WO2007052659A1

WO2007052659A1 - Exposure apparatus, exposure method and device manufacturing method

Info

Publication number: WO2007052659A1
Application number: PCT/JP2006/321751
Authority: WO
Inventors: Hiroyuki Nagasaka
Original assignee: Nikon Corporation
Priority date: 2005-11-01
Filing date: 2006-10-31
Publication date: 2007-05-10
Also published as: JPWO2007052659A1; EP1950795A1; TW200720856A; KR20080063304A; EP1950795A4

Abstract

An exposure apparatus (EX) is provided for exposing a substrate (P) by irradiating the substrate with exposure light (EL). The exposure apparatus is provided with an optical element (LS1) having a recessed surface (2) for applying the exposure light; a supply port (12) arranged on an object (4), which can face the recessed surface, for supplying a space between the recessed surface and the object with a liquid; and a suction port (22), which is arranged on the object and sucks a fluid between the recessed surface and the object.

Description

Specification

Exposure apparatus, exposure method, and device manufacturing method

Technical field

The present invention relates to an exposure apparatus that exposes a substrate, an exposure method, and a device manufacturing method.

This application claims priority based on Japanese Patent Application No. 2005-318139 filed on November 1, 2005, the contents of which are incorporated herein by reference.

Background art

In an exposure apparatus used in the photolithography process, an immersion type exposure apparatus that fills an optical path space of exposure light with a liquid and exposes a substrate through the liquid as disclosed in the following patent document Is known.

Patent Document 1: Pamphlet of International Publication No. 99Z49504

Disclosure of the invention

Problems to be solved by the invention

In an immersion type exposure apparatus, if a gas (including bubbles) is present in the liquid arranged in the optical path space of the exposure light, exposure failure may occur.

[0004] An object of the present invention is to provide an exposure apparatus, an exposure method, and a device manufacturing method using the exposure apparatus that can fill an optical path space of exposure light with a liquid.

Means for solving the problem

[0005] The present invention adopts the following configuration associated with each drawing shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

[0006] According to a first aspect of the present invention, in an exposure apparatus that irradiates a substrate with exposure light to expose the substrate, an optical element having a concave surface from which the exposure light is emitted, and the concave surface A supply port that is provided in a facing object and supplies liquid to a space between the concave surface and the object, and a suction port that is provided in the object and sucks fluid between the concave surface and the object And an exposure apparatus including the above. [0007] According to a second aspect of the present invention, an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate includes an optical element having a concave surface from which the exposure light is emitted, and a convex surface. An exposure apparatus is provided that includes an object, and a supply port that supplies liquid to a space between the concave surface and the convex surface in a state where the concave surface and the convex surface face each other.

[0008] According to the third aspect of the present invention, in the exposure method of exposing the substrate by irradiating the substrate with exposure light through the optical element, the object is provided on an object that can face the concave surface of the optical element. Further, there is provided an exposure method for supplying a liquid to a space between the concave surface and the object and sucking a fluid between the concave surface and the object.

[0009] According to the fourth aspect of the present invention, in the exposure method of exposing the substrate by irradiating the substrate with exposure light through the optical element, the object is arranged facing the concave surface of the optical element. An exposure method is provided in which the liquid is supplied to a space between the concave surface and the object, and the liquid flows along the concave surface.

[0010] According to the fifth aspect of the present invention, in the exposure method of exposing the substrate by irradiating the substrate with exposure light through the optical element, the object is disposed facing the concave surface of the optical element.

An exposure method for supplying liquid to a space between the concave surface and the object is provided so that the liquid is supplied to the concave surface side force with respect to the object.

[0011] According to the sixth aspect of the present invention, in the exposure method of exposing the substrate by irradiating the substrate with exposure light through the optical element, the object is disposed facing the concave surface of the optical element. And supplying a liquid to the space between the concave surface and the object, the liquid supply path used when filling the space with the liquid is different from the liquid supply path used during the substrate exposure. An exposure method is provided.

[0012] According to a seventh aspect of the present invention, in an exposure method for exposing the substrate by irradiating the substrate with exposure light through the optical element, the light emitting surface between the optical element and an object are exposed. An exposure method is provided in which a liquid is supplied to a space, and the interval between the optical element and the object is changed after the liquid supply is started until the space is filled with the liquid.

[0013] According to an eighth aspect of the present invention, there is provided a device manufacturing method using the above exposure method. The invention's effect

[0014] According to the present invention, a predetermined portion of the optical path of the exposure light can be filled with the liquid, and the substrate can be satisfactorily exposed.

Brief Description of Drawings

FIG. 1 is a schematic block diagram that shows an exposure apparatus according to a first embodiment.

FIG. 2A is a diagram showing an immersion system according to the first embodiment.

FIG. 2B is a diagram showing an immersion system according to the first embodiment.

FIG. 3 is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 4A is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 4B is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 5A is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 5B is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 6 is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 7 is a view for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 8A is a diagram for explaining the principle of the detection device according to the first embodiment.

FIG. 8B is a diagram for explaining the principle of the detection device according to the first embodiment.

FIG. 9 is a view showing a main part of an exposure apparatus according to a second embodiment.

FIG. 10 is a view showing a main part of an exposure apparatus according to a third embodiment.

FIG. 11A is a view showing a main part of an exposure apparatus according to a fourth embodiment.

FIG. 11B is a view showing a main part of the exposure apparatus according to the fourth embodiment.

FIG. 12A is a view for explaining the operation of the exposure apparatus according to the fourth embodiment.

FIG. 12B is a view for explaining the operation of the exposure apparatus according to the fourth embodiment.

FIG. 13A is a view for explaining the operation of the exposure apparatus according to the fourth embodiment.

FIG. 13B is a view for explaining the operation of the exposure apparatus according to the fourth embodiment.

FIG. 14 is a view showing a main part of an exposure apparatus according to a fifth embodiment.

FIG. 15 is a view showing a main part of an exposure apparatus according to a sixth embodiment.

FIG. 16 is a view showing a main part of an exposure apparatus according to a seventh embodiment.

FIG. 17 is a view for explaining the operation of the exposure apparatus according to the seventh embodiment. FIG. 18 is a view showing a main part of an exposure apparatus according to an eighth embodiment.

FIG. 19 is a view showing a main part of an exposure apparatus according to a ninth embodiment.

FIG. 20 shows the essential parts of the exposure apparatus related to the tenth embodiment.

FIG. 21A is a view for explaining an operation of the exposure apparatus according to the tenth embodiment.

FIG. 21B is a view for explaining an operation of the exposure apparatus according to the tenth embodiment.

FIG. 22A is a view for explaining an operation of the exposure apparatus according to the tenth embodiment.

FIG. 22B is a view for explaining the operation of the exposure apparatus according to the tenth embodiment.

FIG. 23 shows the essential parts of the exposure apparatus related to the eleventh embodiment.

FIG. 24 is a view for explaining the operation of the exposure apparatus according to the eleventh embodiment.

FIG. 25 is a flowchart for explaining an example of a manufacturing process of a micro device.

[0016] 1 ... immersion system, 2 ... concave surface, 4 ... substrate stage, 4F ... top surface, 4T ... substrate table, 5 ... measurement stage, 7 ... control device, 12 ... supply port, 22 ... suction port, 23 ... first 2 supply port, 30 ... detection device, 40 ··· concave portion, 54 ··· drive device, 64 ··· drive device, 70 ··· predetermined member, 71 ··· convex surface, 82 ··· supply port, 84 ··· recovery port AX ... optical axis, EL ... exposure light, EX ... exposure device, K ... optical path, LG ... interface, LQ ... liquid, LR ... immersion area, LSI ... final optical element, P ... substrate, PK ... lens barrel, PKA ... bottom surface, PL ... projection optical system, SP ... predetermined space

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. And the predetermined direction in the horizontal plane is the X axis direction, in the horizontal plane! The direction perpendicular to the X-axis direction is the Y-axis direction, and the direction perpendicular to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. The rotation (tilt) directions around the X, Y, and Z axes are the ΘX, θY, and 0Z directions, respectively.

[0018] <First embodiment>

A first embodiment will be described. FIG. 1 is a schematic diagram showing an exposure apparatus EX according to the first embodiment. FIG. In FIG. 1, the exposure apparatus EX exposes a mask stage 3 that can move while holding the mask M, a substrate stage 4 that can move while holding the substrate P, and the mask M held by the mask stage 3. Illumination system IL that illuminates with light EL, projection optical system PL that projects the pattern image of mask M illuminated with exposure light EL onto substrate P, and controller 7 that controls the overall operation of exposure apparatus EX And

Note that the substrate here includes a substrate such as a semiconductor wafer coated with a film such as a photosensitive material (photoresist) or a protective film. The mask includes a reticle on which a device pattern to be reduced and projected on a substrate is formed. In the present embodiment, a force reflection type mask using a transmission type mask as a mask may be used.

[0020] An exposure apparatus EX of the present embodiment is an immersion type exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially increase the depth of focus. The substrate P is exposed by irradiating the substrate P with the exposure light EL through the projection optical system PL and the liquid LQ. In the present embodiment, the liquid LQ is filled between the substrate P and the final optical element LSI closest to the image plane of the projection optical system PL among the plurality of optical element LSIs to LS7 of the projection optical system PL. In the present embodiment, the final optical element LSI has a concave surface 2 from which the exposure light EL is emitted.

The exposure apparatus EX includes an immersion system 1 for filling a predetermined space between the concave surface 2 from which the exposure light EL of the final optical element LSI is emitted and the object facing the concave surface 2 with the liquid LQ. Yes. The immersion system 1 is provided on the substrate stage 4 that can be opposed to the concave surface 2 of the final optical element LSI, the supply port 12 that supplies liquid LQ between the concave surface 2 and the substrate stage 4, and the substrate stage 4 And a suction port 22 for sucking a fluid between the concave surface 2 and the substrate stage 4. As will be described later, when exposing the substrate P, the controller 7 uses the liquid immersion system 1 to fill the space between the concave surface 2 and the substrate stage 4 with the liquid LQ, and then the projection optical system PL and the substrate P. The substrate stage 4 is moved in a predetermined direction in the XY plane with respect to the projection optical system PL and the liquid LQ so as to face each other, and held by the concave surface 2 of the final optical element LSI and the substrate stage 4 by the liquid LQ. It fills the specified space including the optical path K of the exposure light EL between the surface of the substrate P. The exposure surface of the substrate P is an exposure surface coated with a photosensitive material. The concave surface 2 and the surface of the substrate P are in contact with the liquid LQ that fills the optical path K. The exposure apparatus EX exposes light between the concave surface 2 of the final optical element LSI and the surface of the substrate P while projecting the pattern image of the mask M onto the substrate P using at least the projection optical system PL. The specified space including the EL optical path K is filled with liquid LQ. The exposure apparatus EX irradiates the exposure light EL passed through the mask M onto the substrate P held on the substrate stage 4 through the projection optical system PL and the liquid LQ that satisfies the optical path K of the exposure light EL. Then, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed. Further, in the exposure apparatus EX of the present embodiment, the liquid LQ filled in the optical path K of the exposure light EL between the final optical element LSI and the substrate P is on the substrate P including the projection area AR of the projection optical system PL. Adopt a local liquid immersion method that locally forms a liquid immersion area LR that is larger than the projection area AR and smaller than the substrate P.

In the present embodiment, the optical axis AX and the Z-axis direction of the projection optical system PL are parallel to each other. Further, the plurality of optical elements LS1 to LS7 of the projection optical system PL are held by a lens barrel PK. The lens barrel PK is a lower surface provided so as to face the surface of the substrate P disposed at a position where the exposure light EL can be irradiated, that is, a position facing the concave surface 2, and surround the optical path K of the exposure light EL. Have PKA. The lower surface PKA is formed so as to surround the concave surface 2. The exposure light EL between the concave surface 2 and the surface of the substrate P is filled with the liquid LQ to form the immersion area LR. When the immersion area LR is formed, the interface LG of the liquid LQ that forms the immersion area LR is the liquid LQ. Is maintained between the surface of the substrate P and the lower surface PKA of the lens barrel PK. The exposure apparatus EX exposes the exposure light EL on the substrate P via the projection optical system PL including the final optical element LSI and the liquid LQ filling the concave surface 2 of the final optical element LSI and the surface of the substrate P. Irradiate.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. Illumination system IL force As exposure light EL emitted, for example, bright ultraviolet rays (g-line, h-line, i-line) emitted from mercury lamps and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193nm) and F laser light (wavelength 15)

2

Vacuum ultraviolet light (VUV light) such as 7 nm) is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

[0025] The mask stage 3 can be moved in the X-axis, Y-axis, and θ-Z directions while holding the mask M by driving a mask stage driving device including an actuator such as a linear motor. It is. The position information of the mask stage 3 (and hence the mask M) is measured by the laser interferometer 3L. The laser interferometer 3L measures the position information of the mask stage 3 using a moving mirror 3K provided on the mask stage 3. The control device 7 drives the mask stage drive device 3D based on the measurement result of the laser interferometer 3L, and controls the position of the mask M held by the mask stage 3.

The movable mirror 3K may include not only a plane mirror but also a corner cube (retro reflector). Instead of fixing the movable mirror 3K to the mask stage 3, for example, an end face (side surface) of the mask stage 3 is used. ) May be used as a reflecting surface formed by mirror finishing. Further, the mask stage 3 may be configured to be capable of coarse and fine movement disclosed in, for example, JP-A-8-130179 (corresponding US Pat. No. 6,721,034).

The substrate stage 4 includes a stage body 4B, a substrate table 4T mounted on the stage body 4B, and a substrate holder 4H provided on the substrate table 4T and holding the substrate P. The substrate holder 4H is disposed in a recess 4R provided on the substrate table 4T, and the upper surface 4F around the recess 4R of the substrate table 4T is substantially the same as the surface of the substrate P held by the substrate holder 4H. It is a flat surface that is height (level). There may be a step between the surface of the substrate P held by the substrate holder 4H and the upper surface 4F of the substrate table 4T. In addition, the upper surface 4F of the substrate stage 4 may be substantially the same height as the surface of the substrate P only in a part thereof, for example, a predetermined region surrounding the substrate P. Further, the substrate holder 4H may be formed integrally with a part of the substrate stage 4. However, in this embodiment, the substrate holder 4H and the substrate stage 4 are separately configured, for example, by vacuum suction or the like. 4H is fixed to the recess 4R.

[0028] The stage body 4B is supported in a non-contact manner on the upper surface (guide surface) of the base member BP by the air bearing 4A. The upper surface of the base member BP is substantially parallel to the XY plane, and the substrate stage 4 is movable in the XY direction within a predetermined region on the base member B P including the position facing the concave surface 2 of the final optical element LSI.

[0029] The substrate stage 4 is movable on the base member BP while the substrate P is held on the substrate holder 4H by driving a substrate stage driving device including an actuator such as a linear motor. The substrate stage drive unit uses the stage body 4B as the X axis on the base member BP. The first drive that can move the substrate table 4 Ζ mounted on the stage body 4 に in the X-axis direction, Ζ-axis direction, and θ-Ζ direction by moving in the direction, Y-axis direction, and θ Ζ direction And a second drive system capable of moving the substrate table 4Τ in the axial direction, θ X direction, and θΥ direction relative to the stage body 4Β.

[0030] The first drive system includes an actuator such as a linear motor, and can drive the stage body 4B supported in a non-contact manner on the base member BP in the X-axis direction, the Y-axis direction, and the θZ direction. The second drive system is interposed between the stage main body 4B and the substrate table 4T, for example, an actuator 4V such as a voice coil motor, and a measuring device (not shown) that measures the drive amount of each actuator. Including. The substrate table 4T is supported on the stage body 4B by at least three actuators 4V. Each of the actuators 4V can drive the substrate table 4T independently in the Z-axis direction with respect to the stage body 4B, and the control device 7 adjusts the driving amount of each of the three actuators 4V to adjust the stage body. The substrate table 4T is driven in the Z axis direction, θ X direction, and θ Y direction with respect to 4B. As described above, the substrate stage driving apparatus including the first and second drive systems is capable of moving the substrate table 4T of the substrate stage 4 on the X axis, the Y axis, the Z axis, 0 X, θ Y, and 0 Z directions. It can move in the direction of degrees. The control device 7 controls the substrate stage driving device to control the X axis, Y axis, Z axis, 0 X, θ Y, and θ Z of the surface of the substrate P held by the substrate holder 4H of the substrate table 4T. It is possible to control the position in the direction of 6 degrees of freedom.

[0031] The position information of the substrate table 4T (and hence the substrate P) of the substrate stage 4 is measured by the laser interferometer 4L. The laser interferometer 4L uses the moving mirror 4K provided on the substrate table 4T to measure position information regarding the X-axis, Y-axis, and θZ directions of the substrate table 4T. In addition, the surface position information (position information about the Z axis, Θ X, and Θ Y directions) of the surface of the substrate P held by the substrate holder 4H of the substrate table 4T is obtained by a focus leveling detection system (not shown). Detected. Based on the measurement result of the laser interferometer 4L and the detection result of the focus / leveling detection system, the control device 7 drives the substrate stage driving device and controls the position of the substrate P held by the substrate holder 4H. Do.

Note that the laser interferometer 4L has a position in the Z-axis direction of the substrate stage 4 and 0 X and 0 Y directions. The details of making it possible to measure rotation information are disclosed in, for example, JP 2001-510577 Gazette (corresponding to International Publication No. 1999Z28790). Further, instead of fixing the movable mirror 4K to the substrate stage 4, for example, a reflecting surface formed by mirror-treating a part (side surface, etc.) of the substrate stage 4 may be used.

[0033] In addition, the focus' leveling detection system measures the position information of the substrate P in the Z-axis direction at each of the plurality of measurement points, so that the tilt information (rotation of the substrate P in the Θ X and Θ Y directions) The plurality of measurement points may be set at least partially within the immersion area LR (or projection area AR), or all of the measurement points may be in the immersion area LR. It may be set outside. Furthermore, for example, when the laser interferometer 4L can measure the position information of the substrate P in the Z axis, θ X and θ Y directions, the position information in the Z axis direction can be measured during the exposure operation of the substrate P. The position control of the substrate P in the Z axis, θ X and 0 Y directions is performed using the measurement result of the laser interferometer 4L during the exposure operation, at least during the exposure operation. Even so,

Note that the projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1Z4, 1/5, 1/8, etc., and a mask pattern is formed in the projection area AR conjugate with the illumination area described above. Form a reduced image. The projection optical system PL may be any of a reduction system, a unity magnification system, and an enlargement system. Further, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

Next, the liquid LQ and the final optical element LSI will be described. In the following description, for the sake of simplicity, the refractive index of the liquid LQ with respect to the exposure light EL is appropriately referred to as the refractive index of the liquid LQ, and the refractive index of the exposure light EL of the final optical element LSI is referred to as the refractive index of the final optical element LSI. The rate is referred to as appropriate.

In this embodiment, the refractive index of the liquid LQ with respect to the exposure light EL (ArF excimer laser light: wavelength 193 ηm) is higher than the refractive index of the final optical element LSI with respect to the exposure light EL. K is filled with a liquid LQ having a refractive index higher than that of the final optical element LSI. For example, when the final optical element LSI is made of quartz, the refractive index of quartz is about 1.5, so the liquid LQ has a refractive index higher than that of quartz, for example 1.6. About ~ 2.0 is used.

[0037] The optical path on the + Z side (object plane side, mask side) of the final optical element LS 1 is filled with a gas (for example, nitrogen), and the optical path on the Z side (image plane side, substrate side) of the final optical element LS I Is filled with liquid LQ. The shape on the + Z side (object surface side) of the final optical element LS I (hereinafter referred to as the first surface) is a convex shape that bulges toward the object surface side (mask side) of the projection optical system PL. This is a curved shape so that all the rays to be imaged on the surface (image plane) of the substrate P are incident.

The shape of the surface (hereinafter referred to as the second surface) on the Z side (image surface side) of the final optical element LS I is a concave surface 2 that is recessed away from the substrate P. That is, the second surface (concave surface 2) of the final optical element LSI is also a convex curved surface directed toward the object surface side (mask side). The shape of the second surface (concave surface 2) is such that all light rays to be imaged on the surface of the substrate P are incident, similar to the shape of the first surface.

[0039] The curved surface shapes of the first surface and the second surface of the final optical element LSI can be determined as appropriate so that the projection optical system PL can obtain the desired performance. Each of the surfaces may be spherical with the same center of curvature! /, May be spherical with different centers of curvature, or may be aspheric.

[0040] The numerical aperture NA on the image plane side of the projection optical system PL is expressed by the following equation.

NA = n-sin 0… (1)

Where n is the refractive index of the liquid LQ and Θ is the convergence half angle. The resolution Ra and the depth of focus δ are expressed by the following equations, respectively.

Ra = k · λ / ΝΑ… (2)

δ = ± k-λ / NA ² … (3)

2

Here, λ is an exposure wavelength, and k and k are process coefficients. Thus, a high refractive index (n)

1 2

By increasing the numerical aperture NA by about n times with the liquid LQ, the resolution and depth of focus can be greatly improved from Equations (2) and (3).

[0041] When trying to obtain the numerical aperture NA of the projection optical system PL equal to or higher than the refractive index of the final optical element LS I, the second surface facing the substrate P of the final optical element LS I is almost perpendicular to the optical axis AX. If it is a flat surface, a part of the exposure light EL will be absorbed by the interface between the final optical element LSI and the liquid LQ (that is, the second surface). ), And cannot reach the image plane of the projection optical system PL. For example, the refractive index of the final optical element LSI is n, the refractive index of the liquid LQ is n, the final optical element LSI and the liquid LQ are

1 2

The angle with respect to the optical axis AX of the outermost light beam of the exposure light EL incident on the interface (second surface) of the outer surface is 0, and the angle with respect to the optical axis AX of the outermost light beam that emerges (incident on the liquid LQ) If Θ, the following formula is established according to Snell's law.

2

n sin θ = n sin θ… (4)

1 1 2 2

In addition, the numerical aperture 投影 of the projection optical system PL is the refractive index η of the liquid LQ and is incident on the liquid LQ.

2

Using the angle 0 with respect to the optical axis AX of the outermost ray, it is expressed as

2

NA = n sin 0… (5)

twenty two

From the equations (4) and (5), the following equation is established.

sin 0 = NA / n… (6)

Therefore, as is clear from equation (6), the interface (second surface) between the final optical element LSI and the liquid LQ is a flat surface substantially perpendicular to the optical axis AX, and the numerical aperture NA of the projection optical system PL If is larger than the refractive index n of the final optical element LSI, a part of the exposure light EL cannot enter the liquid LQ. On the other hand, since the second surface of the final optical element LSI of the present embodiment has the concave surface 2, the numerical aperture NA force of the projection optical system PL is larger than the refractive index n of the final optical element LSI. Even in such a case, since the incident angle of the light beam incident on the interface between the final optical element LSI and the liquid LQ is small, the outermost light beam of the exposure light EL can reach the image plane well.

[0042] Thus, the numerical aperture NA of the projection optical system PL in which the refractive index of the liquid LQ with respect to the exposure light EL is higher than the refractive index with respect to the exposure light EL of the final optical element LSI is the exposure light of the final optical element LSI. If the refractive index is higher than the refractive index of EL, the exposure light EL can reach the substrate P well by providing the final optical element LSI with the concave surface 2.

[0043] The liquid LQ is, for example, a predetermined liquid having a C—H bond and a Z or O—H bond, such as isopropanol having a refractive index of about 1.50 and glycerol (glycerin) having a refractive index of about 1.61. Specific liquids (organic solvents) such as hexane, heptane, and decane, and predetermined liquids such as decalin and nanocyclohexyl are listed. Alternatively, any two or more of these predetermined liquids may be mixed, or the predetermined liquid may be added (mixed) to pure water. It may be what was done. Alternatively, the liquid LQ may be one obtained by adding (mixing) a base or acid such as H +, Cs +, K +, CI ", ^SO2_ , ^PO2_, etc. to pure water.

4 4

It is possible to add (mix) fine particles of water such as A1 acid to water. These liquid LQs can transmit ArF excimer laser light. In addition, the liquid LQ should be stable to the photosensitive material V, which is applied to the surface of the projection optical systems PL and Z or the substrate P, which has a small light absorption coefficient and a small temperature dependency. Favored ,.

[0044] The final optical element LSI can be formed of, for example, quartz (silica). Alternatively, it may be formed of a single crystal material of a fluoride compound such as calcium fluoride (fluorite), barium fluoride, strontium fluoride, lithium fluoride, sodium fluoride, and BaLiF. More

Three

The final optical element LSI may be formed of lutetium aluminum garnet (LuAG). And a single crystal material of a fluorinated compound such as sodium fluoride. Further, the optical elements LS2 to LS7 can be formed of the above-described materials. Further, for example, the optical elements LS2 to LS7 may be formed of fluorite, the optical element LSI may be formed of quartz, the optical elements LS2 to LS7 may be formed of quartz, and the optical element LSI may be formed of fluorite. Alternatively, all of the optical elements LS 1 to LS5 may be made of quartz (or fluorite)!

[0045] Further, as an optical element of the projection optical system PL including the final optical element LSI, quartz and

The final optical element LSI may be formed of a material having a refractive index higher than that of Z or fluorite (eg, 1.6 or more). For example, the optical element of the projection optical system can be formed using sapphire, germanium dioxide, or the like as disclosed in International Publication No. 2005Z059617. Alternatively, the optical element of the projection optical system can be formed using potassium chloride (refractive index: about 1.75) or the like as disclosed in WO 2005/059618.

2A and 2B show the immersion system 1, FIG. 2A is a side sectional view, and FIG. 2B is a plan view showing an upward force. 2A and 2B, the immersion system 1 is provided on the upper surface 4F of the substrate table 4T (substrate stage 4) that can face the concave surface 2 of the final optical element LSI, and the liquid LQ is provided between the concave surface 2 and the substrate table 4T. A suction port 22 for suctioning fluid (including liquid LQ and gas GS) between the concave surface 2 and the substrate table 4T, and a substrate port 4T. Supply port through supply channel 14 formed inside A liquid supply device 11 that supplies liquid LQ to 12 and a suction device 21 that can suck fluid through a suction port 22 and a suction channel 24 formed inside the substrate table 4T are provided. The liquid supply device 11 includes a temperature adjustment device that adjusts the temperature of the liquid LQ to be supplied, and a filter unit that removes foreign matter in the liquid LQ, and can supply clean and temperature-adjusted liquid LQ. . The suction device 21 includes a vacuum system and the like, and can suck fluid. In this embodiment, glycerol (glycerin) is used as the liquid LQ.

The suction port 22 is provided in the vicinity of the supply port 12. In the present embodiment, as shown in FIG. 2B, the suction port 22 is provided in an annular shape so as to surround the supply port 12 in the vicinity of the supply port 12. In the present embodiment, the suction port 22 is formed in an annular shape (annular shape) so as to surround the supply port 12, but may be formed in a rectangular shape (rectangular shape). Also, a plurality of suction ports 22 having a predetermined diameter should be formed side by side so as to surround the supply port 12.

[0048] The liquid immersion system 1 further includes a detection device 30 that detects whether or not the predetermined space between the concave surface 2 and the substrate table 4T is filled with the liquid LQ. The detection device 30 of the present embodiment detects the presence or absence of gas (including bubbles) in a predetermined space between the concave surface 2 and the substrate table 4T by detecting the state of the fluid flowing through the suction flow path 24. The detection result of the detection device 30 is output to the control device 7. Based on the detection result of the detection device 30, the control device 7 determines the presence or absence of gas in the liquid LQ that fills between the concave surface 2 and the substrate table 4T. Further, the control device 7 controls at least one of the supply operation of the supply port 12 and the suction operation of the suction port 22 based on the detection result of the detection device 30.

FIG. 3 is a diagram showing an example of a state in which the supply port 12 and the suction port 22 on the substrate table 4T are opposed to the concave surface 2 of the final optical element LSI. The suction port 22 is disposed in the vicinity of the supply port 12, and the control device 7 controls the substrate stage driving device to drive the substrate stage 4, thereby supplying the supply port 12 and the suction port on the substrate table 4T. 22 and the concave surface 2 of the final optical element LS 1 can be made to face each other. In the present embodiment, when the liquid LQ is supplied from the supply port 12, the control device 7 arranges the supply port 12 on the optical axis AX of the final optical element LSI. The control device 7 controls the substrate stage driving device while measuring the position information of the substrate table 4T using the laser interferometer 4L, and thereby the optical axis A of the final optical element LSI. A supply port 12 can be arranged on X. As described above, the projection optical system PL including the final optical element LSI has the optical axis AX parallel to the vertical direction. The optical axis AX passes through a position AT (hereinafter referred to as apex position) AT farthest from the upper surface 4F of the substrate table 4T among the concave surfaces 2 of the final optical element LSI. Accordingly, the supply port 12 disposed on the optical axis AX of the final optical element LSI is disposed at a position facing the vertex position AT of the concave surface 2. Supply port 12 starts supplying liquid LQ while being placed on the optical axis AX of the final optical element LSI

Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described with reference to the schematic diagrams of FIGS. 4A to 7.

First, the control device 7 uses the liquid immersion system 1 to fill the predetermined space SP on the light exit side of the concave surface 2 of the final optical element LSI including the optical path K of the exposure light EL with the liquid LQ. In the initial state of the exposure apparatus EX before performing a predetermined operation relating to exposure, the liquid LQ does not exist in the predetermined space SP including the optical path K. The control device 7 allows the liquid from the supply port 12 to the optical path K where no liquid LQ exists, with the concave surface 2 of the final optical element LSI facing the supply port 12 and the suction port 22 on the substrate table 4T. LQ is supplied, and the specified space SP including the optical path K is filled with liquid LQ. In the following description, the operation of supplying the liquid LQ to the predetermined space SP in order to fill the predetermined space SP including the optical path K of the exposure light EL in the initial state where the liquid LQ does not exist with the liquid LQ. Where appropriate, referred to as initial filling operation

When performing the initial filling operation, the control device 7 drives the substrate stage 4 and, as shown in FIG. 3, the concave surface 2 of the final optical element LSI, the supply port 12 on the substrate table 4T, and the suction The supply port 12 is arranged on the optical axis AX of the final optical element LSI with the port 22 facing. Then, the control device 7 drives the liquid supply device 11 of the liquid immersion system 1 and starts supplying the liquid LQ to the predetermined space SP between the concave surface 2 and the substrate table 4T. The liquid LQ delivered from the liquid supply device 11 flows through the supply flow path 14 and is then supplied from the supply port 12 to the predetermined space SP. The supply port 12 supplies the liquid LQ to the predetermined space SP in order to fill the predetermined space SP between the concave surface 2 and the substrate table 4T with the liquid LQ.

FIG. 4A shows a state immediately after the supply of the liquid LQ from the supply port 12 is started. Shown in Figure 4A Thus, the liquid immersion system 1 ejects the liquid LQ from the supply port 12 so as to hit the apex position AT of the concave surface 2. In this embodiment, the distance HI (see FIG. 3) between the supply port 12 and the vertex position AT of the concave surface 2 is set to about 50 to 60 mm, and the diameter of the concave surface 2 is set to about 100 to 120 mm. The immersion system 1 ejects liquid (glycerin) LQ from the supply port 12 at a flow velocity of lmZs ec. Or more. Thereby, the immersion system 1 can eject the liquid LQ from the supply port 12 so as to hit the concave surface 2.

Further, the control device 7 starts driving the suction device 21 at a predetermined timing with respect to the time when the supply of the liquid LQ from the supply port 12 is started, and starts sucking the fluid from the suction port 22. The In the present embodiment, the control device 7 starts sucking the fluid from the suction port 22 almost simultaneously with the start of the supply of the liquid LQ from the supply port 12. Immediately after the supply operation of the liquid LQ from the supply port 12 is started, the suction port 22 mainly sucks the gas GS. In parallel with the operation of supplying the liquid LQ from the supply port 12, the suction port 22 sucks (exhausts) the fluid (gas GS) in the predetermined space SP between the concave surface 2 and the substrate table 4T. The fluid sucked from the suction port 22 by driving the suction device 21 flows through the suction flow path 24 and is then sucked into the suction device 21.

Note that the timing of starting the suction operation from the suction port 22 may be before or after the supply operation of the liquid LQ using the supply port 12 is started.

The liquid LQ supplied (spouted) from the supply port 12 to the predetermined space SP flows along the concave surface 2 after hitting the concave surface 2. The control device 7 continues the supply operation of the supply port 12 and the suction operation of the suction port 22. Since the flow of the liquid LQ ejected between the concave surface 2 and the substrate table 4T from the supply port 12 is a high flow velocity of several mZsec., The pressure in the space near the supply port 12 decreases. Therefore, the pressure in the space near the suction port 22 provided near the supply port 12 also decreases. The gas GS in the liquid LQ gathers in the vicinity of the suction port 22 because it gathers in a space where the pressure is low. In other words, the flow of the liquid LQ supplied from the supply port 12 to the predetermined space SP reduces the pressure in the vicinity of the suction port 22 provided in the vicinity of the supply port 12, thereby bringing the liquid LQ near the suction port 22. Gas GS ^^ in liquid LQ can be removed. That is, in the present embodiment, the suction port 22 is provided in the vicinity of the position where the gas GS gathers due to the flow of the liquid LQ supplied from the supply port 12 between the concave surface 2 and the substrate table 4T. The By continuing the supply of the liquid LQ from the supply port 12, the predetermined space SP between the concave surface 2 and the substrate table 4T is gradually filled with the liquid LQ.

[0057] FIG. 4B shows a state immediately before the predetermined space SP is filled with the liquid LQ. As shown in FIG. 4B, a predetermined space SP between the concave surface 2 and the substrate table 4T has a predetermined liquid LQ according to the flow of the liquid LQ supplied from the supply port 12, the shape of the concave surface 2, and the like. A flow is generated. Further, by providing the suction port 22 near the position where the gas GS gathers, as shown in FIG. 4B, the gas (including bubbles) GS in the liquid LQ that fills the predetermined space SP is passed through the suction port 22. It is possible to discharge smoothly from the predetermined space SP.

[0058] When the liquid supply operation of the supply port 12 is performed in order to fill the predetermined space SP with the liquid LQ, the control device 7 moves between the lower surface PKA of the lens barrel PK and the upper surface 4F of the substrate table 4T. Is set to the predetermined gap D1. Here, in the present embodiment, the lower surface PKA of the lens barrel PK is the surface closest to the upper surface 4F of the substrate table 4T among the members facing the upper surface 4F of the substrate table 4T. Liquid LQ physical properties (surface tension, density, etc.), amount of liquid LQ that fills the specified space SP (distance HI between supply port 12 and concave surface 2 apex position AT, size of immersion area LR), top surface 4F Maintaining the edge LG of the immersion area LR between the upper surface 4 F and the lower surface PKA by optimally setting the gap D1 according to the contact angle to the liquid LQ, the contact angle of the lower surface PKA to the liquid LQ, etc. And the outflow of liquid LQ can be suppressed.

[0059] Until the gas GS in the predetermined space SP runs out (or until the amount of the gas GS becomes equal to or less than a predetermined allowable value), the control device 7 performs the supply operation of the supply port 12 and the suction port 22 Continue the suction operation of the fluid (including liquid LQ and gas GS). The liquid immersion system 1 discharges (exhausts) the gas GS in the predetermined space SP while performing the supply operation of the liquid LQ, so that the gas GS in the predetermined space SP can be discharged well through the suction port 22. As shown in FIG. 5A, the predetermined space SP between the concave surface 2 and the substrate table 4T can be satisfactorily filled with the liquid LQ supplied from the supply port 12 without leaving the gas GS in the predetermined space SP. it can.

[0060] As shown in FIGS. 2A and 2B, the immersion system 1 includes a detection device 30 that detects the presence or absence of gas GS in the predetermined space SP between the concave surface 2 and the substrate table 4T. 7 controls the supply operation of the supply port 12 and the suction operation of the suction port 22 based on the detection result of the detection device 30. In other words, the control device 7 performs a predetermined operation based on the detection result of the detection device 30. The supply operation of the supply port 12 and the suction operation of the suction port 22 are continued until it is determined that the gas GS in the constant space SP has run out (until it is determined that the predetermined space SP is filled with the liquid LQ).

FIGS. 8A and 8B are diagrams showing an example of the detection device 30. FIG. The detection device 30 of the present embodiment optically detects the state of the fluid flowing through the suction channel 24 connecting the suction port 22 and the suction device 21 using the detection light La. The detection device 30 includes a projection system 31 capable of emitting the detection light La and a light receiving system 32 provided at a predetermined position with respect to the detection light La emitted from the projection system 31 and capable of receiving the detection light La. ing. In addition, at least a part of the suction channel 24 of the present embodiment is formed of a tube member 24K made of a material having a predetermined refractive index with respect to the detection light La and capable of transmitting the detection light La. The fluid (including liquid LQ and gas GS) sucked from the suction port 22 flows inside the pipe member 24K. The projection system 31 irradiates the detection light La from the outside of the tube member 24K to the inside of the tube member 24K at a predetermined incident angle.

[0062] Since the light receiving state of the detection light La by the light receiving system 32 is different between the case where the liquid LQ is present inside the tube member 24K and the case where the gas GS is present, the detection device 30 receives the light received by the light receiving system 32. Based on the result, it is possible to determine whether the liquid gas LGS exists inside the tube member 24K or the force gas GS exists. For example, as shown in FIG. 8A, when the gas GS is present inside the pipe member 24K, the detection light La emitted from the projection system 31 is generated at the interface between the pipe member 24K and the gas GS inside the gas GS. Reflected and reaches the light receiving system 32 with the first light quantity. On the other hand, as shown in FIG. 8B, when the liquid LQ exists inside the tube member 24K, the detection light La emitted from the projection system 31 passes through the interface between the tube member 24K and the liquid LQ inside the tube member 24K. For example, it passes and does not reach the light receiving system 32, or reaches the second light quantity different from the first light quantity. Thus, the light receiving state of the detection light La by the light receiving system 32 is different between the case where the liquid LQ is present inside the tube member 24K and the case where the gas GS is present.

[0063] In a state where the supply operation of the supply port 12 and the suction operation of the suction port 22 are continuously performed with respect to the predetermined space SP, when the gas GS exists in the predetermined space SP, the tube member 24K Gas GS flows. On the other hand, when the predetermined space SP is entirely filled with the liquid LQ, only the liquid LQ flows through the pipe member 24K. Therefore, the control device 7 can determine the presence or absence of the gas GS in the predetermined space SP between the concave surface 2 and the substrate table 4T based on the detection result of the detection device 30. [0064] Even after the gas GS in the predetermined space SP is exhausted, the control device 7 is configured to supply only the liquid LQ from the suction port 22 until only the liquid LQ flows into the tube member 24K of the suction flow path 24. 12 supply operation and suction port 22 suction operation are continued for a predetermined time.

[0065] When it is determined that there is no gas GS in the predetermined space SP between the concave surface 2 and the substrate table 4T based on the detection result of the detection device 30, the control device 7, as shown in FIG. Stop the supply operation of 12 and the suction operation of the suction port 22. This completes the initial filling operation. On the other hand, when the control device 7 determines that there is gas GS in the predetermined space SP filling the space between the concave surface 2 and the substrate table 4T based on the detection result of the detection device 30, the control device 7 until the gas GS in the predetermined space SP is exhausted. The supply operation at the supply port 12 and the suction operation at the suction port 22 are continued until the detection device 30 no longer detects the gas GS.

Further, as shown in FIG. 5B, when the supply operation of the supply port 12 is stopped, the control device 7 sets a predetermined gap D2 between the lower surface PKA of the lens barrel PK and the surface of the substrate P. be able to. Here, the gap D1 is larger than the gap D2. That is, when the supply operation of the supply port 12 is stopped, the predetermined space SP between the concave surface 2 and the substrate tape 4T is made smaller than when the supply operation of the supply port 12 is executed. In other words, when the supply operation of the supply port 12 is executed, the concave surface 2 and the substrate table are set so that the predetermined space SP between the concave surface 2 and the substrate table 4T is larger than when the supply operation of the supply port 12 is stopped. The positional relationship with 4T is adjusted.

[0067] The gap D2 when the supply operation of the supply port 12 is stopped is also the physical properties (surface tension, density, etc.) of the liquid LQ, the amount of the liquid LQ that satisfies the predetermined space SP (the apex position AT of the supply port 12 and the concave surface 2) Distance, the size of the immersion area LR), the contact angle of the upper surface 4F of the substrate table 4T with the liquid LQ, the contact angle of the lower surface PKA with the liquid LQ, etc., are optimally set. Thereby, the edge LG of the liquid immersion area LR can be maintained between the upper surface 4F and the lower surface PKA of the substrate table 4T, and the outflow of the liquid LQ can be suppressed.

[0068] After filling the predetermined space SP between the concave surface 2 and the substrate table 4T with the liquid LQ and stopping the supply operation of the supply port 12 and the suction operation of the suction port 22, the control device 7 Opposite the surface. The control device 7 moves the substrate stage 4 in the X and Y directions relative to the projection optical system PL and the liquid LQ, thereby forming the concave surface 2 and the surface of the substrate P as shown in FIG. Can be made to face each other. The control device 7 then exposes the exposure light onto the substrate P via the projection optical system PL including the final optical element LSI having the concave surface 2 and the liquid LQ, with the concave surface 2 facing the surface of the substrate P. Irradiate EL.

[0069] In the present embodiment, the control device 7 stops the supply of the liquid LQ and the suction (collection) operation to the predetermined space SP between the concave surface 2 and the surface of the substrate P, and the concave surface 2 and the base The substrate P is exposed through the liquid LQ held between the surface of the plate P. When exposing the substrate P, the Z-axis direction between the projection optical system PL and the substrate P is used in order to obtain a predetermined positional relationship between the image plane formed via the projection optical system PL and the liquid LQ and the surface of the substrate P. , And the positional relationship in the Θ X and Θ Y directions are adjusted.

[0070] As shown in FIG. 6, when the supply operation of the supply port 12 is stopped, such as during exposure of the substrate P, a predetermined gap is provided between the lower surface PKA of the lens barrel PK and the surface of the substrate P. Set to D2 '. Gap D2 'is smaller than gap D1. That is, when the supply operation of the supply port 12 is stopped such as when the substrate P is exposed, the predetermined space SP between the concave surface 2 and the substrate P is smaller than when the supply operation of the supply port 12 is performed such as during the initial filling operation. The positional relationship between the concave surface 2 and the substrate P is adjusted so as to decrease. Note that the gap D2 ′ may be the same as or different from the gap D2.

[0071] Further, the gap D2 'at the time of exposure of the substrate P also depends on the physical properties (surface tension, density, etc.) of the liquid LQ and the amount of the liquid LQ that satisfies the predetermined space SP (the supply port 12 and the vertex position AT of the concave surface 2). It is optimally set according to the distance, the size of the immersion area LR), the contact angle of the surface of the substrate P to the liquid LQ, the contact angle of the lower surface PKA to the liquid LQ, etc. Accordingly, the edge LG of the liquid immersion region LR can be maintained between the front surface and the lower surface PKA of the substrate P, and the outflow of the liquid LQ can be suppressed even when the substrate P is exposed.

Note that in this embodiment, the control device 7 allows the liquid supply operation of the supply port 12 and the fluid of the suction port 22 (mainly the liquid LQ in a state where the predetermined space SP is filled with the liquid LQ. ) In parallel with the suction (recovery) operation, foreign matter such as bubbles or particles in the liquid LQ in the predetermined space SP can be collected (removed) through the suction port 22. For example, as shown in FIG. 7, the control device 7 moves the substrate stage 4 in the XY direction with respect to the projection optical system PL so that the concave surface 2, the supply port 12, and the suction port 22 face each other. And The control device 7 performs the supply operation of the supply port 12 and the suction operation of the suction port 22 in parallel with the concave surface 2, the supply port 12 and the suction port 22 facing each other, and the liquid filling the predetermined space SP. By sucking bubbles (foreign matter) and the like in the LQ together with the liquid LQ from the suction port 22, the bubbles (foreign matter) can be removed from the liquid LQ filling the predetermined space SP.

[0073] Further, the control device 7 performs the supply operation of the supply port 12 and the suction operation of the suction port 22 in parallel in a state where the predetermined space SP is filled with the liquid LQ. LQ replacement (exchange) can be performed. When replacing the liquid LQ in the predetermined space SP, all the liquid LQs filling the predetermined space SP may be replaced (complete replacement), or a part of the liquid LQ may be replaced (partial replacement).

[0074] In the state where the predetermined space SP is filled with the liquid LQ, an operation of performing the supply operation of the supply port 12 and the suction operation of the suction port 22 in parallel (the foreign matter removal operation and the liquid LQ replacement operation are performed). For example) may be performed every predetermined time interval, every predetermined number of processed substrates, or every lot.

[0075] As described above, the supply port 12 for supplying the liquid LQ to the predetermined space SP including the optical path K of the exposure light EL on the substrate table 4T that can face the concave surface 2 of the final optical element LSI, and the fluid LQ Since the suction port 22 for sucking GS is provided, the predetermined space SP on the light exit side of the concave surface 2 can be satisfactorily filled with the liquid LQ. Therefore, the exposure light EL can reach IJ well up to the substrate P.

[0076] Further, by performing the supply operation of the supply port 12 and the suction operation of the suction port 22 in parallel, the gas GS in the predetermined space SP is quickly exhausted (exhausted) during the initial filling operation, and the predetermined space SP is obtained. In this way, it is possible to suppress the remaining gas portion (including bubbles) and to satisfactorily fill the optical path K of the exposure light EL with the liquid LQ. In addition, in a state where the predetermined space SP inside the concave surface 2 is filled with the liquid LQ, the supply of the liquid LQ at the supply port 12 and the suction of the fluid at the suction port 22 are performed in parallel. (Bubbles) can be removed and liquid LQ can be replaced (replaced).

[0077] The suction port 22 is provided at or near the position where the gases GS and Z or foreign substances gather due to the flow of the liquid LQ supplied between the concave surface 2 and the substrate table 4T from the supply port 12, so The gas GS and Z in the space SP or foreign matter can be sucked and discharged well. [0078] Further, since the supply port 12 is arranged on the optical axis AX of the final optical element LSI and the liquid LQ is ejected from the supply port 12 so as to contact the concave surface 2, the liquid LQ that hits the concave surface 2 is discharged. Flows along the concave surface 2. Therefore, the concave surface 2 can be well wetted with the liquid LQ, and the liquid LQ can be satisfactorily filled up to the vicinity of the vertex position AT.

[0079] Since the detection device 30 for detecting the presence or absence of gas GS in the predetermined space SP between the concave surface 2 and the substrate table 4T is provided, the control device 7 does not perform liquid until the predetermined space SP is filled with the liquid LQ. LQ supply operation can be performed. Further, it is possible to prevent the initial filling operation from being continued even though the predetermined space SP is filled with the liquid LQ.

[0080] When the supply operation of the supply port 12 is executed, the space between the concave surface 2 and the object (substrate table 4T, substrate Ρ) facing the concave surface 2 is larger than when the supply operation of the supply port 12 is stopped. As described above, since the positional relationship between the concave surface 2 and the object is adjusted, it is possible to suppress the influence on the final optical element LSI or the like due to the liquid supply operation of the supply port 12, for example. . That is, when the supply operation of the supply port 12 is executed, such as during the initial filling operation, the liquid LQ supplied (spouted) from the supply port 12 is caused between the concave surface 2 and the object facing the concave surface 2. Liquid LQ pressure may increase. If the space between the concave surface 2 and the object is reduced during the supply operation of the supply port 12, the pressure of the liquid LQ between the concave surface 2 and the object rises, for example, the liquid LQ force on the final optical element LSI. May significantly affect the final optical element LSI. In the present embodiment, when the supply operation of the supply port 12 is performed, the lower surface of the lens barrel PK is set so that the predetermined space SP between the concave surface 2 and the object is larger than when the supply operation of the supply port 12 is stopped. By adjusting the gap between the PKA and the object, the interface of the liquid LQ formed between the lower surface of the lens barrel PK and the upper surface 4F of the substrate table 4T is easy to move. An excessive pressure increase in the predetermined space SP at the time of execution can be suppressed. When the supply operation of the supply port 12 is stopped, the outflow of the liquid LQ in the predetermined space SP can be suppressed, and gaps D2 and D2 ′ are formed so as to be the desired positions with respect to the object (substrate). Can do.

[0081] <Second Embodiment>

A second embodiment will be described with reference to FIG. In the following description, the same reference numerals are given to the same or equivalent components as those in the above-described embodiment, and the description is simplified. Or omitted.

As shown in FIG. 9, the immersion system 1 of the present embodiment is similar to the first embodiment described above in that the supply port 12 disposed on the optical axis AX of the final optical element LSI and the supply port And suction port 22 provided so as to surround 12. A recess 40 is provided in a part of the upper surface 4F of the substrate table 4T. The recess 40 is provided in the vicinity of the suction port 22. In the present embodiment, the recess 40 is provided so as to surround the outside of the suction port 22. The concave portion 40 is provided at a position that can face the concave surface 2 of the final optical element LSI when the supply port 12 is disposed on the optical axis AX of the final optical element LSI.

In the present embodiment, the inner surface of the recess 40 is a curved surface that is recessed away from the final optical element LSI. Note that the inner surface of the recess 40 may have a shape in which a plurality of planes facing different directions are combined, for example.

[0084] As described above, the flow of the liquid LQ supplied from the supply port 12 to the predetermined space SP reduces the pressure in the space near the suction port 22 provided in the vicinity of the supply port 12, thereby reducing the suction port. 2 Gas GS can be collected in the vicinity of 2. In addition, the liquid LQ ejected from the supply port 12 hits the concave surface 2 of the final optical element LSI and flows toward the upper surface 4F of the substrate table 4T along the concave surface 2, so that the liquid LQ near the periphery of the concave surface 2 There is a possibility that the vortex of the LQ is generated and the gas GS (bubble) stays in the center of the vortex. However, in this embodiment, since the recess 40 is provided, even if the vortex of the liquid LQ is generated The center of the vortex is formed in the vicinity of the upper surface 4F of the substrate table 4T (in the vicinity of the suction port 22). Therefore, the gas GS (bubbles) in the liquid LQ that fills the predetermined space SP can be quickly discharged through the suction port 22 during the initial filling operation or the like.

[0085] <Third embodiment>

A third embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is simplified or omitted. As shown in FIG. 10, at least a part of the supply flow path 14 connected to the supply port 12 can be gradually expanded in a taper shape (trumpet shape) toward the supply port 12. As a result, the flow of the liquid LQ for filling the predetermined space SP can be brought into a desired state during the initial filling operation or the like. It is possible to suppress the residual gas GS.

[0086] The remaining of the gas GS in the predetermined space SP can also be suppressed by optimizing the diameter of the supply port 12 according to the diameter of the concave surface 2 of the final optical element LSI. For example, by making the diameter of the supply port 12 equal to or greater than 1Z3 of the diameter of the concave surface 2 of the final optical element LSI, the remaining gas GS in the predetermined space SP can be suppressed.

[0087] <Fourth embodiment>

Next, a fourth embodiment will be described with reference to FIGS. 11A to 13B. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In the present embodiment, when performing the initial filling operation of the predetermined space SP, the control device 7 arranges the supply port 12 at a predetermined position facing the peripheral edge of the concave surface 2 of the final optical element LSI. The supply port 12 supplies the liquid LQ in a state where the supply port 12 is disposed at a predetermined position facing the peripheral portion of the concave surface 2 of the final optical element LSI.

The suction port 22 is provided in the vicinity of the supply port 12. In the present embodiment, the suction port 22 is disposed between the optical axis AX of the final optical element LSI and the supply port 12 when the supply port 12 is disposed at a predetermined position facing the peripheral edge of the concave surface 2. The As described above, also in this embodiment, when performing the initial filling operation, the control device 7 controls the substrate stage driving device to drive the substrate stage 4, and the supply port 12 and the suction port 22 on the substrate table 4T The concave surface 2 of the final optical element LSI is opposed.

In the present embodiment, each of the supply port 12 and the suction port 22 is formed in an arcuate slit shape on the upper surface 4F of the substrate table 4T. In the present embodiment, the supply port 12 is formed larger than the suction port 22.

Next, the procedure of the initial filling operation will be described with reference to the schematic diagrams of FIGS. 12A, 12B, 13 A, and 13. When performing the initial filling operation, the control device 7 drives the substrate stage 4 and, as shown in FIGS. 11A and 11B, the concave surface 2 of the final optical element LSI, the supply port 12 on the substrate table 4T, and the suction. The supply port 12 is arranged at a predetermined position facing the peripheral edge of the concave surface 2 of the final optical element LSI. Then, the control device 7 drives the liquid supply device 11 of the liquid immersion system 1 and starts supplying the liquid LQ to the predetermined space SP between the concave surface 2 and the substrate table 4T. The liquid LQ delivered from the liquid supply device 11 is After flowing through the supply flow path 14, it is supplied from the supply port 12 to the predetermined space SP.

FIG. 12A shows a state immediately after the supply of the liquid LQ from the supply port 12 is started. As shown in FIG. 12A, the liquid immersion system 1 spouts the liquid LQ from the supply port 12 so as to hit the peripheral edge of the concave surface 2. Also in this embodiment, the distance between the supply port 12 and the vertex position AT of the concave surface 2 is set to about 50 to 60 mm, the diameter of the concave surface 2 is set to about 100 to 120 mm, and the immersion system 1 is Liquid (glycerin) LQ is ejected from supply port 12 at a flow velocity of lmZsec. Or more. Thus, the supply port 12 can eject the liquid LQ so as to hit the peripheral edge of the concave surface 2, and the liquid LQ supplied to the peripheral edge of the concave surface 2 is positioned along the concave surface 2 at the apex position of the concave surface 2. Can reach AT.

In addition, the control device 7 starts driving the suction device 21 at a predetermined timing with respect to the time when the supply of the liquid LQ from the supply port 12 is started, and starts sucking the fluid from the suction port 22. The The suction port 22 sucks (exhausts) a fluid (gas GS) in a predetermined space between the concave surface 2 and the substrate table 4T in parallel with the supply operation of the liquid LQ from the supply port 12.

The liquid LQ supplied (spouted) from the supply port 12 to the predetermined space SP flows along the concave surface 2 after hitting the concave surface 2. The control device 7 continues the supply operation of the supply port 12 and the suction operation of the suction port 22. Also in this embodiment, since the flow of the liquid LQ supplied from the supply port 12 to the predetermined space SP is a high flow rate of several mZsec., The pressure in the space near the suction port 22 provided in the vicinity of the supply port 12 The gas GS in the liquid LQ can be placed near the suction port 22. Thus, also in the present embodiment, the suction port 22 is provided in the vicinity of the position where the gas GS gathers due to the flow of the liquid LQ supplied from the supply port 12 between the concave surface 2 and the substrate table 4T. . By continuing the supply of the liquid LQ from the supply port 12, the predetermined space SP between the concave surface 2 and the substrate table 4T is gradually filled with the liquid LQ.

FIG. 12B shows a state immediately before the predetermined space SP is filled with the liquid LQ. As shown in FIG. 12B, a predetermined space SP between the concave surface 2 and the substrate table 4T has a predetermined liquid LQ according to the flow of the liquid LQ supplied from the supply port 12, the shape of the concave surface 2, and the like. A flow is generated. Further, by providing the suction port 22 in the vicinity of the position where the gas GS gathers, as shown in FIG. 12B, the gas (including bubbles) GS in the predetermined space SP is passed through the suction port 22 as shown in FIG. It can be discharged more smoothly than SP.

[0095] Then, until the gas GS in the predetermined space SP is exhausted (or until the amount of the gas GS falls below a predetermined allowable value), the control device 7 performs the supply operation and suction of the liquid LQ at the supply port 12. Continue the suction operation of fluid (including liquid LQ and gas GS) in port 22. The liquid immersion system 1 can discharge the gas GS in the predetermined space SP through the suction port 22 by performing the supply operation of the liquid LQ while discharging (exhausting) the gas GS in the predetermined space SP. As shown in FIG. 13A, the predetermined space SP between the concave surface 2 and the substrate table 4T is satisfactorily filled with the liquid LQ supplied from the supply port 12 without leaving the gas GS in the liquid LQ in the predetermined space SP. I can do it. Also in the present embodiment, the control device 7 determines that the gas GS has disappeared in the predetermined space SP based on the detection result of the detection device 30 (until it is determined that the predetermined space SP is filled with the liquid LQ). The supply operation at the supply port 12 and the suction operation at the suction port 22 are continued.

[0096] When it is determined that there is no gas GS in the predetermined space SP between the concave surface 2 and the substrate table 4T based on the detection result of the detection device 30, the control device 7, as shown in FIG. Stop the supply operation of 12 and the suction operation of the suction port 22. This completes the initial filling operation.

Further, as shown in FIG. 13B, the control device 7 adjusts the gap between the lower surface PKA of the lens barrel PK and the surface of the substrate P, and when the supply operation of the supply port 12 is stopped, the supply port 12 The predetermined space SP between the concave surface 2 and the substrate table 4T can be made smaller than when performing the supply operation.

[0098] When the liquid LQ is supplied from the supply port 12 with the concave surface 2 and the substrate table 4T facing each other, the liquid LQ is sucked from the suction port 22 and the predetermined space SP between the concave surface 2 and the substrate table 4T is formed by the liquid LQ. After satisfying and stopping the supply operation of the supply port 12 and the suction operation of the suction port 22, the substrate table 4T is moved in the XY direction, and the control device 7 makes the concave surface 2 and the surface of the substrate P face each other. . The control device 7 then exposes the exposure light on the substrate P via the projection optical system PL including the final optical element LSI having the concave surface 2 and the liquid LQ, with the concave surface 2 facing the surface of the substrate. Irradiate EL.

Also in the present embodiment, the control device 7 includes the concave surface 2, the supply port 12, and the suction port 22. The liquid supply operation of the supply port 12 and the suction (collection) operation of the fluid (mainly liquid LQ) of the suction port 22 are performed in parallel while the predetermined space SP is filled with the liquid LQ. Therefore, it is possible to remove (collect) foreign matters such as bubbles or particles in the liquid LQ, and it is possible to replace (exchange) the liquid LQ that fills the predetermined space SP.

[0100] <Fifth Embodiment>

Next, a fifth embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. As shown in FIG. 14, the liquid immersion system 1 of the present embodiment is similar to the above-described fourth embodiment, and includes a supply port 12 disposed at a predetermined position facing the peripheral edge of the concave surface 2 of the final optical element LSI, A suction port 22 is provided between the supply port 12 and the optical axis AX of the final optical element LSI. A recess 40 ′ is provided in a part of the upper surface 4F of the substrate table 4T. The recess 40 ′ is provided in the vicinity of the suction port 22. In the present embodiment, the recess 40 ′ is provided in the vicinity of the suction port 22 and on the opposite side of the supply port 12 with respect to the suction port 22. The concave portion 40 ′ is provided at a position that can face the concave surface 2 of the final optical element LSI when the supply port 12 is disposed at a predetermined position facing the peripheral edge portion of the concave surface 2 of the final optical element LS1.

[0101] In the present embodiment, the inner surface of the recess 40 'is a curved surface that is recessed away from the final optical element LSI. Note that the inner surface of the recess 40 ′ may have, for example, a shape in which a plurality of planes facing different directions are combined.

[0102] The liquid LQ ejected from the supply port 12 flows toward the upper surface 4F of the substrate table 4T along the concave surface 2 of the final optical element LSI, so that the final optical element LSI and the substrate table 4T There is a possibility that the vortex of the liquid LQ is generated between the two and the gas GS (bubble) stays in the center of the vortex. However, in this embodiment, since the recess 40 'is provided, the vortex of the liquid LQ Even if this occurs, the center of the vortex can be formed in the vicinity of the upper surface 4F of the substrate table 4T (in the vicinity of the suction port 22). Therefore, the gas GS (bubbles) in the liquid LQ that fills the predetermined space SP can be more quickly discharged through the suction port 22 during the initial filling operation or the like.

[0103] <Sixth Embodiment> Next, a sixth embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. As shown in FIG. 15, the liquid immersion system 1 according to the present embodiment is similar to the fourth embodiment described above, and the supply port 12 disposed at a predetermined position facing the peripheral edge of the concave surface 2 of the final optical element LSI, A suction port 22 is provided between the supply port 12 and the optical axis AX of the final optical element LSI. Then, when the supply port 12 is disposed at a predetermined position facing the peripheral edge of the concave surface 2, a second suction port 23 is provided on the opposite side of the supply port 12 with respect to the optical axis AX of the final optical element LSI. Yes. The second suction port 23 is provided on the upper surface 4F of the substrate table 4T.

[0104] During the initial filling operation, the control device 7 supplies the supply port 12 while adjusting the suction force of the suction port 22 (fluid suction amount per unit time) and the suction force of the second suction port 23. The flow of the liquid LQ in the predetermined space SP is controlled by performing the operation, the suction operation of the suction port 22 and the suction operation of the second suction port 23 in parallel, and the pressure in the vicinity of the suction port 22 is low. A space can be formed, and the gas GS in the liquid LQ that fills the predetermined space SP can be collected near the suction port 22. For example, by the suction operation of the second suction port 23, it is possible to suppress the generation of the flow of the downward force liquid LQ in the vicinity of the suction port 22, and gas (bubbles etc.) is generated from the suction port 22. It can suppress moving away.

[0105] In the first to sixth embodiments described above, the suction port 22 is used when the liquid LQ is completely removed (recovered) from the predetermined space SP on the light exit surface side of the final optical element LSI. it can . That is, the liquid LQ in the predetermined space SP can be recovered by recovering the liquid LQ from the suction port 22 with the concave surface 2 of the final optical element LSI and the suction port 22 facing each other. At this time, the supply port 12 can be connected to a vacuum device (suction device), and the liquid LQ in the predetermined space SP can be recovered using both the supply port 12 and the suction port 22.

Next, a seventh embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In FIG. 16, the immersion system 1 is provided on the substrate table 4T and has a supply member 52 having a supply port 12 for supplying the liquid LQ, and drives the supply member 52. Thus, a drive device 54 that moves the supply port 12 relative to the concave surface 2 is provided. The supply member 52 is a tubular member, and is disposed inside a hole 55 provided in a part of the upper surface 4F of the substrate table 4T. The upper end of the supply member 52 is the supply port 12. The supply member 52 can be moved in the vertical direction (Z-axis direction) by the driving force of the driving device 54, and the supply port 12 protrudes and protrudes from the upper surface 4F of the substrate table 4T. . In the present embodiment, when the supply member 52 is lowered and disposed inside the hole 55, as shown in FIG. 16, the supply port 12 at the upper end of the supply member 52 is substantially the same as the upper surface 4F of the substrate table 4T. It will be the same. The supply member 52 may be movable in an oblique direction with respect to the Z-axis direction.

Further, the supply port 12 provided on the upper surface 4F of the substrate table 4T can be opposed to the concave surface 2 of the final optical element LSI by moving the substrate table 4T (substrate stage 4). On the other hand, the lower end of the supply member 52 is connected to the liquid supply apparatus 11 via the pipe member 56. Further, a part of the pipe member 56 is provided with a telescopic mechanism 57 that can be expanded and contracted so as not to hinder the movement of the supply member 52.

When performing the initial filling operation of the predetermined space SP, the control device 7 drives the substrate stage 4 so that the concave surface 2 of the final optical element LSI and the supply port 12 on the substrate table 4T face each other. Then, the control device 7 uses the drive device 54 to move (raise) the supply member 52 in the + Z direction, and brings the supply port 12 provided at the upper end of the supply member 52 closer to the concave surface 2. Then, as shown in FIG. 17, the control device 7 starts supplying the liquid LQ with the supply port 12 brought closer to the concave surface 2 by a predetermined distance (for example, about 1 mm). In the present embodiment, the control device 7 brings the apex position AT of the concave surface 2 close to the supply port 12. Then, the control device 7 gradually moves (lowers) the supply member 52 in the −Z direction while ejecting the liquid LQ from the supply port 12. In this way, the predetermined space SP between the concave surface 2 and the substrate table 4T can be satisfactorily filled with the liquid LQ. Then, after filling the predetermined space SP with the liquid LQ and lowering the supply member 52 until the supply port 12 and the upper surface 4F of the substrate table 4T are substantially flush, the control device 7 stops supplying the liquid LQ and Then, the substrate stage 4 is moved in the XY direction so that the concave surface 2 and the surface of the substrate P face each other, and exposure of the substrate P is started.

[0109] During the initial filling operation, the gas GS in the liquid LQ is above the predetermined space SP ( There is a high possibility of staying in the vicinity of the apex position AT of the concave surface 2). In the present embodiment, since the liquid LQ is supplied with the supply port 12 approaching the concave surface 2, the gas GS is prevented from staying above the predetermined space SP (in the vicinity of the vertex position AT of the concave surface 2). be able to.

[0110] Also in the seventh embodiment, the detection device 30 is provided to detect the presence or absence of the gas GS (including bubbles) in the predetermined space SP, and from the supply port 12 based on the detection result. The liquid supply may be controlled.

Next, an eighth embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In FIG. 18, the immersion system 1 is provided on the substrate table 4T, and has a suction member 62 having a suction port 22 for sucking fluid, and the suction member 22 is driven to the concave surface 2 by driving the suction member 62. And a drive device 64 that moves relatively. The suction member 62 is a tubular member, and is disposed inside a hole provided in a part of the upper surface 4F of the substrate table 4T. The upper end of the suction member 62 is the suction port 22. The suction member 62 can be moved in the Z-axis direction by the driving force of the drive device 64, and the suction port 22 protrudes and appears with respect to the upper surface 4F of the substrate table 4T. In the present embodiment, when the suction member 62 is lowered and disposed inside the hole of the substrate table 4T, the suction port 22 at the upper end of the suction member 62 is substantially the same as the upper surface 4F of the substrate table 4T. It will be the same. The suction member 62 may be movable in an oblique direction with respect to the Z-axis direction.

Further, the suction port 22 provided on the upper surface 4F of the substrate table 4T can be opposed to the concave surface 2 of the final optical element LSI by the movement of the substrate table 4T (substrate stage 4). On the other hand, the lower end of the suction member 62 is connected to the suction device 21 via the pipe member 66. In addition, a telescopic mechanism 67 that can be expanded and contracted is provided in a part of the pipe member 66 so as not to prevent the movement of the suction member 62.

[0113] As shown in FIG. 18, in the initial filling operation, there is a possibility that the gas GS may remain in the liquid LQ after the liquid LQ is supplied to the predetermined space SP between the concave surface 2 and the substrate table 4T. . A gas GS having a specific gravity smaller than that of the liquid LQ is likely to stay at or near the highest position (vertex position) AT of the concave surface 2. For example, after supplying the liquid LQ to the predetermined space SP between the concave surface 2 and the substrate table 4T using the supply member 52 shown in FIG. The suction port 22 of the suction member 62 provided at a position different from the supply member 52 and the concave surface 2 are opposed to each other. Then, the control device 7 moves (raises) the suction member 62 in the + Z direction, and brings the suction port 22 provided at the upper end of the suction member 62 closer to the concave surface 2. That is, the control device 7 arranges the suction port 22 of the suction member 62 in the vicinity of the position where the gas exists, that is, near the vertex position AT of the concave surface 2. The control device 7 sucks and removes the gas GS remaining in the liquid LQ in the predetermined space SP while the suction port 22 is brought closer to the concave surface 2 by a predetermined distance (for example, about 1 mm).

Then, after the operation of removing the gas in the liquid LQ is completed, that is, after the initial filling operation is completed, the control device 7 moves (lowers) the suction member 62 in the −Z direction. The control device 7 lowers the suction member 62 until the suction port 22 and the upper surface 4F of the substrate table 4T are substantially flush with each other, and then moves the substrate stage 4 in the XY direction to move the concave surface 2 and the surface of the substrate P. And exposure of the substrate P is started.

[0116] In the present embodiment, when the gas (including bubbles) GS remaining in the predetermined space SP during the initial filling operation is removed, the suction operation using the suction port 22 of the suction member 62 is performed. However, the suction operation using the suction port 22 of the suction member 62 can also be executed when removing foreign substances (including bubbles) in the liquid LQ filling the predetermined space SP.

[0117] On the substrate table 4T, the supply port 12 of the supply member 52 and the suction port 22 of the suction member 62 can be opposed to the concave surface 2 together. The suction port 22 of the suction member 62 may be disposed in the vicinity. Accordingly, the supply operation of the supply port 12 and the suction operation of the suction port 22 can be performed in a state where the supply port 12 and the suction port 22 are brought close to the concave surface 2. In addition, the liquid LQ in the predetermined space SP can be exchanged (replaced).

[0118] Furthermore, the suction member 62 (suction port 22) of the present embodiment may be combined with the liquid immersion system 1 described in the first to sixth embodiments.

<Ninth embodiment> Next, a ninth embodiment will be described with reference to FIG. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In FIG. 19, the immersion system 1 includes a supply member 52 having a supply port 12 for supplying a liquid LQ, and a suction member 62 having a suction port 22 for sucking fluid, which is provided on the substrate table 4T. . The supply member 52 is a tubular member, and the suction member 62 is a tubular member disposed outside the supply member 52. That is, in the present embodiment, the supply member 52 and the suction member 62 are double tubes. Each of the supply member 52 and the suction member 62 can be moved in the Z-axis direction by a predetermined driving device. In the present embodiment, the supply member 52 and the suction member 62 can move independently of each other.

[0120] When performing the initial filling operation, the control device 7 brings the supply port 12 of the supply member 52 and the suction port 22 of the suction member 62 closer to the concave surface 2, respectively. Then, the control device 7 performs the liquid supply operation using the supply port 12 and the sucking I operation using the sucking I port 22 while the supply port 12 and the suction port 22 are close to the concave surface 2. Execute. In this embodiment! As shown in FIG. 19, the control device 7 performs the liquid supply operation using the supply port 12 in the state where the upper end of the supply member 52 is arranged closer to the concave surface 2 than the upper end of the suction member 62. A suction operation using the suction port 22 is executed. Then, the control device 7 gradually moves (lowers) each of the supply member 52 and the suction member 62 in the −Z direction while performing the liquid supply operation using the supply port 12 and the suction operation using the suction port 22. ) By doing so, the predetermined space SP between the concave surface 2 and the substrate table 4T can be satisfactorily filled with the liquid LQ. After the predetermined space SP is filled with the liquid LQ and the supply member 52 and the suction member 62 are lowered until the supply port 12 and the suction port 22 are substantially flush with the upper surface 4F of the substrate table 4T, the control device 7 Then, the supply operation of the supply port 12 and the suction operation of the suction port 22 are stopped, and the substrate stage 4 is moved in the XY direction so that the concave surface 2 and the surface of the substrate P face each other, and the exposure of the substrate P is started. Start.

[0121] In the present embodiment, the supply member 52 and the suction member 62 can be moved independently of each other, but the relative positional relationship between the supply member 52 and the suction member 62 is fixed to a predetermined value. It is possible to move the supply member 52 and the suction member 62 together using the driving device of In the present embodiment, the supply operation of the supply member 52 from the supply port 12 and the suction operation of the suction member 62 from the suction port 22 are performed in parallel. The liquid LQ may be supplied from 12, and the suction operation from the suction port 22 of the suction member 62 may be started in a state where the predetermined space SP is substantially filled with the liquid LQ.

[0123] Also in the ninth embodiment, the detection device 30 is provided to detect the presence or absence of gas GS (bubbles) in the predetermined space SP, and based on the detection result, supply of liquid from the supply port 12 You may control.

[0124] Further, even in the present embodiment, the predetermined space SP is executed by performing the supply operation of the supply port 12 and the suction operation of the suction port 22 in a state where the predetermined space SP is filled with the liquid LQ. Liquid LQ bubbles or particles can be removed. In addition, at least a part of the liquid LQ in the predetermined space SP can be replaced (exchanged).

[0125] In the eighth and ninth embodiments, when the liquid LQ is completely removed (recovered) from the predetermined space SP on the light exit surface side of the final optical element LSI, the suction port 22 of the suction member 62 is changed. You may use it.

[0126] Further, in the first to ninth embodiments described above, when the liquid LQ is completely removed (collected) from the predetermined space SP, the suction operation of the suction port 22 is performed while the substrate table 4T is powered. Please go.

[0127] Also, in the first to ninth embodiments described above, as the detection device 30, for example, the predetermined space SP is directly irradiated with detection light to detect whether or not the predetermined space SP is filled with the liquid LQ. You can also use what you do.

Further, in the first to ninth embodiments described above, it is determined that the predetermined space SP is filled with the liquid LQ by continuing the supply operation of the supply port 12 and the suction operation of the Z or the suction port 22 for a predetermined time. If possible, you can omit the detector 30.

[0129] <Tenth embodiment>

Next, a tenth embodiment will be described with reference to FIG. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In FIG. 20, the exposure apparatus EX is installed on the substrate table 4T. A predetermined member 70 having a convex surface 71 that can be opposed to the concave surface 2 of the final optical element LSI, and a driving device 72 that moves the convex surface 71 relative to the concave surface 2 by driving the predetermined member 70. It has. The convex surface 71 is a curved surface along the concave surface 2, and is formed in a spherical shape or an aspherical shape in the present embodiment.

[0130] The predetermined member 70 is disposed inside a hole 73 provided in a part of the upper surface 4F of the substrate table 4T. The predetermined member 70 can be moved in the Z-axis direction by the driving force of the driving device 72, and appears and disappears with respect to the upper surface 4F of the substrate table 4T. Of the predetermined member 70, a portion other than the convex surface 71 is formed in a cylindrical shape (columnar shape). Further, the upper surface 4F of the substrate table 4T is disposed around the convex surface 71 of the predetermined member 70 so as to surround the convex surface 71.

[0131] The surface of the predetermined member 70 including the convex surface 71 is lyophilic with respect to the liquid LQ. In the present embodiment, the surface of the predetermined member 70 including the convex surface 71 is covered with a film of a predetermined material having lyophilicity with respect to the liquid LQ, thereby imparting lyophilicity to the convex surface 71 and the like. Yes.

[0132] Further, the exposure apparatus EX is provided so as to surround the final optical element LS1 and the lens barrel PK, and has a supply port 82 that can supply the liquid LQ and a recovery port 84 that can recover the liquid LQ. Equipped with 80. The nozzle member 80 is formed so as to surround the concave surface 2 of the final optical element LSI, and has a lower surface 81 facing the upper surface 4F of the substrate table 4T. The lower surface 81 of the nozzle member 80 and the lower surface PKA of the lens barrel PK are substantially flush with each other, and these lower surfaces PKA and 81 are arranged so as to surround the concave surface 2.

[0133] Each of the supply port 82 and the recovery port 84 is provided on the lower surface 81 of the nozzle member 80. In the present embodiment, the supply port 82 is provided on each of the + Y side and the −Y side with respect to the optical path K. In the present embodiment, the recovery port 84 is provided outside the supply port 82 with respect to the optical path K, and is formed in an annular shape so as to surround the optical path K. Note that a porous member or a mesh member can be disposed in the recovery port 84.

The supply port 82 is provided so as to be able to supply the liquid LQ between the lower surface PKA of the lens barrel PK and the upper surface 4F of the substrate table 4T facing the lower surface PKA. In this embodiment, the supply port 82 is a liquid between the lower surface PKA of the lens barrel PK and the upper surface 4F of the substrate table 4T. In order to be able to supply LQ, the liquid LQ is supplied in an oblique direction by directing the light path K.

Next, the operation of the exposure apparatus EX including the initial filling operation will be described. When executing the initial filling operation, the control device 7 drives the substrate stage 4 in the XY directions so that the concave surface 2 of the final optical element LSI and the convex surface 71 provided on the substrate table 4T face each other. Then, using the driving device 72, the control device 7 moves (raises) the predetermined member 70 in the + Z direction, and brings the convex surface 71 of the predetermined member 70 closer to the concave surface 2 of the final optical element LSI. Then, as shown in FIG. 21A, the control device 7 sets the first distance G1 (about 0.5 mm) between the concave surface 2 and the convex surface 71, so that the concave surface 2 and the convex surface 71 by the supply port 82 are set. The liquid LQ supply operation to and from is started.

[0136] Further, the control device 7 starts collecting (suctioning) fluid (including liquid LQ and gas GS) through the collection port 84. That is, the control device 7 performs recovery (suction) by the recovery port 84 in parallel with the supply of the liquid LQ from the supply port 82.

[0137] As described above, the lower surface PKA (81) is formed so as to surround the concave surface 2, and the upper surface 4F of the substrate table 4T is formed so as to surround the convex surface 71. The supply port 82 fills the space between the concave surface 2 and the convex surface 71 with the liquid LQ by supplying the liquid LQ between the lower surface PKA and the upper surface 4F.

[0138] When the liquid LQ supply operation is started between the concave surface 2 and the convex surface 71 with the first distance G1 between the concave surface 2 and the convex surface 71, the lower surface PKA of the lens barrel PK and the substrate The distance from the upper surface 4F of the table 4T is set to the second distance G2 (about lmm). Here, the first distance G1 is smaller than the second distance G2. The control device 7 uses the supply port 82 in a state where the distance between the concave surface 2 and the convex surface 71 is set to the first distance G1, and the distance between the lower surface PKA and the upper surface 4F is set to the second distance G2. The liquid LQ supply operation between the lower surface PKA and the upper surface 4F was started.

In the present embodiment, when performing the initial filling operation, the liquid LQ is supplied from a predetermined position (one direction) between the lower surface PKA and the upper surface 4F. For example, as shown in FIG. 21A, the control device 7 supplies the liquid LQ from the supply port 82 disposed on the + Y side with respect to the optical path K. The liquid LQ supplied between the lower surface PKA and the upper surface 4F from the supply port 82 flows between the concave surface 2 and the convex surface 71 and wets and spreads between the concave surface 2 and the convex surface 71.

[0140] In the present embodiment, the first distance G1 between the concave surface 2 and the convex surface 71 is equal to the upper surface PKA and the upper surface. The liquid LQ supplied between the lower surface PKA smaller than the second distance G2 between the surface 4F and the upper surface 4F spreads between the concave surface 2 and the convex surface 71 due to, for example, capillary action. The convex surface 71 is lyophilic with respect to the liquid LQ, and the concave surface 2 is also lyophilic with respect to the liquid LQ. Therefore, the liquid LQ is between the concave surface 2 and the convex surface 71. It spreads well. Therefore, the liquid LQ that has flowed between the concave surface 2 and the convex surface 71 can be satisfactorily adhered to the concave surface 2 as shown in FIG. 21B.

[0141] The liquid LQ, which is supplied from the supply port 82 on the + Y side with respect to the optical path K and has wet spread S between the concave surface 2 and the convex surface 71, is eventually arranged on the Y side with respect to the optical path K. Collected at collection port 84. In parallel with the liquid supply operation of the supply port 82, the recovery operation of the fluid (liquid LQ) by the recovery port 84 is executed, so that the liquid LQ is prevented from flowing out of the recovery port 84.

Then, as shown in FIG. 22A, the control device 7 gradually moves the predetermined member 70 in the Z direction while performing the liquid supply operation of the supply port 82 and the liquid recovery operation of the recovery port 84 in parallel. Move (down). That is, the control device 7 gradually increases the distance between the concave surface 2 and the convex surface 71 while continuing the liquid supply operation of the supply port 82 and the liquid recovery operation of the recovery port 84. The control device 7 performs the supply operation of the supply port 82 provided on each of the + Y side and the Y side with respect to the optical path K and the recovery operation of the recovery port 84 in parallel. By doing so, the liquid LQ can be smoothly filled with the liquid LQ while the liquid LQ is prevented from flowing out to the outside of the recovery port 84 and the concave surface 2 and the convex surface 71 are filled.

Then, as shown in FIG. 22B, after the predetermined member 70 is lowered until the predetermined space SP is filled with the liquid LQ and the upper end of the convex surface 71 becomes substantially the same height as the upper surface 4F of the substrate table 4T, the control device In step 7, the substrate stage 4 is moved in the XY direction so that the concave surface 2 and the surface of the substrate P face each other, and exposure of the substrate P is started.

In the present embodiment, the control device 7 finishes the initial filling operation and performs the supply operation of the supply port 82 and the recovery operation of the recovery port 84 in parallel even when the substrate P is exposed. And do it.

As described above, in the initial filling operation, the convex surface 71 is arranged at a position facing the concave surface 2, and the liquid LQ is supplied between the concave surface 2 and the convex surface 71, so that the predetermined space SP The liquid LQ can be satisfactorily filled up to the upper side (near the vertex position AT). Note that, in the present embodiment, the force that the liquid LQ supplied from the supply port 82 of the nozzle member 80 fills between the concave surface 2 and the convex surface 71 is provided on the upper surface of the substrate table 4T. The liquid LQ supplied from the supply port 12 may be filled between the concave surface 2 and the convex surface 71. Alternatively, a supply port may be provided on the convex surface 71 of the predetermined member 70 so that the liquid supplied from the supply port of the convex surface 71 fills the space between the concave surface 2 and the convex surface 71.

[0147] The nozzle member 80 of the present embodiment may be used in combination with the liquid immersion system 1 of the first to ninth embodiments described above.

[0148] Eleventh Embodiment>

Next, an eleventh embodiment will be described with reference to FIG. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In FIG. 23, the measurement stage 5 in which the supply port 12 and the suction port 22 for filling the predetermined space SP described in any of the first to ninth embodiments with the liquid LQ can move independently of the substrate stage 4. It is provided above. The measurement stage 5 is equipped with a measuring instrument for exposure processing and can be moved on the base member BP. Note that an exposure apparatus provided with a measurement stage is disclosed in detail, for example, in JP-A-11-135400 and JP-A-2000-164504 (corresponding US Pat. No. 6,897,963).

[0149] Further, for the present embodiment, the measurement stage 5 is provided with an observation power mesa 100 that can observe the state of the liquid LQ that fills the predetermined space SP. The observation power mela 100 is arranged in the internal space of the measurement stage 5. An opening connected to the internal space is formed on the upper surface 5F of the measurement stage 5, and a transparent member 103 having a quartz isotropic force is disposed in the opening. The upper surface of the transparent member 103 is flat and forms a part of the upper surface 5F of the measurement stage 5. The observation power mela 100 indicates the state of the liquid LQ in the immersion region LR formed on the upper surface 5F of the measurement stage 5 including the upper surface of the transparent member 103, that is, the state of the liquid LQ that satisfies the predetermined space SP. Can be observed. The observation power mela 100 includes an optical system 102 and an image sensor 101 constituted by a CCD (charge coupled device) or the like. The image sensor 101 can acquire an image (optical image) of the liquid LQ, the final optical element LSI, and the like via the transparent member 103 and the optical system 102. The image sensor 101 can acquire the acquired image information. Information is output to the control device 7. The control device 7 can determine the state of the liquid LQ that fills the predetermined space SP based on the imaging result of the observation power mela 100.

[0150] In the present embodiment, the control device 7 observes the presence or absence of gas (including bubbles) GS in the liquid LQ that fills the space between the concave surface 2 of the final optical element LSI and the upper surface 5F of the measurement stage 5. Detect using force Mela 100. That is, the control device 7 performs the initial filling operation of the predetermined space SP using the supply port 12 and the suction port 22, and then moves the measurement stage 5 in the XY direction so that the concave surface 2 and the transparent member 103 face each other. . As a result, the liquid immersion area LR is formed on the transparent member 103. The observation power mela 100 acquires an image of the liquid LQ in the liquid immersion area LR via the transparent member 103. Based on the output of the observation power mela 100, the control device 7 can determine whether or not the gas (bubble) GS is present in the liquid LQ that fills the predetermined space SP.

[0151] Based on the output of the observation power mela 100, the controller 7 determines that gas (bubbles) GS is present in the liquid LQ that fills the predetermined space SP, moves the measurement stage 5 in the XY direction, The concave surface 2 and the suction port 22 on the measurement stage 5 are made to face each other, and for example, a predetermined process for eliminating a gas portion in the liquid LQ is performed. Then, after executing the processing, again, the concave surface 2 and the transparent member 103 are opposed to each other, and the state of the liquid LQ that fills the predetermined space SP is observed using the observation power mela 100.

[0152] Based on the output of the observation power mela 100, the control device 7 determines that there is no gas (bubble) GS in the liquid LQ in the predetermined space SP, and the substrate P on the substrate stage 4 and the concave surface 2 The liquid immersion area LR is moved onto the substrate P so as to face each other.

[0153] As shown in FIG. 24, the control device 7 brings the upper surface 4F of the substrate stage 4 and the upper surface 5F of the measurement stage 5 close to or in contact with each other within a predetermined region including the position immediately below the projection optical system PL. In this state, the immersion stage LR can be moved between the upper surface 4F of the substrate stage 4 and the upper surface 5F of the measurement stage 5 by moving the substrate stage 4 and the measurement stage 5 together in the XY direction. . Therefore, after the initial filling operation is performed on the measurement stage 5, the immersion region LR can be moved onto the substrate P held on the substrate stage 4 by executing the operation as shown in FIG. . Then, after moving the liquid LQ in the immersion area LR onto the substrate P, the control device 7 starts exposure of the substrate P via the projection optical system PL and the liquid LQ. [0154] In the present embodiment, the observation power mela 100 can also detect foreign matter in the liquid LQ, and the control device 7 executes a predetermined process based on the detection result of the observation power mela 100.

Note that the measurement stage 5 of the present embodiment may be applied to the above-described tenth embodiment. In this case, the predetermined member 70 can be provided on the measurement stage 5.

Note that in each of the above-described embodiments, the interface LG forming the liquid immersion region LR is the lower surface PKA of the lens barrel PK formed so as to surround the concave surface 2 and is opposed to the lower surface PKA. The projection optical system PL includes, for example, a part of the final optical element LSI (for example, a flange surface) force of the upper surface of the substrate table 4T. When provided at a position closest to 4F or the like, the interface LG of the immersion region LR is formed between a part of the final optical element LSI and the upper surface 4F of the substrate table 4T. In this case, in the tenth embodiment described above, the supply port supplies a part of the final optical element LSI (flange surface) and the upper surface of the substrate table 4T in order to supply the liquid LQ between the concave surface 2 and the convex surface 71. Liquid LQ can be supplied between 4F.

[0157] In the above-described embodiments, the optical path between the optical element LSI and the optical element LS2 may be filled with the liquid LQ. In this case, the liquid that fills the space between the optical element LSI and the optical element LS 2 may be the same as or different from the liquid LQ that fills the predetermined space SP described above. The refractive index is smaller than the liquid LQ satisfying SP.

[0158] In the first to sixth embodiments described above, the object that faces the final optical element LSI

(For example, the substrate table 4T) is not provided with movable members (such as the supply member 52, the suction member 62, and the predetermined member 70) as shown in the seventh to tenth embodiments, so that no foreign matter such as particles is generated. In addition, the space between the concave surface 2 of the final optical element LSI and the object (for example, the substrate table 4T) can be filled with the liquid LQ.

[0159] In each of the above embodiments, an ArF excimer laser is used as the exposure light EL. However, as described above, various exposure lights (exposure beams) such as an F laser may be employed.

2

The liquid LQ that fills the optical path K can be optimized according to the exposure light (exposure beam) EL, the number of apertures in the projection optical system PL, the refractive index of the final optical element LSI with respect to the exposure light EL, etc. It can be used properly.

[0160] In the above embodiments, the position information of the mask stage 3 and the substrate stage 4 is measured using the interferometer system (3L, 4L). You may use the encoder system which detects the scale (diffraction grating) provided. In this case, it is preferable that a hybrid system including both the interferometer system and the encoder system is used, and the measurement result of the encoder system is calibrated using the measurement result of the interferometer system. Further, the position control of the stage may be performed by switching between the interferometer system and the encoder system or using both.

[0161] The substrate P in each of the above embodiments is used not only for semiconductor wafers for manufacturing semiconductor devices but also for glass substrates for display devices, ceramic wafers for thin film magnetic heads, or exposure apparatuses. Mask or reticle master (synthetic quartz, silicon wafer), etc. are applied.

[0162] As the exposure apparatus EX, in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that performs mask exposure by scanning the mask M and the substrate P in synchronization with each other, a mask is used. The present invention can also be applied to a step-and-repeat projection exposure apparatus (steno) in which the pattern of the mask M is collectively exposed while M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.

[0163] In addition, as the exposure apparatus EX, a reduced image of the first pattern is projected in a state where the first pattern and the substrate P are almost stationary (for example, a refractive type that does not include a reflective element at a 1Z8 reduction magnification). It can also be applied to an exposure apparatus that uses a projection optical system) to perform batch exposure on the substrate P. In this case, after that, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is collectively exposed on the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. In addition, the stitch type exposure apparatus can also be applied to a step 'and' stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.

Further, in each of the embodiments described above, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention is applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. You can. Even when the projection optical system is not used, the exposure light is irradiated onto the substrate through an optical member such as a mask or a lens, and an immersion region is formed in a predetermined space between the optical member and the substrate. The

In addition, the present invention relates to, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. No. 6,590,634) and Japanese Translation of PCT International Publication No. 2000-505958 (corresponding US Pat. 5, 969, 441), US Pat. No. 6,208,407, etc., and can be applied to a multi-stage type exposure apparatus having a plurality of substrate stages. In this case, the liquid immersion system 1 described above may be provided on all stages or only on some stages.

[0166] The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P. An exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an imaging It can be widely applied to exposure devices for manufacturing devices (CCD), micromachines, MEMS, DNA chips, reticles or masks.

In the above-described embodiment, force using a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern 'dimming pattern) is formed on a light-transmitting substrate is used instead of this mask. For example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable molding mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. For example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator) may be used.

[0168] Further, as disclosed in, for example, pamphlet of International Publication No. 2001Z035168, an exposure apparatus (lithography) that exposes a line 'and' space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to a system.

[0169] Further, as disclosed in, for example, JP-T-2004-519850 (corresponding US Pat. No. 6,611,316), two mask patterns are combined on a substrate via a projection optical system. The present invention can also be applied to an exposure apparatus that performs double exposure of one shot area on the substrate almost simultaneously by one scan exposure. [0170] To the extent permitted by the laws and regulations of the country designated or selected in this international application, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated. As a part of the description of the text.

[0171] As described above, the exposure apparatus EX according to the embodiment of the present application has various mechanical subsystems including the respective constituent elements recited in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep. In order to ensure these various accuracies, before and after the assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, various electrical systems Is adjusted to achieve electrical accuracy. The assembly process from various subsystems to the exposure system includes mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping connections between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies for the entire exposure apparatus. It is desirable to manufacture the exposure apparatus in a clean room in which the temperature and cleanliness are controlled.

[0172] As shown in FIG. 25, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on this design step, Step 203 for manufacturing a substrate that is a base material of the device, a step of exposing the mask pattern to the substrate by the exposure apparatus EX of the above-described embodiment, a step of developing the exposed substrate, heating (curing) of the developed substrate, and It is manufactured through a step 204 including a substrate processing process such as an etching process, a device assembly step (including processing processes such as a dicing process, a bonding process, and a knocking process) 205, an inspection step 206, and the like.

Claims

The scope of the claims

[I] In an exposure apparatus that exposes the substrate by irradiating the substrate with exposure light,

An optical element having a concave surface from which the exposure light is emitted;

A supply port that is provided in an object that can face the concave surface, and that supplies liquid to a space between the concave surface and the object;

An exposure apparatus comprising: a suction port that is provided in the object and sucks a fluid between the concave surface and the object.

[2] The exposure apparatus according to [1], wherein the suction port sucks the fluid between the concave surface and the object in parallel with the supply of the liquid of the supply locus.

3. The exposure apparatus according to claim 2, wherein the fluid includes a gas.

4. The exposure apparatus according to claim 3, wherein the suction port is arranged at a position where the gas gathers in the space.

[5] The exposure apparatus according to any one of [1] to [4], wherein the suction port is disposed in the vicinity of the supply port.

6. The exposure apparatus according to claim 1, wherein when supplying the liquid, the supply port is disposed on the optical axis of the optical element.

7. The exposure apparatus according to claim 6, wherein the suction port is provided so as to surround the supply port.

8. The exposure apparatus according to any one of claims 1 to 5, wherein when supplying the liquid, the supply port is disposed to face a peripheral portion of the concave surface.

9. The exposure apparatus according to claim 8, wherein the suction port is disposed between the supply port and the optical axis of the optical element.

[10] The suction port includes a first suction port disposed between the supply port and the optical axis of the optical element, and a second suction port disposed on the opposite side of the supply port with respect to the optical axis. The exposure apparatus according to claim 8, further comprising a suction port.

[II] The exposure apparatus according to any one of claims 1 to 10, wherein the object has a recess.

12. The exposure apparatus according to claim 11, wherein the recess is provided in the vicinity of the suction port.

13. The apparatus according to claim 1, further comprising a first driving device that moves the supply port relative to the concave surface. 13. The exposure apparatus according to any one of 12 above.

14. The exposure apparatus according to claim 13, wherein the first driving device moves the supply port so as to approach the concave surface.

15. The exposure apparatus according to any one of claims 1 to 14, wherein the supply port ejects the liquid so as to contact the concave surface.

16. The exposure apparatus according to claim 1, further comprising a second drive device that moves the suction port relative to the concave surface.

17. The exposure apparatus according to claim 16, wherein the second driving device moves the suction port so as to approach the concave surface.

18. A detection device that detects a gas in the liquid in the space, and a control device that controls at least one of supply of the liquid and suction of the fluid based on the detection result. The exposure apparatus according to any one of 1 to 17.

[19] After the space is filled with the liquid, the supply of the liquid and the suction of the fluid stop, the concave surface and the surface of the substrate face each other, and the optical element and the liquid are interposed therebetween. The exposure apparatus according to claim 1, wherein the exposure light irradiates the substrate.

[20] When the liquid supply operation is performed, the positional relationship between the concave surface and the object is such that a space between the concave surface and the object is larger than when the liquid supply operation is stopped. 20. The exposure apparatus according to claim 19, wherein the exposure apparatus is adjusted.

[21] The object includes a convex surface that can be opposed to the concave surface, and the distance between the concave surface and the convex surface is increased while continuing the liquid supply operation to the space between the concave surface and the convex surface. 21. The exposure apparatus according to any one of claims 1 to 20.

[22] In an exposure apparatus that exposes the substrate by exposing the substrate to exposure light!

An object including a convex surface;

An exposure apparatus comprising: a supply port that supplies liquid to a space between the concave surface and the convex surface in a state where the concave surface and the convex surface face each other.

[23] While continuing the liquid supply operation to the space between the concave surface and the convex surface, 23. The exposure apparatus according to claim 22, wherein the distance between the convex surface is increased.

[24] a first surface formed to surround the concave surface;

A second surface formed on the object so as to surround the convex surface,

The supply port supplies the liquid to the space between the concave surface and the convex surface by supplying the liquid to the space between the first surface and the second surface. The described exposure apparatus.

[25] A first distance is set between the concave surface and the convex surface, and a second distance is set between the first surface and the second surface. Start supplying liquid to the space between the two surfaces,

25. The exposure apparatus according to claim 24, wherein the first distance is smaller than the second distance.

26. The exposure apparatus according to claim 24 or 25, further comprising a recovery port that is provided at a position different from the supply port and collects the liquid between the first surface and the second surface.

27. The exposure apparatus according to claim 21, wherein the convex surface is lyophilic with respect to the liquid.

28. The exposure apparatus according to claim 1, wherein a refractive index of the liquid with respect to the exposure light is higher than a refractive index of the optical element with respect to the exposure light.

[29] a projection optical system that projects a pattern image onto the substrate;

The optical element is an optical element closest to the image plane of the projection optical system among the plurality of optical elements of the projection optical system,

29. The exposure apparatus according to claim 1, wherein the numerical aperture of the projection optical system is larger than a refractive index of the optical element with respect to the exposure light.

30. The exposure apparatus according to claim 1, wherein the object is movable in a two-dimensional direction within a predetermined region including a position facing the concave surface.

[31] The object includes at least one of a first movable member that is movable while holding the substrate, and a second movable member that is movable by mounting a measuring instrument that performs measurement related to exposure processing. 30. The exposure apparatus according to 30.

[32] In an exposure method of exposing the substrate by irradiating the substrate with exposure light through an optical element, Liquid is supplied to a space between the concave surface and the object from a supply port provided in an object capable of facing the concave surface of the optical element, and the concave surface and the object are connected from a suction port provided in the object. An exposure method for sucking the fluid between.

33. The exposure method according to claim 32, wherein the fluid is sucked in parallel with the supply of the liquid.

34. The exposure method according to claim 32 or 33, wherein the fluid contains a gas.

35. The exposure method according to claim 34, wherein the gas is sucked from near the position where the gas gathers in the space.

36. The exposure method according to claim 32, wherein the fluid is sucked from the vicinity of the supply port.

37. The exposure method according to any one of claims 32 to 36, wherein the liquid is supplied through the supply port disposed on the optical axis of the optical element.

[38] The exposure method according to claim 37, wherein the fluid is sucked through the suction port arranged so as to surround the supply port.

[39] The exposure method according to any one of claims 32 to 38, wherein the liquid is applied to the concave surface through the supply port.

40. The liquid is supplied in a state where the supply port is brought close to the concave surface.

40. The exposure method according to any one of 2 to 39.

41. The fluid is sucked in a state where the suction port is brought close to the concave surface.

The exposure method according to any one of 2 to 40.

42. The exposure method according to claim 32, wherein the liquid is also caused to cause a peripheral edge force of the concave surface to flow along the concave surface.

[43] After the space is filled with the liquid, the supply of the liquid and the suction of the fluid stop, the concave surface and the surface of the substrate face each other, and the optical element and the liquid are interposed therebetween. 43. The exposure method according to any one of claims 32 to 42, wherein the exposure light is irradiated onto the substrate.

[44] When the supply operation of the supply port is executed, the position of the concave surface and the object is set so that a space between the concave surface and the object becomes larger than when the supply operation of the supply port is stopped. 44. The exposure method according to claim 43, wherein the relationship is adjusted.

[45] With the concave surface and the convex surface of the object facing each other, the supply operation for supplying the liquid to the space between the concave surface and the convex surface is continued, while the concave surface and the convex surface are 45. The exposure method according to any one of claims 32 to 44, wherein the distance is increased.

[46] In an exposure method of exposing the substrate by irradiating the substrate with exposure light through an optical element,

An exposure method in which an object is disposed opposite to the concave surface of the optical element, the liquid is supplied to a space between the concave surface and the object, and the liquid flows along the concave surface.

[47] In an exposure method of exposing the substrate by irradiating the substrate with exposure light through an optical element,

An exposure method in which an object is disposed facing the concave surface of the optical element, and the liquid is supplied to the space between the concave surface and the object so that the liquid is supplied from the concave surface side to the object.

48. The exposure method according to claim 46 or 47, wherein the liquid is caused to flow along the concave surface when the liquid supply is started.

[49] The exposure method according to any one of [46] to [48], wherein the liquid is supplied in a state in which a supply port for supplying the liquid is brought close to the concave surface.

50. The exposure method according to any one of claims 46 to 49, wherein the liquid is applied to the concave surface through the supply port.

51. The exposure method according to claim 46 or 47, wherein the liquid is caused to flow along a peripheral edge force of the concave surface.

[52] The exposure method according to any one of [46] to [51], wherein the distance between the concave surface and the object is changed while continuing the operation of supplying the liquid to the space.

53. The exposure method according to claim 46 or 47, wherein the liquid is supplied to a space between the concave surface and the convex surface in a state where the concave surface and the convex surface of the object face each other.

54. The exposure method according to claim 53, wherein the distance between the concave surface and the convex surface is increased while continuing the liquid supply operation to the space between the concave surface and the convex surface.

[55] By supplying a liquid to a space between a first surface formed so as to surround the concave surface and a second surface formed on the object so as to surround the convex surface, the concave surface and the convex surface are provided. With The exposure method according to any one of claims 53 to 54, wherein a liquid is supplied therebetween.

[56] The exposure method according to [55], wherein the liquid between the first surface and the second surface is recovered through a recovery port disposed to face the object.

57. The exposure method according to claim 46, wherein the liquid is supplied through a supply port provided in the object.

[58] In the exposure method of exposing the substrate by irradiating the substrate with exposure light through an optical element,

Disposing an object opposite the concave surface of the optical element, and supplying a liquid to a space between the concave surface and the object,

An exposure method in which a liquid supply path used for filling the space with a liquid is different from a liquid supply path used for the substrate exposure.

59. The exposure method according to claim 58, wherein the space is filled with a liquid via a supply port provided in the object.

60. The exposure method according to claim 58 or 59, wherein the liquid is supplied during the exposure through a supply port disposed to face the object.

[61] The exposure method according to any one of [58] to [60], wherein the liquid is supplied during the exposure through a supply port disposed on a first surface formed so as to surround the concave surface.

62. The exposure method according to claim 61, wherein a liquid is supplied to a space between the first surface and a second surface formed on the object through a supply port disposed on the first surface.

[63] In an exposure method of exposing the substrate by irradiating the substrate with exposure light through an optical element,

The liquid is supplied to the space between the light emitting surface of the optical element and the object, and the interval between the optical element and the object is increased after the supply of the liquid is started until the space is filled with the liquid. The exposure method to be changed.

64. The exposure method according to claim 63, wherein the light exit surface of the optical element is a concave surface.

65. The exposure method according to claim 64, wherein the liquid is supplied to a space between the concave surface and the convex surface in a state where the concave surface and the convex surface of the object face each other.

[66] While continuing the operation of supplying the liquid to the space between the concave surface and the convex surface, 66. The exposure method according to claim 65, wherein a distance between the concave surface and the convex surface is increased.

[67] The exposure method according to [63], wherein the supply of the liquid is performed in a state where a supply port for supplying the liquid is brought close to the concave surface.

68. The exposure method according to claim 32, wherein a refractive index of the liquid with respect to the exposure light is higher than a refractive index of the optical element with respect to the exposure light.

[69] The optical element is an optical element closest to an image plane of a projection optical system that projects a pattern image on the substrate.

69. The exposure method according to claim 32, wherein a numerical aperture of the projection optical system is larger than a refractive index of the optical element with respect to the exposure light.

[70] A device manufacturing method using the exposure method according to any one of [32] to [69].