disclosure of Invention Technical Problem
[10] The present disclosure provides an apparatus and a method for depositing an organic thin film that can improve reproducibility of an doped organic thin film and can improve uniformity of a thin film thickness and doping uniformity by mixing raw organic material powder and raw dopant material powder at a predetermined ratio outside a chamber, and supplying the mixture into the chamber to control a dopant amount within an organic thin film formed on a substrate to a constant level. Technical Solution
[11] In accordance with an exemplary embodiment, an apparatus for depositing an organic thin film includes: a chamber; a substrate seating unit disposed inside the chamber; a spraying unit configured to evaporate and spray a raw organic material and a raw dopant material; heaters configured to heat the spraying unit; and a deposition source supplying module configured to supply the raw organic material and the raw dopant material to the spraying unit.
[12] The spraying unit may include: a body having an inner space; and a plurality of nozzles provided to the body, and the inner space of the body being heated by the heaters.
[13] The heater may be provided at least inside a portion of the body where the nozzles are formed.
[14] The apparatus may further include: a rotational shaft connected to the spraying unit; a housing configured to fix the rotational shaft; and a rotating member configured to rotate the rotational shaft, and the housing may be connected to the deposition source supplying module to receive the raw organic material and the raw dopant material, and the rotational shaft may supply the raw organic material and the raw dopant material to the spraying unit via a transfer path provided inside the rotational shaft.
[15] The deposition source supplying module may include: a carrier gas supplying part configured to supply a carrier gas; a raw organic material supplying part configured to supply the raw organic material; a raw dopant material supplying part configured to supply the raw dopant material; and a transfer part configured to supply the raw organic material and the raw dopant material to the spraying unit using the carrier gas.
[16] The raw organic material supplying part may include: a storage configured to store the raw organic material of powder form; and a raw organic material controller configured to control a supplying amount of the raw organic material. Of course, the raw dopant material supplying part may include: a storage configured to store the raw dopant material of powder form; and a raw dopant material controller configured to control a supplying amount of the raw dopant material. Also, the raw dopant material supplying part may further include a storing space connected to the transfer part and configured to store a portion of the raw dopant material of powder form discharged from a storage.
[17] The deposition source supplying module may mix the raw organic material of powder form with the raw dopant material of powder form to supply the mixture.
[18] Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%. Of course, the substrate seating unit may rotate.
[19] In accordance with another exemplary embodiment, a method for depositing an organic thin film includes: loading a substrate into a chamber; heating and rotating a spraying unit located inside the chamber; and supplying a raw organic material and a raw dopant material to the spraying unit, and evaporating and spraying the raw organic material and the raw dopant material supplied to the spraying unit.
[20] Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%.
[21] The raw organic material and the raw dopant material of powder form may be supplied to the spraying unit using a carrier gas.
[22] The method may further include mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
[23] In accordance with yet another exemplary embodiment, a method for depositing an organic thin film includes: loading a substrate onto a substrate seating unit located inside a chamber; rotating the substrate seating unit; heating a spraying unit located inside the chamber; and supplying a raw organic material and a raw dopant material to the spraying unit, and evaporating and spraying the raw organic material and the raw dopant material to the spraying unit. [24] Mole ratios of the raw dopant material to the raw organic material may be controlled to be about 0.3% to about 20%. [25] The raw organic material and the raw dopant material of powder form may be supplied to the spraying unit using a carrier gas. [26] The method may further include mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
Advantageous Effects
[27] As described above, an organic thin film having targeted doping concentration can be manufactured by controlling amounts of a raw organic material and a raw dopant material of powder form supplied into a chamber.
[28] Also, in accordance with the present disclosure, the doping ratio of a doped organic thin film can be controlled accurately and quantitatively by controlling supplying amounts of a raw organic material and a raw dopant material.
[29] Also, in accordance with the present disclosure, doping of dopants can be optimized by simultaneously evaporating a raw organic material and a raw dopant material supplied from the outside in the inside of a spraying unit.
[30] Also, in accordance with the present disclosure, the amounts of the raw organic material and the raw dopant material supplied into a chamber are maintained constant while a plurality of processes is performed, so that reproducibility of the organic thin film containing dopants can be improved.
[31] Although the apparatus and method for depositing the organic thin film have been described with reference to the specific embodiments, they are not limited thereto. Therefore, it will be readily understood by those skilled in the art that various modifications and changes can be made thereto without departing from the spirit and scope of the present invention defined by the appended claims. Brief Description of the Drawings
[32] Exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:
[33] FIG. 1 is a schematic view of a conventional apparatus for depositing an organic thin film;
[34] FIG. 2 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a first embodiment;
[35] FIG. 3 is a schematic view of a deposition source supplying module in accordance with the first exemplary embodiment;
[36] FIG. 4 is a schematic view of a deposition source supplying module in accordance with an exemplary modification of the first embodiment;
[37] FIG. 5 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a second exemplary embodiment;
[38] FIG. 6 is a schematic view of a deposition source supplying module in accordance with the second exemplary embodiment; and
[39] FIG. 7 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a third exemplary embodiment. Best Mode for Carrying Out the Invention
[40] The present invention now will be described more fully herein with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.
[41] FIG. 2 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a first exemplary embodiment, FIG. 3 is a schematic view of a deposition source supplying module in accordance with the first exemplary embodiment, and FIG. 4 is a schematic view of a deposition source supplying module in accordance with a modification of the first exemplary embodiment.
[42] Referring to FIGS. 2 through 4, the apparatus in accordance with an exemplary embodiment includes: a deposition source supplying module 201: 210, 220, 230, and 240 to supply a deposition material containing dopants; a chamber 100 having a spraying unit 120 to evaporate and spray the deposition material containing dopants; and a driving module 130, 140, 150 and 160 to supply the deposition material containing dopants from the deposition source supplying module 201 to the spraying unit 120, and to rotate the spraying unit 120.
[43] The chamber 100 includes a substrate seating unit 110 disposed in a lower portion of the inside of the chamber 100, and a spraying unit 120 disposed above the substrate seating unit 110. Also, the chamber 100 further includes an entry unit (not shown) for entry of a substrate 113, and a separate exhaust unit 101 to exhaust a gas in the chamber 120.
[44] Here, the substrate seating unit 110 includes a seating part 111 on which the substrate
113 is seated, and a fixing part 112 to fix the seating part 111 onto a bottom of the chamber 100. Also, the substrate seating unit 110 may further include a plurality of lift pins (not shown) to assist loading and unloading of the substrate 113. The substrate 113 in accordance with the exemplary embodiment may be a tetragonal plate shaped light transmissive substrate. Accordingly, the seating part 111 may also have a tetragonal shape corresponding to the substrate 113.
[45] The spraying unit 120 includes a body 121 having a predetermined inner space 122, a plurality of nozzles 123 provided in the body 121, and heaters 124 heating the inner space 122. The spraying unit 120 receives a deposition material containing dopants of powder form, and heats and evaporates the deposition material using the heaters 124 to spray the same onto the substrate 113 on the substrate seating unit 110.
[46] As described above, the spraying unit 120 in accordance with the exemplary embodiment includes the heaters 124 to evaporate the deposition material containing dopants of powder form right before the deposition material is sprayed onto the substrate 113. The heater 124 includes a heat emitting member disposed inside the body 121, and an energy supplier for supplying energy to the heat emitting member. At this point, a coil can be used as the heat emitting member, and a power source can be used as the energy supplier for supplying electrical energy. Of course, the heater 124 is not limited thereto, but a variety of heaters for manufacturing a thin film can be used as the heater 124. The heat emitting member may be uniformly distributed over the entire region of the body 121 of the spraying unit 120, or concentrated on regions of the nozzles 123. By doing so, the deposition material containing dopants of powder form can be evaporated right before it is sprayed onto the substrate 113 as described above.
[47] Also, the body 121 is connected to the rotational shaft 130 of the driving module
130, 140, 150, and 160 to perform a rotational motion. By this rotational motion of the body 121, the deposition material evaporated and sprayed within the spraying unit 120 is uniformly supplied to the entire substrate 113. Through this process, an organic thin film containing dopants can be deposited with a uniform thickness over the entire substrate 113. Also, since the deposition material containing dopants is used, doping concentration inside the organic thin film can be maintained uniform.
[48] The driving module connected to the spraying unit 120 to rotate the spraying unit 120 includes the rotational shaft 130 connected to the spraying unit 120, a housing 140 fixedly supporting the rotational shaft 130, and the rotating member 150 rotating the rotational shaft 130.
[49] An injection hole 141 through which the deposition material containing dopants is injected is provided on one side of the housing 140. Referring to FIG. 2, the housing 140 is fixed on the chamber 100. Also, the rotational shaft 130 is provided in the central region of the housing 140.
[50] One end of the rotational shaft 130 is connected to the rotating member 150, and the other end is connected to the spraying unit 120. The rotating member 150 may be a motor. A transfer path 131 transferring the deposition material containing dopants of powder form is provided inside the rotational shaft 130. The transfer path 131 com- municates with the inner space 122 of the spraying unit 120. Also, an end of the transfer path 131 is formed at a region corresponding to the injection hole 141 of the housing 140.
[51] As described above, in accordance with the exemplary embodiment, the deposition material containing dopants of powder form is injected through the injection hole 141 of the housing 140 to pass through a separation space between the housing 140 and the rotational shaft 130, and then is supplied to the spraying unit 120 through the transfer path 131 inside the rotational shaft 130. At this point, the deposition material containing dopants of powder form may fall down into the chamber 100 through the separated space between the housing 140 and the rotational shaft 130. Therefore, to prevent the deposition material from falling down, sealing members 160 such as a bearing and magnetic fluid are disposed in the separation space between the housing 140 and the rotational shaft 130 in accordance with the exemplary embodiment. At this point, the sealing members 160 may be disposed at the upper and lower portions of the injection hole of the housing 140 as illustrated in FIG. 2. The sealing member 160 can also fixedly support the rotational shaft 130 inside the housing 140.
[52] In this way, the deposition material containing dopants of powder form injected through the injection hole 141 of the housing 140 fills the separation space between the housing 140 and the rotational shaft 130. The deposition material containing dopants of powder form is supplied to the inner space 122 of the spraying unit 120 inside the chamber 100 through the transfer path 131 of the rotational shaft 130.
[53] The deposition source supplying module 201 supplying the deposition material containing dopants to the injection hole 141 of the housing 140 will be described below.
[54] The deposition source supplying module 201 includes a carrier gas supplying part
210 for supplying a carrier gas CG, a raw organic material supplying part 220 for supplying a raw organic material, a raw dopant material supplying part 230 for supplying a raw dopant material, and the transfer part 240. The transfer part 240 mixes the raw organic material with the raw dopant material to prepare the deposition material containing dopants, and provides the deposition material containing dopants to the driving module 130, 140, 150 and 160 using the carrier gas.
[55] Here, although not shown, the carrier gas supplying part 210 may include a storage tank for storing the carrier gas CG and a sprayer for spraying the carrier gas at high pressure. Also, the carrier gas supplying part 210 may further include a controller 211 for controlling a sprayed amount of the carrier gas. The controller 211 may be a valve as illustrated in FIG. 3. The carrier gas may be an inert gas. The transfer part 240 provides the deposition material containing dopants to the driving module 130, 140, 150 and 160 using the carrier gas. [56] The transfer part 240 includes a pipe 242 through which the carrier gas passes. Also, the raw organic material supplying part 220 and the raw dopant material supplying part 230 are connected to the pipe 242. Through this structure, the raw organic material is mixed with the raw dopant material inside the pipe 242 to prepare the deposition material containing dopants. Of course, the structure is not limited thereto, but a predetermined mixing region (not shown) may be provided inside the transfer part 240, the raw organic material supplying part 220 and the raw dopant material supplying part 230 being connected to the mixing region. Accordingly, the raw organic material and the raw dopant material are mixed in the separate mixing region to prepare the deposition material containing dopants. Referring to FIG. 3, the transfer part 240 may further include a control valve 241 for controlling supplying of the deposition material containing dopants supplied through the pipe 242.
[57] The raw organic material supplying part 220 includes a raw organic material storage
221 for storing the raw organic material of powder form and supplying the raw organic material to the transfer part 240, and a raw organic material controller 222 for controlling a supplying amount of the raw organic material.
[58] The raw dopant material supplying part 230 includes a dopant storage 231 for storing the raw dopant material of powder form and supplying the raw dopant material to the transfer part 240, and a raw dopant material controller 232 for controlling a supplying amount of the raw dopant material.
[59] A separate storing space for storing the raw dopant material may be further provided between the dopant storage 231 and the transfer part 240. Through this structure, a small amount of raw dopant materials may be stored in the separate storing space from the dopant storage 231 in advance, and then may be delivered to the transfer part 240 by the carrier gas. At this point, the amount of the raw dopant materials to be stored in the separate storing space may be as much as that to be used for doping the organic thin film formed on the substrate 113. By doing so, the amount of the dopants doped inside the doped organic thin film formed on each substrate 113 may be maintained constant by keeping the amount of raw dopant materials stored in the separate storing space uniform when the doped organic thin films are formed on a plurality of substrates.
[60] A valve may be used for the raw organic material controller 222 and the raw dopant material controller 232. Of course, the raw organic material controller 222 and the raw dopant material controller 232 are not limited thereto, but a variety of controllers that can control a supplying amount of raw materials of powder form may be used. Examples of the controller include a pump and a dispenser discharging a predetermined amount of the raw organic material or the raw dopant material of powder form. The supplying amounts of the raw organic material and the raw dopant material discharged to the transfer part 240 through the raw organic material controller 222 and the raw dopant material controller 232 can be controlled to various amounts. Through this mechanism, an amount of dopants in the deposition material containing dopants can be easily controlled to a targeted amount.
[61] In the exemplary embodiment, a dopant doping ratio of the organic thin film formed on the substrate 113 is controlled by controlling a mixed amount of the raw organic material and the raw dopant material within the deposition material containing dopants. At this point, the supplying amounts of the raw organic material and the raw dopant material supplied to the transfer part 240 may be controlled. Also, the supplying amounts of the raw organic material and the raw dopant material may change variously depending on the doped amount of the organic thin film to be formed on the substrate 113. Here, mole ratio of the raw dopant material to the raw organic material may be controlled to be about 0.3% to 20%.
[62] In the exemplary embodiment, the raw organic material of powder form and a small amount of the raw dopant material of powder form are supplied into the pipe 242 through which the carrier gas flows. The raw organic material and a small amount of the raw dopant material carried by the carrier gas move along the pipe 242. At this point, the raw organic material and the raw dopant material of powder form are mixed to prepare the deposition material containing dopants inside the pipe 242. The deposition material containing dopants in the pipe 242 is supplied to the injection hole 141 of the housing 140 by the carrier gas and supplied to the inner space 122 of the spraying unit 120 through the transfer path 131 of the rotational shaft 130.
[63] In the exemplary embodiment, it has been described that amounts of the raw organic material of the raw organic material storage 221 and the raw dopant material of the dopant storage 231 discharged to the transfer part 240, respectively, are controlled by the raw organic material controller and the raw dopant material controller. However, the present disclosure is not limited thereto, but the supplying amounts of the raw organic material and the raw dopant material supplied to the transfer part 240 can be controlled through various methods and structures.
[64] In a modification of the exemplary embodiment illustrated in FIG. 4, a raw organic material is transferred through a first pipe 243, and a raw dopant material is transferred through a second pipe 244. Also, the raw organic material and the raw dopant material are mixed with each other to form a deposition material containing dopants using a third pipe 245 where the first and second pipes 243 and 244 merges. The deposition material is then supplied to a spraying unit 120 of a chamber 100.
[65] This will be described below in more detail with reference to FIG. 4.
[66] An inlet and an outlet of a raw organic material storage 221 communicate with the first pipe 243. Also, a first pressure controller 223 is provided on one side of the raw organic material storage 221. A first valve Vl and a second valve V2 are provided on the outlet and the inlet, respectively. A third valve V3 is provided in a portion of the first pipe 243 that is located between the inlet and the outlet. A first block part 224 preventing backflow of the raw organic material of solid powder form is provided inside the raw organic material storage 221. At this point, the second valve V2 controls an amount of a carrier gas CGl flowing into the raw organic material storage 221. Also, the first valve Vl controls discharging of the organic deposition raw material of powder form stored inside the raw organic material storage 221.
[67] A dopant storage 231 has the same structure as that of the above-described raw organic material storage 221. That is, an inlet and an outlet of the dopant storage 231 communicate with the second pipe 244. A first valve V4 and a second valve V5 are provided on the outlet and the inlet, respectively. A second pressure controller 233 is provided on one side of the dopant storage 231, and a block part 234 is disposed inside the dopant storage 231.
[68] An operation of a deposition source supplying module having the above-construction will be described below using the raw organic material in accordance with another exemplary embodiment of the present disclosure.
[69] First, the raw organic material of powder form is supplied to the first pipe 243 depending on the inner state (that is, laminar flow mode or turbulence flow mode) of the raw organic material storage 221. The laminar flow mode is described first. When the first and second valves Vl and V2 are opened and the third valve V3 is closed with the pressure of the first pressure controller 223 maintained constant, the raw organic material of powder form stored in the raw organic material storage 221 conveyed by the carrier gas CG2 is supplied to the first pipe 243. At this point, an amount of the raw organic material supplied to the first pipe 243 can be controlled by controlling the pressure of the first pressure controller 223 or controlling an amount of the introduced carrier gas CG2. Also, when the third valve V3 is opened, an amount of the carrier gas flowing into the second valve V2 can be controlled, so that a supplying amount of the raw organic material can be controlled. Now, the turbulence flow mode is described. When the second valve V2 is opened, the first valve Vl is opened/closed with a predetermined time interval, and the third valve V3 is closed, turbulence is generated inside the raw organic material storage 221 due to a pressure difference between the inner pressure of the first pipe 243 and the inner pressure of the raw organic material storage 221. This turbulence allows the raw organic material of powder form to be supplied to the first pipe 243. At this point, a supplying amount of the raw organic material can be controlled by controlling an opening time of the first valve Vl. Also, the supplying amount of the raw organic material can be controlled by controlling a pressure difference between the inner pressure of the first pipe 243 and the inner pressure of the raw organic material storage 221.
[70] The amounts of the raw organic material and the dopnat raw material supplied to the first pipe 243 and the second pipe 244, respectively, can be controlled variously using the above-described control method.
[71] Deposition of a doped organic thin film using an apparatus for depositing an organic thin film will be described below in accordance with an exemplary embodiment.
[72] The substrate 113 is loaded into the chamber 100 and is seated on the substrate seating unit 110. The spraying unit 120 is heated to a predetermined temperature, and rotational force of the rotating member 150 is applied to the spraying unit 120 through the rotational shaft 130. By dosing so, the spraying unit 120 is allowed to rotate inside the chamber 100. Then, the carrier gas CG is supplied into the pipe 242 of the transfer part 240 through the carrier gas supplying part 210. At this point, the raw organic material and the raw dopant material are supplied together to the transfer part 240. The amounts of the raw organic material and the raw dopant material supplied into the transfer part 240 are controlled by controlling supplying amounts of the raw organic material supplying part 220 and the raw dopant material supplying part 230.
[73] The raw organic material and the raw dopant material are mixed to form the deposition material containing dopants within the transfer part 240. This deposition material is supplied to the injection hole 141 of the housing 140 through the transfer part 240 and provided to the spraying unit 120 rotating within the chamber 100. The deposition raw material containing dopants supplied to the spraying unit 120 is evaporated within the spraying unit 120 and sprayed onto the substrate 113 through the nozzles 123 of the spraying unit 120 to form the organic thin film containing dopants on the substrate 113.
[74] In accordance with the exemplary embodiment, the raw organic material and the raw dopant material are supplied at a predetermined ratio, and these materials are evaporated right before they are sprayed onto the substrate 113 to form the organic thin film having excellent layer quality, and an amount of dopants within the organic thin film can be made uniform. Since the amounts of the raw organic material and the raw dopant material supplied into the chamber 110 can be maintained uniform even when the above-descried process is repeated a plurality of times, dopant concentration of the organic thin films can be maintained uniform for the respective substrates 113 through a plurality of processes. Also, the spraying unit 120 rotates to supply the uniform deposition material onto the substrate 113, so that the organic thin film having a uniform thickness can be formed on the entire substrate 113.
[75] Also, in accordance with an exemplary embodiment, the raw organic material and the raw dopant material of powder form are not mixed within the carrier gas and the transfer part, but instead, the raw organic material and the raw dopant material of powder form are mixed separately, and then these materials can be supplied to the spraying unit within the chamber using the carrier gas. An apparatus for depositing an organic thin film will be described below in accordance with another exemplary embodiment of the present disclosure with reference to the accompanying drawings. In the following descriptions, the descriptions for the same parts as those of the previous embodiment are omitted. Technology of the following description can be applied to the previous embodiment.
[76] FIG. 5 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with a second exemplary embodiment, and FIG. 6 is a schematic view of a deposition source supplying module in accordance with the second exemplary embodiment.
[77] Referring to FIGS. 5 and 6, the apparatus includes a chamber 100 having a predetermined reaction space, a substrate seating unit 110 and a spraying unit 120 disposed inside the reaction space, and a housing 140, a rotational shaft 130, and a rotating member 160 for rotating the spraying unit 120. The apparatus for depositing the organic thin film further includes a dopant-contained deposition material supplying part 200 for supplying dopant-contained deposition material which includes a raw organic material of powder form is mixed with a raw dopant material of powder form to the spraying unit 120, and a carrier gas supplying part 210 supplying a carrier gas CG for transferring the deposition material containing dopants of powder form to the spraying unit 120. Also, the apparatus for depositing the organic thin film further includes a transfer part 240 through which the dopants of powder form and the carrier gas pass.
[78] The dopant-dontained deposition material supplying part 200 includes a deposition material storage 201 in which the raw organic material and the raw dopant material of powder form are mixed in advance and stored in the form of the deposition material containing dopants, and a deposition material supplier 202 receiving the deposition material containing dopants from the deposition material storage 201 to supply the deposition material to the spraying unit 120 inside the chamber 100 through the carrier gas CG and the transfer part 240.
[79] A predetermined controller for controlling a supplying amount of a deposition material can be provided to the deposition material storage 201. The deposition material supplier 202 may be provided between the deposition material storage 201, the transfer part 240, and the carrier gas supplying part 210.
[80] As described above, in accordance with the exemplary embodiment, the raw organic material and the raw dopant material of powder form are mixed in advance to prepare the deposition material containing dopants. The deposition material is stored in the deposition material storage 201, and then supplied to the deposition material supplier 202 as much as a necessary amount every process. Since the raw organic material and the raw dopant material of powder form are mixed, the mixing can be performed effectively and a composition ratio of the raw dopant material to the raw organic material can be accurately controlled as well. By doing so, a doping ratio of the doped organic thin film can be quantitatively controlled. Also, at least two precursors can be mixed for manufacturing a polymer thin film. By doing so, a polymer thin film of polyimide or polyamide can be formed.
[81] The present disclosure is not limited to the above description. The spraying unit may be fixed and the substrate may rotate to form an organic thin film doped with dopants having a uniform thickness. An apparatus for depositing an organic thin film will be described in accordance with a third exemplary embodiment with reference to the accompanying drawings. In the following descriptions, the descriptions for the same parts as those of the previous embodiment are omitted. Technology of the following description can be applied to the previous embodiment.
[82] FIG. 7 is a cross-sectional schematic view of an apparatus for depositing an organic thin film in accordance with the third exemplary embodiment.
[83] Referring to FIG. 7, the apparatus includes a chamber 100, a substrate seating unit
110 disposed inside the chamber 100 and rotates, a spraying unit 120 for evaporating a deposition material containing dopants and supplying the deposition material into the chamber 100, and a deposition source supplying module 201: 210, 220, 230, and 240 for supplying the deposition material to the spraying unit 120.
[84] The substrate seating unit 110 includes a seating part 111 and a driving part 114 rotating the seating part 111. The driving part 114 includes a driving shaft connected to the seating part 111 for rotating the seating part 111, and a driver for rotating the driving shaft. The driving part 114 can rotate the seating part 111 on which a substrate 113 is seated, so that the deposition material supplied through the spraying unit 120 can be uniformly distributed on the substrate 113. Therefore, the thickness of a thin film formed on the substrate 113 can be prepared uniform. The spraying unit 120 includes a body 121 having an inner space 122, nozzles 123, and heaters 124.
[85] The deposition source supplying module 201 includes a raw organic material supplying part 220 for supplying a raw organic material, and a raw dopant material supplying part 230 for supplying a raw dopant material to an inner space 121 of the spraying unit 120. At this point, the raw organic material and the raw dopant material of powder form are supplied to a predetermined transfer part 240, conveyed by a carrier gas CG within the transfer part 240, and supplied to the spraying unit 120. Also, the deposition source supplying module 201 includes a carrier gas supplying part 210 for supplying a carrier gas CG. In accordance with the exemplary embodiment, the raw material in the deposition source supplying module 201 can be directly supplied to the spraying unit 120. In accordance with the exemplary embodiment, a doped organic thin film having targeted doping concentration can be manufactured by controlling supplying amounts of a raw organic material and a raw dopant material.

Claims

Claims
[1] An apparatus for depositing an organic thin film, the apparatus comprising: a chamber; a substrate seating unit disposed inside the chamber; a spraying unit configured to evaporate and spray a raw organic material and a raw dopant material; heaters configured to heat the spraying unit; and a deposition source supplying module configured to supply the raw organic material and the raw dopant material to the spraying unit.
[2] The apparatus of claim 1, wherein the spraying unit comprises: a body having an inner space; and a plurality of nozzles provided to the body, the inner space of the body being heated by the heaters.
[3] The apparatus of claim 2, wherein the heaters are provided at least inside a portion of the body where the nozzles are formed.
[4] The apparatus of claim 1, further comprising: a rotational shaft connected to the spraying unit; a housing configured to fix the rotational shaft; and a rotating member configured to rotate the rotational shaft, the housing being connected to the deposition source supplying module to receive the raw organic material and the raw dopant material, and the rotational shaft supplying the raw organic material and the raw dopant material to the spraying unit via a transfer path provided inside the rotational shaft.
[5] The apparatus of claim 1, wherein the deposition source supplying module comprises: a carrier gas supplying part configured to supply a carrier gas; a raw organic material supplying part configured to supply the raw organic material; a raw dopant material supplying part configured to supply the raw dopant material; and a transfer part configured to supply the raw organic material and the raw dopant material to the spraying unit using the carrier gas.
[6] The apparatus of claim 5, wherein the raw organic material supplying part comprises: a storage configured to store the raw organic material of powder form; and a raw organic material controller configured to control a supplying amount of the raw organic material.
[7] The apparatus of claim 5, wherein the raw dopant material supplying part comprises: a storage configured to store the raw dopant material of powder form; and a raw dopant material controller configured to control a supplying amount of the raw dopant material.
[8] The apparatus of claim 7, wherein the raw dopant material supplying part further comprises a storing space connected to the transfer part and configured to store a portion of the raw dopant material of powder form discharged from the storage.
[9] The apparatus of claim 1, wherein the deposition source supplying module mixes the raw organic material of powder form with the raw dopant material of powder form to supply the mixture.
[10] The apparatus of claim 1, wherein a mole ratio of the raw dopant material to the raw organic material is controlled to be about 0.3% to 20%.
[11] The apparatus of claim 1, wherein the substrate seating unit rotates.
[12] A method for depositing an organic thin film, the method comprising: loading a substrate into a chamber; heating and rotating a spraying unit located inside the chamber; supplying a raw organic material and a raw dopant material to the spraying unit; and evaporating and spraying the raw organic material and the raw dopant material supplied to the spraying unit.
[13] The method of claim 12, wherein the mole ratio of the raw dopant material to the raw organic material is controlled to be about 0.3% to 20%.
[14] The method of claim 12, wherein the raw organic material and the raw dopant material of powder form are supplied to the spraying unit using a carrier gas.
[15] The method of claim 12, further comprising mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
[16] A method for depositing an organic thin film, the method comprising: loading a substrate onto a substrate seating unit located inside a chamber; rotating the substrate seating unit; heating a spraying unit located inside the chamber; supplying a raw organic material and a raw dopant material to the spraying unit; and evaporating and spraying the raw organic material and the raw dopant material supplied to the spraying unit.
[17] The method of claim 16, wherein the mole ratio of the raw dopant material to the raw organic material is controlled to be about 0.3% to 20%.
[18] The method of claim 16, wherein the raw organic material and the raw dopant material of powder form are supplied to the spraying unit using a carrier gas.
[19] The method of claim 16, further comprising mixing the raw organic material with the raw dopant material before supplying of the raw organic material and the raw dopant material to the spraying unit.
PCT/KR2007/004133 2006-08-29 2007-08-28 Apparatus and method for depositing organic thin film WO2008026865A1 (en)

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