WO2008012166A1 - Verfahren zum stanzen von bei raumtemperatur nicht tackigen hitzeaktivierbaren klebmassen - Google Patents
Verfahren zum stanzen von bei raumtemperatur nicht tackigen hitzeaktivierbaren klebmassen Download PDFInfo
- Publication number
- WO2008012166A1 WO2008012166A1 PCT/EP2007/056529 EP2007056529W WO2008012166A1 WO 2008012166 A1 WO2008012166 A1 WO 2008012166A1 EP 2007056529 W EP2007056529 W EP 2007056529W WO 2008012166 A1 WO2008012166 A1 WO 2008012166A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- release liner
- adhesive
- activatable
- layer
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/005—Presence of polyolefin in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
- Y10T156/1085—One web only
Definitions
- the invention relates to an invention, a process for the production of stamped products (stamped products) from heat-activatable adhesives and the use of novel release liners.
- Heat-activatable adhesives very often replace pressure-sensitive adhesive tapes in processes in which these high temperatures must withstand or where very high bond strengths are required.
- Heat-activatable adhesives have such properties, since you are at
- Bonding for the adhesive layer training
- thermoplastic and thermally reactive heat-activatable adhesives are used in general.
- Thermoplastic heat-activated films are based on the concept that these are included
- thermoplastic heat-activatable adhesives In the case of the thermally reactive heat-activatable adhesives, the same process takes place analogously to the thermoplastic heat-activatable adhesives.
- a crosslinking reaction is initiated which leads to the thermally reactive heat-activatable adhesives curing and thus leads to an increased bond strength.
- the object of the invention is therefore to provide a process for the production of stamped articles from heat-activatable adhesives, which avoids or at least minimizes the disadvantages of the prior art.
- the presence of paper as a carrier material should be avoided in the actual punching process.
- the solubility of the diecuts should be optimized by the carrier material for the particular application.
- the problem is solved by a special manufacturing process of the diecuts using special release liners.
- the invention therefore provides a process for processing a heat-activable adhesive which is coated on a release liner comprising a hot lamination process on a release liner followed by a stamping process.
- the main claim accordingly relates to a process for the production of diecuts from heat-activatable adhesive films, characterized in that a) a heat-activatable adhesive is first coated onto a first support material, b) the heat-activatable adhesive layer is laminated in a subsequent process step to a temporary carrier material ("release liner") under the action of heat, wherein the release liner has at least one polyolefin-based surface, and the polyolefinic surface is non-sticky at room temperature and in turn is activatable under heat, that it has adhesive properties, c) and the heat-activatable adhesive layer is subjected to a stamping process on the release liner.
- release liner temporary carrier material
- a further claim also relates to the use of a layer of a heat-activatable film having at least one polyolefin-based surface which is non-sticky at room temperature and can be activated under heat in such a way that it has pressure-sensitive adhesive properties as a temporary release material ("release liner”) for heat-activatable adhesives.
- release liner temporary release material
- diecuts ready-made (in particular flat) adhesive film moldings are to be referred to, which have been produced in a stamping process.
- the actual shape size and thickness of the diecuts is in principle not limited and can be adapted for the particular application.
- release liners that is to say layers of materials on which the heat-activatable adhesive is temporarily deposited and from which the adhesive can then be removed again-more or less easily-without residue.
- release liners are known in particular as covering materials of adhesive strips which are wound up into rolls; The Releaseliner prevent the permanent bonding of the individual tape strands with each other.
- the heat-activatable film is additionally covered with a cover liner, for example a PET liner.
- a cover liner for example a PET liner.
- the heat lamination process softens the polyolefinic side of the release liner and forms a slight tack that then causes the heat-activatable adhesive to form Film adheres to this layer.
- the heat-activatable adhesive can again be excellently laminated by the release liner to the desired substrate to be bonded.
- a further aspect of the invention are further developments of the method according to the invention, in particular with regard to techniques that can be used excellently for the lamination process.
- techniques that can be used excellently for the lamination process For example, Pressure rollers or pressure rollers with temperature-resistant rubber coatings, especially for the lamination process.
- the heat-activatable adhesive used for the production of the adhesive diecuts in the process according to the invention is characterized in that it has no inherent tack at room temperature and thus differs from conventional pressure-sensitive adhesives. Another characteristic of the heat-activatable adhesive is that it builds up a stickiness only when heat is applied and thus acts as an adhesive. Adhesives of this kind differ substantially from heat-sensitive adhesives which are adhesive at room temperature and are known from the prior art.
- the heat-activatable adhesive has the property that it is tacky under the action of temperature and optionally under pressure and builds up a high bond strength after bonding and cooling by solidification. Depending on the chemical nature of the heat-activatable adhesives, these have different static glass transition temperatures T GA or melting points T SA , which substantially determine the application temperature during bonding and during hot lamination.
- the heat-activatable adhesives may have different polymer structures.
- heat-activatable poly (meth) acrylate-based adhesives are used.
- poly (meth) acrylate adhesives are used which consist of polymers of at least the following monomers a1) 70 to 100 wt .-% acrylic acid esters and / or methacrylic acid esters and / or their free acids having the following formula
- acrylic monomers comprising acrylic and methacrylic acid esters having alkyl groups consisting of 1 to 14 carbon atoms are used.
- Specific examples are methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propymethacrylate, n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n Octyl acrylate, n-nonyl acrylate, lauryl acrylate, stearyl acrylate, stearyl methacrylate, behenyl acrylate, and their branched isomers, such as 2-ethylhexyl acrylate.
- a2) acrylic monomers are used according to the following general formula
- component a2) are hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, allyl alcohol, maleic anhydride, itaconic anhydride, itaconic acid, acrylamide and glyceridyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate,
- aromatic vinyl compounds are used for component a2), wherein the aromatic nuclei preferably consist of C 4 - to C 18 -based building blocks and may also contain heteroatoms.
- aromatic nuclei preferably consist of C 4 - to C 18 -based building blocks and may also contain heteroatoms.
- Particularly preferred examples are styrene, 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene, 4-vinylbenzoic acid, although this list is not exhaustive.
- the monomers are chosen so that the resulting polymers can be used as heat-activatable adhesives.
- the glass transition temperature of the resulting polymer is above room temperature; advantageously above 30 ° C.
- amorphous or partially crystalline systems are characterized by the transformation of the more or less hard amorphous or partially crystalline phase into a softer (rubbery to viscous) phase. At the glass point, it is especially in polymeric systems for "thawing” (or “thawing”). "Freezing" on cooling) of Brownian motion longer
- Melting point in this document refer to the determination by means of calorimetric measurement (DDK; Dynamic differential calorimetry;
- the monomers are very preferably selected in accordance with the above and the quantitative composition of the monomer mixture is advantageously chosen such that according to equation (G1) in analogy to the Fox equation (TG Fox, Bull. Am. Phys Soc., 1 (1956) 123) gives the desired T GA value for the polymer.
- n the number of runs via the monomers used
- w n the mass fraction of the respective monomer n (wt .-%)
- T G n the respective glass transition temperature of the homopolymer of the respective monomers n in K.
- those based on polyolefins are used for the purposes of the heat-activatable adhesive.
- the heat-activatable polyolefin-based adhesives preferably have glass transition temperatures of +75.degree. C. to 180.degree.
- the bond strength of these polymers can be increased by targeted additive.
- polyimine or polyvinyl acetate copolymers can be used as adhesion-promoting additives.
- the monomers used and their amounts are again preferably chosen so that when using the equation (G1) results in the desired temperature.
- the glass transition temperature of the heat-activatable adhesive it is advantageous to further limit the glass transition temperature of the heat-activatable adhesive. If the temperature is too low, there is a risk that the adhesive tape will already begin to melt on delivery or during transport at elevated temperatures and the adhesive tape can no longer be unrolled.
- the molecular weight and the comonomer composition of the monomers in the preparation of the adhesives can be varied.
- polymers of medium or low molecular weight are used.
- low molecular weight and high molecular weight polymers can be mixed together.
- polyethenes, polypropenes, polybutenes, polyhexenes or copolymers of polyethene, polypropene, polybutene or polyhexene are used.
- Polyethylene and polyethylene copolymers can be coated, for example, as aqueous dispersions.
- the mixture used in turn depends on the desired glass transition temperature of the heat-activatable adhesive.
- Various heat-activatable poly- ⁇ -olefins are commercially available from Degussa under the trade name Vestoplast TM.
- Propene-rich grades are offered under the designations Vestoplast TM 703, 704, 708, 750, 751, 792, 828, 888 or 891. These have melting points T SA of 99 to 162 ° C.
- butene-rich grades are also commercially available under the names Vestoplast TM 308, 408, 508, 520 and 608. These have melting points T SA of 84 to 157 ° C.
- heat-activable PSAs are described in US Pat. Nos. 3,326,741, 3,639,500, 4,404,246, 4,452,955, 4,404,345, 4,545,843, 4,880,683 and 5,593,759. These also refer to further temperature-sensitive PSAs.
- the heat-activatable adhesive consists of at least one elastomer and at least one reactive resin component.
- Synthetic rubbers are used in particular as elastomers, such as polyvinyl butyral, polyvinylformal, nitrile rubbers, nitrile-butadiene rubbers, hydrogenated nitrile-butadiene rubbers, polyacrylate rubbers, chloroprene rubbers, ethylene-propylene-diene rubbers, methyl-vinyl silicone rubbers, fluorosilicone rubbers. Rubbers, tetrafluoroethylene-propylene copolymer rubbers, butyl rubbers, styrene-butadiene rubbers.
- elastomers such as polyvinyl butyral, polyvinylformal, nitrile rubbers, nitrile-butadiene rubbers, hydrogenated nitrile-butadiene rubbers, polyacrylate rubbers, chloroprene rubbers, ethylene-propylene-diene rubbers, methyl-vinyl silicone rubbers, fluorosilicone rubbers.
- Nitrile-butadiene rubbers are available, for example, on Europrene TM from Eni Chem, or under Krynac TM from Bayer, or as Breon TM and Nipol N TM from Zeon.
- Polyvinyl butyrals are available as Butvar TM from Solucia, under Pioloform TM from Wacker and under Mowital TM from Kuraray.
- Hydrogenated nitrile butadiene rubbers are available, for example, under Therban TM from Bayer and Zetpol TM from Zeon.
- Polyacrylate rubbers are available, for example, under Nipol AR TM from Zeon.
- Chloroprene rubbers are available, for example, from Baypren TM from Bayer.
- Ethylene-propylene-diene rubbers are available, for example, under Keltan TM from DSM, under Vistalon TM from Exxon Mobile and under Buna EP TM from Bayer.
- Methyl vinyl silicone rubbers are available, for example, under Silastic TM from Dow Corning and under Silopren TM from GE Silicones. Fluorosilicone rubbers are available, for example, under Silastic TM from GE Silicones.
- Butyl rubbers are available, for example, under Esso Butyl TM from Exxon Mobile.
- Styrene-butadiene rubbers are available, for example, under Buna S TM from Bayer, and Europrene TM from Eni Chem and under Polysar S TM from Bayer.
- Polyvinylformals are available, for example, under Formvar TM from Ladd Research.
- the synthetic rubbers preferably have a glass transition temperature between -80 ° C and 0 ° C.
- mixtures with thermoplastics and elastomers can be used.
- thermoplastic materials are preferably selected from the group of the following polymers: polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyesters, hard polyvinyl chlorides, flexible polyvinyl chlorides, polyoxymethylenes, polybutylene terephthalates, polycarbonates, fluorinated polymers, such as.
- polytetrafluoroethylene polyamides, ethylene vinyl acetates, polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, polyolefins, such as polyethylene, polypropylene, polybutene, polyisobutene, and poly (metha) crylate.
- These thermoplastic materials in a preferred embodiment have a glass transition temperature between + 60 ° C and + 125 ° C.
- tackifying resins and / or reactive resins are optionally possible to add tackifying resins and / or reactive resins.
- the proportion of the resins is between 75 and 25 wt .-%, based on the total mixture of elastomer and resin.
- Suitable tackifying resins to be added are the previously known adhesive resins described in the literature. Mention may be made representative of the pinene, indene and rosin resins, their disproportionated, hydrogenated, polymerized, esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene phenolic resins and C5, C9 and other hydrocarbon resins. Any combination of these and other resins can be used to adjust the properties of the resulting adhesive as desired.
- all compatible with the elastomer (soluble) resins can be used, in particular reference is made to all aliphatic, aromatic, alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins.
- reactive resins are additionally or alternatively added to the elastomer.
- Reactive resins are to be understood as meaning those resins which have functional groups which can undergo chemical reactions, in particular crosslinking reactions, under activation, in particular thermal activation.
- a very preferred group from which the reactive resins can be selected includes epoxy resins. The molecular weight of the epoxy resins varies from 100 g / mol up to a maximum of 10,000 g / mol for polymeric epoxy resins.
- the epoxy resins include, for example, epichlorohydrin, glycidyl esters, the reaction product of epichlorohydrin and p-amino phenol, and / or the reaction product of bisphenol A and epichlorohydrin.
- Preferred commercial examples include Araldite TM 6010, CY-281 TM, ECN TM 1273, ECN TM 1280, MY 720, RD-2 from Ciba Geigy, DER TM 331, DER TM 732, DER TM 736, DEN TM 432, DEN TM 438, DEN TM 485 from Dow Chemical, Epon TM 812, 825, 826, 828, 830, 834, 836, 871, 872,1001, 1004, 1031 etc. from Shell Chemical and HPT TM 1071, HPT TM 1079 also from Shell Chemical.
- Examples of commercial aliphatic epoxy resins are e.g. Vinylcyclohexane dioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
- novolak resins e.g. Epi-Rez TM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN TM 431, DEN TM 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, Epiclon TM N673 from DaiNipon Ink Chemistry or Epicote TM 152 from Shell Chemical.
- reactive resins it is also possible to use terpene-phenolic resins, e.g. Use NIREZ TM 2019 from Arizona Chemical.
- reactive resins may also be phenolic resins, e.g. YP 50 from Toto Kasei, PKHC from Union Carbide Corp. and BKR 2620 from Showa Union Gosei Corp. deploy.
- phenolic resole resins can also be used as reactive resins in combination with other phenolic resins.
- polyisocyanates such as e.g. Use Coronate TM L from Nippon Polyurethane Ind., Desmodur TM N3300 or Mondur TM 489 from Bayer.
- crosslinkers and accelerators can also be optionally added to the mixture.
- Imidazoles commercially available as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, PO550, L07N from Shikoku Chem. Corp., for example, are suitable as accelerators. or Curezol 2MZ from Air Products. Further suitable crosslinkers are HMTA (hexamethylenetetramine) additives. Furthermore, amines, in particular tert. -Amine use for acceleration.
- plasticizers can also be used in a favorable procedure.
- plasticizers based on polyglycol ethers, polyethylene oxides, phosphate esters, aliphatic carboxylic acid esters and benzoic acid esters can be used.
- aromatic carboxylic esters relatively high molecular weight diols, sulfonamides and adipic esters.
- optional fillers e.g., fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres of other materials, silicic acid, silicates
- nucleating agents e.g., fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres of other materials, silicic acid, silicates
- blowing agents e.g., tackifying additives and thermoplastics
- compounding agents and / or anti-aging agents e.g. be added in the form of primary and secondary antioxidants or in the form of sunscreens.
- further additives are added to the elastomer, e.g. Polyvinylformal, polyacrylate rubbers, chloroprene rubbers, ethylene-propylene-diene rubbers, methyl-vinyl-silicone rubbers, fluorosilicone rubbers, tetrafluoroethylene-propylene copolymer rubbers, butyl rubbers, styrene-butadiene rubbers.
- Polyvinyl butyrals are available as Butvar TM from Solucia, under Pioloform TM from Wacker and under Mowital TM from Kuraray.
- Polyacrylate Rubbers are available from Nipol AR TM from Zeon.
- Chloroprene rubbers are available under Baypren TM from Bayer.
- Ethylene-propylene-diene rubbers are available under Keltan TM from DSM, under Vistalon TM from Exxon Mobile and under Buna EP TM from Bayer.
- Methyl vinyl silicone rubbers are available from Silastic TM from Dow Corning and Silopren TM from GE Silicones. Fluorosilicone rubbers are available as Silastic TM from GE Silicones.
- Butyl rubbers are available on Esso Butyl TM from Exxon Mobile. Styrene-butadiene rubbers are available under Buna S TM from Bayer, and Europrene TM from Eni Chem, and under Polysar S TM from Bayer. Polyvinylformals are available on Formvar TM from Ladd Research.
- thermoplastic materials from the group of the following polymers: polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyesters, Hard polyvinyl chlorides, soft polyvinyl chlorides, polyoxymethylenes,
- Polybutylene terephthalates polycarbonates, fluorinated polymers, such as. Polytetrafluoroethylene, polyamides, ethylene vinyl acetates, polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, polyolefins, e.g. Polyethylene, polypropylene, polybutene, polyisobutene, and poly (metha) crylate.
- fluorinated polymers such as. Polytetrafluoroethylene, polyamides, ethylene vinyl acetates, polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, polyolefins, e.g. Polyethylene, polypropylene, polybutene, polyisobutene, and poly (metha) crylate.
- the bond strength of the heat-activatable adhesive can be increased by further targeted addition.
- Polyimine or polyvinyl acetate copolymers also use as adhesion-promoting additives.
- the release liner used according to the invention has a polyolefin film on at least one side.
- the release liner which is heat-laminated to in the process according to the invention, is one which, on thermal activation, ie also in the hot lamination process itself, forms a slight pressure-sensitive tack. If the composite of release liner and layer of the heat-activatable adhesive cools again, the adhesion of the two layers to one another remains. It has been found that, surprisingly, the heat-activatable adhesive can again be excellently laminated by the release liner to the desired substrate to be bonded, so that it can then be bonded as desired.
- release liners themselves can be regarded as heat-activatable films which, on thermal activation, form a pressure-sensitive adhesive at least on their surface.
- the pressure-sensitive tackiness of the release liners and thus the adhesion of the release liner and the heat-activatable adhesive layer can be controlled in particular by the choice of the temperature in the H mustumlaminierrata, so that the detachability of the heat-activatable adhesive for the particular application of the later present punched can be adjusted. It is thus advantageously possible to produce composites from a layer of a heat-activatable adhesive and a release liner by means of the method according to the invention, in which the release force of the two Layers can be predefined from one another and adapted to specific requirement profiles.
- release liners are used whose glass transition temperature is at least 20 ° C., preferably at least 30 ° C. lower than the glass transition temperature of the heat-activatable pressure-sensitive adhesive.
- the release liner consists of a coextruded film of a polyolefin and a hard film material such as polyester, PMMA (polymethyl methacrylate), polyimide, polyethylene naphthalate, polyurethane or polyamide.
- the films are preferably produced by coextrusion.
- PE polyethylene
- PP polypropylene
- polyolefins in particular poly- ⁇ -olefins are used which in particular have a glass transition temperature which is smaller by 20 ° C., more preferably by 30 ° C., than that of the heat-sensitive adhesive.
- release liners can advantageously be used for such polyolefin-based heat-activatable pressure-sensitive adhesives.
- the polyolefins of the - in particular coextruded - release liner preferably have glass transition temperatures of + 55 ° C to + 150 ° C.
- the adhesive power of these polymers can be increased by targeted additive.
- polyimine or polyvinyl acetate copolymers can be used as adhesion-promoting additives.
- the monomers used for preparing the release liners and their amounts are again preferably selected such that the desired temperature results when equation (G1) is used.
- the molecular weight and the comonomer composition are varied.
- polymers having a medium or low molecular weight are preferably used.
- low molecular weight and high molecular weight polymers can be mixed together.
- polyethylenes, polypropylenes, polybutylenes, polyhexenes or copolymers of polyethylene, polypropylene, polybutylene or polyhexene are used.
- the coextruded release liner may have a silkon layer as a repellent layer. This is applied to the hard side of the coextruded film, ie the polyolefin side opposite side of the film.
- This form of release liner is preferable when e.g. no cover liner is used for the stamping process and the diecuts are rolled up directly on the coextruded release liner. The diecuts then do not stick to the back side (the siliconized side) of the next winding.
- the coextruded release liner may have a microstructure on the polyolefin side. This can e.g. be impressed by means of a gravure roll in the heat on the polyolefin side.
- the adhesion between the Releaseliner and the heat-activatable adhesive layer can be further adjusted, in particular in such a way that the contact surface between the two layers is reduced and the removability of the heat-activable PSAs - in particular in the form of diecuts - is facilitated by the Releaseliner.
- release liners are e.g. commercially available from the company Loparex under the trade name FILM PLUS TM and can be used excellently according to the invention.
- the release liner on the polyolefin side has a topography which is inverse to the heat-sensitive adhesive is transmitted.
- the topography consists of coherent elevations, which can be both roundish or angular.
- the elevations preferably occupy at least 2% of the total area and / or a maximum of 65% of the total area.
- the proportion of surveys is at least 5%.
- the remaining area should preferably be planar.
- the planar surface but also have a micro-roughness, but should be below the height of the surveys.
- the adhesion between the release liner and the heat-activatable adhesive layer can also be further adjusted by means of such a topography, here in particular in such a way that the contact area between the two layers is increased and the detachability of the heat-activable pressure-sensitive adhesives - in particular in the form of the diecuts - from the release liner is difficult, so you have to spend higher detachment.
- the coextruded release liners preferably have a total layer thickness of 25-350 ⁇ m, more preferably 50-250 ⁇ m.
- the polyolefin layer preferably has at least a layer thickness of 2 ⁇ m.
- the polyolefin layer should in this case be kept as thin as possible, so that in the subsequent punching process the hard back of the release liner, e.g. PET, acting as a hard resistor for the punching knife.
- a substrate After the preparation of the PSA is first coated on a substrate.
- This may be a permanently remaining carrier material or in particular also a first temporary carrier material (a temporarily present substrate).
- a first temporary carrier material for example a release paper, is used, which, however, results in the disadvantages described above for the stamping process.
- the materials which are familiar and customary to the person skilled in the art are suitable, especially those based on non-woven fabrics, since these interfere with the stamping process a little; in particular, for example, films (polyester, PET, PE, PP, BOPP, PVC, HDPE, LDPE).
- the inventive method is characterized by the fact that the heat-activatable adhesive layer is laminated with an exposed side prior to punching on a second temporary carrier material, the release liner described in more detail below, under the influence of temperature.
- a carrier material is coated on both sides with the heat-activatable adhesive and then laminated one of the adhesive layers on the release liner.
- the release liner should preferably have a temperature resistance, so that no damage occurs.
- the required temperature resistance and thus the laminating temperature depends on the activation or glass transition temperature of the heat-activatable adhesive.
- the activation temperature in the hot lamination process is selected such that it lies in a temperature range between the glass transition temperature of the release liner and the glass transition temperature of the heat-activatable adhesive. This can be achieved that the pressure-sensitive adhesive of the surface of the release liner is effected, while the heat-activatable adhesive layer remains during this process stage remains in non-sticky form.
- the heat-activatable adhesive which in particular is coated on the first (temporary) support, e.g. a release paper is present, laminated together with the - in particular coextruded - release liner.
- the polyolefin side of the release liner shows the heat-activatable adhesive layer.
- the layer of adhesive on a permanent carrier can be laminated to the release liner.
- a first lamination can be done on cold rolls (at room temperature - then the release liner is only on the heat-activated film). Thereafter, or when prelaminating is not performed, as "first" lamination, lamination is performed under activation conditions (hot lamination); in particular by heated rollers with the introduction of heat and pressure. The transfer with pressure is carried out, for example, by at least one laminating roller. Here rubberized rollers are preferably used.
- the Schurollenlaminator is preferably operated with a pressure range between 1 and 20 bar.
- the temperature range is preferably between 50 and 170 ° C; adjustable as a function of the activation temperature of the heat-activatable adhesive.
- different heat roller laminators can be combined with each other.
- the throughput speeds are between 0.5 and 50 m / min, more preferably between 2 and 10 m / min.
- the heating rollers of the roller laminator can be heated from the inside or from an external heat source.
- the lamination temperature is increased to provide sufficient heat to soften and tackify the polyolefin layer of the, especially coextruded, release liner.
- a stamping process takes place.
- punching processes can be used in an excellent manner, for example, rotary punching.
- the stamping process can be a punching or a stamping process. Accordingly, the following variants can be advantageously carried out:
- the stamping process completely cuts through the adhesive on the release liner, the stamping process does not completely sever the adhesive on the release liner, the stamping process completely cuts through the adhesive material-equipped backing material, the stamping process does not cut through the adhesive material or only partially.
- the lamination of the heat-activatable adhesive to the - especially coextruded -releaseliner and the following punching process can advantageously be carried out in an in-line process, ie in a combined system and / or continuous sequence. Alternatively, however, the lamination process and the stamping process can be separated from each other.
- a cover liner e.g. made of PET, is laminated to the open side of the heat-activatable adhesive to protect it during rolling of the composite or during its transport or storage.
- Rotary punching process separation of the siliconized cover film and the adhesive bond. Ideally, the punching blades penetrate only minimally into the polyolefin layer of the release liner.
- Rotary punching process separation of the adhesive bond. Ideally, the punching blades penetrate only minimally into the polyolefin layer of the release liner.
- Examples of the speed at which the composite of heat-activatable adhesive and, in particular, coextruded release liner run through the installation are 0.1 m / min to 100 m / min. In practice today common speeds for punching processes are 10 to 30 m / min. For further punching processes, for example flatbed punches can also be used in an outstanding manner.
- the punching process can also be a punching or a stamping process in this case.
- Nipol N1094-80 nitrile rubber
- phenol novolak resin Durez 33040 mixed with 8% HMTA (Rohm and Haas)
- 10 wt .-% of the phenolic resole resin 9610 LW the Fa Bakelites were prepared as a 30% solution in methyl ethyl ketone in a kneader. The kneading time was 20 h.
- the heat-activatable adhesive was then spread out of solution onto a graduated glassine liner (70 ⁇ m, Laufenberg company) and dried at 100 ° C. for 10 minutes. After drying, the layer thickness was 100 ⁇ m.
- Examples 1 and 2 were each laminated to a coextruded PET / PE liner from Loparex.
- the liner has a total thickness of 90 microns, the PE layer has a thickness of about 20 microns.
- the liner has siliconization on the back (PET side). It is a lightly separating easy-release silicone system applied with about 0.5 g / m 2 silicone coating.
- Examples 1 and 2 were each run with the coextruded release liner through a Schurollenlaminator, wherein the coextruded PET / PE liner with the PE side to heat-activated adhesive is directed.
- the lamination temperature was 90 ° C with both rubber rolls of the roll laminator heated.
- the pressure was 2 bar and the speed 1 m / min. Subsequently, the glassine liner was uncovered before winding and only the heat-activatable adhesive was wound up with the coextruded PET / PE liner.
- the roll width of the adhesive materials used was 130 mm.
- the punching tests with the heat-activatable adhesive were carried out so that on the coextruded
- PET / PE liner was punched ("kiss cut" method).
- a second siliconized auxiliary release material was partially laminated from above onto the open adhesive side of the test adhesive tape.
- the auxiliary release material used was a single-sided siliconized, easily separating PET film with a layer thickness of 36 ⁇ m.
- the deduction of the grid was made at an angle of about 80 °.
- the punching speed was 18 m / min.
- the diameter of the diecuts is 14 mm from tip to tip.
- the diameter of the diecuts is 5 mm from tip to tip.
- Circular stamped pieces The circle diameter of the diecuts is 8 mm.
- the punching tests prove that all products can be punched and debittered with the various punching dies on the coextruded PET / PE release liner.
- the circular punched products (target products 3) were laminated to a 1 mm thick aluminum sheet at 120 ° C. and with the aid of a heat roller laminator. After hot lamination, the diecut adhered to the aluminum sheet and the coextruded PET / PE liner was easily removed. Subsequently, the bond strength of Examples 1 and 2 was determined.
- the bond strength was measured with 2 aluminum sheets with a layer thickness of 1 mm in each case in accordance with DIN EN 1465. The measured values were given in N / mm 2 . For the bonding, it was cured under 50 N / cm 2 for 8 minutes at 120 ° C. in a hot press.
- Table 3 shows that with Examples 1 and 2 high bond strengths can be achieved.
- the invention thus presents the principle that a release liner material, which is usually at least partially antiadhesive in its purpose, that is to avoid the adhesion of adhesives to it, at times to at least to an extent pressure-sensitive, which is a layer of heat-sensitive adhesive, the Time of dropping but not sticky itself, can be stored on it sticking. After depositing, the adhesion of the layers to each other persists until the heat-activatable pressure-sensitive adhesive film is removed again, in particular by transfer to a substrate to be bonded. Surprisingly, the removal process of the heat-activatable adhesive from the release liner succeeds flawlessly and without residues, and the required release forces can be definedly influenced by the parameters of the process according to the invention.
- the process differs significantly from the usual procedure, heat-activatable adhesives deposit on carriers and to cause the adhesion from the stickiness of the adhesive.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07786914A EP2049608A1 (de) | 2006-07-28 | 2007-06-29 | Verfahren zum stanzen von bei raumtemperatur nicht tackigen hitzeaktivierbaren klebmassen |
US12/374,805 US8062458B2 (en) | 2006-07-28 | 2007-06-29 | Method for stamping thermally activatable adhesive materials which are not tacky at room temperature |
JP2009521184A JP2009544777A (ja) | 2006-07-28 | 2007-06-29 | 室温で非粘着性の熱活性化可能な接着材料の打ち抜き法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006035787A DE102006035787A1 (de) | 2006-07-28 | 2006-07-28 | Verfahren zum Stanzen von bei Raumtemperatur nicht tackigen hitzeaktivierbaren Klebmassen |
DE102006035787.6 | 2006-07-28 |
Publications (1)
Publication Number | Publication Date |
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WO2008012166A1 true WO2008012166A1 (de) | 2008-01-31 |
Family
ID=38599373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2007/056529 WO2008012166A1 (de) | 2006-07-28 | 2007-06-29 | Verfahren zum stanzen von bei raumtemperatur nicht tackigen hitzeaktivierbaren klebmassen |
Country Status (7)
Country | Link |
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US (1) | US8062458B2 (de) |
EP (1) | EP2049608A1 (de) |
JP (1) | JP2009544777A (de) |
KR (1) | KR20090035630A (de) |
CN (1) | CN101495584A (de) |
DE (1) | DE102006035787A1 (de) |
WO (1) | WO2008012166A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012501361A (ja) * | 2008-09-01 | 2012-01-19 | ロックタイト (アール アンド ディー) リミテッド | 剥離基体上の転写可能な硬化性非液体フィルム |
EP3003711A1 (de) * | 2013-06-04 | 2016-04-13 | Polifilm Extrusion GmbH | Mehrschichtfolie mit thermisch aktivierbarer kleberschicht |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009036967A1 (de) | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Herstellung von Polyacrylaten |
GB201012595D0 (en) | 2010-07-27 | 2010-09-08 | Zephyros Inc | Oriented structural adhesives |
JP5802669B2 (ja) * | 2010-07-29 | 2015-10-28 | 株式会社クラレ | 熱可塑性重合体組成物および成形品 |
CN102559132A (zh) * | 2011-12-26 | 2012-07-11 | 吴江德邦科技化工有限公司 | 一种陶瓷粘合剂及生产方法 |
DE102016223550A1 (de) * | 2016-03-10 | 2017-09-14 | Tesa Se | Verbundsystem mit schwach klebendem Abdeckmaterial |
JP7450356B2 (ja) * | 2018-09-28 | 2024-03-15 | 帝人株式会社 | 熱変性ポリマー層-無機基材複合体、ポリマー部材-無機基材複合体、及びそれらの製造方法 |
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EP0578979A1 (de) * | 1992-07-11 | 1994-01-19 | Beiersdorf Aktiengesellschaft | Verwendung eines Streifens einer Klebfolie für eine wiederlösbare Verklebung |
WO2005063909A1 (de) * | 2003-12-23 | 2005-07-14 | Tesa Ag | Klebfolie zur implantierung von elektrischen modulen in einen kartenkörper |
WO2007012656A1 (de) * | 2005-07-28 | 2007-02-01 | Tesa Ag | Klebstofffolie auf basis von nitrilkautschuk-blends zur fixierung von metallteilen auf kunststoffen |
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GB1053242A (de) | 1962-05-18 | 1900-01-01 | ||
US3639500A (en) | 1968-05-09 | 1972-02-01 | Avery Products Corp | Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier |
US4452955A (en) | 1981-09-16 | 1984-06-05 | Minnesota Mining & Manufacturing Company | Novel adhesive compositions |
US4404345A (en) | 1981-09-16 | 1983-09-13 | Minnesota Mining And Manufacturing Company | Novel adhesive compositions |
US4880683A (en) | 1981-12-28 | 1989-11-14 | Minnesota Mining And Manufacturing Company | Hot-tackifying adhesive tape |
CA1175330A (en) | 1982-09-01 | 1984-10-02 | David Bray | Method of manufacturing adhesive tape |
US4404246A (en) | 1982-09-22 | 1983-09-13 | Minnesota Mining And Manufacturing Company | Storable, crosslinkable pressure-sensitive adhesive tape |
EP0665782B1 (de) | 1992-10-20 | 2000-03-22 | Avery Dennison Corporation | Strukturhaftkleber |
US6531024B1 (en) * | 2000-04-06 | 2003-03-11 | Wisconsin Label Corporation | In-line construction of prismatic labels |
DE10123163A1 (de) | 2001-05-09 | 2003-01-16 | Gruenenthal Gmbh | Substituierte Cyclohexan-1,4-diaminderivate |
US20060228480A1 (en) * | 2005-03-30 | 2006-10-12 | David Lin | Method of manufacturing a release liner |
-
2006
- 2006-07-28 DE DE102006035787A patent/DE102006035787A1/de not_active Withdrawn
-
2007
- 2007-06-29 KR KR1020097004335A patent/KR20090035630A/ko not_active Application Discontinuation
- 2007-06-29 CN CNA2007800282595A patent/CN101495584A/zh active Pending
- 2007-06-29 EP EP07786914A patent/EP2049608A1/de not_active Withdrawn
- 2007-06-29 US US12/374,805 patent/US8062458B2/en not_active Expired - Fee Related
- 2007-06-29 JP JP2009521184A patent/JP2009544777A/ja not_active Withdrawn
- 2007-06-29 WO PCT/EP2007/056529 patent/WO2008012166A1/de active Application Filing
Patent Citations (3)
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EP0578979A1 (de) * | 1992-07-11 | 1994-01-19 | Beiersdorf Aktiengesellschaft | Verwendung eines Streifens einer Klebfolie für eine wiederlösbare Verklebung |
WO2005063909A1 (de) * | 2003-12-23 | 2005-07-14 | Tesa Ag | Klebfolie zur implantierung von elektrischen modulen in einen kartenkörper |
WO2007012656A1 (de) * | 2005-07-28 | 2007-02-01 | Tesa Ag | Klebstofffolie auf basis von nitrilkautschuk-blends zur fixierung von metallteilen auf kunststoffen |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012501361A (ja) * | 2008-09-01 | 2012-01-19 | ロックタイト (アール アンド ディー) リミテッド | 剥離基体上の転写可能な硬化性非液体フィルム |
EP3003711A1 (de) * | 2013-06-04 | 2016-04-13 | Polifilm Extrusion GmbH | Mehrschichtfolie mit thermisch aktivierbarer kleberschicht |
Also Published As
Publication number | Publication date |
---|---|
KR20090035630A (ko) | 2009-04-09 |
EP2049608A1 (de) | 2009-04-22 |
JP2009544777A (ja) | 2009-12-17 |
CN101495584A (zh) | 2009-07-29 |
US8062458B2 (en) | 2011-11-22 |
DE102006035787A1 (de) | 2008-03-13 |
US20090283209A1 (en) | 2009-11-19 |
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