WO2007115241A3 - Low cost boiling coolers utilizing liquid boiling - Google Patents
Low cost boiling coolers utilizing liquid boiling Download PDFInfo
- Publication number
- WO2007115241A3 WO2007115241A3 PCT/US2007/065743 US2007065743W WO2007115241A3 WO 2007115241 A3 WO2007115241 A3 WO 2007115241A3 US 2007065743 W US2007065743 W US 2007065743W WO 2007115241 A3 WO2007115241 A3 WO 2007115241A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- boiling
- low cost
- shell
- utilizing liquid
- liquid coolant
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
- F22B1/284—Methods of steam generation characterised by form of heating method in boilers heated electrically with water in reservoirs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A low cost boiling cooler that utilizes boiling two-phase cooling is presented. As boiling vaporization becomes primary means of spreading heat in a boiling cooler utilizing a boiling enhancement surface to significantly augment nucleate boiling heat transfer within a vessel containing a liquid coolant, the body-shell of the vessel at least partially can be made of inexpensive materials with reduced manufacture costs. The body-shell can also be electrically non-conductive to meet requirement for certain electronics cooling applications. The liquid coolant can use low cost medium such as water.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009503330A JP2009532886A (en) | 2006-03-31 | 2007-03-31 | Low cost boiling cooler using liquid boiling |
EP07759921A EP2002194A2 (en) | 2006-03-31 | 2007-03-31 | Low cost boiling coolers utilizing liquid boiling |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39471806A | 2006-03-31 | 2006-03-31 | |
US11/394,718 | 2006-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007115241A2 WO2007115241A2 (en) | 2007-10-11 |
WO2007115241A3 true WO2007115241A3 (en) | 2008-07-10 |
Family
ID=38564280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/065743 WO2007115241A2 (en) | 2006-03-31 | 2007-03-31 | Low cost boiling coolers utilizing liquid boiling |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2002194A2 (en) |
JP (1) | JP2009532886A (en) |
CN (1) | CN101568791A (en) |
WO (1) | WO2007115241A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011145618A1 (en) * | 2010-05-19 | 2011-11-24 | 日本電気株式会社 | Ebullient cooling device |
JP6163968B2 (en) * | 2013-08-26 | 2017-07-19 | 三浦工業株式会社 | Steam generator |
JP6582114B1 (en) * | 2018-11-30 | 2019-09-25 | 古河電気工業株式会社 | heatsink |
US10677535B1 (en) | 2018-11-30 | 2020-06-09 | Furukawa Electric Co., Ltd. | Heat sink |
CN114475036B (en) * | 2022-02-17 | 2023-03-03 | 北京航空航天大学 | Method for improving ink-jet printing quality based on liquid drop boiling |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3990862A (en) * | 1975-01-31 | 1976-11-09 | The Gates Rubber Company | Liquid heat exchanger interface and method |
US5613552A (en) * | 1994-07-13 | 1997-03-25 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant |
-
2007
- 2007-03-31 JP JP2009503330A patent/JP2009532886A/en active Pending
- 2007-03-31 CN CNA2007800191933A patent/CN101568791A/en active Pending
- 2007-03-31 EP EP07759921A patent/EP2002194A2/en not_active Withdrawn
- 2007-03-31 WO PCT/US2007/065743 patent/WO2007115241A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3990862A (en) * | 1975-01-31 | 1976-11-09 | The Gates Rubber Company | Liquid heat exchanger interface and method |
US5613552A (en) * | 1994-07-13 | 1997-03-25 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant |
Also Published As
Publication number | Publication date |
---|---|
JP2009532886A (en) | 2009-09-10 |
EP2002194A2 (en) | 2008-12-17 |
WO2007115241A2 (en) | 2007-10-11 |
CN101568791A (en) | 2009-10-28 |
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