WO2008005539A3 - Apparatus for cleaning a wafer substrate - Google Patents

Apparatus for cleaning a wafer substrate Download PDF

Info

Publication number
WO2008005539A3
WO2008005539A3 PCT/US2007/015586 US2007015586W WO2008005539A3 WO 2008005539 A3 WO2008005539 A3 WO 2008005539A3 US 2007015586 W US2007015586 W US 2007015586W WO 2008005539 A3 WO2008005539 A3 WO 2008005539A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
chuck
substrate
center
cleaning
Prior art date
Application number
PCT/US2007/015586
Other languages
French (fr)
Other versions
WO2008005539A2 (en
Inventor
Joel Brad Bailey
Jean-Michel Claude Huret
Paul F Forderhase
Satish Sadam
Scott Allen Stratton
Michael D Robbins
Original Assignee
Accretech Usa Inc
Joel Brad Bailey
Jean-Michel Claude Huret
Paul F Forderhase
Satish Sadam
Scott Allen Stratton
Michael D Robbins
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Accretech Usa Inc, Joel Brad Bailey, Jean-Michel Claude Huret, Paul F Forderhase, Satish Sadam, Scott Allen Stratton, Michael D Robbins filed Critical Accretech Usa Inc
Publication of WO2008005539A2 publication Critical patent/WO2008005539A2/en
Publication of WO2008005539A3 publication Critical patent/WO2008005539A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Abstract

A method and apparatus for dry chemical processing a wafer at atmospheric pressure is disclosed. The edge area of a substrate is placed in isolation from the remainder of the substrate. According to the present teachings, a method for centering a wafer on a rotatable chuck is provided. The method includes the steps of positioning a wafer adjacent to a micrometer. The wafer is then rotated and a plurality of wafer edge locations and rotational increments are measured. A center offset value for the value of the wafer center with respect to a chuck is calculated. The wafer is then moved with respect to a center position of the chuck.
PCT/US2007/015586 2006-07-07 2007-07-06 Apparatus for cleaning a wafer substrate WO2008005539A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81952106P 2006-07-07 2006-07-07
US60/819,521 2006-07-07

Publications (2)

Publication Number Publication Date
WO2008005539A2 WO2008005539A2 (en) 2008-01-10
WO2008005539A3 true WO2008005539A3 (en) 2008-03-06

Family

ID=38894891

Family Applications (5)

Application Number Title Priority Date Filing Date
PCT/US2007/015586 WO2008005539A2 (en) 2006-07-07 2007-07-06 Apparatus for cleaning a wafer substrate
PCT/US2007/015589 WO2008005541A2 (en) 2006-07-07 2007-07-06 Clean ignition system for wafer substrate processing
PCT/US2007/015551 WO2008005517A1 (en) 2006-07-07 2007-07-06 Processing chamber having labyrinth seal
PCT/US2007/015556 WO2008005521A1 (en) 2006-07-07 2007-07-06 Wafer processing apparatus and method
PCT/US2007/015588 WO2008005540A2 (en) 2006-07-07 2007-07-06 Method and apparatus for cleaning a wafer substrate

Family Applications After (4)

Application Number Title Priority Date Filing Date
PCT/US2007/015589 WO2008005541A2 (en) 2006-07-07 2007-07-06 Clean ignition system for wafer substrate processing
PCT/US2007/015551 WO2008005517A1 (en) 2006-07-07 2007-07-06 Processing chamber having labyrinth seal
PCT/US2007/015556 WO2008005521A1 (en) 2006-07-07 2007-07-06 Wafer processing apparatus and method
PCT/US2007/015588 WO2008005540A2 (en) 2006-07-07 2007-07-06 Method and apparatus for cleaning a wafer substrate

Country Status (2)

Country Link
TW (1) TW200807522A (en)
WO (5) WO2008005539A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2504860C2 (en) * 2008-04-22 2014-01-20 Эрликон Трейдинг Аг, Трюббах Method of making workpieces with ion-etched surface
JP4672073B2 (en) * 2008-08-22 2011-04-20 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing apparatus operation method
DE112011102142T8 (en) * 2010-06-25 2013-06-13 Ulvac, Inc. A film forming apparatus and method for maintaining a film forming apparatus
KR101590661B1 (en) * 2010-09-13 2016-02-01 도쿄엘렉트론가부시키가이샤 Liquid processing apparatus, liquid processing method and storage medium
CN113725131B (en) * 2021-11-02 2022-02-08 西安奕斯伟材料科技有限公司 Wafer pretreatment device and wafer defect detection method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
KR20030090057A (en) * 2002-05-21 2003-11-28 삼성전자주식회사 Expose unit having alignment function and align method thereof
KR20060057111A (en) * 2004-11-23 2006-05-26 삼성전자주식회사 Edge exposure apparatus for fabricating semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2954059B2 (en) * 1997-01-09 1999-09-27 山形日本電気株式会社 Edge rinse mechanism
US6230651B1 (en) * 1998-12-30 2001-05-15 Lam Research Corporation Gas injection system for plasma processing
JP3395696B2 (en) * 1999-03-15 2003-04-14 日本電気株式会社 Wafer processing apparatus and wafer processing method
JP4498503B2 (en) * 1999-10-29 2010-07-07 アプライド マテリアルズ インコーポレイテッド Thin film forming apparatus and thin film forming method
JP3581292B2 (en) * 2000-03-22 2004-10-27 東京エレクトロン株式会社 Processing device and processing method
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
US7371992B2 (en) * 2003-03-07 2008-05-13 Rapt Industries, Inc. Method for non-contact cleaning of a surface
WO2004100247A1 (en) * 2003-05-12 2004-11-18 Sosul Co., Ltd. Plasma etching chamber and plasma etching system using same
JP2006073590A (en) * 2004-08-31 2006-03-16 Toppan Printing Co Ltd Surface cleaning method and apparatus
KR100593740B1 (en) * 2004-09-16 2006-06-28 삼성전자주식회사 Method of removing native oxide film
KR100568873B1 (en) * 2004-11-30 2006-04-10 삼성전자주식회사 Nozzle apparatus for stripping edge bead of wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
KR20030090057A (en) * 2002-05-21 2003-11-28 삼성전자주식회사 Expose unit having alignment function and align method thereof
KR20060057111A (en) * 2004-11-23 2006-05-26 삼성전자주식회사 Edge exposure apparatus for fabricating semiconductor device

Also Published As

Publication number Publication date
WO2008005517A1 (en) 2008-01-10
TW200807522A (en) 2008-02-01
WO2008005539A2 (en) 2008-01-10
WO2008005541A2 (en) 2008-01-10
WO2008005540A3 (en) 2008-02-21
WO2008005521A1 (en) 2008-01-10
WO2008005540A2 (en) 2008-01-10
WO2008005541A3 (en) 2008-02-21

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