WO2008005541A3 - Système d'allumage propre pour traitement d'un substrat sous forme de tranche - Google Patents

Système d'allumage propre pour traitement d'un substrat sous forme de tranche Download PDF

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Publication number
WO2008005541A3
WO2008005541A3 PCT/US2007/015589 US2007015589W WO2008005541A3 WO 2008005541 A3 WO2008005541 A3 WO 2008005541A3 US 2007015589 W US2007015589 W US 2007015589W WO 2008005541 A3 WO2008005541 A3 WO 2008005541A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
edge area
ignition system
flow
processing
Prior art date
Application number
PCT/US2007/015589
Other languages
English (en)
Other versions
WO2008005541A2 (fr
Inventor
Joel Brad Bailey
Jean-Michel Claude Huret
Paul F Forderhase
Satish Sadam
Scott Allen Stratton
Michael D Robbins
Original Assignee
Accretech Usa Inc
Joel Brad Bailey
Jean-Michel Claude Huret
Paul F Forderhase
Satish Sadam
Scott Allen Stratton
Michael D Robbins
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Accretech Usa Inc, Joel Brad Bailey, Jean-Michel Claude Huret, Paul F Forderhase, Satish Sadam, Scott Allen Stratton, Michael D Robbins filed Critical Accretech Usa Inc
Publication of WO2008005541A2 publication Critical patent/WO2008005541A2/fr
Publication of WO2008005541A3 publication Critical patent/WO2008005541A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif pour traiter la région du bord d'un substrat. La région du bord à traiter est isolée du reste du substrat par l'intermédiaire d'un flux de gaz inerte dirigé à travers un plénum à proximité de la région à traiter de façon à former une barrière, un flux d'espèces réactives étant dirigé simultanément selon un angle donné par rapport à la surface supérieure du substrat en direction de la région du bord du substrat de façon à traiter ladite région. Un flux de gaz contenant de l'oxygène à l'intérieur de la chambre de traitement et une pression d'échappement négative peuvent contribuer à chasser les espèces réactives et les autres gaz des zones du substrat non traitées. Un système d'allumage propre est utilisé pour allumer la flamme de combustion.
PCT/US2007/015589 2006-07-07 2007-07-06 Système d'allumage propre pour traitement d'un substrat sous forme de tranche WO2008005541A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81952106P 2006-07-07 2006-07-07
US60/819,521 2006-07-07

Publications (2)

Publication Number Publication Date
WO2008005541A2 WO2008005541A2 (fr) 2008-01-10
WO2008005541A3 true WO2008005541A3 (fr) 2008-02-21

Family

ID=38894891

Family Applications (5)

Application Number Title Priority Date Filing Date
PCT/US2007/015556 WO2008005521A1 (fr) 2006-07-07 2007-07-06 Appareil et procédé de traitement de tranches
PCT/US2007/015589 WO2008005541A2 (fr) 2006-07-07 2007-07-06 Système d'allumage propre pour traitement d'un substrat sous forme de tranche
PCT/US2007/015588 WO2008005540A2 (fr) 2006-07-07 2007-07-06 Procédé et appareil pour nettoyer un substrat sous forme de tranche
PCT/US2007/015586 WO2008005539A2 (fr) 2006-07-07 2007-07-06 Appareil pour nettoyer un substrat sous forme de tranche
PCT/US2007/015551 WO2008005517A1 (fr) 2006-07-07 2007-07-06 Chambre de traitement comprenant un joint labyrinthe

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015556 WO2008005521A1 (fr) 2006-07-07 2007-07-06 Appareil et procédé de traitement de tranches

Family Applications After (3)

Application Number Title Priority Date Filing Date
PCT/US2007/015588 WO2008005540A2 (fr) 2006-07-07 2007-07-06 Procédé et appareil pour nettoyer un substrat sous forme de tranche
PCT/US2007/015586 WO2008005539A2 (fr) 2006-07-07 2007-07-06 Appareil pour nettoyer un substrat sous forme de tranche
PCT/US2007/015551 WO2008005517A1 (fr) 2006-07-07 2007-07-06 Chambre de traitement comprenant un joint labyrinthe

Country Status (2)

Country Link
TW (1) TW200807522A (fr)
WO (5) WO2008005521A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2274763B1 (fr) * 2008-04-22 2018-10-03 Oerlikon Surface Solutions AG, Pfäffikon Procédé de fabrication de pièces à usiner avec une surface attaquée par des ions
JP4672073B2 (ja) * 2008-08-22 2011-04-20 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理装置の運用方法
DE112011102142T8 (de) * 2010-06-25 2013-06-13 Ulvac, Inc. Filmbildungsvorrichtung und Verfahren zum Instandhalten einer Filmbildungsvorrichtung
KR101590661B1 (ko) * 2010-09-13 2016-02-01 도쿄엘렉트론가부시키가이샤 액처리 장치, 액처리 방법 및 기억 매체
CN113725131B (zh) * 2021-11-02 2022-02-08 西安奕斯伟材料科技有限公司 晶圆预处理装置及晶圆缺陷检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010101359A (ko) * 1998-12-30 2001-11-14 리차드 에이치. 로브그렌 플라즈마 처리용 가스 주입 시스템
KR20050116813A (ko) * 2003-03-07 2005-12-13 알에이피티 인더스트리즈 인코포레이티드 비접촉식 표면 세정 장치 및 방법
KR20060025349A (ko) * 2004-09-16 2006-03-21 삼성전자주식회사 반도체 자연산화막 제거방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
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JP2954059B2 (ja) * 1997-01-09 1999-09-27 山形日本電気株式会社 エッジリンス機構
JP3395696B2 (ja) * 1999-03-15 2003-04-14 日本電気株式会社 ウェハ処理装置およびウェハ処理方法
JP4498503B2 (ja) * 1999-10-29 2010-07-07 アプライド マテリアルズ インコーポレイテッド 薄膜形成装置及び薄膜形成方法
JP3581292B2 (ja) * 2000-03-22 2004-10-27 東京エレクトロン株式会社 処理装置および処理方法
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
KR20030090057A (ko) * 2002-05-21 2003-11-28 삼성전자주식회사 얼라인먼트기능을 갖는 노광유니트 및 그 얼라인방법
WO2004100247A1 (fr) * 2003-05-12 2004-11-18 Sosul Co., Ltd. Chambre de gravure au plasma et systeme de gravure au plasma l'utilisant
JP2006073590A (ja) * 2004-08-31 2006-03-16 Toppan Printing Co Ltd 表面洗浄方法及びその表面洗浄装置
KR20060057111A (ko) * 2004-11-23 2006-05-26 삼성전자주식회사 반도체 소자 제조를 위한 에지 노광 장치
KR100568873B1 (ko) * 2004-11-30 2006-04-10 삼성전자주식회사 웨이퍼의 에지 비드 스트립용 노즐장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010101359A (ko) * 1998-12-30 2001-11-14 리차드 에이치. 로브그렌 플라즈마 처리용 가스 주입 시스템
KR20050116813A (ko) * 2003-03-07 2005-12-13 알에이피티 인더스트리즈 인코포레이티드 비접촉식 표면 세정 장치 및 방법
KR20060025349A (ko) * 2004-09-16 2006-03-21 삼성전자주식회사 반도체 자연산화막 제거방법

Also Published As

Publication number Publication date
WO2008005541A2 (fr) 2008-01-10
TW200807522A (en) 2008-02-01
WO2008005540A3 (fr) 2008-02-21
WO2008005517A1 (fr) 2008-01-10
WO2008005539A2 (fr) 2008-01-10
WO2008005540A2 (fr) 2008-01-10
WO2008005521A1 (fr) 2008-01-10
WO2008005539A3 (fr) 2008-03-06

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