WO2007053976A1 - A new glass packaging diode - Google Patents

A new glass packaging diode Download PDF

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Publication number
WO2007053976A1
WO2007053976A1 PCT/CN2005/001881 CN2005001881W WO2007053976A1 WO 2007053976 A1 WO2007053976 A1 WO 2007053976A1 CN 2005001881 W CN2005001881 W CN 2005001881W WO 2007053976 A1 WO2007053976 A1 WO 2007053976A1
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WO
WIPO (PCT)
Prior art keywords
diode
num
alloy
glass tube
glass
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Application number
PCT/CN2005/001881
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English (en)
French (fr)
Inventor
Sin Kwan Ng
Original Assignee
Tak Cheong Electronics (Shanwei) Co., Ltd.
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Publication date
Application filed by Tak Cheong Electronics (Shanwei) Co., Ltd. filed Critical Tak Cheong Electronics (Shanwei) Co., Ltd.
Priority to PCT/CN2005/001881 priority Critical patent/WO2007053976A1/zh
Publication of WO2007053976A1 publication Critical patent/WO2007053976A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to a glass-encapsulated diode.
  • the traditional glass-encapsulated diode (such as the glass-sealed diode of model D035, D041) is made up of hollow glass tube 1, 42# alloy lead 2 placed in glass tube 1, clamped to 42# alloy lead The intermediate silicon wafer 3 and the copper-clad iron wire 4 exposed on the outside of the glass tube 1 and connected to the 42# alloy lead 2; wherein the diameter of the 42# alloy lead 2 is larger than the copper-clad iron wire 4 connected to the 42# alloy lead diameter of. Since the diameter of the 42# alloy lead in the diode is larger than the diameter of the copper clad wire connected to the 42# alloy lead, the amount is large, and the 42# alloy is expensive, the cost of the conventional glass-sealed diode is high.
  • the conventional glass-sealed diode combination packaging process as shown in FIG. 2, firstly, the copper-clad iron wire 4 at both ends of the glass tube is passed through the fixing hole 51 of the welding plate 5, and the hollow glass tube 1 and the glass tube 1 are wrapped in the glass tube 1.
  • the 42# alloy lead 2 is placed in the middle of the two splicing plates 5, and the two splicing plates are fastened together by the pins 6; then, the unsealed glass-sealed diodes are placed together with the welded plates 5
  • the glass tube 1 is melted and tightly connected to the 42# alloy lead; finally, the glass tube is very firmly connected to the 42# alloy lead through the cooling process.
  • the fixing hole 51 of the soldering plate 5 is not passed, and the position of the 42# alloy lead and the glass tube are relatively fixed. And sent to the welding furnace for welding, so for more than 40 years, the diameter of the 42# alloy lead wrapped in the glass tube has been greater than the diameter of the copper-clad iron wire connected to it, and has not changed.
  • the diameter of the lead 2 is larger than the diameter of the copper clad wire 4. It is not a necessary condition for the combined package diode. As long as the combination of the diode and the fixing device are improved, the 42# alloy lead 2 and the glass tube 1 are made. The position of the diode is relatively fixed and the diode combination can still be packaged together.
  • the diode is a miniature signal product, its maximum power does not exceed 0.5W, and the normal operating current is only 150mA. Therefore, the diameter of the 42# alloy lead 2 that is in contact with the silicon wafer 3 is reduced, and the weak current can be dissipated. Heat does not cause the diode to be burned or shorted during operation.
  • a glass-sealed diode consisting of a hollow glass tube, a 42# alloy lead wrapped in a glass tube, a silicon wafer sandwiched between 42# alloy leads, and a bare glass tube a copper clad wire connected at both ends to the 42# alloy lead; characterized in that: the diameter of the 42# alloy lead is equal to the diameter of the copper clad wire connected to the 42# alloy lead; the 42# alloy lead and the Copper-clad iron wire welded connection.
  • the present invention adopts the above technical solution, the diameter of the 42# alloy lead wrapped in the glass tube is reduced, so that the diameter of the 42# alloy lead is equal to the diameter of the copper-clad iron wire, thereby greatly reducing the cost of the glass-sealed diode and saving the cost. Resources. Moreover, it has been experimentally proven that the performance of the improved glass-sealed diode is better than that of the improved diode.
  • the glass-encapsulated diode of the present invention has a significant improvement in reliability. This is because the inner diameter of the glass tube and the diameter of the 42# alloy lead head become smaller, so that: 1. The position of the silicon wafer in the glass tube is reduced, thereby reducing the probability of misalignment of the silicon wafer; 2. The lead head of the 42# alloy is cut off The deformed fillet and cutting angle are reduced, thereby reducing the deformation width of the lead cross section, and increasing the contact area of the silicon wafer with the 42# alloy lead.
  • Figure 1 is a schematic view of a conventional glass-sealed diode structure
  • Figure 2 is a schematic diagram of a conventional glass-encapsulated diode package.
  • FIG. 3 is a schematic view showing the structure of the improved glass-sealed diode of the present invention
  • the glass-sealed diode provided by the present invention mainly comprises a hollow glass tube 1, a 42# alloy lead wrapped in the glass tube 1, a silicon wafer 3 sandwiched between the 42# alloy leads, and a bare glass.
  • a copper-clad iron wire 4 connected to the 42# alloy lead outside the tube 1 is formed. among them,
  • the diameter of the 42# alloy lead 2 is equal to the diameter of the copper clad wire 4 connected to the 42# alloy lead; 42# The alloy bow I wire is welded to the copper clad iron wire.
  • the hollow glass tube can be 1 and the 42# alloy lead 2 wrapped in the glass tube 1 is placed in the middle of the two welded plates 5; then, the glass-sealed diode which is not subjected to high temperature treatment between the two welded plates 5 is brought together with the welded plate 5 It is placed in a high-temperature soldering furnace. At high temperature, the glass tube 1 is melted and tightly connected to the 42# alloy lead. Finally, the glass tube is very firmly connected to the 42# alloy lead by a cooling process.
  • the 42 # alloy lead of the glass-encapsulated diode of the present invention has the same diameter as the copper-clad iron wire, it is easy to package the 42# wrapped in the glass tube 1 by using a fixing device as shown in FIG.
  • the alloy leads pass through the fixing holes 51 of the soldering plate 5 and are exposed outside the glass tube 1, so that the present invention devises a new device for fixing the diode.
  • the fixing device is composed of three welded plates, and the three welded plates are fixed together by pins 6 to prevent the 42 turns of the alloy wires in the glass tube 1 from passing through the welded plate and exposed to the glass tube 1.
  • the height difference between the second welded plate 53 and the third welded plate 54 is exactly equal to the length of the copper clad wire 4, and the third welded plate 54 has no fixing holes for controlling the 42# alloy lead 2 and the glass.
  • the relative position of the tube 1 acts.
  • the unheated diode is fixed in the middle of the three welded plates, it is placed in a high-temperature soldering furnace together with the welded plate. At high temperature, the glass tube 1 is melted and tightly connected to the 42# alloy lead; finally, Through the cooling process, the glass tube is very firmly connected to the 42# alloy lead.
  • the diameter of the 42# alloy lead wrapped in the hollow glass tube 1 of the present invention is equal to the diameter of the copper-clad iron wire connected to the 42# alloy lead, the amount of the 42# alloy is compared with the conventional glass-sealed diode of the same industry. Reduced by half, greatly reducing the cost of raw materials. Moreover, the glass-sealed diode of the present invention has been rigorously tested by a thousand hours to prove that its performance parameters fully meet the national standards, and each performance index is superior to the conventional diode. Detailed data is as follows - before improvement IN4148 diode DC characteristic test data
  • the fillet and the cutting angle of the 42# alloy lead deformed by cutting are also reduced, thereby reducing the cross-sectional deformation width of the lead 2, and increasing the silicon wafer 3 and 42# alloy
  • Test condition IF 2A, time 10 seconds (number of samples: 30PCS)

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)

Description

新型玻封二极管 技术领域
本发明涉及一种玻封二极管。
背景技术
如图 1所示， 传统的玻封二极管 （如型号为 D035、 D041的玻封二极管)是 由中空的玻璃管 1、 套在玻璃管 1 内的 42# 合金引线 2、 夹在 42# 合金引线中 间的硅片 3、 以及裸露在玻璃管 1外面与 42# 合金引线 2相连的铜包铁线 4构 成； 其中， 42# 合金引线 2的直径大于与 42# 合金引线相连的铜包铁线 4的直 径。由于二极管中 42# 合金引线的直径大于与 42# 合金引线相连的铜包铁线的 直径， 用量大， 且 42# 合金价格昂贵， 所以， 造成这种传统的玻封二极管的成 本高。
传统的玻封二极管组合封装过程， 如图 2所示， 首先， 将玻璃管两端的铜 包铁线 4穿过焊接板 5的固定孔 51， 将中空玻璃管 1和包裹在玻璃管 1内的 42#合金引线 2架在两块悍接板 5的中间， 再将两块悍接板通过销钉 6紧固在 一起； 然后， 将未经过高温处理的玻封二极管连同焊接板 5—起放入高温焊接 炉内， 在高温下， 玻璃管 1熔化与 42# 合金引线紧密连接在一起； 最后， 经冷 却过程使玻璃管非常牢固地与 42# 合金引线相互连接在一起。
自从四十多年前， 人们发明了这种二极管以来， 包裹在玻璃管内的 42#合 金引线的直径就一直大于与之相连的铜包铁线的直径， 始终未有改变， 原因主 要有两点：
1、由于在二极管的组合封装工序中， 为使 42#合金引线头能架在焊接板上， 不会穿过焊接板 5的固定孔 51，进而使 42#合金引线与玻璃管的位置相对固定， 并送入焊接炉内焊接， 所以， 四十多年来， 包裹在玻璃管内的 42#合金引线的 直径就一直大于与之相连的铜包铁线的直径， 始终未变。
2、 由于工程师们长期以来一直认为， 接触硅片 3的 42#合金引线 2的表面 积大一些有利于散热， 如果散热不好， 严重时会导致二极管在工作时被烧掉、 短路， 所以， 四十年来， 二极管的结构始终未变。
本发明的发明人针对上述两方面进行^究后， 发現：
1、 引线 2的直径大于铜包铁线 4的直径不是组合封装二极管的必要条件， 只要对二极管的组合、 固定装置进行一些改进， 使 42#合金引线 2与玻璃管 1 的位置相对固定仍可将二极管组合封装在一起。
2、 二极管属于微型信号产品， 其最大功率不超过 0.5W, 通常的工作电流 只有 150mA， 所以， 将与硅片 3接触的 42# 合金引线 2的直径缩小， 仍可以散 去微弱电流产生的微少热量， 不会导致二极管在工作时被烧掉、 短路。
发明内容
鉴于上述原因， 本发明的目的是提供一种在保持玻封二极管性能符合国家 标准的情况下、 结构简单、 成本低的新型玻封二极管。
为实现上述目的， 本发明采用以下技术方案： 一种玻封二极管， 它由中空 玻璃管、 包裹在玻璃管内的 42# 合金引线、 夹在 42#合金引线中间的硅片、 以 及裸露在玻璃管两端与 42#合金引线相连的铜包铁线构成； 其特征在于 : 42# 合 金引线的直径和与 42#合金引线相连的铜包铁线的直径相等；所述 42#合金引线 与所述铜包铁线焊接连接。
由于本发明采用以上技术方案， 即将包裹在玻璃管内的 42#合金引线的直 径减小， 使 42#合金引线的直径与铜包铁线的直径相等， 从而大大降低玻封二 极管的成本， 节约了资源。 而且， 经实验证明， 改进后的玻封二极管的性能优 于改进前的二极管。
通过进行超常电流 （2A) 下的对比测试， 我们发现， 本发明玻封二极管在 可靠性方面有很明显的改善。 这是由于玻璃管内径和 42#合金引线头直径变小， 从而使得： 1、 硅片在玻璃管内的位置空间减小， 从而减小硅片错位的机率； 2、 42#合金引线头因切断而变形的圆角和切割角减小，从而减小引线头截面变形宽 度， 增加了硅片与 42#合金引线接触面积。
附图说明
图 1为传统的玻封二极管结构示意图
图 2为传统的玻封二极管组合封装示意图
图 3为本发明改进后的玻封二极管结构示意图
图 4为本发明改进后的玻封二极管组合封装示意图
具体实施方式
如图 3所示， 本发明提供的玻封二极管主要由中空的玻璃管 1、 包裹在玻 璃管 1 内的 42# 合金引线 2、 夹在 42# 合金引线中间的硅片 3、 以及裸露在玻 璃管 1两端外面与 42# 合金引线相连的铜包铁线 4构成。 其中，
42#合金引线 2的直径和与 42#合金引线相连的铜包铁线 4的直径相等； 42# 合金弓 I线与铜包铁线焊接连接。
由于传统的标准玻封二极管玻璃管 1 内的 42#合金引线 1的直径大于铜包 铁线 4的直径， 所以， 在玻封二极管组合封装过程中， 如图 2所示， 可以将中 空玻璃管 1和包裹在玻璃管 1 内的 42#合金引线 2架在两块焊接板 5的中间； 然后， 将架在两块焊接板 5之间未经过高温处理的玻封二极管连同焊接板 5— 起被放入高温焊接炉内， 在高温下， 玻璃管 1 熔化与 42#合金引线紧密连接在 一起； 最后， 经冷却过程使玻璃管非常牢固地与 42#合金引线相互连接在一起。
然而， 由于本发明玻封二极管的 42 # 合金引线与铜包铁线的直径相等， 所 以， 再使用如图 2所示的固定装置组合封装二极管就极易使包裹在玻璃管 1 内 的 42# 合金引线穿过焊接板 5的固定孔 51， 裸露在玻璃管 1的外面， 故， 本发 明设计了一种新的、 固定二极管的装置。 如图 4所示， 该固定装置由三块焊接 板组成， 三块焊接板通过销钉 6组合固定在一起， 为防止玻璃管 1 内的 42弁合 金引线穿过焊接板， 裸露在玻璃管 1的外面， 第二块焊接板 53与第三块焊接板 54的高度差刚好等于铜包铁线 4的长度， 且第三块焊接板 54上没有固定孔， 起到控制 42#合金引线 2与玻璃管 1 的相对位置作用。 当未经过高温处理的二 极管固定在三块焊接板中间后， 就连同焊接板一起， 被放入高温焊接炉内， 在 高温下， 玻璃管 1 熔化与 42#合金引线紧密连接在一起； 最后， 经冷却过程使 玻璃管非常牢固地与 42#合金引线相互连接在一起。
由于本发明包裹在中空玻璃管 1内的 42#合金引线的直径和与 42#合金引线 相连的铜包铁线的直径相等， 与同行业传统的玻封二极管相比， 42#合金的耗材 量减少了一半， 大大降低了原材料成本。 而且， 本发明玻封二极管经 1 千小时 严格的测试证明其各项性能参数完全达到国家标准， 且， 各项性能指标均优于 传统的二极管。 详细数据如下- 改进前 IN4148型二极管 DC特性测试数据
批别 测 试 批
测试条件 VR@5uA VR@100uA 1R@ 20 V 1R@ 22V VF@10 mA VF@ 100mA VF@ 400mA 应达到的范围 >75 >100 <25 <22 <1000 <1080 <1280 单位 V V nA nA mV mV mV
1 136. 880 145. 200 11. 600 12. 156 720. 000 901. 600 1 167. 600
# 2 140. 880 157. 520 11. 308 11. 988 727. 600 915. 600 t I gg， QQ
# 3 136. 240 146. 800 10. 768 11. 260 722. 400 909. ZOO 1177. 600
# 4 141. 840 152. 680 12. 412 13. 020 724. 00 911. 200 1 190. 400
# 5 133. 000 10. 908 11. 308 717. 600 903. 200 1189. 200
# 6 137. 680 148. 120 12. 644 13. 056 722. 00 914. 400 1208. 800 #7 131.360 139.120 11.476 11.944 716.000 891.600 1136.800
#8 139.280 153.040 15.740 16.636 725.200 915.600 1218.799
U 9 141.520 152.640 13.316 13.824 726.000 913.200 1183.200
# 10 137.840 149.800 10.160 10.628 724.400 910.800 1184.400 最小值 131.360 139.120 10.160 10.628 716.000 891.600 1136.800
10%ile 132.836 141.064 10.707 11.197 717.440 900.600 1164.520
50%ile 137.760 148.960 11.538 12.072 723.400 911.000 1186.800
90%ile 141.552 153.488 1 t3.558 14.105 726.160 915.600 1209.800 最大值 141.840 157.520 15.740 O 16.636 727.600 915.600 1218.799 平均值 137.652 148.620 12.033 12.582 722.600 908.640 1185.520 差值 3.487 5.698 1.609 1.717 3.730 7.688 22.649 改进后 IN4148型二极管 DC特性测试数据
批别 测 试 批
测试条件 VR@5uA V @100uA IR@ 20V IR@ 22V VF@10 mA VF@ 100mA VF@ 400mA 应达到的范围 >75 >100 <25 <22 <1000 <1080 <1280 单位 V V nA nA mV mV mV
# 1 146.640 161.920 11.388 11.848 732.000 914.800 1179.999
# 2 143.640 158.440 11.072 11.528 727.200 904.400 1172.400
# 3 148.680 166.560 14.368 736.400 921.600 1177.200
#4 140.600 i48.920 12.592 722.400 896.000 1132.800
#5 142.520 151.960 12.340 12.772 724.400 904.400 1158.400
# 6 144.600 156.080 13.924 14.512 726. 00 903.200 1155.599
# 7 135.240 142.800 14.656 13.288 719.200 900.000 1174.000
#8 137.920 146.600 14.208 14.788 719.600 908.800 1196.800
#9 139.920 155.120 11.944 12.540 725.600 910.800 1190.000
# 10 141.080 153.840 12.880 13. 56 722.400 898.000 1147.600 最小值 135.240 142.800 11.072 11.528 719.200 896.000 1132.800
10%ile 137.652 146.220 11.356 11.816 719.560 897.800 1146.120
50%ile 141.800 154.480 12.610 13.030 725.000 904.400 1173.200
90%ile 146.844 162.384 14.253 14.540 732.440 915.480 1190.680 最大值 148.680 166.560 14.656 14.788 736.400 921.6G0 1196.800 平均值 142.084 154.224 12.834 13.169 725.560 906.200 1168.480 差值 4.018 7.114 1.244 1.120 5.371 7.918 19.710 另外， 通过实验还发现， 由于 42#合金引线 2的直径变小， 包裹 42#合金引 线 2的中空玻璃管 1的内径也变小了， 使得硅片 3在玻璃管 1 内的空间位置减 小， 从而减小硅片 3错位的机率； 而且， 42#合金引线因切断而变形的圆角和切 割角也减小了， 从而减小引线 2截面变形宽度， 增加了硅片 3与 42#合金引线 2 的接触面积。 这样大大提高了硅片 3与 42#合金引线 2接触的稳定性， 减少了 接触不良现象； 提高了二极管在大电流时正向导电能力， 在可靠性方面有很明 显的改善。
为了证实本发明改进后玻封二极管的可靠性，发明人在非正常电流即超常 电流 2A下，对传统的二极管和改进后的本发明二极管进行了对比测试，结果发 现改进后的本发明二极管具有更出色的可靠性。 实验结果：
测试条件 IF=2A， 时间 10秒 （取样数： 30PCS)
Figure imgf000007_0001
以上所述仅为本发明的较佳实施例， 本发明的保护范围并不局限于此。 任 何基于本发明技术方案上的等效变换均属于本发明保护范围之内。

Claims

1、 一种新型玻封二极管， 它由中空玻璃管、 包裹在玻璃管内的 42#合金引 线、夹在 42#合金引线中间的硅片、 以及裸露在玻璃管两端与 42#合金引线相连 的铜包铁线构成； 其特征在于： 所述 42#合金引线的直径和与 42#合金引线相连 的铜包铁线的直径相等； 所述 42#合金引线与所述铜包铁线焊接连接。
PCT/CN2005/001881 2005-11-09 2005-11-09 A new glass packaging diode WO2007053976A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172754A (ja) * 1983-03-22 1984-09-29 Nec Corp ガラスケ−ス型ダイオ−ド
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
JPH11251643A (ja) * 1997-11-22 1999-09-17 Vishay Semiconductor Gmbh ハーメチツクシールされたハウジングを有する発光ダイオード及びその製造方法
JP2002043491A (ja) * 2000-07-25 2002-02-08 Hitachi Ltd 電子部品の製造方法
JP2002359105A (ja) * 2001-05-31 2002-12-13 Tdk Corp ガラスダイオード型ｎｔｃサーミスタ
CN2638241Y (zh) * 2003-07-21 2004-09-01 汕尾德昌电子有限公司 改进型玻封二极管
CN2640046Y (zh) * 2003-06-30 2004-09-08 上海新玻电子有限公司 一种改进的玻封二极管

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172754A (ja) * 1983-03-22 1984-09-29 Nec Corp ガラスケ−ス型ダイオ−ド
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
JPH11251643A (ja) * 1997-11-22 1999-09-17 Vishay Semiconductor Gmbh ハーメチツクシールされたハウジングを有する発光ダイオード及びその製造方法
JP2002043491A (ja) * 2000-07-25 2002-02-08 Hitachi Ltd 電子部品の製造方法
JP2002359105A (ja) * 2001-05-31 2002-12-13 Tdk Corp ガラスダイオード型ｎｔｃサーミスタ
CN2640046Y (zh) * 2003-06-30 2004-09-08 上海新玻电子有限公司 一种改进的玻封二极管
CN2638241Y (zh) * 2003-07-21 2004-09-01 汕尾德昌电子有限公司 改进型玻封二极管

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