WO2008015862A1

WO2008015862A1 - Connector for connecting electronic component

Info

Publication number: WO2008015862A1
Application number: PCT/JP2007/063152
Authority: WO
Inventors: Atsushi Nishio; Shinichi Asano; Yoshihiro Ishikawa; Taketomo Nakane
Original assignee: Mitsumi Electric Co., Ltd.
Priority date: 2006-07-31
Filing date: 2007-06-29
Publication date: 2008-02-07

Abstract

Provided is a connector for connecting an electronic component, which reduces noise radiation when the electronic component is connected to a substrate through the connector and driven. In a connector (100), a connector main body (130) stores a module (210) inside an opening section (110), and the connector main body is mounted on the substrate by being electrically connected to the stored module (210). The connector main body (130) is provided with a contact lead section (120b) which is lead out to the side of the connector main body (130) to be bonded to a conductor on the substrate. A cover member (160) which opens and closes by turning with a shaft section (161) at the center is pivotally supported on the connector main body (130), and the opening section (110) is covered with the cover member (160) from above. The cover member (160) is provided with a conductive skirt section (170) for covering the contact lead section (120b) from above in a closed state.

Description

Electronic component connector

Technical field

The present invention relates to an electronic component connecting connector for connecting to an electronic component such as a module coupled to a signal transmission member such as an optical waveguide.

Background art

[0002] Conventionally, when an electronic component is detachably mounted on a substrate for maintenance or the like, a method of providing the electronic component on a substrate via a connector is known.

[0003] At that time, the connector electrically mounts the electronic components in a detachable manner, and arranges the lead portions extending in the horizontal direction from the lower portion on the contact terminals on the substrate to join them. It is common (see, for example, Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2005-56626

Disclosure of the invention

Problems to be solved by the invention

[0004] By the way, along with miniaturization of electronic devices such as mobile phones, miniaturization of electronic components mounted on electronic devices has been promoted, and accordingly, connectors used for mounting electronic components have also been miniaturized. ing.

In such a configuration in which an electronic component is attached to a substrate through a miniaturized connector, for example, an optical waveguide connected to an LCD (Liquid Crystal Display) or the like transmits a signal to be transmitted. A large amount of transmission members may be connected.

[0006] In this case, in the connector, a high-speed signal flows through the lead portion connected to the substrate contact terminal. Therefore, in the configuration in which the lead portion is arranged on the contact terminal of the substrate and joined, the lead portion is exposed to the outside. Because there is a possibility of emitting noise!

[0007] An object of the present invention is to provide an electronic component connecting connector that emits less noise when the electronic component is driven by being connected to a substrate via the connector.

Means for solving the problem

[0008] The connector for connecting an electronic component of the present invention is electrically connected to the accommodated electronic component, A connector main body mounted on a board, a lead terminal portion that is led out and arranged on the connector main body to the side of the connector main body, and is joined to a conductor on the board; and the connector main body from above The cover part which has the electroconductivity to cover, and the terminal cover part which has the electroconductivity which is provided in the said cover part and coat | covers the said lead terminal part joined to the said conductor from upper direction are taken.

The invention's effect

[0009] According to the present invention, noise emission can be reduced when an electronic component is driven by being connected to a substrate via a connector.

Brief Description of Drawings

FIG. 1 is a diagram showing a configuration of an electronic component connecting connector according to Embodiment 1 of the present invention.

[Figure 2] Diagram showing the connector for connecting electronic components with the module inserted

FIG. 3 is a diagram showing a connector for connecting electronic components with the module connected and housed and the cover member closed.

[Figure 4] Plan view of the connector for electronic components shown in Figure 3

[Figure 5] Side view of the connector for electronic components shown in Figure 3

[Figure 6] Bottom view of the connector for electronic components shown in Figure 3

[Fig. 7] Front view of connector for electronic components shown in Fig. 3.

FIG. 8 is a diagram showing a configuration of an electronic component connecting connector according to Embodiment 2 of the present invention.

[Figure 9] Diagram showing the connector for connecting electronic components with the module inserted

[Fig. 10] Diagram showing the connector for connecting electronic components with the module connected and the cover member closed.

FIG. 11 is a diagram showing a configuration of an electronic component connecting connector according to Embodiment 3 of the present invention.

FIG. 12 is a diagram showing a configuration of an electronic component connecting connector according to Embodiment 3 of the present invention.

FIG. 13 is a diagram showing an example of an electronic component connecting connector that is a transmission partner of the electronic component connecting connector according to Embodiment 3 of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0012] (Embodiment 1) FIG. 1 is a diagram showing a configuration of an electronic component connecting connector 100 according to Embodiment 1 of the present invention. Here, the electronic component connected to the electronic component connecting connector 100 will be described using a module to which an optical waveguide is attached. In the present embodiment, the surface on which the electronic component connecting connector 100 is mounted on the substrate is the bottom surface, and the direction in which the optical waveguide 200 is attached to the module (electronic component) 210 is the tip direction. In addition, the electronic component is not limited to a module with an optical waveguide, but may be an electric wire, a cable, a flexible cable, or a module having an optical fiber.

[0013] An electronic component connecting connector 100 shown in FIG. 1 is connected to an optical waveguide 200 that guides an optical signal. The connector 210 receives a module 210 that receives light from the optical waveguide 200, converts the light into a voltage, and outputs the voltage. It is detachably connected and accommodated in the opening 110 of 130. The connector 100 for connecting an electronic component covers the module 210 accommodated in the opening 110 with a cover member (cover) 160 pivotally attached to the connector main body 130 so as to prevent an external electric field or magnetic field. Shield and protect.

FIG. 2 is a diagram showing the electronic component connecting connector 100 in which the module 210 is inserted, and FIG. 3 shows the electronic component connecting connector 100 in a state in which the module 210 is connected and accommodated and the cover member 160 is closed. FIG.

First, the module 210 to which the optical waveguide 200 is attached will be described with reference to FIG.

Here, the module 210 has a rectangular parallelepiped shape, and the optical waveguide 200 is attached with an end face force extending in the longitudinal direction of the module 210.

Specifically, in module 210, substrate 212 on which one end portion of optical waveguide 200 is bonded and an optical signal processing unit (not shown) that performs optical signal processing via optical waveguide 200 is mounted, and substrate And a module cover (exterior part) 214 covering the optical signal processing part 212 (electronic component main body) on 212.

[0018] Note that the optical waveguide 200 is formed in a film shape by covering two cores when performing bidirectional optical transmission, and by coating one core with a cladding when performing unidirectional optical transmission. And has flexibility.

[0019] The optical signal processing unit receives light through the waveguide when the optical waveguide 200 is bidirectional. The light receiving element, the light emitting element, and the light processing components such as capacitors, amplifiers, and drivers that process and amplify the signals of these elements are also configured. When the optical waveguide 200 attached to the module 210 is unidirectional, the optical signal processing unit includes a light receiving element such as a photodiode or a light processing element such as a light emitting element, a capacitor, and an amplifier. Here, the optical signal processing unit has an optical function having a function of outputting a voltage (electrical signal) when an optical signal is input to the module 210, but is not limited thereto. For example, when an electrical signal is input to the module, the optical signal processing unit may have an optical conversion function of outputting as an optical signal.

[0020] The substrate 212 of the module 210 is adjacent to the mounting surface (not shown) and is applied to both side surfaces 212a extending in the extending direction of the optical waveguide 200 by the voltage (electrical current) converted by the optical signal processing unit. The connection terminal part (electrode part) 215 for outputting a gas signal is arranged. These connection terminal portions 215 are provided so as to be exposed on both side surfaces 212a. Here, when the mounting surface of the substrate 212 is the back surface, the connection terminal portions 215 are formed on the side surface 212a so as to open to the front side and the side surface side of the module 210. Each is disposed in the plurality of recesses.

Note that these recesses are formed orthogonal to the surface portion of the film-like optical waveguide 200, and when electrically contacting the electronic component connecting connector 100, the module 210 is replaced with the module 210. The front side force of 210 is also connected by inserting. In other words, the module 210 is connected to the electronic component connecting connector 100 by being inserted in a substantially vertical direction from above.

[0022] The module cover 214 is formed of a conductive member having conductivity. Here, the optical signal processing unit in which the optical waveguide 200 is extended from one side is processed from above by processing a metal plate such as a copper plate. It is formed in the shape of a covering lid. As a result, the module cover 214 absorbs noise generated during the operation of the optical signal processing unit.

In addition, the module cover 214 has a latching piece portion 216 that protrudes rearward from the rear end portion of the substrate 212. Here, the latching piece portion 216 has a plate shape extending horizontally from the upper surface portion 214a of the module cover 214 to the rear, and overhangs the substrate 212.

[0024] When the latching piece 216 is accommodated in the opening 110, the pushing tongue 180 is displaced from the bottom to the top, that is, in the direction opposite to the insertion direction, by the rotation of the cover member 160. On the underside It is hooked.

In addition, a roof portion 214b that protrudes upward and extends in the longitudinal direction is formed at the central portion of the upper surface portion 214a of the module cover 214. The roof portion 214b is a portion that is pressed by the pushing tongue 180 of the cover member 160 when the module 210 is inserted into the opening 110 and the cover member 160 is closed.

[0026] The module 210 configured in this manner is fitted into the opening 110 of the electronic component connecting connector 100 that opens upward, so that the connection terminal portion 215 thereof is the socket contact of the electronic component connecting connector 100. Part (contact terminal) 120 is connected.

As shown in FIGS. 1 to 3, an electronic component connecting connector 100 includes a connector main body 130 having an opening 110 into which a module 210 (see FIG. 1) is inserted, and a connector. And a cover member 160 that covers a module 210 (see FIG. 1) that is pivotally attached to the main body 130 and is fitted in the opening 110.

As shown in FIG. 1, the connector main body 130 includes a housing (nozzle part) 132 having an opening 110, and a module 210 (see FIG. 1) that is disposed around the housing 132 and fitted into the opening 110. And a shield case (shield part) 134 for shielding.

[0029] In the housing 132, a pair of side wall portions 138, 140 are formed on the upper surface of the bottom surface portion 136 of the rectangular flat plate facing the substrate to be mounted, facing each other at a predetermined interval and extending in the longitudinal direction. Has been.

[0030] A front wall 142 having a lead-out path 130c is interposed between one end of the pair of side wall portions 138 and 140 (herein, referred to as a front end), and the other end ( A stagger portion 143 (see Fig. 3) is installed between the base end and the end.

The opening 110 is defined in a groove shape and opened upward by the bottom surface portion 136, the pair of side wall portions 138 and 140, and the front wall portion 142 in the housing 132.

Note that the housing 132 is formed of an insulating member having an insulating property, and is formed of a synthetic resin such as an insulating plastic here.

[0033] In this housing 132, socket contact portions (contact terminals) 120 are disposed on the opposing surfaces 138a, 140a of the side wall portions 138, 140, that is, on the opposing inner wall surfaces of the opening 110, respectively. Yes. The socket contact portion 120 contacts the connection terminal portion 215 (see FIG. 1) of the module 210 when the module 210 (see FIG. 1) is fitted into the opening 110.

[0035] The socket contact portion 120 is formed by bending a long plate-like member having conductivity (not shown), and one end portion projects from the opposing inner wall surface (opposing surfaces 138a, 140a) of the opening 110. The other end portion is connected to the outside of the connector main body 130 through the plurality of holes formed in the lower surface of the side wall portions 138, 140 of the housing 132 from the contact portion 120a. The bottom surface of the main body 130, that is, the contact lead portion (lead terminal portion) 120b extending substantially in parallel with the bottom surface portion 136 is used.

[0036] In the socket contact part 120, a central part (not shown) that connects the contact part 120a and the contact lead part 120b is embedded in the side wall parts 138, 140 in the vertical direction, and the socket contact part 120 itself is embedded in the side wall parts 138, 140. Fix it.

[0037] When the module 210 is inserted into the opening 110 of the electronic component connecting connector 100 from above, the contact portion 120a is guided to the concave portion of the substrate 212 in the module 210, and is connected to the connection terminal portion 215 of the module 210. (See Fig. 1). The contact portions 120a are configured to be biased toward the mutually facing surfaces 138a and 140a, and thereby the module 210 inserted into the opening 110 is fitted in a sandwiched state.

[0038] The contact lead portion 120b is connected to the conductor of the substrate when the electronic component connecting connector 100 is disposed on the substrate.

[0039] Further, as shown in FIGS. 1 and 2, the upper surfaces 138b and 140b of the portion where the socket contact portion 120 is provided are the highest on the upper surfaces of the side walls 138 and 140 of the nosing 132. That is, in the side wall portions 138 and 140, notch portions 144 and 145 are formed in the upper surface portions other than the upper surface portions 138b and 140b (the upper surface portions 138c and 140c on the distal end side and the upper surface portions 138d and 140d on the proximal end side). Yes.

[0040] The upper surface portions 138c and 140c on the distal end side and the upper surface portions 138d and 140d on the proximal end side are substantially flush with each other and are fitted into the opening 110 as shown in FIG. In addition, the height is substantially flush with the upper surface 214a (back surface) of the module 210. In other words, the module 210 fitted into the opening 110 is lower than the height of the portion where the socket contact portion 120 is provided in the side wall portions 138 and 140. [0041] As described above, the socket contact portion 120 is not provided immediately below the formed portion of the notching portion 144, 145 force on the wall 138, 140! . For this reason, since it is not necessary to secure the height and strength required when the socket contact portion 120 is provided in the housing 132, the height level can be lowered accordingly.

That is, in the housing 132, the upper surface portions 138c, 140c on the distal end side and the upper surface portions 138d, 140d on the proximal end side are at the height level of the upper surface portions 138b, 140b of the portion where the socket contact portion 120 is provided. It is lower.

[0043] In addition, a communication groove that communicates with the front end side of the connector main body 130 is formed in the front wall portion 142, and the optical waveguide 200 (see FIG. 1) of the module 210 (see FIG. 1) is formed at the front end by the communication groove portion. A lead-out path 130c for the lead-out portion leading out to the outside is formed.

In other words, the lead-out path 130c is formed between the end portions on the front end sides of the side wall portions 138 and 140 of the connector main body 130 so as to be electrically connected to the front end side of the connector main body 130.

With this configuration, when the module 210 (see FIG. 1) is fitted into the opening 110, the optical waveguide 200 of the module 210 (see FIG. 1) is held by the connector 100 for connecting electronic components. It is derived outside the connector 100 for connecting electronic components.

[0046] The shield case 134 (see FIGS. 1 and 2) is formed of a conductive member having conductivity. Here, the shield case 134 is formed by covering a housing 132 by covering a metal plate. The module 210 housed in the opening 110 of the group 132 is shielded.

[0047] Specifically, as shown in FIGS. 1 and 2, the shield case 134 surrounds the housing 132 from the side on the outer peripheral portion of the housing 132 excluding the peripheral edge portion of the guide path 130c in the front wall portion 142. A rectangular frame-shaped case main body 134a is provided.

[0048] The case main body 134a also has a contact covering portion 134b with its upper side portion extended to cover the entire upper surface of the portion of the side wall portion 138, 140 of the housing 132 where the socket contact portion 120 is provided. Is formed.

[0049] Here, the contact covering portion 134b is conductive and has a plate shape, is formed continuously with the conductive case body 134a, and is electrically connected to the case body 134a. When the cover member 160 is closed with respect to the connector main body 130, the contact covering portion 134b is formed by covering the cover member 160 [not covered by this! /, Socket contact 咅 upper surface portion 138b, 140b. Cover.

[0050] The case main body 134a is fixed on the mounting substrate via a lead portion 134c formed by extending its lower side portion force to the side.

[0051] The lead part 134c is fixed in a state of being electrically connected to the ground part of the substrate on which the electronic component connecting connector 100 is mounted. That is, the lead portion 134c is fixed in a state where it is electrically connected to the GND land portion of the substrate by soldering or the like.

[0052] Thereby, when the electronic component connecting connector 100 is mounted on the substrate, the shield case 134 formed of the conductive member is electrically connected to the GND line of the substrate via the lead portion 134c. In other words, when the electronic component connecting connector 100 is mounted on the board, the shield case 134 is fixed to the board in a conductive state with the GND on the board side.

[0053] The shield case 134 has a shape corresponding to the shape of the outer peripheral surface of the housing 132 disposed inside, and the height level of the upper side portion is formed by the contact covering portion 134b being continuously formed. The part, that is, the part above the contact lead portion 120b is the highest. As a result, the contact lead portion 120b is disposed below the distal end portion and the upper end portion of the proximal end portion where the contact lead portion 120b is not disposed below the both side wall portions of the shield case 134. The height level is lower than the upper side of the part, and it becomes!

The module 210 (see FIG. 1) that fits into the opening 110 of the connector main body 130 configured in this way is inserted from the opening direction of the opening 110 (above the connector main body 130) and then the force bar. By being covered with the member 160, the connector body 130 is fixed in an electrically connected state (see FIG. 3).

[0055] The stagger portion 143 is conductive and is formed by bending a plate-like material, and on the base end face side of the side wall portions 138, 140 of the housing 132, behind the shaft portion 161, the cover It is installed in a direction that intersects the direction of rotation of the member 160.

The stopper portion 143 is disposed in the rotation range of the cover member 160 pivotally attached to the shaft portion 161 at the base end portion of the shield case 134, and restricts the rotation range of the cover member 160.

That is, the stopper portion 143 contacts the cover member 160 on the base end side of the cover member 160 when the cover member 160 is opened at a predetermined angle with respect to the connector main body 130, thereby Hold it open once.

[0058] The cover member 160 is made of a conductive member having conductivity, and is formed by processing a metal plate.

[0059] The cover member 160 includes a pair of arm portions 162 rotatably attached to the connector body 130 via a shaft portion 161, a cover upper surface portion 163 provided between the pair of arm portions 162, It has a pressing plate portion 169 formed on the cover upper surface portion 163 and a scat portion (terminal covering portion) 170 formed on the arm portion 162.

Here, the arm portion 162 is formed in a flat plate shape, and is attached to both side surface portions of the base end portion 130a of the connector main body 130 so that the one end portion 162a is rotatable via a shaft portion 161 orthogonal to the longitudinal direction. Is attached.

[0061] The arm portion 162 is rotated about the one end portion 162a, whereby the cover upper surface portion 16 is rotated.

When 3 is arranged on the notches 144 and 145, that is, when the cover member 160 is closed, it is provided at a position that covers both side surfaces of the connector main body 130.

[0062] When the cover member 160 is closed and the arm portion 162 is positioned so as to cover both side surfaces of the connector main body 130, the arm portion 162 has a locking portion 134e formed on the shield case 134 of the connector main body 130. A locked portion 166 to be engaged is provided.

[0063] The locking portion 134e and the locked portion 166 engage the cover member 160 with the connector body 13 by engagement.

Fix to 0 (see Fig. 3) and connect the arm 162 and the shield case 134 to make them conductive.

[0064] The locking portion (projection portion) 134e and the locked portion (locking hole) 166 are formed in the arm portion 162 and the projection portion 134e that protrudes laterally at the distal end side of both side surfaces of the shield case 134. The protrusion 134e is inserted and engaged with the engagement hole 166. The configuration of the locking portion and the locked portion is not limited to this, and the module 210 (see FIG. 1) in the housing 132 fitted in the opening 110 by the cover member 160 is closed with the cover member 160 closed. Any configuration may be used as long as it is fixed to the connector body 130. For example, the protrusion may be provided in the cover member, and the engagement hole may be provided in the side wall covering portion of the housing 132.

[0065] The arm portion 162 and the shield case 134 are connected to each other by connecting the cover member 160 to the connector body 1. It is good also as a structure which, when closed with respect to 30, conducts by contacting without engaging with each other. For example, when the cover member 160 is closed with respect to the connector main body 130, the inner surface of the arm portion 162 and the outer surface of the shield case 134 may be in surface contact. Further, the arm portion 162 is provided with an operation portion 167 that extends the tip of one arm portion 162 in the axial direction of the arm portion 162 and facilitates the opening / closing operation of the cover member 160.

[0066] The cover upper surface portion 163 provided between the arm portions 162 is provided on the distal end side upper surface portion 164 provided on the distal end side of the pair of arm portions 162 and on the proximal end portion side of the pair of arm portions 162. And a proximal-side upper surface portion 165.

[0067] When the cover member 160 is closed, the distal end side upper surface portion 164 is disposed in the notch portion 144 in the connector main body 130, that is, on the distal end side upper surface portions 138c and 140c.

[0068] When the cover member 160 is closed, the proximal-side upper surface portion 165 is disposed in the notch 145 in the connector main body 130, that is, on the proximal-side upper surface portions 138d and 140d.

[0069] The distal-side upper surface portion 164 and the proximal-side upper surface portion 165 are arranged in a state where the module 210 (see FIG. 1) is fitted in the opening 110 and electrically connected to the connector main body 130. 210 (see Fig. 1) is prevented from moving to the front side, that is, above the connector body 130.

[0070] The distal-side upper surface portion 164 and the proximal-side upper surface portion 165 are located on the same plane, and ribs 168a and 168b are projected from the respective back surfaces.

The ribs 168a and 168b project downward from the back surface of the cover member 160, and regulate the position of the upper surface of the module 210 received in the opening 110.

[0072] Specifically, the ribs 168a and 168b are respectively formed on the distal end side upper surface portion 164 and the proximal end upper surface portion 165 with the same protruding degree, and when the cover member 160 is closed, the ribs 168a and 168b The module 210 is disposed substantially horizontally in contact with the rear surface of the module 210 to be fitted. In this manner, the ribs 168a and 168bi and the inside of the opening 210 can be placed in a suitable accommodation position.

The distal end upper surface portion 164 has a pressing plate portion that extends while being inclined downward from the side portion on the proximal end side of the distal end side upper surface portion 164 toward the proximal end upper surface portion 165 side. 169 is provided Yes.

[0074] The holding plate portion 169 is a plate-like plate panel or the like and has flexibility, and its free end portion 169a is positioned at a substantially central portion of the module fitted into the opening 110. The module 210 (see FIG. 1) that is arranged and fitted in the opening 110 is pressed downward (on the socket contact side) from its upper surface (back surface).

[0075] On the lower surface of the free end portion 169a, an abutting convex portion 169b (see FIG. 1) projecting downward in a hemispherical shape is formed. The contact protrusion 169b contacts the upper surface of the module 210 inserted into the opening 110 and presses the module 210. Here, the contact convex portion 169b is formed by embossing the free end portion 169a portion of the pressing plate portion 169 having a long metal plate force downward.

On the other hand, the base-side upper surface portion 165 extends in the longitudinal direction from the base-side side portion to the base-end side of the connector main body 130 and bends downward, and the free end portion at the tip is the shaft portion 161. Further, an extrusion tongue 180 disposed on the proximal end side of the connector main body 130 is formed.

The push tongue 180 is displaced about the shaft 161 in accordance with the opening / closing operation of the cover member 160, and the free end at the tip of the push-out tongue 180 can be projected and retracted in the opening 110.

That is, the push-out tongue 180 protrudes into the opening 110 and fits into the opening 110 when the cover member 160 is at a predetermined angle or more with respect to the connector main body 130 by rotating in the opening direction. Push the combined module 210 to the opening side.

[0079] This push-out tongue 180 is displaced so as to protrude inward of the opening 110 in conjunction with the rotation of the cover member 160 in the opening direction with respect to the opening 110, so that the latching piece of the module 210 is Abuts the back side. Then, by further rotating the cover member 160 in the opening direction, the free end at the tip of the push-out tongue 180 presses the latch piece 216 upward from the back side. The push tongue 180 is not located in the opening 110 at a position where the cover member 160 regulated by the stopper is at an angle of 90 ° or more with respect to the connector main body 130. Therefore, the push-out tongue 180 does not obstruct the insertion operation of the module 210 when inserted into the opening 110 of the connector body 130 of the module 210! /.

In addition, the arm portion 162 is formed with a skirt portion 170 that covers the contact lead portion 120b with an upward force when the cover member 160 is closed with respect to the connector main body 130. Word ヽ In other words, when the cover member 160 is rotated in the opening direction with respect to the connector main body 130 to be in the open state, the skirt portion 170 on the cover member 160 side applies an upward force to the contact lead portion 120b provided on the connector main body 130. Release the covering state.

The skirt portion 170 constitutes a force bar member 160 having conductivity together with the arm portion 162, the cover upper surface portion 163, and the like. The elements in the cover member 160 are electrically connected to each other.

4 is a plan view of the electronic component connecting connector 100 shown in FIG. 3, FIG. 5 is a side view of the electronic component connecting connector 100, FIG. 6 is a bottom view of the electronic component connecting connector 100, and FIG. FIG. 3 is a front view of the electronic component connecting connector.

[0083] The electronic component connecting connector 100 shown in FIGS.

10 shows a state where the cover member 160 is closed with the module 10 closed and the module 210 is connected and fixed.

As shown in FIGS. 1 to 7, the skirt portion 170 is formed in a plate shape extending substantially horizontally from the lower side portion of each of the pair of arm portions 162 to both sides (left and right direction). . Here, the lower side force of the arm part 162 also having a conductive metal plate force is formed so as to bend in a direction orthogonal to the arm part 162 and extend in the longitudinal direction.

[0085] As shown in FIGS. 3 to 7, the skirt portion 170 is close to the contact lead portion 120b immediately above when the cover member 160 is closed with respect to the connector main body 130. Arranged.

[0086] For example, the skirt portion 170 is formed on the arm portion 162 so as to be disposed about 0.2 or 0.25 above the contact lead portion 120b when the cover member 160 is in the closed state. ing. As described above, the skirt portion 170 is closest to the contact lead portion 12 Ob bonded on the substrate and becomes a conductive member.

[0087] Here, the skirt portion 170 has a length extending from the pair of arm portions 162 longer than the length in the longitudinal direction where the contact lead portion 120b of the connector main body 130 is disposed to both sides (left and right direction). This is longer than the length of the contact lead 120 in the extending direction. Here, as shown in FIGS. 3 to 6, the length of the skirt portion 170 in the longitudinal direction is disposed on the proximal end side and the distal end side of the plurality of contact lead portions 120 b disposed below. Also It is longer on the proximal side and the distal side than

As a result, when the cover member 160 is closed with respect to the connector main body 130, the skirt portion 170 does not see the contact lead portion 120b in the top view as shown in FIG. It is completely covered.

In addition, since the skirt portion 170 is provided so as to extend in a substantially horizontal direction from the arm portion 162 to the side, the skirt portion 170 is located above the contact lead portion 12 Ob with respect to the contact lead portion 120b disposed immediately below. It is arranged in close proximity to the entire surface exposed to the surface.

[0090] Here, the skirt portion 170 is a force that is formed in a substantially horizontal plate shape orthogonal to the arm portion 162, but is not limited to this. When the cover member 160 is closed, the contact is made. Any method may be used as long as the lead portion 120b covers the upward force. For example, the skirt portion 170 is composed of a horizontal plate portion that extends substantially horizontally from the lower side portion of the arm portion 162 and a vertical plate portion that extends perpendicularly downward from the tip side of the horizontal plate portion. Also good.

Specifically, the horizontal plate portion is bent at the tip portion to form a vertical plate portion, and when the cover member 160 is closed with respect to the connector main body 130, the contact lead portion 120b is formed on the horizontal plate portion. Cover from above and cover the tip of contact lead 120b with a horizontal plate. At this time, the horizontal plate portion and the vertical plate portion are both arranged close to the contact lead portion 120b and do not come into contact with each other.

[0092] When the miniaturized module 210 is used by being mounted on an electronic device or the like via the electronic component connecting connector 100, if the operating frequency of a signal flowing between the modules 210 is increased, the signal current is caused. Electromagnetic noise that becomes electromagnetic interference (EMI: Electro Magnetic Interference) to other parts or other equipment in the vicinity of electronic equipment is likely to occur.

[0093] Skirt portion 170 prevents electromagnetic noise that is EMI generated from contact lead portion 120b. In other words, the electronic component connector 100 can absorb EMI generated from the contact lead part 120b and flow it to the ground of the mounting board via the arm part 162, shaft part 161, shield case 134, lead part 134c, etc. .

Here, a method of connecting the electronic component connecting connector and the module with the optical waveguide will be described. As shown in FIG. 1, the cover member 160 of the electronic component connecting connector 100 is opened, and the optical waveguide 200 is inserted into the groove-shaped opening 110 of the connector main body 130 exposed upward from above the connector main body 130. Is inserted from the front side of the module 210, that is, from the board side. When the cover member 160 is opened, the rotation position of the cover member 160 is restricted by the stopper portion 143 when the cover member 160 is opened at an angle of 90 ° or more with respect to the connector main body 130. Therefore, when the module 210 is inserted into the opening 110, the cover member 160 is not opened too much and falls down with the back surface facing upward, and does not come into contact with other electronic components.

[0096] When the module 210 is inserted into the opening 110, the concave connection terminal portions (electrode portions) 215 on both side surfaces of the substrate 212 in the module 210 are connected to the contact portions 120a of the socket contact portion 120 of the connector main body 130. Are each guided and contacted correspondingly. The connection terminal portion 215 and the contact portion 120a come into contact with each other, and the module 210 is fitted into the opening 110.

[0097] At this time, the contact portion 120a protrudes inward from the side wall portions 138, 140 of the groove-shaped opening 110. Therefore, when the concave connection terminal portion 215 is guided by the inner surface portions of both side walls that open downward (in the insertion direction) and contacts the connection terminal portion 215 of the substrate 212 of the module 210, it is elastically deformed to the base end side. And contact with the connection terminal portion 215 in an energized state. As a result, the contact portion 120a is fitted in a state where the module 210 in the opening portion 110 is sandwiched, and the contact terminal portion 215 of the module 210 is reliably brought into contact with the contact portion 120a.

[0098] After the module is fitted into the opening 110 of the connector main body 130, the cover member 160 is closed, and the top end portion 164 is disposed on the notch 144, and the protruding portion 134e of the shield case 134 and the cover member By engaging with the engagement hole 166 of 160, the top end portion 164 of the distal end side is fixed to the connector main body 130.

[0099] Note that the module 210 may be temporarily inserted onto the opening 110 and the module 210 may be fitted into the opening 110 by pressing the cover member 160 by closing the cover member 160. That is, the connection terminal portion 215 of the module 210 is positioned on the contact portion 120a so that the upper side of the contact portion 120a is positioned at the concave edge of the connection terminal portion 215, and then the cover member 160 is closed and the module is closed. 210 is inserted into the opening 110. As shown in FIGS. 3 to 7, the module 210 is accommodated in the electronic component connecting connector 100 by covering the opening 110 with the cover member 160 closed or lying down with respect to the connector main body 130. The

At this time, the front end side upper surface portion 164 is disposed on the rear surface on the front end side of the module 210, and the proximal end upper surface portion 165 is disposed on the rear surface on the proximal end side of the module 210.

[0102] In addition, the holding plate portion extending from the top end portion 164 to the base end portion side of the cover member 160

169 Free end portion 169a force Presses the substantially central portion of the back surface of the module 210.

[0103] As described above, by disposing the top end portion 164 at the top end of the module 210, movement in the direction away from the opening 110 of the module 210, that is, the connector main body 130, is suppressed. .

[0104] Further, since the pressing plate 169 extends from the distal end upper surface 164 toward the proximal end of the cover member 160 while being inclined downward, the module 210 is fitted into the opening 110. Then, when the cover member 160 is closed, the module 210 is also pressed with a substantially central partial force on the back (see FIG. 9). This pressing force is transmitted to the entire contact portion between the connection terminal portion 215 of the module 210 and the contact portion 120a of the socket contact portion 120.

[0105] Further, on the back surface of the module 210, the back surface portions on the distal end side and the proximal end side sandwich the central portion pressed by the pressing plate portion 169, respectively, and the distal end upper surface portion 164 and the proximal end upper surface portion 165 respectively. The ribs 168a and 168b having the same degree of protrusion on the back surface are pressed.

Therefore, the module 210 is prevented from moving in the direction away from the opening 110, that is, the connector main body 130, and is accommodated in the opening 110 substantially horizontally without being inclined in the longitudinal direction. It is done.

[0107] Therefore, by simply closing the cover member 160, the module 210 can be reliably connected to the connector main body 130 where the optical waveguide 200 is not contacted or held without being electrically connected at the contact portion. Fixed to.

[0108] Therefore, the contact position with the module 210 does not shift or come off due to an impact such as vibration applied to the mounting board on which the electronic component connecting connector 100 is mounted, so that a slight sliding does not occur. That is, the connector 100 for connecting an electronic component of the present embodiment and the module with an optical waveguide. According to the structure in which the module 210 is connected, it is possible to smoothly transmit an electric signal in which the module 210 is not displaced from the electronic component connecting connector 100.

In addition, in the electronic component connecting connector 100, the upper portion of the connector main body 130 is cut out except for the portion where the socket contact portion 120 is disposed, and the force bar member 160 is inserted into the cutout portions 144 and 145. A distal end side upper surface portion 164 and a proximal end upper surface portion 165 are disposed.

[0110] Therefore, in the cover member 160, the height of the upper surface portion 163 having the front end side upper surface portion 164 and the proximal end upper surface portion 165 disposed on the notches 144 and 145 is set to the socket contact portion 120. Can be as high as Therefore, the height of the electronic component connecting connector 100 itself can be reduced as much as possible to achieve a low profile.

In the electronic component connecting connector 100 shown in FIGS. 3 to 7, the module 210 in the opening 110 is connected to the upper surface 214a of the conductive module cover 214 by the conductive holding plate 169. It is fixed in a state of being in contact with the contact protrusion 169b.

At this time, in the cover member 160 having the pressing plate portion 169, the engagement hole 166 provided in the arm portion 162 is engaged with the protruding portion 134e of the shield case 134. As a result, the force bar member 160 and the shield case 134 are brought into electrical contact with each other by engagement with the engagement hole 166 and the protrusion 134e.

That is, in a state where the module 210 is mounted on the electronic component connecting connector 100, the module cover 214 is electrically connected to the shield case 134 of the connector main body 130 via the cover member 160. The connector body 130 is mounted on the board by being joined to the GND land part of the board to be mounted via the lead part 134c of the shield case 134.

As described above, the module 210 closes the cover member 160 and the engagement hole 166 and the protrusion 134e engage with each other, whereby the cover member including the module cover 214, the pressing plate portion 169, and the engagement hole 166 is obtained. Through 160 and the shield case 134 including the projecting portion 134e and the lead portion 134c, it is electrically connected to the ground portion of the substrate and becomes conductive.

Thus, when the connector body is mounted on the substrate, the module cover 214 of the module 210 is connected to the GND land portion of the substrate and is electrically connected to the ground portion.

[0116] Therefore, when the module 210 connected to the electronic component connector is operated, The noise generated by the operation is absorbed by the module cover 214 and conducted to the grounding portion of the substrate through the cover member 160 and the shield case 134. Thereby, noise leakage during the operation of the module 210 can be prevented.

[0117] At this time, in order to prevent noise leakage during operation of module 210, the lead part 134c of the shield case 134 that is not required to be separately wired to prevent noise must be fixed in a state where it is connected to the grounding part. Therefore, noise leakage can be prevented simply by mounting the connector body on the board.

[0118] Further, in the electronic component connecting connector 100, when the module 210 is inserted into the opening 110 and the cover member 160 is laid down and closed, the skirt 170 is connected to the contact lead 120b of the connector main body 130. It is placed in close proximity to the top.

[0119] Therefore, when the cover member 160 is laid down and the opening 110 of the connector main body 130 is not closed, the contact lead portion 120b of the connector main body 130 is exposed to the outside, particularly upward, and is confirmed by the operator. Can be made.

[0120] Therefore, when the cover member 160 is opened with respect to the connector main body 130, the contact lead 120b and the pad on the board can be easily joined, and the electronic component connecting connector 100 can be easily placed on the board. Can be implemented.

[0121] When the module 210 of the connector body 130 is covered with the cover member 160, the connector body 1

The contact lead portion 120b that protrudes in the left and right directions on both sides of 30 is covered by an upper cover by a skirt portion 170 that is disposed at the closest position as a conductive member.

[0122] With this configuration, even when a high-speed signal flows through the contact lead part 120b during operation of the module 210 and noise is radiated from the contact lead part 120b, the noise is close to the skirt part arranged immediately above. Absorbed by 170. At this time, the contact lead portion 120b is completely covered with the upward force that is not covered with the skirt portion 170 when viewed from above.

That is, since the skirt portion 170 is provided on the cover member 160, the cover member 160

The connector body 130 is grounded to the GND land of the mounting board via the lead portion 134c of the shield case 134.

[0124] Therefore, in the electronic component connector 100, the contact connected to the mounting board is connected. When a high-speed signal flows through the node portion 120b and the contact lead portion 120b emits noise, the noise is grounded to the GND land of the substrate through the skirt portion 170. Therefore, noise radiated from the contact lead portion 120b is absorbed by the skirt portion 170 and shielded to be reduced.

That is, the skirt portion 170 can prevent electromagnetic interference (EMI: Electro Magnetic Interference) due to radiation and propagation of electromagnetic noise (electromagnetic wave) leaking from the contact lead portion 120b.

The module 210 accommodated in the opening 110 of the electronic component connecting connector 100 is covered with the shield case 134 of the connector main body 130 and the upper surface 214a of the module 210 is covered with the cover member 160. It has been broken.

In detail, in the connector 100 for connecting an electronic component, the top surface portion 16 of the cover member 160 is made of a resin containing the force module 210, that is, the tip side where the insulating housing 132 is exposed upward. The upper part 138c, 140c is also covered with upward force. Further, the base end side upper surface portion 165 covers the base end side upper surface portions 138d and 140d from which the housing 132 is exposed from above. Further, the upper surface portions 138b and 140b of the portion where the socket contact portion 120 is disposed in the nosing and the winging 132 are covered with a contact covering portion 134b extending from the shield case 134, respectively.

Furthermore, the upper surface 214a of the module 210 is covered with a front end side upper surface portion 164, a pressing plate portion 169, and a proximal end side upper surface portion 165.

[0129] Further, the contact lead portion 120b exposed to the outside is covered with the skirt portion 170, and the module 210 electrically connected in the electronic component connecting connector 100 is electrically conductive on substantially the entire circumference. It is covered with a member having the property.

[0130] Therefore, E Ml and the like can be prevented as much as possible in the electronic component connecting connector 100 to which the module 210 is connected.

[0131] In the electronic component connecting connector 100 containing the module 210, when removing the module 210, the module 210 can be removed from the electronic component connecting connector 100 simply by rotating the cover member 160 in the opening direction. Can be withdrawn.

[0132] Further, when removing the module 210 from the electronic component connector 100, The latching piece 216 of the module cover 214 is brought into contact with the push-out tongue 180 of the cover member 160 until it is detached from the opening 110.

Therefore, the module 210 can be grounded to the GND land of the substrate through the cover member 160 shield case 134 until it is pushed out from the electronic component connecting connector 100 and is completely removed. Thus, when static electricity is generated when the module 210 is removed, the static electricity can be passed to the ground portion of the board until the module 210 is completely disconnected.

[Embodiment 2]

8 is a diagram showing the configuration of the electronic component connecting connector according to Embodiment 2 of the present invention, FIG. 9 is a diagram showing the electronic component connecting connector into which the module is inserted, and FIG. 10 is a cover member that connects the module. It is a figure which shows the connector for electronic component connection of the state which closed.

Similar to the electronic component connecting connector 100 of the first embodiment, the electronic component connecting connector 300 of the second embodiment includes an electronic component, here, a module 210 to which the optical waveguide 200 is attached. The connector body 330 is removably connected and accommodated in the opening 310 (see FIG. 9).

[0136] The connector 300 for connecting an electronic component covers the module 210 accommodated in the opening 310 with a cover member (cover) 360 pivotally attached to the connector main body 330 so as to be openable and closable. Shield and protect the magnetic field.

[0137] As with the electronic component connecting connector 100 of Embodiment 1, the module 210 is fitted into the electronic component connecting connector 300 by being inserted into the opening 310 of the electronic component connecting connector 300. . As a result, the connection terminal portion 215 (see FIG. 1) of the module 210 is connected to the socket contact portion (contact terminal) 120 of the electronic component connecting connector 300.

[0138] This electronic component connecting connector 300 is compared with the electronic component connecting connector 100 in the configuration of the cover member 160 of the electronic component connecting connector 100 and the shield case (shield portion) 134 of the connector main body 110. Only the configuration is different, and the other configurations have the same configuration. Accordingly, the details of the same configuration in the electronic component connecting connector 300 are denoted by V, the same name and the same reference numeral, and the description thereof is omitted. [0139] Also in the second embodiment, as in the first embodiment, the surface on which the electronic component connecting connector 100 is mounted on the substrate is the bottom surface, and the direction in which the optical waveguide 200 is attached to the module 210 is The tip direction. The electronic component is not limited to a module with an optical waveguide, and may be a module including an electric wire, a cable, a flexible cable, or an optical fiber.

[0140] The electronic component connecting connector 300 shown in Fig. 8 includes a skirt portion (the same as the skirt portion 170) in the connector main body 330 having an opening 310 into which the module 210 (see Fig. 9) is fitted. A cover member 360 having a terminal covering portion 370 is pivotally attached to the connector body 330. The cover member 360 covers the module 210 (see FIG. 9) fitted into the connector main body 330 in the opening 310 by being inserted into the opening 310.

[0141] As shown in FIG. 8, the connector main body 330 includes a housing (nozzle part) 132 having an opening 310, and a module 210 arranged around the housing 132 and fitted in the opening 310 (FIG. 9). And a shield case (shield part) 334 for shielding.

The housing 132 is the same as the housing 132 of the electronic component connecting connector 100 in the first embodiment. That is, in the connector main body 330, the housing 132 includes a front wall 142 in which a lead-out path 130c is formed between the distal end portions of the pair of side wall portions 138 and 140, and the proximal end portion between the proximal end portions. In this case, a stagger section 143 (see Fig. 10) is installed.

[0143] The bottom surface portion 136, the pair of side wall portions 138, 140 and the front wall portion 14 of the housing 132 are provided.

As in the case of the opening 110, the opening 310 is defined to have a groove shape that opens upward and communicates with the lead-out path 103c on the distal end side.

[0144] Further, each of the opposing surfaces 138a, 140a of the side wall portions 138, 140, that is, the opening 31

As in the first embodiment, socket contact portions (contact terminals) 120 are disposed on each of the 0 opposing inner wall surfaces.

[0145] The housing 1 of the socket contact portion 120 in the connector 300 for connecting electronic components 1

Since the mounting state with respect to 32 and the connection state with the module 210 inserted into the opening 310 of the connector main body 330 are the same as those of the electronic component connecting connector 100, the description thereof is omitted. [0146] In addition, a communication groove communicating with the front end side of the connector main body 330 is formed in the front wall 142 as in the first embodiment, and the optical waveguide of the module 210 (see Fig. 9) is formed by the communication groove. A lead-out path 130c of the lead-out portion that leads 200 (see FIG. 9) outward is formed.

[0147] Shield case 334 is formed of a conductive member having electrical conductivity, similarly to shield case 134 of Embodiment 1, and here is formed by processing a metal plate. The shield case 334 is disposed so as to cover the outer peripheral force of the housing 132, and shields the module 210 accommodated in the opening 310 of the housing 132.

[0148] Compared to the shield case 134, the shield case 334 does not include the contact cover portions 134a and 134b that cover the upper surface portions 138b and 140b of the upper portion of the socket contact portion 120, but the upper plate portions 334a and 334b. The point which is newly prepared is different.

That is, as shown in FIGS. 8 to 10, the shield case 334 has a rectangular frame-like case similar to the case main body 134a on the outer peripheral portion of the housing 132 excluding the peripheral portion of the guide path 130c in the front wall portion 142. A main body 334c is provided.

[0150] The case body 334c surrounds the housing 132 from the side, and is fixed on the mounting substrate via a lead part 134c formed to extend from the lower side to the side. Similarly to the shield case 134, the shield case 334 is fixed to the board in a state of being electrically connected to the GND on the board side when the electronic component connecting connector 300 is mounted on the board via the lead part 134c. The

[0151] The upper plate portions 334a and 334b are formed on the upper side of the case body 334c, and the upper plate portions 334a and 334b are respectively formed on the upper surface portions 138b and 140b of the pair of side wall portions 138 and 140 of the nosing 132. It is arranged on both sides.

[0152] These upper plate portions 334a and 334b cover the upper surface portions 138c and 140 on the distal end side, which are lower in height than the upper surface portions 138b and 140b, and part of the upper surface portions 138d and 140d on the proximal end side.

In addition, when assembling the connector body 330 by fitting the shield case 334 from the upper surface side of the housing 132, the upper plate portions 334a and 334b are the upper surface portions 138c and 140 on the distal end side and the upper surface on the proximal end side. It contacts each of the parts 138d and 140d. Thereby, in the assembly work of the connector main body 330, the shield case 334 can be prevented from fitting more than necessary into the housing 132, and the assembly work can be easily performed. The module 210 (see FIG. 9) that fits into the opening 310 of the connector body 330 configured as described above is inserted from the opening direction of the opening 310 (above the connector body 330), and then the force bar By being covered with the member 360, it is fixed in a state of being electrically connected to the connector main body 330 (see FIG. 10).

[0155] The stopper portion 143 on the proximal end side of the connector main body 330 abuts on the base end portion side of the cover member 360 when the cover member 360 is opened at a predetermined angle with respect to the connector main body 330, and the cover member 360 Is held open at a predetermined angle.

[0156] The cover member 360 has the same basic configuration as the cover member 160, and the position of the pressing plate 369 is different from that of the cover member 160. The difference is that a suction surface 364 wider than the opening diameter of the suction nozzle is provided.

Therefore, in cover member 360, the same configuration as cover member 160 of Embodiment 1 has the same function, so the same name and the same reference numeral are given, and description thereof is omitted.

That is, the cover member 360 is made of a conductive member such as a conductive metal plate, and a pair of arm portions 362 that are rotatably attached to the connector main body 330 via the shaft portion 161. A cover upper surface portion 363 installed between the arm portions 362, a pressing plate portion 369 formed on the cover upper surface portion 363, and a skirt portion 370 formed on the arm portion 362.

[0159] The arm part 362 is the same as the arm part 162, and is attached to the connector main body 330 so as to be rotatable via a shaft part 161 at one end part 362a. The arm portion 362 covers both side surfaces of the connector main body 330 by rotating and closing the shaft portion 161 as a center.

[0160] Similar to the cover member 160 of the first embodiment, the arm portion 362 has the connector main body 330 when the cover member 360 is closed and positioned so as to cover both side surfaces of the connector main body 330. A locked portion 366 that engages with a locking portion 134e formed in the shield case 334 is provided.

[0161] That is, when the connector body 360 covers the connector main body 330, the locked portion (engaged portion) that is detachably engaged with the locking portion (engagement portion) 134e of the connector main body 330. 366. The locking portion 134e and the locked portion 366 are the same as the locking portion 134e and the locked portion 166, and detailed description thereof is omitted. That is, the locking portion 134e and the locked portion 366 are engaged to fix the cover member 360 to the connector main body 330 (see FIG. 10), and connect the arm portion 362 and the shield case 334 to conduct. Let The arm unit 362 is provided with an operation unit 167 in the same manner as the arm unit 162.

[0163] When the cover member 360 is closed with respect to the connector main body 330, the cover upper surface portion 363 is disposed on the upper portion of the connector main body 330, that is, on the upper portion of the housing 132. The cover upper surface portion 363 prevents the module 210 (see FIG. 9) fitted in the opening 310 from moving to the front surface side, that is, above the connector main body 330, similarly to the cover upper surface portion 163.

The cover upper surface portion 363 is formed in a flat plate shape that covers the upper surface of the connector main body 330, specifically, the entire upper surface of the housing 132.

As shown in FIG. 10, the cover upper surface portion 363 is formed with a surface to be attracted 364 that is a planar region wider than the opening diameter of the suction nozzle of the mounter, at a substantially central portion of the upper surface.

The attracted surface portion 364 is a portion that is attracted by a suction nozzle of a mounting device such as a mounter when the electronic component connecting connector 300 is mounted on a substrate using a mounting device such as a mounter.

[0167] Further, as shown in FIGS. 8 and 9, a central portion is provided on the back surface of the cover upper surface portion 363, that is, the surface side facing the upper surface of the module 210 accommodated in the electronic component connecting connector 300. The ribs 368a and 368b are provided so as to protrude therebetween.

[0168] The ribs 368a and 368b project downward from the back surface of the cover member 360, and regulate the position of the upper surface of the module 210 received in the opening 310.

Specifically, ribs 368a and 368b are formed to protrude from the back surface of cover upper surface portion 363 to the same degree, and have the same functions as ribs 168a and 168b of the first embodiment. The That is, when the cover member 160 is closed, the ribs 368a and 368b are in contact with the back surface of the module 210 that fits into the opening 110, and the module 210 is disposed substantially horizontally. The ribs 368a, 368bi, and the opening 210 can be placed in a suitable accommodation position.

[0170] In addition, the cover upper surface portion 363 is provided with a pressing plate portion 369 having the same function as the pressing plate portion 169, extending toward the tip side while being inclined downward. [0171] The holding plate portion 369 is formed integrally with the cover upper surface portion 360, and has a plate shape such as a plate panel and is flexible. The free end 369a of the holding plate 369 presses the module cover 214 having the conductivity of the module fitted into the opening 310 downward from the upper surface (back surface) of the module cover 214 (socket contact portion side). To do. Specifically, the pressing plate portion 369 is formed on the back surface of the cover upper surface portion 363 so as to be inclined downward with respect to the rib 368a from the adjacent portion on the tip side toward the tip side. Here, the pressing plate portion 369 is formed by notching a portion on the tip side of the upper surface portion 363 of the cover with respect to the portion where the rib 368a is formed and bending it downward. The length is shorter than the plate portion 16 9. The free end 369a at the tip of the pressing plate 369 comes into contact with the tip of the module force bar 214 of the module 210 when the module is accommodated in the opening 310.

It should be noted that an extruded tongue 380 similar to the extruded plate portion 180 of the first embodiment is formed on the base end side portion of the cover upper surface portion 363.

That is, the push-out tongue 380 is made of a plate-like member having a width substantially the same as the width of the opening 310, and the central force of the base end side portion of the cover upper surface portion 363 is also on the base end side of the connector main body 330. It is configured by extending and bending downward at a position adjacent to the base end of the arm portion 162. As a result, the free end of the distal end of the extruded tongue 380 is disposed on the proximal end side of the connector body 330 from the shaft 161.

[0174] The push tongue 380 is displaced about the shaft 161 as the cover member 360 is opened and closed, and the free end at the tip of the push-out tongue 380 can be projected and retracted in the opening 310.

That is, the push-out tongue 380 protrudes into the opening 310 and fits into the opening 310 when the cover member 360 is rotated at a predetermined angle or more with respect to the connector main body 330 by rotating in the opening direction. Push the combined module 210 to the opening side. The operation of the push-out tongue 380 is the same as the operation of the push-out tongue 180 in the first embodiment, and a description thereof will be omitted.

[0176] The skirt portion 370 of the arm portion 362 constitutes a cover member 360 having conductivity together with the arm portion 362, the cover upper surface portion 363, and the like. Note that the elements in the cover member 360 are electrically connected to each other.

[0177] The skirt portion 370 is the same as the skirt portion 170 of the first embodiment. sand That is, the skirt portion 370 covers the contact lead portion 120b with an upward force when the cover member 360 is closed with respect to the connector main body 330. On the other hand, when the cover member 360 is rotated in the opening direction with respect to the connector main body 330, the skirt portion 370 on the cover member 360 side is positioned above the contact lead portion 120b provided on the connector main body 330. Release the state of covering the force.

[0178] As shown in FIG. 10, the skirt portion 370 is disposed close to the contact lead portion 120b when the cover member 360 is closed with respect to the connector body 330, and is viewed from above. At this time, the contact lead 120b is not visually recognized and completely covers the contact lead 120b.

[0179] Next, a method of connecting the electronic component connecting connector 300 and the module with an optical waveguide will be described.

First, the cover member 360 of the electronic component connecting connector 300 is opened (see FIG. 8), and the optical waveguide 200 is inserted into the groove-shaped opening 310 of the connector body 330 exposed upward from above the connector body 330. Is inserted from the front side of the module 210, that is, from the board side (see FIG. 9).

[0181] When the cover member 360 is opened, the rotation position of the cover member 360 is restricted by the stagger portion 143 while the cover member 360 is opened at an angle of 90 ° or more with respect to the connector main body 330. Therefore, when the module 210 is inserted into the opening 310, the cover member 360 does not open too much and falls down with the back surface facing upward, and does not come into contact with other electronic components.

[0182] In the connector main body 330, the contact portion 120a is fitted in a state where the module 210 in the opening 310 is sandwiched, and is in a state of being securely in contact with the connection terminal portion 215 of the module 210.

[0183] After the module is fitted into the opening 310 of the connector main body 330, the cover member 360 is closed, the cover upper surface portion 363 is placed on the nosing 132, and the projection 134e of the shield case 334 and the cover member 360 are The cover member 360 is fixed to the connector main body 330 by engaging with the engagement hole 366.

[0184] As in the first embodiment, the module 210 is temporarily inserted into the opening 310, and the cover member 360 is closed to close the module 21 by closing the cover member 360. 0 may be fitted into the opening 310.

Thus, the module 210 is accommodated in the electronic component connecting connector 300 by closing the cover member 360 with respect to the connector main body 330, ie, covering the opening 310.

At this time, the pressing plate 369 shown in FIG. 9 presses the module 210 in the opening 310 in the same manner as the pressing plate 169.

[0187] Further, on the back of the module 210, the ribs 368a and 368b are pressed. For this reason

The module 210 is prevented from moving in the direction away from the opening 310, that is, the connector main body 330, and is accommodated in the opening 310 substantially horizontally without being inclined in the longitudinal direction.

[0188] Therefore, by simply closing the cover member 360, the module 210 can be reliably connected to the connector main body 330 that is in contact with the optical waveguide 200 or without being held at the contact portion. Fixed to. Therefore, the same effect as the electronic component connecting connector 100 can be obtained.

Further, in a state where the module 210 is mounted on the electronic component connecting connector 300, the module cover 214 is attached to the shield case 334 of the connector main body 330 via the cover member 360 in the same manner as the electronic component connecting connector 100. Conduct. The connector body 330 is mounted on the board by being joined to the GND land part of the board to be mounted via the lead part 134c of the shield case 334.

As a result, when the module 210 connected to the electronic component connecting connector 300 is operated, the noise generated by the operation of the module 210 is absorbed by the module cover 214 as in the case of the electronic component connecting connector 100. Conducted to the grounding portion of the substrate through the cover member 360 and the shield case 3 34. Thereby, noise leakage during the operation of the module 210 can be prevented.

[0191] At this time, in order to prevent noise leakage during operation of module 210, it is necessary to fix the lead part 134c of the shield case 334 connected to the grounding part without the need for wiring to prevent noise. Therefore, noise leakage can be prevented simply by mounting the connector body on the board. [0192] Further, according to the configuration of the electronic component connecting connector 300, a suction target surface portion having a plane that is equal to or wider than the opening diameter of the suction nozzle of the mounter is formed in the center of the upper surface of the cover upper surface portion 363 ( 364 to be adsorbed).

As a result, when the electronic component connecting connector 300 itself is mounted on the substrate, the suction surface portion 364 is adsorbed in a state of being preferably in close contact with the adsorption nozzle of the mounter, and the adsorbed adsorption nozzle can be covered. It can hold | maintain to an adsorption nozzle, without.

[0194] Therefore, the electronic component connecting connector 300 itself can be reliably moved to a desired position on the substrate for mounting. That is, it is possible to reduce mounting defects by the mounter.

[0195] In particular, with the miniaturization of module 210 and electronic component connecting connector 300 itself, even when the size of the suction nozzle used for mounting electronic component connecting connector 300 is limited, mounting defects are reduced. It will be mounted suitably while aiming at the key.

[0196] Also, when mounting the electronic component connecting connector 300 on the board, first, the cover member 360 is closed with respect to the connector body 330, and the locking hole 366 of the cover member 360 and the connector body 330 are locked. After engaging the portion 134e, the suction surface portion 364 can be sucked in a state where the suction nozzle is in close contact. As a result, when mounting the electronic component connection connector 300, the electronic component connection connector 300 that is sucked and securely held by the suction nozzle can be moved horizontally via the suction nozzle, so that the mounting position is easy. Can be moved to

[0197] The lead part 134c of the electronic component connecting connector 300 moved to the mounting position is fixed to the board. In this case, in the electronic component connecting connector 300 at this time, like the electronic component connecting connector 100, the skirt portion 170 is disposed close to the contact lead portion 120b of the connector main body 330.

[0198] Therefore, when joining the contact lead 120b to the pad of the board, the cover member 360 is laid down in the opening direction with respect to the connector main body 330 so that the opening 310 of the connector main body 330 is opened. To do.

Thereby, the contact lead part 120b of the connector body 330 can be exposed to the outside, particularly upward, and the board can be easily joined to the pad. [0200] Further, when the module 210 is connected after mounting, that is, when the module 210 of the connector main body 330 is covered with the cover member 160, the contact lead portions projecting left and right from both sides of the connector main body 330 120b is also covered with an upward force by a skirt portion 370 disposed at a position closest to the conductive member 120b.

[0201] With this configuration, even when a high-speed signal flows through the contact lead 120b during operation of the module 210 and noise is radiated from the contact lead 120b, the noise is close to the skirt disposed immediately above. Absorbed by 370. At this time, the contact lead portion 120b is completely covered by the upward force that is not covered by the skirt portion 370 when viewed from above.

[0202] That is, since the skirt portion 370 is provided on the cover member 360, the skirt portion 370 is grounded to the GND land of the mounting board via the cover member 360 and the lead portion 134c of the shield case 334 of the connector body 330. And

[0203] Therefore, in the electronic component connecting connector 300, when a high-speed signal flows through the contact lead portion 120b connected to the mounting board and the contact lead portion 120b emits noise, the noise is reduced to the skirt portion. It is grounded to the GND land of the board via 370. Therefore, the noise radiated from the contact lead portion 120b is absorbed by the skirt portion 370 and shielded to be reduced.

[0204] In other words, the skirt part 370 can prevent electromagnetic interference (EMI: Electro Magnetic Interference) due to radiation and propagation of electromagnetic noise (electromagnetic wave) leaking from the contact lead part 120b.

[0205] In the electronic component connecting connector 300, the resinous housing 132 containing the module 210 is covered with the shield case 334, and the entire upper surface is covered with the cover member 360. In other words, the cover upper surface portion 363 of the cover member 360 covers the module 210 and the portion made of the resin containing the module 210, that is, the portion exposed on the upper surface of the insulating housing 132, from the upper surface. To do.

[0206] Further, the contact lead portion 120b exposed to the outside is covered with the skirt portion 370.

That is, the module 210 electrically connected in the electronic component connecting connector 300 is: It is covered with a conductive member on substantially the entire circumference.

In particular, the upper surface side of the module 210 is covered and shielded entirely by the cover upper surface portion 363.

[0209] Therefore, E Ml and the like can be prevented as much as possible in the electronic component connecting connector 300 to which the module 210 is connected.

[0210] As described above, according to the electronic component connecting connector 300 of the second embodiment, the EMI generated by the operation of the module 210 can be prevented as much as possible, and even when mounted on the substrate, the attracted surface portion 364 It can be reliably adsorbed to the adsorbing nozzle of the mounter. Therefore, the mounter can be securely held, and the mounter can be surely moved onto the substrate and placed at a desired position, so that mounting defects can be reduced. Further, the connecting terminal portion 215 of the module 210 can be securely connected to the socket contact portion 120 by pressing the module 210 against the bottom surface 佃 J of the opening により with the holding plate 咅 369 and the jibs 368a and 368b. it can.

[0211] Since the contact lead part 120b whose upper part is covered with the skirt part 370 during use can be exposed upward by opening the cover member 360 when the electronic component connecting connector 300 is mounted. Mounting can also be performed easily.

[0212] Further, in the electronic component connecting connector 300 that accommodates the module 210, when the module 210 is removed by the push-out tongue 380, the cover member 360 can be rotated in the opening direction without the removal jig. The module 210 can be detached from the electronic component connecting connector 300.

[0213] (Embodiment 3)

FIG. 11 is a diagram showing a configuration of an electronic component connecting connector and an electronic component housed in the connector according to Embodiment 3 of the present invention, and FIG. 12 is a diagram showing the electronic component connecting connector and electronic component shown in FIG. It is the seen perspective view.

[0214] The electronic component connecting connector 400 according to the third embodiment has a socket contact portion (contact terminal) as compared to the configuration of the electronic component connecting connector 300 having the same basic configuration as the electronic component connecting connector 100. In addition to the increase in the number of positioning projections 460 (462, 464, 466), the other configurations are the same. So in the following The different constituent elements will be described, and the same constituent elements as those of the electronic component connecting connector 300 will be given the same names and reference numerals, and the description thereof will be omitted.

[0215] The electronic component connecting connector 400 accommodates the module 510 as an electronic component in the opening 310 of the connector main body 430, and is electrically connected to the connection terminal portion 215 of the module 510 by the socket contact portion 120. Connecting.

The module 510 accommodated in the electronic component connecting connector 400 is an electronic component to which the optical waveguide 200 is attached, like the module 210. The module 510 has basically the same configuration as the module 210 mounted on the electronic component connecting connector 100 of the first embodiment, and is inserted into the opening 410 of the electronic component connecting connector 400. The connector 400 is detachably fitted to the connector 400. As a result, the connection terminal portion 215 (see FIG. 11) of the module 410 is connected to the socket contact portion (contact terminal) 120 of the electronic component connecting connector 400.

[0217] This module 510 has the number of connection terminal portions 215 corresponding to the socket contact portion 120 and positioning compared to the module 210 to which the optical waveguide 200 accommodated in the connector 100, 300 for electronic component connection is attached. The only difference is that the grooves 560 (562, 564, 566) are provided, and the other configurations are the same.

[0218] In the third embodiment, as in the second embodiment, the surface on which the electronic component connecting connector 400 is mounted on the substrate is the bottom surface, and the direction in which the optical waveguide 200 is attached to the module 510 is the tip direction. To do.

First, the module 510 with the optical waveguide 200 accommodated in the electronic component connecting connector 400 will be described.

[0220] The module 510 here has a rectangular parallelepiped shape (more specifically, a flat plate shape), and the optical waveguide 200 is attached with an end surface force extending in the longitudinal direction of the module 510! /.

[0221] The module 510 is provided with more connection terminal portions 215 than the module 210 on both side surfaces extending in the longitudinal direction, and on the side closer to the tip than the arrangement position of the connection terminal portions 215. Positioning grooves 562 and 564 which are notched in the vertical and vertical directions. Further, the module 510 has a base end side positioning groove portion 566 cut out in the side and up and down directions on the base end surface. The width of module 510 and the bottom of positioning grooves 562 and 564 The distance between them is longer than the width of the optical waveguide 200 formed in a film shape.

[0222] Note that module 510 differs from module 210 in that it has positioning grooves 562 and 564 and positioning grooves 566 on the base end side and a large number of connecting terminal parts 215. The other basic configurations have the same configuration.

That is, the module 510 includes a substrate 512 on which one end of the optical waveguide 200 is bonded and an optical signal processing unit (not shown) that performs optical signal processing via the optical waveguide 200 is mounted. Module cover (exterior part 514) that covers the upper optical signal processing part (electronic component body) is provided. The optical signal processing part is the same as the optical signal processing part of the module 210, and has the same functions and effects. Description is omitted here.

The substrate 512 of the module 510 has a voltage (electrical current) converted by the optical signal processing unit on both side surfaces 512a adjacent to the mounting surface (not shown) and extending in the extending direction of the optical waveguide 200. The connection terminal part (electrode part) 215 for outputting a gas signal is arranged. These connection terminal portions 215 are provided so as to be exposed on both side surfaces 512a. Here, when the mounting surface of the substrate 212 is the rear surface (corresponding to the upper surface in FIG. 11), the front surface (z In the bottom side) and the side of the side, it is placed in a plurality of recesses that are open!

[0225] Note that these recesses are formed orthogonal to the surface portion of the film-like optical waveguide 200, and when electrically contacting the electronic component connecting connector 400, the module 510 is The front side force of 510 is connected by inserting. In other words, the module 210 is connected to the electronic component connecting connector 100 by being inserted in a substantially vertical direction from above.

[0226] Further, the concave portion of the substrate 512 communicates with the concave portion formed on the side surface of the module cover 514 in the vertical direction, so that the connection terminal portion 215 is connected to the side surface of the module 210 in the vertical direction and the lateral direction. It is the structure arrange | positioned in the recessed part opened in this. The configuration and function of the module cover 514 are the same as those of the module 214, and absorb the noise generated during the operation of the optical signal processing unit.

[0227] The module cover 514 includes a latching piece 216 formed in the same manner as the module 214. The function of the latch piece 216 is applied to the module cover 214 of the module 210. Since it is the same as that formed, description is omitted. The upper surface of the module cover 514 is formed with a reinforced roof portion 514a having a ridge protruding upward from the main body portion of the module cover 514 to the upper portion of the latch piece 216. 5 The hooking claw portion 216 overhanging on the base end side by 14a is reinforced to improve the strength.

[0228] Further, a roof portion 514b that protrudes upward and extends in the longitudinal direction is formed at the central portion of the upper surface portion of the module cover 214. The roof portion 514b is a portion that is pressed by the pushing tongue 369 of the cover member 360 when the module 510 is inserted into the opening 410 and the cover member 360 is closed.

[0229] The module 510 configured as described above is fitted into the opening 410 of the electronic component connecting connector 100 that opens upward, whereby the connection terminal portion 215 of the electronic component connecting connector 100 is Connect to socket contact (contact terminal) 120.

[0230] The electronic component connector 400 covers the module 510 accommodated in the opening 410 with a cover member 360 pivotally attached to the connector body 430 so as to be openable and closable, thereby shielding an electric field and magnetic field from the outside. Protect.

[0231] An electronic component connecting connector 400 shown in FIG. 11 includes a cover member provided with a skirt portion 370 having a function similar to that of the skirt portion 170 in a connector main body 430 having an opening 410 into which the module 510 is fitted. The 360 is pivotally attached to the connector body 330.

[0232] The cover member 360 covers the module 510 (see FIG. 9) fitted into the connector body 330 in the opening 310 by being inserted into the opening 310.

As shown in FIG. 11, the connector main body 430 has basically the same configuration as the connector main body 330, and is disposed around the housing (nozzle part) 432 having an opening 410, and around the housing 432. A shield case (shield portion) 334 that shields the module 510 fitted in the opening 410.

The housing 432 has positioning protrusions 460 (462, 464, 466) in addition to the configuration of the housing 132 of the electronic component connecting connector 300.

[0235] Specifically, the housing 432 of the connector main body 430 has a pair of side wall portions 138 and 140 that are erected on both sides of the bottom surface portion 136 so as to face each other along the both side portions. Positioning protrusions 462 and 464 forces S are provided on each of the facing surfaces (only the facing surface 140a is shown in FIG. 11).

[0236] The positioning protrusions 462 and 464 project on opposite surfaces facing each other (only the facing surface 140a is shown in the drawing) in a facing direction. The positioning protrusions 462 and 464 each form a protrusion extending in the insertion direction, and the upper surface is exposed upward. The positioning protrusions 462, 464ί and the module 510 are fitted into the positioning grooves 562, 564 of the module 510 having the opening 510 fitted therein.

[0237] Further, between the base end portions of the pair of side wall portions 138, 140 constituting the base end portion of the connector main body 430, an inner wall surface facing the rear end surface of the module 510 accommodated in the opening portion 410 is provided. A waist wall portion 430a having a lower height than the pair of side wall portions is interposed. The waist wall portion 430a is provided with a proximal-side positioning protrusion 466 that protrudes from the inner wall surface toward the distal end side, extends in the insertion direction on the bottom surface portion 136, and exposes the upper surface upward. ing.

[0238] This proximal-side positioning protrusion 466 is similar to the positioning protrusions 462 and 464 that fit into the positioning grooves 562 and 564 of the module 510, and the proximal-side positioning groove of the module 510 that fits into the opening 410. Fits 566.

[0239] Note that a front wall 142 in which a lead-out path 130c is formed is interposed between the distal end portions of the pair of side wall portions 138, 140, and a stagger portion 143 is provided between the proximal end portions. (See Fig. 12).

[0240] Further, the pair of side wall portions 138 and 140 are opposed surfaces (only the opposed surface 140a is shown in FIG. 11) on which the positioning protrusions 462 and 464 are formed, and are opened together with the bottom surface portion 136 and the front wall portion 142. 4 10 is defined as a groove that communicates with the lead-out path 130c on the tip side and opens upward.

[0241] In addition, each of the opposing surfaces of the pair of side wall portions 138, 140 (only the opposing surface 140a is shown in FIG. 11), that is, each of the opposing inner wall surfaces of the opening 410 is connected to an electronic component connecting connector. As with the Kuta 300, a socket contact portion (contact terminal) 120 is provided.

[0242] The mounting state of the socket contact portion 120 in the electronic component connection connector 400 to the housing 4 32 and the connection state of the socket contact portion 120 to the connection terminal portion 215 of the module 510 are as follows. Since it is the same as 100 and 300, the explanation is Omitted.

[0243] Also, like the electronic component connecting connector 300, the front wall 142 is formed with a communication groove that communicates with the distal end side of the connector main body 430. By this communication groove, the module 510 (see FIG. 11) is formed. The lead-out path 13 Oc of the lead-out portion for leading the optical waveguide 200 (see FIG. 11) to the outside on the front end side is formed.

[0244] The shield case 334 covering the housing 432 configured as described above has the same components as the shield case 334 of the electronic component connecting connector 300 and functions by these components, and the description thereof will be omitted.

[0245] Further, the stopper portion 143 and the cover member 360 on the proximal end side of the connector main body 430 are the same as the stopper portion 143 and the cover member 360 of the electronic component connecting connector 300. Since it has an effect, description is abbreviate | omitted.

[0246] When the module 510 with the optical waveguide 200 is connected to the electronic component connecting connector 400 configured as described above, first, the cover member 360 of the electronic component connecting connector 400 is opened. When the cover member 360 is opened, the rotation position of the cover member 360 is restricted by the stagger portion 143 when the cover member 360 is opened at an angle of 90 ° or more with respect to the connector main body 330. Therefore, when the module 210 is inserted into the opening 310, the cover member 360 does not open too much and falls down with the back surface facing upward, and does not come into contact with other electronic components.

Then, the module 510 to which the optical waveguide 200 is connected is inserted into the groove-shaped opening 410 of the connector main body 430 exposed upward from the bottom side of the module 510, that is, from the substrate 512 side.

At this time, in the module 510, the positioning groove portions 562 and 564 correspond to the positioning protrusions 462 and 464 of the electronic component connecting connector 400, and the base end side positioning groove portion 566 is connected to the electronic component connecting connector. It is inserted into the opening 410 while corresponding to the base end side positioning projection 466 of 400.

[0249] Then, the positioning groove 562, 564 is externally fitted to the positioning protrusions 462, 464, while the proximal positioning groove 566 is externally fitted to the proximal positioning protrusion 466, so that the module 510 is in the opening 410. Is housed.

[0250] Thus, according to the electronic component connecting connector 400 of the third embodiment, the opening 410 is formed. At least one of the wall portions of the partitioning connector main body 430 protrudes toward the opening 410, and positioning grooves 562, 564 and a base end formed on the outer periphery along the insertion direction in the module 510 accommodated in the opening 410 Positioning projections 462 and 464 and a proximal-side positioning projection 466 that fit into the side positioning groove 566 are provided. As a result, the connector main body 430 is fitted with the positioning projections 462 and 464, the proximal-side positioning projection 466, the positioning grooves 562 and 564, and the proximal-side positioning groove 566, so that only the module 510 is placed in the opening 410. It is formed to accommodate.

Therefore, in the electronic component connecting connector 400, the positioning groove portions 562, 564 and the base end side positioning groove portion 566 are fitted into the positioning protrusions 462, 464 and the base end side positioning protrusion portion 466, and the module. 510 can be inserted into the opening 410.

[0252] Therefore, the positioning protrusions 462, 464 and the proximal-side positioning protrusion 466 can fit the module 510 in a state in which the module 510 is preferably guided and accurately positioned. . That is, in the electronic component connection connector 400, when the module 510 is inserted and connected, the connection terminal portion 215 of the module 510 and the socket contact portion 120 corresponding to each other can be accurately connected without being shifted.

[0253] In addition, the positioning projections 462 and 464 and the proximal-side positioning projection 466 are formed so that the electronic component connecting connector 40 can accommodate only the module 510 in the opening 410 of the connector main body 430. And

[0254] Thus, an electronic component connecting connector having basically the same configuration as the electronic component connecting connector 400 is prepared together with the electronic component connecting connector 400, and these electronic component connecting connectors are respectively provided. Even when the accommodated modules are connected by the optical waveguide 200 and used as the transmission side and the reception side, only the modules corresponding to each other are accommodated.

[0255] Specifically, the positioning protrusions 460 (positioning protrusions 462, 464 and proximal positioning protrusions 466) in the electronic component connecting connector 400 are positioning protrusions of the mating electronic component connecting connector. It is formed at a position different from the part.

[0256] For example, the electronic component connection connector 400 and the module 510 are used as a transmission side connector set, and as a reception side connector set, the module 700 shown in FIG. It is configured to be used with the connector 600 for use.

[0257] The electronic component connecting connector 600 shown in FIG. 13 has the same basic configuration as the electronic component connecting connector 400, and the positioning protrusion 460a having the same function as the positioning protrusion 460a is arranged at the position. Different. Further, in the module 710 accommodated in the electronic component connecting connector 600, the positioning groove 560 is disposed at a position different from that of the module 510, and is formed at a position corresponding to the positioning projection 660.

[0258] The electronic component connecting connector 600 and the module 710 differ only in the configuration of the positioning protrusion and the positioning groove, and the other basic configurations are substantially the same as the electronic component connecting connector 400 and the module 510. About the same structure, it has the same effect as the thing in the connector 400 for electronic component connection. Therefore, only different configurations will be described, and the same components are denoted by the same reference numerals and description thereof will be omitted.

In this electronic component connecting connector 600, the positioning protrusions 460a (467, 468) are a pair of erected on the housing 432 of the connector body 430 so as to face each other along both sides of the bottom surface 136. The side walls 138 and 140 are provided respectively.

[0260] The positioning protrusions 467 and 468 of the electronic component connecting connector 600 are directed in the opposite direction to the opposing surfaces (only the opposing surface 140a is shown in FIG. 13) of the pair of side wall portions 138 and 140, respectively. It protrudes with force. The positioning protrusions 467 and 468 each form a protrusion extending in the insertion direction, and the upper surface is exposed upward. These positioning protrusions 467 and 468 are positions shifted in the longitudinal direction of the opening 410, that is, in the front-rear direction, in the housing 432 formed in substantially the same manner as the positioning protrusions 462 and 464 of the connector 400 for connecting an electronic component. It is formed!

These positioning protrusions 467 and 468 are fitted in the positioning grooves 567 and 568 of the module 710 fitted in the opening 610.

[0262] Unlike the electronic component connecting connector 400, the electronic component connecting connector 600 is not provided with a positioning projection corresponding to the proximal end positioning projection 466. Accordingly, the positioning groove corresponding to the proximal positioning groove 566 is not provided on the proximal side of the module 710.

[0263] The electronic component connecting connector 400 shown in FIG. 11 and FIG. Modules 510 and 710 respectively connected to both ends of the optical waveguide 200 are accommodated in the electronic component connecting connector 600 shown in FIG. As a result, the substrates on which the electronic component connecting connectors 400 and 700 are mounted can be connected via the optical waveguide 200.

[0264] When such a structure is assembled, positioning protrusions 460 and 460a corresponding to the modules 510 and 710 corresponding to the electronic component connecting connectors 400 and 600, respectively, are formed. Therefore, the module 710 cannot be inserted and accommodated in the electronic component connecting connector 400, and the module 510 cannot be inserted and accommodated in the electronic component connecting connector 700.

[0265] Therefore, when the electronic component connection connectors 400 and 600 are used in pairs, the modules 510 and 710 accommodated in the electronic component connection connector that is the signal transmission destination via the optical waveguide are erroneously attached to each other. Can be prevented.

As described above, in the electronic component connecting connector 400 according to the present embodiment, the positioning protrusions 462 and 464 and the base end side positioning protruding portion 466 are other than the transmission partner side of the electronic component connecting connector 400. It is formed at a position different from the positioning protrusions 467 and 468 of the electronic component connecting connector 700 of FIG.

In other words, the positioning protrusions 462 and 464 and the proximal-side positioning protrusion 466 have the same basic configuration as the electronic component connecting connector 400 in the electronic component connecting connector 400. The other electronic component connecting connector 600 used in a pair with the electronic component connecting connector 400 forms a different opening shape.

That is, in the electronic component connecting connector 400, a signal optical waveguide (transmission member) 200 is extended on one side of the module 510, and the optical waveguide 200 is connected to another module at the end of the extension side. Connected to 710. The connector main body 430 of the electronic component connecting connector 400 is formed in communication with the opening 410, and leads the optical waveguide 200 extended from the module 510 accommodated in the opening 410 to the outside of the connector main body 430. It has a front wall portion (lead-out portion) 142 in which a lead-out path 130c is formed. The positioning protrusions 462 and 464 and the proximal-side positioning protrusion 466 are formed so as to accommodate only the opening 430 of the connector main body 430 and the module 510. [0269] Thus, according to the electronic component connecting connector 400, it is possible to prevent a module other than the corresponding module 510 (here, the module 710) from being mounted by mistake.

[0270] In the present embodiment, the positioning protrusions that fit into the positioning grooves formed along the insertion direction in the module 510 accommodated in the opening 410 are provided on the opposing surface 140a and the waist wall 430a of the housing. Force provided to be provided Not limited to this, as long as at least one of the wall portions of the connector main body 430 that partitions the opening 410 protrudes toward the opening 410 and fits in the positioning groove of the module 510. Any position may be provided.

[0271] For example, in the configuration of the electronic component connecting connector 400, the base-side positioning protrusions 466 are not provided, and the opposing surfaces of the pair of side wall portions 138, 140 are opposed to each other (the opposing surfaces 140a in FIG. 11). (Only shown) may be provided with positioning protrusions 462 and 464, respectively. Alternatively, the positioning protrusion force module may be provided on only one of the opposing surfaces of the inner peripheral surface that partitions the opening for housing the module. In any configuration, it goes without saying that the positioning protrusion formed on the wall surface that partitions the opening of the electronic component connecting connector corresponds to the positioning groove of the module 510 accommodated in the opening.

[0272] The effects of the other components in the electronic component connecting connector 400 are the same as those of the components similar to those of the electronic component connecting connector 300, and thus the description thereof is omitted.

[0273] According to the present embodiment, the connector main body that is electrically connected to the accommodated electronic component and is mounted on the substrate, and the connector main body is led out to the side of the connector main body. The lead terminal portion that is joined to the conductor on the substrate, the conductive cover portion that covers the connector main body from above, and the lead terminal that is provided on the cover portion and joined to the conductor And an electrically conductive terminal covering portion covering the portion from above. As a result, the lead terminal portion joined to the conductor is covered from above by the conductive terminal covering portion. For this reason, even if the operating frequency of the signal flowing through the lead terminal portion becomes high and electromagnetic noise that causes electromagnetic interference (EMI) occurs, the electromagnetic noise can be absorbed by the terminal covering portion.

[0274] Therefore, noise emission can be reduced when the electronic component is driven by being connected to the substrate via the connector. [0275] Also, according to the present embodiment, the electronic component is housed in an opening formed by opening upward in the connector body, and the cover portion covers the connector body from above. The opening is covered, and the terminal covering is formed on the lead terminal when the force bar is attached to the connector body and covers the opening in the cover. It may be rubbed so that it is provided in the part arrange | positioned closely along a terminal part. As a result, since the terminal covering portion is disposed close to the lead terminal portion, it is possible to efficiently absorb the noise generated by the lead terminal portion and to reduce the noise radiation of the lead terminal portion.

[0276] Also, according to the present embodiment, the cover portion is pivotally attached to the connector main body so as to be opened and closed, and the terminal covering portion rotates in the opening direction of the cover portion. Accordingly, it is preferable to move away from the lead terminal portion. As a result, the covering state of the lead terminal portion by the terminal covering portion can be released by opening and closing the cover portion.

That is, when the cover part is opened, the lead terminal part is exposed upward, so when mounting the connector main body on the board, the cover part is opened with respect to the connector main body and the lead terminal The part can be easily joined to the conductor of the substrate. By connecting the lead terminal part and the conductor of the board, the electronic part connector is mounted on the board, and then the electronic part is accommodated and the cover is closed to connect the electronic part connector to which the electronic part is connected. In the case, the lead terminal portion can be covered with the terminal covering portion.

[0278] Also, according to the present embodiment, it is preferable that the terminal covering portion has a horizontal plate shape horizontally disposed on the upper surface of the lead terminal portion. According to the present embodiment, it is preferable that the terminal covering portion covers the entire surface of the lead terminal portion when the connector main body is covered by the cover portion. Furthermore, it is preferable that the cover portion has a suction surface equal to or larger than the opening diameter of the suction nozzle of the mounter at the center of the upper surface.

[0279] Accordingly, since the suction target flat surface is provided in the center portion of the upper surface of the cover member, the cover member is attracted to the suction nozzle of the mounter, thereby adsorbing the cover member in a state of being closely adhered to the central portion of the upper surface. be able to. This allows you to use the mounter on the board. When mounted, the suction nozzle force that is sucked is held by the suction nozzle without deviation, and can be mounted by moving it to a desired position on the substrate. That is, it is possible to reduce mounting defects by the mounter.

[0280] According to the present embodiment, it is preferable that the cover portion has an engaged portion that is detachably engaged with the engaging portion of the connector main body when the connector main body is covered. . As a result, when mounting on the substrate, the engaging portion and the engaged portion can be engaged with each other. Therefore, after the two are engaged, the surface to be attracted is adsorbed to the adsorption nozzle of the mounter. Can be implemented. As a result, the cover part and the connector main body covered with the cover part can be moved integrally, and when the cover part is detachably attached to the connector main body, the mounting work can be easily performed. it can.

[0281] Further, the cover portion has conductivity, and when the opening is covered, the electronic component housed in the opening is pressed to change the connection state of the electronic component and the connector body. It is preferable to provide a pressing part to be held. As a result, when the connector main body is covered with the cover, the electronic component housed in the opening and the connector main body are securely connected to each other, while static electricity is charged to the electronic component and electromagnetic waves generated during the operation of the electronic component. Noise can be absorbed and reduced through the cover. Therefore, noise emission can be reduced when the electronic component is driven by being connected to the board via the connector.

[0282] Further, it is preferable that the cover portion has a protrusion that protrudes downward from the back surface and restricts the upper surface position of the electronic component housed in the opening. As a result, the electronic component can be arranged at a suitable accommodation position in the opening.

In the present embodiment, the module connected to electronic component connecting connector 100 has been described as a module with an optical waveguide. However, the present invention is not limited to this, and an optical signal without an optical waveguide is converted into an electrical signal. It can be applied to processing modules (electronic components), and transmission media that transmit electrical signals other than optical waveguides, such as electric wires, cables, flexible cable signal processing modules (electronic components), etc. Alternatively, a connector for connecting a module that performs signal processing via a transmission member that transmits an electrical signal may be used.

[0284] Japanese Patent Application 2006-209182 filed on July 31, 2006, issued on November 29, 2006 The contents of the description, drawings, and abstract contained in the Japanese application of the application 2006—322355 and the international application of March 2007 300 © PCT / JP2007 / 0 57212 are all incorporated herein by reference.

Industrial applicability

The connector for connecting an electronic component according to the present invention has an effect of reducing noise emission when the electronic component is driven by being connected to a substrate via the connector, and can be miniaturized and has a large amount of signal transmission. It is useful as a connector for connecting an electronic component having a transmission member.

Claims

The scope of the claims

[1] A connector main body that is electrically connected to a housed electronic component and is mounted on a board; and is disposed on the connector main body so as to be led out to a side of the connector main body. A lead terminal portion to be joined;

A conductive cover portion covering the connector body with an upward force;

A conductive terminal covering portion provided on the cover portion and covering the lead terminal portion joined to the conductor with an upward force;

A connector for connecting an electronic component.

[2] The electronic component is accommodated in an opening formed by opening upward in the connector body,

The cover portion covers the opening by covering the connector body with an upward force, and the terminal covering portion is formed in the cover portion when the cover portion is attached to the connector body and covers the opening. 2. The electronic component connecting connector and connector according to claim 1, wherein the electronic component connecting connector and the connector are provided on a portion of the lead terminal portion and adjacently disposed along the lead terminal portion.

[3] The cover portion is pivotally attached to the connector body so as to be freely opened and closed.

3. The electronic component connecting connector according to claim 2, wherein the terminal covering portion moves with the rotation of the cover portion in the opening direction and moves away from the lead terminal portion.

[4] The connector for connecting an electronic component according to claim 1, wherein the terminal covering portion is in the form of a horizontal plate horizontally disposed on the upper surface of the lead terminal portion.

5. The electronic component connecting connector according to claim 1, wherein when the connector main body is covered by the cover portion, the terminal covering portion covers the entire surface of the lead terminal portion.

6. The connector for connecting an electronic component according to claim 1, wherein the cover portion includes a suctioned flat surface portion that is equal to or wider than the opening diameter of the suction nozzle of the mounter at the center portion of the upper surface.

7. The electronic component connecting connector according to claim 6, wherein the cover portion has an engaged portion that is detachably engaged with the engaging portion of the connector body when the connector body is covered.

[8] The cover portion has conductivity, and when the opening is covered, the opening 3. The electronic component connecting connector according to claim 2, further comprising a pressing portion that presses the electronic component housed in a portion to hold a connection state of the electronic component and the connector main body.

9. The electronic component connecting connector according to claim 2, wherein the cover portion has a protrusion that protrudes downward from the back surface and restricts an upper surface position of the electronic component housed in the opening.

[10] At least one of the wall portions of the connector main body that partitions the opening portion protrudes toward the opening portion, and is formed on the outer periphery along the insertion direction in the electronic component housed in the opening portion. Protrusions that fit into the grooves are provided,

3. The connector for connecting an electronic component according to claim 2, wherein the connector main body accommodates only the electronic component in the opening by fitting the protrusion and the groove.