WO2008009796A3 - Procédé de fabrication par moulage d'une entité électronique portable, et entité ainsi obtenue - Google Patents

Procédé de fabrication par moulage d'une entité électronique portable, et entité ainsi obtenue Download PDF

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Publication number
WO2008009796A3
WO2008009796A3 PCT/FR2007/001187 FR2007001187W WO2008009796A3 WO 2008009796 A3 WO2008009796 A3 WO 2008009796A3 FR 2007001187 W FR2007001187 W FR 2007001187W WO 2008009796 A3 WO2008009796 A3 WO 2008009796A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
portable electronic
casting
unit
electronic unit
Prior art date
Application number
PCT/FR2007/001187
Other languages
English (en)
Other versions
WO2008009796A2 (fr
Inventor
Francois Launay
Original Assignee
Oberthur Card Syst Sa
Francois Launay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Syst Sa, Francois Launay filed Critical Oberthur Card Syst Sa
Publication of WO2008009796A2 publication Critical patent/WO2008009796A2/fr
Publication of WO2008009796A3 publication Critical patent/WO2008009796A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/12—Making multilayered or multicoloured articles
    • B29C39/123—Making multilayered articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Pour la fabrication par moulage d'une entité électronique portable, on place un support muni d'au moins un composant le long d'une paroi d'une cavité de moule ouvert, on coule le long de ce support une première masse de résine que l'on fait durcir, on place l'ensemble ainsi obtenu dans une autre cavité de moule ouvert, on coule le long du support une seconde masse de résine par exemple la même que précédemment, que l'on fait durcir. Le support comporte avantageusement des parties en saillie, par exemple des parties de composants venant en saillie vis-à-vis du support. L'entité électronique portable peut être une carte à microcircuit ou une clef USB, notamment.
PCT/FR2007/001187 2006-07-17 2007-07-11 Procédé de fabrication par moulage d'une entité électronique portable, et entité ainsi obtenue WO2008009796A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0652994A FR2903624B1 (fr) 2006-07-17 2006-07-17 Procede de fabrication par moulage d'une entite electronique portable, et entite ainsi obtenue.
FR06.52994 2006-07-17

Publications (2)

Publication Number Publication Date
WO2008009796A2 WO2008009796A2 (fr) 2008-01-24
WO2008009796A3 true WO2008009796A3 (fr) 2008-03-06

Family

ID=37776522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/001187 WO2008009796A2 (fr) 2006-07-17 2007-07-11 Procédé de fabrication par moulage d'une entité électronique portable, et entité ainsi obtenue

Country Status (2)

Country Link
FR (1) FR2903624B1 (fr)
WO (1) WO2008009796A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107273962B (zh) * 2016-06-15 2021-08-06 苏州海博智能系统有限公司 智能卡中料制作方法及中料结构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3153694A (en) * 1959-06-02 1964-10-20 Joseph R Tomlinson Encapsulation of electronic circuits
EP0650315A2 (fr) * 1993-10-23 1995-04-26 Leonische Drahtwerke AG Appareil de commande électrique à installer dans une automobile en particulier
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
JPH08276458A (ja) * 1995-04-06 1996-10-22 Dainippon Printing Co Ltd 非接触ｉｃタグの製造方法及び非接触ｉｃタグ
FR2776796A1 (fr) * 1998-03-31 1999-10-01 Gemplus Card Int Procede de fabrication de cartes a puce
ES2137850A1 (es) * 1997-06-13 1999-12-16 Consejo Superior Investigacion Tecnica de encapsulacion para microsensores de presion entre ambientes humedos.
EP1052595A1 (fr) * 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et objet moulé par injection et procédé pour leur fabrication

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3153694A (en) * 1959-06-02 1964-10-20 Joseph R Tomlinson Encapsulation of electronic circuits
EP0650315A2 (fr) * 1993-10-23 1995-04-26 Leonische Drahtwerke AG Appareil de commande électrique à installer dans une automobile en particulier
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
JPH08276458A (ja) * 1995-04-06 1996-10-22 Dainippon Printing Co Ltd 非接触ｉｃタグの製造方法及び非接触ｉｃタグ
ES2137850A1 (es) * 1997-06-13 1999-12-16 Consejo Superior Investigacion Tecnica de encapsulacion para microsensores de presion entre ambientes humedos.
FR2776796A1 (fr) * 1998-03-31 1999-10-01 Gemplus Card Int Procede de fabrication de cartes a puce
EP1052595A1 (fr) * 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et objet moulé par injection et procédé pour leur fabrication

Also Published As

Publication number Publication date
FR2903624B1 (fr) 2008-11-28
FR2903624A1 (fr) 2008-01-18
WO2008009796A2 (fr) 2008-01-24

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