KR20220138827A - Substrate Connector - Google Patents

Abstract

The present invention relates to a substrate connector, which may comprise: a plurality of radio frequency (RF) contacts which transmit an RF signal; an insulating part to which the RF contacts (110) are coupled; a cover which is coupled to the insulating part; an inner shell which is inserted into the cover; and a shield plate which is coupled to the inner shell. The inner shell is coupled to the cover to be disposed on the front side of the substrate. One side of the shield plate is coupled to the inner shell and the other side is grounded through a first substrate, to realize a downward shielding force for the RF contacts.

Description

Substrate Connector

The present invention relates to a board connector installed in an electronic device for electrical connection between boards.

In general, a connector is provided for various electronic devices for electrical connection. For example, the connector is installed in an electronic device such as a mobile phone, a computer, a tablet computer, and the like, so that various parts installed in the electronic device can be electrically connected to each other. A board connector is a connector which electrically connects a board|substrate and a board|substrate. Such a board connector may be implemented as a board connector for connecting boards arranged perpendicular to each other according to an installation environment.

1 is a schematic perspective view showing a board connector according to the prior art.

Referring to FIG. 1 , a board connector 10 according to the prior art includes a contact 11 , an insulating part 12 to which the contact 11 is coupled, and a shell 13 coupled to the insulating part 12 . can do. The contact 11 is to be connected to the mating connector 20 . The contact 11 may be connected to the mating connector 20 while being mounted on a substrate (not shown). Accordingly, the substrate and the counterpart substrate (not shown) on which the counterpart connector 20 is mounted may be electrically connected.

The mating connector 20 may include a mating contact 21 , a mating insulator 22 to which the mating contact 21 is coupled, and a mating shell 23 to which the mating insulated part 22 is coupled.

The counter contact 21 may be connected to the contact 11 while being mounted on the counter substrate. Accordingly, the substrate and the counter substrate may be electrically connected to each other.

On the other hand, in recent years, as electronic devices are gradually miniaturized, there is a demand for miniaturization of the coupling structure between the board connector and the board installed in the electronic device. ) is being actively developed to implement it.

Here, the board connector 10 according to the prior art has a structure that is alternatively disposed on the upper side of the board or the lower side of the board. For example, when the board connector 10 according to the prior art is mounted through the upper surface of the board, the contact 11 , the insulating part 12 , and the shell 13 are all disposed on the upper side of the board.

Accordingly, since the overall height of the coupling structure of the board connector 10 and the board according to the prior art increases as much as the thickness of the board, there is a problem in that the miniaturization of the product is inhibited. deepens

The present invention has been devised to solve the above-described problems, and to provide a board connector capable of reducing the hindrance in downsizing a product due to the thickness of the board.

In order to solve the above problems, the present invention may include the following configuration.

The board connector according to the present invention includes a plurality of RF contacts for transmitting an RF (Radio Frequency) signal; an insulating part to which the RF contacts are coupled; a cover coupled to the insulating part; an inner shell inserted into the cover; and a shield plate coupled to the inner shell. The inner shell may be coupled to the cover to be disposed on the front side of the substrate. One side of the shield plate is coupled to the inner shell and the other side is grounded through the substrate to implement a downward shielding force for the RF contacts.

According to the present invention, the following effects can be achieved.

The present invention is implemented so that the lower wall of the cover can be omitted by using the inner shell inserted into the cover. Therefore, the present invention can contribute to miniaturization by reducing the height by the thickness of the wall under the cover.

The present invention is implemented such that the inner shell and the insulating portion are positioned below the substrate by disposing the inner shell in front of the substrate. Accordingly, the present invention can contribute to miniaturization by reducing the increase in the overall height of the product due to the substrate.

The present invention can implement a lower shielding force for RF contacts by using a shield plate. Accordingly, the present invention realizes a low profile through a structure in which the inner shell is disposed in front of the substrate, and reduces the RF signal leaking downward through the space between the inner shell and the substrate, thereby reducing the lower shielding performance of the RF contacts. it can be prevented

1 is a schematic perspective view of a board connector according to the prior art;
Figure 2 is a schematic perspective view showing a state before being combined with a counterpart connector in the board connector according to the present invention;
3 is a schematic side view showing a state before being combined with a counterpart connector in the board connector according to the present invention;
4 is a schematic exploded perspective view of a board connector according to the present invention;
5 is a schematic perspective view of an inner shell of a board connector according to the present invention;
6 is a schematic perspective view of a shield plate of a board connector according to the present invention;
FIG. 7 is a schematic side cross-sectional view taken along line II of FIG. 2 ;
8 is a schematic side cross-sectional view showing an enlarged portion A of FIG. 7 in the board connector according to the present invention;
9 is a schematic side cross-sectional view showing an enlarged portion B of FIG. 7 in the board connector according to the present invention;
10 is a schematic side cross-sectional view showing an enlarged portion C of FIG. 7 in the board connector according to the present invention;
11 is a schematic front cross-sectional view taken along line II-II of FIG. 3;
12 is a schematic front cross-sectional view taken along line III-III of FIG. 3;
13 is a schematic front sectional view showing an enlarged portion D of FIG. 12 in the board connector according to the present invention;
14 is a schematic exploded perspective view of a mating connector to which the board connector according to the present invention is coupled;
15 is a schematic side view showing a state in which a board connector according to the prior art is combined with a counterpart connector;

Hereinafter, an embodiment of a board connector according to the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 , the board connector 100 according to the present invention may be installed in an electronic device (not shown) such as a mobile phone, a computer, or a tablet computer. The board connector 100 according to the present invention may be used to electrically connect a plurality of boards. The substrates may be printed circuit boards (PCBs). For example, in the case of electrically connecting the first substrate 100A and the second substrate 200A as shown in FIG. 3 , the board connector 100 according to the present invention is mounted on the first substrate 100A. It is connected to the counterpart connector 200 mounted on the second substrate 200A to electrically connect the first substrate 100A and the second substrate 200A. The first substrate 100A and the second substrate 200A may be disposed perpendicular to each other. For example, as shown in FIG. 3 , the mating connector 200 is inserted into the board connector 100 according to the present invention in a state in which the first substrate 100A and the second substrate 200A are disposed perpendicular to each other, thereby electrically can be connected The board connector 100 according to the present invention may be implemented as a receptacle connector. The board connector 100 according to the present invention may be implemented as a plug connector. When the board connector 100 according to the present invention is implemented as a receptacle connector, the mating connector 200 may be implemented as a plug connector. When the board connector 100 according to the present invention is implemented as a plug connector, the mating connector 200 may be implemented as a receptacle connector. Hereinafter, an embodiment in which the board connector 100 according to the present invention is implemented as a receptacle connector will be described, but it is the present invention to derive an embodiment in which the board connector 100 according to the present invention is implemented as a plug connector. It will be apparent to those skilled in the art.

2 to 5 , the board connector 1 according to the present invention may include a plurality of RF contacts 110 , an insulating part 120 , a cover 130 , and an inner shell 140 .

The RF contacts 110 are for transmitting a radio frequency (RF) signal. The RF contacts 110 may transmit a very high frequency RF signal. The RF contacts 110 may be supported by the insulating part 120 . The RF contacts 110 may be coupled to the insulating part 120 through an assembly process. The RF contacts 110 may be integrally molded with the insulating part 120 through injection molding. The RF contacts 110 may be disposed to be spaced apart from each other based on the first axis direction (X-axis direction). The RF contacts 110 may be electrically connected to the first substrate 100A by being mounted on the first substrate 100A. The RF contacts 110 are connected to the RF contacts of the counterpart connector 200 (shown in FIG. 3), so that the second substrate 200A on which the counterpart connector 200 is mounted (shown in FIG. 3) can be electrically connected to. Accordingly, the first substrate 100A and the second substrate 200A may be electrically connected.

The insulating part 120 is to which the RF contacts 110 are coupled. The RF contacts 110 may be supported on the insulating part 120 . The insulating part 120 may be coupled to the cover 130 so that the RF contacts 110 are located inside the cover 130 .

The cover 130 is coupled to the insulating part 120 . The cover 130 may accommodate the insulating part 120 therein. The cover 130 may protect the insulating part 120 and the RF contacts 110 from the outside. The cover 130 may be grounded to implement shielding for the RF contacts 110 . Specifically, the cover 130 can prevent electromagnetic waves generated from the RF contacts 110 from interfering with signals of circuit components located in the vicinity of the electronic device, and circuit components located in the vicinity of the electronic device. It is possible to prevent electromagnetic waves generated from the RF signals from interfering with the RF signals transmitted by the RF contacts 110 . Accordingly, the board connector 100 according to the present invention can contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using the cover 130 .

The inner shell 140 is inserted into the cover 130 . The inner shell 140 may be inserted into the cover 130 to be coupled to the insulating part 120 . The inner shell 140 may be coupled to the insulating part 120 to cover at least a portion of the RF contacts 110 . The inner shell 140 may be grounded to implement shielding for the RF contacts 110 . Specifically, the inner shell 140 can prevent electromagnetic waves generated from the RF contacts 110 from interfering with signals of circuit components located in the vicinity of the electronic device, and circuits located in the vicinity of the electronic device. It is possible to prevent electromagnetic waves generated from components from interfering with RF signals transmitted by the RF contacts 110 . Accordingly, the board connector 100 according to the present invention can contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using the inner shell 140 .

The cover 130 may include a cover body 131 and a receiving groove 132 . The cover body 131 is coupled to the insulating part 120 and the inner shell 140 . The receiving groove 132 accommodates the insulating part 120 and the inner shell 140 . The accommodating groove 132 may be formed in the cover body 131 . The cover body 131 may be coupled to the insulating part 120 and the inner shell 140 so that the insulating part 120 and the inner shell 140 are accommodated in the receiving groove 132 . Accordingly, the insulating part 120 and the inner shell 140 may be disposed inside the cover 130 . The cover body 131 may be grounded through the first substrate 100A. The cover body 131 may be grounded through the mating cover 230 of the mating connector 200 . The cover body 131 may be grounded to perform a shielding function for the RF contacts 110 .

2 to 7 and 11 , the cover body 131 may include a cover left wall 1311 , a right cover wall 1312 , a rear cover wall 1313 , and an upper cover wall 1314 .

The cover left wall 1311 is disposed to cover the left side of the receiving groove 132 with respect to the first axial direction (X-axis direction). The cover right wall 1312 is disposed to cover the right side of the receiving groove 132 . The right side means a direction opposite to the left side. The cover rear wall 1313 is disposed to cover the rear of the accommodation groove 132 with respect to a second axial direction (Y-axis direction) perpendicular to the first axial direction (X-axis direction). The cover upper wall 1314 is the first axial direction (X-axis direction) and the second axial direction (Y-axis direction) of the receiving groove 132 with respect to the third axial direction (Z-axis direction) perpendicular to the reference. It is arranged to cover the upper side. The cover left wall 1311 , the cover right wall 1312 , the cover rear wall 1313 , and the cover upper wall 1314 may be grounded to shield all four sides of the RF contacts 110 . . For example, the cover left wall 1311 shields the RF signal from being radiated to the left from the RF contacts 110 , and the cover right wall 1312 is the cover right wall 1312 for the RF signal to be radiated to the right from the RF contacts 110 . and the cover rear wall 1313 shields the RF signal from being radiated to the rear from the RF contacts 110 , and the cover upper wall 1314 is the RF signal upward from the RF contacts 110 . By shielding the radiation, it is possible to shield all sides of the RF contacts (110). Here, the left, the right, the front, the rear, the upper, and the lower are for distinguishing each configuration, and it is clear to those skilled in the art that the present invention does not refer to a specific direction. something to do.

Here, the inner shell 140 may include a lower shell wall 144 (shown in FIG. 5 ) disposed to cover a lower portion of the receiving groove 132 . In the board connector 1 according to the present invention, the lower shell wall 144, the cover left wall 1311, the cover right wall 1312, the cover rear wall 1313, and the cover upper wall 1314 are grounded. It is implemented to shield in five different directions of the RF contacts 110 . For example, referring to FIG. 7 , the lower shell wall 144 shields the RF signals from being radiated downward from the RF contacts 110 , so that the cover left wall 1311 , the cover right wall 1312 , and the cover rear wall 1313 and the cover wall 1314 together with the RF contacts 110 may be implemented to shield in five directions, including left, right, upper, rear, and lower. Accordingly, the board connector 1 according to the present invention can achieve the following effects.

First, the board connector 1 according to the present invention is implemented so that the cover 130 omits the lower wall of the cover. Therefore, the board connector 1 according to the present invention prevents the overall height from increasing due to the lower wall of the cover regardless of the thickness of the cover body 131, so that the product is based on the third axis direction (Z axis direction). miniaturization can be achieved.

Second, the board connector 1 according to the present invention is implemented to shield the lower side of the RF contacts 110 by using the lower shell wall 144 . Accordingly, in the board connector 1 according to the present invention, in addition to implementing a four-way shielding for shielding the left, right, upper and rear of the RF contacts 110 using the cover body 131, By additionally shielding the lower side of the RF contacts 110 through the lower shell wall 144 , it is possible to implement shielding in five directions for the RF contacts 110 . Therefore, the board connector 1 according to the present invention realizes miniaturization based on the height direction (Z-axis direction) by the cover body 131 omitting the cover lower wall, and uses the lower shell wall 144 to provide the cover As the lower cover wall is omitted from the main body 131, it is possible to prevent the lower shielding performance from being deteriorated.

Third, the board connector 1 according to the present invention is implemented in a structure in which the lower side of the receiving groove 132 is opened by omitting the lower cover wall of the cover body 131 . Accordingly, the board connector 1 according to the present invention can improve the ease of inserting the insulating part 120 and the inner shell 140 into the receiving groove 132 . In the case of the comparative example in which the lower side of the receiving groove 132 is covered by the cover body 131 by the lower cover wall, the insulating part 120 and the inner shell 140 have the receiving groove 132 due to the lower cover wall. ) may be restricted from being inserted through the underside. On the other hand, in the board connector 1 according to the present invention, since the lower side of the receiving groove 132 is open, the insulating part 120 and the inner shell 140 are inserted through the lower side of the receiving groove 132 . implemented to be In addition, the board connector 1 according to the present invention is implemented so that the operator can easily access the receiving groove 132 as the lower side of the receiving groove 132 is opened. Accordingly, the board connector 1 according to the present invention can improve the convenience of operations such as welding or assembling performed inside the receiving groove 132 . Therefore, in the board connector 1 according to the present invention, the degree of freedom in the direction in which the insulating part 120 and the inner shell 140 are inserted into the receiving groove 132 is increased, and the inner shell 140 is inserted into the receiving groove 132 . By improving accessibility, it is possible to improve the convenience and easiness of the operation of coupling the cover 130 , the insulating part 120 , and the inner shell 140 .

7 and 8 , the inner shell 140 may be coupled to the cover 130 to be disposed on the front side of the first substrate 100A. The front means the opposite direction to the rear. The front may be in a direction parallel to the second axial direction (Y-axis direction). The board connector 100 according to the present invention may include a shield plate 150 . The shield plate 150 is coupled to the inner shell 140 . One side of the shield plate 150 is coupled to the inner shell 140 and the other side is grounded through the first substrate 100A to implement a downward shielding force for the RF contact 110 . . Accordingly, the board connector 100 according to the present invention can achieve the following operational effects.

First, in the board connector 100 according to the present invention, by disposing the inner shell 140 in front of the first substrate 100A, the inner shell 140 and the insulating part 120 are connected to the first substrate ( It is implemented so that it can be located below 100A). Accordingly, the board connector 100 according to the present invention has the first board 100A in comparison with the comparative example in which the inner shell 140 and the insulating part 120 are disposed on the first board 100A. ), it is possible to reduce the size of the product from being enlarged in the third axis direction (Z axis direction) due to the thickness.

Second, the board connector 100 according to the present invention may implement a lower shielding force for the RF contacts 110 by using the shield plate 150 . Specifically, when the inner shell 140 is disposed in front of the first substrate 100A, as the RF signal flows between the inner shell 140 and the first substrate 100A, the RF contact 110 The lower shielding performance of Accordingly, the board connector 1 according to the present invention realizes miniaturization based on the third axial direction (Z-axis direction) by disposing the inner shell 140 in front of the first substrate 100A. By using the shield plate 150 to reduce the RF signal leaking downward through between the inner shell 140 and the first substrate 100A, the lower shielding performance of the RF contacts 110 is reduced. can be prevented

Hereinafter, the RF contact 110 , the insulating part 120 , the cover 130 , the inner shell 140 , and the shield plate 150 will be described in detail with reference to the accompanying drawings.

2 to 11 , the RF contact 110 is for transmitting a radio frequency (RF) signal. The RF contacts 110 may be formed in plurality. The RF contacts 110 may be disposed to be spaced apart along the first axial direction (X-axis direction). The RF contacts 110 may be connected to the counterpart connector 200 in a mounted state through the ground pattern 120A formed on the first substrate 100A. The RF contact 110 may be formed of a material having an electrical conductivity. For example, the RF contact 110 may be formed of a metal.

The insulating part 120 supports the RF contacts 110 . The insulating part 120 may be coupled to the first substrate 100A to support the RF contact 110 . Accordingly, the RF contact 110 may be positioned with one side mounted on the first substrate 100A and the other side spaced apart from the first substrate 100A. The insulating part 120 may be formed of an insulating material.

The insulating part 120 may be inserted into the insertion groove 110A formed in the first substrate 100A. In this case, the inner shell 140 may be inserted into the insertion groove 110A. The insertion groove 110A is for inserting the insulating part 120 and the inner shell 140 . The insertion groove 110A may be formed through the first substrate 100A. The insertion groove 110A may be formed to extend from the front end of the first substrate 100A toward the rear. The cover 130 may be disposed on the upper side of the insertion groove 110A and mounted on the upper surface of the first substrate 100A. Accordingly, in the board connector 1 according to the present invention, the third axial direction (Z-axis direction) is formed by disposing the insulating part 120 and the inner shell 140 in front of the first substrate 100A. The second axis is achieved by reducing the degree of protrusion of the insulating part 120 and the inner shell 140 forward from the first substrate 100A by using the insertion groove 110A while reducing the size as a reference. It is also possible to achieve downsizing based on the direction (Y-axis direction).

At least a part of the insulating part 120 may be inserted into the insertion groove 110A. In this case, the remaining portion of the insulating part 120 may be accommodated in the receiving groove 132 . Although not shown, the insulating part 120 may be inserted into the insertion groove 110A so as to protrude below the first substrate 100A through the insertion groove 110A. At least a portion of the inner shell 140 may be inserted into the insertion groove 110A. Accordingly, the inner shell 140 may be disposed in front of the first substrate 100A. The remaining portion of the inner shell 140 may be accommodated in the receiving groove 132 . Although not shown, the inner shell 140 may be inserted into the insertion groove 110A such that it passes through the insertion groove 110A and protrudes downward of the first substrate 100A. The insertion groove 110A may be formed in a rectangular shape as a whole, but is not limited thereto, and may be formed in a different shape as long as the insulating part 120 and the inner shell 140 can be inserted.

The insulating part 120 may include an insulating body 121 and an insulating protruding member 122 . The insulating body 121 is accommodated in the receiving groove 132 . The cover left wall 1311 is disposed on the left side of the insulating body 121 , the cover right wall 1312 is disposed on the right side of the insulating body 121 , and the cover rear wall is disposed on the rear side of the insulating body 121 . 1313 is disposed, and the cover upper wall 1314 may be disposed on the upper side of the insulating body 121 . The insulating body 121 may be disposed above the first substrate 100A. The insulating body 121 may be supported by the upper surface of the first substrate 100A. The insulating protruding member 122 protrudes forward from the insulating body 121 . At least a portion of the insulating protrusion member 122 may be accommodated in the insertion groove 110A. Accordingly, the insulating protrusion member 122 may be disposed in front of the first substrate 100A. In this case, the remaining part of the insulating protruding member 122 may be accommodated in the receiving groove 132 . Although not shown, the insulating protruding member 122 may be inserted into the insertion groove 110A so as to pass through the insertion groove 110A and protrude downward of the first substrate 100A.

The cover 130 is coupled to the inner shell 140 . The insulating part 120 and the inner shell 140 may be disposed inside the cover 130 . Accordingly, the insulating part 120 and the RF contact 110 may be protected from the outside by the cover 130 .

2 to 13 , the cover 130 may include the cover body 131 , the receiving groove 132 , and a flange 133 .

The cover body 131 may include the cover left wall 1311 , the cover right wall 1312 , the cover rear wall 1313 , and the cover upper wall 1314 . The receiving groove 132 may be disposed inside the cover body 131 . The cover left wall 1311 is arranged to cover the left side of the receiving groove 132 , the cover right wall 1312 is arranged to cover the right side of the receiving groove 132 , and the cover rear wall 1313 is the It may be arranged to cover the rear of the receiving groove 132 , and the upper cover wall 1314 may be arranged to cover the upper side of the receiving groove 132 . The cover body 131 may be formed of a material having an electrical conductivity. For example, the cover body 131 may be formed of metal. The cover 130 may be mounted on the upper surface of the first substrate 100A. The cover body 131 may be grounded through the ground pattern 120A formed on the upper surface of the first substrate 100A. Accordingly, the cover body 131 may implement shielding for the RF contacts 110 accommodated in the receiving groove 132 .

The flange 133 (shown in FIG. 13 ) is for supporting the cover body 131 on the first substrate 100A. The flange 133 may be formed by bending in an outward direction from each end of the cover left wall 1311 , the cover right wall 1312 , and the cover rear wall 1313 . The outward direction means a direction opposite to the inner direction from the cover body 131 toward the receiving groove 132 . The flange 133 increases the support area of the cover body 131 with respect to the first substrate 100A as compared to the comparative example in which only the end of the cover body 131 is supported on the first substrate 100A. can do it Accordingly, the board connector 100 according to the present invention can increase the supporting force of the cover body 131 with respect to the first board 100A through the flange 133 . Therefore, the board connector 100 according to the present invention can improve durability against external vibration or shock. In addition, the board connector 100 according to the present invention has an area for forming a fixing part (not shown) for fixing the cover body 131 to the first board 100A using the flange 133 . can be further increased. Accordingly, in the board connector 100 according to the present invention, the cover body 131 increases the fixing area by the fixing part as compared to the comparative example in which the cover body 131 is directly coupled to the first board 100A. ) may be more firmly fixed to the first substrate 100A. The fixing part may be formed through soldering or may be formed through an adhesive material or the like. The fixing part may be formed by solidifying after the flange 133 is melted through heat treatment.

The inner shell 140 is inserted into the cover 130 . The inner shell 140 may be coupled to the insulating part 120 while being inserted into the cover 130 .

The inner shell 140 may perform a shielding function for the RF contacts 110 . The inner shell 140 may be disposed to cover at least a portion of the insulating part 120 . The inner shell 140 may be formed of a material having electrical conductivity. For example, the inner shell 140 may be formed of metal.

2 to 12 , the inner shell 140 may include the lower shell wall 144 , the shell left wall 141 , the right shell wall 142 , the shell upper wall 143 , and the shell thick wall 145 . can

The lower shell wall 144 is to cover the lower portion of the receiving groove (132). The lower shell wall 144 may be coupled to the lower surface of the insulating part 120 to cover the lower side of the receiving groove 132 . The lower shell wall 144 may protect the lower surface of the insulating part 120 from the outside. The lower shell wall 144 may be grounded through the first substrate 100A to shield lower portions of the RF contacts 110 . The shield plate 150 may be coupled to the lower shell wall 144 . The shield plate 150 may extend toward the rear so that the other side is coupled to the first substrate 100A while one side is coupled to the lower shell wall 144 .

The shell left wall 141 is to cover the left side of the receiving groove (132). The shell left wall 141 may be positioned between the cover left wall 1311 and the RF contacts 110 with respect to the first axial direction (X-axis direction). The cover left wall 1311 and the shell left wall 141 may be grounded to perform a shielding function for the RF contacts 110 . Accordingly, the board connector 1 according to the present invention can implement a double shielding wall for the left side of the RF contacts 110 using the cover left wall 1311 and the shell left wall 141 . Accordingly, the board connector 1 according to the present invention can further reduce radiation of the RF signal generated from the RF contacts 110 to the outside through the left side of the receiving groove 132 .

The shell right wall 142 covers the right side of the receiving groove 132 . The right shell wall 142 may be positioned between the cover right wall 1312 and the RF contacts 110 in the first axial direction (X-axis direction). The cover right wall 1312 and the shell right wall 142 may be disposed on opposite sides of the shell left wall 141 with respect to the receiving groove 132 . The shell right wall 142 may be grounded to perform a shielding function for the RF contacts 110 . Accordingly, the board connector 1 according to the present invention can implement a double shielding wall for the right side of the RF contacts 110 using the cover right wall 1312 and the shell right wall 142 . Accordingly, the board connector 1 according to the present invention can further reduce radiation of the RF signal generated from the RF contacts 110 to the outside through the right side of the receiving groove 132 .

The shell upper wall 143 is to cover the upper side of the receiving groove (132). The shell upper wall 143 may be disposed between the cover upper wall 1314 and the RF contacts 110 . The upper shell wall 143 may be disposed above the RF contacts 110 with respect to the third axis direction (Z axis direction). The cover upper wall 1314 and the shell upper wall 143 may be grounded to perform a shielding function for the RF contacts 110 . Accordingly, the board connector 1 according to the present invention can implement a double shielding wall for the upper side of the RF contacts 110 by using the cover upper wall 1314 and the shell upper wall 143 . Accordingly, the board connector 1 according to the present invention can further reduce the radiation of the RF signal generated from the RF contacts 110 to the outside through the upper portion of the receiving groove 132 . Therefore, the board connector 100 according to the present invention implements a double shielding wall for the left, right, and upper portions of the RF contacts 110 using the inner shell 140 and the cover 130 , so that the RF Shielding performance for the contacts 110 may be further strengthened.

At least one of the shell lower wall 144, the shell upper wall 143, the shell right wall 142, and the shell left wall 141 is inserted into the mating connector 200 through the front of the receiving groove 132. It can be connected to shield between the inner shell 140 and the counterpart connector 200 . Specifically, at least one of the lower shell wall 144, the shell upper wall 143, the shell right wall 142, and the shell left wall 141 is connected to the counterpart cover 230 of the counterpart connector 200. As a result, it is possible to shield between the inner shell 140 and the counterpart connector 200 . For example, when the upper shell wall 143 is connected to the counterpart cover 230 of the mating connector 200 as shown in FIGS. 7 and 10 , the upper shell wall 143 is grounded through the mating cover 230 . It is possible to shield between the inner shell 140 and the counterpart connector 200 . Accordingly, the board connector 100 according to the present invention provides five directions including left, right, upper, lower, and rear of the RF contact 110 through the cover 130 and the inner shell 140 . In addition to shielding, the inner shell 140 is connected to the mating connector 200 inserted through the front of the receiving groove 132 to shield the RF contact 110 . Therefore, the board connector 100 according to the present invention can implement full shielding for the RF contacts 110 .

The shell rear wall 145 is disposed to cover the rear surface of the insulating protruding member 122 . The shell rear wall 145 may be coupled to the rear surface of the insulating protruding member 122 to cover the rear of the insulating protruding member 122 . The shell thick wall 145 may be disposed to partially cover the rear surface of the insulating protruding member 122 . The shell thick wall 145 may be disposed to completely cover the rear surface of the insulating protruding member 122 . In a state in which the insulating protrusion member 122 is disposed in front of the first substrate 100A, a rear surface thereof may be covered by the shell thick wall 145 . The shell thick wall 145 may be disposed between the first substrate 100A and the insulating protruding member 122 . The shell thick wall 145 may be grounded to implement a rear shielding performance for the RF contacts 110 . Accordingly, the board connector 100 according to the present invention achieves miniaturization based on the third axial direction (Z-axis direction) by disposing the insulating protruding member 122 in front of the first substrate 100A. In addition, the RF contacts 110 as the insulating protruding member 122 is disposed in front of the first substrate 100A by covering the rear surface of the insulating protruding member 122 using the shell thick wall 145 . It is possible to prevent the rear shielding performance from decreasing.

6 to 8, the other side of the shield plate 150 is grounded through the first substrate 100A to shield between the shell thick wall 145 and the first substrate 100A. can For example, the shield plate 150 has one side coupled to the shell thick wall 145 and the other side mounted on the first substrate 100A to shield between the shell thick wall 145 and the first substrate 100A. can do. For example, the shield plate 150 has one side coupled to the lower shell wall 144 and the other side mounted on the first substrate 100A to shield between the shell thick wall 145 and the first substrate 100A. can do. Accordingly, the board connector 100 according to the present invention enhances the rear shielding performance for the RF contacts 110 using the shell thick wall 145 and uses the shield plate 150 to enhance the shell thick wall By preventing the RF signal from being radiated through the gap formed between the 145 and the first substrate 100A, the lower shielding performance of the RF contacts 110 can be enhanced. The inner shell 140 may be formed by integrating the lower shell wall 144, the shell left wall 141, the shell right wall 142, the shell upper wall 143, and the shell thick wall 145 as one body. . The inner shell 140 may be formed in the form of a rectangular ring with an empty interior as a whole, but is not limited thereto, and may be formed in various shapes.

5 to 10 , the inner shell 140 may further include a limiting member 146 and an assembly groove 147 .

The limiting member 146 is for restricting the backward movement of the insulating part 120 . The limiting member 146 may be coupled to the upper cover wall 1314 to be positioned at the rear of the insulating part 120 . Accordingly, the limiting member 146 may restrict the backward movement of the insulating part 120 by supporting the insulating part 120 at the rear of the insulating part 120 . The limiting member 146 supports the rear surface of the insulating protruding member 122 , thereby supporting the insulating part 120 from the rear side. Therefore, the board connector 100 according to the present invention prevents the insulating part 120 from being pushed backward as the mating connector 200 is excessively inserted using the limiting member 146, thereby preventing product damage and damage can be prevented. The limiting member 146 may be formed to protrude downward from the rear end of the upper cover wall 1314 . The limiting member 146 may be integrally formed with the upper cover wall 1314 . The limiting member 146 may be formed by bending based on the boundary line between the upper cover wall 1314 and the limiting member 146 .

The assembly groove 147 is for connecting to the cover shell of the mating connector. The assembly groove 147 may be formed on the inner surface of the inner shell 140 . The inner surface of the inner shell 140 is a surface disposed to face the receiving groove 132 from the inner shell 140 . For example, it may be formed on the inner surface of the shell upper wall 143 of the assembly groove 147 . Referring to FIG. 10 , the assembling groove 147 is implemented to insert the assembly protrusion 234 of the mating cover 230 of the mating connector 200 inserted into the receiving groove 132 . Accordingly, the board connector 100 according to the present invention can improve connection reliability and coupling stability of the cover 130 to the counterpart connector 200 through the assembly groove 147 . The assembly groove 147 may be implemented by forming a groove by a predetermined depth from the inner surface of the inner shell 140 .

The assembly groove 147 may be formed in plurality. In this case, the assembly grooves 147 may be formed in at least one of the shell left wall 141 , the shell right wall 142 , the shell upper wall 143 , and the shell lower wall 144 . Accordingly, the board connector 1 according to the present invention is implemented such that the assembly grooves 147 are connected to the cover shell of the counterpart connector at different positions of the inner shell 140 . Accordingly, the board connector 100 according to the present invention can further improve connection reliability with respect to the cover shell of the counterpart connector and further improve coupling stability.

2 to 11 , the shield plate 150 is coupled to the inner shell 140 . The shield plate 150 has one side coupled to the inner shell 140 and the other side mounted on the first substrate 100A disposed on the rear side of the inner shell 140, so that the first substrate 100A and the Between the inner shell 140 may be shielded. The shield plate 150 may be formed of a material having electrical conductivity. For example, the shield plate 150 may be formed of metal.

2 to 11, the shield plate 150 includes a front shield 151, a rear shield 152, a connecting shield 153, a left shield 154, a right shield 155, and a fixing protrusion ( 156) may be included.

The front shield 151 is coupled to the lower shell wall 144 . The front shield 151 may be disposed in front of the first substrate 100A and coupled to the lower shell wall 144 . The front shield 151 may be disposed to overlap the lower shell wall 144 . For example, the front shield 151 is positioned between the lower surface of the insulating protruding member 122 and the upper surface of the front shield 151 with respect to the third axial direction (Z-axis direction) to form the lower shell wall 144 . It may be arranged to overlap. The front shield 151 may be grounded to implement a double shielding structure for the RF contacts 110 together with the lower shell wall 144 . Accordingly, the board connector 100 according to the present invention can further strengthen the lower shielding performance of the RF contacts 110 through the double shielding structure of the lower shell wall 144 and the front shield 151 .

The rear shield 152 is coupled to the upper surface of the first substrate 100A. The rear shield 152 may be disposed behind the front shield 151 with respect to the second axial direction (Y-axis direction). The rear shield 152 may be mounted on the first substrate 100A. The rear shield 152 may be grounded to a ground pattern 140A formed on the upper surface of the first substrate 100A. The front shield 151 may be grounded to the ground pattern 120A formed on the first substrate 100A through the rear shield 152 .

The connection shield 153 connects the front shield 151 and the rear shield 152 . The connection shield 153 may have one side coupled to the front shield 151 and the other side coupled to the rear shield 152 . The connection shield 153 is configured such that the front shield 151 and the rear shield 152 are positioned at different positions with respect to the third axial direction (Z-axis direction). (152) can be connected. For example, the connection shield 153 may connect the rear shield 152 and the front shield 151 such that the rear shield 152 is disposed above the front shield 151 as shown in FIG. 8 . In this case, the connection shield 153 may extend upwardly from the rear end of the front shield 151 to be coupled to the front end of the rear shield 152 . The connection shield 153 may be disposed behind the insulating protruding member 122 . The connecting shield 153 may connect the front shield 151 and the rear shield 152 so that the shield plate 150 forms a step as a whole. The connection shield 153 may be coupled to the shell thick wall 145 . The connection shield 153 may be disposed to overlap the shell thick wall 145 . For example, the connection shield 153 may be coupled to the rear surface of the insulating protruding member 122 and disposed between the insulating protruding member 122 and the shell rear wall 145 . The connection shield 153 may be grounded through the rear shield 152 to implement rear shielding for the RF contacts 110 . Accordingly, the board connector 1 according to the present invention improves the rear shielding performance by implementing a double shielding structure for the rear of the RF contacts 110 together with the shell rear wall 145 using the connection shield 153 . can be further strengthened.

7 and 8 , the lower shell wall 144 may be coupled to the front shield 151 to be disposed below the front shield 151 . Accordingly, the lower shell wall 144 may support the front shield 151 under the front shield 151 . Accordingly, in the board connector 1 according to the present invention, the front shield 151 and the lower shell wall 144 are coupled such that the lower shell wall 144 is disposed on the upper side of the front shield 151 as compared to the comparative example. Due to the weight of the shield plate 150, the coupling force between the front shield 151 and the lower shell wall 144 is fundamentally prevented from being lowered, and in addition, it is disposed on the upper side of the lower shell wall 144 As the front shield 151 presses the lower shell wall 144 due to the weight of the shield plate 150 , the coupling force between the front shield 151 and the lower shell wall 144 can be increased.

The rear shield 152 may be coupled to the upper surface of the first substrate 100A so as to be disposed on the upper side of the first substrate 100A. Accordingly, the first substrate 100A may support the rear shield 152 under the rear shield 152 . Accordingly, the shield plate 150 is supported by the first substrate 100A as the rear shield 152 is coupled to the upper surface of the first substrate 100A, and the front shield 151 is formed on the lower shell wall. It may be implemented to be supported by 144 . Accordingly, in the board connector 1 according to the present invention, the lower surface of the first board 100A and the rear shield 152 are coupled such that the first board 100A is disposed on the upper side of the rear shield 152 . In contrast to the example, the coupling force between the rear shield 152 and the first substrate 100A is fundamentally prevented from being lowered due to the weight of the shield plate 150, and in addition, the first substrate ( The rear shield 152 disposed on the upper side of 100A presses the upper surface of the first substrate 100A due to the weight of the shield plate 150 by pressing the rear shield 152 and the first substrate 100A. can increase the bonding strength of

The front shield 151 , the rear shield 152 , and the connection shield 153 may be integrally formed. The front shield 151 , the rear shield 152 , and the connection shield 153 may be formed by bending a metal plate. Specifically, bending is processed to rotate in one direction based on the boundary line between the front shield 151 and the connection shield 153, and the other based on the boundary line between the connection shield 153 and the rear shield 152 It can be formed by bending to rotate in the direction. The one direction and the other direction are opposite to each other with the first axial direction (X-axis direction) as a rotation axis. For example, when the one direction is a clockwise direction with the first axis direction (X-axis direction) as a rotation axis, the other direction may be a counterclockwise direction. When the first direction is a counterclockwise direction with the first axis direction (X-axis direction) as a rotation axis, the other direction may be a clockwise direction.

6 and 11 , the shield plate 150 may include a left shield 154 and a right shield 155 . The left shield 154 is coupled to one side of the rear shield 152 with respect to the first axial direction (X-axis direction). The left side shield 154 may be disposed to cover the left side of the receiving groove 132 . The left shield 154 may be formed to extend upwardly from the right end of the rear shield 152 . The left shield 154 may be integrally formed with the rear shield 152 . The left shield 154 may be formed by bending based on a boundary line with the rear shield 152 .

The right shield 155 is coupled to the other side of the rear shield 152 with respect to the first axial direction (X-axis direction). The right shield 155 may be disposed to cover the left side of the receiving groove 132 . The right shield 155 may be formed to extend upwardly from the left end of the rear shield 152 . The right shield 155 may be integrally formed with the rear shield 152 . The right shield 155 may be formed by bending based on a boundary line with the rear shield 152 .

One side of the rear shield 152 is coupled to the shell left wall 141 through the left shield 154 with respect to the first axial direction (X-axis direction), and the other side is coupled to the right side through the right shield 155 . It may be coupled to the shell right wall 142 . Accordingly, the board connector 1 according to the present invention increases the area in which the shield plate 150 is coupled to the inner shell 140 through the left shield 154 and the right shield 155 to increase the shielding area. The coupling force between the plate 150 and the inner shell 140 may be increased. In addition, the left shield 154 may be supported by being coupled to the shell left wall 141 , and the right shield 155 may be coupled to and supported by the shell right wall 142 . Therefore, the board connector 1 according to the present invention limits the relative movement of the shield plate 150 and the inner shell 140 with respect to the first axial direction (X-axis direction), thereby limiting the shield plate 150. and the coupling force between the inner shell 140 may be further increased.

The left shield 154 may be disposed to overlap the shell left wall 141 and the cover left wall 1311 . Accordingly, the board connector 1 according to the present invention has a triple shielding structure for the left side of the RF contacts 110 using the left shield 154 , the shell left wall 141 , and the cover left wall 1311 . can be implemented. Accordingly, the board connector 1 according to the present invention can further enhance the left shielding performance for the RF contacts 110 .

The right shield 155 may be disposed to overlap the right shell wall 142 and the cover right wall 1312 . Accordingly, the board connector 1 according to the present invention has a triple shielding structure for the right side of the RF contacts 110 using the right shield 155 , the right shell wall 142 , and the cover right wall 1312 . can be implemented. Therefore, the board connector 1 according to the present invention can further enhance the right shielding performance for the RF contacts 110 .

6 to 8 , the shield plate 150 may include a fixing protrusion 156 . The fixing protrusion 156 is for fixing the insulating part 120 .

The fixing protrusion 156 may be coupled to the front shield 151 . The fixing protrusion 156 may protrude from the front shield 151 toward the insulating part 120 . The fixing protrusion 156 may be inserted into the insulating part 120 to limit movement of the insulating part 120 . Specifically, the fixing protrusion 156 may be inserted into the insulating protruding member 122 to restrict movement of the insulating protruding member 122 and the insulating body 121 . For example, when the insulating part 120 is disposed on the upper side of the front shield 151 , the fixing protrusion 156 moves upward from the front shield 151 in the third axial direction (Z-axis direction). It can be protruded so as to extend to Accordingly, the fixing protrusion 156 may have one side coupled to the front shield 151 while the other side may be inserted into the insulating part 120 . Accordingly, the board connector 1 according to the present invention uses the fixing protrusion 156 to limit the movement of the insulating part 120, so that the insulating part 120 is different from the insulating part 120 by external vibration or shaking. It is possible to prevent the bond from being released. The fixing protrusion 156 may be formed in plurality. In this case, the fixing protrusions 160 and 160 ′ may be disposed to be spaced apart from each other based on the first axial direction (X-axis direction). Accordingly, the board connector 1 according to the present invention uses the fixing protrusions 160 and 160' to secure the insulating part 120 at different positions with respect to the first axial direction (X-axis direction). Since it can be fixed, it is possible to further prevent the insulator 120 from being disconnected from other components due to external vibration or shaking.

2, 3, 7 and 14 , the board connector 100 according to the present invention may include a transmission contact 160 and a ground contact 170 .

The transmission contacts 160 are coupled to the insulating part 120 . The transmission contacts 160 may be in charge of transmitting a signal (Sinal), data (Data), and the like. The transmission contacts 160 may be coupled to the insulating part 120 through an assembly process. The transmission contacts 160 may be integrally molded with the insulating part 120 through injection molding.

The first RF contact 111 and the second RF contact 112 of the RF contacts 110 may be disposed to be spaced apart along the first axial direction (X-axis direction). The transmission contacts 160 may be disposed between the first RF contact 111 and the second RF contact 112 . For example, the transmission contacts 160a, 160b, 160c, 160d, 160e, and 160f are located between the first RF contact 111 and the second RF contact 112 with respect to the first axial direction (X-axis direction). can be placed. Accordingly, the board connector 100 according to the present invention can reduce RF signal interference by increasing the distance between the first RF contact 111 and the second RF contact 112 separated from each other, as well as the spacing for this. By disposing the transmission contacts 160 in a space, space utilization of the insulating part 120 can be improved.

The transmission contacts 160 may be disposed to be spaced apart from each other. The transmission contacts 160 may be electrically connected to the first substrate 200A by being mounted on the first substrate 200A. In this case, a transmission mounting member (not shown) of each of the transmission contacts 160 may be connected to a connection pattern (not shown) formed on the first substrate 200A. Accordingly, the transmission contacts 160 may be electrically connected to the internal circuit of the first substrate 200A. The transmission contacts 160 may be formed of a material having electrical conductivity. For example, the transmission contacts 160 may be formed of metal. The transmission contacts 160 may be electrically connected to the second substrate 200A on which the counterpart connector is mounted by being connected to the transmission contacts of the counterpart connector. Accordingly, the first substrate 200A and the second substrate 200A may be electrically connected.

Meanwhile, in FIG. 12 , the board connector 100 according to the present invention is illustrated as including six transmission contacts 160a, 160b, 160c, 160d, 160e, and 160f, but the present invention is not limited thereto. The connector 100 may include seven or more transmission contacts 160 .

The ground contacts 170 are coupled to the insulating part 120 . The ground contacts 170 may be grounded through a ground pattern (not shown) formed on the first substrate 100A. The ground contacts 170 may be coupled to the insulating part 120 through an assembly process. The ground contacts 170 may be integrally molded with the insulating part 120 through injection molding. A first ground contact 171 among the ground contacts 170 is disposed between the first RF contact 111 and the transmission contact 160 with respect to the first axial direction (X-axis direction), so that the first RF It is possible to shield between the contact 111 and the transmission contact 160 . In this case, the first RF contact 111 and the transmission contact 160 may be disposed to be spaced apart from each other based on the first axial direction (X-axis direction). Accordingly, the board connector 100 according to the present invention can reduce signal interference by increasing the distance between the first RF contact 111 and the transmission contact 160 separated from each other. By disposing the first ground contact 171 , the space utilization for the insulating part 120 can be further improved in addition to further reducing signal interference between the first RF contact 111 and the transmission contact 160 . .

A second ground contact 172 among the ground contacts 170 is disposed between the second RF contact 112 and the transmission contact 160 with respect to the first axial direction (X-axis direction), so that the first It is possible to shield between the 2RF contact 112 and the transmission contact 160 . In this case, the second RF contact 112 and the transmission contact 160 may be disposed to be spaced apart from each other based on the first axial direction (X-axis direction). Accordingly, the board connector 100 according to the present invention can reduce signal interference by increasing the distance between the second RF contact 112 and the transmission contact 160, as well as reduce the signal interference in the spaced space for this. By arranging the second ground contact 172, the signal interference between the second RF contact 112 and the transmission contact 160 is further reduced, and the space utilization for the insulating part 120 can be further improved. .

Hereinafter, the mating connector 200 to which the board connector 100 according to the present invention is coupled will be described in detail with reference to the accompanying drawings.

2, 7 and 14 , the mating connector 200 is mounted on a second substrate 200A vertically disposed with respect to the first substrate 100A. The mating connector 200 includes a mating cover 230 coupled to one surface of the second substrate 200A facing the first substrate 100A, and a mating insulator 220 disposed inside the mating cover 230 . ), and a plurality of counter contacts 210 supported by the relative insulator 220 . When the mating connector 200 is inserted into the inner shell 140 in a state in which the first substrate 100A and the second substrate 200A are vertically arranged, the mating connector 200 is the mating contact ( 210 may be implemented to be directly connected to the RF contacts 110 .

Here, the board connector 100 according to the present invention may include the second board 200A and the counterpart connector 200 . The board connector 100 according to the present invention includes the second board 200A and the counterpart connector 200, so that the first board 100A and the second board 200A are vertically arranged with each other. In the RF contact 110 and the counterpart contact 210 is implemented to be directly connected. In this regard, the board connector according to the prior art solves a problem in that as the boards 100A and 200A are disposed perpendicular to each other as shown in FIG. 15 , the connectors 10 and 20 are oriented in different directions to limit direct connection. In order to do this, a separate connection substrate 30 was accompanied. Therefore, in the case of a board connector according to the prior art, there is a problem in that miniaturization and weight reduction are inhibited due to the size and weight of the connecting board 30 , and the connecting board 30 is a general printed circuit board (PCB, Printed Circuit). Since it was a flexible printed circuit board (FPCB) that was more expensive than Broad), there was a problem that the manufacturing cost increased.

On the other hand, since the board connector 100 according to the present invention is implemented so that the RF contact 110 and the counter contact 210 are directly connected, the above-described problem is fundamentally prevented from occurring, thereby reducing the manufacturing cost and reducing the size. and weight reduction.

Hereinafter, the counter contact 210 , the counterpart insulating part 220 , and the counterpart cover 230 will be described in detail with reference to FIGS. 2 , 7 and 14 .

The counterpart contacts 210 are for transmitting a radio frequency (RF) signal. The counter contacts 210 may be mounted on the second substrate 200A for RF signal transmission. The second substrate 200A is to be electrically connected to the first substrate 200A. The counter contacts 210 may be electrically connected to the second substrate 200A by being mounted on the second substrate 200A. The counter contacts 210 may be electrically connected to the first substrate 200A on which the RF contacts 110 are mounted by being connected to the RF contacts 110 . Accordingly, the first substrate 200A and the second substrate 200A may be electrically connected.

The relative insulator 220 is a combination of the counter contacts 210 . The counter contacts 210 may be supported by the counter insulator 220 to be connected to the RF contacts 110 . The counter contacts 210 may be coupled to the counter insulator 220 through an assembling process. The counter contacts 210 may be integrally molded with the counter insulator 220 through injection molding.

The counter cover 230 is a combination of the relative insulating part 220 . The counter cover 230 may be coupled to the counter insulating part 220 to protect the counter contact 210 and the counter insulating part 220 from the outside. The counter cover 230 may be grounded by being mounted on the second substrate 200A. Accordingly, the counter cover 230 may implement a shielding function of signals, electromagnetic waves, etc. for the counter contacts 210 . In this case, the counter cover 230 can prevent electromagnetic waves generated from the counter contacts 210 from interfering with signals of circuit components located in the vicinity of the electronic device, and circuits located in the vicinity of the electronic device. It is possible to prevent electromagnetic waves generated from components from interfering with RF signals transmitted by the counterpart contacts 210 . Accordingly, the mating connector 200 may contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using the mating cover 230 . The counter cover 230 may be formed of a material having an electrical conductivity. For example, the counter cover 230 may be formed of metal.

The counterpart cover 230 may include a counterpart cover body 231 , a counterpart receiving groove 232 , a counterpart flange 233 , and an assembly protrusion 234 .

The counterpart cover body 231 is coupled to the counterpart insulating part 220 . A counter receiving groove 232 for accommodating the relative insulating part 220 may be formed in the counter cover body 231 . The counterpart cover body 231 may be coupled to the counterpart insulating part 220 such that the counterpart insulating part 220 is accommodated in the counter receiving groove 232 . The counter cover body 231 may be coupled to the second substrate 200A. The relative insulating part 220 may be disposed between the counterpart cover body 231 and the second substrate 200A. Accordingly, the relative insulating part 220 may be protected from the outside by the counter cover body 231 and the second substrate 200A.

The mating flange 233 is for supporting the mating cover body 231 to the second substrate 200A. The counter flange 233 may be formed by bending in the outward direction from the end of the counter cover body 231 . The outward direction means a direction opposite to the inward direction from the mating cover body 231 toward the mating receiving groove 232 . Accordingly, the mating connector 200 increases the support force of the mating cover body 231 to the second substrate 200A through the mating flange 233, thereby improving durability against external vibration or shock. have. In addition, the mating connector 200 further increases the area for forming a fixing part (not shown) for fixing the mating cover body 231 to the second substrate 200A using the mating flange 233 . can do it Accordingly, the mating connector 200 increases the fixed area by the fixing part as compared to the comparative example in which the mating cover body 231 is directly coupled to the second substrate 200A without the mating flange 233. The counter cover body 231 can be more firmly fixed to the second substrate 200A. The fixing part may be formed through solidification of solder, or may be formed through an adhesive material or the like. The fixing part may be formed by melting and then solidifying the counter flange 233 through heat treatment.

The assembly protrusion 234 is to be connected to the cover 130 . The assembly protrusion 234 may be formed to protrude outwardly from the counterpart cover body 231 .

The assembling protrusion 234 may be inserted into the assembling groove 147 as the mating cover 230 is inserted into the receiving groove 132 . Accordingly, the mating connector 200 implements the assembly groove 147 and the assembly structure using the assembly protrusion 234 , thereby improving connection reliability and coupling stability to the cover 130 .

The assembly protrusion 234 may be formed in plurality. In this case, the assembly protrusions 234 may be formed in a number corresponding to the number of the assembly grooves 147 . The assembly protrusions 234 may be disposed at different positions of the counterpart cover 230 , and the assembly grooves 147 may be disposed at different positions of the cover 130 . The assembling protrusion 234 and the assembling groove 147 are positioned at positions corresponding to each other with respect to the insertion of the counterpart cover 230 into the cover 130, respectively. 130) can be combined. Accordingly, the mating connector 200 improves the connecting force and coupling force at various positions of the cover 130 and the mating cover 230 , thereby combining reliability and connection between the cover 130 and the mating cover 230 . Stability can be further improved.

The counterpart connector 200 may include a counterpart transmission contact (not shown) and a counterpart ground contact (not shown). Since the relative transmission contact and the relative ground contact approximately coincide with the above-described transmission contact 160 and the ground contact 170, respectively, a detailed description thereof will be omitted.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of

100: board connector 110: RF contact
120: insulated part 121: insulated body
122: insulating protruding member 130: cover
131: cover body 132: receiving groove
140: inner shell 141: shell left wall
142: shell right wall 143: shell top wall
144: shell thick wall 145: shell lower wall
146: assembly groove 150: shield plate
151: front shield 152: rear shield
153: connection shield 154: left shield
155: right shield 156: fixed projection
160: transmission contact 170: ground contact
1311: cover left wall 1312: cover right wall
1313: cover rear wall 1314: cover upper wall

Claims (17)

a plurality of RF contacts 110 for transmitting a radio frequency (RF) signal;
an insulating part 120 to which the RF contacts 110 are coupled;
a cover 130 coupled to the insulating part 120;
an inner shell 140 inserted into the cover 130; and
and a shield plate 150 coupled to the inner shell 140,
The inner shell 140 is coupled to the cover 130 so as to be disposed on the front side of the first substrate 100A,
The shield plate 150 has one side coupled to the inner shell 140 and the other side grounded through the first substrate 100A to implement a lower shielding force for the RF contacts 110 . A board connector featuring. According to claim 1,
The cover 130 includes a cover body 131 having a receiving groove 132 for accommodating the insulating part 120 and the inner shell 140,
The cover body 131 is,
a cover seat wall 1311 disposed to cover the left side of the receiving groove 132 with respect to the first axial direction (X-axis direction);
a cover right wall 1312 disposed to cover the right side of the receiving groove 132;
a cover rear wall 1313 disposed to cover the rear of the accommodation groove 132 with respect to a second axial direction (Y-axis direction) perpendicular to the first axial direction (X-axis direction); and
to cover the upper side of the receiving groove 132 with respect to the third axis direction (Z axis direction) perpendicular to the first axis direction (X axis direction) and the second axis direction (Y axis direction) Including a cover upper wall 1314 disposed,
The inner shell (140) is a board connector, characterized in that it includes a lower shell wall (144) disposed to cover the lower side of the receiving groove (132). According to claim 1,
The insulating part 120 includes an insulating body 121 accommodated in the receiving groove 132 of the cover 130, and an insulating protruding member 122 protruding forward from the insulating body 121,
The inner shell 140 includes a shell thick wall 145 disposed between the insulating protruding member 122 and the first substrate 100A to cover the rear surface of the insulating protruding member 122,
The shield plate 150 covers a gap formed between the shell thick wall 145 and the first substrate 100A to realize a downward shielding force for the RF contact 110 . According to claim 1,
The insulating part 120 includes an insulating body 121 accommodated in the receiving groove 132 of the cover 130, and an insulating protruding member 122 protruding forward from the insulating body 121,
At least a portion of the inner shell 140 and the insulating protruding member 122 is inserted into the insertion groove 110A formed in the first substrate 100A, so that it is disposed in front of the first substrate 100A. board connector. 3. The method of claim 2,
The shield plate 150,
The front shield 151 coupled to the lower shell wall 144, the rear shield 152 coupled to the upper surface of the first substrate 100A, and the rear shield 152 are provided on the upper side of the front shield 151 and a connecting shield 153 connecting the rear shield 152 and the front shield 151 so as to be positioned, and the front shield 151, the rear shield 152, and the connecting shield 153 are integrally formed. Board connector, characterized in that formed with. 3. The method of claim 2,
The shield plate 150,
and a front shield 151 disposed to overlap with the lower shell wall 144,
The front shield (151) is a board connector, characterized in that it implements a double shielding structure for the lower side of the RF contacts (110) together with the lower shell wall (144). 4. The method of claim 3,
The shield plate 150,
The front shield 151 coupled to the insulating part 120 , the rear shield 152 coupled to the upper surface of the first substrate 100A, and the rear shield 152 are provided on the upper side of the front shield 151 . and a connection shield 153 connecting the rear shield 152 and the front shield 151 to be positioned,
The connection shield (153) is disposed to overlap the shell thick wall (145) so as to implement a double shielding structure for the rear of the RF contacts (110) together with the shell thick wall (145). According to claim 1,
The cover 130 includes a cover body 131 having a receiving groove 132 for accommodating the insulating part 120 and the inner shell 140,
The cover body 131 is a cover left wall 1311 arranged to cover the left side of the receiving groove 132, and a cover right wall arranged to cover the right side of the receiving groove 132 ( 1312), a cover rear wall 1313 arranged to cover the rear of the receiving groove 132, and a cover upper wall 1314 arranged to cover the upper side of the receiving groove 132, ,
The inner shell 140 includes a shell left wall 141 disposed between the cover left wall 1311 and the RF contacts 110 , and a shell disposed between the cover right wall 1312 and the RF contacts 110 . a right wall 142, and a shell upper wall 143 disposed between the cover upper wall 1314 and the RF contacts 110,
The cover left wall 1311 and the shell left wall 141 are grounded to implement a double shielding wall for the left side of the RF contacts 110,
The cover right wall 1312 and the shell right wall 142 are grounded to implement a double shielding wall for the right side of the RF contacts 110,
The upper cover wall (1314) and the upper shell wall (143) are grounded to implement a double shielding wall for the upper side of the RF contacts (110). According to claim 1,
The shield plate 150,
The front shield 151 coupled to the insulating part 120 , the rear shield 152 coupled to the upper surface of the first substrate 100A, and the rear shield 152 are located above the front shield 151 . and a connecting shield 153 connecting the rear shield 152 and the front shield 151 so as to be able to, and a fixing protrusion 156 coupled to the front shield 151,
The insulating part 120 is disposed on the upper side of the front shield 151,
The fixing protrusion (156) protrudes from the front shield (151) toward the insulating part (120) and is inserted into the insulating part (120). According to claim 1,
The inner shell 140 has a shell left wall 141 disposed to cover the left side of the receiving groove 132 of the cover 130 , and a shell right wall 142 disposed to cover the right side of the receiving groove 132 . ), including
The shield plate 150 includes a rear shield 152 coupled to the upper surface of the first substrate 100A, and a left shield coupled to one side of the rear shield 152 in the first axial direction (X-axis direction). (154), and a right side shield (155) coupled to the other side of the rear shield (152), characterized in that it comprises a board connector. 11. The method of claim 10,
One side of the rear shield 152 is coupled to the shell left wall 141 through the left shield 154 with respect to the first axial direction (X-axis direction), and the other side is coupled to the right side through the right shield 155 . A board connector coupled to the shell right wall (142). 3. The method of claim 2,
The inner shell 140 includes a shell left wall 141, a shell right wall 142 for connection to the mating connector 200 inserted into the receiving groove 132 through the front of the receiving groove 132, and a shell upper wall 143,
At least one of the shell lower wall 144, the shell upper wall 143, the shell right wall 142, and the shell left wall 141 is inserted into the mating connector 200 through the front of the receiving groove 132. A board connector, characterized in that it is connected to shield between the cover (130) and the mating connector (200). 3. The method of claim 2,
The shield plate 150,
The front shield 151 coupled to the lower shell wall 144, the rear shield 152 coupled to the upper surface of the first substrate 100A, and the rear shield 152 are provided on the upper side of the front shield 151 and a connection shield 153 connecting the rear shield 152 and the front shield 151 to be positioned,
The lower shell wall (144) is disposed below the front shield (151) to support the front shield (151). According to claim 1,
Among the RF contacts 110 , the first RF contact 111 and the second RF contact 112 are disposed to be spaced apart from each other in the first axial direction (X-axis direction),
A board connector, characterized in that a plurality of transmission contacts (160) are disposed between the first RF contact (111) and the second RF contact (112). 15. The method of claim 14,
a first ground contact 171 positioned between the transmission contacts 160 and the first RF contact 111 with respect to the first axial direction (X-axis direction);
The first ground contact (171) is grounded to shield the first RF contact (111) and the transmission contact (160) between the board connector, characterized in that. 3. The method of claim 2,
The cover 130 includes a flange 133 for supporting the cover body 131 to the first substrate 100A,
The flange (133) is a board connector, characterized in that formed by bending outwardly from each end of the cover left wall (1311), the cover right wall (1312), and the cover rear wall (1313). According to claim 1,
A second substrate 200A vertically disposed with respect to the first substrate 100A on which the RF contacts 110 are mounted, and a mating connector 200 mounted on the second substrate 200A,
The mating connector 200,
a counter cover 230 coupled to one surface of the second substrate 200A facing the first substrate 100A;
a relative insulating part 220 disposed inside the counter cover 230; and
and a plurality of counter contacts 210 supported by the relative insulator 220,
When the counter cover 230 is inserted into the inner shell 140 while the first substrate 100A and the second substrate 200A are vertically arranged, the counter contacts 210 and the RF contact (110) A board connector, characterized in that it is directly connected.

Images