WO2007050989A2 - System and method for modular electronics design - Google Patents

Abstract

A system for designing electronic hardware devices includes a system interface (Fig 1, element 145) accepting electronic design parameters as input, a library storing a plurality of modules where each module (Fig 1) is an electronic subassemble and the modules have standardized common interface. The system retrieves compatible modules from the library in response to design parameters (see Fig 1, element 150) and joins modules in order to create a complete electronic design for an electronic component such as a printed circuit board, a microchip or a wafer-stacked device.

Description

SYSTEM AND METHOD FOR MODULAR ELECTRONICS DESIGN

BACKGROUND

The present invention relates generally to electronics, and, more particularly, to electronic design.

Printed circuit boards (PCBs)₅ also referred to as printed wiring boards (PWBs), and are often used to provide the dense and intricate circuitry needed to connect current electronic components. PCBs are used to connect electronic components without discrete wires. A basic printed circuit board has a layer of printed wires, also referred to as traces, mounted on a layer of insulation material. The traces are typically made of copper and the insulation material is generally a plastic. Often, a PCB has multiple layers of circuitry separated by insulation. A PCB having multiple layers is referred to as a multilayer board. The layers are connected with drilled and plated holes called vias.

Printed circuit board design is a complex process involving not only electronic considerations but also form factor requirements, many standards (e.g. safety, military and environmental standards) and materials and manufacturing considerations. For example, electronic considerations include the width and spacing of traces to maintain adequate signal transmission and the placement of power and ground planes within the board to detune accidental antennas and to provide some heat dissipation. Trace layout is also a manufacturing consideration as traces that are too close together can be shorted by solder in the process of mounting components. Trace layout also affects flow of the plastic of the insulation layers during lamination of multilayer boards. Proper flow of the insulation plastic maintains the alignment of the various layers so that vias can be drilled accurately. If the layers are misaligned, the vias may not hit the circuit points to be connected. The number of vias is typically minimized to reduce drilling costs and to maximize circuit area on each layer. Also, vias can interrupt circuit layout on layers where the vias are not needed for connection.

Circuits are typically formed by etching copper from a copper sheet laminated to a layer of insulation. It is generally desirable to leave as much copper as possible on the layer of insulation because removing large amounts of copper uses up etchant and produces pollutants to be processed. Further, circuitry etches more consistently if the regions to be etched have a similar average ratio of circuitry to non-circuitry surface area. There are many more PCB design considerations than those described above.

There are other types of electronic design such as Very Large Scale Integrated (VLSI) circuits, e.g. microchips and three-dimensional microsystems (3D Microsystems) in which microchips composed of conventional VLSI layers are stacked vertically to produce three- dimensional integrated circuits. The design of VLSI circuits and 3D Microsystems involve similar considerations to those described above for PCB design. Given the above considerations, conventional PCB design and layout (and other electronic design) is a technically demanding, labor-intensive process that often requires many hours of work by skilled electronic engineers. Once a PCB design is complete, adding or modifying functionality is difficult, requiring in many cases a comprehensive redesign process that may be nearly as labor intensive as the original design. This is particularly true of dense, highly space-optimized designs for modern portable or wearable electronic gear, for example.

For the foregoing reasons, there is a need for a system and method for more efficient electronic design.

SUMMARY

The present invention is directed to a system and method for modular electronics design providing improved efficiency of the design process and improved effectiveness of the design produced. A system according to the present invention includes a library of design modules. The library of design modules includes geometrically-constrained modules having well-specified functional interfaces. Modules are, for example, functional subassemblies of complete PCB designs such as power regulator modules, radio modules, and sensor modules. The system, in response to design parameters, tiles together modules conforming to a particular design specification. The assembled modules form a complete, contiguous, functional electronic design, such as a PCB₅ combining the functionality of the sub- assemblies. The interfaces of the modules are designed to provide flexibility in the process of tiling. In general, no additional design tasks are required in providing a complete design. Conventional approaches to modular electronic design operate at the low level of integrated circuits (ICs) or discrete components or at the high level of larger systems composed of a combination of separate PCBs with mechanical interconnects. IC or discrete component modularity does not address the problems of higher level functional design, and the use of separate PCBs with mechanical interconnects increases size and introduces reliability and packaging problems for many electronic applications including portable or wearable electronic devices.

In contrast, the system and method of the present invention using functional sub- assemblies in the PCB design process, for example, provides the advantages of connecting separate PCBs with mechanical interconnects but without the increased size, increased packaging problems, and decreased reliability of doing so.

Embodiments of the invention includes a system for designing electronic hardware devices including a system interface to take as input electronic design parameters. The system further includes a library storing a plurality of modules where each module includes a design of an electronic component . At least one module is compatible with at least one other module of the plurality of modules. In one embodiment, the system has a single library and all modules share the same low-level geometric and interface compatibility. In one arrangement, the modules are defined by function. In an alternative arrangement, the modules are defined by at least one feature. In another alternative arrangement, the modules are defined by a functional set of features. Modules stored in the library are, for example, radio modules, power modules and sensor modules. The system further includes a controller in communication with the system interface and with the library. The controller accesses the library to retrieve compatible modules in response to received design parameters. The retrieved modules form at least a portion of a design for an electronic hardware device. The advantage of this system is that electronic subassemblies are designed only once and then stored in a library of designs as modules. The modules can be re-used in subsequent electronic designs. With a comprehensive library, new electronic device designs, such as new PCBs, can be created by selecting and tiling the appropriate modules with little additional engineering work. Further, once modules are available in the library and then selected for a particular PCB application, the system designs and lays out the PCB design based on simple design rules.

In one arrangement, the retrieved modules have compatible interfaces. In one alternative embodiment, the interfaces are electronically compatible. In another alternative embodiment, the interfaces are compatible in form factor. The common interfaces reduce the design tasks in designing a new electronic assembly to those tasks involved in designing and laying out functionality not already provided in an existing module in the library. Modules may be updated, modified or replaced in existing PCB designs independently. This enables parallel development of modules, simplified troubleshooting of designs and easy functionality upgrades in electronic designs.

In another embodiment of the invention, the library stores a set of design rules to be applied by the controller to verify a design of an electronic hardware device. In one arrangement, the design rules are design-level rules meaning to be applied to the design as a whole and in another arrangement, the design rules are associated with individual modules. In a still further arrangement, both design level rules and individual module rules are applied. In another embodiment of the invention, the system interface accepts electronic design parameters for a plurality of electronic hardware devices and the system lays out a single manufacturing assembly that includes the plurality of electronic hardware devices. In a first arrangement, the plurality of electronic hardware devices are of identical design. In a second arrangement, the plurality of electronic hardware devices are not of identical design. The single manufacturing assembly is, for example, a multilayer printed wiring board having a plurality of electronic devices to be separated after manufacture into separate printed circuit board devices.

In another embodiment of the invention, a method for designing electronic hardware device includes providing a library storing a plurality of modules where each module includes a design of an electronic component. At least two of the modules in the plurality of modules are compatible with each other. The system executing the method then receives electronic design parameters and selects at least two modules from the library in response to the electronic design parameters. The system then forms at least a partial design of an electronic hardware device from the selected modules. In one arrangement, the system selects modules based on a feature. In a second arrangement, the system selects modules based on module function.

The standardized sub-assemblies of the present invention allow for standardized packaging, accordingly reducing associated mechanical design and fabrication costs for electronic devices. The combination of a module-based design system and rapid PCB fabrication enables accelerated prototype development while minimizing engineering costs.

The present invention together with the above and other advantages may best be understood from the following detailed description of the embodiments of the invention illustrated in the drawings, wherein:

DRAWINGS

Figure 1 is a block diagram of a design system according to principles of the invention;

Figure 2 is a block diagram of the library of Figure 1 including further detail of the modules according to principles of the invention; Figure 3 is a cross-sectional view of a conventional six-layer printed circuit board;

Figure 4 is a block diagram of tiled modules according to principles of the invention;

Figure 5 is a block diagram of a module for three-dimensional tiling according to principles of the invention; Figure 6 is a top view of a horizontally tiled printed circuit board having modules including vertical connectors according to principles of the invention;

Figure 7 is a side view diagram of a vertically tiled three-dimensional microsystem according to principles of the invention;

Figure 8 is a top view diagram of a printed circuit board having a modularized internal structure according to principles of the invention;

Figure 9 is a flow chart of the operation of the design system according to principles of the invention; and

Figure 10 is a block diagram of a manufacturing assembly including a plurality of electronic devices according to principles of the invention.

DESCRIPTION

An electronics design system includes a library of subassembly designs, also called modules. The system lays out the modules in a process referred to as "tiling" to form a complete design assembly such as a printed circuit board. The modules conform to specifications that provide compatible interfaces and signal and power requirements. The electronics design system can be applied to VLSI designs and to 3D Microsystem designs as well as to PCBs. Embodiments of the invention provide automatic generation of electronics designs as well as significant advantages in rapid prototyping of electronic components.

Figure 1 is a block diagram of a system for modular electronics design according to principles of the invention. The design system 100 includes a controller 105 capable of interfacing with a layout and design system 110. In the present embodiment, the layout and design process is external to the design system 100. In an alternate embodiment, the layout and design system 110 is integral to the design system 100. The controller 105 is, for example, a microprocessor. The layout and design system 110 is, for example, a computer system executing one of a number of design and layout programs available that are suitable for use in the present invention. The layout and design system 110 is, for example, the EAGLE Layout Editor from CadSoft Computer, Inc. of Delray Beach, Florida. In an alternative embodiment of the invention, the design system 100 of the present invention incorporates a layout & design system. The design system 100 further includes a library 115. The library 115 includes a plurality of modules 120, 125, 130, 135. Each module is a design for an electronic subassembly. A subassembly is, for example, a component having a particular function such as a power module 125. Other examples of.subassemblies are radio modules 120, 135 or a sensor module 130. The modules 120, 125, 130, 135 in the present embodiment are created on the basis of functionality however, other ways to define electronic subassemblies, such as by components or by features, are possible. The present invention is not limited to the module definitions listed here. The modules 120, 125, 130, 135 have compatible physical and electronic interfaces as well as compatible signal and power requirements. The library 115 is capable of maintaining modules conforming to a plurality of interface and signal and power requirements. The library 115 further includes design rules 140. The design rules 140 are used to test the integrity of the design, for example, against standards. The library 115 in one embodiment includes design menus 160. The design menus 160 are used to design assemblies and will be explained in greater detail below. The design menus 160 include designs for assemblies using the modules stored in the library 115.

The design system 100 has a system interface 145 through which the design system 100 receives an input of design parameters 150. The design parameters 150 are the data specifying the electronic component, such as a PCB, to be designed by the design system. The design parameters 150 include, for example, the functionality of the PCB and the form factor. The design system 100 is, for example, a computing device. The system interface 145 is any interface through which the computing device receives data. For example, a user may enter the design parameters 150 through a keyboard. Alternatively, the design parameters 150 are received over a network or as a file on electronic media such as a CD ROM. In still further embodiments, the design parameters 150 are generated by a computer program.

In operation, the design system 100 receives design parameters 150 specifying an electronic assembly such as a PCB at the system interface 145. The controller 105 retrieves modules from the library 115 in accordance with the design parameters 150. The controller 105 provides the retrieved modules to the layout and design process 110 for assembly into an electronic design. The controller 105 then applies the design rules 140 to check the design 155 created by the layout and design process 110 and provides information about rule violations to the layout and design process 110 The system 100 and the layout and design process 110 modify, if necessary, the design 155 in response to the application of the design rules 140. The system 100 outputs a completed design of an electronic device or assembly such as a PCB.

In alternative embodiments, the design system described above is used for VLSI design and for three-dimensional microsystem design. In a further alternative embodiment, the controller 105 retrieves modules from the library 115 in response to the design parameters 150 and using the design menus 160. Further, in alternative embodiments, user input is accepted in all phases of the design process.

The design process for working with the modular design system at the low level of module-design involves considerations of interfaces and form factor as well as circuit design. To create a new module, a designer begins with the design specifications and design constraints, and lays out an electronic design for an electronic module, such as a PCB, that meets the specifications within the constraints. This process is different from a more conventional design process in that the design constraints, which typically include fabrication-process imposed design rules, include additional constraints imposed by the module system geometry and interface specification.

The modules described above are merely exemplary. For example, in addition to radio modules 120, 135, the sensor module 130, and the power module 125, a display module, a bidirectional audio module, and interface modules for various types of equipment are also possible. The present invention is not considered to be limited to the types of modules listed herein.

Figure 2 is a block diagram of the library 115 storing modules 120, 125, 130, 135 and design rules 140. Each module 120, 125, 130, 135 includes design data 200, 205, 210, 215 describing the layout of circuitry of the module. Each module 120, 125, 130, 135 has a specified signal interface 240, 245, 250, 255 in common with the other modules 120, 125, 130, 135. The specified signal interface, in this example called signal interface "beta".

Signal interface "beta" provides a specified signal with, for example, a compatible voltage level and impedance so that a first module, for example radio module A 120 can be connected to a second module, for example power module B 125 without additional signal conditioning. Each module 120, 125, 130, 135 has a specified physical interface 260, 265, 270, 275, in this example called physical interface "alpha". The specified physical interface 260, 265, 270, 275 provides a standard for common physical connection between the modules. The physical interface 260, 265, 270, 275 also includes form factor specifications. The physical interface 260, 265, 270, 275 in a first embodiment, is compatible in the location of fiducial features. In a second embodiment, the physical interface 260, 265, 270, 275 is compatible in locations of vias. These features are merely exemplary. Other features of physical compatibility of possible within the scope of the invention. While only one type of signal interface and one type of physical interface are specified here, one skilled in the art will understand that the library 115 is capable of storing modules having other types of interfaces.

Each module 120, 125, 130, 135 in this embodiment includes a set of design rules 220, 225, 230, 235 specific to the module. The sets of design rules 220, 225, 230, 235 are applied in a manner similar to the application of the design rules 140 stored in the library independent of the modules 120, 125, 130, 135. The module-specific design rules 220, 225, 230, 235 include, for example, rules about interconnection with other modules. In one alternative embodiment of the present invention, the design system 100 has no design-level design rules 140 and only module-specific design rules 220, 225, 230, 235 are applied to the design 155. In another alternative embodiment, the modules 120, 125, 130, 135 do not have design rules 220, 225, 230, 235 and so only design rules 140 are applied to the design 155. The modules retrieved from the library 115 form at least a portion of a design for an electronic hardware device. The advantage of this system is that electronic subassemblies are designed only once and then stored in the library. The modules can be re-used in subsequent electronic designs. With a comprehensive library, new electronic device designs, such as new PCBs, can be created by selecting and tiling the appropriate modules with little additional engineering work. Further, once modules are available in the library and then selected for a particular PCB application, the system designs and lays out the PCB design based on design rules. In some embodiments of the invention, designs are stored in the library and made available for subsequent projects in the design menus 160. The standardized sub-assemblies of the present invention allow for standardized packaging, accordingly reducing associated mechanical design and fabrication costs for electronic devices. In PCB manufacture, for example, the combination of a module-based design system and rapid PCB fabrication enables accelerated prototype development while minimizing engineering costs.

Figure 3 is a cross-section view of a section of an example multilayer printed circuit board 300 of a type that could be made from a design produced by an embodiment of the present invention. A simple version of a PCB design is a single-layer board in which all signals are routed on the top surface of the board. More commonly, PCBs have at least two signal layers (a top layer 305 and a bottom layer 310), and frequently have several internal signal layers 315, 320, 325, 330 as shown in Figure 3. The signal layers 305, 310, 315, 320, 325, 330 are separated by layers of insulating material 335 and connected at specific points by plated vias 340. In this example, the PCB 300 has two surface mount components 345. The system and method of the present invention enables efficient and effective design of assemblies such as the one shown here. Figure 4 is a block diagram of tiled modules according to principles of the invention.

For the purpose of clarity, the following explanation of tiling uses a single layer board and a horizontal tiling scheme. Figure 4 shows a section of a PCB 350 having three example modules 355, 360. 365. The example modules include a radio module 355, a power module 360 and a sensor module 365. Each module has a plurality of connection points at specified locations. The connection points are power connection points 370, ground connection points 375, clock connection points 380 and data connection points 385. The design of the modules 355, 360, 365 is such that any conforming module can be tiled adjacent to any other conforming module resulting in a functionally connected design. The connections points 370, 375, 380, 385 of adjacent modules 355, 360, 365 are joined to form a larger PCB assembly. Each module 355, 360, 365 also has fiducial marks 390, also referred to as

"fiducials", which may be used to align modules with each other. The fiducials 390 are also useful for aligning layers in multilayer PCBs.

The example modules 355, 360, 365 in Figure 4 are tiled in a single-layer, horizontal tiling where the modules 355, 360, 365 themselves are rectangular sub-assemblies each with a four signal interface. This module scheme uses a single power rail and a two-wire shared serial bus for communications across the modules. The bus is, for example, an i2c bus from Royal Philips Electronics of the Netherlands. By assembling pre-designed modules together to form an electronic design, the work that would have been spent designing and laying at the components is saved. The system and method of the present invention are not limited to single layer boards or horizontal tiling. In alternative embodiments, any number of board layers is possible and two and three dimensional tiling is supported. In one alternative embodiment of the invention, the library 115 further includes specifications of modules to be included in particular classes of design. In a still further alternative embodiment of the invention, the system 100 provides menus 160 of design specifications to define a particular class of design. In the embodiment having design menus 160, for example, a PCB design class is defined by specifying the number and general type of sub-assemblies that may be used. For example, a menu for a wearable biosensor might be specified as a combination of three modules, each of a specified type: a radio (module type A), a power supply (module type B), and a sensor system (module type C). Given an appropriate design library, any combination of type A, type B₅ and type C modules will result in a functional PCB design for a wearable biosensor.

In an alternative embodiment of the invention, multilayer boards are tiled in a manner similar to the tiling described above. For example, in a two-layer board, interface signals between modules can be located (or "routed") on the bottom as well as the top of the board. Using both sides of the board for routing (as well as for components) has the advantage of allowing for denser board designs, and generally simplifies board routing problems by allowing signals to cross each other spatially while remaining electrically isolated. By using both layers for the interface signals, the resulting sub-assembly is denser and more easily routed.

The horizontal tiling system described above can be extended to designs with more than two layers, either by continuing to run interface signals on the top or bottom, or by delegating interface signals to internal layers. For example, the middle two layers in conventional four or six layer PCB layout, such as the layout illustrated in the PBC of Figure 3, are often reserved for supply signals (PWR and GND). This makes routing supply signals easy and makes available space on the top and bottom layers for component packages and routing other signals. With additional internal layers, more signals can be run internally, making more space available on the top and bottom for component placement. Through the use of this type of system, as many layers of PCBs as desired may be stacked into a functional "PCB sandwich," with each PCB layer being composed of a group of tiled PCB modules.

PCBs, though layered, are generally two-dimensional. Components are typically placed on the top or the bottom of a PCB. Internal layers of a PCB are typically used for routing only. In conventional modular electronics design, a single horizontal or vertical "backplane" is often used to provide interconnects between parallel "daughterboard" or "expansion card" PCBs. Embodiments of the present invention provide three dimensional capabilities to meet the need for 3-D electronic design.

Figure 5 is a diagram of a module 400 for three dimensional tiling according to one embodiment of the invention. The module 400 includes connections 405, 410 for horizontal tiling. The module 400 further includes a vertical interconnect interface 415. The vertical interconnect interface 415 is a connector conforming to a specified design and location. The vertical interconnect interface 415 provides a connection with layers, or assemblies above or below the present module. The vertical interconnect interface 415 is for example a board-to- board connector. The module 400 further includes fiducial marks 420 for alignment. The vertical interconnect interface expands the system capabilities to tiling complex designs such as vertically tiled designs or horizontal and vertically tiled designs.

Figure 6 is a top view of a tiled PCB 450 having both vertical and horizontal tiling. The PCB 450 includes four modules 455, 460, 465, 470 connected through horizontal connectors 475. Each module 455, 460, 465, 470 includes a vertical connector 480 that can be used to connect to other assemblies (not shown) positioned above or below the PCB 450. The process of the design system 100 to form this design involved selecting modules in response to received design parameters. Each module in this example is a complex multilayer design. It is possible however, to simply place the modules adjacent to one another regardless of the complexity internal to the individual modules because the modules are compatible in interface and form factor.

Figure 7 is a side view of a three-dimensional microsystem 500 according to one embodiment of the invention in which vertical tiling is applied. The three-dimensional microsystem ("3D microsystem") 500 is an integrated circuit (IC) composed of vertically- stacked, bonded layers of conventionally etched semiconductor ICs 505, 510. The 3D microsystem shown in Figure 7 includes an encapsulation layer 515 that provides protection for the ICs 505, 510 as well as electrical insulation. The two-dimensional modular design process that has been previously described for PCB design is also appropriate for functional modules in VLSI (Very Large Scale Integrated circuit) design. Accordingly, each IC 505, 510 is modularized in similar manner to the PCBs described above. Further, each IC 505 includes a vertical connector 520. The use of two dimensional modules with standardized vertical interconnects for VLSI design enables VLSI modules to be stacked to form an assembly that is a 3D microsystem.

Figure 8 is a top view of a PCB 550 having a modularized internal structure according to one embodiment of the invention. In this illustration, the various layers that make up the internal structure are visible with dotted outlines and with different fill patterns for each layer.

In the conventional multi-layer design process, a particular signal may be routed through one or more layers of the PCB. Signal transitions between layers are effected by plated drill-holes that go through all layers (vias) or through a subset of layers (microvias). This routing scheme provides flexibility, but fabricating multilayer PCBs requires a large amount of expensive, specialized equipment, making in-house production of multilayer PCBs difficult for most organizations. By contrast, the equipment and processes to etch the top and bottom layers of a PCB and to drill vias are relatively inexpensive, making in-house two- layer board production feasible for even small organizations.

Accordingly, one embodiment of the modular design system and process of the present invention involves providing a board module such as the PCB 550 shown in Figure 8 having a modularized internal structure. The board modules are provided with internal circuitry and a "blank" top 555 and bottom (not visible in this view), for example, a top and a bottom layer of unetched copper. The PCB 550 is a multi-layer "blank" with useful internal structure, the circuitry layers 560, 565, 570, 575. Specialized circuitry can be laid out on the top layer 555 and bottom layer. Each circuitry layer 560, 565, 570, 575 has at least one connection point 580 where vias may be drilled to form a vertical connection to other layers. A two-layer etching and drilling process can be applied to these modularized boards in order to easily manufacture multi-layer boards.

Conventional multilayer board design is generally complex with complexity growing significantly with every layer that is added to a design. Accordingly, an 8-layer board is significantly more complex to design than a 4-layer board and a 14-layer board is significantly more complex to design than an 8-layer board. Embodiments of the present invention provide compatible pre-designed modules that can be assembled together to form the design for a multilayer board. Assembling a multilayer board using the pre-designed modules of the present invention enables the designer to avoid much of the complexity involved in conventional board design.

The use of modular design allows for a hybrid approach in which a multi-layer board is produced with prefabricated internal layers, leaving the top and bottom layers to be customized for a specific design and etched in-house. Internal layers can be designed that systematically route supply and data signals so that these signals are available at specific locations or regions of the multilayer board, for example, the connection points 580 of Figure 8. These inner layers are then prefabricated with a solid copper top and bottom layer. The supply and data signals are then optionally tapped by vias drilled at specific locations. Further, the designs for the prefabricated internal layers in some embodiments leave open space for drilled vias to route other signals from the top to the bottom of the board. The use of more than two (top and bottom) layers presents significant advantages in

PCB design, as it allows for the internal routing of signals and thus denser use of top and bottom layers for component placement. The principle disadvantage of conventional multilayer design is that the fabrication process is more complex, and many organizations contract out the manufacture of multilayer boards to a specialized facility because the complexity creates a burdensome challenge and expense. By contrast, etching the top and bottom layers of a PCB board panel can be done in-house using relatively inexpensive equipment, with a turn-around time of hours rather than days. Thus embodiments of the present invention provide modifiable building blocks that can be assembled rapidly and readily into an integrated device.

Prefabricated multi-layer layer boards with "blank" (unetched copper) top and bottom layers can be fabricated cheaply in volume in advance. In one embodiment, modules are selected from a design library 160. The selected modules provide the modularized inner structure for the PCB "blanks". Although the structure of the middle layers of these PCB modules is fixed, the top and bottom layers, as well as the position of vias and drill holes are customized to the electronic design's specific function. The prefabricated multi-layer board design includes registration marks to make it possible to align the layout of the top, bottom, and vias with/drills to form connections with the prefabricated internal structure. The resulting design is quickly and inexpensively fabricated using conventional photo masking and chemical etching or numerically-controlled (NC) milling, and drilling.

Figure 9 is a flow chart of the process of the design system 100 according to one embodiment of the invention. At step 600, the design system 100 provides a library 115 of modules. As described above, the modules include designs for electronic subassemblies. In one embodiment, the modules are for horizontal tiling. In alternative embodiments, modules for vertical tiling are included. In further embodiments, modules for combined vertical and horizontal tiling are included. In a still further embodiment, modules that form the core of PCB "blanks" are provided in the library 115

At step 605, the design system 100 receives electronic design parameters 150. When at least two modules are selected, the design parameters 150 specify the electronic assembly to be designed. As described above, the design parameters 150 originate from one or more of a number of sources including user input and output of computer programs.

At step 610, the design system 100 selects at least two modules in response to the received design parameters 150. The selected modules have compatible interfaces so that the modules can be tiled together according to principles of the invention. At step 615, the modules are laid out into a design. A conventional layout and design system, such as the EAGLE system, can be used to lay out the modules.

At step 615, the compatible modules are combined to create a design for an electronic assembly such as a PCB. The compatible interfaces of the module result in simplification of placement and routing. At step 620, the design system 100 applies design rules to the design resulting from step 615. In an alternative embodiment, the system 100 applies system-level design rules 140. In a second alternate embodiment, the system 100 applies module-level design rules such as the design rules 220, 225, 230, 235 in Figure 2. The design rules are, for example, electronics standards.

At step 625, the system 100 finalized the design. In this step, any changes to be made in response to step 620 are made and the design is formatted for output.

Figure 10 is a block diagram of a manufacturing assembly including a plurality of electronic devices according to an embodiment of the invention. The manufacturing assembly 650 is, in this example, a multilayer printed wiring board (PWB). The manufacturing assembly 650 includes a plurality of individual multilayer electronic devices, multilayer device A 655, multilayer device B 660, multilayer device C 665, multilayer device D 670, multilayer device E 675 and multilayer device F 680. The design system 100 of the present invention in order to design the manufacturing assembly 650 received design parameters for the various multilayer devices 655, 660, 665, 670, 675, 680. Instead of designing one device on a single board, the design system 100 was directed to design a plurality of devices on a single multilayer board. The compatibility of the individual modules is extendable across multiple electronic devices on a multilayer board. In a first arrangement, the multilayer devices 655, 660, 665, 670, 675, 680 are of identical design. In a second arrangement, the multilayer devices 655, 660, 665, 670, 675, 680 are of different designs.

The multilayer devices 655, 660, 665, 670, 675, 680 are manufactured as a whole as the PWB 650 and then later divided into individual multilayer devices. The capability of easily designing this type of manufacturing assembly provides opportunity to cut production costs. It is much cheaper to manufacture one multilayer board than to manufacture, for example, six multilayer boards.

While the system and process described above was described mainly through PCBs, the present invention is applicable also to VLSI design and to 3D Microsystem design.

It is to be understood that the above-identified embodiments are simply illustrative of the principles of the invention. Various and other modifications and changes may be made by those skilled in the art which will embody the principles of the invention and fall within the spirit and scope thereof.

We claim:

Claims

1. A system for designing electronic hardware devices, comprising: a system interface to receive as input electronic design parameters; a library storing a plurality of modules, each said module including a design of an electronic component where at least one module of said plurality of modules is compatible with at least one other of said modules; and a controller in communication with said system interface and in communication with said library, the controller to access said library to retrieve compatible modules in response to the design parameters, wherein said retrieved modules form at least a portion of a design for an electronic hardware device.

2. The system of claim 1 wherein the at least one module and the at least one other of said modules have compatible interfaces.

3. The system of claim 2 wherein the compatible interfaces are electronically compatible.

4. The system of claim 2 wherein the compatible interfaces are compatible in form factor.

5. The system of claim 4 wherein the compatible interfaces are compatible in locations of fiducial marks.

6. The system of claim 4 wherein the compatible interfaces are compatible in locations of vias.

7. The system of claim 1 wherein the library further stores a set of design rules and wherein the controller applies the set of design rules to verify the design of the electronic hardware device.

8. The system of claim 1 wherein each module further includes a set of design rules and wherein the controller applies the sets of design rules belonging to the selected modules to verify the design of the electronic hardware device.

9. The system of claim 1 wherein each module is defined by at least one feature.

10. The system of claim 1 wherein each module is defined by its function.

11. The system of claim 1 wherein the system interface accepts electronic design parameters for a plurality of electronic hardware devices and the controller retrieves modules in response to the electronic design parameters to form a plurality of electronic hardware devices in a single manufacturing assembly.

12. The system of claim 11 wherein the single manufacturing assembly is a plurality of printed circuit devices.

13. The system of claim 12 wherein the plurality of electronic hardware devices are of identical design.

14. The system of claim 12 wherein the plurality of electronic hardware devices are not identical in design..

15. The system of claim 1 wherein the electronic component is a power module.

16. The system of claim 1 wherein the electronic component is a radio module.

17. The system of claim 1 wherein the electronic hardware device is printed wiring board.

18. The system of claim 1 wherein the electronic hardware device is a microchip.

19. The system of claim 1 wherein the electronic hardware device is a wafer stacked device.

20. The system of claim 1 wherein the module is a design of internal structure of an electronic device.

21. The system of claim 20 wherein the electronic device is a printed circuit board blank.

22. A method for designing electronic hardware devices, comprising: providing a library storing a plurality of modules, each said module including a design of an electronic component where at least one module of said plurality of modules is compatible with at least one other of said modules; receiving electronic design parameters; selecting at least two modules from the library in response to the electronic design parameters; and forming at least a partial design of an electronic hardware device from said modules.

23. The method of claim 22 wherein the step of selecting comprises selecting the at least two modules from the library based on module function.

24. The method of claim 22 wherein the step of selecting comprises selecting the at least two modules form the library based on at least one feature.

25. The method of claim 22 further comprising the step of applying a set of design rules to check the design of the electronic hardware device.

26. The method of claim 22 wherein the step of forming comprises from a plurality of electronic hardware devices in a single manufacturing assembly.

27. The method of claim 26 wherein the step of forming further comprises forming electronic hardware devices in a single manufacturing assembly.

28. The method of claim 27 wherein the electronic hardware devices in the single manufacturing assembly are identical in design.

29. The method of claim 27 wherein the electronic hardware devices are not identical in design.

30. A computer readable medium including code for designing electronic devices, the code operable to: provide a library storing a plurality of modules, each said module including a design of an electronic component where at least one module of said plurality of modules is compatible with at least one other of said modules; receive electronic design parameters; select at least two modules from the library in response to the electronic design parameters; and form at least a partial design of an electronic hardware device from said modules.