WO2008010528A1 - Liquid crystal orienting agent and liquid crystal oriented film and liquid crystal display element using the same - Google Patents

Liquid crystal orienting agent and liquid crystal oriented film and liquid crystal display element using the same Download PDF

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Publication number
WO2008010528A1
WO2008010528A1 PCT/JP2007/064207 JP2007064207W WO2008010528A1 WO 2008010528 A1 WO2008010528 A1 WO 2008010528A1 JP 2007064207 W JP2007064207 W JP 2007064207W WO 2008010528 A1 WO2008010528 A1 WO 2008010528A1
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WIPO (PCT)
Prior art keywords
amine compound
liquid crystal
solvent
formula
mass
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PCT/JP2007/064207
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French (fr)
Japanese (ja)
Inventor
Kimiaki Tsutsui
Hirobumi Shida
Mariko Yamada
Kosuke Takazawa
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Nissan Chemical Industries, Ltd.
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Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to KR1020097000976A priority Critical patent/KR101426100B1/en
Priority to JP2008525889A priority patent/JP5428336B2/en
Priority to CN2007800270738A priority patent/CN101490188B/en
Publication of WO2008010528A1 publication Critical patent/WO2008010528A1/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/52Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K19/54Additives having no specific mesophase characterised by their chemical composition
    • C09K19/56Aligning agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • G02F1/133723Polyimide, polyamide-imide

Definitions

  • the present invention relates to a coating liquid suitable as a liquid crystal aligning agent, and further relates to a liquid crystal alignment film and a liquid crystal display element obtained using this coating liquid.
  • a liquid crystal alignment film used in a liquid crystal display element or the like is generally made of polyimide, and is usually manufactured by applying a solution called a liquid crystal alignment agent and baking it. Yes.
  • the liquid crystal aligning agent is generally a solution containing a polyimide precursor such as polyamic acid or a solvent-soluble polyimide, but contains both a polyamic acid and a solvent-soluble polyimide (see Patent Document 1).
  • polyamic acids and those containing two or more types of imidopolymers having different imidication ratios obtained by dehydrating and ring-closing polyamic acids see Patent Document 2.
  • the liquid crystal aligning power which contains several kinds of resin components
  • the obtained liquid crystal aligning film has several required properties such as liquid crystal orientation, liquid crystal pretilt angle, and various electric characteristics of the liquid crystal cell. It is known that can be realized simultaneously.
  • Patent Document 1 Japanese Patent Laid-Open No. 8-220541
  • Patent Document 2 Japanese Patent Laid-Open No. 9-2937312
  • Patent Document 3 International Publication No. 2004Z090016 pamphlet
  • the problem to be solved by the present invention is to improve the stability during moisture absorption with respect to a coating solution containing both a polyamic acid and an imidized polymer soluble in a solvent.
  • An object of the present invention is to provide a coating liquid suitable as a liquid crystal aligning agent, to provide a high-quality liquid crystal alignment film, and to provide a high-quality liquid crystal display element.
  • the present inventors have made a specific amine compound react with a solvent-soluble polyimide, or a raw material for producing a solvent-soluble polyimide. It has been found that the use of a specific amine compound improves the hygroscopic stability of the mixed solution with the polyamic acid, and the present invention has been completed. That is, the present invention has the following features.
  • a coating solution comprising: an imidized polymer that is soluble in the obtained solvent and at least one selected amine compound strength; and (B) component: polyamic acid.
  • Amine compound (a) In the molecule, at least one primary amino group selected from formula [K1] and formula [K2] and at least an imino group selected from formula [K3] and formula [K4] One amine compound.
  • the bonding direction of —CH—NH— is opposite.
  • Amine compound (b) an amine compound having at least two primary amino groups selected from the above formulas [K1] and [K2] in the molecule.
  • the component (A) is composed of at least one of a side chain and a molecular end of a solvent-soluble polyimide obtained by the ability of a tetracarboxylic dianhydride and a diamine compound, and the amine compound (a) and The coating solution according to the above (1), which is an imidized polymer soluble in a solvent obtained by binding an amine compound (b) with at least one amine compound that also has a selected force.
  • the component (A) is at least one selected from the amine compound (a) and the amine compound (b) as a solvent-soluble polyimide obtained by combining tetracarboxylic dianhydride and diamine compound.
  • the component (A) is a solvent-soluble imido compound obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride with a diamine compound containing an amine compound (c).
  • the component (A) is a solvent obtained by using, as the amine compound (a), at least one amine compound selected from amine compounds represented by the following formulas (i) and (ii):
  • the coating solution according to the above (1) which is an imidized polymer soluble in water.
  • R 1 in the formula is CH CH (CH) or one CH (CH CH) —
  • X 1 represents a single bond or an aliphatic hydrocarbon having 120 carbon atoms
  • —NH 2 may be contained in the aliphatic hydrocarbon.
  • X 2 represents an organic group having 120 carbon atoms, an alkyl group having 120 carbon atoms, and a cyclic aliphatic group.
  • Organic group consisting of a group, aromatic group, heterocyclic group, carboxyl group and combinations thereof, and unsaturated bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), An amino bond (one NH 3), an amine bond (one N), a silyl bond (one Si—), a siloxane bond (SiO 2), and the like may be included. Furthermore, even if the alkyl group of X 2 forms a heterocyclic structure with any of —R 1 , X 1 —, —CH 1, and NH
  • the component (A) is at least one amine compound selected from amine compounds represented by the following formulas (m) to (V) as the amine compound (b):
  • R 1 in the formula is CH —, one CH (CH 2) one, or one CH (CH 2 CH 2) —
  • X 3 represents a single bond or an organic group having 1 to 20 carbon atoms, an alkylene group having 1 to 20 carbon atoms, an aliphatic ring, an aromatic ring, a heterocyclic ring, and an organic group having a combination force thereof, and , Unsaturated bond, ether bond (one 0—), ketone bond (one CO), ester bond (COO), thioether bond (one S), silyl bond (one Si—), siloxane bond (one SiO), etc. May be included.
  • x 4 , x 5 , X 6 , X 7 and X 8 each independently represent an aliphatic hydrocarbon having 1 to 20 carbon atoms, and may be the same or different.
  • the component (A) is at least one amine compound selected from amine compounds represented by the following formulas (i), (ii), Gv) and (V) as the amine compound (c):
  • Ratio power of imidized polymer of component (A) and polyamic acid of component (B) In the total mass of component (A) and component (B), the ratio of polyamic acid of component (B) is The coating solution according to any one of (1), (2), and (4) to (7), which is 20 to 99% by mass.
  • the component (A) is composed of tetracarboxylic dianhydride and diamine compound, and the solvent-soluble polyimide obtained is 100 parts by mass with respect to the amine compound (a) and amine compound (b).
  • the coating liquid according to (3) above which is a product obtained by reacting 1 to 15 parts by mass of at least one amine compound selected from
  • the component (A) is soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride and a diamine containing the amine compound (c) represented above.
  • a liquid crystal aligning agent comprising the coating liquid according to any one of (1) to (10) above.
  • the coating liquid of the present invention precipitation of the resin component due to moisture absorption is suppressed, stable printability can be obtained, and it can be suitably used as a liquid crystal aligning agent.
  • the coating of the present invention Since the liquid crystal alignment film obtained using the cloth liquid has improved rubbing resistance and improved ease of stored charge release, a liquid crystal display element of higher quality than before can be obtained.
  • FIG. 1 is a graph showing a comparison of the ease of escape of accumulated charges in a liquid crystal cell using a liquid crystal aligning agent having a coating solution force of Example 4 or Comparative Example 1.
  • the solvent-soluble imidized polymer component is particularly suitable for forming a liquid crystal alignment film at a low firing temperature.
  • the polyamic acid component contributes to printability, adhesion to the substrate, reduction of charge accumulation and ease of charge removal when used as a liquid crystal alignment film.
  • the concentration of soluble polyimide and polyamic acid in the film thickness direction has a gradient, which makes it difficult to obtain with a single resin component.
  • the liquid crystal aligning agent staying on the printing press is concentrated by volatilization of the solvent and further absorbs moisture as described above.
  • the aggregation and precipitation of the fat component is thought to be one of the causes of printing defects. Therefore, the present inventors have moderately suppressed this phase separation by the action of a specific amine compound, so that the advantage of containing both the solvent-soluble polyimide and the polyamic acid is not lost. As a result, the present invention has been completed.
  • the present invention relates to a solvent obtained from tetracarboxylic dianhydride, diamine compound, and an amine compound (a) and amine compound (b) represented by the following formula:
  • a preferred embodiment of the component (A) is that the solvent-soluble polyimide obtained from tetracarboxylic dianhydride and a diamine compound includes a specific amine compound (a) and an amine compound.
  • the following amine compound (a) and amine compound (b) are added to ⁇ 1 ⁇ solvent-soluble polyimide.
  • a force that contains an imidized polymer that is soluble in a solvent which is a product obtained by reacting at least one selected amine compound, and a polyamic acid, or ⁇ 2 ⁇ tetracarboxylic acid It contains a polyimide precursor soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting an anhydride with a diamine containing the following amine compound (c), and a polyamic acid.
  • the polyamic acid is the same.
  • the amine compound (a) has one primary amino group selected from the formula [K1] and formula [K2] and an imino group selected from the formula [K3] and formula [K4] in the molecule.
  • Amine compound (b) is an amine compound having at least two primary amino groups selected from the formulas [K1] and [K2] in the molecule.
  • the amine compound (c) has at least one primary amino group having the formula [K1] and formula [K2] forces selected in the molecule and an imino group selected from the formula [K3] and formula [K4]. It is an amine compound with at least one.
  • the amine compound (c) is the same as the amine compound (a) when it has one primary amino group represented by the formula [K1] or the formula [K2]. And having at least two primary amino groups selected from the formulas [K1] and [K2] are compounds contained in the amine compound (b).
  • the amine compound (a) has the following formula —I ⁇ NH (R 1 is CH —, —CH (CH
  • amine compound having at least one imino group represented by —R 2 —NH—R 3 — (R 2 and R 3 are divalent organic groups, at least one of which is methylene).
  • the amine compound (b) is represented by the following formula: —I ⁇ —NH (R 1 is —CH—, —CH
  • the amine compound (c) has the following formula —I ⁇ —NH (R 1 is —CH—, —C
  • the coating solution of ⁇ 1 ⁇ a predetermined amount of the amine compound (a) or amine compound (b) is added to a polyimide solution, and the solution is heated at room temperature or under heating conditions. It is a solution obtained by mixing the imidyl polymer soluble in the solvent of the reaction product obtained by stirring and the polyamic acid solution in an arbitrary ratio.
  • the specific amine compound (a) and amine compound (b) used in the present invention have at least two action points. One is a site chemically bonded to the solvent-soluble polyimide, and the other is a site that forms a hydrogen bond or salt formation with the polyamic acid. This improves the compatibility between the imidopolymer and polyamic acid that are soluble in the solvent reacted with the specific amine compound, and suppresses phase separation when the coating solution is concentrated.
  • the primary amino group represented by the formula [K1] and the formula [K2] is an aliphatic amino group
  • the imide carbonyl group in the polyimide is When the imidization ratio of the polyimide is less than 100% as described later, in addition to the reaction described above, the carboxyl group or amic acid ester group of the amic acid group It binds to the carboxyester group by a reaction involving elimination of water or alcohol.
  • R 1 represents one CH CH (CH) CH (CH CH)
  • Aliphatic rings include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, and cyclododecane.
  • R 1 of this amino group is most preferably methylene because it increases the nucleophilicity of the amino group and has less steric hindrance.
  • aliphatic rings cyclopropane, cyclobutane, cyclopentane, cyclohexane and the like are preferable.
  • the imino group acts with the carboxyl group in polyamic acid, such as hydrogen bonding and salt formation.
  • amine compound (a) In the amine compound (a), it is represented by —CH—NH or NH—CH—.
  • One or more imino groups may be contained, but 1 to 4 is suitable from the viewpoint of availability and stability of the compound, and 1 to 2 is particularly preferable.
  • the imino group represented by —R 2 —NH—R 3 contained in the amine compound (a) described above has a function of forming a hydrogen bond or salt formation with the carboxyl group in the polyamic acid. . Therefore, R 2 and R 3 of this imino group need to have at least one of R 2 and R 3 methylene because it is necessary to give the nitrogen atom of the imino group a certain electron density.
  • structures of the other is not particularly limited, for example, exemplified in R 1 - CH -, - CH (CH) -, - CH (CH CH) -, aliphatic ring, or off
  • both R 2 and R 3 are styrene.
  • the amine compound (a) it is sufficient that at least one imino group represented by R 2 —NH—R 3 is present, but 1 to 4 is appropriate from the viewpoint of availability and stability of the compound. There are 1 to 2 pieces, especially.
  • the amine compound (b) has at least two primary amino groups selected from the formulas [K1] and [K2].
  • the first primary amino group reacts with the solvent-soluble polyimide
  • the migration of the amine compound is suppressed, so the remaining amino group reacts with another solvent-soluble polyimide. It becomes difficult.
  • the amino group not reacting with the solvent-soluble polyimide has the same action as the imino group contained in the amine compound (a). It becomes.
  • the amine compound (b) there are 2 or more primary amino groups as described above, but 2 to 5 from the viewpoint of availability and stability of the compound. Is suitable, and 2 to 3 is particularly preferable.
  • the amine compound (b) further has one or more imino groups selected from the formulas [K3] and [K4] because the compatibility with the polyamic acid becomes higher.
  • This imino group is preferably an imino group represented by R 2 —NH—R 3 as in the amine compound (a).
  • the definitions of R 2 and R 3 are the same as in the amine compound (a).
  • the primary amino group reacts with tetracarboxylic dianhydride, so that the amine compound (c) is taken into the polyimide.
  • One or more amino groups may be contained in the molecule, but 1 to 5 is suitable from the viewpoint of availability and stability of the compound, and 1 to 2 is particularly preferable.
  • the amine compound (c) with one amino group is located at either the side chain or the terminal of the polymer molecule, it has less steric hindrance when it forms a hydrogen bond or salt with the polyamic acid. Most preferred for reasons. If the number of amino groups is 3 or more, the resulting soluble polyimide has a three-dimensional structure. When this coating solution is used as a liquid crystal alignment film, the reason for obtaining uniform orientation of the liquid crystal is preferred to have less branching of the main chain. Therefore, two or less amino groups are preferred.
  • This amino group is an amino group represented by R 1 —NH.
  • R 1 is the same as the amine compound (a).
  • the imino group selected from the formula [K3] and the formula [K4] contained in the amine compound (c) is the above-mentioned amine compound (a) with regard to its constitution, action and preferred form. It is the same as the imino group contained in. That - R 2 - NH-R 3 in the preferred instrument R 2 be an imino group represented,
  • R 3 is the same as in the amine compound (a).
  • amine compound (a) in the present invention for example, amine compounds represented by the following formulas (i) and (ii) can be exemplified.
  • R 1 is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
  • X 1 represents a single bond or a divalent organic group
  • specific examples of the divalent organic group include an alkylene, an aliphatic ring, an aromatic ring, Heterocycles and organic groups that combine these, and unsaturated bonds, ether bonds (one O—), ketone bonds (one CO), ester bonds (one COO), thioether bonds (one S— ), Amino bonds (one NH), amide bonds (one CONH), silyl bonds (one Si—), siloxane bonds (SiO 2), and the like.
  • X 2 is a monovalent organic group, and specific examples thereof include an alkyl group, an alkoxy group, a cycloaliphatic group, an aromatic group, a heterocyclic group, and an organic group having a combination force thereof.
  • Unsaturated bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), thioether bond (one S), amino bond (one NH), amide bond (one CON H), silyl bond (One Si—), a siloxane bond (one SiO 2), and the like may be included.
  • X 2 is - R 1 -, - X 1 -, -CH-, and - double and one selected from NH
  • examples of the aliphatic ring or cycloaliphatic group include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, decahydronaphthalene, and norobornane.
  • examples of the aromatic ring or aromatic group include ring structures such as benzene and naphthalene.
  • heterocyclic ring or heterocyclic group examples include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine.
  • alkyl group, alkoxy group, and alkylene examples include an alkyl group having 1 to 20 carbon atoms, an alkoxy group, and alkylene.
  • X 1 and X 2 may have a substituent! /.
  • substituents include alkyl Group, alkoxy group, hydroxyl group, carboxyl group, and the like.
  • amine compound (b) in the present invention for example, amine compounds represented by the following formulas (m) to (V) can be exemplified.
  • R 1 in the formula is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
  • X 3 , X 4 , X 5 , X 6 , X 7 and X 8 represent a single bond or a divalent organic group, and specific examples of the divalent organic group include alkylene, an aliphatic ring, Organic groups consisting of aromatic rings, heterocycles, and combinations of these include unsaturated bonds, ether bonds (one o-), ketone bonds (one CO), ester bonds (one COO), thioethers.
  • a bond (one S—), an amino bond (NH), an amide bond (one CONH), a silyl bond (one Si—), a siloxane bond (one SiO—), and the like may be included.
  • aliphatic ring or cycloaliphatic group cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, deca And ring structures such as hydronaphthalene and norobornane.
  • aromatic ring or aromatic group include ring structures such as benzene and naphthalene.
  • heterocyclic ring or heterocyclic group examples include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine.
  • alkylene examples include alkylene having 1 to 20 carbon atoms.
  • X 3 , X 4 , X 5 , X 6 , X 7 and X 8 may have a substituent.
  • substituents include an alkyl group, an alkoxy group, a hydroxyl group, and a carboxyl group.
  • amine compound (c) in the present invention include amine compounds represented by the following formulas (i), (ii), (iv) and (V).
  • R 1 in the formula is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
  • X 1 , X 4 , X 5 , X 6 , X 7 and X 8 represent a single bond or a divalent organic group, and specific examples of the divalent organic group include alkylene, an aliphatic ring, Organic groups consisting of aromatic rings, heterocycles, and combinations of these include unsaturated bonds, ether bonds (one o-), ketone bonds (one CO), ester bonds (one COO), thioethers.
  • a bond (one S—), an amino bond (NH), an amide bond (one CONH), a silyl bond (one Si—), a siloxane bond (one SiO—), and the like may be included.
  • X 2 is a monovalent organic group, and specific examples thereof include an alkyl group, an alkoxy group, a cycloaliphatic group, an aromatic group, a heterocyclic group, and an organic group having a combination force thereof. Bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), thioether bond (one S), amino bond (one NH), amide bond (one CON H), silyl bond (Si) , Including siloxane bonds (SiO 2), etc.
  • examples of the aliphatic ring or cycloaliphatic group include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, decahydronaphthalene, and norobornane.
  • examples of the aromatic ring or aromatic group include ring structures such as benzene and naphthalene.
  • heterocyclic ring or heterocyclic group examples include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine.
  • alkyl group, alkoxy group, and alkylene examples include an alkyl group having 1 to 20 carbon atoms, an alkoxy group, and alkylene.
  • X 1 , X 4 , X 5 , X 6 , X 7 and X 8 may have a substituent! /.
  • substituent include an alkyl group, an alkoxy group, a hydroxyl group, and a carboxyl group.
  • the molecular weight of the compound is preferably 1000 or less. Preferably it is 500 or less, Especially preferably, it is 300 or less.
  • amine compound (a) or the amine compound (b) include the following, but are not limited thereto. Two or more amine compounds may be used in combination.
  • Specific examples of the amine compound (c) include No. 1 to No. 50, No. 71 to No. 76, No. 93 to N ⁇ .102, and ⁇ .106 to ⁇ .108. It is not limited to these. Two or more amine compounds may be used in combination.
  • the solvent-soluble polyimide and the imidyl polymer soluble in the solvent are polymers having an imide bond in the repeating unit, and an organic solvent. It refers to what can be dissolved.
  • a solvent-soluble polyimide used in the present invention and a solvent-soluble imide include those in which a part of the imide group contained in the repeating unit is ring-opened to form an amic acid group or an amic acid ester group. Included in the category of chemical polymers. Imi contained in polymers having these imide bonds The ratio of dodo groups can be expressed as an imidization rate as shown in the following formula.
  • Imide ratio number of imide groups ⁇ (number of imide groups + number of amide acid groups + number of amide acid ester groups) These imidation rates are determined by dissolving the polyimide in d-DMSO (dimethylsulfoxide d).
  • the imidation ratio of the solvent-soluble polyimide used in the coating solution of the present invention and the imidized polymer soluble in the solvent is not particularly limited. Usually, the higher the imidization rate, the lower the solubility of the polyimide in the solvent. As a result, if the solution cannot be dissolved at the required concentration, the imidization rate may be lowered appropriately. In view of the purpose of using a polymer that has been imidized in advance, the imidization rate is preferably 10% or more. In addition, when used as a liquid crystal aligning agent, the reason for obtaining good liquid crystal alignment or good electrical properties.
  • the imidity ratio is preferably 40% or more, more preferably 60% or more. Particularly preferably, it is 80% or more.
  • the molecular weight of the solvent-soluble polyimide and the solvent-soluble imidopolymer is not particularly limited, but it is 2 in terms of weight average molecular weight from the viewpoints of handling and stability of characteristics when a film is formed. 000 to 200,000 force, more preferably 4,000 to 50,000.
  • the molecular weight is determined by GPC (gel permeation chromatography).
  • the structure of the solvent-soluble polyimide used in the coating solution of ⁇ 1 ⁇ of the present invention is not particularly limited, but can be obtained relatively easily by using tetracarboxylic dianhydride and diamine as raw materials. For this reason, a polyimide having a repeating unit represented by the following formula (I) is preferred.
  • the imidized polymer soluble in the solvent used in the coating solution of ⁇ 2 ⁇ of the present invention is a reaction between tetraforce rubonic acid dianhydride and diamine containing an amine compound (c).
  • the force obtained by imidizing the polyimide precursor obtained is obtained using diamine as a main raw material, and the polyimide having a repeating unit represented by the following formula (I) is used as a basic structure in the same manner as ⁇ 1 ⁇ . Yes.
  • the imidized polymer soluble in the solvent used in the coating solution of ⁇ 1 ⁇ of the present invention is a specific amine polymer in a part of the polyimide having a repeating unit represented by the following formula (I).
  • the polyimide has a structure bonded to the imide carbonyl group by a reaction involving ring opening of the imide group, or the polyimide has an imido ratio of less than 100%, the carboxyl group or amide acid of the amide acid group It has a structure in which the ester group is bonded to the carboxyester group.
  • the imidyl polymer soluble in the solvent used in the coating solution of ⁇ 2 ⁇ is selected from a specific amine compound (c) force on a polyimide having a repeating unit represented by the following formula (I).
  • A represents a tetravalent organic group
  • B represents a divalent organic group
  • the structure of A is not particularly limited.
  • the structure of A may be one type, or multiple types may be mixed. Specific examples of A are as follows.
  • A-6, A-16, A-18 to A-22, and A-25 are preferable because they have high solubility even with polyimide having a high imidization rate.
  • the voltage holding ratio of the liquid crystal cell is improved when it is used as a liquid crystal alignment film. Good.
  • the structure of B is not particularly limited.
  • the structure of B may be one type or a mixture of multiple types. Specific examples of B are as follows.
  • the pretilt angle of the liquid crystal can be increased when the liquid crystal alignment film is formed.
  • the polyimide having the repeating unit represented by the above formula (I) corresponds to the tetracarboxylic dianhydride having the corresponding structure of A as represented by the following formula (II) and the following formula (III) according to a conventional method. It can be obtained by reacting with a diamine having the structure of B to obtain a polyimide precursor, which is dehydrated and cyclized.
  • 15 mol% or less is preferable, more preferably 10 mol% or less, particularly preferably 5 mol% or less, and the amine compound (c) having 2 or more primary amino groups contained in the molecule is Since it plays the role of diamine of formula (III), di of formula (III) Be replaced by Min and Amini ⁇ was the total amount of (c) in this,.
  • the reaction for obtaining the polyimide precursor is usually carried out in an organic solvent at ⁇ 20 to 150 ° C., preferably 0 to 100 ° C., more preferably 10 to 80 ° C.
  • the proportion of tetracarboxylic dianhydride and diamine used is such that the acid anhydride group contained in tetracarboxylic dianhydride is 0.5 to 1 equivalent of amino group contained in diamine. It is preferable that it is -1.5 equivalent, More preferably, it is 0.8-1.2 equivalent.
  • a polyimide precursor to be generated is dissolved. That is not particularly limited.
  • a solvent that does not dissolve the polyamic acid may be used by mixing with the above solvent as long as the produced polyamic acid does not precipitate.
  • water in the organic solvent inhibits the polymerization reaction and further causes hydrolysis of the generated polyamic acid, it is preferable to use an organic solvent that has been dehydrated and dried as much as possible.
  • Common methods for dehydrating and ring-closing polyimide precursors include thermal imidization by heating the polyimide precursor solution as it is, and chemical imidization by adding a catalyst to the polyimide precursor solution, but imidization at a relatively low temperature. Chemical imidization, in which the reaction proceeds, is preferred because the molecular weight of the resulting polyimide is less likely to decrease.
  • Chemical imidization can be performed by stirring a polyimide precursor in an organic solvent in the presence of a basic catalyst and an acid anhydride.
  • the reaction temperature at this time is 20 to 250 ° C, preferably 0 to 180 ° C. Higher reaction temperature Force of S-imide is too high. If it is too high, the molecular weight of the polyimide may decrease.
  • the amount of the basic catalyst is 0.5 to 30 mol times, preferably 2 to 20 mol times of the amic acid group, and the amount of the acid anhydride is 1 to 50 mol times, preferably 3 to 30 mol of the amido acid group. Is double. If the amount of the basic catalyst or acid anhydride is small, the reaction does not proceed sufficiently.
  • the basic catalyst to be used examples include pyridine, triethylamine, trimethylamine, tributylamine, trioctylamine and the like. Among them, pyridine is preferable because it has an appropriate basicity for proceeding with the reaction.
  • the acid anhydride examples include acetic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like. Among them, use of acetic anhydride is preferable because purification after completion of the reaction is facilitated.
  • the organic solvent the solvent used in the polyamic acid polymerization reaction described above can be used. The imidity ratio due to chemical imidization can be controlled by adjusting the amount of catalyst, reaction temperature, and reaction time.
  • the added catalyst remains in the solution of the polyimide solution obtained in this way, it is preferable to throw this polyimide solution into a stirring poor solvent and recover the precipitate. Yes.
  • a poor solvent used for the precipitation collection recovery of a polyimide, Methanol, acetone, hexane, a butyl cellosolve, a heptane, a methyl ethyl ketone, a methyl isobutyl ketone, ethanol, toluene, benzene etc. can be illustrated.
  • the polyimide precipitated by adding it to a poor solvent can be recovered by filtration and washing, and then dried at normal temperature or under reduced pressure at room temperature or by heating.
  • reaction between the solvent-soluble polyimide and the amine compound (a) or the amine compound (b) can be performed as follows in the coating solution of ⁇ 1 ⁇ .
  • solvent-soluble polyimide is dissolved in an organic solvent to obtain a solution.
  • the polyimide may be heated. If the heating temperature is too high, the molecular weight of the polyimide may decrease, so 30-100 ° C is preferred.
  • the concentration of the polyimide solution is preferably 1 to 20% by mass, more preferably 3 to 15% by mass, because the polyimide and the amine compound can be reacted efficiently and uniformly. Preferably it is 3-10 mass%.
  • the amine compound is represented by —R 1 —NH.
  • the polyimide concentration is too high, the polyimides may form a three-dimensional structure with the amine compound and the solubility may be reduced. It is preferable to be less than mass%.
  • the solvent is not particularly limited as long as the resin is completely dissolved within the above concentration range.
  • Specific examples include N, N dimethylformamide, N, N dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolatatam, 2-pyrrolidone, N-ethylpyrrolidone, N vinylpyrrolidone, dimethyl sulfoxide, tetramethylurea.
  • Pyridine dimethylsulfone, hexamethylsulfoxide, y-butyrolatatone, 1,3 dimethylimidazolidinone. Two or more of these solvents may be used in combination.
  • Lataton solvents such as y-petit-mouthed rataton react easily with aliphatic amino groups and may consume amine compounds, N, N dimethylformamide is N-methyl 2-pyrrolidone, etc. It is preferable to use the solvent. If you want to use a rataton solvent such as y-petit-mouth rataton as the main solvent, first react the amine compound with the polyimide using a solvent other than the rataton solvent, and then put this solution into an appropriate poor solvent for recovery. Then, it may be dissolved again in the rataton solvent.
  • Examples include butanol, acetone, hexane, butyl cellosolve, heptane, methyl ethyl ketone, methyl isobutyl ketone, ethanol, toluene, and benzene.
  • the polyimide precipitated by pouring into a poor solvent can be recovered by filtration, washing, and drying at normal temperature or reduced pressure at room temperature or by heating.
  • an amine compound selected from the amine compound (a) and the amine compound (b) is added to the polyimide solution, and the mixture is stirred at room temperature or under heating conditions.
  • the amount of the amine compound added is too small, the effect of the moisture absorption stability of the coating solution will not be sufficiently exerted, and if it is too large, for example, in the liquid crystal alignment film, the orientation of the liquid crystal will be reduced. 1 to 15 parts by mass is more preferable, and 2 to 5 parts by mass is particularly preferable, with respect to 100 parts by mass of the solvent-soluble polyimide, because the characteristics are deteriorated.
  • the amine compound may be added directly to the solvent-soluble polyimide solution, but it is preferable to add the aminey compound after making a solution with a concentration of 0.1 to 10% by mass with an appropriate solvent. Examples of the solvent include the solvent of the solvent-soluble polyimide described above.
  • latonic solvents such as petit latatotone may react with the aliphatic amino group and consume the aminic compound immediately. Therefore, solvents such as ⁇ , ⁇ ⁇ ⁇ ⁇ dimethylformamide ⁇ methyl-2-pyrrolidone, etc. Preferred to use.
  • the temperature during the reaction is preferably 25 to 150 ° C, more preferably 30 to 100 ° C, because the polyimide and the amine compound react efficiently and side reactions do not easily occur. It is particularly preferably 40 to 80 ° C. If the temperature is too high, the soluble polyimide may be hydrolyzed.
  • the reaction time varies depending on the reactivity between the solvent-soluble polyimide and the amine compound and the temperature at which the reaction is carried out. To give a standard example, it is 6 to 48 hours at 40 to 80 ° C.
  • the structure of the polyamic acid used in the coating solution is not particularly limited, but is represented by the following formula (IV) because it can be obtained relatively easily by using tetraforce rubonic acid dianhydride and diamine as raw materials.
  • Preferable is a polyamic acid having a repeating unit.
  • a ' represents a tetravalent organic group
  • B' represents a divalent organic group
  • the polyamic acid having a repeating unit represented by the above formula (IV) is a tetracarboxylic acid having the structure of A ′, as shown in the method for synthesizing a polyimide precursor for obtaining the solvent-soluble polyimide described above. It can be obtained by reacting a dianhydride and a diamine having the structure of B ′ in an organic solvent.
  • the molecular weight of the polyamic acid is not particularly limited, but a weight average molecular weight of 2,000 to 200,000 is more preferable and 5 is more preferable from the viewpoints of handling and stability of characteristics when a film is formed. , 00000 to 100,000.
  • the molecular weight was determined by GPC (gel permeation chromatography).
  • the structure of A ′ is not particularly limited. Further, the structure of A ′ may be one type, or may have different A ′ structures and a plurality of different types of repeating units may be mixed. As a specific example of A ′, the structure exemplified in the above A can be mentioned.
  • the structure of B ′ is not particularly limited. Further, the structure of B ′ may be one type, or may have a different B ′ structure, and a plurality of different types may be mixed as a repeating unit. If the specific example of B 'is given, the structure illustrated by said B will be mentioned.
  • the coating solution of the present invention is soluble in a solvent of a product obtained by reacting a solvent-soluble polyimide with an amine compound selected from amine compounds (a) and (b). What is necessary is just to mix the solution of an imidyl polymer (henceforth a specific product) and the solution of a polyamic acid in arbitrary ratios.
  • an imidyl polymer hereinafter referred to as a specific polyimide
  • a solution of polyamic acid may be mixed at an arbitrary ratio.
  • the reaction solution is put into an appropriate poor solvent, and after the specific product is recovered, it is dissolved in the solvent and used again. May be.
  • the poor solvent at this time include water, methanol, acetone, hexane, butyl cellosolve, heptane, methyl ethyl ketone, methyl isobutyl ketone, ethanol, toluene, and benzene.
  • Solvents for re-dissolution include N, N dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolatatam, 2-pyrididone, N ethylpyrrolidone, N bull pyrrolidone Dimethylsulfoxide, tetramethylurea, pyridine, dimethylsulfone, hexamethylsulfoxide, ⁇ -butyrolacton, 1,3 dimethylimidazolidinone, and the like. These redissolving solvents can also be used as solvents for dissolving the specific polyimide.
  • the specific product and the specific polyimide may be used in combination.
  • the ratio of the specific product, specific polyimide, and polyamic acid is arbitrary. Because a liquid crystal alignment film with good characteristics can be obtained, the polyamic mass in the mass of the specific product, the specific polyimide, and the polyamic acid is combined.
  • the acid ratio is more preferably 20 to 99% by mass, more preferably 40 to 95% by mass, and particularly preferably 60 to 90% by mass.
  • the ratio of the polyamic acid in the mass of the specific product and the soot or the specific polyimide and the polyamic acid is preferably 20 to 99% by mass, more preferably 40 to 95% by mass, and particularly preferably. Is 60-90% by mass.
  • the concentration of the solid component in the coating solution can be appropriately changed depending on the thickness of the coating film to be formed. To obtain a uniform coating film, 0.1 is required. From the viewpoint of storage stability that is preferably at least 30% by mass, it is preferably at most 30% by mass. In addition, 1 to 10% by mass is preferable because a coating film having an appropriate thickness can be obtained as a liquid crystal alignment film.
  • the solvent contained in the coating solution of the present invention may contain a solvent for improving the printability in addition to the above-described re-dissolving solvent for the specific product.
  • a solvent for improving the printability in addition to the above-described re-dissolving solvent for the specific product.
  • Specific examples thereof include ethinorecerosonolev, butinorecellosonoleb, ethinorecanorebitonore, butinorecanolebitonore, ethenorecarbitol acetate, ethylene glycol, 1-methoxy-2-propanol, 1-etoxy-2- Propanol, 1-butoxy 2-propanol, 1-phenoxy 2-propanol, propylene glycol monoacetate, propylene glycol diacetate, propylene Lopyleneglycol 1 Monomethylolate 2—Acetate, Propylene glycol 1 —Monoethyl ether—2-Acetate, Dipropylene glycol, 2-
  • an amide solvent such as N, N dimethylformamide N-methyl-2pyrrolidone is contained in an amount of 50% by mass or more of the coating liquid.
  • the film thickness uniformity is improved, which is preferable.
  • the liquid crystal aligning agent of the present invention comprises the above coating solution, and an additive such as a silane coupling agent may be added to improve the adhesion of the liquid crystal aligning film to the substrate.
  • an additive such as a silane coupling agent may be added to improve the adhesion of the liquid crystal aligning film to the substrate.
  • the liquid crystal aligning agent needs to form a thin film of 300 nm or less on the substrate, when using the coating liquid as the liquid crystal aligning agent, it is filtered with a membrane filter having a pore diameter of 0.1 m to l ⁇ m. U prefer that.
  • the liquid crystal aligning agent of the present invention increases the entanglement of the polymer by appropriately suppressing the phase separation between the imidyl copolymer soluble in the solvent and the polyamic acid when formed into a coating film. In addition, it has the effect of being sharpened against the rubbing process. Furthermore, compared with the case where no amine compound is used, the electrical characteristics of the liquid crystal display element, such as the ease of draining the stored charge and the voltage holding ratio, tend to be improved.
  • the liquid crystal alignment film of the present invention is a coating film obtained by applying the liquid crystal aligning agent obtained as described above to a substrate, drying and baking, and is used for aligning liquid crystals in a predetermined direction. .
  • the substrate on which the liquid crystal aligning agent is applied is not particularly limited as long as it is a highly transparent substrate, and a glass substrate, a plastic substrate such as an acrylic substrate, a polycarbonate substrate, or the like can be used. Use of a substrate on which is formed is also preferable from the viewpoint of simplifying the process.
  • the reflective liquid crystal display element can be used with an opaque object such as a silicon wafer as long as it is only on one side of the substrate. Can also use materials that reflect light, such as aluminum.
  • Examples of the method for applying the liquid crystal aligning agent include spin coating, printing, and ink jet. Industrially, transfer printing such as flexographic printing is widely used from the viewpoint of productivity.
  • the liquid crystal aligning agent of the present invention is also preferably used.
  • the drying process after applying the liquid crystal aligning agent is not necessarily required, but if the time from application to baking is constant for each substrate, or is not baked immediately after coating! It is preferable to include a drying step.
  • the drying means is not particularly limited as long as the solvent is evaporated to such an extent that the shape of the coating film is not deformed due to transport of the substrate or the like.
  • a method of drying on a hot plate at 50 to 150 ° C, preferably 80 to 120 ° C for 0.5 to 30 minutes, preferably 1 to 5 minutes is used.
  • the substrate coated with the liquid crystal aligning agent can be baked at any temperature of 100 to 350 ° C, preferably 150 ° C to 300 ° C, more preferably 180 ° C to 250 ° C. It is. Also, it is more preferable to fire at a temperature of 10 ° C or higher than the heat treatment temperature required for the liquid crystal cell manufacturing process, such as curing the sealant.
  • the thickness of the coating film after firing is too thick, it is disadvantageous in terms of power consumption of the liquid crystal display element, and if it is too thin, the reliability of the liquid crystal display element may be lowered, so it is preferably 5 to 300 nm. , More preferably 10: LOOnm.
  • the fired coating film is treated with rubbing or irradiation with polarized ultraviolet rays.
  • the liquid crystal display element of the present invention is a liquid crystal display element obtained by obtaining a liquid crystal alignment agent-powered substrate with a liquid crystal alignment film of the present invention by the method described above, and then preparing a liquid crystal cell by a known method.
  • a pair of substrates on which a liquid crystal alignment film is formed is prepared, and a spacer is dispersed on the liquid crystal alignment film of one substrate, and the liquid crystal alignment film surface is on the inside. Then, the other substrate is bonded and sealed by injecting liquid crystal under reduced pressure, or after dropping the liquid crystal on the surface of the liquid crystal alignment film on which the spacer is dispersed, the substrate is bonded and sealed.
  • the method etc. which perform can be illustrated.
  • the thickness of the spacer at this time is preferably 1 to 30 m, more preferably 2 to 10 ⁇ m.
  • the liquid crystal display element of the present invention includes a TN liquid crystal display element, an STN liquid crystal display element, a TFT liquid crystal display element, an OCB liquid crystal display element, a horizontal electric field type liquid crystal display element, and a vertical alignment type liquid crystal display. It is suitably used for display elements of various methods using nematic liquid crystal such as elements. Further, by selecting the liquid crystal to be used, it can also be used for a ferroelectric and antiferroelectric liquid crystal display element.
  • AM2 (No.37) (Aminoethylaminomethyl) phenethyltrimethoxysilane
  • AM3 (No.32) N- (2-aminoethyl) -3-aminominotrimethoxysilane
  • AM4 (No. 47) (3-Trimethoxysilylpropyl) diethylenetriamine
  • AM5 (No.34) N- (2-aminoethyl) -3-amino
  • AM6 (No.35) N- (2-aminoethyl) -3-amino AM7: (No.95): ⁇ , ⁇ , -bis (2-aminoethinole) -1,3-propanediamin
  • the molecular weights of the solvent-soluble polyimide, the solvent-soluble imidopolymer, and the polyamic acid in the synthesis examples are as follows: Shodex's room temperature gel permeation chromatography (GPC) apparatus (GPC-101), Shodex's column ( Measurement was performed as follows using KD-803 and KD-805).
  • Standard sample for preparing calibration curve TSK standard polyethylene oxide (molecular weight: about 900,000, 150,000, 100,000, 30,000) manufactured by Tosoh Corporation, and polyethylene glycol (molecular weight: about 12,000, 4,000, 1,000) manufactured by Polymer Laboratory.
  • the imido ratio of the solvent-soluble polyimide in the synthesis example and the imido polymer soluble in the solvent was measured as follows. Add 20 mg of polyimide powder to the NMR sample tube (N MR sampling tube standard ⁇ 5 manufactured by Kusano Kagakusha) and add 0.53 ml of deuterated dimethyl sulfoxide (DMSO-d, 0.05% TMS (tetramethylsilane) mixture) Hesitate and apply ultrasound It was completely dissolved. This solution was measured for proton NMR at 500 MHz with an NMR measuring instrument (JNM-ECA 500) manufactured by JEOL Datum.
  • JNM-ECA 500 JNM-ECA 500
  • the imidation rate is determined based on protons derived from structures that do not change before and after imidation as reference protons, and the peak integrated value of these protons and the proton peak integrated value derived from the NH group of amic acid that appears in the vicinity of 9.5 to 10.0 ppm. It was calculated by the following formula using and.
  • X is the proton peak integrated value derived from the NH group of the amic acid
  • y is the peak integrated value of the reference proton
  • a is one NH group proton of the amic acid in the case of polyamic acid (imido ratio is 0%). Is the number ratio of the reference proton to.
  • a polyamic acid solution was prepared by reacting 150.14 g (0.5 mol) of TDA, 48.67 g (0.45 mol) of DA1, and 18.83 g (0.05 mol) of DA2 in 1233 g of NMP at 50 ° C. for 24 hours.
  • This polyamic acid solution was diluted to 5% by mass with NMP, and 237.9 g of pyridine and 510.6 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours.
  • This solution was put into 17.4 L of methanol, and the resulting precipitate was filtered off and dried to obtain a white polyimide powder.
  • the obtained solvent-soluble polyimide had a number average molecular weight of 9,273 and a weight average molecular weight of 18,815.
  • the imidization ratio was 84%.
  • CBDA 98.05 g (0.5 mol), PMDA 95.98 g (0.44 mol) and DA3 198.27 g (1.0 mol) were reacted in a mixed solvent of NMP lll lg and GBL lll lg at room temperature for 5 hours to polyamic.
  • An acid solution was prepared. This polyamic acid had a number average molecular weight of 11,067 and a weight average molecular weight of 26,270.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA and 19.83 g (0.1 mol) of DA3 in 283 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.1 g of pyridine and 15.4 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was poured into 0.6 L of methanol, and the resulting precipitate was filtered and dried to obtain a white polyimide powder.
  • the solvent-soluble polyimide obtained had a number average molecular weight of 13,651 and a weight average molecular weight of 48,092. The imidation ratio was 81%.
  • a coating solution of the present invention was obtained in the same manner as in Example 1 except that the polyimide powder obtained in Synthesis Example 3 was used.
  • a coating solution of the present invention was obtained in the same manner as in Example 1 except that the addition amount or type of the amine compound was changed as follows. When 3 parts by mass of the amine compound is added, a 3% by weight NMP solution of the amine compound is added. When 2 parts by mass is added, the same 2% by weight NMP solution is added. When 1 part by mass of the mass% NMP solution was added, the same 1 mass% NMP solution was added.
  • Example 1 except that the amine compound was not added to the solvent-soluble polyimide solution and diluted to 6% by mass with NMP, and this was mixed with the dilute solution of polyamic acid. A coating solution for comparison was obtained in the same manner as in 1.
  • Example 2 A coating solution for comparison was obtained in the same manner as in Example 1, except that 3-aminopropylmethyljetoxysilane was used as the amine compound in Example 1.
  • a coating solution for comparison was obtained in the same manner as in Example 1 except that 2- (4-aminophenol) ethylamine was used as the amine compound in Example 1.
  • a coating solution for comparison was obtained in the same manner as in Example 1 except that bis (trimethoxysilylpropyl) amine was used as the amine compound in Example 1.
  • a coating solution for comparison was obtained in the same manner as in Example 1 except that N-methylaminopropyltrimethoxysilane was used as the amine compound in Example 1.
  • Example 1 except that the dilute solution of polyamic acid to be mixed was prepared so that polyamic acid was 6% by mass, NMP was 39.5% by mass, GBL was 39.5% by mass, and BCS was 15% by mass. Similarly, the coating liquid of the present invention was obtained.
  • Example 1 the dilute solution of polyamic acid to be mixed was prepared in the same manner as in Example 1 except that the polyamic acid was adjusted to 6% by mass, NMP 20% by mass, GBL 59% by mass, and BCS 15% by mass. Similarly, the coating liquid of the present invention was obtained.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid strength of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
  • a coating solution of the present invention was obtained in the same manner as in Example 30, except that the type of amine compound was changed as follows.
  • a coating solution of the present invention was obtained in the same manner as in Example 31 except that the type of amine compound was changed as follows.
  • a coating solution of the present invention was obtained in the same manner as in Example 32 except that the type of amine compound was changed as follows.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.46 g (0.0875 mol) of DA1, and 4.71 g (0.0125 mol) of DA2 in 251 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 8.1 g of pyridine and 17.3 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,195 and a weight average molecular weight of 19,235. The imidation ratio was 83%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.65 g (0.015 mol) of DA2 in 254 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17. lg of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,324 and a weight average molecular weight of 19,244. The imidation ratio was 83%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 8.56 g (0.08 mol) of DA1, and 5.85 g (0.02 mol) of DA5 in NMP 252 g at 50 ° C for 24 hours. . 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and further 8.0 g of pyridine and 17.2 g of anhydrous acetic acid were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was poured into 0.6 L of methanol, and the resulting precipitate was filtered off and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,111 and a weight average molecular weight of 18,045. Further, the imido ratio was 83%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 8.65 g (0.08 mol) of DA1, and 7.61 g (0.02 mol) of DA6 in NMP 185 g at 50 ° C. for 24 hours. . 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, 10.3 g of pyridine and 22. lg of acetic anhydride were further added as an imido catalyst and reacted at 35 ° C. for 3 hours. This solution was put into 0.8 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 6,446 and a weight average molecular weight of 13,971. The imidation ratio was 74%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.71 g (0.015 mol) of DA6 in NMP 255 g at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were further added as an imido catalyst and reacted at 35 ° C. for 3 hours. This solution in 0.6 L methanol The precipitate obtained was filtered off and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,943 and a weight average molecular weight of 14,365. The imidation ratio was 76%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 6.11 g (0.015 mol) of DA7 in 257 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 16.9 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 5,735 and a weight average molecular weight of 12,670. The imidation ratio was 83%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.92 g (0.015 mol) of DA8 in 256 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,495 and a weight average molecular weight of 22,294. The imidization ratio was 84%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 6.04 g (0.015 mol) of DA9 in 257 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 16.9 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,775 and a weight average molecular weight of 23,308. The imidization ratio was 84%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DAI, and 5.44 g (0.015 mol) of DA10 in 253 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 8.0 g of pyridine and 17.1 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,367 and a weight average molecular weight of 18,959. The imidization ratio was 84%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.80 g (0.015 mol) of DA11 in NMP 255 g at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,203 and a weight average molecular weight of 18,298. The imidization ratio was 84%.
  • a polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 12.26 g (0.09 mol) of DA12, and 3.77 g (0.01 mol) of DA2 in 261 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and further 7.7 g of pyridine and 16.6 g of acetic anhydride were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,634 and a weight average molecular weight of 17,655. The imidation ratio was 81%.
  • a polyamic acid solution was prepared by reacting 19.22 g (0.098 mol) of CBDA, 16.26 g (0.08 mol) of DA14, and 5.85 g (0.02 mol) of DA5 in 234 g of NMP at room temperature for 24 hours.
  • This polyamic Mick acid solution 50g diluted five mass 0/0 by NMP, pyridine 2.3 g, acetic anhydride 5.5g added as further imidization catalyst, and reacted for 3 hours at 50 ° C.
  • This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder.
  • the resulting solvent-soluble polyimide had a number average molecular weight of 12,988 and a weight average molecular weight of 30,324.
  • the imidation ratio was 94%.
  • a polyamic acid solution was prepared by reacting 18.43 g (0.094 mol) of CBDA and 19.83 g (0.1 mol) of DA3 in a mixed solvent of 108 g of NMP and 108 g of GBL at room temperature for 5 hours.
  • This polyamic acid had a number average molecular weight of 16,951 and a weight average molecular weight of 37,292.
  • a polyamic acid solution was prepared by reacting 18.43 g (0.094 mol) of CBDA and 20.02 g (0.1 mol) of DA15 in a mixed solvent of 109 g of NMP and 109 g of GBL at room temperature for 5 hours.
  • This polyamic acid had a number average molecular weight of 15,139 and a weight average molecular weight of 31,565.
  • a polyamic acid solution was prepared by reacting 18.04 g (0.092 mol) of CBDA and 19.93 g (0.1 mol) of DA16 in a mixed solvent of NMP 171 g and GBL 17 lg at room temperature for 5 hours.
  • This polyamic acid had a number average molecular weight of 20,821 and a weight average molecular weight of 49,970.
  • 3 g of the polyimide powder obtained in Synthesis Example 4 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours.
  • 3 wt 0 / oNMP solution was added (0.09 g as Amini ⁇ product) to 3.0 g, further polyimide concentration in the solution is 6 mass triethylenetetramine (Amin compound of No.94) the NMP 9.5 g so that the 0/0 Ka ⁇ E and 20h stirred at 50 ° C.
  • the added amount of the amine compound at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
  • Example NoNMPZGBLZBCS 66Zl6Zl2.
  • a coating solution of the present invention was obtained in the same manner as in Example 47 except that the polyimide powder was changed as follows.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 19 to prepare a polyamic acid power of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
  • 3 g of the polyimide powder obtained in Synthesis Example 17 was dissolved in 34.5 g of GBL by stirring at 50 ° C. for 20 hours. To this solution was added 3.0 g (0.15 g as an amine compound) of 3 mass 0 / oGBL solution of triethylenetetraamine (No. 94 amine compound), and the polyimide concentration in this solution was 6%. GBL 9.5g was added so that it might become the amount%, and it stirred at 50 degreeC for 20 hours. The amount of the amine compound added at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
  • NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 20 to prepare a polyamic acid power of 3% by mass, NMP of 20% by mass, GBL of 59% by mass, and BCS of 15% by mass.
  • NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 19 to prepare a polyamic acid power of 3 mass%, NMP of 59 mass%, GBL of 20 mass%, and BCS of 15 mass%.
  • Example 62 NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 21 as a dilute solution of the polyamic acid to be mixed, and the polyamic acid strength was 3 ⁇ 4 mass%, NMP was 39.5 mass%, A coating solution of the present invention was obtained in the same manner as in Example 62 except that GBL was 39.5% by mass and BCS was 15% by mass.
  • a polyamic acid solution was prepared by reacting 9.81 g (0.05 mol) of CBDA, 9.60 g (0.044 mol) of PMDA, and 19.83 g (0.1 mol) of DA3 in 222 g of NMP at room temperature for 5 hours.
  • This polyamic acid had a number average molecular weight of 10,893 and a weight average molecular weight of 25,972.
  • NMP and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 22 to prepare 6 mass% polyamic acid, 79 mass% NMP, and 15 mass% BCS.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid strength of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
  • the obtained imidized polymer soluble in the solvent had a number average molecular weight of 5,951 and a weight average molecular weight of 22,992.
  • the imidation ratio was 81%.
  • NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
  • the coating liquids prepared in Examples 1 to 66 and Comparative Examples 1 to 5 were pressure filtered through a membrane filter having a pore size of 1 ⁇ m to obtain a liquid crystal aligning agent.
  • a liquid crystal aligning agent is spin-coated on a glass substrate with an ITO electrode, dried on a hot plate at 80 ° C for 5 minutes, and then baked in a hot air circulation oven at 230 ° C for 30 minutes.
  • An Onm coating was formed. This coating surface was rubbed with a rayon cloth with a rubbing machine having a roll diameter of 120 mm under the conditions of a roll rotation speed of 1000 rpm, a roll traveling speed of 50 mm / sec, and an indentation amount of 0.3 mm to obtain a substrate with a liquid crystal alignment film .
  • the surface of the liquid crystal alignment film was observed with a real-time scanning laser microscope 1LM21D (objective lens 10 ⁇ ) manufactured by Lasertec (magnification magnification 340 ⁇ on the monitor).
  • the surface of the liquid crystal alignment film obtained using the liquid crystal aligning agent having the coating liquid force of Examples 1 to 64 and Example 66 was strong enough to show no scratches or film peeling. Although peeling of the film was not observed on the surface of the liquid crystal alignment film obtained by using the liquid crystal aligning agent comprising the coating liquids of Comparative Examples 1 to 5, many fine scratches were observed. Further, the surface of the liquid crystal alignment film obtained using the liquid crystal aligning agent having the coating liquid force of Example 65 was observed to have fine scratches although no film peeling was observed.
  • Example 65 This is because in Example 65, ⁇ -petit-mouth rataton was used as the solvent for reacting the solvent-soluble polyimide and the amine compound, so that the amine compound was consumed by reacting with ⁇ -petit-mouth rataton. It is considered that a sufficient amount of the added amount by mass did not react with the solvent-soluble polyimide.
  • liquid crystal aligning agents having the coating liquid power of Examples 30 to 32 were subjected to a printability test by the flexographic printing method as follows.
  • Printing conditions -The width of the pop was 0.2 mm.
  • the tact time was set to 30 seconds, and printing was first performed on six 100 mm ⁇ 100 mm glass substrates, followed by printing on four Cr film-formed glass substrates of the same size. Finally, the printed substrate is dried on a hot plate at 80 ° C for 5 minutes and viewed with a microscope at 50x magnification.
  • the liquid crystal aligning agent having the coating solution power of Example 30 was superior in in-plane film thickness uniformity to the other two liquid crystal aligning agents.
  • a liquid crystal aligning agent is spin-coated on a glass substrate with a ⁇ electrode, dried on a hot plate at 80 ° C for 5 minutes, and then baked in a hot air circulation oven at 230 ° C for 30 minutes.
  • An Onm coating was formed.
  • the coated surface was rubbed with a rayon cloth using a rubbing machine having a roll diameter of 120 mm under the conditions of a roll rotation speed of 1000 rpm, a roll traveling speed of 50 mm / sec, and an indentation amount of 0.3 mm to obtain a substrate with a liquid crystal alignment film. .
  • the temperature of the liquid crystal cell produced above is 90 using the VHR-1 voltage holding ratio measuring device manufactured by Toyo Tech-Riki. C, voltage: ⁇ 4V, pulse width: 60 ⁇ s, flame period: measured at a setting of 16.67ms, voltage holding of how much can be maintained after 16.6ms of voltage force of 4VZ60s at a temperature of 90 ° C Calculated as a rate.
  • Example 5 93% Example 3 0 943 ⁇ 4 Example 5 5 933 ⁇ 4
  • Example 1 0 943 ⁇ 4
  • Example 3 5 943 ⁇ 4
  • Example 6 0 953 ⁇ 4
  • Example 1 1 953 ⁇ 4
  • Example 3 6 943 ⁇ 4
  • Example 6 1 953 ⁇ 4
  • Example 1 2 933 ⁇ 4 Example 3 7 943 ⁇ 4 Example 6 2 943 ⁇ 4
  • Example 1 4 953 ⁇ 4
  • Example 3 9 943 ⁇ 4
  • Example 6 4 953 ⁇ 4
  • Example 1 5 943 ⁇ 4
  • Example 4 0 943 ⁇ 4
  • Example 6 5 933 ⁇ 4
  • Example 1 6 953 ⁇ 4
  • Example 4 1 943 ⁇ 4
  • Example 6 6 94X
  • Example 2 1 943 ⁇ 4 Example 4 6 943 ⁇ 4 Comparative Example 5 933 ⁇ 4
  • liquid crystal cell of the liquid crystal aligning agent liquid crystal display element of the present invention
  • liquid crystal cell of the liquid crystal aligning agent that is the coating liquid of Example 4
  • the liquid crystal cell of the liquid crystal aligning agent that is the coating liquid force of Comparative Example 1 the liquid for comparison
  • the crystal display element was compared with the ease of stored charge release as follows.
  • the coating solution of the present invention precipitation of the rosin component due to moisture absorption can be suppressed, stable printability can be obtained, and it can be suitably used as a liquid crystal aligning agent.
  • the liquid crystal alignment film of the present invention can provide a liquid crystal display element of higher quality than before, and this liquid crystal display element can be suitably used for various display devices.

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Abstract

It is intended to provide a liquid crystal oriented film in which deposition of resin component due to moisture absorption is inhibited, and which has stable printability and also has characteristics such as rubbing resistance and ease of removing stored charge. An application liquid, characterized by containing (A) component: an imidized polymer soluble in a solvent obtained from at least one type of amine compound selected from the group consisting of a tetracarboxylic dianhydride, a diamine compound, an amine compound (a), an amine compound (b), and an amine compound (c) described below, and (B) component: polyamic acid. Amine compound (a): an amine compound having in its molecule, one primary amino group selected from the formula [K1] and the formula [K2], and at least one imino group selected from the formula [K3] and the formula [K4]. In the formula [K3] and the formula [K4], the coupling direction of -CH2-NH- is opposite to each other. Amine compound (b): an amine compound having in its molecule, at least two primary amino groups selected from the formula [K1] and the formula [K2]. Amine compound (c): an amine compound having in its molecule, at least one primary amino group selected from the formula [K1] and the formula [K2], and at least one imino group selected from the formula [K3] and the formula [K4].

Description

明 細 書  Specification
液晶配向剤並びにそれを用いた液晶配向膜及び液晶表示素子 技術分野  LIQUID CRYSTAL ALIGNANT, LIQUID CRYSTAL ALIGNING FILM AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME
[0001] 本発明は、液晶配向剤として好適な塗布液に関するものであり、更には、この塗布 液を用いて得られる液晶配向膜及び液晶表示素子に関する。  The present invention relates to a coating liquid suitable as a liquid crystal aligning agent, and further relates to a liquid crystal alignment film and a liquid crystal display element obtained using this coating liquid.
背景技術  Background art
[0002] 現在、液晶表示素子などに用いられている液晶配向膜は、ポリイミドを使用すること が一般的であり、通常は液晶配向剤と呼ばれる溶液を塗布し、焼成することで作製さ れている。この場合、液晶配向剤は、ポリアミック酸などのポリイミド前駆体、又は溶媒 可溶性ポリイミドなどを含有する溶液が一般的であるが、ポリアミック酸と溶媒可溶性 ポリイミドの両方を含有するもの(特許文献 1参照)や、ポリアミック酸及びポリアミック 酸を脱水閉環して得られるイミドィ匕率の異なる 2種類以上のイミドィ匕重合体を含有す るもの (特許文献 2参照)なども提案されて!ヽる。このように数種類の榭脂成分を含有 する液晶配向剤力 得られた液晶配向膜は、液晶の配向性、液晶のプレチルト角、 液晶セルの種々の電気特性など、必要とされるいくつかの特性を同時に実現できる ことが知られている。  [0002] Currently, a liquid crystal alignment film used in a liquid crystal display element or the like is generally made of polyimide, and is usually manufactured by applying a solution called a liquid crystal alignment agent and baking it. Yes. In this case, the liquid crystal aligning agent is generally a solution containing a polyimide precursor such as polyamic acid or a solvent-soluble polyimide, but contains both a polyamic acid and a solvent-soluble polyimide (see Patent Document 1). Also proposed are polyamic acids and those containing two or more types of imidopolymers having different imidication ratios obtained by dehydrating and ring-closing polyamic acids (see Patent Document 2). Thus, the liquid crystal aligning power which contains several kinds of resin components The obtained liquid crystal aligning film has several required properties such as liquid crystal orientation, liquid crystal pretilt angle, and various electric characteristics of the liquid crystal cell. It is known that can be realized simultaneously.
[0003] 液晶配向膜を工業的に生産するには、液晶配向剤の塗布は印刷機によるフレキソ 印刷で行う方法が現在の主流であるが、長時間連続して印刷を行うど塗膜の均一性 が低下し印刷不良を起こす場合があった。これは、印刷機上に滞留している液晶配 向剤が溶媒の揮発により濃縮され更には吸湿し、溶液中の榭脂成分が凝集や析出 を起こすことが原因のひとつとされている。従って、この現象はアミド系溶媒のように 吸湿性の高い溶媒を主溶媒とした場合に顕著となる。また、詳細な原因は解明され て!、な 、が、ポリアミック酸と可溶性ポリイミドの両方を含有する液晶配向剤の場合に は、上記のような印刷不良が起こりやす力つた。この現象に対して、可溶性ポリイミド を得るためのジァミン成分にビフヱ-ルジァミン骨格を有する化合物を使用すること が提案されて ヽる (特許文献 3参照)。  [0003] In order to industrially produce a liquid crystal alignment film, a method of applying a liquid crystal alignment agent by flexographic printing using a printing machine is currently the mainstream, but the film is uniformly printed for a long time. In some cases, the printing performance deteriorates and printing defects occur. One of the reasons for this is that the liquid crystal orientation agent staying on the printing press is concentrated by volatilization of the solvent and further absorbs moisture, causing aggregation and precipitation of the resin component in the solution. Therefore, this phenomenon becomes significant when a main solvent is a highly hygroscopic solvent such as an amide solvent. In addition, the detailed cause has been elucidated! However, in the case of the liquid crystal aligning agent containing both polyamic acid and soluble polyimide, the above-mentioned printing failure is likely to occur. In response to this phenomenon, it has been proposed to use a compound having a biphenyl-diamine skeleton as a diamine component for obtaining a soluble polyimide (see Patent Document 3).
[0004] 特許文献 1 :特開平 8— 220541号公報 特許文献 2 :特開平 9— 297312号公報 [0004] Patent Document 1: Japanese Patent Laid-Open No. 8-220541 Patent Document 2: Japanese Patent Laid-Open No. 9-2937312
特許文献 3:国際公開第 2004Z090016号パンフレット  Patent Document 3: International Publication No. 2004Z090016 pamphlet
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0005] 本発明が解決しょうとする課題は、ポリアミック酸と溶媒に可溶なイミド化重合体の 両方を含有する塗布液に関して、吸湿時の安定性を向上させることにある。 [0005] The problem to be solved by the present invention is to improve the stability during moisture absorption with respect to a coating solution containing both a polyamic acid and an imidized polymer soluble in a solvent.
本発明の目的は、液晶配向剤として好適な塗布液を提供すること、高品質の液晶 配向膜を提供すること、及び高品位の液晶表示素子を提供することにある。  An object of the present invention is to provide a coating liquid suitable as a liquid crystal aligning agent, to provide a high-quality liquid crystal alignment film, and to provide a high-quality liquid crystal display element.
課題を解決するための手段  Means for solving the problem
[0006] 本発明者らは、上記課題を解決するために鋭意検討を行った結果、溶媒可溶性ポ リイミドに特定のアミンィ匕合物を反応させること、又は溶媒可溶性ポリイミドを製造する 際の原料に特定のアミンィ匕合物を使用することにより、ポリアミック酸との混合溶液の 吸湿安定性が向上することを見いだし、本発明を完成させるに至った。即ち本発明 は、以下の特徴を要旨とするものである。  [0006] As a result of intensive studies to solve the above problems, the present inventors have made a specific amine compound react with a solvent-soluble polyimide, or a raw material for producing a solvent-soluble polyimide. It has been found that the use of a specific amine compound improves the hygroscopic stability of the mixed solution with the polyamic acid, and the present invention has been completed. That is, the present invention has the following features.
[0007] (1) (A)成分:テトラカルボン酸二無水物、ジァミン化合物、下記のアミンィ匕合物(a) 、アミンィ匕合物 (b)及びアミンィ匕合物(c)からなる群力 選ばれる少なくとも一種のアミ ン化合物力 得られる溶媒に可溶なイミド化重合体と、 (B)成分:ポリアミック酸とを含 有することを特徴とする塗布液。  [0007] (1) Component (A): tetracarboxylic dianhydride, diamine compound, aminic compound (a), aminic compound (b) and aminic compound (c) A coating solution comprising: an imidized polymer that is soluble in the obtained solvent and at least one selected amine compound strength; and (B) component: polyamic acid.
アミンィ匕合物(a):分子内に、式 [K1]及び式 [K2]から選ばれる一級アミノ基を 1個 と、式 [K3]及び式 [K4]カゝら選ばれるイミノ基を少なくとも 1個有するァミン化合物。 なお、式 [K3]と式 [K4]では、—CH—NH—の結合方向が逆の関係にある。  Amine compound (a): In the molecule, at least one primary amino group selected from formula [K1] and formula [K2] and at least an imino group selected from formula [K3] and formula [K4] One amine compound. In the formulas [K3] and [K4], the bonding direction of —CH—NH— is opposite.
2  2
アミンィ匕合物 (b):分子内に、上記式 [K1]及び式 [K2]から選ばれる一級アミノ基 を少なくとも 2個有するアミンィ匕合物。  Amine compound (b): an amine compound having at least two primary amino groups selected from the above formulas [K1] and [K2] in the molecule.
アミンィ匕合物(c):分子内に式 [K1 ]及び式 [K2]力も選ばれる一級アミノ基を少なく とも 1個と、式 [K3]及び式 [K4]カゝら選ばれるイミノ基を少なくとも 1個有するアミンィ匕 合物。  Amine compound (c): At least one primary amino group of formula [K1] and formula [K2] force in the molecule and an imino group of formula [K3] and formula [K4] Amine compound having at least one.
[0008] [化 1] H2N-CH2— H2N-CH— [0008] [Chemical 1] H 2 N-CH 2 — H 2 N-CH—
[Kl] [K2]  [Kl] [K2]
— CH2-NH— — NH— CH2— CH 2 -NH— — NH— CH 2
[K3] [K4]  [K3] [K4]
(2) (A)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力 得られる溶媒可溶 性ポリイミドの側鎖及び分子末端のうちの少なくとも一方と、前記アミンィ匕合物 (a)及 びァミン化合物 (b)力も選ばれる少なくとも一種のアミンィ匕合物とが結合して得られる 溶媒に可溶なイミド化重合体である上記(1)に記載の塗布液。 (2) The component (A) is composed of at least one of a side chain and a molecular end of a solvent-soluble polyimide obtained by the ability of a tetracarboxylic dianhydride and a diamine compound, and the amine compound (a) and The coating solution according to the above (1), which is an imidized polymer soluble in a solvent obtained by binding an amine compound (b) with at least one amine compound that also has a selected force.
(3) (A)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力 得られる溶媒可溶 性ポリイミドに、前記アミン化合物(a)及びアミンィ匕合物 (b)から選ばれる少なくとも一 種のアミンィ匕合物を反応させて得られる生成物である上記(1)に記載の塗布液。 (3) The component (A) is at least one selected from the amine compound (a) and the amine compound (b) as a solvent-soluble polyimide obtained by combining tetracarboxylic dianhydride and diamine compound. The coating solution according to (1) above, which is a product obtained by reacting an amine compound.
(4) (A)成分が、テトラカルボン酸二無水物とアミンィ匕合物(c)を含むジァミンィ匕合物 とを反応させたポリイミド前駆体をイミドィ匕して得られる溶媒に可溶なイミドィ匕重合体で ある上記(1)に記載の塗布液。 (4) The component (A) is a solvent-soluble imido compound obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride with a diamine compound containing an amine compound (c). The coating solution according to (1) above, which is a soot polymer.
(5) (A)成分が、前記アミン化合物(a)として、下記式 (i)及び (ii)で表されるアミンィ匕 合物から選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に可溶なイミ ド化重合体である上記(1)に記載の塗布液。  (5) The component (A) is a solvent obtained by using, as the amine compound (a), at least one amine compound selected from amine compounds represented by the following formulas (i) and (ii): The coating solution according to the above (1), which is an imidized polymer soluble in water.
[化 2] [Chemical 2]
H2N— R1— X1- CH N ~ X2 ( i ) H 2 N— R 1 — X 1 -CH N ~ X 2 (i)
H  H
H2N— R1— X1— N-CH2-X2 ( ϋ ) H 2 N— R 1 — X 1 — N-CH 2 -X 2 (ϋ)
H  H
〔ただし、式中の R1は、 CH CH (CH ) もしくは一 CH (CH CH )—のァ [However, R 1 in the formula is CH CH (CH) or one CH (CH CH) —
2 3 2 3 ルキレン、又は脂肪族環を表し、 X1は、単結合又は炭素原子数 1 20の脂肪族炭 化水素を表し、かつ脂肪族炭化水素中に— NH を含んでいてもよい。また、 X2は 炭素原子数 1 20の有機基を表し、炭素原子数 1 20のアルキル基、環状脂肪族 基、芳香族基、複素環基、カルボキシル基及びこれらの組み合わせからなる有機基 で、かつ、不飽和結合、エーテル結合(一 O )、ケトン結合(一 CO )、エステル結 合(一 COO )、ァミノ結合(一 NH )、ァミン結合(一 N )、シリル結合(一 Si—)、 シロキサン結合( SiO )などを含んでいてもよい。さらに、 X2のアルキル基が— R1 一、 X1—、 -CH 一、及び NH のいずれかと複素環状構造を形成していても 2 3 2 3 represents alkylene or an aliphatic ring, X 1 represents a single bond or an aliphatic hydrocarbon having 120 carbon atoms, and —NH 2 may be contained in the aliphatic hydrocarbon. X 2 represents an organic group having 120 carbon atoms, an alkyl group having 120 carbon atoms, and a cyclic aliphatic group. Organic group consisting of a group, aromatic group, heterocyclic group, carboxyl group and combinations thereof, and unsaturated bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), An amino bond (one NH 3), an amine bond (one N), a silyl bond (one Si—), a siloxane bond (SiO 2), and the like may be included. Furthermore, even if the alkyl group of X 2 forms a heterocyclic structure with any of —R 1 , X 1 —, —CH 1, and NH
2  2
よい。〕  Good. ]
[0010] (6) (A)成分が、前記アミン化合物 (b)として、下記式 (m)から (V)で表されるアミンィ匕 合物から選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に可溶なイミ ド化重合体である上記(1)に記載の塗布液。  (6) The component (A) is at least one amine compound selected from amine compounds represented by the following formulas (m) to (V) as the amine compound (b): The coating solution according to (1) above, which is an imidized polymer soluble in the obtained solvent.
[0011] [化 3] [0011] [Chemical 3]
H2N— R1— X3-R1— NH2 ( iii ) H 2 N— R 1 — X 3 -R 1 — NH 2 (iii)
H2N— R— X4— NH— X5— R1— NH2 ( iv ) H 2 N— R— X 4 — NH— X 5 — R 1 — NH 2 (iv)
H2N— R1— X6-NH— X7-NH— X8-R1— NH2 ( v ) H 2 N— R 1 — X 6 -NH— X 7 -NH— X 8 -R 1 — NH 2 (v)
〔ただし、式中の R1は、 CH —、 一 CH (CH ) 一、もしくは一 CH (CH CH )—のァ [However, R 1 in the formula is CH —, one CH (CH 2) one, or one CH (CH 2 CH 2) —
2 3 2 3 ルキレン、又は脂肪族環を表し、 H ?^ 1^ーとー1^ ?《1の R1は同一でも異なって 2 3 2 3 Represents lucylene or an aliphatic ring, and H? ^ 1 ^-and -1 ^? << 1 R 1 are the same or different
2 2  twenty two
いてもよい。 X3は、単結合、又は炭素原子数 1〜20の有機基を表し、炭素原子数 1 〜20のアルキレン、脂肪族環、芳香族環、複素環及びこれらの組み合わせ力 なる 有機基で、かつ、不飽和結合、エーテル結合(一 0— )、ケトン結合(一 CO )、エス テル結合( COO )、チォエーテル結合(一 S )、シリル結合(一 Si—)、シロキサ ン結合(一 SiO )などを含んでいてもよい。 x4、 x5、 X6、 X7及び X8は、それぞれ独 立に炭素原子数 1〜20の脂肪族炭化水素を表し、それぞれ同一でも異なっていても よい。〕 May be. X 3 represents a single bond or an organic group having 1 to 20 carbon atoms, an alkylene group having 1 to 20 carbon atoms, an aliphatic ring, an aromatic ring, a heterocyclic ring, and an organic group having a combination force thereof, and , Unsaturated bond, ether bond (one 0—), ketone bond (one CO), ester bond (COO), thioether bond (one S), silyl bond (one Si—), siloxane bond (one SiO), etc. May be included. x 4 , x 5 , X 6 , X 7 and X 8 each independently represent an aliphatic hydrocarbon having 1 to 20 carbon atoms, and may be the same or different. ]
(7) (A)成分が、前記アミン化合物 (c)として、下記式 (i)、 (ii)、 Gv)及び (V)で表され るアミンィ匕合物から選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に 可溶なイミドィ匕重合体である上記(1)に記載の塗布液。  (7) The component (A) is at least one amine compound selected from amine compounds represented by the following formulas (i), (ii), Gv) and (V) as the amine compound (c): The coating solution according to (1) above, which is an imidopolymer soluble in a solvent obtained by using the product.
[0012] [化 4] H2N— R1— X1-CH2— N ~ X2 ( i ) [0012] [Chemical 4] H 2 N— R 1 — X 1 -CH 2 — N ~ X 2 (i)
H  H
H2N— R1— X1— N-CH2-X2 ( ϋ ) H 2 N— R 1 — X 1 — N-CH 2 -X 2 (ϋ)
H  H
[0013] [化 5]  [0013] [Chemical 5]
H2N— R^-X4— NH— X5— R1— NH2 ( iv ) H2N— R1— X6 - NH— X7— NH— X8- R1— NH2 ( v ) H 2 N— R ^ -X 4 — NH— X 5 — R 1 — NH 2 (iv) H 2 N— R 1 — X 6 -NH— X 7 — NH— X 8 -R 1 — NH 2 (v )
[0014] (8) (A)成分のイミド化重合体と (B)成分のポリアミック酸の比率力 (A)成分と (B) 成分の合計質量中、(B)成分のポリアミック酸の比率が 20〜99質量%である上記(1 )、(2)、及び (4)〜(7)のいずれかに記載の塗布液。 (8) Ratio power of imidized polymer of component (A) and polyamic acid of component (B) In the total mass of component (A) and component (B), the ratio of polyamic acid of component (B) is The coating solution according to any one of (1), (2), and (4) to (7), which is 20 to 99% by mass.
(9) (A)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力 得られる溶媒可溶 性ポリイミド 100質量部に対して、前記アミンィ匕合物(a)及びアミンィ匕合物 (b)から選 ばれる少なくとも一種のアミンィ匕合物を 1〜15質量部反応させた生成物である上記( 3)に記載の塗布液。  (9) The component (A) is composed of tetracarboxylic dianhydride and diamine compound, and the solvent-soluble polyimide obtained is 100 parts by mass with respect to the amine compound (a) and amine compound (b). The coating liquid according to (3) above, which is a product obtained by reacting 1 to 15 parts by mass of at least one amine compound selected from
(10) (A)成分が、テトラカルボン酸二無水物と、前記で表されたァミン化合物 (c)を 含むジァミンとを反応させたポリイミド前駆体をイミドィ匕して得られる溶媒に可溶なイミ ド化重合体にぉ 、て、アミンィ匕合物(c)の量が、ジァミンとアミンィ匕合物(c)を合わせ た合計量中 lmol%〜15mol%である上記 (4)又は(7)に記載の塗布液。  (10) The component (A) is soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride and a diamine containing the amine compound (c) represented above. The above-mentioned (4) or (7), wherein the amount of the amine compound (c) is 1 mol% to 15 mol% in the total amount of the diamine and the amine compound (c) combined with the imidized polymer. ).
(11)上記(1)〜(10)のいずれかに記載の塗布液からなる液晶配向剤。  (11) A liquid crystal aligning agent comprising the coating liquid according to any one of (1) to (10) above.
(12)アミド系溶媒が塗布液中に 50質量%以上含有する上記(11)に記載の液晶配 向剤。  (12) The liquid crystal aligning agent according to the above (11), wherein the amide solvent is contained in the coating solution in an amount of 50% by mass or more.
( 13)上記( 11)又は( 12)に記載の液晶配向剤を用 、て得られる液晶配向膜。  (13) A liquid crystal alignment film obtained by using the liquid crystal aligning agent according to (11) or (12).
(14)上記(13)に記載の液晶配向膜を用いた液晶表示素子。  (14) A liquid crystal display device using the liquid crystal alignment film according to (13).
発明の効果  The invention's effect
[0015] 本発明の塗布液によれば、吸湿による榭脂成分の析出が抑制され、安定した印刷 性を得ることができ、液晶配向剤として好適に用いることができる。また、本発明の塗 布液を用いて得られる液晶配向膜は、ラビング耐性の向上や、蓄積電荷の抜け易さ の向上もみられるので、従来よりも高品位の液晶表示素子を得ることができる。 [0015] According to the coating liquid of the present invention, precipitation of the resin component due to moisture absorption is suppressed, stable printability can be obtained, and it can be suitably used as a liquid crystal aligning agent. In addition, the coating of the present invention Since the liquid crystal alignment film obtained using the cloth liquid has improved rubbing resistance and improved ease of stored charge release, a liquid crystal display element of higher quality than before can be obtained.
図面の簡単な説明  Brief Description of Drawings
[0016] [図 1]実施例 4又は比較例 1の塗布液力 なる液晶配向剤を用いた液晶セルの蓄積 電荷の抜け易さの比較を示すグラフである。  [0016] FIG. 1 is a graph showing a comparison of the ease of escape of accumulated charges in a liquid crystal cell using a liquid crystal aligning agent having a coating solution force of Example 4 or Comparative Example 1.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0017] 溶媒に可溶なイミドィ匕重合体とポリアミック酸の両方を含有する塗布液において、溶 媒に可溶なイミド化重合体成分は、特に、液晶配向膜を低い焼成温度で形成する際 に、液晶セルの電圧保持率などに寄与し、ポリアミック酸成分は印刷性や基板との密 着性、液晶配向膜としたときの電荷蓄積の低減や電荷の抜けやすさなどに寄与して いる。また、塗膜形成後においては、膜の厚み方向で可溶性ポリイミドとポリアミック 酸の濃度に勾配ができていることで、単一榭脂成分では得られにくい特性が発現し ているともいわれている。 [0017] In a coating solution containing both a solvent-soluble imidopolymer and a polyamic acid, the solvent-soluble imidized polymer component is particularly suitable for forming a liquid crystal alignment film at a low firing temperature. In addition, it contributes to the voltage holding ratio of the liquid crystal cell, etc., and the polyamic acid component contributes to printability, adhesion to the substrate, reduction of charge accumulation and ease of charge removal when used as a liquid crystal alignment film. . In addition, it is said that after the coating film is formed, the concentration of soluble polyimide and polyamic acid in the film thickness direction has a gradient, which makes it difficult to obtain with a single resin component.
し力しながら、このような優れた特性を有しながら、先にも述べたように印刷機上に 滞留している液晶配向剤が溶媒の揮発により濃縮され更には吸湿し、溶液中の榭脂 成分が凝集や析出を起こすことが印刷不良を起こす原因のひとつと考えられる。 そこで、本発明者らは、特定のアミンィ匕合物の作用により、この相分離が適度に抑 制されることで、溶媒可溶性ポリイミドとポリアミック酸の両方を含有する利点を失わず に、吸湿時の安定性が向上することを見出し、本発明を完成するに至った。  However, as described above, the liquid crystal aligning agent staying on the printing press is concentrated by volatilization of the solvent and further absorbs moisture as described above. The aggregation and precipitation of the fat component is thought to be one of the causes of printing defects. Therefore, the present inventors have moderately suppressed this phase separation by the action of a specific amine compound, so that the advantage of containing both the solvent-soluble polyimide and the polyamic acid is not lost. As a result, the present invention has been completed.
即ち、本発明は、テトラカルボン酸二無水物、ジァミンィ匕合物、及び下記で表される ァミン化合物(a)とアミンィ匕合物 (b)力 選ばれる少なくとも一種のァミン化合物から 得られる溶媒に可溶なイミドィ匕重合体の (A)成分とポリアミック酸の(B)成分とを含有 する塗布液である。  That is, the present invention relates to a solvent obtained from tetracarboxylic dianhydride, diamine compound, and an amine compound (a) and amine compound (b) represented by the following formula: A coating solution containing a component (A) of a soluble imidopolymer and a component (B) of a polyamic acid.
[0018] 本発明にお 、て、(A)成分の好ま 、態様は、テトラカルボン酸二無水物とジァミン 化合物から得られる溶媒可溶性ポリイミドに、特定のアミンィ匕合物(a)及びアミン化合 物 (b)力も選ばれる少なくとも一種のァミン化合物が、側鎖及び分子末端のうちの少 なくとも一つとして結合して得られる溶媒に可溶なイミドィ匕重合体である。  In the present invention, a preferred embodiment of the component (A) is that the solvent-soluble polyimide obtained from tetracarboxylic dianhydride and a diamine compound includes a specific amine compound (a) and an amine compound. (b) An imidyl polymer that is soluble in a solvent obtained by binding at least one amine compound, the force of which is selected, as at least one of a side chain and a molecular end.
[0019] 具体的には、 { 1 }溶媒可溶性ポリイミドに下記のアミンィ匕合物(a)とアミンィ匕合物 (b) と力 選ばれる少なくとも一種のアミンィ匕合物を反応させた生成物である溶媒に可溶 なイミド化重合体と、ポリアミック酸とを含有するものである力、又は、 {2}テトラカルボ ン酸ニ無水物と下記アミンィ匕合物(c)を含むジァミンとを反応させたポリイミド前駆体 をイミドィ匕して得られた溶媒に可溶なイミドィ匕重合体と、ポリアミック酸とを含有するも のである。なお、 { 1 }、 {2}においてポリアミック酸は同じものである。 [0019] Specifically, the following amine compound (a) and amine compound (b) are added to {1} solvent-soluble polyimide. Or a force that contains an imidized polymer that is soluble in a solvent, which is a product obtained by reacting at least one selected amine compound, and a polyamic acid, or {2} tetracarboxylic acid It contains a polyimide precursor soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting an anhydride with a diamine containing the following amine compound (c), and a polyamic acid. . In {1} and {2}, the polyamic acid is the same.
アミンィ匕合物(a)は、分子内に、式 [K1]及び式 [K2]から選ばれる一級アミノ基を 1 個と、式 [K3]及び式 [K4]カゝら選ばれるイミノ基を少なくとも 1個有するァミン化合物 であり、  The amine compound (a) has one primary amino group selected from the formula [K1] and formula [K2] and an imino group selected from the formula [K3] and formula [K4] in the molecule. An amine compound having at least one,
[0020] [化 6] [0020] [Chemical 6]
H2N-CH2— H2N-CH— [Kl] [ 2] H 2 N-CH 2 — H 2 N-CH— [Kl] [2]
— CH2-NH— — NH-CH2— CH 2 -NH— — NH-CH 2
[K3j [K4] アミンィ匕合物 (b)は、分子内に、式 [K1]及び式 [K2]から選ばれる一級アミノ基を 少なくとも 2個有するアミンィ匕合物である。  [K3j [K4] Amine compound (b) is an amine compound having at least two primary amino groups selected from the formulas [K1] and [K2] in the molecule.
[0021] なお、式 [K3]と式 [K4]では、例えば、後記する式 (i)と (ii)の X1、 X2での関係のよ うに、 CH— NH の結合方向が逆の関係にある、 [0021] It should be noted that in the formulas [K3] and [K4], for example, the CH—NH bonding directions are reversed as in the relations of X 1 and X 2 in formulas (i) and (ii) described later. In relation,
2  2
また、ァミン化合物(c)は、分子内に式 [K1]及び式 [K2]力も選ばれる一級アミノ 基を少なくとも 1個と、式 [K3]及び式 [K4]カゝら選ばれるイミノ基を少なくとも 1個有す るアミンィ匕合物である。  In addition, the amine compound (c) has at least one primary amino group having the formula [K1] and formula [K2] forces selected in the molecule and an imino group selected from the formula [K3] and formula [K4]. It is an amine compound with at least one.
[0022] なお、アミンィ匕合物(c)は、式 [K1]又は式 [K2]で表される一級アミノ基を 1個有す る場合は、アミンィ匕合物(a)と同じであり、式 [K1]及び式 [K2]から選ばれる一級アミ ノ基を少なくとも 2個有する場合は、アミンィ匕合物 (b)に含まれる化合物である。  [0022] The amine compound (c) is the same as the amine compound (a) when it has one primary amino group represented by the formula [K1] or the formula [K2]. And having at least two primary amino groups selected from the formulas [K1] and [K2] are compounds contained in the amine compound (b).
好ましくは、ァミン化合物(a)は、次式 —I^ NH (R1は CH —、—CH (CH Preferably, the amine compound (a) has the following formula —I ^ NH (R 1 is CH —, —CH (CH
2 2 3 2 2 3
)一、 CH (CH CH )—、又は脂肪族環である)で表されるアミノ基を 1個と、次式 1) an amino group represented by CH (CH 2 CH 3) — or an aliphatic ring) and
2 3  twenty three
-R2-NH-R3- (R2、 R3は 2価の有機基であり、その少なくとも一方はメチレンで ある)で表されるイミノ基を少なくとも 1個有するアミンィ匕合物である。 [0023] また、好ましくは、ァミン化合物(b)は、次式 —I^—NH (R1は—CH—、—CH An amine compound having at least one imino group represented by —R 2 —NH—R 3 — (R 2 and R 3 are divalent organic groups, at least one of which is methylene). [0023] Preferably, the amine compound (b) is represented by the following formula: —I ^ —NH (R 1 is —CH—, —CH
2 2  twenty two
(CH )―、 -CH (CH CH )―、又は脂肪族環である)で表されるアミノ基を少なくと (CH 3) —, —CH 2 (CH 2 CH 3) —, or an aliphatic ring)
3 2 3 3 2 3
も 2個有するアミンィ匕合物である。  Is also an amine compound.
さらに、好ましくは、ァミン化合物(c)は、次式 —I^— NH (R1は— CH—、—C Further, preferably, the amine compound (c) has the following formula —I ^ —NH (R 1 is —CH—, —C
2 2 twenty two
H (CH )—、 -CH (CH CH )—、又は脂肪族環である)で表されるアミノ基を少なくH (CH 3) —, —CH 2 (CH 2 CH 3) —, or an aliphatic ring)
3 2 3 3 2 3
とも 1個と、次式 ― R2— NH— R3— (R2、 R3は 2価の有機基であり、その少なくとも 一方はメチレンである)で表されるイミノ基を少なくとも 1個とを有するアミンィ匕合物で ある。 And at least one imino group represented by the following formula: —R 2 —NH—R 3 — (R 2 and R 3 are divalent organic groups, at least one of which is methylene) It is an amine compound having
上記 { 1 }の塗布液の具体例としては、ポリイミドの溶液に上記アミンィ匕合物(a)又は ァミン化合物 (b)の 、ずれかのアミン化合物を所定量添加し、室温又は加熱条件下 で攪拌して得られた反応生成物の溶媒に可溶なイミドィ匕重合体と、ポリアミック酸の 溶液とを任意の比率で混合して得られる溶液である。  As a specific example of the coating solution of {1}, a predetermined amount of the amine compound (a) or amine compound (b) is added to a polyimide solution, and the solution is heated at room temperature or under heating conditions. It is a solution obtained by mixing the imidyl polymer soluble in the solvent of the reaction product obtained by stirring and the polyamic acid solution in an arbitrary ratio.
また、 {2}の塗布液の具体例としては、テトラカルボン酸二無水物とジァミンと上記 ァミン化合物 (c)とを反応させたポリイミド前駆体をイミド化して得られたイミドィ匕重合 体の溶液と、ポリアミック酸の溶液とを任意の比率で混合して得られる溶液が挙げら れる。  Further, as a specific example of the coating solution of {2}, an imidyl polymer solution obtained by imidizing a polyimide precursor obtained by reacting tetracarboxylic dianhydride, diamine and the above amine compound (c) And a solution obtained by mixing a polyamic acid solution in an arbitrary ratio.
[0024] 本発明に使用される特定のァミン化合物(a)及びアミン化合物 (b)は少なくとも二つ の作用点を有して 、る。一つは溶媒可溶性ポリイミドと化学的に結合する部位であり 、もう一つはポリアミック酸と水素結合や塩形成などをする部位である。このことにより 、特定のアミンィ匕合物と反応した溶媒に可溶なイミドィ匕重合体とポリアミック酸は相溶 性が向上し、塗布液が濃縮された際の相分離が抑制される。  The specific amine compound (a) and amine compound (b) used in the present invention have at least two action points. One is a site chemically bonded to the solvent-soluble polyimide, and the other is a site that forms a hydrogen bond or salt formation with the polyamic acid. This improves the compatibility between the imidopolymer and polyamic acid that are soluble in the solvent reacted with the specific amine compound, and suppresses phase separation when the coating solution is concentrated.
前記アミンィ匕合物(a)又はアミンィ匕合物 (b)において、式 [K1]及び式 [K2]で表さ れる一級アミノ基は脂肪族ァミノ基であり、ポリイミド中のイミドカルボニル基に対して イミド基の開環を伴う反応で結合し、また後述するようにポリイミドのイミド化率が 100 %未満の場合は、上述した反応の他に、そのアミド酸基のカルボキシル基又はアミド 酸エステル基のカルボキシエステル基に対して、水又はアルコ一ルの脱離を伴う反 応で結合をする。  In the amine compound (a) or the amine compound (b), the primary amino group represented by the formula [K1] and the formula [K2] is an aliphatic amino group, and the imide carbonyl group in the polyimide is When the imidization ratio of the polyimide is less than 100% as described later, in addition to the reaction described above, the carboxyl group or amic acid ester group of the amic acid group It binds to the carboxyester group by a reaction involving elimination of water or alcohol.
前記で好まし 、としたァミン化合物(a)又はアミンィ匕合物 (b)に含まれる— R1― NH で表されるアミノ基において、 R1は一 CH CH (CH ) CH (CH CH )Included in the amine compound (a) or the amine compound (b) that is preferred as described above — R 1 — NH In the amino group represented by R 1 , R 1 represents one CH CH (CH) CH (CH CH)
2 2 3 2 32 2 3 2 3
―、又は脂肪族環を表す。脂肪族環としては、シクロプロパン、シクロブタン、シクロべ ンタン、シクロへキサン、シクロヘプタン、シクロオクタン、シクロデカン、シクロドデカン-Or an aliphatic ring. Aliphatic rings include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, and cyclododecane.
、ァダマンタン、デカヒドロナフタレン、ノロボルナンなどが挙げられる。 , Adamantane, decahydronaphthalene, norobornane and the like.
これらのアミノ基は脂肪族ァミノ基であり、上記で述べたとおりの特性を発現する。 従って、このアミノ基の R1は、ァミノ基の求核性を高め、かつ立体障害が少ないとい う理由で、メチレンが最も好ましい。脂肪族環の中ではシクロプロパン、シクロブタン、 シクロペンタン、シクロへキサンなどが好ましい。 These amino groups are aliphatic amino groups and exhibit the characteristics as described above. Therefore, R 1 of this amino group is most preferably methylene because it increases the nucleophilicity of the amino group and has less steric hindrance. Among the aliphatic rings, cyclopropane, cyclobutane, cyclopentane, cyclohexane and the like are preferable.
[0025] 一方、ァミン化合物(a)に含まれる CH—NH 又は NH— CH—で表される On the other hand, it is represented by CH—NH or NH—CH— contained in the amine compound (a).
2 2  twenty two
イミノ基は、ポリアミック酸中のカルボキシル基と、水素結合や塩形成等の作用をする The imino group acts with the carboxyl group in polyamic acid, such as hydrogen bonding and salt formation.
。また、ァミン化合物(a)において、—CH—NH 又は NH— CH—で表される . In the amine compound (a), it is represented by —CH—NH or NH—CH—.
2 2  twenty two
イミノ基は 1個以上有して 、ればよ 、が、化合物の入手性や安定性の観点から 1〜4 個が適当であり、特には 1〜2個が好ましい。  One or more imino groups may be contained, but 1 to 4 is suitable from the viewpoint of availability and stability of the compound, and 1 to 2 is particularly preferable.
同様に、前記で好ましいとしたァミン化合物(a)に含まれる— R2— NH— R3 で表 されるイミノ基は、ポリアミック酸中のカルボキシル基と、水素結合や塩形成等の作用 をする。従って、このイミノ基の R2、 R3は、ィミノ基の窒素原子にある程度以上の電子 密度を持たせる必要があるという理由から、 R2、 R3の少なくとも一方はメチレンである 必要がある。片方カ^チレンであるとき、もう片方の構造は特に限定されず、例えば、 R1で例示した— CH―、— CH (CH )―、— CH (CH CH )―、脂肪族環、又はフ Similarly, the imino group represented by —R 2 —NH—R 3 contained in the amine compound (a) described above has a function of forming a hydrogen bond or salt formation with the carboxyl group in the polyamic acid. . Therefore, R 2 and R 3 of this imino group need to have at least one of R 2 and R 3 methylene because it is necessary to give the nitrogen atom of the imino group a certain electron density. When a one month ^ styrene, structures of the other is not particularly limited, for example, exemplified in R 1 - CH -, - CH (CH) -, - CH (CH CH) -, aliphatic ring, or off
2 3 2 3  2 3 2 3
ェ-レンなどが挙げられる。これらの中ではメチレン又は脂肪族環が好ましい。 R2、 R3 の両方カ^チレンであるとより好ましい。ァミン化合物(a)において、 R2— NH—R3 一で表されるイミノ基は 1個以上有していればよいが、化合物の入手性や安定性の 観点から 1〜4個が適当であり、特には 1〜 2個が好まし 、。 Ehren etc. Among these, methylene or an aliphatic ring is preferable. More preferably, both R 2 and R 3 are styrene. In the amine compound (a), it is sufficient that at least one imino group represented by R 2 —NH—R 3 is present, but 1 to 4 is appropriate from the viewpoint of availability and stability of the compound. There are 1 to 2 pieces, especially.
[0026] 前記アミンィ匕合物 (b)では、式 [K1]及び式 [K2]から選ばれる一級アミノ基を少な くとも 2個有している。このようなアミンィ匕合物の場合は、 1個目の一級アミノ基が溶媒 可溶性ポリイミドと反応するとアミンィ匕合物の移動が抑制されるため、残ったアミノ基 は他の溶媒可溶性ポリイミドと反応しにくくなる。その結果、溶媒可溶性ポリイミドと反 応していないアミノ基は、ァミン化合物(a)に含まれる前記イミノ基と同じ作用をするこ ととなる。 [0026] The amine compound (b) has at least two primary amino groups selected from the formulas [K1] and [K2]. In the case of such an amine compound, when the first primary amino group reacts with the solvent-soluble polyimide, the migration of the amine compound is suppressed, so the remaining amino group reacts with another solvent-soluble polyimide. It becomes difficult. As a result, the amino group not reacting with the solvent-soluble polyimide has the same action as the imino group contained in the amine compound (a). It becomes.
[0027] アミンィ匕合物(b)にお 、て、上記の一級アミノ基は 2個以上有して 、ればよ 、が、化 合物の入手性や安定性の観点から 2〜5個が適当であり、特には 2〜3個が好ましい 。また、ァミン化合物 (b)は、さらに式 [K3]及び式 [K4]から選ばれるイミノ基を 1個 以上有していると、ポリアミック酸との相溶性がより高くなるので好ましい。このイミノ基 はアミンィ匕合物(a)と同様に、 R2— NH— R3 で表されるイミノ基であることが好ま しい。 R2、 R3の定義はアミンィ匕合物(a)と同じである。 [0027] In the amine compound (b), there are 2 or more primary amino groups as described above, but 2 to 5 from the viewpoint of availability and stability of the compound. Is suitable, and 2 to 3 is particularly preferable. In addition, it is preferable that the amine compound (b) further has one or more imino groups selected from the formulas [K3] and [K4] because the compatibility with the polyamic acid becomes higher. This imino group is preferably an imino group represented by R 2 —NH—R 3 as in the amine compound (a). The definitions of R 2 and R 3 are the same as in the amine compound (a).
[0028] {2}の塗布液においては、(A)成分の可溶性イミド化重合体の製造時に、アミンィ匕 合物(c)が有する式 [K1 ]及び式 [K2]力も選ばれる少なくとも一個の一級アミノ基が 、テトラカルボン酸二無水物と反応することでァミン化合物(c)がポリイミド中に取り込 まれる。このアミノ基は分子内に 1個以上有していればよいが、化合物の入手性や安 定性の観点から 1〜5個が適当であり、特に 1〜2個が好ましい。ァミノ基が 1個である ァミン化合物(c)はポリマー分子の側鎖及び末端のいずれかに位置することになるの で、ポリアミック酸と水素結合や塩形成などをする際に立体障害が少ないという理由 から、最も好ましい。また、ァミノ基が 3個以上であると、得られた可溶性ポリイミドは三 次元構造になる。この塗布液を液晶配向膜として使用する場合は、液晶の均一な配 向性を得るという理由力 主鎖の枝分かれが少ない方が好ましぐ従ってアミノ基は 2 個以下が好ましい。  [0028] In the coating solution of {2}, at the time of producing the soluble imidized polymer of component (A), at least one of the formula [K1] and formula [K2] forces possessed by the amine compound (c) is also selected. The primary amino group reacts with tetracarboxylic dianhydride, so that the amine compound (c) is taken into the polyimide. One or more amino groups may be contained in the molecule, but 1 to 5 is suitable from the viewpoint of availability and stability of the compound, and 1 to 2 is particularly preferable. Since the amine compound (c) with one amino group is located at either the side chain or the terminal of the polymer molecule, it has less steric hindrance when it forms a hydrogen bond or salt with the polyamic acid. Most preferred for reasons. If the number of amino groups is 3 or more, the resulting soluble polyimide has a three-dimensional structure. When this coating solution is used as a liquid crystal alignment film, the reason for obtaining uniform orientation of the liquid crystal is preferred to have less branching of the main chain. Therefore, two or less amino groups are preferred.
このアミノ基は、ァミン化合物(a)と同様に、 R1— NHで表されるアミノ基であるこ This amino group, like the amine compound (a), is an amino group represented by R 1 —NH.
2  2
とが好ましい。 R1の定義はアミンィ匕合物(a)と同じである。 Are preferred. The definition of R 1 is the same as the amine compound (a).
[0029] 一方、アミンィ匕合物(c)に含まれる式 [K3]及び式 [K4]から選ばれるイミノ基は、そ の構成、作用及び好ましい形態に関して、前述したアミンィ匕合物(a)に含まれるィミノ 基と同じである。即ち— R2— NH—R3 で表されるイミノ基であることが好ましぐ R2[0029] On the other hand, the imino group selected from the formula [K3] and the formula [K4] contained in the amine compound (c) is the above-mentioned amine compound (a) with regard to its constitution, action and preferred form. It is the same as the imino group contained in. That - R 2 - NH-R 3 in the preferred instrument R 2 be an imino group represented,
R3の定義はアミンィ匕合物(a)と同じである。 The definition of R 3 is the same as in the amine compound (a).
より具体的には、本発明におけるアミンィ匕合物(a)としては、例えば下記式 (i)及び ( ii)で表されるァミン化合物を例示することができる。  More specifically, as the amine compound (a) in the present invention, for example, amine compounds represented by the following formulas (i) and (ii) can be exemplified.
[0030] [化 7] H2N— R1— X -CH2-N— X2 ( i ) [0030] [Chemical 7] H 2 N— R 1 — X -CH 2 -N— X 2 (i)
H  H
H2N— R1— X1— N-CH2-X2 ( ϋ ) H 2 N— R 1 — X 1 — N-CH 2 -X 2 (ϋ)
H ただし、式中の R1は、 CH―、 一 CH (CH )―、もしくは一 CH (CH CH )—の H where R 1 is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
2 3 2 3 アルキレン、又は脂肪族環を表し、 X1は、単結合又は 2価の有機基を表し、 2価の有 機基の具体例としては、アルキレン、脂肪族環、芳香族環、複素環及びこれらの組み 合わせ力 なる有機基などが挙げられ、かつ、不飽和結合、エーテル結合(一 O—) 、ケトン結合(一 CO )、エステル結合(一 COO )、チォエーテル結合(一 S—)、ァ ミノ結合(一 NH )、アミド結合(一 CONH )、シリル結合(一 Si— )、シロキサン結 合( SiO )などを含んで 、てもよ 、。 2 3 2 3 represents an alkylene or an aliphatic ring, X 1 represents a single bond or a divalent organic group, and specific examples of the divalent organic group include an alkylene, an aliphatic ring, an aromatic ring, Heterocycles and organic groups that combine these, and unsaturated bonds, ether bonds (one O—), ketone bonds (one CO), ester bonds (one COO), thioether bonds (one S— ), Amino bonds (one NH), amide bonds (one CONH), silyl bonds (one Si—), siloxane bonds (SiO 2), and the like.
[0031] X2は 1価の有機基で、具体例としては、アルキル基、アルコキシ基、環状脂肪族基 、芳香族基、複素環基及びこれらの組み合わせ力 なる有機基などが挙げられ、 つ、不飽和結合、エーテル結合(一 O )、ケトン結合(一 CO )、エステル結合(一 COO )、チォエーテル結合(一 S )、ァミノ結合(一 NH )、アミド結合(一 CON H )、シリル結合(一 Si—)、シロキサン結合(一 SiO )などを含んでいてもよい。 [0031] X 2 is a monovalent organic group, and specific examples thereof include an alkyl group, an alkoxy group, a cycloaliphatic group, an aromatic group, a heterocyclic group, and an organic group having a combination force thereof. , Unsaturated bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), thioether bond (one S), amino bond (one NH), amide bond (one CON H), silyl bond (One Si—), a siloxane bond (one SiO 2), and the like may be included.
[0032] さらに、 X2が— R1—、― X1—、 -CH―、及び— NH から選ばれるいずれかと複 [0032] In addition, X 2 is - R 1 -, - X 1 -, -CH-, and - double and one selected from NH
2  2
素環状構造を形成して 、てもよ 、。  Form an elemental ring structure.
以上の例示において、脂肪族環又は環状脂肪族基としては、シクロプロパン、シク ロブタン、シクロペンタン、シクロへキサン、シクロヘプタン、シクロオクタン、シクロデカ ン、シクロドデカン、ァダマンタン、デカヒドロナフタレン、ノロボルナンなどの環構造が 挙げられる。芳香族環又は芳香族基としてはベンゼン、ナフタレンなどの環構造が挙 げられる。複素環又は複素環基としては、ピロール、フラン、チォフェン、イミダゾール 、ォキサゾール、チアゾール、ピラゾール、ピロリン、ピロリジン、ピリジン、ピリミジンな どの環構造が挙げられる。また、アルキル基、アルコキシ基、アルキレンとしては、炭 素数 1〜20のアルキル基、アルコキシ基、アルキレンが挙げられる。  In the above examples, examples of the aliphatic ring or cycloaliphatic group include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, decahydronaphthalene, and norobornane. A ring structure. Examples of the aromatic ring or aromatic group include ring structures such as benzene and naphthalene. Examples of the heterocyclic ring or heterocyclic group include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine. Examples of the alkyl group, alkoxy group, and alkylene include an alkyl group having 1 to 20 carbon atoms, an alkoxy group, and alkylene.
[0033] また、 X1及び X2は、置換基を有して!/、てもよ 、。置換基の具体例としては、アルキ ル基、アルコキシ基、水酸基、カルボキシル基、などが挙げられる。 [0033] X 1 and X 2 may have a substituent! /. Specific examples of the substituent include alkyl Group, alkoxy group, hydroxyl group, carboxyl group, and the like.
本発明におけるァミン化合物 (b)としては、例えば下記式 (m)から (V)で表されるァ ミンィ匕合物を例示することができる。  As the amine compound (b) in the present invention, for example, amine compounds represented by the following formulas (m) to (V) can be exemplified.
[0034] [化 8]  [0034] [Chemical 8]
H2N— R1— X3-R1— NH2 ( iii )H 2 N— R 1 — X 3 -R 1 — NH 2 (iii)
H2N— R^X4— NH— X5— R1— NH2 ( iv ) H 2 N— R ^ X 4 — NH— X 5 — R 1 — NH 2 (iv)
H2N— R1— X6- NH— X7— NH— X8 - R1― NH2 ( v ) H 2 N— R 1 — X 6 -NH— X 7 — NH— X 8 -R 1 — NH 2 (v)
ただし、式中の R1は、 CH―、 一 CH (CH )―、もしくは一 CH (CH CH )—の However, R 1 in the formula is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
2 3 2 3 アルキレン、又は脂肪族環を表し、 H N— R1—と— R1— NHの R1は同一でも異なつ 2 3 2 3 represents an alkylene or an aliphatic ring, and H 1 — R 1 — and — R 1 — NH have the same or different R 1
2 2  twenty two
ていてもよい。  It may be.
[0035] X3、 X4、 X5、 X6、 X7及び X8は、単結合又は 2価の有機基を表し、 2価の有機基の具 体例としては、アルキレン、脂肪族環、芳香族環、複素環及びこれらの組み合わせか らなる有機基などが挙げられ、かつ、不飽和結合、エーテル結合(一 o—)、ケトン結 合(一 CO )、エステル結合(一 COO )、チォエーテル結合(一 S—)、ァミノ結合( NH )、アミド結合(一 CONH )、シリル結合(一 Si—)、シロキサン結合(一 SiO 一)などを含んでいてもよい。 [0035] X 3 , X 4 , X 5 , X 6 , X 7 and X 8 represent a single bond or a divalent organic group, and specific examples of the divalent organic group include alkylene, an aliphatic ring, Organic groups consisting of aromatic rings, heterocycles, and combinations of these include unsaturated bonds, ether bonds (one o-), ketone bonds (one CO), ester bonds (one COO), thioethers. A bond (one S—), an amino bond (NH), an amide bond (one CONH), a silyl bond (one Si—), a siloxane bond (one SiO—), and the like may be included.
[0036] 以上の例示にぉ 、て、脂肪族環又は環状脂肪族基としては、シクロプロパン、シク ロブタン、シクロペンタン、シクロへキサン、シクロヘプタン、シクロオクタン、シクロデカ ン、シクロドデカン、ァダマンタン、デカヒドロナフタレン、ノロボルナンなどの環構造が 挙げられる。芳香族環又は芳香族基としてはベンゼン、ナフタレンなどの環構造が挙 げられる。複素環又は複素環基としては、ピロール、フラン、チォフェン、イミダゾール 、ォキサゾール、チアゾール、ピラゾール、ピロリン、ピロリジン、ピリジン、ピリミジンな どの環構造が挙げられる。また、アルキレンとしては、炭素数 1〜20のアルキレンが 挙げられる。 In the above examples, as the aliphatic ring or cycloaliphatic group, cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, deca And ring structures such as hydronaphthalene and norobornane. Examples of the aromatic ring or aromatic group include ring structures such as benzene and naphthalene. Examples of the heterocyclic ring or heterocyclic group include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine. Examples of the alkylene include alkylene having 1 to 20 carbon atoms.
また、 X3、 X4、 X5、 X6、 X7及び X8は、置換基を有していてもよい。置換基の具体例 としては、アルキル基、アルコキシ基、水酸基、カルボキシル基、などが挙げられる。 本発明におけるァミン化合物(c)としては、例えば下記式 (i)、(ii)、(iv)及び (V)で表 されるアミンィ匕合物を例示することができる。 X 3 , X 4 , X 5 , X 6 , X 7 and X 8 may have a substituent. Specific examples of the substituent include an alkyl group, an alkoxy group, a hydroxyl group, and a carboxyl group. Examples of the amine compound (c) in the present invention include amine compounds represented by the following formulas (i), (ii), (iv) and (V).
[0037] [化 9]  [0037] [Chemical 9]
H2N— R1 ~ X1- CH2— N ~ X2 ( i ) H 2 N— R 1 to X 1 -CH 2 — N to X 2 (i)
H  H
H2N— R1— X1— N-CH2-X2 ( ϋ ) H 2 N— R 1 — X 1 — N-CH 2 -X 2 (ϋ)
H  H
[0038] [化 10]  [0038] [Chemical 10]
H2N— R^-X4— NH— X5— R1— NH2 ( iv ) H2N— R1— X6 - NH— X7— NH— X8- R1— NH2 ( v ) ただし、式中の R1は、 CH―、 一 CH (CH )―、もしくは一 CH (CH CH )—の H 2 N— R ^ -X 4 — NH— X 5 — R 1 — NH 2 (iv) H 2 N— R 1 — X 6 -NH— X 7 — NH— X 8 -R 1 — NH 2 (v ) However, R 1 in the formula is CH—, 1 CH (CH 2) —, or 1 CH (CH 2 CH 2) —
2 3 2 3 アルキレン、又は脂肪族環を表し、 H N— R1—と— R1— NHの R1は同一でも異なつ 2 3 2 3 represents an alkylene or an aliphatic ring, and H 1 — R 1 — and — R 1 — NH have the same or different R 1
2 2  twenty two
ていてもよい。  It may be.
[0039] X1、 X4、 X5、 X6、 X7及び X8は、単結合又は 2価の有機基を表し、 2価の有機基の具 体例としては、アルキレン、脂肪族環、芳香族環、複素環及びこれらの組み合わせか らなる有機基などが挙げられ、かつ、不飽和結合、エーテル結合(一 o—)、ケトン結 合(一 CO )、エステル結合(一 COO )、チォエーテル結合(一 S—)、ァミノ結合( NH )、アミド結合(一 CONH )、シリル結合(一 Si—)、シロキサン結合(一 SiO 一)などを含んでいてもよい。 [0039] X 1 , X 4 , X 5 , X 6 , X 7 and X 8 represent a single bond or a divalent organic group, and specific examples of the divalent organic group include alkylene, an aliphatic ring, Organic groups consisting of aromatic rings, heterocycles, and combinations of these include unsaturated bonds, ether bonds (one o-), ketone bonds (one CO), ester bonds (one COO), thioethers. A bond (one S—), an amino bond (NH), an amide bond (one CONH), a silyl bond (one Si—), a siloxane bond (one SiO—), and the like may be included.
X2は 1価の有機基で、具体例としては、アルキル基、アルコキシ基、環状脂肪族基 、芳香族基、複素環基及びこれらの組み合わせ力 なる有機基などが挙げられ、 つ、不飽和結合、エーテル結合(一 O )、ケトン結合(一 CO )、エステル結合(一 COO )、チォエーテル結合(一 S )、ァミノ結合(一 NH )、アミド結合(一 CON H )、シリル結合( Si )、シロキサン結合( SiO )などを含んで 、てもよ 、。 X 2 is a monovalent organic group, and specific examples thereof include an alkyl group, an alkoxy group, a cycloaliphatic group, an aromatic group, a heterocyclic group, and an organic group having a combination force thereof. Bond, ether bond (one O), ketone bond (one CO), ester bond (one COO), thioether bond (one S), amino bond (one NH), amide bond (one CON H), silyl bond (Si) , Including siloxane bonds (SiO 2), etc.
[0040] また、式(i)、(ii)の X2が— R1—、― X1—、 -CH―、及び— NH のいずれ力と複 [0040] In addition, the formula (i), the X 2 of (ii) - R 1 -, - X 1 -, -CH-, and - any force NH and double
2  2
素環状構造を形成して 、てもよ 、。 以上の例示において、脂肪族環又は環状脂肪族基としては、シクロプロパン、シク ロブタン、シクロペンタン、シクロへキサン、シクロヘプタン、シクロオクタン、シクロデカ ン、シクロドデカン、ァダマンタン、デカヒドロナフタレン、ノロボルナンなどの環構造が 挙げられる。芳香族環又は芳香族基としてはベンゼン、ナフタレンなどの環構造が挙 げられる。複素環又は複素環基としては、ピロール、フラン、チォフェン、イミダゾール 、ォキサゾール、チアゾール、ピラゾール、ピロリン、ピロリジン、ピリジン、ピリミジンな どの環構造が挙げられる。また、アルキル基、アルコキシ基、アルキレンとしては、炭 素数 1〜20のアルキル基、アルコキシ基、アルキレンが挙げられる。 Form an elemental ring structure. In the above examples, examples of the aliphatic ring or cycloaliphatic group include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclodecane, cyclododecane, adamantane, decahydronaphthalene, and norobornane. A ring structure. Examples of the aromatic ring or aromatic group include ring structures such as benzene and naphthalene. Examples of the heterocyclic ring or heterocyclic group include ring structures such as pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyrazole, pyrroline, pyrrolidine, pyridine, and pyrimidine. Examples of the alkyl group, alkoxy group, and alkylene include an alkyl group having 1 to 20 carbon atoms, an alkoxy group, and alkylene.
[0041] また、 X1、 X4、 X5、 X6、 X7及び X8は、置換基を有して!/、てもよ ヽ。置換基の具体例 としては、アルキル基、アルコキシ基、水酸基、カルボキシル基、などが挙げられる。 ァミン化合物(a)、ァミン化合物 (b)又はアミン化合物(c)は、膜中にあってもポリイミ ドの物性を低下させないという観点から、化合物の分子量として 1000以下であること が好ましぐより好ましくは 500以下であり、特に好ましくは 300以下である。 [0041] X 1 , X 4 , X 5 , X 6 , X 7 and X 8 may have a substituent! /. Specific examples of the substituent include an alkyl group, an alkoxy group, a hydroxyl group, and a carboxyl group. From the viewpoint that the amine compound (a), the amine compound (b) or the amine compound (c) does not deteriorate the physical properties of the polyimide even in the film, the molecular weight of the compound is preferably 1000 or less. Preferably it is 500 or less, Especially preferably, it is 300 or less.
アミンィ匕合物(a)又はアミンィ匕合物 (b)の具体例としては以下のものを挙げることが できるが、これらに限定されるものではない。また、アミンィ匕合物は 2種類以上を併用 しても構わない。  Specific examples of the amine compound (a) or the amine compound (b) include the following, but are not limited thereto. Two or more amine compounds may be used in combination.
[0042] [表 1] [0042] [Table 1]
Figure imgf000017_0001
2]
Figure imgf000018_0001
3]
Figure imgf000019_0001
4]
Figure imgf000017_0001
2]
Figure imgf000018_0001
3]
Figure imgf000019_0001
Four]
Figure imgf000020_0001
5]
Figure imgf000021_0001
Figure imgf000020_0001
Five]
Figure imgf000021_0001
[0047] ァミン化合物(c)の具体例としては上記の No.l〜No.50、 No.71~No.76, No.93〜N ο.102、 Νο.106〜Νο.108を挙げることができる力 これらに限定されるものではない。 また、アミンィ匕合物は 2種類以上を併用してもよい。 [0047] Specific examples of the amine compound (c) include No. 1 to No. 50, No. 71 to No. 76, No. 93 to N ο.102, and Νο.106 to Νο.108. It is not limited to these. Two or more amine compounds may be used in combination.
本発明の上記 { 1 }及び { 2 }の塗布液における、溶媒可溶性ポリイミド及び溶媒に可 溶なイミドィ匕重合体とは、繰り返し単位中にイミド結合を有する重合体であり、かつ、 有機溶媒に対して溶解し得るものを指す。  In the coating liquids {1} and {2} of the present invention, the solvent-soluble polyimide and the imidyl polymer soluble in the solvent are polymers having an imide bond in the repeating unit, and an organic solvent. It refers to what can be dissolved.
[0048] また、繰り返し単位に含まれるイミド基の一部が開環し、アミド酸基又はアミド酸エス テル基になっているものも本発明で使用する溶媒可溶性ポリイミド及び溶媒に可溶な イミド化重合体の範疇に含まれる。これらのイミド結合を有する重合体に含まれるイミ ド基の比率は、下記式のようにイミド化率として表すことができる。 [0048] A solvent-soluble polyimide used in the present invention and a solvent-soluble imide include those in which a part of the imide group contained in the repeating unit is ring-opened to form an amic acid group or an amic acid ester group. Included in the category of chemical polymers. Imi contained in polymers having these imide bonds The ratio of dodo groups can be expressed as an imidization rate as shown in the following formula.
イミドィ匕率 =イミド基数 ÷ (イミド基数 +アミド酸基数 +アミド酸エステル基数) これらのイミド化率は、該ポリイミドを d—DMSO (ジメチルスルホキシドー d )に溶  Imide ratio = number of imide groups ÷ (number of imide groups + number of amide acid groups + number of amide acid ester groups) These imidation rates are determined by dissolving the polyimide in d-DMSO (dimethylsulfoxide d).
6 6 解させて1 H— NMRを測定し、イミド基が開環しても変化しない構造に由来するプロト ンピークの積算値を基準として、前記のアミド酸基及びアミド酸エステル基に由来す る NH のプロトンピークの積算値を比較することで確認することができる。 6 6 Dissolved and measured by 1 H-NMR, derived from the above-mentioned amic acid group and amic acid ester group based on the integrated value of the proton peak derived from the structure that does not change even when the imide group is opened. This can be confirmed by comparing the integrated values of NH proton peaks.
[0049] 本発明の塗布液に使用される溶媒可溶性ポリイミド及び溶媒に可溶なイミド化重合 体のイミド化率は特に限定されない。通常は、イミド化率が高くなるほど、溶媒に対す るポリイミドの溶解性が低下するので、その結果、必要な濃度で溶解させることができ ない場合はイミドィ匕率を適度に下げればよい。また、事前にイミド化されているポリマ 一を使用するという目的を考えるとイミド化率は 10%以上が好ましい。また、液晶配 向剤として使用する場合は、良好な液晶の配向性又は良好な電気特性が得られると いう理由力 イミドィ匕率は 40%以上が好ましぐより好ましくは 60%以上であり、特に 好ましくは 80%以上である。  [0049] The imidation ratio of the solvent-soluble polyimide used in the coating solution of the present invention and the imidized polymer soluble in the solvent is not particularly limited. Usually, the higher the imidization rate, the lower the solubility of the polyimide in the solvent. As a result, if the solution cannot be dissolved at the required concentration, the imidization rate may be lowered appropriately. In view of the purpose of using a polymer that has been imidized in advance, the imidization rate is preferably 10% or more. In addition, when used as a liquid crystal aligning agent, the reason for obtaining good liquid crystal alignment or good electrical properties. The imidity ratio is preferably 40% or more, more preferably 60% or more. Particularly preferably, it is 80% or more.
[0050] 溶媒可溶性ポリイミド及び溶媒に可溶なイミドィ匕重合体の分子量は特に制限されな いが、取り扱いのしゃすさと、膜形成した際の特性の安定性の観点から重量平均分 子量で 2, 000〜200, 000力 子ましく、より好ましくは 4, 000〜50, 000である。分 子量は、 GPC (ゲルパーミエッシヨンクロマトグラフィ)により求めたものである。  [0050] The molecular weight of the solvent-soluble polyimide and the solvent-soluble imidopolymer is not particularly limited, but it is 2 in terms of weight average molecular weight from the viewpoints of handling and stability of characteristics when a film is formed. 000 to 200,000 force, more preferably 4,000 to 50,000. The molecular weight is determined by GPC (gel permeation chromatography).
本発明の { 1 }の塗布液に使用される溶媒可溶性ポリイミドの構造は特に限定されな いが、テトラカルボン酸二無水物とジァミンとを原料とすることで比較的簡便に得られ ると 、う理由から、下記式 (I)で示される繰り返し単位を有するポリイミドが好まし 、。  The structure of the solvent-soluble polyimide used in the coating solution of {1} of the present invention is not particularly limited, but can be obtained relatively easily by using tetracarboxylic dianhydride and diamine as raw materials. For this reason, a polyimide having a repeating unit represented by the following formula (I) is preferred.
[0051] また、本発明の {2}の塗布液に使用される溶媒に可溶なイミド化重合体は、テトラ力 ルボン酸二無水物とアミンィ匕合物(c)を含むジァミンとを反応させたポリイミド前駆体 をイミドィ匕して得られるものである力 ジァミンを主要原料として得られるものであり、 { 1 }と同様に下記式 (I)で示される繰り返し単位を有するポリイミドを基本構造として有 するものである。  [0051] Also, the imidized polymer soluble in the solvent used in the coating solution of {2} of the present invention is a reaction between tetraforce rubonic acid dianhydride and diamine containing an amine compound (c). The force obtained by imidizing the polyimide precursor obtained is obtained using diamine as a main raw material, and the polyimide having a repeating unit represented by the following formula (I) is used as a basic structure in the same manner as {1}. Yes.
[0052] さらに、本発明の { 1 }の塗布液に使用される溶媒に可溶なイミド化重合体は、下記 式 (I)で示される繰り返し単位を有するポリイミドの一部に、特定のアミンィ匕合物(a)及 びァミン化合物 (b)力も選ばれるアミンィ匕合物の— R1— NHで表されるァミノ基が、 [0052] Further, the imidized polymer soluble in the solvent used in the coating solution of {1} of the present invention is a specific amine polymer in a part of the polyimide having a repeating unit represented by the following formula (I). Compound (a) and The amine group represented by —R 1 —NH of the amine compound in which the biamine compound (b) force is also selected,
2  2
ポリイミド中のイミドカルボニル基に対してイミド基の開環を伴う反応で結合した構造を 有するか、又はポリイミドのイミドィ匕率が 100%未満の場合は、そのアミド酸基のカル ボキシル基又はアミド酸エステル基のカルボキシエステル基に対して結合した構造を 有するものである。  If the polyimide has a structure bonded to the imide carbonyl group by a reaction involving ring opening of the imide group, or the polyimide has an imido ratio of less than 100%, the carboxyl group or amide acid of the amide acid group It has a structure in which the ester group is bonded to the carboxyester group.
[0053] また、 {2}の塗布液に使用される溶媒に可溶なイミドィ匕重合体は、下記式 (I)で示さ れる繰り返し単位を有するポリイミドに、特定のァミン化合物(c)力 選ばれるアミンィ匕 合物の—R1— NHで表されるアミノ基力 テトラカルボン酸二無水物と反応してポリ [0053] Further, the imidyl polymer soluble in the solvent used in the coating solution of {2} is selected from a specific amine compound (c) force on a polyimide having a repeating unit represented by the following formula (I). Amino group represented by —R 1 — NH of the amine compound to be reacted with tetracarboxylic dianhydride
2  2
イミド中に分子末端として取り込まれる力、式 (I)で示される繰り返し単位を有するポリ イミドの一部にイミドカルボニル基に対してイミド基の開環を成した結合状態、又はァ ミド酸基のカルボキシル基又はアミド酸エステル基のカルボキシエステル基に対して 結合した構造を有するものである。  The force taken into the imide as a molecular end, a bonded state in which a part of the polyimide having the repeating unit represented by the formula (I) is ring-opened to the imide carbonyl group, or the amide acid group It has a structure bonded to a carboxyl group of a carboxyl group or an amic acid ester group.
[0054] [化 11]  [0054] [Chemical 11]
Figure imgf000023_0001
Figure imgf000023_0001
[0055] 上記式 (I)にお 、て、 Aは 4価の有機基を表し、 Bは 2価の有機基を表す。  [0055] In the above formula (I), A represents a tetravalent organic group, and B represents a divalent organic group.
上記式 (I)において、 Aの構造は特に限定されない。また、 Aの構造は 1種類であつ ても、複数種が混在してもよい。 Aの具体例を挙げるとすれば以下のとおりである。  In the above formula (I), the structure of A is not particularly limited. In addition, the structure of A may be one type, or multiple types may be mixed. Specific examples of A are as follows.
[0056] [表 6]
Figure imgf000024_0001
[0056] [Table 6]
Figure imgf000024_0001
Figure imgf000025_0001
Figure imgf000025_0001
[0058] これらのうち、 A- 6、 A-16、 A-18〜A-22、 A-25は、イミド化率が高いポリイミドであつ ても高 、溶解性が得られるので好ま 、。  [0058] Of these, A-6, A-16, A-18 to A-22, and A-25 are preferable because they have high solubility even with polyimide having a high imidization rate.
また、 Aの 10mol%以上力 Α-1〜Α-25のように脂環式構造又は脂肪族構造を有 する場合は、液晶配向膜としたときに液晶セルの電圧保持率が向上するので好まし い。  In addition, when it has an alicyclic structure or an aliphatic structure such as a force of -1 to -25, the voltage holding ratio of the liquid crystal cell is improved when it is used as a liquid crystal alignment film. Good.
前記式 (I)において、 Bの構造は特に限定されない。また、 Bの構造は 1種類であつ ても、複数種が混在してもよい。 Bの具体例を挙げるとすれば以下のとおりである。  In the formula (I), the structure of B is not particularly limited. In addition, the structure of B may be one type or a mixture of multiple types. Specific examples of B are as follows.
[0059] [表 8] [0059] [Table 8]
Figure imgf000026_0001
Figure imgf000026_0001
[Οΐ挲] [Ϊ900] [Οΐ 挲] [Ϊ900]
Figure imgf000027_0001
Figure imgf000027_0001
L0ZP90IL00Zdt/L3d 93 8 0難 00Z OAV
Figure imgf000028_0001
11]
Figure imgf000029_0001
12]
Figure imgf000030_0001
L0ZP90IL00Zdt / L3d 93 8 0 Difficult 00Z OAV
Figure imgf000028_0001
11]
Figure imgf000029_0001
12]
Figure imgf000030_0001
[0064] これらのうち、 Bの一部又は全部が B-80〜B-101などである場合は、液晶配向膜と したときに液晶のプレチルト角を高くすることができる。  [0064] Of these, when part or all of B is B-80 to B-101, the pretilt angle of the liquid crystal can be increased when the liquid crystal alignment film is formed.
上記式 (I)で示される繰り返し単位を有するポリイミドは、定法に従い、下記式 (II)の ように対応する Aの構造を有するテトラカルボン酸二無水物と、下記式 (III)のように 対応する Bの構造を有するジァミンとを反応させることでポリイミド前駆体とし、これを 脱水閉環させることで得ることができる。  The polyimide having the repeating unit represented by the above formula (I) corresponds to the tetracarboxylic dianhydride having the corresponding structure of A as represented by the following formula (II) and the following formula (III) according to a conventional method. It can be obtained by reacting with a diamine having the structure of B to obtain a polyimide precursor, which is dehydrated and cyclized.
[0065] [化 12]
Figure imgf000031_0001
[0065] [Chemical 12]
Figure imgf000031_0001
[0066] [化 13]
Figure imgf000031_0002
[0066] [Chemical 13]
Figure imgf000031_0002
[0067] また、 {2}の塗布液に使用する溶媒に可溶なイミドィ匕重合体を得る場合は、上記式  [0067] Also, in the case of obtaining an imidopolymer soluble in the solvent used in the coating solution of {2}, the above formula
(II)のテトラカルボン酸二無水物と、上記式 (III)のジァミンと、前記アミンィ匕合物( と を反応させることでポリイミド前駆体とし、これを脱水閉環させることで得ることができる 。アミンィ匕合物(c)の使用量は、少なすぎると塗布液の吸湿安定性の効果が十分に 発揮されないので、式(III)のジァミンとアミン化合物(c)を合わせた全量中で lmol% 以上が好ましぐより好ましくは 2mol%である。分子中に含まれる一級アミノ基が 1個 であるアミンィ匕合物 (c)は、得られる溶媒に可溶なイミドィ匕重合体の分子量が制限さ れるので 15mol%以下が好ましぐより好ましくは 10mol%以下であり、特に好ましくは 5mol%以下である。分子中に含まれる一級アミノ基が 2個以上であるアミンィ匕合物(c )は、式 (III)のジァミンの役割を果たすので、式 (III)のジァミン及びアミンィ匕合物(c) の全量をこれで置き換えてもよ 、。  It can be obtained by reacting the tetracarboxylic dianhydride of (II), the diamine of the above formula (III) and the amine compound () to form a polyimide precursor, which is dehydrated and cyclized. If the amount of the amine compound (c) used is too small, the effect of the moisture absorption stability of the coating solution will not be sufficiently exerted, so lmol% in the total amount of the diamine of formula (III) and the amine compound (c) More preferably, the amount is 2 mol% Amine compound (c) containing one primary amino group in the molecule limits the molecular weight of the imidyl polymer soluble in the resulting solvent. 15 mol% or less is preferable, more preferably 10 mol% or less, particularly preferably 5 mol% or less, and the amine compound (c) having 2 or more primary amino groups contained in the molecule is Since it plays the role of diamine of formula (III), di of formula (III) Be replaced by Min and Amini 匕合 was the total amount of (c) in this,.
ポリイミド前駆体を得る反応は、有機溶媒中において、通常— 20〜150°C、好まし くは 0〜100°C、より好ましくは 10〜80°Cで行われる。  The reaction for obtaining the polyimide precursor is usually carried out in an organic solvent at −20 to 150 ° C., preferably 0 to 100 ° C., more preferably 10 to 80 ° C.
[0068] この際、テトラカルボン酸二無水物と、ジァミンとの使用割合は、ジァミンに含まれる アミノ基 1当量に対して、テトラカルボン酸二無水物に含まれる酸無水物基が 0. 5〜 1. 5当量であることが好ましぐより好ましくは 0. 8〜1. 2当量である。なお、アミンィ匕 合物(c)を反応させる場合は、ジァミンに含まれるァミノ基とアミンィ匕合物に含まれる ァミノ基とを合わせたアミノ基に対する、テトラカルボン酸二無水物に含まれる酸無水 物基の割合とする。  [0068] At this time, the proportion of tetracarboxylic dianhydride and diamine used is such that the acid anhydride group contained in tetracarboxylic dianhydride is 0.5 to 1 equivalent of amino group contained in diamine. It is preferable that it is -1.5 equivalent, More preferably, it is 0.8-1.2 equivalent. In the case of reacting the amine compound (c), the acid anhydride contained in the tetracarboxylic dianhydride with respect to the amino group obtained by combining the amino group contained in the diamine and the amino group contained in the amine compound. It is the ratio of the physical group.
[0069] 上記反応に用いる有機溶媒としては、生成するポリイミド前駆体が溶解するもので あれは特に制限されない。例えば、 N, N—ジメチルホルムアミド、 N, N—ジメチルァ セトアミド、 N—メチルー 2—ピロリドン、 N—メチルカプロラタタム、ジメチルスルホキシ ド、テトラメチル尿素、ピリジン、ジメチルスルホン、へキサメチルスルホキシド、 γ—ブ チロラタトン等を挙げることができる。これらは単独でも、また混合して使用してもよい 。さらに、ポリアミック酸を溶解させない溶媒であっても、生成したポリアミック酸が析出 しない範囲で、上記溶媒に混合して使用してもよい。また、有機溶媒中の水分は重 合反応を阻害し、さらには生成したポリアミック酸を加水分解させる原因となるので、 有機溶媒はなるべく脱水乾燥させたものを用いることが好まし 、。 [0069] As the organic solvent used in the above reaction, a polyimide precursor to be generated is dissolved. That is not particularly limited. For example, N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolatatam, dimethyl sulfoxide, tetramethyl urea, pyridine, dimethyl sulfone, hexamethyl sulfoxide, γ —Butyloraton. These may be used alone or in combination. Furthermore, even a solvent that does not dissolve the polyamic acid may be used by mixing with the above solvent as long as the produced polyamic acid does not precipitate. In addition, since water in the organic solvent inhibits the polymerization reaction and further causes hydrolysis of the generated polyamic acid, it is preferable to use an organic solvent that has been dehydrated and dried as much as possible.
ポリイミド前駆体を脱水閉環させる方法としては、ポリイミド前駆体の溶液をそのまま 加熱する熱イミド化、ポリイミド前駆体の溶液に触媒を添加する化学イミドィ匕が一般的 であるが、比較的低温でイミド化反応が進行する化学イミド化の方が、得られるポリイ ミドの分子量低下が起こりにくく好ま 、。  Common methods for dehydrating and ring-closing polyimide precursors include thermal imidization by heating the polyimide precursor solution as it is, and chemical imidization by adding a catalyst to the polyimide precursor solution, but imidization at a relatively low temperature. Chemical imidization, in which the reaction proceeds, is preferred because the molecular weight of the resulting polyimide is less likely to decrease.
[0070] 化学イミドィ匕は、ポリイミド前駆体を有機溶媒中にぉ 、て、塩基性触媒と酸無水物 の存在下で攪拌することにより行うことができる。このときの反応温度は一 20〜250°C 、好ましくは 0〜180°Cである。反応温度が高い方力 Sイミドィ匕は早く進行する力 高す ぎるとポリイミドの分子量が低下する場合がある。塩基性触媒の量はアミド酸基の 0. 5〜30モル倍、好ましくは 2〜20モル倍であり、酸無水物の量はアミド酸基の 1〜50 モル倍、好ましくは 3〜30モル倍である。塩基性触媒や酸無水物の量が少ないと反 応が十分に進行せず、また多すぎると反応終了後に完全に除去することが困難とな る。用いる塩基性触媒としてはピリジン、トリェチルァミン、トリメチルァミン、トリブチル ァミン、トリオクチルァミン等を挙げることができ、中でもピリジンは反応を進行させるの に適度な塩基性を持つので好ましい。また、酸無水物としては無水酢酸、無水トリメリ ット酸、無水ピロメリット酸などを挙げることができ、中でも無水酢酸を用いると反応終 了後の精製が容易となるので好ましい。有機溶媒としては前述したポリアミック酸重合 反応時に用いる溶媒を使用することができる。化学イミドィ匕によるイミドィ匕率は、触媒 量と反応温度、反応時間を調節することにより制御することができる。  [0070] Chemical imidization can be performed by stirring a polyimide precursor in an organic solvent in the presence of a basic catalyst and an acid anhydride. The reaction temperature at this time is 20 to 250 ° C, preferably 0 to 180 ° C. Higher reaction temperature Force of S-imide is too high. If it is too high, the molecular weight of the polyimide may decrease. The amount of the basic catalyst is 0.5 to 30 mol times, preferably 2 to 20 mol times of the amic acid group, and the amount of the acid anhydride is 1 to 50 mol times, preferably 3 to 30 mol of the amido acid group. Is double. If the amount of the basic catalyst or acid anhydride is small, the reaction does not proceed sufficiently. If the amount is too large, it becomes difficult to completely remove the reaction after completion of the reaction. Examples of the basic catalyst to be used include pyridine, triethylamine, trimethylamine, tributylamine, trioctylamine and the like. Among them, pyridine is preferable because it has an appropriate basicity for proceeding with the reaction. Examples of the acid anhydride include acetic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like. Among them, use of acetic anhydride is preferable because purification after completion of the reaction is facilitated. As the organic solvent, the solvent used in the polyamic acid polymerization reaction described above can be used. The imidity ratio due to chemical imidization can be controlled by adjusting the amount of catalyst, reaction temperature, and reaction time.
[0071] このようにして得られたポリイミド溶液は、添加した触媒が溶液内に残存しているの で、このポリイミド溶液を、攪拌している貧溶媒に投入し、沈殿回収することが好まし い。ポリイミドの沈殿回収に用いる貧溶媒としては特に限定されないが、メタノール、 アセトン、へキサン、ブチルセルソルブ、ヘプタン、メチルェチルケトン、メチルイソブ チルケトン、エタノール、トルエン、ベンゼンなどが例示できる。貧溶媒に投入すること により沈殿したポリイミドは濾過 '洗浄して回収した後、常圧あるいは減圧下で、常温 あるいは加熱乾燥してパウダーとすることが出来る。 [0071] Since the added catalyst remains in the solution of the polyimide solution obtained in this way, it is preferable to throw this polyimide solution into a stirring poor solvent and recover the precipitate. Yes. Although it does not specifically limit as a poor solvent used for the precipitation collection | recovery of a polyimide, Methanol, acetone, hexane, a butyl cellosolve, a heptane, a methyl ethyl ketone, a methyl isobutyl ketone, ethanol, toluene, benzene etc. can be illustrated. The polyimide precipitated by adding it to a poor solvent can be recovered by filtration and washing, and then dried at normal temperature or under reduced pressure at room temperature or by heating.
{ 1 }の塗布液にぉ 、て、溶媒可溶性ポリイミドと前記アミンィ匕合物(a)又はアミンィ匕 合物 (b)との反応は以下のようにして行うことができる。  The reaction between the solvent-soluble polyimide and the amine compound (a) or the amine compound (b) can be performed as follows in the coating solution of {1}.
まず、溶媒可溶性ポリイミドを有機溶媒に溶解させ、溶液とする。この時、ポリイミド が溶解しにく ヽときは加熱しても構わな ヽ。加熱する温度が高すぎるとポリイミドの分 子量が低下する場合があるので、 30〜100°Cが好ましい。  First, solvent-soluble polyimide is dissolved in an organic solvent to obtain a solution. At this time, if the polyimide is difficult to dissolve, it may be heated. If the heating temperature is too high, the molecular weight of the polyimide may decrease, so 30-100 ° C is preferred.
[0072] ポリイミド溶液の濃度は、ポリイミドとァミン化合物が効率的でかつ均一に反応させる ことができるという理由から、 1〜20質量%が好ましぐより好ましくは 3〜15質量%で あり、特に好ましくは 3〜10質量%である。また、アミンィ匕合物が— R1— NHで表さ [0072] The concentration of the polyimide solution is preferably 1 to 20% by mass, more preferably 3 to 15% by mass, because the polyimide and the amine compound can be reacted efficiently and uniformly. Preferably it is 3-10 mass%. Also, the amine compound is represented by —R 1 —NH.
2 れるァミノ基を 2個以上有している場合は、ポリイミド濃度が高すぎると、ポリイミド同士 がアミンィ匕合物によって三次元構造を形成し溶解性が低下することがあるので、この 場合は 5質量%以下とすることが好ま 、。  2 If there are two or more amino groups, if the polyimide concentration is too high, the polyimides may form a three-dimensional structure with the amine compound and the solubility may be reduced. It is preferable to be less than mass%.
[0073] 溶媒は、上記の濃度範囲内で樹脂が完全に溶解するものであれは特に限定されな い。具体例としては、 N, N ジメチルホルムアミド、 N, N ジメチルァセトアミド、 N ーメチルー 2—ピロリドン、 N—メチルカプロラタタム、 2—ピロリドン、 N ェチルピロリ ドン、 N ビニルピロリドン、ジメチルスルホキシド、テトラメチル尿素、ピリジン、ジメチ ルスルホン、へキサメチルスルホキシド、 y ブチロラタトン、 1, 3 ジメチルーイミダ ゾリジノンなどが挙げられる。これらの溶媒は 2種類以上を混合して用いてもよい。し 力しながら、 y—プチ口ラタトンなどのラタトン系溶媒は脂肪族ァミノ基と反応しやすく 、ァミン化合物を消費してしまう場合があるので、 N, N ジメチルホルムアミドゃ N— メチル 2—ピロリドン等の溶媒を使用することが好ましい。 y—プチ口ラタトンなどの ラタトン系溶媒を主溶媒として用いたい場合は、一度ラタトン系以外の溶媒を用いて ァミン化合物とポリイミドを反応させた後、この溶液を適当な貧溶媒に投入し、回収し た後に、それをラタトン系溶媒へ再度溶解させるとよい。この時の貧溶媒としては、メ タノール、アセトン、へキサン、ブチルセルソルブ、ヘプタン、メチルェチルケトン、メ チルイソブチルケトン、エタノール、トルエン、ベンゼンなどが例示できる。貧溶媒に 投入することにより沈殿したポリイミドは濾過 ·洗浄して回収した後、常圧あるいは減 圧下で、常温あるいは加熱乾燥してパウダーとすることが出来る。 [0073] The solvent is not particularly limited as long as the resin is completely dissolved within the above concentration range. Specific examples include N, N dimethylformamide, N, N dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolatatam, 2-pyrrolidone, N-ethylpyrrolidone, N vinylpyrrolidone, dimethyl sulfoxide, tetramethylurea. , Pyridine, dimethylsulfone, hexamethylsulfoxide, y-butyrolatatone, 1,3 dimethylimidazolidinone. Two or more of these solvents may be used in combination. However, since Lataton solvents such as y-petit-mouthed rataton react easily with aliphatic amino groups and may consume amine compounds, N, N dimethylformamide is N-methyl 2-pyrrolidone, etc. It is preferable to use the solvent. If you want to use a rataton solvent such as y-petit-mouth rataton as the main solvent, first react the amine compound with the polyimide using a solvent other than the rataton solvent, and then put this solution into an appropriate poor solvent for recovery. Then, it may be dissolved again in the rataton solvent. As a poor solvent at this time, Examples include butanol, acetone, hexane, butyl cellosolve, heptane, methyl ethyl ketone, methyl isobutyl ketone, ethanol, toluene, and benzene. The polyimide precipitated by pouring into a poor solvent can be recovered by filtration, washing, and drying at normal temperature or reduced pressure at room temperature or by heating.
[0074] 次に、上記のポリイミド溶液にアミン化合物(a)及びアミン化合物 (b)から選ばれる ァミン化合物を添加し、室温又は加熱条件下で攪拌する。  Next, an amine compound selected from the amine compound (a) and the amine compound (b) is added to the polyimide solution, and the mixture is stirred at room temperature or under heating conditions.
アミンィ匕合物の添加量は、少なすぎると塗布液の吸湿安定性の効果が十分に発揮 されず、多すぎる場合は、例えば液晶配向膜においては液晶の配向性が低下する など、塗膜の特性が低下するという理由から、溶媒可溶性ポリイミド 100質量部に対し て 1〜15質量部が好ましぐより好ましくは 2〜10質量部であり、特に好ましくは 2〜5 質量部である。アミンィ匕合物は、溶媒可溶性ポリイミドの溶液に直接添加しても構わ ないが、適当な溶媒で濃度 0. 1〜10質量%の溶液にしてから添加することが好まし い。この溶媒としては、前記した溶媒可溶性ポリイミドの溶媒が挙げられる。この場合 も、 Ί プチ口ラタトンなどのラタトン系溶媒は脂肪族ァミノ基と反応しやすぐァミン 化合物を消費してしまう場合があるので、 Ν, Ν ジメチルホルムアミドゃ Ν メチル -2-ピロリドン等の溶媒を使用することが好ま 、。 If the amount of the amine compound added is too small, the effect of the moisture absorption stability of the coating solution will not be sufficiently exerted, and if it is too large, for example, in the liquid crystal alignment film, the orientation of the liquid crystal will be reduced. 1 to 15 parts by mass is more preferable, and 2 to 5 parts by mass is particularly preferable, with respect to 100 parts by mass of the solvent-soluble polyimide, because the characteristics are deteriorated. The amine compound may be added directly to the solvent-soluble polyimide solution, but it is preferable to add the aminey compound after making a solution with a concentration of 0.1 to 10% by mass with an appropriate solvent. Examples of the solvent include the solvent of the solvent-soluble polyimide described above. In this case as well, latonic solvents such as petit latatotone may react with the aliphatic amino group and consume the aminic compound immediately. Therefore, solvents such as Ν, ジ メ チ ル dimethylformamide 等 methyl-2-pyrrolidone, etc. Preferred to use.
[0075] ポリイミドとァミンィ匕合物が効率的に反応し、かつ副反応が起きにくいという理由から 、反応させる際の温度は 25〜150°Cが好ましぐより好ましくは 30〜100°Cであり、特 に好ましくは 40〜80°Cである。温度が高すぎる場合、可溶性ポリイミドが加水分解さ れる可能性がある。  [0075] The temperature during the reaction is preferably 25 to 150 ° C, more preferably 30 to 100 ° C, because the polyimide and the amine compound react efficiently and side reactions do not easily occur. It is particularly preferably 40 to 80 ° C. If the temperature is too high, the soluble polyimide may be hydrolyzed.
反応させる時間は、溶媒可溶性ポリイミドとァミンィ匕合物との反応性や反応させる温 度によっても異なる力 標準的な例を挙げるならば、 40〜80°Cで 6〜48時間である 本発明の塗布液に使用されるポリアミック酸の構造は特に限定されないが、テトラ力 ルボン酸二無水物とジァミンとを原料とすることで比較的簡便に得られるという理由か ら、下記式 (IV)で示される繰り返し単位を有するポリアミック酸が好ま 、。  The reaction time varies depending on the reactivity between the solvent-soluble polyimide and the amine compound and the temperature at which the reaction is carried out. To give a standard example, it is 6 to 48 hours at 40 to 80 ° C. The structure of the polyamic acid used in the coating solution is not particularly limited, but is represented by the following formula (IV) because it can be obtained relatively easily by using tetraforce rubonic acid dianhydride and diamine as raw materials. Preferable is a polyamic acid having a repeating unit.
[0076] [化 14]
Figure imgf000035_0001
[0076] [Chemical 14]
Figure imgf000035_0001
[0077] 上記式 (IV) A'は 4価の有機基を表し、 B'は 2価の有機基を表す。 [0077] In the above formula (IV), A 'represents a tetravalent organic group, and B' represents a divalent organic group.
上記式 (IV)で示される繰り返し単位を有するポリアミック酸は、前述した溶媒可溶 性ポリイミドを得るためのポリイミド前駆体の合成方法で示したのと同様に、 A'の構造 を有するテトラカルボン酸二無水物と、 B'の構造を有するジァミンとを、有機溶媒中 で反応させることで得ることができる。  The polyamic acid having a repeating unit represented by the above formula (IV) is a tetracarboxylic acid having the structure of A ′, as shown in the method for synthesizing a polyimide precursor for obtaining the solvent-soluble polyimide described above. It can be obtained by reacting a dianhydride and a diamine having the structure of B ′ in an organic solvent.
[0078] ポリアミック酸の分子量は特に制限されないが、取り扱いのしゃすさと、膜形成した 際の特性の安定性の観点から重量平均分子量で 2, 000-200, 000が好ましぐよ り好ましくは 5, 000〜100, 000である。分子量は、 GPC (ゲルパーミエッシヨンクロ マトグラフィ)により求めたものである。  [0078] The molecular weight of the polyamic acid is not particularly limited, but a weight average molecular weight of 2,000 to 200,000 is more preferable and 5 is more preferable from the viewpoints of handling and stability of characteristics when a film is formed. , 00000 to 100,000. The molecular weight was determined by GPC (gel permeation chromatography).
上記式 (IV)において、 A'の構造は特に限定されない。また、 A'の構造は 1種類で あっても、また異なった A'の構造を有し、繰り返し単位として異なった複数種が混在 してもよい。 A'の具体例を挙げるとすれば、前記 Aで例示した構造が挙げられる。 前記式 (IV)において、 B'の構造は特に限定されない。また、 B'の構造は 1種類で あっても、また異なった B'の構造を有し、繰り返し単位とし異なった複数種が混在し てもよい。 B'の具体例を挙げるとすれば、前記 Bで例示した構造が挙げられる。  In the above formula (IV), the structure of A ′ is not particularly limited. Further, the structure of A ′ may be one type, or may have different A ′ structures and a plurality of different types of repeating units may be mixed. As a specific example of A ′, the structure exemplified in the above A can be mentioned. In the formula (IV), the structure of B ′ is not particularly limited. Further, the structure of B ′ may be one type, or may have a different B ′ structure, and a plurality of different types may be mixed as a repeating unit. If the specific example of B 'is given, the structure illustrated by said B will be mentioned.
[0079] 本発明の塗布液を得るには、溶媒可溶性ポリイミドと、アミンィ匕合物(a)及び (b)か ら選ばれるアミンィ匕合物とを反応させた生成物の溶媒に可溶なイミドィ匕重合体 (以下 、特定生成物と称することもある)の溶液と、ポリアミック酸の溶液を任意の比率で混 合すればよい。また、テトラカルボン酸二無水物とアミンィ匕合物(c)を含むジァミンとを 反応させたポリイミド前駆体をイミドィ匕して得られた溶媒に可溶なイミドィ匕重合体 (以 下、特定ポリイミドと称することもある)の溶液と、ポリアミック酸の溶液を任意の比率で 混合してちょい。 [0080] 特定生成物の溶液は、特定生成物の反応溶液そのまま使用しても、反応溶液を適 当な貧溶媒に投入し、特定生成物を回収した後、再度溶媒に溶解させて使用しても よい。この時の貧溶媒としては水、メタノール、アセトン、へキサン、ブチルセルソルブ 、ヘプタン、メチルェチルケトン、メチルイソブチルケトン、エタノール、トルエン、ベン ゼンなどが例示できる。再溶解の溶媒としては、 N, N ジメチルホルムアミド、 N, N ージメチルァセトアミド、 N—メチルー 2—ピロリドン、 N—メチルカプロラタタム、 2—ピ 口リドン、 N ェチルピロリドン、 N ビュルピロリドン、ジメチルスルホキシド、テトラメ チル尿素、ピリジン、ジメチルスルホン、へキサメチルスルホキシド、 γ ブチロラクト ン、 1, 3 ジメチルーイミダゾリジノンなどが挙げられる。また、これらの再溶解溶媒は 特定ポリイミドを溶解させるための溶媒としても使用できる。 [0079] In order to obtain the coating solution of the present invention, it is soluble in a solvent of a product obtained by reacting a solvent-soluble polyimide with an amine compound selected from amine compounds (a) and (b). What is necessary is just to mix the solution of an imidyl polymer (henceforth a specific product) and the solution of a polyamic acid in arbitrary ratios. In addition, an imidyl polymer (hereinafter referred to as a specific polyimide) soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride and a diamine containing an amine compound (c). And a solution of polyamic acid may be mixed at an arbitrary ratio. [0080] Even if the solution of the specific product is used as it is as the reaction solution of the specific product, the reaction solution is put into an appropriate poor solvent, and after the specific product is recovered, it is dissolved in the solvent and used again. May be. Examples of the poor solvent at this time include water, methanol, acetone, hexane, butyl cellosolve, heptane, methyl ethyl ketone, methyl isobutyl ketone, ethanol, toluene, and benzene. Solvents for re-dissolution include N, N dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolatatam, 2-pyrididone, N ethylpyrrolidone, N bull pyrrolidone Dimethylsulfoxide, tetramethylurea, pyridine, dimethylsulfone, hexamethylsulfoxide, γ-butyrolacton, 1,3 dimethylimidazolidinone, and the like. These redissolving solvents can also be used as solvents for dissolving the specific polyimide.
[0081] 本発明の塗布液にお!、て、特定生成物と特定ポリイミドは併用しても構わな 、。特 定生成物、特定ポリイミド、ポリアミック酸の比率は任意である力 特性的に良好な液 晶配向膜が得られるという理由から、特定生成物と特定ポリイミドとポリアミック酸を合 わせた質量における、ポリアミック酸の比率で 20〜99質量%が好ましぐより好ましく は、 40〜95質量%であり、特に好ましくは 60〜90質量%である。  [0081] In the coating liquid of the present invention, the specific product and the specific polyimide may be used in combination. The ratio of the specific product, specific polyimide, and polyamic acid is arbitrary. Because a liquid crystal alignment film with good characteristics can be obtained, the polyamic mass in the mass of the specific product, the specific polyimide, and the polyamic acid is combined. The acid ratio is more preferably 20 to 99% by mass, more preferably 40 to 95% by mass, and particularly preferably 60 to 90% by mass.
即ち、特定生成物及び Ζ又は特定ポリイミドとポリアミック酸とを合わせた質量にお ける、ポリアミック酸の比率で 20〜99質量%が好ましぐより好ましくは、 40〜95質量 %であり、特に好ましくは 60〜90質量%である。  That is, the ratio of the polyamic acid in the mass of the specific product and the soot or the specific polyimide and the polyamic acid is preferably 20 to 99% by mass, more preferably 40 to 95% by mass, and particularly preferably. Is 60-90% by mass.
[0082] また、塗布液中の上記固形物成分の濃度は、形成させようとする塗膜の厚みによつ て適宜変更することができるが、均一な塗膜を得るためには 0. 1質量%以上が好ま しぐ保存安定性の観点からは 30質量%以下であることが好ましい。また、液晶配向 膜として適切な厚みの塗膜が得られるという理由では 1〜 10質量%が好まし 、。  [0082] The concentration of the solid component in the coating solution can be appropriately changed depending on the thickness of the coating film to be formed. To obtain a uniform coating film, 0.1 is required. From the viewpoint of storage stability that is preferably at least 30% by mass, it is preferably at most 30% by mass. In addition, 1 to 10% by mass is preferable because a coating film having an appropriate thickness can be obtained as a liquid crystal alignment film.
[0083] 本発明の塗布液に含有される溶媒は、前記した特定生成物の再溶解溶媒の他に、 印刷性を改善するための溶媒を含有していても構わない。その具体例としては、ェチ ノレセロソノレブ、ブチノレセロソノレブ、ェチノレカノレビトーノレ、ブチノレカノレビトーノレ、ェチノレ カルビトールアセテート、エチレングリコール、 1ーメトキシー 2—プロパノール、 1ーェ トキシー 2—プロパノール、 1 ブトキシ 2—プロパノール、 1 フエノキシ 2—プロ パノール、プロピレングリコールモノアセテート、プロピレングリコールジアセテート、プ ロピレングリコーノレ 1 モノメチノレエーテノレ 2—アセテート、プロピレングリコーノレ —1—モノェチルエーテル— 2—アセテート、ジプロピレングリコール、 2— (2—ェトキ シプロボキシ)プロパノール、乳酸メチルエステル、乳酸ェチルエステル、乳酸 n—プ 口ピルエステル、乳酸 n ブチルエステル、乳酸イソアミルエステルなどの低表面張 力を有する溶媒が挙げられる。これらを適度に混在させることにより、基板への塗布 時に塗膜均一性が向上することが知られており、本発明の塗布液においても好適に 用いられる。 [0083] The solvent contained in the coating solution of the present invention may contain a solvent for improving the printability in addition to the above-described re-dissolving solvent for the specific product. Specific examples thereof include ethinorecerosonolev, butinorecellosonoleb, ethinorecanorebitonore, butinorecanolebitonore, ethenorecarbitol acetate, ethylene glycol, 1-methoxy-2-propanol, 1-etoxy-2- Propanol, 1-butoxy 2-propanol, 1-phenoxy 2-propanol, propylene glycol monoacetate, propylene glycol diacetate, propylene Lopyleneglycol 1 Monomethylolate 2—Acetate, Propylene glycol 1 —Monoethyl ether—2-Acetate, Dipropylene glycol, 2- (2-Ethoxypropyloxy) propanol, Lactic acid methyl ester, Lactic acid ethyl ester, Lactic acid Examples thereof include solvents having low surface tension such as n-propyl pill ester, lactic acid n butyl ester, and lactyl isoamyl ester. It is known that the coating film uniformity is improved at the time of application to the substrate by mixing these appropriately, and it is also suitably used in the coating liquid of the present invention.
[0084] また、本発明の塗布液を液晶配向剤として使用する場合は、 N, N ジメチルホル ムアミドゃ N—メチル—2 ピロリドン等のアミド系溶媒が塗布液の 50質量%以上含 有していると、フレキソ印刷などの印刷法で薄膜を形成させた際に、膜厚均一性が向 上するので好ましい。  [0084] When the coating liquid of the present invention is used as a liquid crystal aligning agent, an amide solvent such as N, N dimethylformamide N-methyl-2pyrrolidone is contained in an amount of 50% by mass or more of the coating liquid. When the thin film is formed by a printing method such as flexographic printing, the film thickness uniformity is improved, which is preferable.
本発明の液晶配向剤は、上記塗布液からなるものであり、基板に対する液晶配向 膜の密着性を向上させるために、シランカップリング剤などの添加剤を加えてもょ 、。 また、液晶配向剤は、基板上に 300nm以下といった薄膜を形成させる必要があるの で、塗布液を液晶配向剤として使用する際には、細孔径 0.1 m〜l μ mのメンブラン フィルタで濾過することが好ま U 、。  The liquid crystal aligning agent of the present invention comprises the above coating solution, and an additive such as a silane coupling agent may be added to improve the adhesion of the liquid crystal aligning film to the substrate. In addition, since the liquid crystal aligning agent needs to form a thin film of 300 nm or less on the substrate, when using the coating liquid as the liquid crystal aligning agent, it is filtered with a membrane filter having a pore diameter of 0.1 m to l μm. U prefer that.
[0085] 本発明の液晶配向剤は、塗膜にした際に溶媒に可溶なイミドィ匕重合体とポリアミツ ク酸との相分離が適度に抑制されることで高分子の絡み合いが増加するので、ラビン グ処理に対して削れに《なるという効果を有する。更には、ァミン化合物を使用しな い場合と比較して、蓄積電荷の抜け易さや電圧保持率など、液晶表示素子の電気 特性も向上する傾向にある。  [0085] The liquid crystal aligning agent of the present invention increases the entanglement of the polymer by appropriately suppressing the phase separation between the imidyl copolymer soluble in the solvent and the polyamic acid when formed into a coating film. In addition, it has the effect of being sharpened against the rubbing process. Furthermore, compared with the case where no amine compound is used, the electrical characteristics of the liquid crystal display element, such as the ease of draining the stored charge and the voltage holding ratio, tend to be improved.
[0086] 本発明の液晶配向膜は、以上のようにして得られた液晶配向剤を基板に塗布し、 乾燥、焼成した塗膜であり、液晶を所定の方向へ配向させるのに使用される。  The liquid crystal alignment film of the present invention is a coating film obtained by applying the liquid crystal aligning agent obtained as described above to a substrate, drying and baking, and is used for aligning liquid crystals in a predetermined direction. .
液晶配向剤を塗布する基板としては透明性の高い基板であれば特に限定されず、 ガラス基板、あるいはアクリル基板、ポリカーボネート基板などのプラスチック基板など を用いることができ、液晶駆動のための ITO電極などが形成された基板を用いること がプロセスの簡素化の観点力も好ましい。また、反射型の液晶表示素子では片側の 基板のみにならばシリコンウェハー等の不透明な物でも使用でき、この場合の電極 はアルミ等の光を反射する材料も使用できる。 The substrate on which the liquid crystal aligning agent is applied is not particularly limited as long as it is a highly transparent substrate, and a glass substrate, a plastic substrate such as an acrylic substrate, a polycarbonate substrate, or the like can be used. Use of a substrate on which is formed is also preferable from the viewpoint of simplifying the process. In addition, the reflective liquid crystal display element can be used with an opaque object such as a silicon wafer as long as it is only on one side of the substrate. Can also use materials that reflect light, such as aluminum.
[0087] 液晶配向剤の塗布方法としては、スピンコート法、印刷法、インクジェット法などが 挙げられるが、生産性の面から工業的にはフレキソ印刷などの転写印刷法が広く用 いられており、本発明の液晶配向剤においても好適に用いられる。  [0087] Examples of the method for applying the liquid crystal aligning agent include spin coating, printing, and ink jet. Industrially, transfer printing such as flexographic printing is widely used from the viewpoint of productivity. The liquid crystal aligning agent of the present invention is also preferably used.
液晶配向剤を塗布した後の乾燥の工程は、必ずしも必要とされないが、塗布後から 焼成までの時間が基板ごとに一定して 、な 、場合や、塗布後ただちに焼成されな!ヽ 場合には、乾燥工程を含める方が好ましい。この乾燥は、基板の搬送等により塗膜 形状が変形しない程度に溶媒が蒸発していればよぐその乾燥手段については特に 限定されない。具体例を挙げるならば、 50〜150°C、好ましくは 80〜120°Cのホット プレート上で、 0. 5〜30分、好ましくは 1〜5分乾燥させる方法がとられる。  The drying process after applying the liquid crystal aligning agent is not necessarily required, but if the time from application to baking is constant for each substrate, or is not baked immediately after coating! It is preferable to include a drying step. The drying means is not particularly limited as long as the solvent is evaporated to such an extent that the shape of the coating film is not deformed due to transport of the substrate or the like. As a specific example, a method of drying on a hot plate at 50 to 150 ° C, preferably 80 to 120 ° C for 0.5 to 30 minutes, preferably 1 to 5 minutes is used.
液晶配向剤を塗布した基板の焼成は、 100〜350°Cの任意の温度で行うことがで きるが、好ましくは 150°C〜300°Cであり、さらに好ましくは 180°C〜250°Cである。ま た、液晶セル製造行程で必要とされる、シール剤硬化などの熱処理温度より、 10°C 以上高 、温度で焼成することがより好ま U、。  The substrate coated with the liquid crystal aligning agent can be baked at any temperature of 100 to 350 ° C, preferably 150 ° C to 300 ° C, more preferably 180 ° C to 250 ° C. It is. Also, it is more preferable to fire at a temperature of 10 ° C or higher than the heat treatment temperature required for the liquid crystal cell manufacturing process, such as curing the sealant.
[0088] 焼成後の塗膜の厚みは、厚すぎると液晶表示素子の消費電力の面で不利となり、 薄すぎると液晶表示素子の信頼性が低下する場合があるので、好ましくは 5〜300n m、より好ましくは 10〜: LOOnmである。 [0088] If the thickness of the coating film after firing is too thick, it is disadvantageous in terms of power consumption of the liquid crystal display element, and if it is too thin, the reliability of the liquid crystal display element may be lowered, so it is preferably 5 to 300 nm. , More preferably 10: LOOnm.
液晶を水平配向や傾斜配向させる場合は、焼成後の塗膜をラビング又は偏光紫外 線照射などで処理する。  When the liquid crystal is aligned horizontally or tilted, the fired coating film is treated with rubbing or irradiation with polarized ultraviolet rays.
本発明の液晶表示素子は、上記した手法により本発明の液晶配向剤力 液晶配 向膜付き基板を得た後、公知の方法で液晶セルを作製し、液晶表示素子としたもの である。  The liquid crystal display element of the present invention is a liquid crystal display element obtained by obtaining a liquid crystal alignment agent-powered substrate with a liquid crystal alignment film of the present invention by the method described above, and then preparing a liquid crystal cell by a known method.
[0089] 液晶セル作製の一例を挙げるならば、液晶配向膜の形成された 1対の基板を用意 し、片方の基板の液晶配向膜上にスぺーサーを散布し、液晶配向膜面が内側になる ようにしてもう片方の基板を貼り合わせ、液晶を減圧注入して封止する方法、又は、ス ぺーサ一を散布した液晶配向膜面に液晶を滴下した後に基板を貼り合わせて封止 を行う方法などが例示できる。このときのスぺーサ一の厚みは、好ましくは 1〜30 m 、より好ましくは 2〜 10 μ mである。 [0090] 本発明の液晶表示素子は、 TN液晶表示素子、 STN液晶表示素子、 TFT液晶表 示素子、 OCB液晶表示素子、更には、横電界型の液晶表示素子、垂直配向型の液 晶表示素子などネマティック液晶を用いた種々の方式による表示素子に好適に用い られる。また、使用する液晶を選択することで、強誘電性及び反強誘電性の液晶表 示素子にも使用することができる。 [0089] To give an example of liquid crystal cell production, a pair of substrates on which a liquid crystal alignment film is formed is prepared, and a spacer is dispersed on the liquid crystal alignment film of one substrate, and the liquid crystal alignment film surface is on the inside. Then, the other substrate is bonded and sealed by injecting liquid crystal under reduced pressure, or after dropping the liquid crystal on the surface of the liquid crystal alignment film on which the spacer is dispersed, the substrate is bonded and sealed. The method etc. which perform can be illustrated. The thickness of the spacer at this time is preferably 1 to 30 m, more preferably 2 to 10 μm. The liquid crystal display element of the present invention includes a TN liquid crystal display element, an STN liquid crystal display element, a TFT liquid crystal display element, an OCB liquid crystal display element, a horizontal electric field type liquid crystal display element, and a vertical alignment type liquid crystal display. It is suitably used for display elements of various methods using nematic liquid crystal such as elements. Further, by selecting the liquid crystal to be used, it can also be used for a ferroelectric and antiferroelectric liquid crystal display element.
以下に実施例を挙げ、本発明を更に詳しく説明するが、本発明はこれらに限定して 解釈されるものではない。  The present invention will be described in more detail with reference to the following examples, but the present invention should not be construed as being limited thereto.
実施例  Example
[0091] 合成例にお 1、て、溶媒可溶性ポリイミド、溶媒に可溶なイミド化重合体、又はポリア ミック酸の合成に使用したテトラカルボン酸二無水物及びジァミンの略号とその構造 を以下に示す。  [0091] In Synthesis Examples 1, the abbreviations and structures of tetracarboxylic dianhydride and diamine used for the synthesis of solvent-soluble polyimide, solvent-soluble imidized polymer, or polyamic acid are shown below. Show.
[0092] [化 15]  [0092] [Chemical 15]
Figure imgf000039_0001
Figure imgf000039_0001
[0093] [化 16]
Figure imgf000039_0002
Figure imgf000039_0003
[0093] [Chemical 16]
Figure imgf000039_0002
Figure imgf000039_0003
[0094] [化 17]
Figure imgf000040_0001
[0094] [Chemical 17]
Figure imgf000040_0001
[0095] [化 18]
Figure imgf000040_0002
[0095] [Chemical 18]
Figure imgf000040_0002
DA12 DA13
Figure imgf000040_0003
DA12 DA13
Figure imgf000040_0003
[0096] 合成例、実施例等で使用した有機溶媒の略号は以下の通りである。 [0096] Abbreviations of organic solvents used in Synthesis Examples, Examples, etc. are as follows.
NMP: N—メチル 2—ピロリドン  NMP: N-methyl 2-pyrrolidone
BCS: ブチノレセロソノレブ  BCS: Butinorecero Sorelev
GBL: Ύ ブチロラタトン GBL: ΎButiro Lataton
実施例において使用したアミンィ匕合物の略号は、下記の通りである。(括弧内の No. は明細書中で示したアミンィ匕合物の番号である。 )  The abbreviations of the amine compounds used in the examples are as follows. (No. in parenthesis is the number of the amine compound shown in the specification.)
ΑΜ1:(Νο.94) トリエチレンテトラアミン  ΑΜ1: (Νο.94) Triethylenetetraamine
AM2:(No.37) (アミノエチルアミノメチル)フエネチルトリメトキシシラン  AM2: (No.37) (Aminoethylaminomethyl) phenethyltrimethoxysilane
AM3:(No.32) N-(2-アミノエチル) -3-ァミノプロピルトリメトキシシラン  AM3: (No.32) N- (2-aminoethyl) -3-aminominotrimethoxysilane
AM4:(No.47) (3-トリメトキシシリルプロピル)ジエチレントリァミン  AM4: (No. 47) (3-Trimethoxysilylpropyl) diethylenetriamine
AM5:(No.34) N- (2-アミノエチル) -3-アミ  AM5: (No.34) N- (2-aminoethyl) -3-amino
AM6:(No.35) N- (2-アミノエチル) -3-アミ AM7: (No.95): Ν,Ν,-ビス(2-アミノエチノレ) -1 ,3-プロパンジァミン AM6: (No.35) N- (2-aminoethyl) -3-amino AM7: (No.95): Ν, Ν, -bis (2-aminoethinole) -1,3-propanediamin
ΑΜ8: (Νο.36): Ν- (2-アミノエチル) -11-アミノウンデシルトリメトキシシラン  ΑΜ8: (Νο.36): Ν- (2-Aminoethyl) -11-aminoundecyltrimethoxysilane
ΑΜ9: (Νο.38): Ν- (6-ァミノへキシル)ァミノプロピルトリメトキシシラン  ΑΜ9: (Νο.38): Ν- (6-Aminohexyl) aminopropyltrimethoxysilane
AM10 (No 55) : 1,6-ジァミノへキサン  AM10 (No 55): 1,6-Diaminohexane
AM11 (No 71) : ジエチレントリァミン  AM11 (No 71): Diethylenetriamine
AM12 (No 73) : ジプロピレントリァミン  AM12 (No 73): Dipropylenetriamine
AM13 (No 11): n-プロピル- 1 ,3-プロパンジァ  AM13 (No 11): n-propyl-1,3-propanedia
AM14 (No 51) : エチレンジァミン  AM14 (No 51): Ethylenediamine
AM15 (No 56) : 1,12-ジアミノドデカン  AM15 (No 56): 1,12-Diaminododecane
AM16 (No 65) : p-キシリレンジァミン  AM16 (No 65): p-Xylylenediamine
AM17 (No 27) : 1-(2-アミノエチル)ピぺラジン  AM17 (No 27): 1- (2-Aminoethyl) piperazine
[0097] <重合体の分子量の測定 >  <Measurement of molecular weight of polymer>
合成例における溶媒可溶性ポリイミド、溶媒に可溶なイミドィ匕重合体、及びポリアミ ック酸の分子量は、 Shodex社製 常温ゲル浸透クロマトグラフィー (GPC)装置 (GPC-1 01)、 Shodex社製カラム(KD-803、 KD- 805)を用い以下のようにして測定した。  The molecular weights of the solvent-soluble polyimide, the solvent-soluble imidopolymer, and the polyamic acid in the synthesis examples are as follows: Shodex's room temperature gel permeation chromatography (GPC) apparatus (GPC-101), Shodex's column ( Measurement was performed as follows using KD-803 and KD-805).
カラム温度: 50°C  Column temperature: 50 ° C
溶離液: Ν,Ν-ジメチルホルムアミド(添加剤として、臭化リチウム—水和物(LiBr'H2 0)が 30mmol/L、リン酸 ·無水結晶(o-リン酸)力 S30mmol/L、テトラヒドロフラン (THF) が 10ml/L)  Eluent: Ν, Ν-dimethylformamide (as an additive, lithium bromide-hydrate (LiBr'H2 0) is 30 mmol / L, phosphoric acid / anhydrous crystal (o-phosphate) force S30 mmol / L, tetrahydrofuran ( (THF) is 10ml / L)
流速: l.OmLZ分  Flow rate: l.OmLZ min
検量線作成用標準サンプル:東ソ一社製 TSK 標準ポリエチレンオキサイド (分 子量 約 900,000、 150,000、 100,000、 30,000)、及び、ポリマーラボラトリー社製 ポリ エチレングリコール(分子量 約 12,000、 4,000、 1,000)。  Standard sample for preparing calibration curve: TSK standard polyethylene oxide (molecular weight: about 900,000, 150,000, 100,000, 30,000) manufactured by Tosoh Corporation, and polyethylene glycol (molecular weight: about 12,000, 4,000, 1,000) manufactured by Polymer Laboratory.
[0098] <イミド化率の測定 > [0098] <Measurement of imidization ratio>
合成例における溶媒可溶性ポリイミド、溶媒に可溶なイミドィ匕重合体のイミドィ匕率は 次のようにして測定した。ポリイミド粉末 20mgを NMRサンプル管(草野科学社製 N MRサンプリングチューブスタンダード φ 5)〖こ入れ、重水素化ジメチルスルホキシド (DMSO-d、 0.05%TMS (テトラメチルシラン)混合品) 0.53mlを添カ卩し、超音波をか けて完全に溶解させた。この溶液を日本電子データム社製 NMR測定器 (JNM-ECA 500)にて 500MHzのプロトン NMRを測定した。イミド化率は、イミド化前後で変化し ない構造に由来するプロトンを基準プロトンとして決め、このプロトンのピーク積算値と 、 9.5〜10.0ppm付近に現れるァミック酸の NH基に由来するプロトンピーク積算値とを 用い以下の式によって求めた。 The imido ratio of the solvent-soluble polyimide in the synthesis example and the imido polymer soluble in the solvent was measured as follows. Add 20 mg of polyimide powder to the NMR sample tube (N MR sampling tube standard φ5 manufactured by Kusano Kagakusha) and add 0.53 ml of deuterated dimethyl sulfoxide (DMSO-d, 0.05% TMS (tetramethylsilane) mixture) Hesitate and apply ultrasound It was completely dissolved. This solution was measured for proton NMR at 500 MHz with an NMR measuring instrument (JNM-ECA 500) manufactured by JEOL Datum. The imidation rate is determined based on protons derived from structures that do not change before and after imidation as reference protons, and the peak integrated value of these protons and the proton peak integrated value derived from the NH group of amic acid that appears in the vicinity of 9.5 to 10.0 ppm. It was calculated by the following formula using and.
イミドィ匕率(%) = (l - a -x/y) X 100  Imidi ratio (%) = (l-a -x / y) X 100
上記式において、 Xはァミック酸の NH基由来のプロトンピーク積算値、 yは基準プロ トンのピーク積算値、 aはポリアミック酸 (イミドィ匕率が 0%)の場合におけるァミック酸 の NH基プロトン一個に対する基準プロトンの個数割合である。  In the above formula, X is the proton peak integrated value derived from the NH group of the amic acid, y is the peak integrated value of the reference proton, and a is one NH group proton of the amic acid in the case of polyamic acid (imido ratio is 0%). Is the number ratio of the reference proton to.
[0099] (合成例 1) [0099] (Synthesis Example 1)
TDAを 150.14g(0.5mol)と、 DA1を 48.67g(0.45mol)と、 DA2を 18.83g(0.05mol)とを、 NMP 1233g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミ ック酸溶液を NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 237.9g、 無水酢酸 510.6gを加え、 40°Cで 3時間反応させた。この溶液を 17.4Lのメタノール中 に投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。  A polyamic acid solution was prepared by reacting 150.14 g (0.5 mol) of TDA, 48.67 g (0.45 mol) of DA1, and 18.83 g (0.05 mol) of DA2 in 1233 g of NMP at 50 ° C. for 24 hours. This polyamic acid solution was diluted to 5% by mass with NMP, and 237.9 g of pyridine and 510.6 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 17.4 L of methanol, and the resulting precipitate was filtered off and dried to obtain a white polyimide powder.
得られた溶媒可溶性ポリイミドは、数平均分子量が 9,273、重量平均分子量が 18,81 5であった。またイミド化率は 84%であった。  The obtained solvent-soluble polyimide had a number average molecular weight of 9,273 and a weight average molecular weight of 18,815. The imidization ratio was 84%.
[0100] (合成例 2) [0100] (Synthesis example 2)
CBDAを 98.05g(0.5mol)と、 PMDAを 95.98g(0.44mol)と、 DA3を 198.27g(1.0mol)と を、 NMP l l l lgと GBL l l l lgの混合溶媒中、室温で 5時間反応させポリアミック酸 溶液を調製した。このポリアミック酸は、数平均分子量が 11,067、重量平均分子量が 2 6,270であった。  CBDA 98.05 g (0.5 mol), PMDA 95.98 g (0.44 mol) and DA3 198.27 g (1.0 mol) were reacted in a mixed solvent of NMP lll lg and GBL lll lg at room temperature for 5 hours to polyamic. An acid solution was prepared. This polyamic acid had a number average molecular weight of 11,067 and a weight average molecular weight of 26,270.
[0101] {実施例 1 } [0101] {Example 1}
合成例 1で得たポリイミド粉末 3gを NMP 34.5g中、 50°Cにて 20h攪拌し溶解させた 。この溶液に、トリエチレンテトラアミン(No.94のァミン化合物)の 5質量0 /oNMP溶液 を 3.0g (アミンィ匕合物としては 0.15g)を添加し、さらにこの溶液中のポリイミド濃度が 6 質量0 /0になるように NMP 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミン化合 物の添加量はポリイミド 100質量部に対して 5質量部である。 合成例 2で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 59質量%、 GBLが 20質量%、 BCSが 15質量%になるよう調製 した。 3 g of the polyimide powder obtained in Synthesis Example 1 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours. To this solution was added 3.0 g (0.15 g as an amine compound) of 5 mass 0 / oNMP solution of triethylenetetraamine (No. 94 amine compound), and the polyimide concentration in this solution was 6 mass. the NMP 9.5 g so that the 0/0 Ka卩E and 20h stirred at 50 ° C. At this time, the addition amount of the amine compound is 5 parts by mass with respect to 100 parts by mass of the polyimide. NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 66Z16Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 66Z16Z12 by mass ratio.
[0102] (合成例 3) [0102] (Synthesis Example 3)
TDAを 30.03g(0.1mol)と、 DA3を 19.83g(0.1mol)とを、 NMP 283g中、 50°Cで 24時 間反応させポリアミック酸溶液を調製した。このポリアミック酸溶液 50gを NMPにより 5 質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.1g、無水酢酸 15.4gを加え、 40°C で 3時間反応させた。この溶液を 0.6Lのメタノール中に投入し、得られた沈殿物を濾 別し、乾燥し、白色のポリイミド粉末を得た。得られた溶媒可溶性ポリイミドは、数平均 分子量が 13,651、重量平均分子量が 48,092であった。またイミド化率は 81%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA and 19.83 g (0.1 mol) of DA3 in 283 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.1 g of pyridine and 15.4 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was poured into 0.6 L of methanol, and the resulting precipitate was filtered and dried to obtain a white polyimide powder. The solvent-soluble polyimide obtained had a number average molecular weight of 13,651 and a weight average molecular weight of 48,092. The imidation ratio was 81%.
[0103] {実施例 2} [0103] {Example 2}
合成例 3で得たポリイミド粉末を使用した以外は実施例 1と同様にして、本発明の塗 布液を得た。  A coating solution of the present invention was obtained in the same manner as in Example 1 except that the polyimide powder obtained in Synthesis Example 3 was used.
{実施例 3〜29}  {Examples 3 to 29}
アミンィ匕合物の添加量又は種類を下記のように変更した以外は実施例 1と同様にし て、本発明の塗布液を得た。なお、アミンィ匕合物を 3質量部添加するときはアミンィ匕 合物の 3質量%NMP溶液を、 2質量部添加するときは同 2質量%NMP溶液を、 10 質量部添加するときは同 10質量%NMP溶液を、 1質量部添加するときは同 1質量 %NMP溶液を添カ卩した。  A coating solution of the present invention was obtained in the same manner as in Example 1 except that the addition amount or type of the amine compound was changed as follows. When 3 parts by mass of the amine compound is added, a 3% by weight NMP solution of the amine compound is added. When 2 parts by mass is added, the same 2% by weight NMP solution is added. When 1 part by mass of the mass% NMP solution was added, the same 1 mass% NMP solution was added.
実施例 No ァミン化合物 添加量 (質量部)  Example No Amine compound Addition amount (parts by mass)
1 AMI 0.15g (5)  1 AMI 0.15g (5)
3 AMI 0.09g (3)  3 AMI 0.09g (3)
4 AMI 0.06g (2)  4 AMI 0.06g (2)
5 AM2 0.09g (3)  5 AM2 0.09g (3)
6 AM2 0.15g (5) 7 AM2 0.30g (10) 6 AM2 0.15g (5) 7 AM2 0.30g (10)
8 AM3 0.15g (5)  8 AM3 0.15g (5)
9 AM3 0.30g (10)  9 AM3 0.30g (10)
10 AM4 0.15g (5)  10 AM4 0.15g (5)
11 AM4 0.30g (10)  11 AM4 0.30g (10)
12 AM5 0.09g (3)  12 AM5 0.09g (3)
13 AM5 0.15g (5)  13 AM5 0.15g (5)
14 AM5 0.30g (10)  14 AM5 0.30g (10)
15 AM6 0.15g (5)  15 AM6 0.15g (5)
16 AM6 0.30g (10)  16 AM6 0.30g (10)
17 AM7 0.15g (5)  17 AM7 0.15g (5)
18 AM8 0.15g (5)  18 AM8 0.15g (5)
19 AM8 0.30g (10)  19 AM8 0.30g (10)
20 AM9 0.15g (5)  20 AM9 0.15g (5)
21 AM10 0.15g :5)  21 AM10 0.15g: 5)
22 AM11 0.03g :1)  22 AM11 0.03 g: 1)
23 AM11 0.09g :3)  23 AM11 0.09g: 3)
24 AM12 0.09g :3)  24 AM12 0.09g: 3)
25 AM13 0.15g :5)  25 AM13 0.15g: 5)
26 AM 14 0.15g :5)  26 AM 14 0.15g: 5)
27 AM15 0.15g :5)  27 AM15 0.15g: 5)
28 AM16 0.15g :5)  28 AM16 0.15g: 5)
29 AM17 0.15g :5)  29 AM17 0.15g: 5)
{比較例 1 }  {Comparative Example 1}
実施例 1にお 、て、溶媒可溶性ポリイミドの溶液にアミンィ匕合物を添加量せずに N MPで 6質量%に希釈し、これとポリアミック酸の希釈液とを混合したこと以外は実施 例 1と同様にして比較のための塗布液を得た。  In Example 1, except that the amine compound was not added to the solvent-soluble polyimide solution and diluted to 6% by mass with NMP, and this was mixed with the dilute solution of polyamic acid. A coating solution for comparison was obtained in the same manner as in 1.
{比較例 2} 実施例 1において、アミンィ匕合物として 3—ァミノプロピルメチルジェトキシシランを 使用した以外は実施例 1と同様にして比較のための塗布液を得た。 {Comparative Example 2} A coating solution for comparison was obtained in the same manner as in Example 1, except that 3-aminopropylmethyljetoxysilane was used as the amine compound in Example 1.
{比較例 3}  {Comparative Example 3}
実施例 1において、アミンィ匕合物として 2— (4—ァミノフエ-ル)ェチルァミンを使用 した以外は実施例 1と同様にして比較のための塗布液を得た。  A coating solution for comparison was obtained in the same manner as in Example 1 except that 2- (4-aminophenol) ethylamine was used as the amine compound in Example 1.
{比較例 4}  {Comparative Example 4}
実施例 1にお 、て、アミンィ匕合物としてビス(トリメトキシシリルプロピル)アミンを使用 した以外は実施例 1と同様にして比較のための塗布液を得た。  A coating solution for comparison was obtained in the same manner as in Example 1 except that bis (trimethoxysilylpropyl) amine was used as the amine compound in Example 1.
{比較例 5}  {Comparative Example 5}
実施例 1において、アミンィ匕合物として N—メチルァミノプロピルトリメトキシシランを 使用した以外は実施例 1と同様にして比較のための塗布液を得た。  A coating solution for comparison was obtained in the same manner as in Example 1 except that N-methylaminopropyltrimethoxysilane was used as the amine compound in Example 1.
<吸湿安定性の評価 > <Evaluation of moisture absorption stability>
上記実施例又は比較例で調製した塗布液を、 Cr製膜ガラス基板 (クロム蒸着したガ ラス基板)上にそれぞれ約 0. 1ml滴下し、温度 23°C、湿度 50%の環境に放置した。 この液滴の端近傍及び中央付近を 1時間ごとに顕微鏡で観察した。なお、液滴の端 近傍は 100倍で、液滴の中央付近は 50倍の倍率で観察を行った。  About 0.1 ml of each of the coating solutions prepared in the above examples or comparative examples was dropped on a Cr film-formed glass substrate (chromium-deposited glass substrate) and left in an environment at a temperature of 23 ° C. and a humidity of 50%. The vicinity of the edge and the center of the droplet were observed with a microscope every hour. The observation was performed at 100x magnification near the edge of the droplet and at 50x magnification near the center of the droplet.
その結果、実施例 1〜29の塗布液は 6時間経過しても凝集物が見られないのに対 して、比較例 1〜5の塗布液は 1時間後の観察で液滴の端近傍及び中央付近に凝集 物が見られた。  As a result, in the coating liquids of Examples 1 to 29, no agglomerates were observed even after 6 hours. Aggregates were observed near the center.
{実施例 30}  {Example 30}
実施例 1において、混合するポリアミック酸の希釈液を、ポリアミック酸が 6質量%、 N MPが 39.5質量%、 GBLが 39.5質量%、 BCSが 15質量%になるよう調製した以外は 実施例 1と同様にして本発明の塗布液を得た。この塗布液の溶媒組成は、質量比で , NMP/GBL/BCS = 50. 3/31. 6,12である。  In Example 1, except that the dilute solution of polyamic acid to be mixed was prepared so that polyamic acid was 6% by mass, NMP was 39.5% by mass, GBL was 39.5% by mass, and BCS was 15% by mass. Similarly, the coating liquid of the present invention was obtained. The solvent composition of this coating solution is NMP / GBL / BCS = 50.3 / 31.6,12 by mass ratio.
{実施例 31 }  {Example 31}
実施例 1において、混合するポリアミック酸の希釈液を、ポリアミック酸が 6質量%、 N MPが 20質量%、 GBLが 59質量%、 BCSが 15質量%になるよう調製した以外は実施 例 1と同様にして本発明の塗布液を得た。この塗布液の溶媒組成は、質量比で、 N MP/GBL/BCS = 34. 7/47. 2,12である。 In Example 1, the dilute solution of polyamic acid to be mixed was prepared in the same manner as in Example 1 except that the polyamic acid was adjusted to 6% by mass, NMP 20% by mass, GBL 59% by mass, and BCS 15% by mass. Similarly, the coating liquid of the present invention was obtained. The solvent composition of this coating solution is N MP / GBL / BCS = 34.7 / 7 / 47.2,12.
[0106] {実施例 32} [0106] {Example 32}
合成例 1で得たポリイミド粉末 3gを GBL 34.5g中、 50°Cにて 20h攪拌し溶解させた。 この溶液に、トリエチレンテトラアミン (No.94のアミンィ匕合物)の 5質量0 /oGBL溶液を 3. Og (アミンィ匕合物としては 0.15g)を添加し、さらにこの溶液中のポリイミド濃度が 6質量 %になるように GBL 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミンィ匕合物の 添加量はポリイミド 100質量部に対して 5質量部である。 3 g of the polyimide powder obtained in Synthesis Example 1 was dissolved in 34.5 g of GBL by stirring at 50 ° C. for 20 hours. To this solution, add 3 mass 0 / oGBL solution of triethylenetetraamine (No.94 amine compound) 3. Og (0.15 g as amine compound), and then add polyimide concentration in this solution GBL (9.5 g) was added so that the amount was 6 mass%, and the mixture was stirred at 50 ° C for 20 hours. The amount of the amine compound added at this time is 5 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 2で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 20質量%、 GBLが 59質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid strength of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 16Z66Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 16Z66Z12 by mass ratio.
[0107] {実施例 33〜36} [0107] {Examples 33 to 36}
アミンィ匕合物の種類を下記のように変更した以外は実施例 30と同様にして、本発 明の塗布液を得た。  A coating solution of the present invention was obtained in the same manner as in Example 30, except that the type of amine compound was changed as follows.
実施例 No アミンィ匕合物  Example No. Aminy compound
33 AM2  33 AM2
34 AM5  34 AM5
35 AM7  35 AM7
36 AM10  36 AM10
[0108] {実施例 37〜39} [0108] {Examples 37 to 39}
アミンィ匕合物の種類を下記のように変更した以外は実施例 31と同様にして、本発 明の塗布液を得た。  A coating solution of the present invention was obtained in the same manner as in Example 31 except that the type of amine compound was changed as follows.
実施例 No アミンィ匕合物  Example No. Aminy compound
37 AM2  37 AM2
38 AM5  38 AM5
39 AM7 [0109] {実施例 40〜46} 39 AM7 [0109] {Examples 40 to 46}
アミンィ匕合物の種類を下記のように変更した以外は実施例 32と同様にして、本発 明の塗布液を得た。  A coating solution of the present invention was obtained in the same manner as in Example 32 except that the type of amine compound was changed as follows.
実施例 No アミンィ匕合物  Example No. Aminy compound
40 AM2  40 AM2
41 AM3  41 AM3
42 AM4  42 AM4
43 AM5  43 AM5
44 AM6  44 AM6
45 AM7  45 AM7
46 AM10  46 AM10
(合成例 4)  (Synthesis Example 4)
TDAを 30.03g(0.1mol)と、 DA1を 9.46g(0.0875mol)と、 DA2を 4.71g(0.0125mol)とを 、 NMP 251g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミ ック酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 8.1g 、無水酢酸 17.3gを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 9, 195、重量平均分子量が 19,235であった。 またイミド化率は 83%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.46 g (0.0875 mol) of DA1, and 4.71 g (0.0125 mol) of DA2 in 251 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 8.1 g of pyridine and 17.3 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,195 and a weight average molecular weight of 19,235. The imidation ratio was 83%.
[0110] (合成例 5)  [0110] (Synthesis Example 5)
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA2を 5.65g(0.015mol)とを、 NMP 254g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g、 無水酢酸 17. lgを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 9,324、重量平均分子量が 19,244であった。 またイミド化率は 83%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.65 g (0.015 mol) of DA2 in 254 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17. lg of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,324 and a weight average molecular weight of 19,244. The imidation ratio was 83%.
[0111] (合成例 6) TDAを 30.03g(0.1mol)と、 DAIを 9.19g(0.085mol)と、 DA4を 5.23g(0.015mol)とを、 NMP 252g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 8.0g、 無水酢酸 17.2gをカ卩え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 9,834、重量平均分子量が 21,659であった。 またイミド化率は 83%であった。 [0111] (Synthesis Example 6) A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DAI, and 5.23 g (0.015 mol) of DA4 in 252 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and further 8.0 g of pyridine and 17.2 g of acetic anhydride were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,834 and a weight average molecular weight of 21,659. The imidation ratio was 83%.
[0112] (合成例 7) [0112] (Synthesis Example 7)
TDAを 30.03g(0.1mol)と、 DA1を 8.56g(0.08mol)と、 DA5を 5.85g(0.02mol)とを、 N MP 252g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミック 酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 8.0g、無 水酢酸 17.2gを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に投 入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶媒 可溶性ポリイミドは、数平均分子量が 9,111、重量平均分子量が 18,045であった。また イミドィ匕率は 83%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 8.56 g (0.08 mol) of DA1, and 5.85 g (0.02 mol) of DA5 in NMP 252 g at 50 ° C for 24 hours. . 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and further 8.0 g of pyridine and 17.2 g of anhydrous acetic acid were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was poured into 0.6 L of methanol, and the resulting precipitate was filtered off and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 9,111 and a weight average molecular weight of 18,045. Further, the imido ratio was 83%.
[0113] (合成例 8) [0113] (Synthesis Example 8)
TDAを 30.03g(0.1mol)と、 DA1を 8.65g(0.08mol)と、 DA6を 7.61g(0.02mol)とを、 N MP 185g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミック 酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 10.3g、 無水酢酸 22. lgを加え、 35°Cで 3時間反応させた。この溶液を 0.8Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 6,446、重量平均分子量が 13,971であった。 またイミド化率は 74%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 8.65 g (0.08 mol) of DA1, and 7.61 g (0.02 mol) of DA6 in NMP 185 g at 50 ° C. for 24 hours. . 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, 10.3 g of pyridine and 22. lg of acetic anhydride were further added as an imido catalyst and reacted at 35 ° C. for 3 hours. This solution was put into 0.8 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 6,446 and a weight average molecular weight of 13,971. The imidation ratio was 74%.
[0114] (合成例 9) [0114] (Synthesis Example 9)
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA6を 5.71g(0.015mol)とを、 NMP 255g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g、 無水酢酸 17.0gをカ卩え、 35°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 7,943、重量平均分子量が 14,365であった。 またイミド化率は 76%であった。 A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.71 g (0.015 mol) of DA6 in NMP 255 g at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were further added as an imido catalyst and reacted at 35 ° C. for 3 hours. This solution in 0.6 L methanol The precipitate obtained was filtered off and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,943 and a weight average molecular weight of 14,365. The imidation ratio was 76%.
[0115] (合成例 10)  [0115] (Synthesis Example 10)
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA7を 6.11g(0.015mol)とを、 NMP 257g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g、 無水酢酸 16.9gをカ卩え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 5,735、重量平均分子量が 12,670であった。 またイミド化率は 83%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 6.11 g (0.015 mol) of DA7 in 257 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 16.9 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 5,735 and a weight average molecular weight of 12,670. The imidation ratio was 83%.
[0116] (合成例 11)  [0116] (Synthesis Example 11)
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA8を 5.92g(0.015mol)とを、 NMP 256g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g、 無水酢酸 17.0gをカ卩え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 8,495、重量平均分子量が 22,294であった。 またイミド化率は 84%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.92 g (0.015 mol) of DA8 in 256 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,495 and a weight average molecular weight of 22,294. The imidization ratio was 84%.
[0117] (合成例 12)  [0117] (Synthesis Example 12)
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA9を 6.04g(0.015mol)とを、 NMP 257g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g、 無水酢酸 16.9gをカ卩え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 8,775、重量平均分子量が 23,308であった。 またイミド化率は 84%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 6.04 g (0.015 mol) of DA9 in 257 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 16.9 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,775 and a weight average molecular weight of 23,308. The imidization ratio was 84%.
[0118] (合成例 13) TDAを 30.03g(0.1mol)と、 DAIを 9.19g(0.085mol)と、 DA10を 5.44g(0.015mol)とを 、 NMP 253g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミ ック酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 8.0g 、無水酢酸 17.1gを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 7,367、重量平均分子量が 18,959であった。 またイミド化率は 84%であった。 [0118] (Synthesis Example 13) A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DAI, and 5.44 g (0.015 mol) of DA10 in 253 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 8.0 g of pyridine and 17.1 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,367 and a weight average molecular weight of 18,959. The imidization ratio was 84%.
[0119] (合成例 14) [Synthesis Example 14]
TDAを 30.03g(0.1mol)と、 DA1を 9.19g(0.085mol)と、 DA11を 5.80g(0.015mol)とを 、 NMP 255g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミ ック酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.9g 、無水酢酸 17.0gを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 7,203、重量平均分子量が 18,298であった。 またイミド化率は 84%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 9.19 g (0.085 mol) of DA1, and 5.80 g (0.015 mol) of DA11 in NMP 255 g at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 7.9 g of pyridine and 17.0 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 7,203 and a weight average molecular weight of 18,298. The imidization ratio was 84%.
[0120] (合成例 15) [0120] (Synthesis Example 15)
TDAを 30.03g(0.1mol)と、 DA12を 12.26g(0.09mol)と、 DA2を 3.77g(0.01mol)とを、 NMP 261g中、 50°Cで 24時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 7.7g、 無水酢酸 16.6gをカ卩え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 8,634、重量平均分子量が 17,655であった。 またイミド化率は 81%であった。  A polyamic acid solution was prepared by reacting 30.03 g (0.1 mol) of TDA, 12.26 g (0.09 mol) of DA12, and 3.77 g (0.01 mol) of DA2 in 261 g of NMP at 50 ° C. for 24 hours. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and further 7.7 g of pyridine and 16.6 g of acetic anhydride were added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 8,634 and a weight average molecular weight of 17,655. The imidation ratio was 81%.
[0121] (合成例 16) [0121] (Synthesis Example 16)
TDAを 30.03g(0.1mol)と、 DA13を 19.83g(0.1mol)とを、 NMP 329g中、 50°Cで 24 時間反応させポリアミック酸溶液を調製した。このポリアミック酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリジン 6.1g、無水酢酸 13.1gを加え、 40 °Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に投入し、得られた沈殿物を 濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶媒可溶性ポリイミドは、数平 均分子量が 18, 197、重量平均分子量が 70,609であった。またイミド化率は 90%であつ た。 30.03 g (0.1 mol) of TDA and 19.83 g (0.1 mol) of DA13 were reacted in 329 g of NMP at 50 ° C. for 24 hours to prepare a polyamic acid solution. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 6.1 g of pyridine and 13.1 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was poured into 0.6 L of methanol, and the resulting precipitate was It was filtered and dried to obtain a white polyimide powder. The obtained solvent-soluble polyimide had a number average molecular weight of 18,197 and a weight average molecular weight of 70,609. The imidization rate was 90%.
[0122] (合成例 17)  [0122] (Synthesis Example 17)
CBDAを 19.22g(0.098mol)と、 DA14を 16.26g(0.08mol)と、 DA5を 5.85g(0.02mol)と を、 NMP 234g中、室温で 24時間反応させポリアミック酸溶液を調製した。このポリア ミック酸溶液 50gを NMPにより 5質量0 /0に希釈し、さらにイミド化触媒としてピリジン 2.3 g、無水酢酸 5.5gを加え、 50°Cで 3時間反応させた。この溶液を 0.6Lのメタノール中に 投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得られた溶 媒可溶性ポリイミドは、数平均分子量が 12,988、重量平均分子量が 30,324であった。 またイミド化率は 94%であった。 A polyamic acid solution was prepared by reacting 19.22 g (0.098 mol) of CBDA, 16.26 g (0.08 mol) of DA14, and 5.85 g (0.02 mol) of DA5 in 234 g of NMP at room temperature for 24 hours. This polyamic Mick acid solution 50g diluted five mass 0/0 by NMP, pyridine 2.3 g, acetic anhydride 5.5g added as further imidization catalyst, and reacted for 3 hours at 50 ° C. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The resulting solvent-soluble polyimide had a number average molecular weight of 12,988 and a weight average molecular weight of 30,324. The imidation ratio was 94%.
[0123] (合成例 18)  [0123] (Synthesis example 18)
TDAを 15.02g(0.05mol)と、 BODAを 12.51g(0.05mol)と、 DA1を 9.73g(0.09mol)と、 DA2を 3.77g(0.01mol)とを、 NMP 164g中、 35°Cで 24時間反応させポリアミック酸溶 液を調製した。このポリアミック酸溶液 50gを NMPにより 7質量%に希釈し、さらにイミ ド化触媒としてピリジン 9.6g、無水酢酸 6.2gを加え、 100°Cで 3時間反応させた。この 溶液を 0.6Lのメタノール中に投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイ ミド粉末を得た。得られた溶媒可溶性ポリイミドは、数平均分子量が 12,808、重量平 均分子量が 32,511であった。またイミド化率は 85%であった。  TDA 15.02g (0.05mol), BODA 12.51g (0.05mol), DA1 9.73g (0.09mol), DA2 3.77g (0.01mol) in NMP 164g at 35 ° C 24 A polyamic acid solution was prepared by reacting for a time. 50 g of this polyamic acid solution was diluted to 7% by mass with NMP, and 9.6 g of pyridine and 6.2 g of acetic anhydride were further added as an imidation catalyst, followed by reaction at 100 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was separated by filtration and dried to obtain a white polyimide powder. The obtained solvent-soluble polyimide had a number average molecular weight of 12,808 and a weight average molecular weight of 32,511. The imidization ratio was 85%.
[0124] (合成例 19)  [0124] (Synthesis Example 19)
CBDAを 18.43g(0.094mol)と、 DA3を 19.83g(0.1mol)とを、 NMP 108gと GBL 108 gの混合溶媒中、室温で 5時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸は、数平均分子量が 16,951、重量平均分子量が 37,292であった。  A polyamic acid solution was prepared by reacting 18.43 g (0.094 mol) of CBDA and 19.83 g (0.1 mol) of DA3 in a mixed solvent of 108 g of NMP and 108 g of GBL at room temperature for 5 hours. This polyamic acid had a number average molecular weight of 16,951 and a weight average molecular weight of 37,292.
[0125] (合成例 20)  [0125] (Synthesis Example 20)
CBDAを 18.43g(0.094mol)と、 DA15を 20.02g(0.1mol)とを、 NMP 109gと GBL 10 9gの混合溶媒中、室温で 5時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸は、数平均分子量が 15,139、重量平均分子量が 31,565であった。  A polyamic acid solution was prepared by reacting 18.43 g (0.094 mol) of CBDA and 20.02 g (0.1 mol) of DA15 in a mixed solvent of 109 g of NMP and 109 g of GBL at room temperature for 5 hours. This polyamic acid had a number average molecular weight of 15,139 and a weight average molecular weight of 31,565.
[0126] (合成例 21) CBDAを 18.04g(0.092mol)と、 DA16を 19.93g(0.1mol)とを、 NMP 171gと GBL 17 lgの混合溶媒中、室温で 5時間反応させポリアミック酸溶液を調製した。このポリアミツ ク酸は、数平均分子量が 20,821、重量平均分子量が 49,970であった。 [Synthesis Example 21] A polyamic acid solution was prepared by reacting 18.04 g (0.092 mol) of CBDA and 19.93 g (0.1 mol) of DA16 in a mixed solvent of NMP 171 g and GBL 17 lg at room temperature for 5 hours. This polyamic acid had a number average molecular weight of 20,821 and a weight average molecular weight of 49,970.
[0127] {実施例 47} [0127] {Example 47}
合成例 4で得たポリイミド粉末 3gを NMP 34.5g中、 50°Cにて 20h攪拌し溶解させた 。この溶液に、トリエチレンテトラアミン (No.94のァミン化合物)の 3質量0 /oNMP溶液 を 3.0g (アミンィ匕合物としては 0.09g)を添加し、さらにこの溶液中のポリイミド濃度が 6 質量0 /0になるように NMP 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミン化合 物の添加量はポリイミド 100質量部に対して 3質量部である。 3 g of the polyimide powder obtained in Synthesis Example 4 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours. To this solution, 3 wt 0 / oNMP solution was added (0.09 g as Amini匕合product) to 3.0 g, further polyimide concentration in the solution is 6 mass triethylenetetramine (Amin compound of No.94) the NMP 9.5 g so that the 0/0 Ka卩E and 20h stirred at 50 ° C. The added amount of the amine compound at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 2で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 59質量%、 GBLが 20質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、実施例 NoNMPZGBLZBCS = 66Zl6Zl2である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is, in mass ratio, Example NoNMPZGBLZBCS = 66Zl6Zl2.
[0128] {実施例 48〜58} [0128] {Examples 48 to 58}
ポリイミド粉末を下記のように変更した以外は実施例 47と同様にして、本発明の塗 布液を得た。  A coating solution of the present invention was obtained in the same manner as in Example 47 except that the polyimide powder was changed as follows.
実施例 48 合成例 5で得たポリイミド粉末  Example 48 Polyimide powder obtained in Synthesis Example 5
実施例 49 合成例 6で得たポリイミド粉末  Example 49 Polyimide powder obtained in Synthesis Example 6
実施例 50 合成例 7で得たポリイミド粉末  Example 50 Polyimide powder obtained in Synthesis Example 7
実施例 51 合成例 8で得たポリイミド粉末  Example 51 Polyimide powder obtained in Synthesis Example 8
実施例 52 合成例 9で得たポリイミド粉末  Example 52 Polyimide powder obtained in Synthesis Example 9
実施例 53 合成例 10で得たポリイミド粉末  Example 53 Polyimide powder obtained in Synthesis Example 10
実施例 54 合成例 11で得たポリイミド粉末  Example 54 Polyimide powder obtained in Synthesis Example 11
実施例 55 合成例 12で得たポリイミド粉末  Example 55 Polyimide powder obtained in Synthesis Example 12
実施例 56 合成例 13で得たポリイミド粉末  Example 56 Polyimide powder obtained in Synthesis Example 13
実施例 57 合成例 14で得たポリイミド粉末 実施例 58 合成例 15で得たポリイミド粉末 Example 57 Polyimide powder obtained in Synthesis Example 14 Example 58 Polyimide powder obtained in Synthesis Example 15
[0129] {実施例 59} [0129] {Example 59}
合成例 16で得たポリイミド粉末 3gを GBL 34.5g中、 50°Cにて 20h攪拌し溶解させた 。この溶液に、トリエチレンテトラアミン (No.94のァミン化合物)の 3質量0 /oGBL溶液を 3.0g (アミンィ匕合物としては 0.15g)を添加し、さらにこの溶液中のポリイミド濃度が 6質 量%になるように GBL 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミンィ匕合物 の添加量はポリイミド 100質量部に対して 3質量部である。 3 g of the polyimide powder obtained in Synthesis Example 16 was stirred and dissolved in 34.5 g of GBL at 50 ° C. for 20 hours. To this solution was added 3.0 g (0.15 g as an amine compound) of 3 mass 0 / oGBL solution of triethylenetetraamine (No. 94 amine compound), and the polyimide concentration in this solution was 6%. GBL 9.5g was added so that it might become the amount%, and it stirred at 50 degreeC for 20 hours. The amount of the amine compound added at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 19で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 20質量%、 GBLが 59質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 19 to prepare a polyamic acid power of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 16Z66Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 16Z66Z12 by mass ratio.
[0130] {実施例 60} [0130] {Example 60}
合成例 17で得たポリイミド粉末 3gを GBL 34.5g中、 50°Cにて 20h攪拌し溶解させた 。この溶液に、トリエチレンテトラアミン (No.94のァミン化合物)の 3質量0 /oGBL溶液を 3.0g (アミンィ匕合物としては 0.15g)を添加し、さらにこの溶液中のポリイミド濃度が 6質 量%になるように GBL 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミンィ匕合物 の添加量はポリイミド 100質量部に対して 3質量部である。 3 g of the polyimide powder obtained in Synthesis Example 17 was dissolved in 34.5 g of GBL by stirring at 50 ° C. for 20 hours. To this solution was added 3.0 g (0.15 g as an amine compound) of 3 mass 0 / oGBL solution of triethylenetetraamine (No. 94 amine compound), and the polyimide concentration in this solution was 6%. GBL 9.5g was added so that it might become the amount%, and it stirred at 50 degreeC for 20 hours. The amount of the amine compound added at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 20で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 20質量%、 GBLが 59質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 20 to prepare a polyamic acid power of 3% by mass, NMP of 20% by mass, GBL of 59% by mass, and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 16Z66Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 16Z66Z12 by mass ratio.
[0131] {実施例 61 } [0131] {Example 61}
合成例 18で得たポリイミド粉末 3gを NMP 23.5g、 GBL 23.5g中、 50°Cにて 20h攪 拌し溶解させた。この溶液に、(アミノエチルアミノメチル)フエネチルトリメトキシシラン (No.37のァミン化合物)の 1質量0 /oGBL溶液を 3.0g (アミンィ匕合物としては 0.03g)を 添加し、さらにこの溶液中のポリイミド濃度が 5質量0 /0になるように GBL 7.0gをカロえ 5 0°Cにて 20h攪拌した。このときのアミンィ匕合物の添加量はポリイミド 100質量部に対し て 1質量部である。 3 g of the polyimide powder obtained in Synthesis Example 18 was stirred and dissolved in 23.5 g of NMP and 23.5 g of GBL at 50 ° C. for 20 hours. To this solution, (aminoethylaminomethyl) phenethyltrimethoxysilane It was added (0.03 g as Amini匕合). 1 mass 0 / OGBL solution 3.0g of (Amin compound of No.37), as further polyimide concentration in the solution becomes 5 mass 0/0 GBL 7.0 g was stirred and stirred at 50 ° C. for 20 hours. The amount of the amine compound added at this time is 1 part by mass with respect to 100 parts by mass of the polyimide.
合成例 20で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力^質量0 /0、 NMPが 17.75質量0 /0、 GBLが 52.25質量0 /0、 BCSが 25質量0 /0になるよう 調製した。 NMP to the polyamic acid solution 40g obtained in Synthesis Example 20, GBL, the BCS was added, the polyamic acid force ^ mass 0/0, NMP is 17.75 mass 0/0, GBL is 52.25 mass 0/0, BCS is 25 mass 0 / Prepared to be zero .
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 22Z53Z20である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 22Z53Z20 by mass ratio.
[0132] {実施例 62} [0132] {Example 62}
合成例 1で得たポリイミド粉末 3gを NMP 34.5g中 50°Cにて 20h攪拌し溶解させた。 この溶液に、トリエチレンテトラアミン (No.94のァミン化合物)の 3質量0 /oNMP溶液を 3 .Og (アミンィ匕合物としては 0.09g)を添加し、さらにこの溶液中のポリイミド濃度が 6質量 %になるように NMP 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミン化合物の 添加量はポリイミド 100質量部に対して 3質量部である。 3 g of the polyimide powder obtained in Synthesis Example 1 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours. To this solution was added 3.Og (0.09 g as an amine compound) of 3 mass 0 / oNMP solution of triethylenetetraamine (No.94 amin compound), and the polyimide concentration in this solution was 6 NMP 9.5g was added so that it might become mass%, and it stirred at 50 degreeC for 20 hours. At this time, the addition amount of the amine compound is 3 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 19で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 59質量%、 GBLが 20質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 19 to prepare a polyamic acid power of 3 mass%, NMP of 59 mass%, GBL of 20 mass%, and BCS of 15 mass%.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 66Z16Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 66Z16Z12 by mass ratio.
[0133] {実施例 63} [0133] {Example 63}
実施例 62にお ヽて、混合するポリアミック酸の希釈液を合成例 21で得たポリアミツ ク酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸力 ¾質量%、 NMPが 39.5質 量%、 GBLが 39.5質量%、 BCSが 15質量%になるよう調製した以外は実施例 62と 同様にして本発明の塗布液を得た。この塗布液の溶媒組成は、質量比で、 NMP/ GBL/BCS = 50. 3/31. 6Z12である。 [0134] (合成例 22) In Example 62, NMP, GBL, and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 21 as a dilute solution of the polyamic acid to be mixed, and the polyamic acid strength was ¾ mass%, NMP was 39.5 mass%, A coating solution of the present invention was obtained in the same manner as in Example 62 except that GBL was 39.5% by mass and BCS was 15% by mass. The solvent composition of this coating solution is NMP / GBL / BCS = 50.3 / 31.6Z12 by mass ratio. [Synthesis Example 22]
CBDAを 9.81g(0.05mol)と、 PMDAを 9.60g(0.044mol)と、 DA3を 19.83g(0.1mol)と を、 NMP 222g中、室温で 5時間反応させポリアミック酸溶液を調製した。このポリア ミック酸は、数平均分子量が 10,893、重量平均分子量が 25,972であった。  A polyamic acid solution was prepared by reacting 9.81 g (0.05 mol) of CBDA, 9.60 g (0.044 mol) of PMDA, and 19.83 g (0.1 mol) of DA3 in 222 g of NMP at room temperature for 5 hours. This polyamic acid had a number average molecular weight of 10,893 and a weight average molecular weight of 25,972.
[0135] {実施例 64}  [0135] {Example 64}
合成例 1で得たポリイミド粉末 3gを NMP 34.5g中、 50°Cにて 20h攪拌し溶解させた 。この溶液に、(アミノエチルアミノメチル)フエネチルトリメトキシシラン (No.37のァミン 化合物)の 10質量。/ oGBL溶液を 3.0g (アミンィ匕合物としては 0.30g)を添加し、さらに この溶液中のポリイミド濃度が 6質量0 /0になるように NMP 9.5gをカ卩え、 50°Cにて 20h 攪拌した。このときのアミンィ匕合物の添加量はポリイミド 100質量部に対して 3質量部 である。 3 g of the polyimide powder obtained in Synthesis Example 1 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours. 10 masses of (aminoethylaminomethyl) phenethyltrimethoxysilane (No. 37 amine compound) in this solution. / OGBL solution was added (0.30 g as Amini匕合product) and 3.0 g, even more NMP 9.5 g as polyimide concentration becomes 6 mass 0/0 of the solution Ka卩E at 50 ° C Stir for 20 h. The amount of the amine compound added at this time is 3 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 22で得たポリアミック酸溶液 40gに NMP、 BCSを加え、ポリアミック酸が 6質 量%、 NMPが 79質量%、 BCSが 15質量%になるよう調製した。  NMP and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 22 to prepare 6 mass% polyamic acid, 79 mass% NMP, and 15 mass% BCS.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZBCS = 82Z12である。  20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZBCS = 82Z12 in terms of mass ratio.
[0136] {実施例 65} [0136] {Example 65}
合成例 1で得たポリイミド粉末 3gを GBL 34.5g中、 50°Cにて 20h攪拌し溶解させた。 この溶液に、トリエチレンテトラアミン (No.94のアミンィ匕合物)の 2質量0 /oGBL溶液を 3. Og (アミンィ匕合物としては 0.15g)を添加し、さらにこの溶液中のポリイミド濃度が 6質量 %になるように GBL 9.5gをカ卩え、 50°Cにて 20h攪拌した。このときのアミンィ匕合物の 添加量はポリイミド 100質量部に対して 2質量部である。 3 g of the polyimide powder obtained in Synthesis Example 1 was dissolved in 34.5 g of GBL by stirring at 50 ° C. for 20 hours. To this solution, add 2 mass 0 / oGBL solution of triethylenetetraamine (No.94 amine compound) 3. Og (0.15 g as amine compound), and then add polyimide concentration in this solution GBL (9.5 g) was added so that the amount was 6 mass%, and the mixture was stirred at 50 ° C for 20 hours. The amount of the amine compound added at this time is 2 parts by mass with respect to 100 parts by mass of the polyimide.
合成例 2で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 20質量%、 GBLが 59質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid strength of 3% by mass, NMP of 20% by mass, GBL of 59% by mass and BCS of 15% by mass.
上記で調製したポリイミドとァミンィ匕合物の反応液 20gと、ポリアミック酸の希釈液 80g を混合し、室温で 20時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は 、質量比で、 NMPZGBLZBCS = 16Z66Z12である。 [0137] (合成例 23) 20 g of the reaction solution of polyimide and amine mixture prepared above and 80 g of dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain the coating solution of the present invention. The solvent composition of this coating solution is NMPZGBLZBCS = 16Z66Z12 by mass ratio. [0137] (Synthesis Example 23)
TDAを 30.03g(0.1mol)と、 DAIを 9.46g(0.0875mol)と、 DA2を 3.77g(0.01mol)と、(ァ ミノェチルアミノメチル)フエネチルトリメトキシシラン(No.37のァミン化合物)を 1.49g(0. 005mol)とを、 NMP 254g中、室温 24時間反応させポリアミック酸溶液を調製した。こ のポリアミック酸溶液 50gを NMPにより 5質量%に希釈し、さらにイミドィ匕触媒としてピリ ジン 8.0g、無水酢酸 17.1gを加え、 40°Cで 3時間反応させた。この溶液を 0.6Lのメタノ ール中に投入し、得られた沈殿物を濾別し、乾燥し、白色のポリイミド粉末を得た。得 られた溶媒に可溶なイミド化重合体は、数平均分子量が 5,951、重量平均分子量が 2 2,992であった。またイミド化率は 81%であった。  30.03 g (0.1 mol) of TDA, 9.46 g (0.0875 mol) of DAI, 3.77 g (0.01 mol) of DA2, (aminoethylaminomethyl) phenethyltrimethoxysilane (No. 37 ammine) Compound) was reacted with 1.49 g (0.005 mol) in NMP 254 g at room temperature for 24 hours to prepare a polyamic acid solution. 50 g of this polyamic acid solution was diluted to 5% by mass with NMP, and 8.0 g of pyridine and 17.1 g of acetic anhydride were further added as an imido catalyst and reacted at 40 ° C. for 3 hours. This solution was put into 0.6 L of methanol, and the resulting precipitate was filtered off and dried to obtain a white polyimide powder. The obtained imidized polymer soluble in the solvent had a number average molecular weight of 5,951 and a weight average molecular weight of 22,992. The imidation ratio was 81%.
[0138] {実施例 66}  [0138] {Example 66}
合成例 23で得たポリイミド粉末 3gを NMP 34.5g中 50°Cにて 20h攪拌し溶解させた 。その後、この溶液中のポリイミド濃度が 6質量%になるように NMP 12.5gを加え希 した。  3 g of the polyimide powder obtained in Synthesis Example 23 was dissolved in 34.5 g of NMP by stirring at 50 ° C. for 20 hours. Thereafter, 12.5 g of NMP was added and diluted so that the polyimide concentration in the solution was 6% by mass.
合成例 2で得たポリアミック酸溶液 40gに NMP、 GBL、 BCSを加え、ポリアミック酸 力 ¾質量%、 NMPが 59質量%、 GBLが 20質量%、 BCSが 15質量%になるよう調製 した。  NMP, GBL and BCS were added to 40 g of the polyamic acid solution obtained in Synthesis Example 2 to prepare a polyamic acid power of 3% by mass, NMP of 59% by mass, GBL of 20% by mass and BCS of 15% by mass.
上記で調製したポリイミド溶液 20gと、ポリアミック酸の希釈液 80gを混合し、室温で 20 時間攪拌し、本発明の塗布液を得た。この塗布液の溶媒組成は、質量比で、 NMP ZGBLZBCS = 66Z16Z12である。  20 g of the polyimide solution prepared above and 80 g of a dilute solution of polyamic acid were mixed and stirred at room temperature for 20 hours to obtain a coating solution of the present invention. The solvent composition of this coating solution is NMP ZGBLZBCS = 66Z16Z12 by mass ratio.
[0139] <吸湿安定性の評価 > [0139] <Evaluation of moisture absorption stability>
上記実施例 28〜66で調製した塗布液を用い、前記と同様に吸湿安定性の評価を 行った。その結果、これらの塗布液は 6時間経過しても凝集物は見られなカゝつた。  Using the coating solutions prepared in Examples 28 to 66, the moisture absorption stability was evaluated in the same manner as described above. As a result, these coating solutions showed no agglomeration even after 6 hours.
(液晶配向剤)  (Liquid crystal aligning agent)
上記実施例 1〜66及び、比較例 1〜5で調製した塗布液を細孔径 1 μ mのメンブラ ンフィルタで加圧濾過し、液晶配向剤とした。  The coating liquids prepared in Examples 1 to 66 and Comparative Examples 1 to 5 were pressure filtered through a membrane filter having a pore size of 1 μm to obtain a liquid crystal aligning agent.
[0140] <ラビング耐'性の評価 > [0140] <Evaluation of rubbing resistance>
液晶配向剤を ITO電極付きガラス基板にスピンコートし、 80°Cのホットプレート上で 5分間乾燥させた後、 230°Cの熱風循環式オーブンで 30分間焼成を行い、膜厚 10 Onmの塗膜を形成させた。この塗膜面をロール径 120mmのラビング装置でレーヨン 布を用いて、ロール回転数 1000rpm、ロール進行速度 50mm/sec、押し込み量 0. 3 mmの条件でラビングし、液晶配向膜付き基板を得た。この液晶配向膜の膜表面を、 レーザーテック社製リアルタイム走査型レーザー顕微鏡 1LM21D (対物レンズ 10倍 )にて観察した (モニター上での拡大倍率 340倍)。 A liquid crystal aligning agent is spin-coated on a glass substrate with an ITO electrode, dried on a hot plate at 80 ° C for 5 minutes, and then baked in a hot air circulation oven at 230 ° C for 30 minutes. An Onm coating was formed. This coating surface was rubbed with a rayon cloth with a rubbing machine having a roll diameter of 120 mm under the conditions of a roll rotation speed of 1000 rpm, a roll traveling speed of 50 mm / sec, and an indentation amount of 0.3 mm to obtain a substrate with a liquid crystal alignment film . The surface of the liquid crystal alignment film was observed with a real-time scanning laser microscope 1LM21D (objective lens 10 ×) manufactured by Lasertec (magnification magnification 340 × on the monitor).
[0141] その結果、実施例 1〜64、実施例 66の塗布液力もなる液晶配向剤を用いて得られ た液晶配向膜の表面には傷や膜の剥離は見られな力つた。比較例 1〜5の塗布液か らなる液晶配向剤を用いて得られた液晶配向膜の表面に膜の剥離は見られなかつ たものの、細かな傷が多数観察された。また、実施例 65の塗布液力もなる液晶配向 剤を用いて得られた液晶配向膜の表面は膜の剥離は見られな力つたものの細かな 傷が観察された。これは、実施例 65では溶媒可溶性ポリイミドとァミンィ匕合物とを反 応させる際の溶媒に γ —プチ口ラタトンを使用したので、ァミン化合物が γ —プチ口 ラタトンと反応して消費され、 2質量部の添加量では十分な量が溶媒可溶性ポリイミド と反応しな力つた為であると考えられる。 [0141] As a result, the surface of the liquid crystal alignment film obtained using the liquid crystal aligning agent having the coating liquid force of Examples 1 to 64 and Example 66 was strong enough to show no scratches or film peeling. Although peeling of the film was not observed on the surface of the liquid crystal alignment film obtained by using the liquid crystal aligning agent comprising the coating liquids of Comparative Examples 1 to 5, many fine scratches were observed. Further, the surface of the liquid crystal alignment film obtained using the liquid crystal aligning agent having the coating liquid force of Example 65 was observed to have fine scratches although no film peeling was observed. This is because in Example 65, γ-petit-mouth rataton was used as the solvent for reacting the solvent-soluble polyimide and the amine compound, so that the amine compound was consumed by reacting with γ-petit-mouth rataton. It is considered that a sufficient amount of the added amount by mass did not react with the solvent-soluble polyimide.
[0142] <印刷性の評価 > [0142] <Evaluation of printability>
実施例 実施例 30〜32の塗布液力もなる液晶配向剤で、次のようにフレキソ印 刷法による印刷性試験を行った。  Examples The liquid crystal aligning agents having the coating liquid power of Examples 30 to 32 were subjected to a printability test by the flexographic printing method as follows.
印刷機:日本写真印刷社製 Angstromer S- 15  Printer: Nissha Printing Angstromer S-15
印刷版: 400メッシュの APR版  Printed version: 400 mesh APR version
印刷条件: -ップ幅は 0.2mmとした。タクト時間を 30secとし、初めに 100mm X 100mm のガラス基板 6枚に印刷した後、同サイズの Cr製膜ガラス基板 4枚に印刷した。最後 に印刷した基板をホットプレート上、 80°Cで 5分間乾燥させ、倍率 50倍の顕微鏡で観 Printing conditions:-The width of the pop was 0.2 mm. The tact time was set to 30 seconds, and printing was first performed on six 100 mm × 100 mm glass substrates, followed by printing on four Cr film-formed glass substrates of the same size. Finally, the printed substrate is dried on a hot plate at 80 ° C for 5 minutes and viewed with a microscope at 50x magnification.
¾πίした。 ¾πί.
その結果、実施例 実施例 30の塗布液力もなる液晶配向剤は、他の 2つの液晶 配向剤よりも、膜厚の面内均一性に優れていた。  As a result, the liquid crystal aligning agent having the coating solution power of Example 30 was superior in in-plane film thickness uniformity to the other two liquid crystal aligning agents.
[0143] (液晶表示素子の作成と電気特性の評価) [0143] (Production of liquid crystal display element and evaluation of electrical characteristics)
液晶配向剤を ΙΤΟ電極付きガラス基板にスピンコートし、 80°Cのホットプレート上で 5分間乾燥させた後、 230°Cの熱風循環式オーブンで 30分間焼成を行い、膜厚 10 Onmの塗膜を形成させた。この塗膜面をロール径 120mmのラビング装置でレーヨン 布を用いて、ロール回転数 1000rpm、ロール進行速度 50mm/sec、押し込み量 0. 3 mmの条件でラビングし、液晶配向膜付き基板を得た。 A liquid crystal aligning agent is spin-coated on a glass substrate with a ΙΤΟ electrode, dried on a hot plate at 80 ° C for 5 minutes, and then baked in a hot air circulation oven at 230 ° C for 30 minutes. An Onm coating was formed. The coated surface was rubbed with a rayon cloth using a rubbing machine having a roll diameter of 120 mm under the conditions of a roll rotation speed of 1000 rpm, a roll traveling speed of 50 mm / sec, and an indentation amount of 0.3 mm to obtain a substrate with a liquid crystal alignment film. .
[0144] この液晶配向膜付き基板を 2枚用意し、その 1枚の液晶配向膜面上に 6 μ mのスぺ 一サーを散布した後、その上力もシール剤を印刷し、もう 1枚の基板を液晶配向膜面 が向き合いラビング方向が直行するようにして張り合わせた後、シール剤を硬化させ て空セルを作製した。この空セルに減圧注入法によって、液晶 MLC-2003 (メルク'ジ ャパン社製)を注入し、注入口を封止して、ツイストネマティック液晶セルを得た。 実施例 1〜65及び、比較例 1〜5の塗布液力 なる液晶配向剤を使用し、上記のよ うにして作製した液晶セルを偏光顕微鏡下で観察したところ、全ての液晶セルで液 晶は均一に配向していた。 [0144] Prepare two substrates with this liquid crystal alignment film, spray a 6 μm spacer on the surface of one liquid crystal alignment film, and then print another sealant with the upper force. The substrates were laminated so that the liquid crystal alignment film faces each other and the rubbing direction was orthogonal, and then the sealing agent was cured to produce an empty cell. Liquid crystal MLC-2003 (manufactured by Merck Japan Co., Ltd.) was injected into this empty cell by a reduced pressure injection method, and the injection port was sealed to obtain a twisted nematic liquid crystal cell. Using the liquid crystal aligning agent having the coating liquid force of Examples 1 to 65 and Comparative Examples 1 to 5, the liquid crystal cells produced as described above were observed under a polarizing microscope. Were uniformly oriented.
[0145] <電圧保持率の評価 > [0145] <Evaluation of voltage holding ratio>
上記で作製した液晶セルを、東陽テク-力社製 VHR— 1電圧保持率測定装置を 使用し、温度 90。C、 voltage: ±4V、 pulse width : 60 μ s、 flame period: 16.67msの 設定で測定し、 90°Cの温度下で 4VZ60 sの電圧力 16.6ms後にどのくらい保持 できて 、るかを電圧保持率として計算した。  The temperature of the liquid crystal cell produced above is 90 using the VHR-1 voltage holding ratio measuring device manufactured by Toyo Tech-Riki. C, voltage: ± 4V, pulse width: 60 μs, flame period: measured at a setting of 16.67ms, voltage holding of how much can be maintained after 16.6ms of voltage force of 4VZ60s at a temperature of 90 ° C Calculated as a rate.
その結果を以下に示す。  The results are shown below.
[0146] [表 13] [0146] [Table 13]
塗布液 電圧保持率 電圧保持率 塗 電圧保持率 実施例 1 94¾ 実施例 2 6 94¾ 実施例 5 1 93¾ Coating liquid Voltage holding ratio Voltage holding ratio Coating voltage holding ratio Example 1 94¾ Example 2 6 94¾ Example 5 1 93¾
実施例 2 93¾ 実施例 2 7 94¾ 実施例 5 2 93¾  Example 2 93¾ Example 2 7 94¾ Example 5 2 93¾
実施例 3 93% 実施例 2 8 94% 実施例 5 3 93¾  Example 3 93% Example 2 8 94% Example 5 3 93¾
実施例 4 93¾ 実施例 2 9 94¾ 実施例 5 4 93¾  Example 4 93¾ Example 2 9 94¾ Example 5 4 93¾
実施例 5 93% 実施例 3 0 94¾ 実施例 5 5 93¾  Example 5 93% Example 3 0 94¾ Example 5 5 93¾
実施例 6 94¾ 実施例 3 1 94¾ 実施例 5 6 93¾  Example 6 94¾ Example 3 1 94¾ Example 5 6 93¾
実施例 7 95¾ 実施例 3 2 94¾ 実施例 5 7 93¾  Example 7 95¾ Example 3 2 94¾ Example 5 7 93¾
実施例 8 94¾ 実施例 3 3 94¾ 実施例 5 8 93%  Example 8 94¾ Example 3 3 94¾ Example 5 8 93%
実施例 9 95¾ 実施例 3 4 94¾ 実施例 5 9 93¾  Example 9 95¾ Example 3 4 94¾ Example 5 9 93¾
実施例 1 0 94¾ 実施例 3 5 94¾ 実施例 6 0 95¾  Example 1 0 94¾ Example 3 5 94¾ Example 6 0 95¾
実施例 1 1 95¾ 実施例 3 6 94¾ 実施例 6 1 95¾  Example 1 1 95¾ Example 3 6 94¾ Example 6 1 95¾
実施例 1 2 93¾ 実施例 3 7 94¾ 実施例 6 2 94¾  Example 1 2 93¾ Example 3 7 94¾ Example 6 2 94¾
実施例 1 3 94¾ 実施例 3 8 94¾ 実施例 6 3 94¾  Example 1 3 94¾ Example 3 8 94¾ Example 6 3 94¾
実施例 1 4 95¾ 実施例 3 9 94¾ 実施例 6 4 95¾  Example 1 4 95¾ Example 3 9 94¾ Example 6 4 95¾
実施例 1 5 94¾ 実施例 4 0 94¾ 実施例 6 5 93¾  Example 1 5 94¾ Example 4 0 94¾ Example 6 5 93¾
実施例 1 6 95¾ 実施例 4 1 94¾ 実施例 6 6 94X  Example 1 6 95¾ Example 4 1 94¾ Example 6 6 94X
実施例 1 7 94¾ 実施例 4 2 94¾ 比較例 1 93%  Example 1 7 94¾ Example 4 2 94¾ Comparative Example 1 93%
実施例】 8 94¾ 実施例 4 3 94¾ 比铰例 2 93%  Example 8 94¾ Example 4 3 94¾ Comparative Example 2 93%
実施例 1 9 95¾ 実施例 4 4 94¾ 比較例 3 93¾  Example 1 9 95¾ Example 4 4 94¾ Comparative Example 3 93¾
実施例 2 0 94¾ 実施例 4 5 94¾ 比較例 4 93¾  Example 2 0 94¾ Example 4 5 94¾ Comparative Example 4 93¾
実施例 2 1 94¾ 実施例 4 6 94¾ 比較例 5 93¾  Example 2 1 94¾ Example 4 6 94¾ Comparative Example 5 93¾
実施例 2 2 93¾ 実施例 4 7 93¾  Example 2 2 93¾ Example 4 7 93¾
実施例 2 3 93¾ 実施例 4 8 94¾  Example 2 3 93¾ Example 4 8 94¾
実施例 2 4 93¾ 実施例 4 9 94¾  Example 2 4 93¾ Example 4 9 94¾
実施例 2 5 94¾ 実施例 5 0 94¾  Example 2 5 94¾ Example 5 0 94¾
[0147] <蓄積電荷の抜け易さの評価 > [0147] <Evaluation of easy removal of accumulated charge>
上記液晶セルのうち、実施例 4の塗布液カゝらなる液晶配向剤の液晶セル (本発明 の液晶表示素子)と、比較例 1の塗布液力 なる液晶配向剤の液晶セル (比較の液 晶表示素子)とで、次のようにして蓄積電荷の抜け易さを比較した。  Among the above liquid crystal cells, the liquid crystal cell of the liquid crystal aligning agent (liquid crystal display element of the present invention) that is the coating liquid of Example 4 and the liquid crystal cell of the liquid crystal aligning agent that is the coating liquid force of Comparative Example 1 (the liquid for comparison) The crystal display element) was compared with the ease of stored charge release as follows.
液晶セルに直流電圧 10Vを 30分印加し、 1秒短絡させた後、液晶セル内に発生して Vヽる電位 (蓄積電荷)の変化を東陽テク-力社製 6254型液晶物性評価装置を用い測 定した。その結果、本発明の液晶表示素子は、比較の液晶表示素子に比べて、蓄積 電荷の最大値が小さぐまた電荷の減少も早力つた。この電位変化のグラフを図 1に 示す。  After applying a DC voltage of 10V to the liquid crystal cell for 30 minutes and short-circuiting it for 1 second, a change in the potential (accumulated charge) generated in the liquid crystal cell and the V charge (stored charge) Measured using. As a result, in the liquid crystal display element of the present invention, the maximum value of the accumulated charge was smaller than that of the comparative liquid crystal display element, and the decrease in the charge was quick. Figure 1 shows a graph of this potential change.
産業上の利用可能性  Industrial applicability
[0148] 本発明の塗布液によれば、吸湿による榭脂成分の析出が抑制され、安定した印刷 性を得ることができ、液晶配向剤として好適に用いることができる。また、本発明の液 晶配向膜は、従来よりも高品位の液晶表示素子を得ることができ、この液晶表示素子 は種々の表示装置に好適に使用することができる。 なお、 2006年 7月 18曰に出願された曰本特許出願 2006— 195403号の明細書 、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開 示として、取り入れるものである。 [0148] According to the coating solution of the present invention, precipitation of the rosin component due to moisture absorption can be suppressed, stable printability can be obtained, and it can be suitably used as a liquid crystal aligning agent. In addition, the liquid crystal alignment film of the present invention can provide a liquid crystal display element of higher quality than before, and this liquid crystal display element can be suitably used for various display devices. It should be noted that the entire contents of the specification, claims, drawings and abstract of the Japanese Patent Application No. 2006-195403, filed on July 18, 2006, are hereby incorporated herein by reference. As it is incorporated.

Claims

請求の範囲 [1] (A)成分:テトラカルボン酸二無水物、ジァミンィ匕合物、下記のアミンィ匕合物(a)、ァ ミン化合物 (b)及びアミン化合物(c)力 なる群力 選ばれる少なくとも一種のァミン 化合物から得られる溶媒に可溶なイミドィヒ重合体と、 (B)成分:ポリアミック酸とを含有 することを特徴とする塗布液。 ァミン化合物(a):分子内に、式 [K1]及び式 [K2]から選ばれる一級アミノ基を 1個と 、式 [K3]及び式 [K4]から選ばれるイミノ基を少なくとも 1個有するアミンィ匕合物。な お、式 [K3]と式 [K4]では、—CH—NH—の結合方向が逆の関係にある。 2 アミンィ匕合物 (b):分子内に、上記式 [K1]及び式 [K2]から選ばれる一級アミノ基 を少なくとも 2個有するアミンィ匕合物。 アミンィ匕合物(c):分子内に式 [K1 ]及び式 [K2]力も選ばれる一級アミノ基を少なく とも 1個と、式 [K3]及び式 [K4]カゝら選ばれるイミノ基を少なくとも 1個有するアミンィ匕 合物。 Claim [1] Component (A): tetracarboxylic dianhydride, diamine compound, amine compound (a), amine compound (b) and amine compound (c) A coating solution comprising: an imidi polymer soluble in a solvent obtained from at least one amine compound, and a component (B): a polyamic acid. Amine compound (a): an amine compound having one primary amino group selected from formula [K1] and formula [K2] and at least one imino group selected from formula [K3] and formula [K4] in the molecule Compound. Note that in the formulas [K3] and [K4], the bonding direction of —CH—NH— is opposite. 2 Amine compound (b): Amine compound having at least two primary amino groups selected from the above formulas [K1] and [K2] in the molecule. Amine compound (c): At least one primary amino group of formula [K1] and formula [K2] force in the molecule and an imino group of formula [K3] and formula [K4] Amine compound having at least one.
[化 1]  [Chemical 1]
H2N-CH2— H2N-CH— [Kl] [K2] H 2 N-CH 2 — H 2 N-CH— [Kl] [K2]
— CH2-NH— — NH-CH2— CH 2 -NH— — NH-CH 2
[K3] [ 4]  [K3] [4]
[2] (Α)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力も得られる溶媒可溶性 ポリイミドの側鎖及び分子末端のうちの少なくとも一方と、前記アミンィ匕合物(a)及び ァミン化合物 (b)力も選ばれる少なくとも一種のアミンィ匕合物とが結合して得られる溶 媒に可溶なイミド化重合体である請求項 1に記載の塗布液。 [2] The component (ii) is a solvent-soluble polyimide that can also obtain the ability of a tetracarboxylic dianhydride and diamine compound, and at least one of the side chain and molecular end of the polyimide, the amine compound (a), and the amine compound 2. The coating solution according to claim 1, wherein the coating solution is an imidized polymer that is soluble in a solvent obtained by binding (b) at least one amine compound that also has a selected force.
[3] (A)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力も得られる溶媒可溶性 ポリイミドに、前記アミン化合物(a)及びアミンィ匕合物 (b)から選ばれる少なくとも一種 のアミンィ匕合物を反応させて得られる生成物である請求項 1に記載の塗布液。  [3] The component (A) is a solvent-soluble polyimide capable of obtaining a compound strength of tetracarboxylic dianhydride and diamine compound, and at least one amine compound selected from the amine compound (a) and amine compound (b). 2. The coating solution according to claim 1, which is a product obtained by reacting the compound.
[4] (A)成分が、テトラカルボン酸二無水物とアミンィ匕合物(c)を含むジァミン化合物と を反応させたポリイミド前駆体をイミドィ匕して得られる溶媒に可溶なイミドィ匕重合体で ある請求項 1に記載の塗布液。 [4] The component (A) is a diamine compound containing a tetracarboxylic dianhydride and an amine compound (c); 2. The coating solution according to claim 1, wherein the coating solution is an imidopolymer soluble in a solvent obtained by imidizing a polyimide precursor obtained by reacting with.
[5] (A)成分が、前記アミンィ匕合物(a)として、下記式 (i)及び (ii)で表されるアミンィ匕合 物から選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に可溶なイミド 化重合体である請求項 1に記載の塗布液。 [5] The component (A) is obtained by using at least one amine compound selected from the amine compounds represented by the following formulas (i) and (ii) as the amine compound (a). The coating solution according to claim 1, which is an imidized polymer soluble in a solvent to be obtained.
[化 2]  [Chemical 2]
H2N— R1— X -CHQ-N ~ X2 ( i ) H 2 N— R 1 — X -CHQ-N ~ X 2 (i)
H  H
H2N— R1— X1— N— CH2— X2 ( ϋ ) H 2 N— R 1 — X 1 — N— CH 2 — X 2 (ϋ)
H  H
〔ただし、式中の R1は、 CH CH (CH ) もしくは一 CH (CH CH )—のァ [However, R 1 in the formula is CH CH (CH) or one CH (CH CH) —
2 3 2 3 ルキレン、又は脂肪族環を表し、 X1は、単結合又は炭素原子数 1〜20の脂肪族炭 化水素を表し、かつ脂肪族炭化水素中に— NH を含んでいてもよい。また、 X2は 炭素原子数 1〜20の有機基を表し、炭素原子数 1〜20のアルキル基、環状脂肪族 基、芳香族基、複素環基、カルボキシル基及びこれらの組み合わせからなる有機基 で、かつ、不飽和結合、エーテル結合(一 O )、ケトン結合(一 CO )、エステル結 合(一 COO )、ァミノ結合(一 NH )、ァミン結合(一 N )、シリル結合(一 Si—)、 シロキサン結合( SiO )などを含んでいてもよい。さらに、 X2のアルキル基が— R1 X1 -CH 及び NH のいずれかと複素環状構造を形成していても 2 3 2 3 represents alkylene or an aliphatic ring, X 1 represents a single bond or an aliphatic hydrocarbon having 1 to 20 carbon atoms, and —NH 2 may be included in the aliphatic hydrocarbon. . X 2 represents an organic group having 1 to 20 carbon atoms, and an organic group comprising an alkyl group having 1 to 20 carbon atoms, a cycloaliphatic group, an aromatic group, a heterocyclic group, a carboxyl group, and a combination thereof. And unsaturated bonds, ether bonds (one O), ketone bonds (one CO), ester bonds (one COO), amino bonds (one NH), ammine bonds (one N), silyl bonds (one Si— ), A siloxane bond (SiO 2), or the like. Further, even if the alkyl group of X 2 forms a heterocyclic structure with either —R 1 X 1 —CH 2 or NH 3
2  2
よい。〕  Good. ]
[6] (A)成分が、前記アミンィ匕合物 (b)として、下記式 (m)から (V)で表されるァミン化合 物から選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に可溶なイミド 化重合体である請求項 1に記載の塗布液。  [6] The component (A) is obtained by using, as the amine compound (b), at least one amine compound selected from the amine compounds represented by the following formulas (m) to (V): 2. The coating solution according to claim 1, which is an imidized polymer soluble in a solvent.
[化 3] H2N— R1— X3— R1— NH2 ( iii ) [Chemical 3] H 2 N— R 1 — X 3 — R 1 — NH 2 (iii)
H2N— RLX4— NH— X5— R1— NH2 ( iv ) H 2 N— RL X 4— NH— X 5 — R 1 — NH 2 (iv)
H2N— R1— X6-NH— X7-NH— X8-R1― NH2 ( v ) H 2 N— R 1 — X 6 -NH— X 7 -NH— X 8 -R 1 ― NH 2 (v)
〔ただし、式中の R1は、 CH —、 一 CH (CH ) 一、もしくは一 CH (CH CH )—のァ [However, R 1 in the formula is CH —, one CH (CH 2) one, or one CH (CH 2 CH 2) —
2 3 2 3 ルキレン、又は脂肪族環を表し、 H ?^ 1^ーとー1^ ?《1の R1は同一でも異なって 2 3 2 3 Represents lucylene or an aliphatic ring, and H? ^ 1 ^-and -1 ^? << 1 R 1 are the same or different
2 2  twenty two
いてもよい。 X3は、単結合、又は炭素原子数 1〜20の有機基を表し、炭素原子数 1 〜20のアルキレン、脂肪族環、芳香族環、複素環及びこれらの組み合わせ力 なる 有機基で、かつ、不飽和結合、エーテル結合(一 0— )、ケトン結合(一 CO )、エス テル結合( COO )、チォエーテル結合(一 S )、シリル結合(一 Si—)、シロキサ ン結合(一 SiO )などを含んでいてもよい。 x4、 x5、 X6、 X7及び X8は、それぞれ独 立に炭素原子数 1〜20の脂肪族炭化水素を表し、それぞれ同一でも異なっていても よい。〕 May be. X 3 represents a single bond or an organic group having 1 to 20 carbon atoms, an alkylene group having 1 to 20 carbon atoms, an aliphatic ring, an aromatic ring, a heterocyclic ring, and an organic group having a combination force thereof, and , Unsaturated bond, ether bond (one 0—), ketone bond (one CO), ester bond (COO), thioether bond (one S), silyl bond (one Si—), siloxane bond (one SiO), etc. May be included. x 4 , x 5 , X 6 , X 7 and X 8 each independently represent an aliphatic hydrocarbon having 1 to 20 carbon atoms, and may be the same or different. ]
[7] (A)成分が、前記アミンィ匕合物 (c)として、下記式 (i)、 (ii)、(iv)及び (v)で表される ァミン化合物力 選ばれる少なくとも一種のアミンィ匕合物を用いて得られる溶媒に可 溶なイミドィ匕重合体である請求項 1に記載の塗布液。  [7] The component (A) is at least one amine compound selected from the following formulas (i), (ii), (iv) and (v) as the amine compound (c): 2. The coating solution according to claim 1, which is an imidopolymer soluble in a solvent obtained using the compound.
[化 4]
Figure imgf000063_0001
[Chemical 4]
Figure imgf000063_0001
H2N— R1— X1— N— CH2— X2 ( ϋ ) H 2 N— R 1 — X 1 — N— CH 2 — X 2 (ϋ)
H  H
[化 5] [Chemical 5]
H2N— R^-X4— NH— X5— R1— NH2 ( iv ) H2N— R1— X6 - NH— X7_NH— X8 - R1— NH2 ( v ) H 2 N— R ^ -X 4 — NH— X 5 — R 1 — NH 2 (iv) H 2 N— R 1 — X 6 -NH— X 7 _NH— X 8 -R 1 — NH 2 (v)
[8] (A)成分のイミド化重合体と (B)成分のポリアミック酸の比率力 (A)成分と (B)成 分の合計質量中、(B)成分のポリアミック酸の比率が 20〜99質量%である請求項 1 、 2、及び 4〜7のいずれかに記載の塗布液。 [8] Ratio power of imidized polymer of component (A) and polyamic acid of component (B) Component (A) and component (B) The coating solution according to any one of claims 1, 2, and 4 to 7, wherein the ratio of the polyamic acid of the component (B) is 20 to 99% by mass in the total mass of the component.
[9] (A)成分が、テトラカルボン酸二無水物とジァミンィ匕合物力も得られる溶媒可溶性 ポリイミド 100質量部に対して、前記アミンィ匕合物(a)及びアミンィ匕合物 (b)から選ば れる少なくとも一種のアミンィ匕合物を 1〜15質量部反応させた生成物である請求項 3 に記載の塗布液。 [9] The component (A) is composed of the amine compound (a) and the amine compound (b) with respect to 100 parts by mass of the solvent-soluble polyimide capable of obtaining a tetracarboxylic dianhydride and diamine compound. 4. The coating solution according to claim 3, which is a product obtained by reacting 1 to 15 parts by mass of at least one selected amine compound.
[10] (A)成分が、テトラカルボン酸二無水物と、前記で表されたアミンィ匕合物 (c)を含む ジァミンとを反応させたポリイミド前駆体をイミドィ匕して得られる溶媒に可溶なイミドィ匕 重合体にお 、て、アミンィ匕合物(c)の量が、ジァミンとアミンィ匕合物(c)を合わせた合 計量中 lmol%〜15mol%である請求項 4又は 7に記載の塗布液。  [10] The component (A) can be used as a solvent obtained by imidizing a polyimide precursor obtained by reacting a tetracarboxylic dianhydride and a diamine containing the above-described amine compound (c). The amount of the amine compound (c) in the soluble imido polymer is from 1 mol% to 15 mol% in the combined amount of diamine and amine compound (c). The coating liquid as described.
[11] 請求項 1〜10のいずれかに記載の塗布液力もなる液晶配向剤。 [11] A liquid crystal aligning agent that also has a coating liquid force according to any one of claims 1 to 10.
[12] アミド系溶媒が塗布液中に 50質量%以上含有する請求項 11に記載の液晶配向剤 12. The liquid crystal aligning agent according to claim 11, wherein the amide solvent is contained in the coating solution in an amount of 50% by mass or more.
[13] 請求項 11又は 12に記載の液晶配向剤を用いて得られる液晶配向膜。 [13] A liquid crystal alignment film obtained by using the liquid crystal aligning agent according to claim 11 or 12.
[14] 請求項 13に記載の液晶配向膜を用いた液晶表示素子。 14. A liquid crystal display device using the liquid crystal alignment film according to claim 13.
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