WO2008010280A1

WO2008010280A1 - Plasma display

Info

Publication number: WO2008010280A1
Application number: PCT/JP2006/314396
Authority: WO
Inventors: Shuhei Miyoshi; Kuninori Suzuki; Akito Tanokuchi
Original assignee: Hitachi, Ltd.; Hitachi Plasma Display Limited
Priority date: 2006-07-20
Filing date: 2006-07-20
Publication date: 2008-01-24

Abstract

Disclosed is a plasma display characterized by comprising a plasma display panel provided with a plurality of electrodes, a chassis (2) to which the plasma display panel is fixed, a drive circuit arranged on the chassis for driving the electrodes of the plasma display panel, a flexible substrate (31) mounting connection wiring for the electrodes of the plasma display panel and the drive circuit, a conductive substrate (32) fixed to the flexible substrate, a hold member (402) for holding and fixing the conductive substrate to the chassis movably in the plane direction of the chassis, and a metal spring (401) for electrically connecting the chassis and the conductive substrate.

Description

Specification

Plasma display device

Technical field

[0001] The present invention relates to a plasma display device.

Background art

[0002] In a basic configuration of a plasma display device, a plasma display panel (PDP) is bonded and fixed to a chassis with an adhesive layer, and a circuit unit for driving electrodes of the PDP is provided on the rear side of the chassis. (Drive circuit) and the like are arranged. The PDP extreme portion and the drive circuit are electrically connected using a driver module composed of, for example, a flexible board (flexible printed circuit board) and a metal plate (also referred to as a driver board).

As a driver module, in particular, an address driver module that connects an address drive circuit and an address electrode of a PDP is provided. In addition, the electrical connection by this driver module is divided into a plurality of driver modules corresponding to electrode groups.

[0004] The flexible substrate is mounted with wiring, ICs, and the like that connect the drive circuit side and the PDP electrode side. The flexible substrate is held and fixed in a curved shape to connect the end portion on the PDP side and the end portion of the drive circuit on the chassis side. The metal plate is in close contact with the flexible substrate so as to hold and fix the flexible substrate with respect to the chassis or the like, and is attached to the chassis structure by screws or the like. The metal plate is a member having functions and roles such as holding and fixing the driver module and the flexible substrate, heat radiation from the IC (semiconductor integrated circuit) of the flexible substrate, and grounding.

[0005] The configuration of the conventional driver module and its mounting portion related to the mounting in the chassis, PDP, and address driver module has the following.

[0006] Firstly, as a general configuration, a metal plate constituting an address driver module and a mounting portion (a boss portion or the like) on the chassis structure corresponding to the metal plate are mainly two for one metal plate. The connection is fixed by screwing and fastening at locations (near both ends). [0007] Secondly, there is a configuration in which screwing and positioning pins are used in combination. For example, the technology described in Patent Document 1 below is a structure in which the position of one board of a driver module is fixed by screwing at one end and a positioning pin is used at the other end.

[0008] Regarding the holding and fixing of the driver module and the flexible substrate in the plasma display device, it is necessary to determine the position with high accuracy and to stably hold and fix it, in particular, in order to reduce stress on the flexible substrate. In particular, the number of electrodes and driver modules tends to increase as the resolution of PDPs increases, and high-precision and inexpensive driver modules are required to cope with this.

[0009] When the address board is fixed to the chassis with screws, when the chassis expands and contracts due to thermal expansion, the address board does not move with respect to the chassis, so the positional relationship between the PDP and the address board changes. This puts stress on the flexible board that connects the address board and the PDP, causing the pattern in the flexible board to break.

[0010] Patent Document 1: Japanese Patent Application Laid-Open No. 2004-258473

Disclosure of the invention

An object of the present invention is to provide a plasma display device capable of preventing stress from being applied to a flexible substrate connected to an electrode of a plasma display panel even if the chassis expands and contracts due to thermal expansion. It is.

[0012] According to one aspect of the present invention, a plasma display panel in which a plurality of electrodes are formed, a chassis to which the plasma display panel is fixed, and an electrode disposed on the chassis for driving the electrodes of the plasma display panel A movable substrate mounted thereon, a flexible substrate on which the electrodes of the plasma display panel and connection wiring of the driver circuit are mounted, a conductive substrate fixed to the flexible substrate, and movable in the plane of the chassis There is provided a plasma display device comprising: a holding portion for holding and fixing to the chassis; and a metal panel for electrically connecting the chassis and the conductive substrate.

Brief Description of Drawings

FIG. 1 is a diagram showing a configuration example of a plasma display device. FIG. 2 is a diagram showing an example of the structure of a plasma display panel.

FIG. 3 is a diagram showing a planar configuration example of an address driver module.

FIG. 4 is a view showing a state where the address board according to the first embodiment of the present invention is held and fixed to the chassis.

[5] FIG. 5 is a diagram showing a state in which the address board according to the first embodiment is attached to the chassis.

FIG. 6 is a view showing a cross section of the address substrate according to the first embodiment in the long side direction (the PDP display region direction).

FIG. 7 is a view showing a cross section in the short side direction (the column direction of the PDP display area) of the address substrate according to the first embodiment.

FIG. 8 is a view showing a state in which an address board according to a second embodiment of the present invention is held and fixed to a chassis.

FIG. 9 is a diagram showing a state where the address board according to the second embodiment is attached to the chassis.

FIG. 10 is a view showing a cross section in the long side direction (the row direction of the PDP display region) of the address substrate according to the second embodiment.

FIG. 11 is a view showing a cross section in the short side direction (column direction of the PDP display area) of the address substrate according to the second embodiment.

FIG. 12 is a view showing a state in which an address board according to a third embodiment of the present invention is held and fixed to a chassis.

FIG. 13 is a diagram showing a state where an address board according to a third embodiment is attached to a chassis.

FIG. 14 is a view showing a cross section in the long side direction (the row direction of the PDP display region) of the address substrate according to the third embodiment.

FIG. 15 is a view showing a cross section in the short side direction (column direction of the PDP display region) of the address substrate according to the third embodiment.

FIG. 16 is a view showing a state in which an address board according to a fourth embodiment of the present invention is held and fixed to the chassis. FIG. 17 is a view showing a state in which the address board according to the fourth embodiment is attached to the chassis.

FIG. 18 is a view showing a cross section in the long side direction (the row direction of the PDP display area) of the address substrate according to the fourth embodiment.

FIG. 19 is a view showing a cross section in the short side direction (column direction of the PDP display area) of the address substrate according to the fourth embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

[0014] (First embodiment)

FIG. 1 is a diagram showing a configuration example of the plasma display device 100 according to the first embodiment of the present invention, and particularly shows an arrangement configuration of a drive circuit and the like as viewed from the back side of the plasma display device 100. FIG. 2 shows an example of the structure of a plasma display panel (hereinafter referred to as PDP) 1. FIG. 3 is a diagram showing a planar configuration example of the address driver module (hereinafter referred to as ADM) 3. 4 and 5 are diagrams showing a configuration example of attachment of the ADM 3. FIG. 6 and 7 are diagrams showing an example of a cross-sectional configuration in the vicinity of the attachment portion of the ADM 3

In FIG. 1, a plasma display device 100 mainly includes a PD P1 that is a display unit on the front side, and a chassis (base chassis) 2 on the back side that holds PDP1, and includes an address electrode on the PDP1 side. This is a configuration having an AD M3 which is a driver module for connecting the group and the drive circuit on the chassis 2 side.

[0016] In the plasma display device 100, the PDP 1 is attached and fixed to the chassis 2 via an adhesive layer (for example, a double-sided tape divided into a plurality of regions) during device manufacture and assembly. Is configured by being attached and connected. The plasma display device 100 is further incorporated into an external housing or the like to constitute a product set.

[0017] The PDP 1 and the chassis 2 are substantially rectangular planar plate-like structures. A circuit part (driving circuit) is configured on the two chassis surfaces (back surface side) with a predetermined structure. The circuit section includes an X (maintenance) drive circuit 101, a Y (scan) drive circuit 102, first and second address drive circuits 103, a control circuit 104, a power supply circuit 105, and the like. [0018] The power supply circuit 105 supplies power to each circuit. The control circuit 104 controls the entire plasma display device, and is connected to each of the drive circuits 101, 102, 103, and generates and outputs a drive control signal based on a display signal, a control clock, and the like. Each drive circuit 101, 102, 103 is electrically connected to a corresponding type of electrode group on the PDP1 side. The X drive circuit 101 applies a drive voltage to the X electrode 21. The Y drive circuit 102 applies a drive voltage to the Y electrode 22. The address drive circuit 103 applies a drive voltage to the address electrode 23.

[0019] The address board 32 of the ADM 3 is connected to the two surfaces of the chassis, and the ADM 3 is held and fixed. The attachment position of the ADM 3 is roughly the area of the long side of each of the upper and lower sides of the chassis 2. A plurality of ADMs 3 are arranged in an alignment with the address drive circuit 103. A plurality of ADMs 3 are connected to the first and second address drive circuits 103, respectively, and are connected to the address electrodes 23 of the PDP 1 through the ADM 3. In the present embodiment, a total of 16 ADM3s are arranged, 8 on the upper and lower sides.

Note that the ADM 3 and its address board (metal plate) 32 are different from the board of the address drive circuit 103 from which a plurality of ADMs 3 are connected. The two upper and lower address drive circuits 103 correspond to a configuration in which the address electrodes 23 in the display area of the PDP 1 are driven and controlled in two parts. However, the present invention is not limited to this, and a single address driving circuit can be configured. Further, although not shown, the X drive circuit 101 and the Y drive circuit 102 are connected to the corresponding X electrode 21 and Y electrode 22 side of the PDP 1 through a flexible substrate or the like. This can be applied to the same characteristic configuration as that of ADM3 when considering a configuration in which the PDP 1 is connected to the corresponding X electrode 21 and Y electrode 22 groups via the driver module.

The address drive circuit 103 is a circuit board that transmits a drive control signal based on the signal generated by the control circuit 104 to each ADM 3. The components on the address drive circuit 103 are mainly circuits for stabilizing the operation. Direct and individual driving of the address electrodes 23 of the PDP 1 is performed by the driver IC 33 mounted on the flexible substrate 31 from the ADM 3 arranged corresponding to the group of the address electrodes 23. In each ADM 3, the driver IC 33 performs driving for causing the display cell group of the PDP 1 to emit light (light on), particularly driving of the address electrode 23 group (address driving), in accordance with the driving control signal from the address driving circuit 103. That is, the driver IC 33 generates a drive signal (voltage waveform) for driving the address electrode 23 (address drive) corresponding to the PDP 1 based on the drive control signal from the address drive circuit 103, and performs the target through the wiring. Applied to address electrode 23. In the address drive, a voltage is applied to the target address electrode 23 and the Y electrode 22 to generate a discharge for selecting a lighting display cell.

With reference to FIG. 2, an example structure of PDP 1 will be described. The PDP 1 is configured by bonding a front plate 11 side portion (front surface portion 201) mainly made of glass and a back plate 12 side portion (back surface portion 202).

[0023] A plurality of X (sustain) electrodes 21 and Y (scan) electrodes 22 for sustaining (sustaining) discharge for display and the like are substantially parallel to the first (lateral) direction on the front plate 11 of the front surface portion 201. Alternatingly arranged. The display electrodes X electrode 21 and Y electrode 22 group are covered with a first dielectric layer 13, and the surface of the first dielectric layer 13 is further covered with a protective layer 14 such as MgO. Yes. The X electrode 21 and the Y electrode 22 are each composed of, for example, a linear metal bus electrode and a transparent electrode that is electrically connected to the electrode to generate a discharge.

A plurality of address electrodes 23 are arranged on the back plate 12 of the back surface portion 202 substantially parallel to the second (vertical) direction substantially perpendicular to the X electrode 21 and the Y electrode 22. The second dielectric layer 15 is covered. On both sides of the address electrode 23, partition walls 16 extending in the second direction are arranged to separate the column direction of the PDP1 display area and the display cells. Furthermore, phosphors of various colors that generate red (R), green (G), and blue (B) visible light are excited on the dielectric layer 15 surface of the address electrode 23 and the side surface of the partition wall 16 by ultraviolet rays. 17 is applied separately. A display line (row) is formed by a combination of the X electrode 21 and the Y electrode 22, and a display cell is formed corresponding to a region where the display line and the address electrode 23 intersect and are separated by the partition wall 16. The display area of PDP 1 is configured by a matrix of display cells.

[0025] The front plate 11 side and the back plate 12 side are bonded together so that the protective layer 14 and the upper surface of the partition 16 are in contact with each other, and a discharge gas such as Ne, Xe, etc. is sealed in the PDP 1. Each electrode group of PDP1 is pulled out to the vicinity of the end of PDP1 outside the sealing area, and connected to the drive circuit side on the back of chassis 2 through a flexible substrate of the driver module.

In FIG. 3, a configuration example of the ADM 3 will be described. In Figure 3, the dry IC inside ADM3 Viewed from the side where 33 is placed. The ADM 3 is mainly composed of a flexible substrate 31 and an address substrate (metal plate) 32. A driver IC (IC knocker) 33 is mounted on the flexible substrate 31. FIG. 3 shows a configuration in which one driver IC 33 is mounted on one address board 32 as an example. The address board 32 is fixed to the chassis 2 through the long holes 403 at both ends (short sides) thereof. The ADM 3 has a substantially symmetric configuration with respect to the center line in the direction in which the flexible substrate 31 extends (second direction). The detailed structure of the ADM 3 depends on the design concept and specifications of the plasma display device, and is not limited to this embodiment.

[0027] The flexible substrate 31 has an end 311 electrically connected to the address drive circuit 103 in the direction of an arrow 351, and an end 312 electrically connected to the address electrode 23 of the PDP1 in the direction of an arrow 352. . One end 311 is inserted into a connector of the address drive circuit 103, for example. The other end 312 is connected to the end of the lead-out of the address electrode 23 on the back surface 202 of the PDP 1 by thermocompression bonding.

[0028] On the flexible substrate 31, there are various wirings 341 and 342 connected to the driver IC 33, and an independent linear pattern 343 and the like. The driver IC 33 is electrically connected to the address electrode 23 and the address drive circuit 103 of the PDP 1 through the flexible substrate 31. The flexible substrate 31 carries connection wirings 128, 341, and 342 from the driver IC33 to the address drive circuit 103 and the address electrode 23 of the PDP1, and a dry IC33. On the outermost side in the width direction (first direction) of the flexible board 31, there are ground lines (wiring) 342 connected (grounded) to the ground of ADM3 on the both sides, and inside each address electrode on the PDP1 side A plurality of signal wirings 341 connected to 23 are provided. The number of signal wiring 341 in one ADM3 is 64, 128, etc. depending on the type of driver IC33. In addition, a plurality of linear patterns 343 that are not connected to the electrode of the PDP 1 are provided outside the ground line 342 in a part of the flexible substrate 13 near the end of the long side of the address substrate 32. It is provided in the arrangement which crosses the end face of the perpendicularly. The linear pattern 343 contributes to the reinforcement of the flexible substrate 31 and the mitigation of stress exerted in the direction in which the wirings 341 and 342 of the flexible substrate 31 are arranged, thereby preventing metal fatigue of the wiring.

[0029] The address board 32 is connected and fixed to the chassis 2, and holds and fixes the ADM3. It is a member having a function and role of heat and grounding, and in this embodiment, is constituted by a substantially rectangular metal plate. In the present embodiment, the outer side surface of the partial area where the driver IC 33 of the flexible substrate 31 is disposed is adhered and adhered to the inner side surface of the address substrate 32 facing the chassis 2 surface side by an adhesive or the like. Thus, one ADM3 is configured.

The address board 32 is provided with a long hole 403 that constitutes a part of the positioning portion near the inside of the short side and closer to the address driving circuit 103 side. The long hole 403 has a margin that allows for expansion and contraction of the chassis 2 due to thermal expansion that is long in the longitudinal direction (first direction) of the address board 32. The long hole 403 is formed by processing a metal plate that is a source of the address substrate 32, for example.

4 and 5, the structure for mounting and holding and fixing the address board 32 of the ADM 3 will be described. 4 and 5 show a configuration in which the vicinity of one ADM 3 in FIG. 1 is seen from the rear side of the chassis 2. This configuration also corresponds to the cross-sectional views of FIGS. The other ADM3 has the same configuration. Fig. 4 shows the state where the address board 32 is attached to the chassis 2 by the latched pins 402 and is held and fixed. Fig. 5 shows an example of the installation work of the address board 32 at the time of manufacturing the device. As shown, the address board 32 is attached to the chassis 2.

[0032] The address substrate 32 is a conductive substrate, preferably a metal substrate. The chassis 2 and the address board 32 are, for example, aluminum. The address board 32 is fixed in close contact with the flexible board 31.

If the address board 32 is completely fixed to the chassis 2, if the chassis 2 expands and contracts due to thermal expansion, the position of the address board 32 moves accordingly. The address board 32 is connected to the address electrode 23 of the PDP 1 through the flexible board 31. The expansion and contraction of the chassis 2 causes the address board 32 to move with respect to the address electrode 23 of the PDP 1, so that stress is applied to the flexible board 31 and the wiring in the flexible board 31 may be disconnected.

In the present embodiment, the latched pin (holding portion) 402 is, for example, a grease and is fixed to the chassis 2. Latch function when pin 31 with latch is passed through long hole 403 of address board 32 As a result, the address board 32 is held and fixed (regulated) in the vertical direction with respect to the chassis 2. That is, the address board 32 is fixed to the chassis 2 so that the distance between the address board 32 and the chassis 2 is constant.

The address board 32 has two long holes 403 in the long side direction 421 of the address board 32. In the long hole 403, the length 411 of the long side direction 421 of the address board 32 is longer than the length 412 of the short side direction 422 of the address board 32. As a result, the address board 32 is held and fixed to the chassis 2 so as to be movable in the long side direction (surface direction of the chassis 2) 421 within the range of the long hole 402. When the chassis 2 expands and contracts due to thermal expansion, the chassis 2 moves relative to the address board 32. At this time, since the address substrate 32 can maintain the positional relationship with respect to the address electrode 23 of the PDP 1, it is possible to prevent stress on the flexible substrate 31. Thereby, disconnection of the wiring in the flexible substrate 31 due to expansion and contraction of the chassis 2 can be prevented.

The metal panel 401 is, for example, a plate panel, and is connected and fixed to the chassis 2 by caulking or the like, and is in contact with the address board 32. Chassis 2 is electrically at ground potential. The metal spring 401 elastically and electrically connects the chassis 2 and the address board 32. Even if the chassis 2 expands and contracts due to thermal expansion, the metal panel 401 can electrically connect the chassis 2 and the address board 32. The address board 32 is connected to a dotted line 342 in the flexible board 31. The ground line 342 in the flexible substrate 31 is electrically connected to the chassis 2 via the address substrate 32 and the metal panel 401, and becomes a ground potential.

[0037] The pin with latch 402 is preferably made of grease in order to improve the sliding property in the elongated hole 403. The metal spring 401 can be a plate panel or a coil panel! / ヽ.

As described above, according to the present embodiment, the movement of the address board 32 is restricted by the two long holes 403 provided in the address board 32 and the two latched pins 402 provided in the chassis 2. To do. In other words, the address board 32 can move in the horizontal direction (plane direction), but cannot move in the vertical direction. In addition, by connecting the address board 32 and the chassis 2 with the metal panel 401, the ground connection between the chassis 2 and the address board 32 is maintained even if the address board 32 moves in the horizontal direction with respect to the chassis 2. Can be maintained. FIG. 6 shows a cross section of the address substrate 32 of the plasma display device 100 in the long side direction (the PDP display region in the row direction). FIG. 7 shows a cross section of the address board 32 in the short side direction (column direction of the PDP display area), and shows a cut surface at a position where the driver IC 33 is disposed.

[0040] The back surface portion 202 of the PDP 1 and the chassis 2 are bonded to each other by an adhesive layer 9 and are fixed almost entirely. The latch pin 402 is inserted into the long hole 403 of the address board 32. The flexible substrate 31 has one end 311 connected to the address driving circuit 103 and the other end 312 force connected to the address electrode 23 of the back surface 202 of the PDP 1. The flexible substrate 31 is held and fixed in a curved state. In the end region of the back plate 12 of the PDP 1, the end portion 312 of the flexible substrate 31 is connected by thermocompression bonding.

[0041] Note that the end of the chassis 2 has a structure bent in the vertical direction in order to improve the strength, and does not conflict with the ADM 3.

One or more driver ICs 33 are mounted and mounted at positions corresponding to the arrangement of the address substrate 32 on the inner surface of the flexible substrate 31. As an example, a configuration in which two driver ICs 33 are mounted on one ADM3 is shown. For example, if one ADM3 is equipped with two 129-line dryino IC33s, one ADM3 can drive 256 address electrodes 23, and 12 ADM3s have a total of 3072 address electrodes 23. Can be driven. Since one pixel consists of a set of R, G, and B color display cells, the number of pixels in the row direction of the display area of PDP1 in this case is 1024.

[0043] PDP1 generates heat due to discharge. In addition, the driver IC 33 mounted on the flexible substrate 31 also generates heat. As the temperature changes, the chassis 2 expands due to thermal expansion. In the present embodiment, the address board 32 is attached to the chassis 2 so as to be movable in the plane direction by the latched pins 402. Therefore, even if the chassis 2 expands and contracts, the address board 32 can maintain a relative position with respect to the address electrode 23 of the PDP 1. Thereby, stress applied to the flexible substrate 31 can be prevented, and disconnection of the flexible substrate 31 can be prevented. Further, by using the metal panel 401, the address board 32 can be electrically connected to the chassis 2 continuously even when the chassis 2 expands and contracts.

[0044] (Second Embodiment)

8 to 11 show examples of the configuration of the plasma display device according to the second embodiment of the present invention. FIG. FIG. 8 corresponds to FIG. 4 and shows a state in which the address board 32 is held and fixed to the chassis 2. FIG. 9 corresponds to FIG. 5 and shows a state in which the address board 32 is attached to the chassis 2. FIG. 10 corresponds to FIG. 6 and shows a cross section in the long side direction of the address substrate 32 (in the row direction of the PDP display area). FIG. 11 is a diagram corresponding to FIG. 7 and showing a cross section of the address substrate 32 in the short side direction (column direction of the PDP display region).

[0045] The difference between the present embodiment and the first embodiment will be described below. The bracket 801 is provided in place of the latched pin 402 of the first embodiment. A U-shaped panel (clip) 803 is provided in place of the metal panel 401 of the first embodiment.

In the chassis 2, two receiving brackets 801 are fixed for each address board 32. The metal receiver 801 has a staircase shape, and has a convex portion (positioning pin) 802 on the upper surface. The convex portion 802 of the receiving metal 80 1 is fitted into the long hole 403 of the address board 32. The U-shaped panel 803 elastically holds the receiving bracket 801 and the address board 32 so as to be sandwiched therebetween.

[0047] The receiving board (holding portion) 801 holds and fixes (regulates) the address board 32 in the vertical direction with respect to the chassis 2 so that the distance between the address board 32 and the chassis 2 is constant.

[0048] By fitting the convex portion 802 of the receiving bracket 801 into the long hole 403, the address board 32 can move in the long side direction 421 within the range of the long hole 402 with respect to the chassis 2. . When the chassis 2 expands and contracts due to thermal expansion, the chassis 2 moves relative to the address board 32. At this time, since the address substrate 32 can maintain the positional relationship with the address electrode 23 of the PDP 1, it is possible to prevent stress on the flexible substrate 31. Thereby, disconnection of the wiring in the flexible substrate 31 due to expansion and contraction of the chassis 2 can be prevented.

[0049] The metal fitting 801 is made of, for example, iron or aluminum and is electrically connected to the chassis 2. The U-shaped panel 803 is a metal panel, and electrically and elastically connects the receiving bracket 801 and the address board 32. Even if the chassis 2 expands and contracts due to thermal expansion, the panel 803 can continue to electrically connect the bracket 801 and the address board 32. The address board 32 is connected to a ground line 342 in the flexible board 31. The ground line 342 in the flexible board 31 connects the address board 32, the bracket 801, and the panel 803. And is electrically connected to the chassis 2 to become a ground potential.

[0050] (Third embodiment)

12 to 15 are diagrams showing a configuration example of the plasma display device according to the third embodiment of the present invention. FIG. 12 corresponds to FIG. 4 and shows a state in which the address board 32 is held and fixed to the chassis 2. FIG. 13 is a diagram corresponding to FIG. 5 and showing a state where the address board 32 is attached to the chassis 2. FIG. 14 is a diagram corresponding to FIG. 6 and showing a cross section of the address substrate 32 in the long side direction (PDP display region row direction). FIG. 15 is a view corresponding to FIG. 7 and showing a cross section of the address substrate 32 in the short side direction (column direction of the PDP display region).

[0051] Hereinafter, differences of the present embodiment from the first embodiment will be described. The metal panel 1201 is provided in place of the metal panel 401 of the first embodiment. The metal panel 1201 has a hole. The pin 402 with latch is passed through the hole of the metal panel 1201, and the metal panel 1201 is attached to the pin 402 with latch. The metal panel 1201 is extendable in the vertical direction, and electrically and elastically connects the address board 32 and the chassis 2. Even if the chassis 2 expands and contracts due to thermal expansion, the metal panel 1201 can continue to electrically connect the chassis 2 and the address board 32. The address board 32 is connected to a ground line 342 in the flexible board 31. The ground line 342 in the flexible substrate 31 is electrically connected to the chassis 2 via the address substrate 32 and the metal spring 1201, and becomes a ground potential.

[0052] (Fourth embodiment)

FIGS. 16 to 19 are diagrams showing a configuration example of the plasma display device according to the fourth embodiment of the present invention. FIG. 16 corresponds to FIG. 8 and shows a state in which the address board 32 is held and fixed to the chassis 2. FIG. 17 is a view corresponding to FIG. 9 and showing a state where the address board 32 is attached to the chassis 2. FIG. 18 corresponds to FIG. 10 and shows a cross section of the address substrate 32 in the long side direction (PDP display region row direction). FIG. 19 is a view corresponding to FIG. 11 and showing a cross section of the address substrate 32 in the short side direction (column direction of the PDP display area).

Hereinafter, differences of this embodiment from the second embodiment will be described. In the second embodiment, two receiving brackets 801 and two U-shaped panel 803 are used for one address board 32. In the present embodiment, one receiving unit is provided for the ends of two adjacent address boards 32. The bracket 801 and one U-shaped panel 803 are shared. The receiving bracket 801 has two convex portions 802 and is fixed to the chassis 2 near the boundary between two adjacent address boards 32. Two protrusions 802 on one receiving bracket 801 are fitted into the elongated holes 403 of the two adjacent address boards 32. One U-shaped panel 803 holds the end portions of two adjacent address boards 32 and one receiving bracket 801 in a sandwiched manner.

In the present embodiment, since one receiving bracket 801 and one U-shaped panel 803 are shared with two adjacent address boards 32, compared to the second embodiment, the receiving is performed. The number of metal fittings 801 and U-shaped panel 803 can be reduced to about half.

As described above, according to the first to fourth embodiments, the address board 32 is movable with respect to the chassis 2 in the long side direction 421 within the range of the long hole 402. Even if the chassis 2 expands and contracts due to thermal expansion, the address board 32 can move relative to the chassis 2, so that stress can be prevented from being applied to the flexible board 31. Thereby, disconnection of the wiring in the flexible substrate 31 due to expansion and contraction of the chassis 2 can be prevented. Further, since the metal panel has elasticity, even if the chassis 2 expands and contracts due to thermal expansion, the metal panel can electrically connect the chassis 2 and the address board 32 continuously.

[0056] In the future, PDP1 will be suitable for full-spec HDTV, the number of pixels will increase, and the number of address electrodes 23 will also increase. This increases the number of ADM3 (address board 32). In the present embodiment, the holding portion (the latching pin 402 or the bracket 801 having the convex portion 802) for fixing the address board 32 to the chassis 2 can be simplified, and thus the effect of reducing the price is significant. It is important.

It should be noted that the above-described embodiments are merely examples of implementation in carrying out the present invention, and the technical scope of the present invention should not be construed as being limited thereto. It is. That is, the present invention can be implemented in various forms without departing from the technical idea or the main features thereof.

Industrial applicability

[0058] Even if the chassis expands or contracts due to thermal expansion, it is possible to prevent stress from being applied to the flexible substrate connected to the electrodes of the plasma display panel, and to prevent disconnection of wiring in the flexible substrate.

Claims

The scope of the claims

[1] a plasma display panel having a plurality of electrodes formed thereon;

A chassis to which the plasma display panel is fixed;

A driving circuit disposed in the chassis for driving the electrodes of the plasma display panel;

A flexible substrate on which the electrodes of the plasma display panel and the connection wiring of the drive circuit are mounted;

A conductive substrate fixed to the flexible substrate;

A plasma display device, comprising: a holding portion for holding and fixing to the chassis so as to be movable in a surface direction of the chassis; and a metal panel for electrically connecting the chassis and the conductive substrate.

[2] Furthermore, it has a driver IC electrically connected to the electrode of the plasma display panel and the driving circuit,

2. The plasma display device according to claim 1, wherein the flexible substrate is mounted with connection wiring from the driver IC to an electrode of the plasma display panel and the driving circuit, and the driver IC.

3. The plasma display device according to claim 1, wherein the conductive substrate is connected to a ground wiring of the flexible substrate.

[4] The conductive substrate has an elongated hole,

2. The plasma display device according to claim 1, wherein the holding portion is a pin with a latch fixed to the chassis and passed through an elongated hole of the conductive substrate.

5. The plasma display device according to claim 4, wherein the pin with latch is a resin.

6. The plasma display device according to claim 4, wherein the metal panel is attached to the pin with a latch.

7. The plasma display device according to claim 1, wherein the metal panel is fixed to the chassis and is in contact with the conductive substrate.

8. The plasma display device according to claim 1, wherein the metal panel is a plate panel or a coil panel.

[9] The conductive substrate has an elongated hole,

The holding portion is a latched pin fixed to the chassis and passed through a long hole of the conductive substrate.

The plasma display apparatus according to claim 1, wherein the metal panel is fixed to the chassis and is in contact with the conductive substrate.

[10] The conductive substrate has a slot.

2. The plasma display device according to claim 1, wherein the holding portion is a metal fitting having a convex portion that is fixed to the chassis and fits into an elongated hole of the conductive substrate.

11. The plasma display device according to claim 10, wherein the metal panel is held so as to sandwich the conductive substrate and the metal fitting.

[12] A plurality of sets of the flexible substrate and the conductive substrate are provided,

2. The plasma display device according to claim 1, wherein the holding portion is a metal fitting having a plurality of convex portions that are fixed to the chassis and are fitted into elongated holes of the plurality of conductive substrates.

13. The plasma display device according to claim 12, wherein the one metal panel is held so as to sandwich the plurality of conductive substrates and the one metal fitting.

14. The plasma display device according to claim 1, wherein the electrodes of the plasma display panel are address electrodes.