WO2008001807A1

WO2008001807A1 - Metal wire rod plating insoluble anode and production method of wire rod

Info

Publication number: WO2008001807A1
Application number: PCT/JP2007/062894
Authority: WO
Inventors: Kenichi Murakami; Yukihiro Umezaki
Original assignee: Bridgestone Corporation
Priority date: 2006-06-30
Filing date: 2007-06-27
Publication date: 2008-01-03
Also published as: JP2008007832A

Abstract

A metal wire rod plating insoluble anode which can make uniform a plating deposition amounts in a plurality of metal wire rods constantly and for an extended period, can contribute to simplifying a plating facility and to facilitating a wire leading job, and provides an excellent feature in releasing gas produced due to plating reaction; and a production method of a wire rod using this. An insoluble anode for an electroplating device for concurrently electroplating a plurality of metal wire rods (60) traveling in parallel through plating solution. The electroplating device comprises a plurality of insoluble electrode plates (20) arranged in parallel and oppositely so as to hold the wire pass line of each metal wire rod (60) from the opposite sides, a plurality of conductive contacts (30) sandwiched between the electrode plates to form an equidistant gap between them, and a plurality of through bolts (40) for fastening and fixing the plurality of insoluble electrode plates (20) and conductive contacts (30) in a parallel direction at a plurality of locations in a wire rod pass line direction.

Description

Specification

Insoluble anode for metal wire plating and method for producing wire

Technical field

The present invention relates to an insoluble anode for metal wire plating and a method for manufacturing the wire (hereinafter also simply referred to as “insoluble anode” and “manufacturing method”, respectively). Specifically, the present invention travels in parallel in the plating solution. The present invention relates to an insoluble anode used in a plating apparatus that simultaneously applies electrical plating to a plurality of metal wires, and a method of manufacturing a wire using the same.

Background art

[0002] There is a steel cord for tires as one of products obtained by applying electrical plating to a metal wire. In the production of this steel cord, copper and zinc plating are generally applied to the steel wire. In these electroplating processes, a plurality of metal wires are run along the electrode plates arranged in the plating tank, and are passed through the plating solution in the tank, so that the surface of each metal wire is electroplated. I do. An electrode plate that has been conventionally used for such wire rods is a soluble anode.

[0003] In an electric plating using a soluble electrode, a metal plate or the like made of the same material as the metallic metal is used as a soluble anode, and the metallic electrode is dissolved in the plating solution by the anodic dissolution by energization to supply metallic metal ions. To do. In this method, since the electrode plate is melted, the distance from the metal wire serving as the cathode changes, and the thickness of the plating changes with time, which makes it difficult to obtain a stable quality product. is there. In addition, there is a problem in work efficiency that the electrode plates must be replaced frequently. Under these circumstances, the use of insoluble anodes in place of soluble anodes has been increasing recently.

[0004] In the metal plating method using a metal wire using an insoluble anode, the supply of metal metal ions from the electrode plate cannot be expected. Therefore, it is necessary to separately provide a metal metal ion supply means. Fig. 4 shows the schematic structure of a measuring device that is generally used in the electroplating method using an insoluble anode.

In the measuring apparatus shown in FIG. 4, an insoluble electrode plate 3 is horizontally disposed at the bottom of the measuring tank 2 that stores the measuring liquid 1. Overflow of the measuring liquid 1 from the measuring tank 2, and the guide roller 4 arranged before and after the measuring tank 2, the metal wire 5 is moved below the level of the measuring liquid 1. Pass through the tank 2 while supporting. At this time, a voltage is applied between the metal wire 5 and the electrode plate 3 using the power feeding means 6. The measurement liquid 1 overflowing from the measurement tank 2 is collected in the auxiliary tank 7 and returned to the measurement tank 2 by a pump. The plating metal in the plating solution consumed as the plating operation proceeds is appropriately replenished by a supply means (not shown).

In such an electric plating apparatus, the electrode plate is opposed only from the lower side to the metal wire passing through the plating liquid. Since the upper side of the wire is open, the facilities are simple and the electrode plate has the advantage that it does not block the wiring work.In addition, the release of gas generated by the plating reaction in the plating tank Is also good. However, there is a problem in the plating quality that the amount of adhesion of the upper surface is smaller than that of the lower surface facing the electrode plate, and the distribution of the amount of adhesion of the plating tends to be uneven in the circumferential direction of the wire.

[0007] In order to solve the problem while leaving the advantages of the electric plating apparatus, two electrode plates are installed facing each other so that the wire pass line in the plating tank is sandwiched from both sides, and between the electrode plates on both sides. Patent Document 1 describes an electric plating method for passing a metal wire! Speak. According to this method, the uniformity of the adhesion amount distribution in the circumferential direction of the wire is improved and the upper side of the wire path line is opened, so that the above-described advantages are inherited as they are. In the case of simultaneously electroplating a plurality of metal wires, the same document describes a form in which a metal wire is passed between each of a plurality of electrode plates arranged at a predetermined interval.

Patent Document 1: JP 2000-192291 A

Disclosure of the invention

Problems to be solved by the invention

[0008] In order to increase the productivity of the plating wire, it is indispensable to have a technique of passing a plurality of metal wires in parallel in the plating solution and simultaneously applying electric plating to them. In addition, for this simultaneous marking, the method of arranging a plurality of vertically arranged electrode plates in the thickness direction in the measuring tank and passing the metal wire between each of the electrode plates is very conceptual. Is reasonable. However, if this is actually attempted, the amount of adhesion of the metal will vary among a plurality of metal wires, making it very difficult to evenly align them. This tendency became more prominent as the number of metal wires that flickered at a time increased, and this resulted in hindering the productivity of the flake wires. [0009] Accordingly, an object of the present invention is to provide an insoluble anode for metal wire plating that can stably and uniformly uniform the amount of plating on each metal wire for a long period of time when applying electrical plating to a plurality of metal wires simultaneously. In addition to being able to simplify the equipment, the electrode plate has the advantage of not interrupting the wire connection, and in addition to the metal reaction in the plating tank. An object of the present invention is to provide an insoluble anode for metal wire plating that is excellent in the release of generated gas and a method for producing a wire using the same.

Means for solving the problem

[0010] In order to achieve the above object, the present inventors have made a plurality of metal wire rods by using a multiple wire simultaneous method in which a metal wire material is passed between gaps of a plurality of vertically arranged electrode plates. We studied diligently about the causes and countermeasures for the variation in the amount of adhesion. As a result, the following facts were found.

[0011] The cause of the variation in the adhesion amount between the plurality of metal wires traveling in parallel is the unevenness of the plating current in the gaps of the plurality of electrode plates. In addition to dimensional variations, this is due to variations in power supply to each electrode plate. In order to suppress the dimensional variation of the gap and the variation in power supply to the electrode plate, a plurality of electrode plates are fixed by tightening in the plate thickness direction with a through bolt with a conductive contact between each gap. Is effective. In other words, if a plurality of electrode plates are fixed by sandwiching conductive contacts in each gap and tightening them in the plate thickness direction with through bolts, the dimensional variation of the gaps and the power supply to the electrode plates will be reduced. Both variations are effectively suppressed.

[0012] That is, the insoluble anode for metal wire plating according to the present invention is an insoluble anode for an electrical plating apparatus that simultaneously applies electrical plating to a plurality of metal wires running in parallel in a plating solution. A plurality of insoluble electrode plates arranged in parallel so as to face each other with a wire rod pass line sandwiched from both sides, and a plurality of insoluble electrode plates are interposed between each other to form equally spaced gaps therebetween. It comprises a plurality of conductive contacts, a plurality of insoluble electrode plates, and a plurality of through bolts that fasten and fix the conductive contacts in a parallel direction at a plurality of locations in the wire pass line direction. To do.

[0013] In the present invention, it is preferable that the plurality of conductive contacts are arranged at a plurality of locations in the wire pass line direction with a space therebetween, and the wire pass line between each of the plurality of insoluble electrode plates is preferable. It is also preferable to arrange it below the wire rod pass line so as not to interfere with the wire. Further, it is preferable to form a bolt hole through which the through bolt penetrates into at least one of the plurality of insoluble electrode plates or the plurality of conductive contacts so as to reach the end face of the member.

[0014] In addition, the method for manufacturing a wire according to the present invention is more than the method for manufacturing a wire including a plating process in which an electric plating is applied to the wire by running in a plating solution. Electrical plating is performed using an insoluble anode for use.

The invention's effect

[0015] According to the insoluble anode of the present invention, a plurality of insoluble electrode plates and a plurality of conductive contacts forming gaps at equal intervals therebetween are fastened and fixed by a plurality of through bolts. With this configuration, when applying electrical plating to a plurality of metal wires at the same time by passing between these insoluble electrode plates, the amount of adhesion of the plating can be made uniform among the metal wires and stable over a long period of time. Thus, the wire rod can be treated. Therefore, according to the manufacturing method of the present invention using a powerful insoluble anode, it is possible to stably obtain a high quality finished wire material over a long period of time.

[0016] In addition, if a plurality of conductive contacts are disposed at a plurality of positions in the wire material pass line direction at intervals in the insoluble anode of the present invention, a space is formed between adjacent conductive contacts. Since the gap between the electrodes communicates in the vertical direction at this part, the stirring flow of the plating solution is not hindered. Furthermore, if a plurality of conductive contacts are arranged below the wire path line, obstacles from the upper side of the wire path line are completely eliminated, and the equipment can be simplified, and the wiring work is interrupted. It is possible to improve the release of gas generated by the plating reaction in the plating tank. Furthermore, in at least one of the plurality of insoluble electrode plates or the plurality of conductive contacts, if the bolt hole that penetrates the through bolt is formed in a cut shape that reaches the end surface of the member, the tightening is loosened without removing the through bolt. Only these members can be attached and detached, and the replacement work is simplified.

Brief Description of Drawings

FIG. 1 is a front view showing an insoluble anode for metal wire plating according to an embodiment of the present invention. FIG. 2 is a plan view showing an insoluble anode for metal wire plating. FIG. 3 is a side view showing an insoluble electrode plate used for the insoluble anode for metal wire plating.

FIG. 4 is a schematic side view showing a conventional insoluble anode for metal wire plating.

Explanation of symbols

[0018] 10 outer frame

11 Terminal

20 Insoluble electrode plate

21 Electrode surface

22 Bolt hole

30 Conductive contact

40 Through bolt

41 Natsu

60 metal wire

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of an insoluble anode for metal wire plating showing an embodiment of the present invention, FIG. 2 is a plan view of the insoluble anode for metal wire plating, and FIG. 3 is an insoluble used for the insoluble anode for metal wire plating. It is a side view of an electrode plate.

[0020] The insoluble anode of the present embodiment is used in an electric plating apparatus for simultaneously electroplating a plurality of metal wires that run horizontally in a plating solution in a plating tank. As shown in FIGS. 1 and 2, the insoluble anode includes a plurality of insoluble electrode plates 20 and a plurality of insoluble electrode plates 20 arranged in parallel at predetermined intervals between outer frames 10 and 10 on both sides. A plurality of conductive contacts 30 inserted between each of the gaps that form an equidistant gap between each other, and a plurality of through bolts 40 that fasten and fix these in the thickness direction.

[0021] The plurality of insoluble electrode plates 20 are conductive thin plates that are long and rectangular in the running direction of the metal wire 60 to be plated, and are made of metal titanium, titanium tantalum, which is not eroded by the plating solution, Titanium-based alloys such as titanium tantalum niobium and titanium palladium are suitable. For example, a titanium plate having a thickness of about 1 mm can be used. [0022] As shown in FIG. 3, a bolt hole 22 through which a tightening through bolt 40 passes is formed in the lower part of the insoluble electrode plate 20. The bolt holes 22 are provided at intervals in the longitudinal direction of the electrode plate 20. Here, the bolt holes 22 are opened at both ends in the longitudinal direction of the electrode plate 20, which are fastening portions by the through bolts 40. Each bolt hole 22 is a long hole extending downward, and has an inverted U-shaped cut shape reaching the lower end surface of the electrode plate 20.

The outer frames 10 and 10 on both sides sandwiching the plurality of insoluble electrode plates 20 have the same length as the insoluble electrode plates 20. Each outer frame 10 is made of a titanium material that is not eroded by the plating solution like the insoluble electrode plate 20, has a thickness that can secure sufficient mechanical strength, and corresponds to the bolt hole 22 of the insoluble electrode plate 20. It has a bolt hole provided. Terminals 11 are attached to both ends of each outer frame 10 in the longitudinal direction for supplying power to a plurality of insoluble electrode plates 20 arranged between the outer frames 10 and 10 on both sides.

[0024] The plurality of conductive contacts 30 are made of a conductive thick plate that is lower than the insoluble electrode plate 20 and sufficiently short, and are disposed between the lower portions of the plurality of insoluble electrode plates 20, so A space for a pass line for allowing the metal wire 60 to pass between the electrolytic surfaces facing each other is formed. As a result, the upper side of the wire path line is opened over the entire length of the line, the structure of the apparatus is simplified, and a better gas releasing property is ensured without the conductive contact obstructing the wire connection work. These conductive contacts 30 are preferably arranged at a plurality of locations in the pass line direction at intervals. Here, the conductive contacts 30 are arranged at both ends in the pass line direction, which are tightened portions by the through bolts 40. The conductive contact 30 is also arranged not only between each of the plurality of insoluble electrode plates 20 but also between the insoluble anode plates 20 at both ends and the outer frame 10 on the outside thereof.

[0025] Each conductive contact 30 is not eroded by the plating solution in the same manner as the insoluble electrode plate 20, but is made of a material such as platinum, titanium, tantalum, niobium, zirconium, or an alloy mainly composed of any of these. Etc., and has two bolt holes through which the through bolt 40 passes.

[0026] The lower surfaces of all insoluble electrode plates 20 and all conductive contacts 30 are located on the same plane to form a horizontal flat surface.

[0027] As described above, the through bolts 40 are disposed at both ends in the pass line direction, which are tightening portions, and are disposed between the outer frames 10 and 10 on both sides in each tightening portion. The plurality of electrode plates 20 and the conductive contacts 30 are penetrated in the parallel direction. Then, the nuts 41 and 41 are screwed into both end portions projecting outside the outer frames 10 and 10, so that these members are firmly tightened and fixed in the parallel direction. The through bolt 40 and the nuts 41 and 41 are also made of a titanium material that is not eroded by the plating liquid, as with the other members.

Next, the usage method and function of the insoluble anode of this embodiment will be described.

[0029] After the assembly, the insoluble anode is placed in a plating tank and immersed in the plating solution in the tank. The metal wire 60 to be measured is passed through a horizontal pass line formed between each of the plurality of insoluble electrode plates 20, more specifically between the opposing electrode surfaces 21 and 21. As a result, a plurality of metal wires 60 travel in parallel in the plating solution with the electrode plates 20 and 20 sandwiched from both sides.

At this time, power is supplied to the plurality of insoluble electrode plates 20 from the terminal 11 exposed outside the plating solution. The grounding of the metal wire 60 that is the cathode, the circulation of the plating solution in the plating tank, the supply of plating metal ions into the plating solution, etc. are the same as in the past.

[0031] Thereby, the plurality of metal wires 60 traveling in parallel in the plating solution are simultaneously electrically meshed. If there are 20 electrode plates 20, 19 metal wires 60 can be simultaneously measured. In actual operation, dozens of metal wires 60 can be run in parallel and measured simultaneously.

[0032] In such a multiple-line simultaneous plating, the insoluble electrode plates 20 are arranged on both sides of each metal wire 60 so as to face each other, so that an electric measurement with an equal thickness is performed around the metal wire 60. be able to. Since the electrode plate is insoluble, there is no consumption due to the progress of the metal operation, and there is no change in the distance between the electrodes. Due to the structure in which multiple insoluble electrode plates 20 are clamped in the thickness direction by through bolts 40 with conductive contacts 30 in each gap, all the insoluble electrode plates 20 are fixed in parallel and between the upper electrodes. The lateral width (distance between the electrodes) of the pass line space formed in is fixed uniformly in each gap. For this reason, the adhesion amount of the metal on the plurality of metal wires 60 can be made uniform.

In addition to this, by tightening the through bolts 40 in the plate thickness direction, the plurality of electrode plates 20 are brought into strong surface contact via the conductive contacts 30 and the electrical resistance at the contact surfaces of both is reduced. Therefore, the screws attached to the ends in the member parallel direction, that is, the outer frames 10 and 10 on both sides Even when power is supplied from one terminal 11, uniform power supply to each electrode plate 20 is possible.

Thus, in the insoluble anode of the present embodiment, the amount of plating adhesion on the plurality of metal wires 60 can be made uniform from the viewpoint of reducing the contact resistance, and the uniformity can be maintained for a long period of time. It goes without saying that the electrode active material coated on the contact surface contributes to this homogenization.

[0035] Between each of the plurality of electrode plates 20, conductive contacts 30 are arranged at intervals in a plurality of locations in the pass line direction, and in the illustrated example, they are arranged at both ends in the pass line direction. . For this reason, a large gap is formed between the conductive contacts adjacent in the nosline direction, and the lower part between the electrodes is substantially open like the upper part. For this reason, good fluidity of the plating solution is secured, which also contributes to uniform plating.

[0036] Further, since the upper part of the plurality of insoluble electrode plates 20 is opened upward along the entire length of the pass line, the structure of the apparatus is simplified, and there is no member that interrupts the wiring work before the start of plating. Workability is improved. Furthermore, the release of the gas generated by the plating reaction is good, which also contributes to the improvement of uniform plating and plating quality.

[0037] Regarding workability, the electrode plate 20 has a reverse U-shaped cut shape in which the bolt hole 22 in the electrode plate 20 reaches the lower surface. Therefore, if the through bolt 40 is loosened, the electrode plate 20 can be pulled upward without disassembling the electrode plate 20 and the conductive contact 30 by pulling out the through bolt 40. It becomes easy. Not only the electrode plate 20 but also the conductive contact 30 can be formed into an inverted U-shaped notch that reaches the bottom surface of the bolt hole.

[0038] In the above embodiment, the tightening portions (conductive contactor placement portions) with through bolts are set at both ends in the longitudinal direction of the electrode plate. However, it may be at three or more locations at both ends and the center. It can be suitably selected according to the length of the electrode plate.

[0039] The insoluble anode of the present invention can be suitably used for electrical plating of copper, zinc and the like, and is useful, for example, in the production of tire steel cords.

[0040] In the method for producing a wire according to the present invention, it is important that the insoluble anode according to the present invention is used in a plating process in which the wire is electroplated by running in a plating solution. For details on specific measuring conditions and other manufacturing processes other than It can be determined and implemented as appropriate, and is not particularly limited.

Example

[0041] Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to these examples.

(Example 1)

The insoluble anodes shown in FIGS. 1 to 3 were actually produced and subjected to a plating test. The number of insoluble electrode plates was 51 in order to simultaneously measure 50 metal wires. Each insoluble electrode plate was a titanium thin plate having a length of 400 mm, a height of 90 mm, and a thickness of 1 mm. The conductive contact was a titanium thick plate having a length of 80 mm, a height of 40 mm, and a thickness of 10 mm, and was disposed at both ends in the longitudinal direction between the electrode plates. The through bolt was a titanium bolt, and was used for the conductive contact placement part (clamping part) at both ends in the longitudinal direction. The outer frame and terminal were also made of titanium.

[0042] The manufactured insoluble anode is placed in a separately prepared plating tank, and 50 steel wires (diameter: 1.5 mm, length: 200 mm) as cathodes are placed in the pass line between the electrode plates to make a plating test. I went. In the plating test, zinc sulfate: 300 gZL and sulfuric acid: 50 gZL were prepared as the plating solution (electrolytic bath), and the plating conditions were set at a temperature of 50 ° C, a cathode current density of 20AZdm ² , and an energization time of 10 seconds. The zinc-coated steel wire after plating was immersed in a stripping solution to dissolve zinc, and the solution was analyzed with a fluorescent X-ray analyzer to investigate the amount of coating on each steel wire. The survey results are shown in Table 1.

[0043] [Table 1]

[0044] In Table 1, 50 steel wires are measured at a time, and when the dispersion in the amount of adhesion is within 7%, “good”, and when over 7% and within 15%, “good”. 15 When the value exceeds%, it was determined as “impossible”. From this result, conductive contacts were interposed between the insoluble electrode plates so that the distance between the electrodes was equal, and both were in surface contact to ensure a sufficient contact area. It was confirmed that the amount of adhesion could be made uniform at a high level.

Claims

The scope of the claims

[1] In an insoluble anode for an electric plating apparatus that simultaneously applies electric plating to a plurality of metal wires that run in parallel in the plating liquid.

A plurality of insoluble electrode plates arranged in parallel so as to face each other with the wire pass line of each metal wire sandwiched between both sides;

A plurality of conductive contacts interposed between each of a plurality of insoluble electrode plates to form an equidistant gap between each;

An insoluble anode for metal wire plating, comprising: a plurality of through-bolts that fasten and fix a plurality of insoluble electrode plates and conductive contacts in a parallel direction at a plurality of locations in the wire pass line direction. .

[2] The insoluble anode for metal wire plating according to [1], wherein the plurality of conductive contacts are arranged at intervals in a plurality of locations in the wire pass line direction.

[3] The plurality of conductive contacts are arranged below the wire path line so as not to interfere with the wire path line between each of the plurality of insoluble electrode plates. Insoluble anode for metal wire mesh.

[4] The metal according to claim 1, wherein in at least one of the plurality of insoluble electrode plates or the plurality of conductive contacts, the bolt hole through which the through bolt penetrates is formed in a cut shape reaching the end surface of the member. Insoluble anode for wire rod plating.

[5] In a method of manufacturing a wire including a plating process in which electric wire is electroplated by running in a plating solution, the insoluble anode for metal wire plating according to any one of claims 1 to 4 is used. A method of manufacturing a wire, characterized by performing electrical plating.