WO2007105450A1 - Procede et appareil d'elimination de chaleur - Google Patents

Procede et appareil d'elimination de chaleur Download PDF

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Publication number
WO2007105450A1
WO2007105450A1 PCT/JP2007/053297 JP2007053297W WO2007105450A1 WO 2007105450 A1 WO2007105450 A1 WO 2007105450A1 JP 2007053297 W JP2007053297 W JP 2007053297W WO 2007105450 A1 WO2007105450 A1 WO 2007105450A1
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WO
WIPO (PCT)
Prior art keywords
heat removal
use channel
refrigerant
heat
liquid
Prior art date
Application number
PCT/JP2007/053297
Other languages
English (en)
Japanese (ja)
Inventor
Haruhiko Ohta
Yasuhisa Shinmoto
Original Assignee
Kyushu University, National University Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu University, National University Corporation filed Critical Kyushu University, National University Corporation
Priority to JP2008505028A priority Critical patent/JP4269060B2/ja
Priority to US12/280,397 priority patent/US20090114374A1/en
Publication of WO2007105450A1 publication Critical patent/WO2007105450A1/fr

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat removal method and a heat removal apparatus.
  • a technique is known in which a liquid refrigerant is passed through a flow path adjacent to a heat removal object, and the heat removal object is cooled by heat exchange between the heat removal object and the refrigerant.
  • This technology is required to remove heat with a high heat flux from a large area due to a dramatic increase in the heat generation density of electronic devices and the spread of large semiconductors for power conversion.
  • FIG. 14 is a diagram for explaining a problem that occurs when the flow path is lengthened in order to perform heat removal from a large area in the conventional heat removal flow path 501.
  • a plan view is shown on the left side of the drawing, and a cross-sectional view at positions y501 to y504 in the plan view is shown on the right side of the drawing at positions y501 to y504.
  • the heat removal use channel 501 extends in the y direction as shown in the plan view on the left side of the sheet of FIG. 14, and the liquid refrigerant RL is poured from the end 501a as shown by an arrow A501.
  • the heat removal object (not shown) is disposed, for example, on the negative side in the z direction of the heat removal use channel 501, and as shown by the arrow A502 in the cross-sectional view on the right side of FIG.
  • the bottom surface 501b is heated.
  • the heat removal use channel 501 removes heat from the heat removal object by the bottom surface 501b.
  • the liquid refrigerant RL fills the heat removal use channel 501.
  • a part of the liquid refrigerant RL is evaporated, and bubbles are generated by the gaseous refrigerant RG.
  • the bubbles are generated on the heated bottom surface 501b side in the heat removal use channel 501.
  • bubbles are expanded and combined, and the amount of liquid refrigerant RL on the bottom surface 501b side is small.
  • Patent Document 1 a sub-flow path extending along the main flow path is provided at a position farther away from the heat removal object than the main flow path as the heat removal flow path. Disclosed is a technique for equalizing the temperature of the liquid refrigerant from the upstream side to the downstream side of the main flow path by supplying the liquid refrigerant from the sub flow path to the main flow path through a plurality of communication holes that communicate with each other. ing. In Patent Document 1, a crushing device for crushing bubbles generated in the main flow path is provided to prevent the burnout phenomenon.
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-79337
  • the conventional technique shown in FIG. 14 and the technique of Patent Document 1 are based on flowing a liquid refrigerant filled in the heat removal use channel (main channel), and thus may cause various problems.
  • the refrigerant that uses latent heat for heat removal is limited to only a part of the refrigerant that flows through the main flow path. For this reason, the heat flux must be small.
  • a large amount of refrigerant must be flowed over the heat removal area, which increases the size of the heat removal device and increases the necessary pump power. Even so, if heat is removed from a large area extending in the downstream direction, a burnout such as the position of y504 in FIG.
  • the heat removal method of the first aspect of the present invention is a heat removal flow provided adjacent to a heat removal object. Supplying a liquid refrigerant into the heat removal use channel at a plurality of positions in a predetermined direction of the passage, forming a liquid film of the refrigerant over the plurality of positions on an inner peripheral surface of the heat removal use channel, The liquid film is evaporated by heat from the heat removal object, and the evaporated refrigerant is discharged from the heat removal channel to remove heat from the heat removal object.
  • the predetermined direction is a channel direction of the heat removal use channel.
  • the heat removal method of the second aspect of the present invention is a liquid removal method in the heat removal use channel within a predetermined range in the flow direction of the heat removal use channel provided adjacent to the heat removal object.
  • a refrigerant was supplied, and a liquid film of the refrigerant was formed over the predetermined range on the inner peripheral surface of the heat removal use channel, and the liquid film was evaporated by heat from the heat removal object and evaporated.
  • the heat removal object is removed.
  • a heat removal apparatus includes a heat removal use channel provided adjacent to a heat removal object, and the heat removal use at a plurality of positions in a predetermined direction of the heat removal use channel.
  • a liquid supply unit configured to supply a liquid refrigerant into the flow path and to form a liquid film of the refrigerant over the plurality of positions on an inner peripheral surface of the heat removal use channel.
  • the predetermined direction is a flow direction of the heat removal use channel.
  • the liquid supply unit includes a liquid supply flow channel through which the liquid refrigerant flows, adjacent to the heat removal flow channel, and the heat removal flow channel and the liquid supply flow channel.
  • refrigerant passage portions configured to allow passage of the liquid refrigerant from the liquid supply passage to the heat removal passage are provided at the plurality of positions! / Speak.
  • the heat removal use channel is partitioned into a plurality of sections in the flow direction, and the plurality of sections are provided with discharge ports for discharging the gaseous refrigerant.
  • the heat removal use channel is provided with outlets for the refrigerant at both ends in the flow direction.
  • a groove is provided on the inner peripheral surface of the heat removal use channel.
  • a groove portion extending in a direction crossing the heat removal use channel is provided on the inner peripheral surface of the heat removal use channel.
  • a groove portion extending in a direction along the heat removal use channel is provided on an inner peripheral surface of the heat removal use channel.
  • a sheet through which the liquid refrigerant permeates is stretched on the inner peripheral surface of the heat removal use channel.
  • the inner peripheral surface of the heat removal use channel is roughened.
  • heat can be removed with a large area force and a high heat flux.
  • FIG. 1 is a diagram showing an overall configuration of a heat removal apparatus according to an embodiment of the present invention.
  • FIG. 2 is a diagram schematically showing a configuration example of a heat removal unit of the heat removal apparatus in FIG. 1.
  • FIG. 3 is a view for explaining a heat removal method in the structural example of the heat removal portion of FIGS. 2A to 2C.
  • FIG. 4 A diagram illustrating the effect of the heat removal apparatus of FIG.
  • FIG. 5 is a view for explaining a modification of the liquid supply method to the heat removal use channel.
  • FIG. 6 is a cross-sectional view showing a modification of the method for supplying the liquid to the heat removal use channel.
  • FIG. 7 is a diagram for explaining a flow pattern in a liquid supply use channel and a heat removal use channel.
  • FIG. 8 is a view showing a modified example in which the flow pattern in the liquid supply use channel and the heat removal use channel is three-dimensionally expanded.
  • FIG. 9 is a perspective view showing a modified example of a wall portion and a communication hole that partition the heat removal use channel and the liquid supply use channel.
  • FIG. 10 is a diagram for explaining a pattern example of an inner peripheral surface of a heat removal use channel.
  • FIG. 11 is a view showing a modification in which the heat removal use channel is enlarged in the width direction of the channel.
  • FIG. 12 is a view showing a modified example in which the heat removal use channel is enlarged in the flow direction.
  • FIG. 13 is a view showing a modification of the overall configuration of the heat removal apparatus.
  • FIG. 14 is a view showing a conventional heat removal use channel.
  • FIG. 15 is a diagram for explaining the supply amount of liquid refrigerant to the heat removal use channel force.
  • FIG. 16 is a diagram showing an example in which the flow resistance of the refrigerant passage portion is increased at the downstream portion where the flow resistance is decreased at the upstream portion of the liquid supply channel.
  • FIG. 17 is a diagram showing an application example of the present invention.
  • FIG. 18 is a diagram showing another application example of the present invention.
  • FIG. 19 is a diagram for explaining the effect of the present invention. Explanation of symbols
  • FIG. 1 is a diagram showing an overall configuration of a heat removal apparatus 1 according to an embodiment of the present invention.
  • the heat removal apparatus 1 includes a liquid storage tank 3 for storing the liquid refrigerant RL, a pump 5 for sending the refrigerant in the liquid storage tank 3 and the like, and a heat removal target HO (Fig. 2A) using the refrigerant sent from the pump 5.
  • a heat removal target HO Fig. 2A
  • Heat removal part 12 that removes heat
  • Condensation part 14 that condenses the gaseous refrigerant that has flowed out of the heat removal part 12, and refrigerant that has flowed out of the condensation part 14
  • a gas-liquid phase separator 19 that separates into a refrigerant and a supercooling section 21 that supercools the refrigerant that has flowed out of the gas-liquid phase separator 19 in order to prevent the pump 5 from becoming cavitation.
  • the refrigerant supercooled by the supercooling unit 21 is sent out by the pump 5 or stored in the liquid storage tank 3.
  • the liquid storage tank 3 is constituted by, for example, an accumulator, and is used for fine adjustment of the fluid temperature according to load fluctuations, in addition to maintaining the pressure of the circulation system of the heat removal apparatus 1 at a predetermined pressure.
  • the pump 5 is driven by the motor 6, and the operation of the motor 6 is controlled by the controller 7.
  • the condensing unit 14 is, for example, an air-cooled type, and air that exchanges heat with the refrigerant is sent by the fan 15.
  • the fan 15 is driven by a motor 16, and the operation of the motor 16 is controlled by a controller 17.
  • the supercooling unit 21 is, for example, an air-cooling type, and air that exchanges heat with the refrigerant is sent by the fan 22.
  • the fan 22 is driven by a motor 23, and the operation of the motor 23 is controlled by a controller 24.
  • a flow rate sensor 9 for detecting the flow rate of the liquid refrigerant RL flowing into the heat removal unit 12, and a liquid refrigerant RL flowing into the heat removal unit 12 A temperature sensor 10 for detecting the temperature is provided.
  • Controller 7 controls the operation of motor 6 based on the detection result of flow sensor 9
  • controller 17 controls the operation of motor 16 based on the detection result of temperature sensor 10
  • controller 24 controls temperature sensor 10. The operation of the motor 23 is controlled based on the detection result.
  • FIGS. 2A to 2C are diagrams schematically showing the configuration of the heat removal unit 12, FIG. 2A is a perspective view partially seen through, and FIG. 2B is a view in the direction of the lib-lib line in FIG. 2A.
  • FIG. 2C is a cross-sectional view taken from the X direction showing an enlarged region E surrounded by a solid line in FIG. 2A.
  • the z direction may be expressed as the vertical direction, but the heat removal unit 12 may be in the vertical direction depending on various conditions such as the size. Even so, a certain heat removal effect can be exhibited.
  • the heat removal unit 12 includes a heat removal use channel 31 provided adjacent to the heat removal object HO, and a liquid supply use channel 32 that supplies a liquid refrigerant to the heat removal use channel 31. ing.
  • the liquid supply channel 32 or a refrigerant delivery system including the pump 5 and the like in addition to the liquid supply channel 32 is an example of the liquid supply unit of the present invention.
  • the heat removal use channel 31 includes, for example, a first plate-like portion 34 provided in contact with the heat removal object HO, and a second plate-like portion 35 disposed to face the first plate-like portion 34. Arranged between the first plate portion 34 and the second plate portion 35 and parallel to each other in the flow direction of the heat removal use channel 31 (flow direction of refrigerant, length direction of the flow channel, y direction). It is formed in a region surrounded by these members by the two extended knobs 36. It should be noted that the heat removal object may be arranged on the second plate portion 35 side only on the first plate portion 34 side. Further, instead of the pipe 36, a hollow body having an appropriate cross-sectional shape such as a rectangular duct may be used. One end of the heat removal use channel 31 in the flow direction (the positive side in the y direction) is open and connected to the condensing unit 14. The other end in the flow path direction is closed by a wall portion (not shown).
  • the first plate-like portion 34, the second plate-like portion 35, and the pipe 36 may be formed of an appropriate material such as a metal resin.
  • the first plate-like portion 34 and the second plate-like portion 35 and the pipe 36 may be appropriately joined, such as joining using an adhesive or solder, or joining by welding or fusion.
  • the liquid supply channel 32 is formed inside the pipe 36 by a pipe 36.
  • the position of the liquid supply flow path 32 may be a position that overlaps the heat removal object HO as viewed in the z direction or a position that does not overlap.
  • One end 36b of the nozzle 36 is open and an inflow port 37 is formed.
  • the end 36b is connected to the pump 5.
  • the other end 36c of the pipe 36 is blocked. It is.
  • the wall portion 36 a that separates the heat removal use channel 31 and the liquid supply use channel 32 has heat removal at a plurality of positions in the flow direction (y direction) of the heat removal use channel 31.
  • a communication hole 38 is provided for communicating the flow path 31 and the liquid supply flow path 32.
  • the communication hole 38 is an example of the coolant passage portion of the present invention.
  • the plurality of communication holes 38 have the same diameter, for example, and are provided at equal intervals.
  • the first plate-like portion 34 has a surface forming an inner peripheral surface of the heat removal use channel 31 in a direction (width direction, X direction) orthogonal to the flow direction of the heat removal use channel 31.
  • An extending groove 40 is formed.
  • a plurality of the groove portions 40 are provided in the flow direction of the heat removal use channel 31.
  • the same number of the plurality of communication holes 38 is provided at the same position as the plurality of communication holes 38.
  • FIG. 3 is a diagram for explaining a heat removal method in the heat removal unit 12.
  • a plan view is shown on the left side of the drawing, and a cross-sectional view of the plan view at positions yl to y3 is shown on the right side of the drawing at positions yl to y3.
  • the liquid refrigerant RL sent out by the pump 5 flows into the liquid supply channel 32 from the inlet 37.
  • the liquid refrigerant RL that has flowed into the liquid supply flow path 32 flows into the heat removal flow path 31 from the communication hole 38 as indicated by an arrow A2 in FIG. 2A and an arrow A5 in FIG.
  • the liquid refrigerant RL that has flowed into the heat removal use channel 31 is formed on the inner peripheral surface of the heat removal use channel 31 on the first plate-like portion 34 side, as shown in the cross-sectional view on the right side of FIG. A liquid film is formed. Since the communication holes 38 are provided at a plurality of positions in the flow direction of the heat removal use channel 31, the liquid film of the refrigerant RL extends in the flow direction from the upstream side to the downstream side of the heat removal use channel 31. It is formed throughout.
  • the gaseous refrigerant RG in the heat removal use channel 31 flows out from the opening end and flows into the condensing unit 14, as indicated by an arrow A3 in FIG. 2A.
  • An exhaust means such as a fan for exhausting the gaseous refrigerant RG may be provided in the flow path.
  • dVZdt Supply amount of liquid refrigerant to heat removal channel per unit time (m 3 Zs)
  • C Constant pressure specific heat of liquid refrigerant CiZkgK
  • T Saturation temperature of refrigerant in heat removal use channel ( ⁇ )
  • a liquid film can be formed in the heat removal use channel 31.
  • An example of the X range out in which a liquid film is preferably formed is 0.2 or more and 1 or less.
  • Q is determined by the heat removal amount required in the heat removal object HO. P , C, h
  • 1 l fg can be adjusted by selecting refrigerant components and operating pressure.
  • the dV / dt, T, and T m s can be adjusted by the structural aspects of various means at the time of designing the heat removal apparatus l, and can be adjusted by the operation of the various means when the heat removal apparatus 1 is in operation.
  • control of X during operation of the heat removal apparatus 1 is performed, for example, as follows.
  • the controller 7 controls the operation of the pump 5 via the motor 6 based on the detection value of the flow sensor 9 so that dVZdt approaches a predetermined target value. That is, feedback control of dVZdt is performed by the controller 7, and consequently X is controlled.
  • T is detected by the temperature sensor 10.
  • Controller 17 is based on the detected value of temperature sensor 10.
  • the operation of the motor 16 is controlled so that T approaches a predetermined target value. Also control On the basis of the detection value of the temperature sensor 10, the device 24 is also connected so that T approaches a predetermined target value.
  • T is fed by controller 17 and controller 24.
  • the controller 17 (condensing unit 14) and the controller 24 (supercooling unit 21) are used in the control of T.
  • Dodback control is performed and cooling in the supercooling section 21 is stopped.
  • the rotation of the motor 16 is kept constant in the condensing section 14 and the cooling efficiency is kept constant.
  • T is determined by the pressure in the heat removal use channel 31. Therefore, T depends on fans 15 and 22.
  • a pressure sensor may be provided in the heat removal use channel 31 and a pressure adjustment valve may be provided in the flow channel to the condensing unit 14, and the operation of the pressure adjustment valve may be controlled based on the detection result of the pressure sensor. .
  • the liquid refrigerant RL is supplied to a plurality of positions in the flow direction of the heat removal use channel 31 provided adjacent to the heat removal object HO, so that the heat removal use channel is obtained. Since the liquid film of the refrigerant RL is formed at multiple positions on the inner peripheral surface of 31, the liquid refrigerant RL is not exhausted over a wide range from the upstream to the downstream of the heat removal use channel 31, and it is efficient.
  • the refrigerant can be evaporated. Therefore, the ratio of the amount of heat removed by latent heat to the amount of heat removed by sensible heat is significantly increased compared to the conventional case, and heat can be removed from a large area with a high heat flux.
  • the flow rate (mass) of the cooling medium can also be reduced, and the heat removal device 1 and the heat removal use channel 31 can be downsized. Since the flow rate is kept low and the main flow path penetrates with steam, the pressure loss is smaller than that of Patent Document 1, and the pump capacity given by the product of both is greatly reduced. Since the liquid refrigerant RL removes heat by latent heat, the temperature of the refrigerant RL, which has a very good heat transfer compared to the case of removing heat by boiling sensible heat as in the past, is the HO The permissible temperature (target temperature after heat removal) may not be so low.
  • the cooling capacity required for the condensing unit 14 and the supercooling unit 21 can be lowered, and the condensing unit 14 and the supercooling unit 21 Since the temperature difference between the refrigerant flowing inside and the outside air becomes large and the refrigerant can be efficiently cooled, the condensing unit 14 and the supercooling unit 21 can be downsized. Since it is based on flowing a gaseous refrigerant through the heat removal use channel 31, various problems that occur when a liquid coolant is made to flow through the heat removal use channel do not occur. For example, as in Patent Document 1, if the flow of the sub-flow path merges with the main flow path and the flow of the main flow path becomes unstable! There is no need to provide a device for crushing bubbles generated in the main channel.
  • the heat removal apparatus 1 includes a liquid supply flow path 32 that extends along the heat removal flow path 31 and through which the liquid refrigerant RL flows, and includes the heat removal flow path 31 and the liquid supply flow path 32. Since the separating wall portion 36a has communication holes 38 communicating with the heat removal use channel 31 and the liquid supply use channel 32 at a plurality of positions in the flow direction of the heat removal use channel 31, the configuration is Although simple, a refrigerant can be supplied to a plurality of positions in the flow direction of the heat removal use channel 31 to form a liquid film.
  • the groove portion 40 extending in the direction orthogonal to the heat removal use channel 31 is provided on the inner peripheral surface of the heat removal use channel 31, the liquid is removed in the direction orthogonal to the heat removal use channel 31. It is easy for the film to spread, and it is possible to suppress the exhaustion of the refrigerant at the position away from the liquid supply flow path 32, that is, at the central position of the heat removal flow path 31.
  • the principle of spreading the liquid refrigerant by the groove 40 is as follows.
  • the liquid refrigerant RL sticks to the side surface (inclined surface) of the groove 40 due to surface tension, and the surface of the liquid refrigerant RL in the groove 40 becomes concave.
  • the contact angle between the surface of the refrigerant RL and the side surface of the groove 40 is the same on the central side and the side of the heat removal use channel 31 (on the side of the liquid supply use channel 32), but on the center side Therefore, since the amount of the refrigerant RL is small, the curvature of the concave surface becomes larger toward the center side. For this reason, the force at which the refrigerant RL tends to contract increases toward the center, and balances with the high atmospheric pressure. However, the size of the gaseous refrigerant RG applied to the surface of the refrigerant RL is the same on the center side and the side part side. For this reason, the liquid refrigerant RG automatically flows toward the center because a negative pressure gradient is generated from the side to the center.
  • FIGS. 4A to 4C are diagrams for explaining the effect of the heat removal apparatus 1 of the present embodiment by grasping another viewpoint.
  • FIG. 4A shows the state of the refrigerant in the conventional heat removal use channel 501.
  • the liquid refrigerant RL is also fed with one end force of the heat removal use channel 501 (arrow 7A) and flows toward the other end. Therefore, the length L501 of the heat removal use channel 501 in the channel direction is the refrigerant Becomes the heating length to be heated.
  • the liquid refrigerant RL evaporates to become a gaseous refrigerant RG and is discharged from the downstream side of the heat removal use channel 501 (arrow A8). That is, on the downstream side of the heat removal use channel 501, a dry-out phenomenon occurs, the inner surface is depleted, and the cooling capacity is significantly reduced.
  • the liquid refrigerant RL is supplied from both sides of the heat removal use channel 31 in a direction orthogonal to the flow direction. Therefore, the heating length is half length L1 of the width of the heat removal use channel 31. Therefore, if the refrigerant RL is supplied in an amount such that the liquid refrigerant RL does not wither only while flowing through the length L1, the cooling ability can be exerted over the entire surface of the heat removal use channel 31. In other words, the influence of the length of the heat removal use channel 31 in the flow direction on the depletion of the refrigerant RL is significantly reduced, and the degree of freedom in setting the length in the flow direction is improved.
  • the width of the heat removal use channel 31 is increased, and the heating length is increased with respect to the supply amount of the liquid refrigerant RL. If the length (L2) becomes longer, the liquid refrigerant RL will wither in the center of the heat removal use channel 31. Therefore, the width of the heat removal use channel 31 and the supply amount of the liquid refrigerant RL need to be set appropriately.
  • FIG. 5A to FIG. 5D are diagrams for explaining a modification of the liquid supply method to the heat removal use channel from the viewpoint of the heating length described with reference to FIG. 4A to FIG. 4C.
  • the heat removal use channel is located on both sides in the vertical direction of the paper (the first plate-like portion 34 side of the heat removal use channel 31 and the second plate An example of heating from the part 35 side) is shown.
  • FIG. 5A shows a modification in which the liquid refrigerant is supplied from both sides of the rectangular shape as indicated by an arrow A10 in the heat removal use channel 41 having a rectangular cross section.
  • the heating length is half length L4 of the width of the heat removal use channel 41.
  • FIG. 5B shows a modification in which liquid refrigerant is supplied from two opposing points in a circular shape as indicated by a bifurcated arrow All in the heat removal use channel 42 having a circular cross section.
  • the heating length is the length L5 of 1Z4 around the circumference of the heat removal use channel 42.
  • FIG. 5C shows a modification in which the liquid refrigerant is supplied from one circular point in the heat removal use channel 43 having a circular cross section, as indicated by a bifurcated arrow A12.
  • the heating length This is the length L6 of 1Z2 around the circumference of the heat removal use channel 43.
  • FIG. 5D shows a modification in which a four-point force liquid refrigerant is evenly arranged on the circumference, as shown by a bifurcated arrow A13, in the heat removal use channel 44 having a circular cross section. ing.
  • the heating length is the length L7 of 1Z8 around the circumference of the heat removal use channel 43.
  • the cross-sectional shape of the heat removal use channel and the position and number of liquid refrigerant supply ports should be set in consideration of various conditions such as the saturation temperature of the refrigerant, the size of the heat removal object, and the amount of heat generation. Is preferred. 5A to 5D are examples of combinations of the cross-sectional shape of the heat removal use channel, the position and number of supply ports, and various other modifications may be made.
  • FIG. 6A to FIG. 6D are cross-sectional views showing modifications of the method for supplying liquid to the heat removal use channel.
  • the heat removal object is provided on at least one of the positive side and the negative side in the z direction of the flow path, and the flow direction of the heat removal flow path is in the y direction. It is.
  • FIG. 6A shows a modification in which a wall 47 is provided in a channel having a rectangular cross section, and the channel is divided into a heat removal use channel 45 and a liquid supply use channel 46.
  • the wall 47 is provided with communication holes (not shown) at a plurality of positions in the flow direction (y direction) of the heat removal use channel 45, and the communication holes are provided from the liquid supply use channel 46 as indicated by an arrow A15. Then, the liquid refrigerant is supplied to the heat removal use channel 45.
  • the heat removal use channel 45 and the liquid supply use channel 46 can be configured easily.
  • FIG. 6B shows a modification in which nozzles 50 are provided on both sides of the heat removal use channel 49.
  • the nozzles 50 are provided at a plurality of positions in the channel direction (y direction) of the heat removal use channel 49.
  • the liquid refrigerant is supplied to the heat removal use channel 49 by the nozzle 50 as indicated by an arrow A17.
  • the liquid supply direction can be adjusted by adjusting the direction of the nozzle 50, and the position of the tip 50a of the nozzle 50 is adjusted in the direction (X direction) orthogonal to the flow direction of the heat removal use channel 49.
  • the liquid supply position can be adjusted. It is also possible to set different directions, positions, and flow rates of the plurality of nozzles 50.
  • FIG. 6C shows a modification in which pipes 51 are provided at both ends of a rectangular flow path, a heat removal flow path 52 is formed outside the pipe 51, and a liquid supply flow path 53 is formed inside the noise 51. Show.
  • liquid refrigerant is supplied to the heat removal use channel 52 from a plurality of communication holes formed in the pipe 51 (arrow A19).
  • the heat removal use channel 52 and the liquid supply use channel 53 can be configured simply by passing the pipe 51 through a rectangular channel.
  • the pipe 51 also contributes to the structural strength of the rectangular flow path.
  • FIG. 6D shows a modification in which a wall portion 55 made of a porous material is provided in a rectangular flow path, and a heat removal flow path 56 and a liquid supply flow path 57 are formed.
  • the porous body will be described later.
  • FIG. 6E shows a modification in which a liquid supply use channel 60 having a width equivalent to that of the heat removal use channel 59 overlaps the heat removal use channel 59 and runs in parallel.
  • the heat removal object is disposed on the lower side of the paper surface of the heat removal use channel 59.
  • communication holes (not shown) communicating with each other are formed on both sides of the flow channel.
  • a plurality of communication holes are provided in the channel direction (y direction) of the heat removal use channel 59.
  • the liquid refrigerant in the liquid supply use channel 60 is supplied to the heat removal use channel 59 through the communication hole as indicated by an arrow A21.
  • FIG. 6F shows a modification in which a nozzle 62 that protrudes into the heat removal use channel 49 is provided at the center of the heat removal use channel 49, in comparison with the modification of FIG. 6B.
  • the heat removal object is provided on the lower side of the paper surface of the heat removal use channel 49, and the nozzle 62 projects into the heat removal use channel 49 from the upper side of the heat removal use channel 49.
  • the liquid refrigerant from the nozzle 50 may dry up before reaching the center in the width direction. Therefore, in this modification, liquid refrigerant is supplied to the center of the heat removal use channel 49 by the nozzle 62, thereby preventing the center of the heat removal use channel 49 in the width direction.
  • the tip position of the nozzle 62 is heated by the heat removal object, and is brought closer to the surface on the side (the surface on the lower side of the paper).
  • a liquid film can be reliably formed on the surface.
  • FIG. 6G shows a heat removal use channel 59 instead of the communication holes on both sides in the modification shown in FIG. 6E.
  • nozzles 65 protruding from the liquid supply channel 60 into the heat removal channel 59 are provided at a plurality of positions in the width direction.
  • the liquid refrigerant in the liquid supply channel 60 is supplied to the heat removal channel 59 via the nozzle 65.
  • the heating length is the distance between the nozzles 65. Therefore, the heating length can be made shorter than the width of the heat removal use channel 59 to prevent the liquid refrigerant from depleting.
  • the heat removal use channel 59 can be expanded in the width direction. Further, by bringing the tip position of the nozzle 65 closer to the surface heated by the heat removal object (the surface below the paper surface), a liquid film can be reliably formed on the surface.
  • FIGS. 7A to 7D are diagrams illustrating flow patterns in the liquid supply use channel and the heat removal use channel. 7A to 7D, solid arrows indicate the flow direction of the liquid refrigerant, and dotted arrows indicate the flow direction of the gaseous refrigerant.
  • the liquid supply channel has a liquid refrigerant flowing from one end 74a in the channel direction (y direction) of the heat removal use channel 73 and the other end.
  • the liquid refrigerant may flow out from 74b, and the other ends 68b and 71b are closed like the liquid supply flow path 68 in FIG. 7B and the liquid supply flow path 71 in FIG.
  • As a refrigerant outlet only a communication hole (not shown) with the heat removal use channels 67 and 70 may be provided. Further, as shown in FIG.
  • an inflow port 77a is provided at an appropriate position in the middle of the heat removal use channel 76 in the direction of the flow path, and is directed to the one end 77b and the other end 77c in the direction of the flow path.
  • the thing through which a refrigerant flows may be used.
  • one end 77b and the other end 77c of the liquid supply flow channel 77 are closed, and only a communication hole with the heat removal flow channel 76 is provided as a refrigerant outlet.
  • the refrigerant may flow out by one force of the one end 77b and the other end 77c. If both ends of the liquid supply flow path are open as shown in FIG. 7A, both may be used as inflow ports.
  • the heat removal use channel may be supplied with a liquid fluid from one end 73a, or like the heat removal use channel in FIGS. 7B to 7D. Further, the liquid refrigerant may be supplied only from the liquid supply channel. Further, the heat removal use channel may be such that the gaseous refrigerant flows out only by one end side force in the flow direction, as in the heat removal use channel 67 in FIG. 7B, or the heat removal use in FIG. 7C. As in the case of the use channel 70 and the heat removal use channel 76 of FIG.
  • both ends of the heat removal use channel in the flow direction are discharged. This is because heat is removed by evaporation of the liquid film formed in the heat removal use channel, and gaseous refrigerant is discharged from the heat removal use channel.
  • the conventional technology that removes heat by sensible heat of liquid refrigerant or normal boiling requires that a large amount of liquid refrigerant flow through the heat removal flow path.
  • a structure is adopted in which a liquid refrigerant flows from one end of the heat removal use channel to the other end. If the refrigerant flow path is set as shown in FIG.
  • the inlet of the liquid supply flow path can be provided at an appropriate position, and the liquid refrigerant can be directed to both sides of the flow path direction (y direction).
  • the flow of the liquid refrigerant was divided into the main flow path and the sub flow path and then merged, so the flow of the main flow path and the flow of the sub flow path must be in the same direction.
  • Advantageous power since the gaseous refrigerant flows in the heat removal use channel and the liquid refrigerant flows in the liquid supply use channel, the flow direction of each other can be freely set. it can.
  • FIGS. 7A to 7D various flow patterns as shown in FIGS. 7A to 7D are possible, and the degree of freedom in design is improved.
  • 7A to 7D are examples, and in addition, let the liquid refrigerant and the gaseous refrigerant flow in various patterns.
  • FIGS. 7A to 7D the improvement in the degree of freedom in the design of the heat removal use channel and the liquid supply use channel is the flow pattern in the liquid supply use channel and the heat removal use channel. Can be extended in three dimensions.
  • FIG. 8A to FIG. 8F are diagrams showing modifications in which the flow patterns in the liquid supply use channel and the heat removal use channel are three-dimensionally expanded. 8A to 8F, the solid line arrows indicate the flow direction of the liquid refrigerant, and the dotted arrows indicate the flow direction of the gaseous refrigerant.
  • FIG. 8A is a plan view showing a modified example in which liquid refrigerant is supplied in a direction (z direction) orthogonal to the heat removal object in addition to the modified example shown in FIG.
  • FIG. 8B is a cross-sectional view as viewed from the bottom of FIG.
  • a heat removal object is provided on the lower side of the drawing in FIG. 8B.
  • a liquid supply flow path 79 extending along the flow path direction of the heat removal flow path 76 is provided at the center in the width direction of the heat removal flow path 76.
  • the liquid supply flow path 79 is, for example, the same shape as the liquid supply flow path 77, and is slightly smaller.
  • a plurality of communication holes (not shown) for supplying the liquid refrigerant to the heat removal use channel 76 are provided along the heat removal use channel 76.
  • the modified example is effective for preventing dryness at the center of the heat removal use channel 76, similarly to the modified example shown in FIG. 6F.
  • FIG. 8C is a modification in which a plurality of liquid supply flow paths 79 shown in FIG. 8A are arranged in the width direction of the heat removal flow path 81
  • FIG. 8D is a view from the lower side of FIG. 8C.
  • FIG. 8C in this modified example, as in the modified example shown in FIG. 6G, the heat removal use channel 81 can be expanded in the width direction.
  • the flow direction of the heat removal use channel of the present invention may not be the longitudinal direction.
  • FIG. 8E is a modification in which a discharge port 83a for discharging a gaseous refrigerant is provided in a direction orthogonal to the longitudinal direction and the width direction of the heat removal use channel 83
  • FIG. 8F is a drawing of FIG. 8E. It is sectional drawing seen from the downward side.
  • the heat removal object is provided on the lower side of the sheet of FIG. 8F
  • the discharge port 83a opens to the opposite side of the inner surface of the heat removal use channel 83 from the heat removal object. Yes.
  • the heat removal use channel 83 is closed at both ends in the longitudinal direction (the flow direction of the liquid supply use channel 84), and the outlet of the gaseous refrigerant is only the discharge port 83a.
  • a plurality of discharge ports 83a are provided, for example, along the flow direction of the liquid supply channel 84.
  • the evaporated refrigerant can be discharged immediately without flowing to other areas on the surface along the heat removal target.
  • FIG. 8E it can be said that the end face of the flow path is arranged along the heat removal object.
  • the heat removal use channel of the present invention may not be one in which the gaseous refrigerant flows in the direction (y direction) along the heat removal object.
  • the gaseous refrigerant discharged from the discharge port 83a flows into, for example, a pipe or a rectangular duct and flows to the condensing unit or the supercooling unit.
  • FIGS. 9A to 9E show a wall portion (a wall portion 47 in FIG. 6A) that separates the heat removal use channel from the liquid supply use channel.
  • FIG. 6D is a perspective view showing a modified example of the communication hole.
  • a plurality of communication holes 86 are formed in the flat wall portion 85.
  • a metal plate is formed by punching a resin plate.
  • the wall portion having the communication holes can be easily formed, and the design of the communication holes can be easily changed in position (for example, the interval between the plurality of communication holes), size, and shape.
  • the wall 88 is formed of a porous body.
  • the porous body is, for example, a sintered metal.
  • the filtration diameter of the porous body may be appropriately set depending on the supply amount to the heat removal use channel, etc., and is, for example, 1 ⁇ force 200.
  • a sufficient amount of liquid refrigerant is supplied to the main flow channel even if the main flow channel and the sub flow channel are partitioned by the porous body. I can't do it.
  • the hole part of a porous body is an example of the refrigerant
  • one slit 90 extending along the longitudinal direction of the wall 89 is provided.
  • a liquid refrigerant is supplied into the heat removal use channel in a predetermined range in the flow direction of the heat removal use channel by the slit 90, and a liquid film is formed over the predetermined range, The same effect as when liquid refrigerant is supplied to a plurality of positions can be obtained.
  • the size, shape, and arrangement position of the communication holes may be changed as appropriate.
  • the size, shape, and position of the communication holes may be uneven or uneven.
  • the communication holes and the grooves in the direction orthogonal to the flow path formed on the inner peripheral surface of the heat removal flow path may not be at the same position or the same number.
  • the liquid supply flow path 91 is provided with a plurality of communication holes 92 from one end 9 la into which the liquid refrigerant is poured to the other end 9 lb. It is formed so that its diameter increases toward 9 lb.
  • the liquid refrigerant may be supplied to the heat removal use channel at a uniform flow rate from the upstream side to the downstream side of the liquid supply use channel 91 in some cases.
  • the communication holes 95 are formed so that the pitch of the communication holes 95 becomes smaller toward the end 94a and end 94b side of the liquid supply channel 94.
  • the liquid refrigerant can be supplied to the heat removal use channel at a uniform flow rate from the upstream side to the downstream side of the liquid supply use channel 94.
  • FIG. 15A and FIG. 15B show the amount of liquid refrigerant supplied from the liquid supply channel to the heat removal channel.
  • FIG. 15A is a plan view that generalizes the heat removal use channels 31, 73, and 67 shown in FIGS. 2A to 2C, FIG. 7A, and FIG. 7B.
  • the diagram on the lower side of FIG. 15A is a diagram showing the pressure P1 of the liquid supply channel and the pressure P2 of the heat removal channel at each position in the channel direction in the diagram on the upper side of FIG. 15A.
  • 15B is a plan view generally showing the heat removal use channel 76 shown in FIG. 7D.
  • the diagram on the lower side of FIG. 15B is a diagram showing the pressure P1 of the liquid supply channel and the pressure P2 of the heat removal channel at each position in the channel direction in the diagram on the upper side of FIG. 15B.
  • the supply of the liquid refrigerant from the liquid supply flow path (32, 77, etc.) to the heat removal flow path (31, 76, etc.) is performed by a flow path (refrigerant passage section; for example, a communication hole).
  • a flow path refrigerant passage section; for example, a communication hole.
  • flow of holes 88, Fig. 9B
  • slits 90, Fig. 9C
  • nozzles 65, Fig. 6G, etc.
  • the liquid supply amount is determined.
  • the pressure of the liquid supply flow path is higher than the pressure of the heat removal flow path.
  • the distribution of the flow rate from the liquid supply flow path to the heat removal flow path is determined by the pressure distribution of each of the liquid supply flow path and the heat removal flow path.
  • the pressure gradient in the liquid supply flow path gradually decreases because the flow rate in the liquid supply flow path decreases due to the flow of liquid into the heat removal flow path (31, 76, etc.). To drop.
  • the flow rate is steadily increasing, and the pressure gradient increases conversely because it changes from a liquid single phase to a gas-liquid two phase by heating.
  • the pressure difference ⁇ ⁇ between the liquid supply channel (32, 77, etc.) and the heat removal channel (31, 76, etc.) is assumed to be upstream of the heat removal channel when a parallel channel is assumed. As the amount of supply from the liquid supply channel to the heat removal channel in the upstream part becomes small, dryout may easily occur in the upstream part.
  • the flow resistance of the flow path (refrigerant passage section) communicating with the liquid supply flow path (32, 77, etc.) and the heat removal flow path (31, 76, etc.) is opened.
  • the flow resistance of the refrigerant passage portion located at the boundary between the liquid supply flow path and the heat removal flow path is reduced in the upstream portion of the heat removal flow path.
  • An example of enlargement in the downstream is shown.
  • FIG. 16A shows a case where the liquid supply use channel and the heat removal use channel of FIG. 15A are communicated by the communication hole 131.
  • the diameter of the communication hole 131 is set larger toward the upstream side (right side of the drawing) of the liquid supply channel and the heat removal channel, and the flow resistance is smaller toward the upstream side.
  • FIG. 16B shows a case where the liquid supply use channel and the heat removal use channel shown in FIG. 15A are communicated with each other through the communication hole 133.
  • the communication holes 133 are set to have a smaller pitch on the upstream side (right side of the drawing) of the liquid supply channel and the heat removal channel, and the flow resistance is smaller on the upstream side.
  • FIG. 16C shows a case where the liquid supply use channel and the heat removal use channel of FIG.
  • the width of the slit 135 is set larger toward the upstream side (right side of the drawing) of the liquid supply channel and the heat removal channel, and the flow resistance is smaller toward the upstream side.
  • FIG. 16D shows a case where the liquid supply use channel and the heat removal use channel shown in FIG. 15B are communicated with each other through the communication hole 137.
  • the communication hole 137 has a larger diameter on the upstream side of the liquid supply flow path and the heat removal flow path (the center side of the liquid supply flow path 77), and the upstream side has a smaller flow resistance. .
  • FIG. 16E shows a case where the liquid supply use channel and the heat removal use channel of FIG. 15B are communicated with each other through the communication hole 139.
  • the communication hole 139 has a smaller pitch on the upstream side of the liquid supply channel and the heat removal channel (the center side of the liquid supply channel 77), and the upstream side has a smaller flow resistance force. .
  • FIG. 16F shows a case where the liquid supply use channel and the heat removal use channel of FIG.
  • the slit 141 is set to have a larger width on the upstream side of the liquid supply channel and the heat removal channel (center side of the liquid supply channel 77), and the flow resistance is smaller on the upstream side.
  • the flow resistance is relatively increased in the central portion where the pressure of the liquid supply channel locally increases due to the collision of the inflowing liquid.
  • FIGS. 10A to 10F are diagrams illustrating patterns on the inner peripheral surface of the heat removal use channel.
  • the liquid refrigerant is supplied in the left-right direction (X direction) from the liquid supply channel or the like.
  • FIG. 10A corresponds to the embodiment shown in FIGS. 2A to 2C.
  • a plurality of groove portions 96 extending in the direction orthogonal to the groove portion 40 are provided in addition to the groove portion 40.
  • the groove 96 makes it easy for the liquid refrigerant to spread in the direction in which the groove 96 extends, and a liquid film is easily formed over the entire heat removal use channel.
  • the gap between the supply positions tends to be depleted. Since the liquid refrigerant spreads between the supply positions by the groove portion 96, drought is prevented.
  • the groove portion 96 may be provided without providing the groove portion 40, or a groove portion that extends obliquely in the flow path direction is provided, and the groove portion is liquid in both the flow path direction and the direction orthogonal to the flow path. You may spread the cooling medium. You may provide the groove part meandering zigzag.
  • the groove 40 and the groove extending obliquely to the channel are an example of a groove crossing the channel.
  • the groove section that crosses the flow path may extend from one side end of the flow path to the other side end, and extends within an appropriate range in the middle between the side ends. Moyo.
  • a net-like sheet 98 is stretched on the inner peripheral surface of the heat removal use channel.
  • the sheet 98 is an example of a sheet into which the liquid refrigerant of the present invention permeates.
  • the sheet 98 is made of, for example, metal, ceramic, resin, fiber, or the like.
  • the size of the mesh and the weaving type may be appropriately selected according to the type of refrigerant.
  • the refrigerant is sucked into the sheet 98 and spreads on the inner peripheral surface of the heat removal use channel. As a result, a liquid film is uniformly formed on the entire inner peripheral surface.
  • a sheet 100 formed of a porous material is stretched on the inner peripheral surface of the heat removal use channel.
  • the sheet 100 is an example of a sheet into which the liquid refrigerant of the present invention permeates.
  • the sheet 100 is made of, for example, a sintered metal. The same effect as the sheet 98 can be obtained in the sheet 100.
  • the inner peripheral surface of the heat removal use channel is a rough surface such as coating or polishing.
  • the inner peripheral surface may be roughened to have a liquid film holding function.
  • FIGS. 10E and 10F show examples of the cross-sectional shapes of the groove 40 and the groove 96.
  • the groove 102 shown in FIG. 10E has a V-shaped cross section
  • the groove 103 shown in FIG. 10F has a rectangular cross section.
  • 10E and 10F are examples, and the groove 40 and the groove 96 may have various shapes such as a U-shape.
  • FIGS. 11A to 11C show modified examples in which the heat removal use channel is enlarged in the width direction of the flow channel.
  • FIG. 11A is an external perspective view of the heat removal unit 105
  • FIG. 11B is an Xlb of FIG. — Cross-sectional view in the direction of arrow Xlb
  • FIG. 11C is a cross-sectional view in the direction of arrow XIc—XIc in FIG. 11A.
  • 11A to 11C are pipes 107A, 107B, 107C (hereinafter simply referred to as “pipe 107”, which have branch portions at both sides and the center of a hollow body 106 having a rectangular cross section. May be distinguished from each other.)
  • the two heat removal flow paths 109A and 109B (hereinafter simply referred to as “heat removal flow path 109") may not be distinguished from each other. .)
  • Pipes 107A, 107B, and 107C each have a liquid supply channel 110A, 110B, and 1 IOC (hereinafter, simply referred to as “liquid supply channel 110”, which may not be distinguished). Is formed.
  • the pipe 107 is provided with a plurality of communication holes (not shown) that connect the heat removal use channel 109 and the liquid supply use channel 110 along the flow direction of the heat removal use channel 109.
  • each heat removal use channel 109 similarly to the heat removal use channel shown in Fig. 2A and the like, the liquid supply use channel 110 arranged on both sides of the heat removal use channel 109 passes through a communication hole (not shown). Liquid refrigerant is supplied, and a liquid film of the refrigerant is formed. However, the liquid supply channel 110B in the center supplies liquid refrigerant to both the heat removal use channels 109A and 109B on both sides thereof. The gaseous refrigerant evaporated in each heat removal use channel 109 is joined after being discharged from each heat removal use channel 109.
  • the heat removal use channel is divided into a plurality of heat removal use channels 109 in the width direction of the flow channel, so that the heating length in the width direction is short.
  • the heat removal use channel can be expanded in the width direction.
  • the liquid supply flow path 110B is shared by the two heat removal flow paths 109A and 109B, and the number of parts can be reduced.
  • the two heat removal flow paths 109A and 109B are separated by the liquid supply flow path 110B, reducing the mutual effects of the heat removal flow paths 109A and 109B. Is done.
  • FIGS. 12A to 12C show modified examples in which the heat removal use channel is enlarged in the flow direction.
  • FIG. 12A is an external perspective view of the heat removal unit 112
  • FIG. 12C is a cross-sectional view taken along the line Xllb-Xllb, and FIG.
  • pipes 115A, 115B, and 115C (hereinafter simply referred to as “pipe 115”) having a plurality of branch portions on both sides and the center of a hollow body 114 having a rectangular cross section. May be distinguished from each other), and the two heat removal use channels 116A and 116B (hereinafter simply referred to as “heat removal use channel 116") may not be distinguished from each other. ) Is formed.
  • the pipes 115A, 115B, and 115C have liquid supply channels 117A, 117B, and 117C (hereinafter simply referred to as “liquid supply channels 117”, which may not be distinguished from each other). Is formed.
  • the Neuve 115 is provided with a plurality of communication holes (not shown) that connect the heat removal use channel 116 and the liquid supply use channel 117 along the flow direction of the heat removal use channel 116.
  • the heat removal use channel 116 is partitioned into a plurality of sections Dl, D2, and D3 in the channel direction (y direction).
  • the plurality of compartments D1 to D3 are respectively provided with discharge ports 119A, 119B, and 119C that open to the side of the flow path, for example, to the opposite side of the heat removal object HO and discharge the gaseous refrigerant. .
  • a liquid film is formed by the refrigerant supplied from the liquid supply path 117, and the evaporated refrigerant is discharged through the discharge ports 119A to 119C.
  • the liquid supply path 117 may communicate with all the sections D1 to D3, and may be divided into a plurality of partitions in the same manner as the heat removal flow path 116. Are you okay?
  • the evaporated refrigerant can be discharged at an early stage, and the heat removal efficiency of each of the divisions D1 to D3 is improved and the compartment Impact can be mitigated.
  • the heat removal use channel that is, the heat removal surface can be made as long as possible.
  • the liquid supply flow path 117 does not need to be partitioned according to the sections D1 to D3, so that no design change is required.
  • partitioning the heat removal use channel in the direction of the flow increases the load on the pump due to the large pressure loss and also reduces the cooling efficiency. Expansion in the direction was difficult.
  • FIG. 13 is a diagram showing a modification of the overall configuration of the heat removal apparatus.
  • the heat removal device 1 in FIG. The common parts are denoted by the same reference numerals.
  • the gas-liquid phase separator 19 and the supercooling unit 21 are omitted. Therefore, the evaporative refrigerant completely returns to liquid inside the condensing unit 14, and all the heat quantity Q from the heat removal object is released to the atmosphere in the condensing unit 14.
  • FIG. 17 is a diagram showing an application example of the present invention.
  • the automobile 151 has a power controller 153 as a heat removal target and a heat removal device 155.
  • the heat removal apparatus 155 has a configuration similar to that of the heat removal apparatus 1 described above. Specifically, the heat removal device 155 includes an auxiliary liquid tank 157 that stores liquid refrigerant (corresponding to the liquid storage tank 3), a pump 159 that discharges liquid refrigerant (corresponding to the pump 5), and a pump 159.
  • the heat removal device 155 includes an auxiliary liquid tank 157 that stores liquid refrigerant (corresponding to the liquid storage tank 3), a pump 159 that discharges liquid refrigerant (corresponding to the pump 5), and a pump 159.
  • a heat removal unit 161 that removes heat from the power controller 153 by the delivered liquid refrigerant (corresponding to the heat removal unit 12) and a radiator 163 that condenses the gaseous refrigerant flowing out of the heat removal unit 161 (corresponding to the condensation unit 14) )
  • a gas-liquid phase splitter 165 (corresponding to the gas-liquid phase splitter 19) that separates the refrigerant that has flowed out of the radiator 163 into a gaseous refrigerant and a liquid refrigerant.
  • the liquid refrigerant separated by the gas-liquid phase separator 165 is sent out by the pump 159.
  • the flow rate of the liquid refrigerant sent out by the pump 159 to the auxiliary liquid tank 157 and the heat removal unit 1601 is controlled by the flow rate control unit 160.
  • the heat removal unit 161 has a heat removal flow path provided adjacent to the power controller 153, as with the heat removal unit 12.
  • Liquid refrigerant is supplied into the heat removal flow path at a plurality of positions (predetermined range) in a predetermined direction of the heat removal flow path, and the plurality of positions (predetermined range) are provided on the inner peripheral surface of the heat removal flow path.
  • a liquid film of refrigerant is formed.
  • the power controller 153 is cooled by the evaporation of the liquid film.
  • the temperature difference between the allowable temperature of the power controller (about 100 ° C) and the outside air temperature (about 30 ° C) that releases waste heat is small. Since the required temperature difference can be kept smaller than normal boiling cooling, the heat removal capacity of the entire cooling system can be increased.
  • FIG. 18 is a diagram showing another application example of the present invention.
  • the power conversion system 171 is provided in, for example, a power plant or factory, and converts voltage, etc. System.
  • the power conversion system 171 includes a plurality of power elements 173 as heat removal objects and a heat removal device 175.
  • the heat removal apparatus 175 has a configuration similar to that of the heat removal apparatus 121 described above.
  • the heat removal device 175 includes a pump 177 (corresponding to the pump 5) that sends out liquid refrigerant, and a plurality of heat removal devices that remove heat from the plurality of power elements 173 by the liquid refrigerant sent out by the pump 177. It has a heat section 179 (corresponding to the heat removal section 12) and an air cooling unit 181 (corresponding to the condensation section 14) that condenses the gaseous refrigerant flowing out from the heat removal section 179.
  • the cooling medium flowing out from the air cooling unit 181 is sent out by a pump 177.
  • the plurality of power elements 173 and the plurality of heat removal units 179 constitute a power element cooling row 183 by alternately laminating one heat removal unit 179 and two power elements 173.
  • a plurality of power element cooling rows 183 are provided.
  • power elements 173 are arranged on both sides of one heat removal unit 179, and two heat elements 173 can be removed by one heat removal unit 179.
  • each power element cooling row 183 and the plurality of heat removal units 179 in each power element cooling row 183 are connected in parallel to each other. That is, the liquid refrigerant sent from the pump 177 is divided and flows into each power element cooling row 183, and further divided into each power element cooling row 183 and flows into each heat removal unit 179. Configured to be! RU
  • Each heat removal section 179 has a heat removal flow path provided adjacent to the power element 173, similar to the heat removal section 12, although not particularly shown.
  • Liquid refrigerant is supplied into the heat removal flow path at a plurality of positions (predetermined range) in a predetermined direction of the heat removal flow path, and the inner peripheral surface of the heat removal flow path extends over a plurality of positions (predetermined range).
  • a liquid film of refrigerant is formed.
  • the power element 173 is cooled by the evaporation of the liquid film.
  • FIG. 19A and FIG. 19B are diagrams for explaining the effect of the present invention.
  • FIG. 19A is a diagram showing a heat transfer characteristic obtained by an experiment in the heat removal apparatus as an example of the present invention.
  • FIG. 19B is a diagram showing the heat transfer characteristics of FIG. 19A in comparison with the heat transfer characteristics in the prior art.
  • the horizontal axis represents the temperature difference between the heat removal target surface of the heat removal object (one surface constituting the heat removal flow path) and the liquid refrigerant flowing into the heat removal flow path.
  • ⁇ ( ⁇ ) and the vertical axis represents the heat flux q (WZcm 2 ) of the heat removal target surface on the heat removal target surface.
  • WZm 2 K the heat transfer coefficient
  • the circular mark Ml represents the value at the upstream position in the flow direction and the center position in the width direction of the heat removal use channel in the heat removal apparatus of an example of the present invention.
  • the rectangular mark M2 indicates the value at the center in the flow direction and the center in the width direction of the heat removal channel in the heat removal apparatus according to an example of the present invention, and the triangular mark M3 indicates the value according to the example of the present invention.
  • the value at the downstream position in the flow direction of the heat removal use channel and at the center in the width direction is shown.
  • the heat removal use channel of the heat removal apparatus of one example of the present invention has a groove formed on the inner peripheral surface. Further, no heat spreader is provided.
  • the liquid supercooling (difference from saturation temperature) at the inlet of the heat removal channel is 15K.
  • the volume flow rate of the liquid refrigerant is 4.5 liters Z min.
  • One side of the liquid supply channel is closed.
  • the gap width of the heat removal use channel (the gap between the heat removal target surface and the heat insulation surface facing it) is 5 mm.
  • the width X length (flow path direction) of the heat removal target surface is 30 mm X 150 mm.
  • the heat removal apparatus of an example of the present invention has a heat flux that is one order higher than that of the water-cooling method with the heat spreader even when the heat spreader is not provided. Cooling at has been realized.
  • the heat generation area that can be cooled is 2 orders of magnitude larger, and a high heat transfer coefficient can be obtained by evaporation of the liquid film.
  • the heat removal target may be a heating element that releases heat, such as a power element, a motor, or a battery, as long as it is higher than the saturation temperature of the refrigerant, or a heating element such as a heat spreader. It may be a heat transfer material that transfers heat. It may be gas, liquid, or solid.
  • the heat removal use channel may be formed with an appropriate material, shape, and dimensions as long as it is provided adjacent to the heat removal object. In any case, if the heat removal use channel is adjacent to the heat removal object, heat is transferred from the heat removal object, and therefore, the heat removal channel is thermally connected to the heat removal object.
  • the plurality of positions at which the liquid refrigerant is supplied to the heat removal use channel is not limited to those arranged in the flow direction. As long as liquid refrigerant is supplied to a plurality of positions and a liquid film is formed over the plurality of positions, the direction may be perpendicular to the flow path. It should be noted that the range of multiple positions Although it is desirable that the area that does not wither in the enclosure does not occur, liquid refrigerant is supplied to a plurality of positions even if there is a part that has withered, and the conventional liquid refrigerant is used.
  • liquid refrigerant liquid refrigerant is filled in the heat removal use channel
  • a liquid film is formed over a plurality of positions. It can be said that is formed.

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Abstract

La présente invention concerne un appareil d'élimination de chaleur capable de réaliser l'élimination d'un important flux de chaleur à partir d'une grande surface. Un appareil (1) d'élimination de chaleur selon l'invention comporte un passage (31) d'écoulement évacuateur de chaleur pratiqué au voisinage d'un objet (HO) duquel la chaleur doit être extraite, et un passage (32) d'écoulement d'amenée de liquide qui s'étend le long du passage (31) d'écoulement évacuateur de chaleur et à travers lequel s'écoule un agent de refroidissement liquide. Des trous (38) de communication servant à mettre en communication le passage (31) d'écoulement évacuateur de chaleur avec le passage (32) d'écoulement d'amenée de liquide sont pratiqués au niveau d'une pluralité de positions dans une partie (36a) de paroi servant à séparer le passage (31) d'écoulement évacuateur de chaleur du passage (32) d'écoulement d'amenée de liquide. L'agent de refroidissement liquide est amené du passage (32) d'écoulement d'amenée de liquide au passage (31) d'écoulement évacuateur de chaleur par les trous (38) de communication et un film liquide est formé sur la surface périphérique intérieure du passage (31) d'écoulement évacuateur de chaleur. Ledit film liquide est évaporé par la chaleur provenant de l'objet (HO) duquel la chaleur doit être extraite. L'agent de refroidissement évaporé est évacué du passage (31) d'écoulement évacuateur de chaleur.
PCT/JP2007/053297 2006-02-22 2007-02-22 Procede et appareil d'elimination de chaleur WO2007105450A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008505028A JP4269060B2 (ja) 2006-02-22 2007-02-22 除熱方法及び除熱装置
US12/280,397 US20090114374A1 (en) 2006-02-22 2007-02-22 Heat removal method and heat removal apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006045558 2006-02-22
JP2006-045558 2006-02-22

Publications (1)

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WO2007105450A1 true WO2007105450A1 (fr) 2007-09-20

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US (1) US20090114374A1 (fr)
JP (1) JP4269060B2 (fr)
TW (1) TW200739014A (fr)
WO (1) WO2007105450A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266117A (ja) * 2006-03-27 2007-10-11 Toyota Motor Corp 冷却器
JP2007266463A (ja) * 2006-03-29 2007-10-11 Toyota Motor Corp 冷却器
JP2009206271A (ja) * 2008-02-27 2009-09-10 Aisin Aw Co Ltd 発熱体冷却装置

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Publication number Priority date Publication date Assignee Title
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KR101474616B1 (ko) * 2012-11-02 2014-12-18 삼성전기주식회사 전력반도체장치의 방열시스템
US10436519B1 (en) * 2015-10-14 2019-10-08 The Research Foundation For The State University Of New York Cocurrent loop thermosyphon heat transfer system for sub-ambient evaporative cooling and cool storage
CN106714505A (zh) * 2015-11-13 2017-05-24 鸿富锦精密工业(深圳)有限公司 服务器散热系统
JP6321089B2 (ja) * 2016-07-04 2018-05-09 レノボ・シンガポール・プライベート・リミテッド ベイパーチャンバー及び電子機器
JP2021069993A (ja) * 2019-10-31 2021-05-06 キヤノン株式会社 ウルトラファインバブル生成装置およびその制御方法
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CN113883925B (zh) * 2021-10-18 2022-08-09 西安交通大学 一种均匀液膜蒸发换热器及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035980A (ja) * 1999-06-04 2001-02-09 Jung Hyun Lee 超小型冷却装置
JP2004028444A (ja) * 2002-06-25 2004-01-29 Sony Corp 冷却装置、電子機器装置及び冷却装置の製造方法
JP2004207737A (ja) * 2002-12-20 2004-07-22 Innowert Service-Center In Ges Fuer Innovation & Kommunikationstechnik Mbh 電気装置及び電子装置の少なくとも一方のための冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2005259747A (ja) * 2004-03-09 2005-09-22 Sony Corp 熱輸送装置及び電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035980A (ja) * 1999-06-04 2001-02-09 Jung Hyun Lee 超小型冷却装置
JP2004028444A (ja) * 2002-06-25 2004-01-29 Sony Corp 冷却装置、電子機器装置及び冷却装置の製造方法
JP2004207737A (ja) * 2002-12-20 2004-07-22 Innowert Service-Center In Ges Fuer Innovation & Kommunikationstechnik Mbh 電気装置及び電子装置の少なくとも一方のための冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2005259747A (ja) * 2004-03-09 2005-09-22 Sony Corp 熱輸送装置及び電子機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266117A (ja) * 2006-03-27 2007-10-11 Toyota Motor Corp 冷却器
JP2007266463A (ja) * 2006-03-29 2007-10-11 Toyota Motor Corp 冷却器
JP2009206271A (ja) * 2008-02-27 2009-09-10 Aisin Aw Co Ltd 発熱体冷却装置

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TWI361265B (fr) 2012-04-01
US20090114374A1 (en) 2009-05-07
JPWO2007105450A1 (ja) 2009-07-30
TW200739014A (en) 2007-10-16
JP4269060B2 (ja) 2009-05-27

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