WO2008001844A1 - Process for producing high-purity hexafluoropropylene and cleaning gas - Google Patents

Process for producing high-purity hexafluoropropylene and cleaning gas Download PDF

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WO2008001844A1
WO2008001844A1 PCT/JP2007/062995 JP2007062995W WO2008001844A1 WO 2008001844 A1 WO2008001844 A1 WO 2008001844A1 JP 2007062995 W JP2007062995 W JP 2007062995W WO 2008001844 A1 WO2008001844 A1 WO 2008001844A1
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hexafluoropropylene
purity
content
crude
less
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PCT/JP2007/062995
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French (fr)
Japanese (ja)
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Hiromoto Ohno
Toshio Ohi
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Showa Denko K.K.
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Priority to JP2008522621A priority Critical patent/JP5132555B2/en
Publication of WO2008001844A1 publication Critical patent/WO2008001844A1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00Preparation of halogenated hydrocarbons
    • C07C17/38Separation; Purification; Stabilisation; Use of additives
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00Preparation of halogenated hydrocarbons
    • C07C17/38Separation; Purification; Stabilisation; Use of additives
    • C07C17/383Separation; Purification; Stabilisation; Use of additives by distillation
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00Preparation of halogenated hydrocarbons
    • C07C17/38Separation; Purification; Stabilisation; Use of additives
    • C07C17/389Separation; Purification; Stabilisation; Use of additives by adsorption on solids

Abstract

A process for industrially advantageously producing high-purity hexafluoropropylene; and a use of this high-purity hexafluoropropylene, specifically, a cleaning gas for removing deposits in a semiconductor manufacturing apparatus or liquid-crystal manufacturing apparatus. In the process for high-purity hexafluoropropylene production, crude hexafluoropropylene produced by the pyrolysis of chlorodifluoromethane is purified to thereby produce high-purity hexafluoropropylene. It comprises: a step (1) in which the crude hexafluoropropylene is brought into contact with an adsorbent comprising a zeolite having an average micropore diameter of 3.4-11 Å and/or a carbonaceous adsorbent having an average micropore diameter of 3.5-11 Å to reduce the content of chlorine compounds and/or hydrocarbons in the crude hexafluoropropylene; and a step (2) in which the hexafluoropropylene obtained in the step (1) is distilled to reduce the content of low-boiling ingredients therein.

Description

高純度へキサフルォロプロピレンの製造方法及びクリーニングガス 技術分野  Manufacturing method of high purity hexafluoropropylene and cleaning gas
[0001] 本発明は、高純度へキサフルォロプロピレンの製造方法に関する。特に、半導体製 造装置内または液晶製造装置内の堆積物を除去するために好適に使用されるへキ サフルォロプロピレンの製造方法および高純度へキサフルォロプロピレンの用途に 関する。  [0001] The present invention relates to a method for producing high-purity hexafluoropropylene. In particular, the present invention relates to a method for producing hexafluoropropylene and a use of high-purity hexafluoropropylene which are preferably used for removing deposits in a semiconductor production apparatus or a liquid crystal production apparatus.
背景技術  Background art
[0002] へキサフルォロプロピレン(以下、「CF CF=CF」または「FC— 1216」ということが  [0002] Hexafluoropropylene (hereinafter referred to as “CF CF = CF” or “FC-1216”)
3 2  3 2
ある)は、例えば、半導体デバイス製造工程におけるクリーニングガスゃォクタフルォ 口プロパン (C F )の製造用原料等に使用される。その製造方法としては、例えば、  For example, is used as a raw material for the production of cleaning gas fluorinated propane (C F) in the semiconductor device manufacturing process. As its manufacturing method, for example,
3 8  3 8
(1)下記式に示すクロロジフルォロメタン(CHC1F )の熱分解を経てテトラフルォロェ  (1) Through the thermal decomposition of chlorodifluoromethane (CHC1F) shown in the following formula, tetrafluoro
2  2
チレン (CF =CF )を製造する工程における副生成物として得る方法、  A method of obtaining as a by-product in the process of producing tylene (CF = CF),
2 2  twenty two
2CHC1F + H O → CF =CF + CF CF = CF  2CHC1F + H O → CF = CF + CF CF = CF
2 2 2 2 3 2  2 2 2 2 3 2
(2)ポリテトラフルォロエチレンを熱分解したり、テトラフルォロエチレンを減圧下、高 温で白金上に通したりすること等により得る方法、  (2) A method obtained by thermally decomposing polytetrafluoroethylene or passing tetrafluoroethylene over platinum under reduced pressure at high temperature, etc.
(3)プロパン、プロピレンあるいは部分的にハロゲン化されている C3非環式炭化水 素類をクロ口フルォロ化して脱ノヽロゲンィ匕する方法 (特開平 4— 145033号公報)、 等が知られている力 多くの場合、へキサフルォロプロピレンにはクロ口フルォロカ一 ボン(CFC)類、ハイド口クロ口フルォロカーボン(HCFC)類、ハイドロカ—ボン(HC) 類などの飽和化合物や不飽和化合物等の様々な不純物が含まれて!/、る。これらの 不純物は蒸留操作によってへキサフルォロプロピレンと分離することが困難である。  (3) A method for denerogenizing propane, propylene or partially halogenated C3 acyclic hydrocarbons by fluorination and dehydrogenation (Japanese Patent Laid-Open No. 4-145033), etc. are known. In many cases, hexafluoropropylene has saturated and unsaturated compounds such as black mouth fluorocarbons (CFCs), hyde mouth black mouth fluorocarbons (HCFCs), and hydrocarbons (HC). Contains various impurities! These impurities are difficult to separate from hexafluoropropylene by distillation.
[0003] したがって、純度の高!、へキサフルォロプロピレンを得るためには、これらの不純物 をできる限り除去する必要がある。特に、含塩素化合物であるクロ口フルォロカーボン 類やハイド口クロ口フルォロカーボン類については、へキサフルォロプロピレンの高純 度化の目的の他に、オゾン層の破壊を防止するという観点や半導体製造装置内また は液晶製造装置内の汚染 (エッチング室内の含塩素化合物による汚染)の防止とい う観点から、通常の蒸留では分離が困難な化合物も除去する必要がある。 [0003] Therefore, in order to obtain high purity and hexafluoropropylene, it is necessary to remove these impurities as much as possible. In particular, with regard to chlorine-containing fluorocarbons and hide-mouthed fluorocarbons, which are chlorine-containing compounds, in addition to the purpose of improving the purity of hexafluoropropylene, the viewpoint of preventing the destruction of the ozone layer and semiconductor manufacturing Prevention of contamination in equipment or liquid crystal manufacturing equipment (contamination by chlorine-containing compounds in the etching chamber) From this viewpoint, it is necessary to remove compounds that are difficult to separate by ordinary distillation.
[0004] ところが、前記の不純物の中には、へキサフルォロプロピレンと共沸混合物や共沸 様混合物を形成するため、へキサフルォロプロピレンと分離することが非常に困難な 化合物もある。例えば、クロ口フルォロエチレン(CH =CC1F)、クロ口トリフルォロェ  [0004] However, among the above impurities, there are compounds that are very difficult to separate from hexafluoropropylene because they form an azeotrope or azeotrope-like mixture with hexafluoropropylene. is there. For example, black mouthed fluoroethylene (CH = CC1F), black mouthed fluoroethylene
2  2
チレン(CF =CC1F)ゃジクロロジフルォロメタン(CC1 F )等は、へキサフルォロプロ  Tylene (CF = CC1F), dichlorodifluoromethane (CC1 F), etc. are hexafluoropro
2 2 2  2 2 2
ピレンと沸点が近接しており、共沸混合物や共沸様混合物を形成するため、分離精 製することが非常に困難な化合物である。  Since the boiling point is close to that of pyrene and forms an azeotrope or azeotrope-like mixture, it is a compound that is very difficult to separate and refine.
[0005] 冷媒として重要な化合物である 1, 1, 1, 2—テトラフルォロェタン(CF CH F)ゃぺ  [0005] 1, 1, 1, 2-tetrafluoroethane (CF CH F) Nyape is an important compound as a refrigerant
3 2 ンタフルォロェタン (CF CHF )等において不純物を精製する方法として、例えば、  3 2 As a method for purifying impurities in ntafluoretane (CF CHF) etc., for example,
3 2  3 2
抽出蒸留による精製方法や触媒の存在下で水素を用いた脱ハロゲン水素化反応等 によって除去する方法が知られて 、る。  Methods for purification by extractive distillation and methods for removal by dehalogenation using hydrogen in the presence of a catalyst are known.
[0006] また、クリーニングガスとして使用される三フッ化窒素 (NF )や六弗化工タン (CF C [0006] Nitrogen trifluoride (NF) and hexafluorinated tan (CF C) used as cleaning gases
3 3 3 3
F )等の飽和化合物は高純度化のため、この含塩素化合物の低減 (精製)のため、F) saturated compounds such as high purity, and to reduce (purify) these chlorine-containing compounds,
3 Three
様々な方法が提案、実施され、高純度化が達成されている。  Various methods have been proposed and implemented to achieve high purity.
[0007] 一方、へキサフルォロプロピレンをクリーニングガスとして用いる方法として、例えば [0007] On the other hand, as a method of using hexafluoropropylene as a cleaning gas, for example,
(1)プラズマ CVD反応室清掃方法およびプラズマエッチング方法 (特開平 9— 2962 71号公報)、 (1) Plasma CVD reaction chamber cleaning method and plasma etching method (JP-A-9-29671),
(2)エッチングガスおよびクリーニングガス(特開平 10— 27781号公報)、  (2) Etching gas and cleaning gas (Japanese Patent Laid-Open No. 10-27781),
(3)プロセスチャンバ—内のクリーニング方法及び基板処理装置(特開 2005— 264 09号公報)  (3) Process chamber cleaning method and substrate processing apparatus (Japanese Patent Laid-Open No. 2005-26409)
等が知られている力 へキサフルォロプロピレン中の不純物、特に汚染源となる含塩 素化合物の精製方法や高純度化については未だ課題、問題を残している。  There are still problems and problems in the purification method and high purity of impurities in hexafluoropropylene, especially the chlorine-containing compounds that are the source of contamination.
特許文献 1 :特開平 4— 145033号公報  Patent Document 1: JP-A-4-145503
特許文献 2 :特開平 9 296271号公報  Patent Document 2: JP-A-9 296271
特許文献 3:特開平 10— 27781号公報  Patent Document 3: Japanese Patent Laid-Open No. 10-27781
特許文献 4:特開 2005 - 26409号公報  Patent Document 4: Japanese Patent Laid-Open No. 2005-26409
発明の開示 発明が解決しょうとする課題 Disclosure of the invention Problems to be solved by the invention
[0008] 本発明は、上記のような従来技術に伴う問題を解決しょうとするものであって、高純 度のへキサフルォロプロピレンを工業的に有利に製造する方法、およびこの高純度 へキサフルォロプロピレンの用途、具体的には、半導体製造装置内または液晶製造 装置内の堆積物を除去するためのクリーニングガスを提供することを目的としている。 課題を解決するための手段  [0008] The present invention is intended to solve the problems associated with the prior art as described above, and is a method for industrially advantageously producing high purity hexafluoropropylene, and its high purity. The purpose of the hexafluoropropylene is to provide a cleaning gas for removing deposits in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus. Means for solving the problem
[0009] 本発明者らは、上記問題点を解決すべく鋭意研究した結果、含塩素化合物および /またはハイド口カーボン類を含む粗へキサフルォロプロピレンを、平均細孔径が 3.[0009] As a result of intensive studies to solve the above problems, the present inventors have determined that crude hexafluoropropylene containing chlorine-containing compounds and / or hydrated carbons has an average pore diameter of 3.
4Α〜ιι Aであるゼォライトおよび Zまたは平均細孔径が 3. 5Α〜ιιΑである炭素 質吸着剤からなる吸着剤と接触させて含塩素化合物および Zまたはハイド口カーボ ン類の含有量を低減する工程と、蒸留精製工程とを組み合わせることにより高純度の へキサフルォロプロピレンを得ることができることを見出し、本発明を完成するに至つ た。 Reduce the content of chlorine-containing compounds and Z or Hyde mouth carbons by contacting with Zeolite and Z which are 4 吸着 ~ ιιA or carbonaceous adsorbent whose average pore size is 3.5Α ~ ιιΑ It has been found that high-purity hexafluoropropylene can be obtained by combining the process and the distillation purification process, and the present invention has been completed.
[0010] すなわち、本発明は、以下の [1]〜[15]により構成される。  That is, the present invention is configured by the following [1] to [15].
[0011] [1]クロロジフルォロメタンの熱分解を経て製造された粗へキサフルォロプロピレン を精製して高純度へキサフルォロプロピレンを製造する方法であって、  [1] A method for producing high-purity hexafluoropropylene by purifying crude hexafluoropropylene produced by thermal decomposition of chlorodifluoromethane,
(1)前記粗へキサフルォロプロピレンと、平均細孔径が 3. 4A〜llAであるゼオラ イトおよび Zまたは平均細孔径が 3. 5A〜11 Aである炭素質吸着剤力 なる吸着 剤とを接触させて、粗へキサフルォロプロピレン中の含塩素化合物および Zまたはハ イド口カーボン類の含有量を低減する工程、および  (1) The crude hexafluoropropylene, zeolite having an average pore diameter of 3.4 A to llA, and Z or an adsorbent having a carbonaceous adsorbent power having an average pore diameter of 3.5 A to 11 A Reducing the content of chlorine-containing compounds and Z or hard mouth carbons in crude hexafluoropropylene, and
( 2)工程( 1 )で得たへキサフルォロプロピレン中の低沸成分の含有量を蒸留により 低減する工程  (2) A step of reducing the content of low boiling point components in hexafluoropropylene obtained in step (1) by distillation.
を含む、高純度へキサフルォロプロピレンの製造方法。  A process for producing high purity hexafluoropropylene, comprising:
[0012] [2]前記含塩素化合物が、一般式: C H C1 F (式中、 vは 1〜4の整数、 xは 0〜2 の整数、 yは 1〜3の整数、 zは 1〜6の整数、 2v≤x+y+z≤2v+ 2)で表される少な くとも 1種の化合物である、上記 [1]に記載の高純度へキサフルォロプロピレンの製 造方法。  [2] The chlorine-containing compound has the general formula: CH C1 F (wherein v is an integer of 1 to 4, x is an integer of 0 to 2, y is an integer of 1 to 3, z is 1 to The method for producing high-purity hexafluoropropylene according to [1] above, which is at least one compound represented by an integer of 6 and 2v≤x + y + z≤2v + 2).
[0013] [3]前記含塩素化合物が、ジクロロジフルォロメタン、ジクロロフルォロメタン、クロ口 ジフノレオロメタン、クロロフノレォロエチレン、クロロトリフノレオ口エチレン、クロロテトラフ ルォロェタン、クロ口ペンタフルォロェタンおよびクロ口へキサフルォロプロパンからな る群より選ばれる少なくとも 1種である、上記 [1]に記載の高純度へキサフルォロプロ ピレンの製造方法。 [3] The chlorine-containing compound may be dichlorodifluoromethane, dichlorofluoromethane, Is at least one selected from the group consisting of difluororeomethane, chlorofluoroethylene, chlorotrifluoroethylene, chlorotetrafluoroethane, black pentafluoroethane, and black hexafluoropropane; The method for producing high-purity hexafluoropropylene as described in [1] above.
[0014] [4]前記ハイド口カーボン類がプロピレン、シクロプロパンおよびプロパンからなる群 より選ばれる少なくとも 1種である、上記 [1]に記載の高純度へキサフルォロプロピレ ンの製造方法。  [4] The method for producing high-purity hexafluoropropylene according to the above [1], wherein the hide mouth carbon is at least one selected from the group consisting of propylene, cyclopropane and propane.
[0015] [5]前記ゼォライトが、シリカ Zアルミニウム比が 2. 0以下のゼォライトである、上記  [5] The above zeolite is a zeolite having a silica Z aluminum ratio of 2.0 or less.
[1]に記載の高純度へキサフルォロプロピレンの製造方法。  The method for producing high-purity hexafluoropropylene according to [1].
[0016] [6]前記の低沸成分が、窒素、酸素、一酸化炭素および二酸化炭素からなる群より 選ばれる少なくとも一種である、上記 [1]に記載の高純度へキサフルォロプロピレン の製造方法。 [6] The high-purity hexafluoropropylene according to [1], wherein the low-boiling component is at least one selected from the group consisting of nitrogen, oxygen, carbon monoxide, and carbon dioxide. Production method.
[0017] [7]クロロジフルォロメタンの熱分解を経て製造された粗へキサフルォロプロピレン を蒸留して、粗へキサフルォロプロピレン中の高沸成分の含有量を低減した後、前記 工程(1)に供する、上記 [1]に記載の高純度へキサフルォロプロピレンの製造方法。  [7] [7] After distilling crude hexafluoropropylene produced by pyrolysis of chlorodifluoromethane to reduce the content of high-boiling components in the crude hexafluoropropylene, The method for producing high-purity hexafluoropropylene according to the above [1], which is used in the step (1).
[0018] [8]前記工程(2)で得られる高純度へキサフルォロプロピレン中の含塩素化合物の 含有量が 20volppm以下である、上記 [1]に記載の高純度へキサフルォロプロピレ ンの製造方法。  [0018] [8] The high-purity hexafluoropro as described in [1] above, wherein the content of the chlorine-containing compound in the high-purity hexafluoropropylene obtained in the step (2) is 20 volppm or less. Pyrene manufacturing method.
[0019] [9]前記工程(2)で得られる高純度へキサフルォロプロピレン中のハイド口カーボン 類の含有量が 30volppm以下である、上記 [1]に記載の高純度へキサフルォロプロ ピレンの製造方法。  [9] The high purity hexafluoropropylene according to the above [1], wherein the content of the hydrated carbon in the high purity hexafluoropropylene obtained in the step (2) is 30 volppm or less. Production method.
[0020] [10]前記工程(2)で得られる高純度へキサフルォロプロピレン中の低沸成分の含 有量が 20volppm以下である、上記 [1]に記載の高純度へキサフルォロプロピレン の製造方法。  [0020] [10] The high purity hexafluoro described in [1] above, wherein the content of the low boiling component in the high purity hexafluoropropylene obtained in the step (2) is 20 volppm or less. A method for producing lopropylene.
[0021] [11]前記工程(2)で得られる高純度へキサフルォロプロピレンの純度が 99. 99vo 1%以上である、上記 [1]に記載の高純度へキサフルォロプロピレンの製造方法。  [11] The high purity hexafluoropropylene according to the above [1], wherein the purity of the high purity hexafluoropropylene obtained in the step (2) is 99.99vo 1% or more. Production method.
[0022] [12]前記高純度へキサフルォロプロピレンが、半導体製造装置内または液晶製造 装置内の堆積物を除去するためのクリーニングガスとし使用される、上記 [1]に記載 の高純度へキサフルォロプロピレンの製造方法。 [0022] [12] The above [1], wherein the high-purity hexafluoropropylene is used as a cleaning gas for removing deposits in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus. A method for producing high-purity hexafluoropropylene.
[0023] [13]含塩素化合物の含有量が 20volppm以下、ハイド口カーボン類の含有量が 3 Ovolppm以下、および低沸成分の含有量が 20volppm以下であり、純度が 99. 99v ol%以上の高純度へキサフルォロプロピレンである、半導体または液晶製造装置内 の堆積物を除去するためのクリーニングガス。  [0023] [13] The content of chlorine-containing compounds is 20 volppm or less, the content of hydrated carbons is 3 Ovolppm or less, and the content of low-boiling components is 20 volppm or less, and the purity is 99.99 vol% or more. A cleaning gas for removing deposits in semiconductor or liquid crystal manufacturing equipment, which is high-purity hexafluoropropylene.
[0024] [14]前記高純度へキサフルォロプロピレン力 上記 [1]〜[12]のいずれかの方法 で製造された高純度へキサフルォロプロピレンである、上記 [13]に記載のタリーニン グガス。  [14] The high-purity hexafluoropropylene power described in [13] above, which is a high-purity hexafluoropropylene produced by the method according to any one of [1] to [12] above. Taring gas.
[0025] [15]上記 [13]に記載のクリーニングガスを使用し、 50〜500°Cの範囲の温度、 0 . 05〜lMPaの範囲の圧力で半導体製造装置内または液晶製造装置内の堆積物 を除去するクリーニング方法。  [0025] [15] Deposition in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus using the cleaning gas described in [13] above at a temperature in the range of 50 to 500 ° C and a pressure in the range of 0.05 to lMPa A cleaning method that removes objects.
発明の効果  The invention's effect
[0026] 本発明によれば、高純度のへキサフルォロプロピレンを簡便な方法で、効率的に 製造することができ、得られた高純度へキサフルォロプロピレンを、半導体製造装置 内または液晶製造装置内の堆積物を除去するためのプラズマクリーニングガスとして 好適に使用することができる。  According to the present invention, high-purity hexafluoropropylene can be efficiently produced by a simple method, and the obtained high-purity hexafluoropropylene is used in a semiconductor manufacturing apparatus. Alternatively, it can be suitably used as a plasma cleaning gas for removing deposits in the liquid crystal manufacturing apparatus.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0027] 以下、本発明の好ましい態様について詳しく説明する。  Hereinafter, preferred embodiments of the present invention will be described in detail.
[0028] 本発明の高純度へキサフルォロプロピレンの製造方法は、粗へキサフルォロプロピ レンを精製して高純度へキサフルォロプロピレンを製造する方法である。具体的には 、(1)上記粗へキサフルォロプロピレンと、平均細孔径が 3. 4A〜llAであるゼオラ イトおよび Zまたは平均細孔径が 3. 5A〜11 Aである炭素質吸着剤力 なる吸着 剤とを接触させて、粗へキサフルォロプロピレン中の含塩素化合物および Zまたはハ イド口カーボン類の含有量を低減する工程と、 (2)上記工程(1)で得たへキサフルォ 口プロピレン中の低沸成分の含有量を蒸留により低減する工程とを含んでいる。  The method for producing high-purity hexafluoropropylene according to the present invention is a method for producing high-purity hexafluoropropylene by purifying crude hexafluoropropylene. Specifically, (1) the above crude hexafluoropropylene, zeolite having an average pore size of 3.4 A to llA, and Z or a carbonaceous adsorbent having an average pore size of 3.5 A to 11 A A step of reducing the content of chlorine-containing compounds and Z or hard mouth carbons in the crude hexafluoropropylene by contacting with a powerful adsorbent; (2) obtained in the above step (1) And reducing the content of low boiling components in the hexafluoropropylene by distillation.
[0029] 本発明に用いられる粗へキサフルォロプロピレンは、クロロジフルォロメタンの熱分 解を経てテトラフルォロエチレンを製造する際に副生成物として製造され、クロ口フル ォロカーボン(CFC)類などの含塩素化合物、ハイド口フルォロカーボン(HFC)類や ハイドロカ ボン (HC)類などの飽和化合物や不飽和化合物等の様々な不純物を含 んでいる。 [0029] Crude hexafluoropropylene used in the present invention is produced as a by-product in the production of tetrafluoroethylene via thermal decomposition of chlorodifluoromethane. ) And other chlorine-containing compounds, Hyde mouth fluorocarbons (HFC) It contains various impurities such as saturated and unsaturated compounds such as hydrocarbons (HC).
[0030] 上記含塩素化合物としては、一般式: C H C1 F (式中、 Vは 1〜4の整数、 xは 0〜2 の整数、 yは 1〜3の整数、 zは 1〜6の整数、 2v≤x+y+z≤2v+ 2)で表される化合 物が挙げられ、粗へキサフルォロプロピレンにはこれらの化合物が 1種または 2種以 上含まれている。上記一般式で表される化合物の具体例としては、ジクロロジフルォ ロメタン(CC1 F )、ジクロロフルォロメタン(CHC1 F)、クロロジフルォロメタン(CHC1  [0030] The chlorine-containing compound may be represented by the general formula: CH C1 F (wherein V is an integer of 1 to 4, x is an integer of 0 to 2, y is an integer of 1 to 3, and z is 1 to 6) An integer, a compound represented by 2v≤x + y + z≤2v + 2), is included, and crude hexafluoropropylene contains one or more of these compounds. Specific examples of the compound represented by the above general formula include dichlorodifluoromethane (CC1 F), dichlorofluoromethane (CHC1 F), chlorodifluoromethane (CHC1
2 2 2  2 2 2
F )、クロ口フルォロエチレン(CH =CC1F)、クロ口トリフルォロエチレン(CF =CC1 F), black-opened fluoroethylene (CH = CC1F), black-opened trifluoroethylene (CF = CC1
2 2 22 2 2
F)、クロロテトラフルォロェタン(CF CHC1F)、クロ口ペンタフルォロェタン(CF CC1 F), chlorotetrafluoroethane (CF CHC1F), black-opened pentafluoroethane (CF CC1
3 3 3 3
F )およびクロ口へキサフルォロプロパン(CF CHFCC1F )などが挙げられる。粗へF) and black hexafluoropropane (CF CHFCC1F) and the like. Coarsely
2 3 2 2 3 2
キサフルォロプロピレン中の上記含塩素化合物の含有量は 0. 05vol%以下であるこ とが好ましい。  The content of the chlorine-containing compound in xafluoropropylene is preferably 0.05 vol% or less.
[0031] 上記ハイド口フルォロカーボン類としては、ジフルォロエチレン(CHF = CHF)、テト ラフルォロェタン(CF CH F)、トリフルォロプロペン(CF CH = CH )やフルォロプロ  [0031] Examples of the above-mentioned hydrated fluorocarbons include difluoroethylene (CHF = CHF), tetrafluoroethane (CF CH F), trifluoropropene (CF CH = CH), and fluoropro.
3 2 3 2  3 2 3 2
ペン(CH CF = CH )などが挙げられる。粗へキサフルォロプロピレン中の上記ハイ  Pens (CH CF = CH) and the like can be mentioned. The above high in crude hexafluoropropylene
3 2  3 2
ドロフルォロカーボン類の含有量は 0. 05vol%以下であることが好まし!/、。  The content of drofluorocarbons is preferably 0.05 vol% or less! /.
[0032] 上記ハイドロカ一ボン類としては、プロピレン(CH =CHCH )、シクロプロパン(C [0032] The above hydrocarbons include propylene (CH = CHCH), cyclopropane (C
2 3 3 2 3 3
H )やプロパン(CH CH CH )などが挙げられる。粗へキサフルォロプロピレン中のH) and propane (CH 2 CH 2 CH 3) and the like. In crude hexafluoropropylene
6 3 2 3 6 3 2 3
上記ハイド口カーボン類の含有量は 0. 05vol%以下であることが好ましい。  It is preferable that the content of the above-mentioned hide mouth carbons is 0.05 vol% or less.
[0033] 本発明に用いられる吸着剤は、(1)平均細孔径が 3. 4A〜llAのゼオライト、 (2) 平均細孔径が 3. 5A〜llAの炭素質吸着剤、または (3)上記ゼォライトと上記炭素 質吸着剤との混合物である。平均細孔径が上記範囲にあるゼォライトは、粗へキサフ ルォロプロピレン中の不純物の含有量の低減効果に優れている。また、平均細孔径 が上記範囲にある炭素質吸着剤は、粗へキサフルォロプロピレン中の不純物の含有 量の低減効果に優れている。さらに、不純物の含有量の低減効果がより向上する点 で、シリカ Zアルミニウム比が 2. 0以下のゼォライトがより好ましい。 [0033] The adsorbent used in the present invention includes (1) a zeolite having an average pore diameter of 3.4 A to llA, (2) a carbonaceous adsorbent having an average pore diameter of 3.5 A to llA, or (3) the above It is a mixture of zeolite and the above carbonaceous adsorbent. Zeolite having an average pore diameter in the above range is excellent in the effect of reducing the content of impurities in crude hexafluoropropylene. In addition, the carbonaceous adsorbent having an average pore diameter in the above range is excellent in the effect of reducing the content of impurities in the crude hexafluoropropylene. Further, zeolite having a silica-Z aluminum ratio of 2.0 or less is more preferable in that the effect of reducing the content of impurities is further improved.
[0034] すなわち、本発明の高純度へキサフルォロプロピレンの製造方法に用いられるゼ オライトは、 3. 4〜: L lA、好ましくは 3. 4〜: LOAの平均細孔径を有するものであるの がよい。平均細孔径が 11 Aより大きいゼォライトでは、へキサフルォロプロピレンの吸 着量が多くなり、平均細孔径が 3. 4 Aより小さいゼォライトでは含塩素化合物やハイ ドロカーボン類を吸着する能力が小さくなる場合がある。 That is, the zeolite used in the method for producing high-purity hexafluoropropylene of the present invention has an average pore diameter of 3.4 to: L 1A, preferably 3.4 to: LOA. Is there Is good. Zeolite with an average pore size larger than 11 A increases the amount of hexafluoropropylene adsorbed, and zeolite with an average pore size smaller than 3.4 A has the ability to adsorb chlorine-containing compounds and hydrocarbons. May be smaller.
[0035] また、ゼォライトの Si (シリカ) ZA1 (アルミニウム)比は 2. 0以下であることが好ましく 、 SiZAl比が 2より大きい場合には、含塩素化合物やハイド口カーボン類が選択的に 吸着されないことがある。ゼォライトとしては、モレキュラーシーブス 4A(MS—4A、ュ ユオン昭和株式会社製)、モレキュラーシーブス 5A (MS— 5A、ユニオン昭和株式 会社製)、モレキュラーシーブス 10X(MS— 10A、ユニオン昭和株式会社製)および モレキュラーシーブス 13X (MS - 13X、ユニオン昭和株式会社製)力もなる群より選 ばれる少なくとも 1種のゼォライトが好ま 、。  [0035] Further, the ratio of zeolite (Si) (silica) ZA1 (aluminum) is preferably 2.0 or less. When the SiZAl ratio is greater than 2, chlorine-containing compounds and hydrated carbons are selectively adsorbed. It may not be done. Zeolite includes molecular sieves 4A (MS-4A, made by Yuon Showa Co., Ltd.), molecular sieves 5A (MS-5A, made by Union Showa Co., Ltd.), molecular sieves 10X (MS-10A, made by Union Showa Co., Ltd.) and Molecular sieves 13X (MS-13X, manufactured by Union Showa Co., Ltd.) At least one kind of zeolite selected from the group that also has power is preferred.
[0036] 一方、炭素質吸着剤としては、活性炭、モレキュラーシービングカーボンが知られ ている。活性炭はヤシ殻、石炭、木材などを原料にし、高温で炭化した後賦活と呼ば れる原料に細孔を生成させる特殊処理を施し活性化した炭素で、優れた吸着剤とし て広い用途を有するが、本発明の製造方法では高度に制御された細孔径を有する 分子ふる!/、活性炭であるモレキュラーシービングカーボンを用いることが好ま 、。  [0036] On the other hand, activated carbon and molecular sieving carbon are known as carbonaceous adsorbents. Activated carbon is activated carbon made from coconut shell, coal, wood, etc., and carbonized at a high temperature and then activated by applying a special treatment to generate pores in the raw material, which has a wide range of uses as an excellent adsorbent. In the production method of the present invention, it is preferable to use molecular sieve having a highly controlled pore size! /, Molecular sieve carbon which is activated carbon.
[0037] 炭素質吸着剤は、 3. 5〜: L1Aの平均細孔径を有するものであるのがよぐ平均細 孔径が 11 Aより大きい炭素質吸着剤ではへキサフルォロプロピレンの吸着量が多く なり、平均細孔径が 3. 5Aより小さい炭素質吸着剤では含塩素化合物やハイドロカ 一ボン類を吸着する能力が小さくなる場合がある。炭素質吸着剤としては、モレキュ ラーシービングカーボン 4A (例えば武田薬品工業株式会社製)またはモレキュラー シービングカーボン 5A (例えば武田薬品工業株式会社製)が好ましぐこれらの併用 も可能である。  [0037] The carbonaceous adsorbent has an average pore diameter of 3.5 to: L1A. The carbonaceous adsorbent having an average pore diameter larger than 11 A is adsorbed by hexafluoropropylene. Carbonaceous adsorbents with an average pore size of less than 3.5A may have a reduced ability to adsorb chlorine-containing compounds and hydrocarbons. As the carbonaceous adsorbent, molecular sieve carbon 4A (for example, manufactured by Takeda Pharmaceutical Co., Ltd.) or molecular sieve carbon 5A (for example, manufactured by Takeda Pharmaceutical Co., Ltd.) can be used in combination.
[0038] また、上記ゼォライトと炭素質吸着剤とを含む上記吸着剤において、ゼォライトと炭 素質吸着剤との混合比は特に限定されず、粗へキサフルォロプロピレン中の不純物 の種類や含有量によって適宜設定される。  [0038] In the adsorbent containing the zeolite and the carbonaceous adsorbent, the mixing ratio of the zeolite and the carbonaceous adsorbent is not particularly limited, and the type and content of impurities in the crude hexafluoropropylene are not limited. It is set appropriately depending on the amount.
[0039] 上述したように、本発明では、上記吸着剤と粗へキサフルォロプロピレンとを接触さ せることにより、含塩素化合物および Zまたはハイド口カーボン類の含有量を低減す る。吸着剤と粗へキサフルォロプロピレンとの接触時の粗へキサフルォロプロピレン の状態は特に限定されず、例えば、粗へキサフルォロプロピレン力 気体の状態で 接触させる方法、気液が混合した状態で接触させる方法、あるいは液体の状態で接 触させる方法の 、ずれの方法でも可能である力 液体の状態で接触させる方法が効 率がよく好ましい。 [0039] As described above, in the present invention, the content of chlorine-containing compounds and Z or hydrated carbons is reduced by bringing the adsorbent into contact with crude hexafluoropropylene. Crude hexafluoropropylene during contact of adsorbent with crude hexafluoropropylene There is no particular limitation on the state of, for example, rough hexafluoropropylene force, a method of contacting in a gas state, a method of contacting in a gas-liquid mixed state, or a method of contacting in a liquid state. Force that can be used by the method The method of contacting in the liquid state is preferable because of its high efficiency.
[0040] 吸着剤と粗へキサフルォロプロピレンとの接触方法は、特に限定されな 、が、たと えば、回分式や連続式など公知の方法を用いることができる。工業的には、例えば固 定床式吸着塔を 2基設け、一方が飽和吸着に達すればこれを切り換えて再生する方 法が一般的である。また、接触処理の条件は特に限定されないが、処理温度は低温 が好ましぐたとえば、— 50〜50°Cの温度範囲が好ましぐより好ましくは— 20〜30 °Cの温度範囲である。また、処理圧力は、粗へキサフルォロプロピレンを液体の状態 で接触させる場合には、液体の状態に保持できる圧力であれば特に制限されず、ま た、気体の状態で接触させる場合にも特に限定されないが、好ましくは 0. 05MPa〜 IMPaの範囲である。  [0040] The method for contacting the adsorbent with the crude hexafluoropropylene is not particularly limited. For example, a known method such as a batch method or a continuous method can be used. In industry, for example, two fixed bed type adsorption towers are generally provided, and when one reaches saturation adsorption, this is switched and regenerated. The conditions for the contact treatment are not particularly limited, but the treatment temperature is preferably a low temperature. For example, a temperature range of −50 to 50 ° C. is more preferred, and a temperature range of −20 to 30 ° C. is more preferred. The treatment pressure is not particularly limited as long as the crude hexafluoropropylene is brought into contact in a liquid state as long as the pressure can be maintained in the liquid state, and when the contact is made in a gas state. Is not particularly limited, but is preferably in the range of 0.05 MPa to IMPa.
[0041] 前記粗へキサフルォロプロピレンは、前記吸着剤と接触させる前に、予め、蒸留塔 に導入して低沸成分 (低沸カット)や高沸成分 (高沸カット)を除去してもよ!/ヽが、この 場合、吸着剤から低沸成分の混入の可能性があり、再度、低沸成分を除去する必要 性がある。したがって、本発明に係る製造方法では、(1)前記粗へキサフルォロプロ ピレンと前記吸着剤とを接触させた後、(2)この工程(1)で得たへキサフルォロプロピ レンを蒸留して低沸成分の含有量を低減させる工程を実施する。さら〖こ、粗へキサフ ルォロプロピレン中の高沸成分は、上記接触工程(1)の前に予め低減されていること が好ましぐ本発明では、上記接触工程(1)の前に、粗へキサフルォロプロピレンを 蒸留して、粗へキサフルォロプロピレン中の高沸成分の含有量を低減する工程を有 することが好ましい。  [0041] Prior to contacting with the adsorbent, the crude hexafluoropropylene is introduced into a distillation column in advance to remove low boiling components (low boiling cut) and high boiling components (high boiling cut). In this case, however, there is a possibility that low-boiling components may be mixed from the adsorbent, and it is necessary to remove low-boiling components again. Therefore, in the production method according to the present invention, (1) the crude hexafluoropropylene and the adsorbent are contacted, and then (2) the hexafluoropropylene obtained in this step (1) is distilled. And a step of reducing the content of low boiling components. In the present invention, it is preferable that the high-boiling component in the scouring and crude hexafluoropropylene is reduced in advance before the contact step (1). It is preferable to have a step of distilling crude hexafluoropropylene to reduce the content of high-boiling components in the crude hexafluoropropylene.
[0042] 上記低沸成分としては、窒素、酸素、一酸化炭素、二酸化炭素、およびこれらの 2 種以上の混合物が挙げられる。  [0042] Examples of the low boiling point component include nitrogen, oxygen, carbon monoxide, carbon dioxide, and a mixture of two or more thereof.
[0043] このようにして、粗へキサフルォロプロピレンを上記吸着剤と接触させた後、蒸留す ることにより、含塩素化合物、ハイド口カーボン類、低沸成分の含有量を低減でき、純 度が 99. 99vol%以上の高純度へキサフルォロプロピレンを得ることができる。この 高純度へキサフルォロプロピレン中の含塩素化合物の含有量は 20volppm以下が 好ましぐ lOvolppm以下がより好ましぐハイド口カーボン類の含有量は 30volppm 以下が好ましぐ 20volppm以下がより好ましぐ低沸成分の含有量は 20volppm以 下が好ましぐ lOvolppm以下がより好ましい。 [0043] Thus, by bringing crude hexafluoropropylene into contact with the adsorbent and distilling it, the contents of chlorine-containing compounds, hydrated carbons, and low-boiling components can be reduced. High purity hexafluoropropylene having a purity of 99.99 vol% or more can be obtained. this The content of chlorine-containing compounds in high-purity hexafluoropropylene is preferably 20 volppm or less. The content of hydrated carbons is more preferably 30 volppm or less. The content of hydrated carbons is more preferably 20 volppm or less. The content of low boiling components is preferably 20 volppm or less, more preferably 10 volppm or less.
[0044] このような高純度へキサフルォロプロピレンは、半導体製造装置内または液晶製造 装置内の堆積物を除去するためのクリーニングガスとして使用することができる。この とき、高純度へキサフルォロプロピレンを単独で使用してもよいが、クリーニング条件 に応じて、 He、 Ar、 N [0044] Such high-purity hexafluoropropylene can be used as a cleaning gas for removing deposits in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus. At this time, high purity hexafluoropropylene may be used alone, but depending on the cleaning conditions, He, Ar, N
2、 Ne、 Krや含酸素化合物力もなる群力 選ばれる少なくとも 1 種の希釈ガスを添カ卩してもよい。上記含酸素化合物としては、 O  2, Ne, Kr, or group power that also has oxygen-containing compound power At least one type of dilution gas selected may be added. As the oxygen-containing compound, O
2、 CO、 CO  2, CO, CO
2、 NO、 2, NO,
N 0、 OF、 COF等が挙げられる。これらの希釈ガスの添力卩量は 40vol%以下が好N 0, OF, COF and the like. It is preferable that the amount of applied force of these dilution gases is 40 vol% or less.
2 2 2 2 2 2
ましい。  Good.
[0045] 上記クリーニングガスを使用して半導体製造装置をクリーニングする場合、プラズマ 条件でクリーニングしてもよいし、プラズマレス条件でクリーニングしてもよい。プラス、 マ条件でクリーニングする場合、励起源は上記クリーニングガス力 プラズマが励起 されるものであれば特に限定されないが、マイクロ波励起源を用いるとクリーニング効 率がよぐ好ましい。また、本発明のクリーニングガスを使用する温度範囲、圧力範囲 はプラズマを生成する範囲であれば特に限定されな!、が、 50〜500°Cの範囲の温 度が好ましぐ 0. 05〜lMPaの範囲の圧力が好ましい。一方、また、プラズマレス条 件でクリーニングする場合、クリーニングガスをチャンバ一内に導入し、好ましくはチ ヤンバー内の圧力を 0. 05〜lMPaの範囲に設定し、チャンバ一内およびタリー-ン グガスの少なくとも一部、あるいはどちらか一方を 150〜500°Cの範囲に加熱するこ とによりクリーニングガスを活性ィ匕させ、チャンバ一およびその他の堆積物が蓄積して いる領域力も堆積物をエッチングして取り除くことにより半導体製造装置をタリーニン グすることができる。  [0045] When the semiconductor manufacturing apparatus is cleaned using the cleaning gas, it may be cleaned under plasma conditions or may be cleaned under plasmaless conditions. In the case of cleaning under plus or minus conditions, the excitation source is not particularly limited as long as the above-described cleaning gas force plasma is excited, but the use of a microwave excitation source is preferable because the cleaning efficiency is good. In addition, the temperature range and pressure range in which the cleaning gas of the present invention is used are not particularly limited as long as they generate plasma. However, temperatures in the range of 50 to 500 ° C are preferred. A pressure in the lMPa range is preferred. On the other hand, when cleaning is performed under plasmaless conditions, a cleaning gas is introduced into the chamber, and preferably the pressure in the chamber is set in the range of 0.05 to lMPa. The cleaning gas is activated by heating at least one or both of them to a temperature in the range of 150 to 500 ° C., and the region force in which the chamber and other deposits are accumulated also etches the deposits. By removing it, the semiconductor manufacturing equipment can be tallyed.
[0046] [実施例]  [0046] [Example]
以下、本発明を実施例により説明するが、本発明は、この実施例により何ら限定さ れるものではない。  Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to the examples.
[0047] [調製例 1] クロロジフルォロメタン (CHC1F )から熱分解(熱分解温度 600°C)を経て四フツイ匕 [0047] [Preparation Example 1] After pyrolysis from chlorodifluoromethane (CHC1F) (pyrolysis temperature 600 ° C)
2  2
エチレンを製造する際に、生成物を 2度蒸留して四フッ化工チレンを回収した後、粗 へキサフルォロプロピレンを得た。この粗へキサフルォロプロピレンをガスクロマトグラ フ〔(株)島津製作所製「GC— 14A」、カラム:(株)島津製作所製 Pompack— Q (6m )、測定温度: 80〜200°C〕で分析した結果を表 1に示す。  In the production of ethylene, the product was distilled twice to recover tetrafluoroethylene, and then crude hexafluoropropylene was obtained. This crude hexafluoropropylene was gas chromatograph [GC-14A, manufactured by Shimadzu Corporation, column: Pompack-Q (6m), manufactured by Shimadzu Corporation, measuring temperature: 80 to 200 ° C] Table 1 shows the results of the analysis.
[実施例 1]  [Example 1]
[0048] 容積 1000mlのステンレス製シリンダーに、モレキュラーシ一ブス 13X (ユニオン昭 和株式会社製:平均細孔径 10 A、シリカ Zアルミニウム比 =0. 81) 80gと炭素質吸 着剤 (モレキユラーシービング力 ボン 5A、武田薬品工業株式会社製:平均細孔径 5A) 70gとを混合して充填し、真空乾燥した。次いで、シリンダ—を冷却しながら、上 記調製例 1で得た粗へキサフルォロプロピレンを約 550g充填し、室温で時々攪拌し 、充填力ゝら約 12時間後の液相部を回収した〔工程(1)〕。この液相部をガスクロマトグ ラフ〔(株)島津製作所製「GC— 14A」、カラム:(株)島津製作所製 Pompack— Q (6 m)、測定温度: 80〜200°C〕で分析した。結果を表 1に示す。  [0048] In a 1000 ml stainless steel cylinder, molecular sieve 13X (manufactured by Union Showa Co., Ltd .: average pore diameter 10 A, silica Z aluminum ratio = 0.81) 80 g and carbonaceous adsorbent (Molecular Seeding force Bonn 5A, Takeda Pharmaceutical Co., Ltd .: average pore diameter 5A) 70 g were mixed and filled, and then vacuum dried. Next, while cooling the cylinder, about 550 g of the crude hexafluoropropylene obtained in Preparation Example 1 above was charged, and stirred occasionally at room temperature, and the liquid phase portion after about 12 hours was recovered from the filling power. [Step (1)]. This liquid phase part was analyzed by a gas chromatograph [“GC-14A” manufactured by Shimadzu Corporation, column: Pompack-Q (6 m) manufactured by Shimadzu Corporation, measurement temperature: 80 to 200 ° C.]. The results are shown in Table 1.
[0049] 次に、上記工程 (1)で得た液相部を蒸留塔に導入し、蒸留塔の塔頂部より低沸成 分を抜き出し (低沸カット)、蒸留塔の底部より液相部を回収した〔工程 (2)〕。この液 相部をガスクロマトグラフ〔(株)島津製作所製「GC— 14A」、カラム:(株)島津製作所 製 Pompack— Q (6m)、測定温度: 80〜200°C〕で分析した。結果を表 1に示す。  [0049] Next, the liquid phase part obtained in the above step (1) is introduced into the distillation column, the low boiling component is extracted from the top of the distillation column (low boiling cut), and the liquid phase part is extracted from the bottom of the distillation column. [Step (2)]. This liquid phase part was analyzed by a gas chromatograph [“GC-14A” manufactured by Shimadzu Corporation, column: Pompack-Q (6 m) manufactured by Shimadzu Corporation, measurement temperature: 80 to 200 ° C.]. The results are shown in Table 1.
[0050] [参考例 1]  [0050] [Reference Example 1]
容積 200mlのステンレス製シリンダーに、モレキユラ一シ一ブス 13X (ユニオン昭和 株式会社製:平均細孔径 10 A、シリカ Zアルミニウム比 =0. 81)を 30g充填し、真 空乾燥した。次いで、シリンダーを冷却しながら、上記調製例 1で得た粗へキサフル ォロプロピレンを約 70g充填し、室温で時々攪拌し、充填力も約 12時間後の液相部 を回収した。この液相部をガスクロマトグラフ〔 (株)島津製作所製「GC— 14A」、カラ ム:(株)島津製作所製 Pompack— Q (6m)、測定温度: 80〜200°C〕で分析した。 結果を表 1に示す。  A stainless steel cylinder with a capacity of 200 ml was filled with 30 g of Molecular Sieves 13X (Union Showa Co., Ltd .: average pore diameter 10 A, silica Z aluminum ratio = 0.81) and dried in the air. Next, while cooling the cylinder, about 70 g of the crude hexafluoropropylene obtained in Preparation Example 1 was charged, stirred occasionally at room temperature, and the liquid phase part after about 12 hours of filling force was recovered. This liquid phase portion was analyzed by gas chromatography [“GC-14A” manufactured by Shimadzu Corporation, column: Pompack-Q (6 m) manufactured by Shimadzu Corporation, measurement temperature: 80 to 200 ° C.]. The results are shown in Table 1.
[0051] [参考例 2]  [0051] [Reference Example 2]
容積 200mlのステンレス製シリンダ—に、炭素質吸着剤(モレキユラ—シ—ビング力 —ボン 5A、武田薬品工業株式会社製:平均細孔径 5A)を 20g充填し、真空乾燥し た。次いで、シリンダ—を冷却しながら、上記調製例 1で得た粗へキサフルォロプロピ レンを約 60g充填し、室温で時々攪拌し、充填力ゝら約 12時間後の液相部を回収した 。この液相部をガスクロマトグラフ〔(株)島津製作所製「GC— 14A」、カラム:(株)島 津製作所製 Porapack— Q (6m)、測定温度: 80〜200°C〕で分析した。結果を表 1 に示す。 Carbonaceous adsorbent (molecular scrubbing force) on a 200 ml stainless steel cylinder —Bonn 5A, Takeda Pharmaceutical Co., Ltd .: average pore size 5A) was filled with 20 g and vacuum dried. Next, while cooling the cylinder, about 60 g of the crude hexafluoropropylene obtained in Preparation Example 1 above was charged and stirred occasionally at room temperature, and the liquid phase portion after about 12 hours was recovered with a filling power of about 12 hours. did . This liquid phase part was analyzed with a gas chromatograph [“GC-14A” manufactured by Shimadzu Corporation, column: Porapack-Q (6 m) manufactured by Shimadzu Corporation, measurement temperature: 80 to 200 ° C.]. The results are shown in Table 1.
[表 1] [table 1]
表 1 table 1
Figure imgf000013_0001
Figure imgf000013_0001
(単位: V o 1 %)  (Unit: V o 1%)

Claims

請求の範囲 [1] クロロジフルォロメタンの熱分解を経て製造された粗へキサフルォロプロピレンを精 製して高純度へキサフルォロプロピレンを製造する方法であって、 Claims [1] A method for producing high-purity hexafluoropropylene by refining crude hexafluoropropylene produced by thermal decomposition of chlorodifluoromethane,
(1)前記粗へキサフルォロプロピレンと、平均細孔径が 3. 4A〜llAであるゼオラ イトおよび Zまたは平均細孔径が 3. 5A〜11 Aである炭素質吸着剤力 なる吸着 剤とを接触させて、粗へキサフルォロプロピレン中の含塩素化合物および Zまたはハ イド口カーボン類の含有量を低減する工程、および  (1) The crude hexafluoropropylene, zeolite having an average pore diameter of 3.4 A to llA, and Z or an adsorbent having a carbonaceous adsorbent power having an average pore diameter of 3.5 A to 11 A Reducing the content of chlorine-containing compounds and Z or hard mouth carbons in crude hexafluoropropylene, and
( 2)工程( 1 )で得たへキサフルォロプロピレン中の低沸成分の含有量を蒸留により 低減する工程  (2) A step of reducing the content of low boiling point components in hexafluoropropylene obtained in step (1) by distillation.
を含む、高純度へキサフルォロプロピレンの製造方法。  A process for producing high purity hexafluoropropylene, comprising:
[2] 前記含塩素化合物が、一般式: C H C1 F (式中、 Vは 1〜4の整数、 Xは 0〜2の整 数、 yは 1〜3の整数、 zは 1〜6の整数、 2v≤x+y+z≤2v+ 2)で表される少なくとも 1種の化合物である、請求項 1に記載の高純度へキサフルォロプロピレンの製造方 法。  [2] The chlorine-containing compound has the general formula: CH C1 F (where V is an integer of 1 to 4, X is an integer of 0 to 2, y is an integer of 1 to 3, and z is 1 to 6) The method for producing high-purity hexafluoropropylene according to claim 1, which is at least one compound represented by an integer, 2v≤x + y + z≤2v + 2).
[3] 前記含塩素化合物が、ジクロロジフルォロメタン、ジクロロフルォロメタン、クロロジフ ノレォロメタン、クロロフノレォロエチレン、クロロトリフノレオ口エチレン、クロロテトラフノレオ ロェタン、クロ口ペンタフルォロェタンおよびクロ口へキサフルォロプロパンからなる群 より選ばれる少なくとも 1種である、請求項 1に記載の高純度へキサフルォロプロピレ ンの製造方法。  [3] The chlorine-containing compound may be dichlorodifluoromethane, dichlorofluoromethane, chlorodifluoromethane, chlorofluoroethylene, chlorotrifluoroethylene, chlorotetrafluoroethane, chloropentafluoroethane, or chloropentafluoroethane. The method for producing high-purity hexafluoropropylene according to claim 1, wherein the method is at least one selected from the group consisting of oral hexafluoropropane.
[4] 前記ハイド口カーボン類がプロピレン、シクロプロパンおよびプロパンからなる群より 選ばれる少なくとも 1種である、請求項 1に記載の高純度へキサフルォロプロピレンの 製造方法。  [4] The method for producing high-purity hexafluoropropylene according to [1], wherein the hydrated carbon is at least one selected from the group consisting of propylene, cyclopropane and propane.
[5] 前記ゼォライトが、シリカ Zアルミニウム比が 2. 0以下のゼォライトである、請求項 1 に記載の高純度へキサフルォロプロピレンの製造方法。  5. The method for producing high-purity hexafluoropropylene according to claim 1, wherein the zeolite is zeolite having a silica Z aluminum ratio of 2.0 or less.
[6] 前記の低沸成分が、窒素、酸素、一酸化炭素および二酸化炭素からなる群より選 ばれる少なくとも一種である、請求項 1に記載の高純度へキサフルォロプロピレンの 製造方法。 6. The method for producing high-purity hexafluoropropylene according to claim 1, wherein the low-boiling component is at least one selected from the group consisting of nitrogen, oxygen, carbon monoxide and carbon dioxide.
[7] クロロジフルォロメタンの熱分解を経て製造された粗へキサフルォロプロピレンを蒸 留して、粗へキサフルォロプロピレン中の高沸成分の含有量を低減した後、前記ェ 程(1)に供する、請求項 1に記載の高純度へキサフルォロプロピレンの製造方法。 [7] Steamed crude hexafluoropropylene produced by pyrolysis of chlorodifluoromethane 2. The method for producing high-purity hexafluoropropylene according to claim 1, wherein the high-boiling component content in the crude hexafluoropropylene is reduced and then subjected to the step (1). .
[8] 前記工程(2)で得られる高純度へキサフルォロプロピレン中の含塩素化合物の含 有量が 20volppm以下である、請求項 1に記載の高純度へキサフルォロプロピレン の製造方法。 [8] The production of high purity hexafluoropropylene according to claim 1, wherein the content of the chlorine-containing compound in the high purity hexafluoropropylene obtained in the step (2) is 20 volppm or less. Method.
[9] 前記工程(2)で得られる高純度へキサフルォロプロピレン中のハイド口カーボン類 の含有量が 30volppm以下である、請求項 1に記載の高純度へキサフルォロプロピ レンの製造方法。  [9] The high purity hexafluoropropylene according to claim 1, wherein the content of the hydrated carbon in the high purity hexafluoropropylene obtained in the step (2) is 30 volppm or less. Production method.
[10] 前記工程(2)で得られる高純度へキサフルォロプロピレン中の低沸成分の含有量 力 S20volppm以下である、請求項 1に記載の高純度へキサフルォロプロピレンの製 造方法。  [10] The production of high purity hexafluoropropylene according to claim 1, wherein the content of the low boiling component in the high purity hexafluoropropylene obtained in the step (2) is S20 volppm or less. Method.
[11] 前記工程(2)で得られる高純度へキサフルォロプロピレンの純度が 99. 99vol%以 上である、請求項 1に記載の高純度へキサフルォロプロピレンの製造方法。  [11] The process for producing high-purity hexafluoropropylene according to [1], wherein the purity of the high-purity hexafluoropropylene obtained in the step (2) is 99.99vol% or more.
[12] 前記高純度へキサフルォロプロピレンが、半導体製造装置内または液晶製造装置 内の堆積物を除去するためのクリーニングガスとし使用される、請求項 1に記載の高 純度へキサフルォロプロピレンの製造方法。 12. The high purity hexafluoropropylene according to claim 1, wherein the high purity hexafluoropropylene is used as a cleaning gas for removing deposits in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus. A method for producing propylene.
[13] 含塩素化合物の含有量が 20volppm以下、ハイド口カーボン類の含有量が 30volp pm以下、および低沸成分の含有量が 20volppm以下であり、純度が 99. 99vol% 以上の高純度へキサフルォロプロピレンである、半導体または液晶製造装置内の堆 積物を除去するためのクリーニングガス。 [13] A high-purity hex having a chlorine-containing compound content of 20 volppm or less, a hydrated carbon content of 30 volp pm or less, and a low-boiling component content of 20 volppm or less and a purity of 99.99 vol% or more. Cleaning gas for removing deposits in semiconductor or liquid crystal manufacturing equipment, which is fluoropropylene.
[14] 前記高純度へキサフルォロプロピレン力 請求項 1〜12のいずれかの方法で製造 された高純度へキサフルォロプロピレンである、請求項 13に記載のクリーニングガス [14] The cleaning gas according to claim 13, wherein the cleaning gas is high-purity hexafluoropropylene produced by the method according to any one of claims 1 to 12.
[15] 請求項 13に記載のクリーニングガスを使用し、 50〜500°Cの範囲の温度、 0. 05 〜lMPaの範囲の圧力で半導体製造装置内または液晶製造装置内の堆積物を除 去するクリーニング方法。 [15] Using the cleaning gas according to claim 13, the deposits in the semiconductor manufacturing apparatus or the liquid crystal manufacturing apparatus are removed at a temperature in the range of 50 to 500 ° C and a pressure in the range of 0.05 to lMPa. How to clean.
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