WO2007105880A1 - Manufacturing method of radiant heat circuit board - Google Patents
Manufacturing method of radiant heat circuit board Download PDFInfo
- Publication number
- WO2007105880A1 WO2007105880A1 PCT/KR2007/001169 KR2007001169W WO2007105880A1 WO 2007105880 A1 WO2007105880 A1 WO 2007105880A1 KR 2007001169 W KR2007001169 W KR 2007001169W WO 2007105880 A1 WO2007105880 A1 WO 2007105880A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- circuit board
- insulating layer
- heat dissipation
- heat
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Definitions
- the present invention relates to a method of manufacturing a heat dissipation circuit board and, more particularly, to a method of manufacturing a heat dissipation circuit board used in vehicle and electric and electronic parts to improve the efficiency of dissipating heat.
- a circuit board generally includes a plurality of conductive patterns formed thereon according to a designed circuit pattern, the circuit board generates high temperature heat according to the conductive patterns and mounted elements. Particularly, a light emitting diode (LED) generates significant heat.
- LED light emitting diode
- FIG. 1 is a diagram illustrating a conventional heat dissipation circuit board.
- a heat dissipating plate 2 is stacked beneath an insulating layer 1, a copper layer 3 is stacked on the insulating layer 1, and a circuit pattern is formed on the copper layer 3. After forming the circuit pattern on the copper layer 3, an electric part 4 is mounted on the copper layer 3.
- the heat generated from the circuit pattern or the electric part 4 is not directly transferred to the heat dissipating plate because the insulating layer 1 blocks the heat. That is, the conventional heat dissipation circuit board 100 cannot effectively dissipate heat, and it causes the inferiority of a circuit board.
- a substrate is formed by stacking a lower metal and an upper metal on an insulating layer. Then, more than one of through-holes is formed in the substrate to penetrate the insulating layer, the lower metal, and the upper metal. After forming, a metal pin is inserted into and fixed in the through-hole for transferring heat. In the step of forming the substrate, surfaces of the lower metal and upper metal are roughed.
- FIG. 1 is a cross-sectional view of a conventional heat dissipation circuit board
- FIG. 2 through FIG. 7 are cross-sectional views for sequentially showing the manufacturing processes of a heat dissipation circuit board according to an embodiment of the present invention.
- FIG. 8 is a flowchart illustrating a method of manufacturing method shown in FIG. 2 through FIG. 7.
- Words or terms used through the specification and claims are not limited by definitions defined in a dictionary. In order to clearly describe the present invention, the definitions of the words or terms are properly defined and used to be suitable to the spirit and scope of the present invention.
- FIG. 2 through FIG. 7 are cross-sectional views for sequentially showing the manufacturing processes of a heat dissipation circuit board shown in FIG. 2, and FIG. 8 is a flowchart illustrating a method of manufacturing method shown in FIG. 2 through FIG. 7.
- the method of manufacturing a heat dissipation circuit board includes a stacking step S310, a hole forming step S320, and an inserting step S330.
- a lower metal 220 for dissipating the heat generated from a substrate, and an upper metal 230 is formed on the insulating layer 210.
- nodule 225 or 235 In order to firmly adhering the upper metal 230 and the lower metal 220 to the insulating layer 210, a roughing process is performed to form nodule 225 or 235.
- the roughening process forms fine nodule on the metal surface to improve the adhesive force between the metals and the insulating layer.
- the nodule functions as anchor to hold the insulating layer 210, thereby enhancing the adhesive force.
- the lower and upper metal layers 220 and 230 are stacked on the insulating layer through hot- press pressurizing.
- a circuit pattern can be formed without having limitation of thickness of the lower and upper metals 220 and 230, and it is possible to set the thickness to properly dissipate heat according to elements.
- a through-hole 240 is formed in the substrate 200c to penetrate the upper metal 230, the insulating layer 210, and the lower metal 220. It is possible to modify the shape of the through-hole 240 according to the shape of a metal pin 250 and the shape of electric part mounted on the substrate. In consideration of heat generated from the circuit, more than one through-one 240 may be formed according to a circuit design where the electric part 260 is mounted.
- a metal pin 250 is inserted into the through-hole 240 for transferring heat.
- the metal pin 250 directly transfers heat generated from the electric part 260 or the circuit formed on the upper metal 230 to the lower metal 220 without blocking the heat by the insulating layer 210.
- the metal pin 250 it is preferable to plate the metal pin 250 to effectively reflect light when an electric part 260 emitting light is mounted on the heat dissipation circuit board 200.
- metal having high thermal conductivity such as copper, aluminum, and steel special use stainless (SUS) to form the metal pin 250.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Provided is a method of manufacturing a heat dissipation circuit board. In the method, a substrate is formed by stacking a lower metal and an upper metal on an insulating layer. Then, more than one of through-holes is formed in the substrate to penetrate the insulating layer, the lower metal, and the upper metal. After forming, a metal pin is inserted into and fixed in the through-hole for transferring heat. In the step of forming the substrate, surfaces of the lower metal and upper metal are roughed.
Description
Description
MANUFACTURING METHOD OF RADIANT HEAT CIRCUIT
BOARD
Technical Field
[1] The present invention relates to a method of manufacturing a heat dissipation circuit board and, more particularly, to a method of manufacturing a heat dissipation circuit board used in vehicle and electric and electronic parts to improve the efficiency of dissipating heat. Background Art
[2] Since a circuit board generally includes a plurality of conductive patterns formed thereon according to a designed circuit pattern, the circuit board generates high temperature heat according to the conductive patterns and mounted elements. Particularly, a light emitting diode (LED) generates significant heat.
[3] If heat generating elements such as the conductive patterns and mounted elements generate heat more than a predetermined level, a circuit having the heat generating element may malfunction or a device having the heat generating element may be damaged. In order to solve such an overheat problem, various methods have been employed.
[4] FIG. 1 is a diagram illustrating a conventional heat dissipation circuit board.
[5] Referring to FIG. 1, in the conventional heat dissipation circuit board 10, a heat dissipating plate 2 is stacked beneath an insulating layer 1, a copper layer 3 is stacked on the insulating layer 1, and a circuit pattern is formed on the copper layer 3. After forming the circuit pattern on the copper layer 3, an electric part 4 is mounted on the copper layer 3.
[6] In the conventional heat dissipation circuit board 100, the heat generated from the circuit pattern or the electric part 4 is not directly transferred to the heat dissipating plate because the insulating layer 1 blocks the heat. That is, the conventional heat dissipation circuit board 100 cannot effectively dissipate heat, and it causes the inferiority of a circuit board.
[7] In case of mounting the electronic part 140 such as a LED, which emit light, the light emitted from the electric part 140 is not effectively reflected from the conventional heat dissipation circuit board 100, and a predetermined portion of the light is absorbed into the conventional heat dissipation circuit board 100. Therefore, the concentration of the light is degraded.
[8] Furthermore, if the thickness of the copper layers 3 or the heat dissipating plate 2 becomes thicker, the reliability is degraded according to the adhesive force of stacking
the copper layer 3 and the heat dissipating plate 2 on the insulating layer 1. Disclosure of Invention
Technical Problem
[9] It is, therefore, an object of the present invention to provide a method of manufacturing a heat dissipation circuit board having a structure for effectively dissipating heat generated from a circuit pattern and an electronic part. Technical Solution
[10] In accordance with one aspect of the present invention, there is a method of manufacturing a heat dissipation circuit board. In the method, a substrate is formed by stacking a lower metal and an upper metal on an insulating layer. Then, more than one of through-holes is formed in the substrate to penetrate the insulating layer, the lower metal, and the upper metal. After forming, a metal pin is inserted into and fixed in the through-hole for transferring heat. In the step of forming the substrate, surfaces of the lower metal and upper metal are roughed.
Advantageous Effects
[11] Since heat generated from a circuit pattern or an electric part is directly transferred to a lower metal without blocking the heat by an insulating layer in a heat dissipation circuit board manufactured according to an embodiment of the present invention, the efficiency of dissipating heat is significantly improved.
[12] Since a heat dissipation circuit board does not need an additional heat dissipating plate, related products can be more miniaturized.
[13] Furthermore, since a metal pin or a heat dissipation circuit board is plated for effectively reflecting light, the light concentration is improved when an element emitting light is mounted on a heat dissipation circuit board manufactured according to an embodiment of the present invention. After the surfaces of an upper metal and a lower metal are roughed, the upper and lower metals are stacked on the insulating layer through hot-pressing. Therefore, it is possible to stack thick metal without having limitation of the thicknesses of the upper metal and lower metal. Brief Description of the Drawings
[14] The above and other objects and features of the present invention will become apparent from the following description of the preferred embodiments given in conjunction with the accompanying drawings, in which:
[15] FIG. 1 is a cross-sectional view of a conventional heat dissipation circuit board;
[16] FIG. 2 through FIG. 7 are cross-sectional views for sequentially showing the manufacturing processes of a heat dissipation circuit board according to an embodiment of the present invention; and
[17] FIG. 8 is a flowchart illustrating a method of manufacturing method shown in FIG.
2 through FIG. 7.
Best Mode for Carrying Out the Invention
[18] Other objects and aspects of the invention will become apparent from the following description of the embodiments with reference to the accompanying drawings, which is set forth hereinafter.
[19] Hereinafter, a method of manufacturing a heat dissipation circuit board according to an embodiment of the present invention will be described with reference to accompanying drawings.
[20] Words or terms used through the specification and claims are not limited by definitions defined in a dictionary. In order to clearly describe the present invention, the definitions of the words or terms are properly defined and used to be suitable to the spirit and scope of the present invention.
[21] Embodiments described in the specification and structures shown in the accompanying drawings are only embodiments of the present invention. The present invention may be embodied in many different forms and should not be constructed as being limited to the embodiments set fort therein.
[22] FIG. 2 through FIG. 7 are cross-sectional views for sequentially showing the manufacturing processes of a heat dissipation circuit board shown in FIG. 2, and FIG. 8 is a flowchart illustrating a method of manufacturing method shown in FIG. 2 through FIG. 7.
[23] Referring to the drawings, the method of manufacturing a heat dissipation circuit board according to an embodiment of the present invention includes a stacking step S310, a hole forming step S320, and an inserting step S330.
[24] At the stacking step S310, a lower metal 220 for dissipating the heat generated from a substrate, and an upper metal 230 is formed on the insulating layer 210.
[25] In order to firmly adhering the upper metal 230 and the lower metal 220 to the insulating layer 210, a roughing process is performed to form nodule 225 or 235. The roughening process forms fine nodule on the metal surface to improve the adhesive force between the metals and the insulating layer. When the metal and the insulating layer are adhered at high temperature and pressure, the nodule functions as anchor to hold the insulating layer 210, thereby enhancing the adhesive force.
[26] After the roughing process is performed to form the nodules 225 or 235, the lower and upper metal layers 220 and 230 are stacked on the insulating layer through hot- press pressurizing.
[27] Since the stacking process is performed without the roughing process according to the related art, it is impossible to stack metals on the insulating layer due to cohesive if the thickness of the lower metal 220 and the upper metal 230 is thicker than about
0. lmm. If the thick lower and upper metal is stacked on the insulating layer, the circuit board thereof may have defect.
[28] According to the present embodiment, a circuit pattern can be formed without having limitation of thickness of the lower and upper metals 220 and 230, and it is possible to set the thickness to properly dissipate heat according to elements.
[29] At the hole forming step S320, a through-hole 240 is formed in the substrate 200c to penetrate the upper metal 230, the insulating layer 210, and the lower metal 220. It is possible to modify the shape of the through-hole 240 according to the shape of a metal pin 250 and the shape of electric part mounted on the substrate. In consideration of heat generated from the circuit, more than one through-one 240 may be formed according to a circuit design where the electric part 260 is mounted.
[30] At the inserting step S330, a metal pin 250 is inserted into the through-hole 240 for transferring heat.
[31] The metal pin 250 directly transfers heat generated from the electric part 260 or the circuit formed on the upper metal 230 to the lower metal 220 without blocking the heat by the insulating layer 210.
[32] As described above, the heat generated from the heat dissipation circuit board 200 is effectively transferred to and dissipated through the lower metal 220.
[33] Also, it is preferable to plate the metal pin 250 to effectively reflect light when an electric part 260 emitting light is mounted on the heat dissipation circuit board 200. In order to effectively transfer heat, it is preferable to use metal having high thermal conductivity such as copper, aluminum, and steel special use stainless (SUS) to form the metal pin 250.
[34] While the present invention has been described with respect to certain preferred embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined in the following claims.
Claims
[1] A method of manufacturing a heat dissipation circuit board comprising: forming a substrate by stacking a lower metal and an upper metal on an insulating layer; forming more than one of through-holes in the substrate to penetrate the insulating layer, the lower metal, and the upper metal; and inserting and fixing a metal pin into the through-hole for transferring heat, wherein in the step of forming the substrate, surfaces of the lower metal and upper metal are roughed.
[2] The method of claim 1, wherein the step of forming the substrate, the lower metal or the upper metal is stacked on the insulating layer through a hot-press pressurizing and adhering scheme.
[3] The method of claim 1, wherein the metal pin is one of copper, aluminum, and
SUS(steel special use stainless).
[4] The method of claim 3, wherein the metal pin is plated for reflecting light.
[5] A heat dissipation circuit board manufactured by a method of manufacturing a heat dissipation circuit board, which is claimed in one of claims 1 to 4.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2006-0022988 | 2006-03-13 | ||
| KR1020060022988A KR100666751B1 (en) | 2006-03-13 | 2006-03-13 | Method for manufacturing of radiant heat circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007105880A1 true WO2007105880A1 (en) | 2007-09-20 |
Family
ID=37867487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2007/001169 WO2007105880A1 (en) | 2006-03-13 | 2007-03-09 | Manufacturing method of radiant heat circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100666751B1 (en) |
| WO (1) | WO2007105880A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
| CN109413843A (en) * | 2018-12-06 | 2019-03-01 | 四川英创力电子科技股份有限公司 | One kind burying thick copper pcb board structure and its manufacture craft |
| CN110891363A (en) * | 2011-12-15 | 2020-03-17 | 法雷奥电机控制系统公司 | Thermally conductive and electrically insulating link between at least one electronic component and a fully or partially metallic heat sink |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100787089B1 (en) | 2006-12-05 | 2007-12-21 | 엘지마이크론 주식회사 | Radiant heat circuit substrate and method for manufacturing thereof |
| KR101181105B1 (en) | 2010-12-24 | 2012-09-07 | 엘지이노텍 주식회사 | The radiant heat circuit board and the method for manufacturing the same |
| KR101208604B1 (en) | 2011-05-25 | 2012-12-06 | 안복만 | Heat dissipating circuit board and method for manufacturing the same |
| CN108184308B (en) * | 2018-01-16 | 2020-06-26 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039691A (en) * | 2002-06-28 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Heat conduction wiring board for led lighting device, led lighting device using the same, and method of manufacturing them |
| JP2005012155A (en) * | 2003-05-26 | 2005-01-13 | Matsushita Electric Works Ltd | Light emitting device |
-
2006
- 2006-03-13 KR KR1020060022988A patent/KR100666751B1/en not_active IP Right Cessation
-
2007
- 2007-03-09 WO PCT/KR2007/001169 patent/WO2007105880A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039691A (en) * | 2002-06-28 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Heat conduction wiring board for led lighting device, led lighting device using the same, and method of manufacturing them |
| JP2005012155A (en) * | 2003-05-26 | 2005-01-13 | Matsushita Electric Works Ltd | Light emitting device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110891363A (en) * | 2011-12-15 | 2020-03-17 | 法雷奥电机控制系统公司 | Thermally conductive and electrically insulating link between at least one electronic component and a fully or partially metallic heat sink |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
| CN109413843A (en) * | 2018-12-06 | 2019-03-01 | 四川英创力电子科技股份有限公司 | One kind burying thick copper pcb board structure and its manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100666751B1 (en) | 2007-01-09 |
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