WO2007054244A2 - Procede pour le revetement de contacts electriques - Google Patents

Procede pour le revetement de contacts electriques Download PDF

Info

Publication number
WO2007054244A2
WO2007054244A2 PCT/EP2006/010596 EP2006010596W WO2007054244A2 WO 2007054244 A2 WO2007054244 A2 WO 2007054244A2 EP 2006010596 W EP2006010596 W EP 2006010596W WO 2007054244 A2 WO2007054244 A2 WO 2007054244A2
Authority
WO
WIPO (PCT)
Prior art keywords
contact
monolayer
layer
electrical
coating
Prior art date
Application number
PCT/EP2006/010596
Other languages
German (de)
English (en)
Other versions
WO2007054244A3 (fr
Inventor
Sabri Akari
Rainer M. Rothe
Original Assignee
Fixtest Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fixtest Gmbh filed Critical Fixtest Gmbh
Publication of WO2007054244A2 publication Critical patent/WO2007054244A2/fr
Publication of WO2007054244A3 publication Critical patent/WO2007054244A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B05D1/185—Processes for applying liquids or other fluent materials performed by dipping applying monomolecular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/08—Flame spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2300/00—Orthogonal indexing scheme relating to electric switches, relays, selectors or emergency protective devices covered by H01H
    • H01H2300/036—Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale

Definitions

  • the invention relates to a method for coating electrical contacts for protection against environmental influences, such as corrosion, wear or dirt deposits while maintaining the electrical conductivity.
  • contacts are coated with precious metals, such as a gold or silver layer. This provides some protection, but does not eliminate all problems.
  • galvanically treat contacts for better conductivity and corrosion prevention. Over time, however, the galvanized contact surfaces also become contaminated by oxidation, atmospheric
  • Contamination and countercontact residues (eg tin), which occur during Contact with the solder. This happens especially in the legally prescribed use of unleaded tin. Poor contacts form parasitics in the form of inductances and capacitances that would not be present during regular soldering.
  • contact fats which can otherwise contribute to improving the reliability and service life of live metal interfaces.
  • Contact lubricants show a good result in the durability of (positive) connectors.
  • a serious disadvantage of contact fats is that they rather attract the dirt by their slowly evaporating components.
  • this solution shows only a low durability and must be repeated in relatively short time cycles.
  • the object of the present invention is to improve the contact reliability, the contact durability, the corrosion resistance and the reduction of the susceptibility to fouling of electrical contact connections.
  • Layer is applied with a chemically functional surface.
  • the chemically functional surface has the effect of repelling particles so that they can not attach to the contact.
  • a multilayer which does not impair or even improve the electronic conductivity or a self-assembled monolayer is applied to the contact.
  • a molecular non-stick layer against dirt is applied to the contact. This is done by coating with SAM molecules.
  • the molecular monolayer is an ultrathin organic layer. It is the thinnest, closed layer that can ever be applied to a surface. Its thickness corresponds to the length of a molecule and thus about one nanometer.
  • the molecules of the layer consist of an anchor, a backbone and a functional group. They are fixed by a solid chemical compound of the anchor group with the surface atoms of the contact. This results in a quasi-molecular fur whose hair corresponds to the rod-shaped molecules.
  • the chemical nature of the surface is determined by the functional group that forms the surface of the monolayer, called termination.
  • the anchoring group of the monolayer with a metallic surface of the contact is a thiolic anchor group which forms a covalent bond with the surface.
  • functional end groups terminal
  • methyl groups (CH 3 ) or fluorine groups (CF 3 ) are preferred as examples.
  • the monolayer Since, as mentioned above, the monolayer is only 0.5 nm to 3 nm thick, it poses no problem for the conductivity of the contact due to the tunnel effect or the current permeability of the monolayer. In addition, the monolayer exhibits a mechanically stabilizing effect and thus a Increase in surface hardness.
  • the provision of contact with the monolayer is preferably done in an ethanolic or aqueous SAM solution, but it is also conceivable application from the gas phase.
  • a monomolecular layer of amphiphilic molecules forms on the surface.
  • the surface properties of the layer are determined by the functional end groups of the molecule layer.
  • High voltage generator and a plasma nozzle Inside the plasma nozzle, the plasma is created by a high-voltage discharge between two
  • Electrodes The process gas flows around the electrodes where it becomes a plasma and escapes through a nozzle due to its flow.
  • the cheapest process gas is air.
  • the basis of the approach is a deposition of the coating by plasma polymerization at atmospheric pressure.
  • the so-called open air plasma system is used.
  • the plasma generation is based on an arc-like discharge by electrical excitation in the kHz frequency range.
  • the plasma jet or contacts are moved relative to each other.
  • Important and adjustable process parameters are the substrate-plasma distance, the treatment duration, the feed location of the precursor and the process gases.
  • the use of functionalized conductive nanoparticles is provided in order to achieve the required functionality while maintaining and improving the electrical properties. These can be applied alone to the contact or in or on a monolayer. As nanoparticles, especially those from a precious metal can be used.
  • Another variant for achieving the required functionality while maintaining the electrical properties is the coating of the contact surface with conductive functional polymers.
  • the conductivity is For example, generated by the incorporation of metal particles in a polymer. These metal particles, especially of precious metal, can then migrate to the surface and form the functional surface there.
  • This novel coating allows the achievement of a chemical functionality of the metal surface while maintaining or improving the electrical properties of the metal surface.
  • the modification is permanent and leads to a significant extension of the operating time of electrical contacts.
  • the invention is intended, above all, for use in test contact, for charging current contacts of battery charging devices, in docking stations, etc.
  • An important area of application is the testing of circuit boards, on which up to 1000 measuring points can be tested in just a few seconds.
  • the insert extends to any type of mechanical and electrical contacts to reduce contact problems. This includes switches and plug contacts in automotive electronics.
  • the invention is also useful in all types of detachable electrical contacts and for general corrosion and oxidation protection of electrical conductors.
  • the coating is suitable for all precious metal surfaces (Au, Ag 1 Cu 1 Pt, etc.), refined contact elements and connectors, IC connectors and sockets, sockets, relays, PCBs, etc. for rigid or movable contacts, homogeneous or heterogeneous contact materials.
  • Figure 1 is a schematically enlarged, substantially enlarged
  • FIG. 2 shows a schematically illustrated, substantially enlarged section of a contact surface with a further embodiment of a coating.
  • 1 denotes a metallic contact which has a surface 2.
  • SAM self-aggregated monolayer
  • This monolayer 3 consists of individual molecules 4, wherein the thickness of the monolayer 3 corresponds approximately to the length of a molecule.
  • Each molecule 4 is anchored with an armature 5 in the metallic contact 1, wherein the armature 5 is followed by a 6 consisting of a plurality of molecular elements backbone.
  • a plurality of anchors 5 forms an anchor group.
  • termination To the respective backbone 6 adjoins an end member 7, wherein a plurality of end members 7 form a functional end group (termination) 8. The nature of the surface of the monolayer is determined by this termination 8.
  • functionalized conductive nanoparticles 9 can additionally be applied or applied onto or into the monolayer 3, so that a particle layer 10 is formed. This leads to an improvement of the electrical property of the contact.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Switches (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé pour le revêtement de contacts électriques (1) en vue de protéger ces derniers d'effets environnementaux, tels que la corrosion, l'usure ou l'encrassement, tout en conservant la conductivité électrique. Selon ce procédé, on applique sur le contact (1) une multicouche ou une couche électroconductrice ayant une surface chimiquement fonctionnelle.
PCT/EP2006/010596 2005-11-09 2006-11-06 Procede pour le revetement de contacts electriques WO2007054244A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005053790 2005-11-09
DE102005053790.1 2005-11-09
DE102006030961A DE102006030961A1 (de) 2005-11-09 2006-07-03 Verfahren zum Beschichten elektrischer Kontakte
DE102006030961.8 2006-07-03

Publications (2)

Publication Number Publication Date
WO2007054244A2 true WO2007054244A2 (fr) 2007-05-18
WO2007054244A3 WO2007054244A3 (fr) 2007-07-19

Family

ID=37836625

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/010596 WO2007054244A2 (fr) 2005-11-09 2006-11-06 Procede pour le revetement de contacts electriques

Country Status (2)

Country Link
DE (1) DE102006030961A1 (fr)
WO (1) WO2007054244A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014119114A1 (de) 2014-12-18 2016-06-23 Harting Kgaa Kontaktbeschichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996002383A1 (fr) * 1994-07-14 1996-02-01 Competitive Technologies, Inc. Formation par etapes de nanostructures a couches multiples a partir de precurseurs macromoleculaires
WO1999048682A1 (fr) * 1998-03-27 1999-09-30 University Of Pittsburgh Article, preparation resistant au ternissement, procede de fabrication et procedes d'utilisation associes
US20030077625A1 (en) * 1997-05-27 2003-04-24 Hutchison James E. Particles by facile ligand exchange reactions
WO2003092914A2 (fr) * 2002-05-03 2003-11-13 Fci Procédé pour améliorer la résistance à la corrosion et diminuer le coefficient de friction d'un substrat métallique ou revêtu d'un film métallique et utilisation du procédé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996002383A1 (fr) * 1994-07-14 1996-02-01 Competitive Technologies, Inc. Formation par etapes de nanostructures a couches multiples a partir de precurseurs macromoleculaires
US20030077625A1 (en) * 1997-05-27 2003-04-24 Hutchison James E. Particles by facile ligand exchange reactions
WO1999048682A1 (fr) * 1998-03-27 1999-09-30 University Of Pittsburgh Article, preparation resistant au ternissement, procede de fabrication et procedes d'utilisation associes
WO2003092914A2 (fr) * 2002-05-03 2003-11-13 Fci Procédé pour améliorer la résistance à la corrosion et diminuer le coefficient de friction d'un substrat métallique ou revêtu d'un film métallique et utilisation du procédé

Also Published As

Publication number Publication date
DE102006030961A1 (de) 2007-05-10
WO2007054244A3 (fr) 2007-07-19

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DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
122 Ep: pct application non-entry in european phase

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