CN110611991A - Printed board combining rigidity and flexibility on spring and design method thereof - Google Patents
Printed board combining rigidity and flexibility on spring and design method thereof Download PDFInfo
- Publication number
- CN110611991A CN110611991A CN201910879030.7A CN201910879030A CN110611991A CN 110611991 A CN110611991 A CN 110611991A CN 201910879030 A CN201910879030 A CN 201910879030A CN 110611991 A CN110611991 A CN 110611991A
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- rigid
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- printed board
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- flex
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000013461 design Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000004891 communication Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 61
- 239000002344 surface layer Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41G—WEAPON SIGHTS; AIMING
- F41G11/00—Details of sighting or aiming apparatus; Accessories
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The disclosure relates to a printed board with rigid-flexible combination on a spring and a design method thereof, wherein the method comprises the following steps: designing a rigid-flex PCB layer, and determining the shape, size, thickness, layer number, line width, interval, size and tolerance of holes, hole positions and graphic positions of the rigid-flex PCB; designing a rigid-flex PCB layout based on the rigid-flex PCB layer, and determining a heat dissipation area, a wiring forbidden area, key element positions and connection relations with other substrates; and designing the shape of the connecting disc in the rigid-flex interface area based on the rigid-flex PCB layout. The invention has the advantages that: the method is simple to realize, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of combining the missile-borne computer and the inertia measurement. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method.
Description
Technical Field
The invention relates to a printed board combining rigidity and flexibility on a spring and a design method thereof.
Background
The XXX control combined information processing circuit is an important component of a bomb control system, is small in size and high in integration degree, generally requires a 170X200mm space to be designed with a central signal processing unit and external communication interfaces such as an inertial measurement unit, remote measurement, remote control, launch control, electric control and fuze, and is very high in integration degree and high in difficulty. In the traditional model design, missile guidance control is mainly realized by mutually communicating and matching two parts of two information processing circuit boards (an inertial measurement circuit board and a missile-borne computer circuit board) to finish missile flight control, a connector and wire cable mode is adopted, namely connectors are arranged on two connected printed boards, and then board-level interconnection is realized between every two printed boards by adopting a crimping cable or a welding mode; the problems of complex structure, large volume, more electronic components, low reliability, low space utilization rate, low reusability of hardware and software and the like exist. The assembling and connecting mode is time-consuming, labor-consuming, low in efficiency, high in cost of the additional connector, complex in assembly and poor in reliability, and meanwhile, insufficient soldering or wrong soldering phenomena are easily generated between the leads.
Disclosure of Invention
The invention aims to provide a printed board combining rigidity and flexibility on a spring, which is simple to assemble and high in reliability.
In order to solve the technical problems, the invention adopts the technical scheme that: a design method of a printed board with rigid-flexible combination on a spring is characterized by comprising the following steps:
designing a rigid-flex PCB layer, and determining the shape, size, thickness, layer number, line width, interval, size and tolerance of holes, hole positions and graphic positions of the rigid-flex PCB;
designing a rigid-flex PCB layout based on the rigid-flex PCB layer, and determining a heat dissipation area, a wiring forbidden area, key element positions and connection relations with other substrates;
and designing the shape of the connecting disc in the rigid-flex interface area based on the rigid-flex PCB layout.
Compared with the prior art, the invention has the following beneficial technical effects:
the method is simple to realize, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of combining the missile-borne computer and the inertia measurement. With this high density, high integration design, the control assembly and pop-up device is implemented with the smallest printed board scale: the remote measurement, remote control, launch control, electric control and fuze system interconnection, the technology greatly saves the product space structure and has stronger reliability. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method. The rigid-flex combined plate technology has great significance in military application and can be popularized to weapon systems of other models.
Drawings
FIG. 1 is a flow chart of a method for designing a printed board combining rigidity and flexibility on a spring;
FIG. 2 is a schematic diagram of a layer structure of the printed board with rigid-flexible combination on the spring;
fig. 3 is a schematic layout of the snap-on rigid-flex printed board of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments, but these examples are only illustrative and do not limit the scope of the present invention.
Referring to fig. 1 to 3, a method for designing a printed board with a rigid-flex combination on a flip chip according to the present invention includes: step S101, designing a rigid-flex PCB layer, and determining the shape, size, thickness, layer number, line width, interval, hole size, tolerance, hole position and graphic position of the rigid-flex PCB; step S102, designing a rigid-flex PCB layout based on the rigid-flex PCB layer, and determining a heat dissipation area, a wiring forbidden area, key element positions and connection relations with other substrates; and S103, designing the shape of the connecting disc in the rigid-flex interface area based on the rigid-flex PCB layout.
In one embodiment, the rigid-flex PCB layer adopts 10 layers of PCB rigid-flex PCB, and the signal processing unit and the missile-borne communication interface are integrated into a rigid-flex board.
In one embodiment, the rigid-flex PCB layer sequentially includes, from top to bottom: the flexible antenna comprises a surface layer, a first electrical ground plane, a middle signal layer, a second electrical ground plane, a first flexible lead-out layer, a second flexible lead-out layer, a third electrical ground plane, a first power supply layer, a second power supply layer and a bottom layer.
In one embodiment, the surface layer mounted device comprises: DSP digital processor, FPGA logic processing unit, external connector, high-speed sampling A/D, high-precision D/A and relevant digital circuit chip.
In one embodiment, the surface layer is designed with a minimum printed conductor line width of 10 mils, a minimum line spacing of 12 mils, and a minimum hole size of 10 mils.
In one embodiment, the first electrical ground plane is divided into 3 different electrical characteristic planes: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.
In one embodiment, the intermediate signal layer is designed to be parallel address lines and data lines of a DSP and an FPGA.
In one embodiment, the intermediate signal layer is designed with a minimum printed conductor line width of 6 mils, a minimum line spacing of 9 mils, and a minimum hole size of 10 mils.
In one embodiment, the under-layer mounted device includes a high-speed FLASH, a high-speed optocoupler, a magnetic isolator, a decoupling capacitor, and an LDO power supply.
As a specific example, when designing the layer of the rigid-flex PCB, the shape and size, thickness and number of layers of the rigid-flex PCB, the size and shape of the connection pad, the line width and the space, the size and tolerance of the hole, the hole position and the pattern position are mainly considered.
As a specific example, from the viewpoint of production process, for convenience of batch production and cost reduction, the shape should be as simple as possible, and generally be a rectangle with a length-width ratio not very different.
As a specific example, the number of layers of the flex-rigid PCB is determined in consideration of the influence of the number of layers on the production cost and reliability, and the layers are preferably kept symmetrical, preferably even number of copper layers.
Referring to fig. 2, in the rigid-flex printed circuit board: the first layer is the superficial layer, the line is walked in main surface device installation and surface printing, the device of installation has DSP digital processor, FPGA logical processing unit, to outer connector, high-speed sampling AD, high accuracy DA and relevant digital circuit chip, design printed wire minimum line width 10mil, minimum line spacing 12mil, minimum hole size 10mil, the installation of rigid-flex printed board is realized through 10M 2 (tolerance 6H) installation set screw holes to whole printed board.
The second layer stratum is an electrical ground plane, and the whole layer is divided into 3 different electrical characteristic ground planes according to the functional requirements: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.
The third layer is a middle signal layer used for high-speed signal transmission and mainly designed into parallel address lines and data lines of a DSP and an FPGA, and the minimum line width of a printed wire is 6 mils, the minimum line spacing is 9 mils, and the minimum hole size is 10 mils.
A fourth earth formation; the high-speed digital signal plane ground is mainly used as an electric ground plane.
The fifth layer and the sixth layer are flexible lead-out layers, and key important signals are led out;
and the seventh layer of stratum is an electrical ground plane and is mainly used as a high-speed digital signal ground plane.
The eighth layer and the ninth layer are power supply layers, power supplies of +27V, +15V, -15V, digital +5V, digital-5V, analog +5V, analog-5V, 3.3V, 1.8V, 1.5V and the like are mainly designed, and the power supply of the whole system is directly led to power supply input pins of related devices from the power supply layers through via hole design.
The tenth layer is a bottom layer and mainly comprises bottom surface device installation and bottom surface printed wiring; the installed devices comprise high-speed FLASH, high-speed optocouplers, magnetic isolators, decoupling capacitors, LDO power supplies and the like. The minimum line width of the printed conductor is 10 mils, the minimum line spacing is 12 mils, and the minimum hole size is 10 mils. And then processing the ten printed boards with the thickness of 12.6 mils into one printed board through a pressing process, wherein the whole printed board is an integrated high-speed and high-density signal processing system, the minimum line width is 6 mils, the line spacing is 9 mils, the minimum hole size is 10 mils, signal interconnection is realized among layers through blind holes, buried holes and through holes, and finally signal input and output and signal central control processing are realized.
As a specific example, referring to fig. 3, the layout should take into consideration the heat dissipation area, the wiring exclusion area, the location of the key element, and the connection relationship with other substrates. Generally, in the case of wiring on the outer layer, it is required to have a large number of wirings on the bonding surface, a small number of wirings on the element surface, and a large area of copper foil to be relatively uniformly distributed on the inner and outer layers. In order to prevent the printed wires from being damaged by contour machining, the distance between the conductive pattern of the outer-layer wiring area and the edge of the substrate and the distance between the conductive pattern of the inner-layer wiring area and the edge of the substrate are kept at a certain distance, and the distance is proper and is 2-3 mm. Meanwhile, in order to meet the requirements of the assembly and welding process of components, the process edges and stamp holes need to be considered in the design of the PCB.
As a specific example, the shape design of the land directly affects the peel strength and bending strength of the flex-rigid PCB. In order to improve the peeling strength and the bending strength of the rigid-flexible PCB, the maximum value of the connecting disc is required on the premise of meeting the requirement of an electrical gap, the ratio of the connecting disc to a hole is not less than 2: l, the diameter and the aperture of the through hole bonding pad are recommended in series, and the large connecting disc is used for preventing the connecting disc from being pulled off and also for effectively counteracting the shrinkage of materials. All the connection parts of the connecting discs and the leads are in fillet transition, and the design of 'tear drop' is adopted, so that the stress concentration is reduced to the minimum.
Test of
Applied to certain type weapon system
1. The space of the projectile body is greatly reduced by 50%, the assembly is simple, and the reliability is high.
2. Compared with the traditional printed board, the total weight and volume are reduced by more than 70 percent compared with the traditional wire harness method.
The invention achieves the following beneficial technical effects:
the method is simple to realize, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of combining the missile-borne computer and the inertia measurement. With this high density, high integration design, the control assembly and pop-up device is implemented with the smallest printed board scale: the remote measurement, remote control, launch control, electric control and fuze system interconnection, the technology greatly saves the product space structure and has stronger reliability. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method. The rigid-flex combined plate technology has great significance in military application and can be popularized to weapon systems of other models.
While the invention has been described with reference to preferred embodiments, it is not intended to be limited thereto. It is obvious that not all embodiments need be, nor cannot be exhaustive here. Variations and modifications of the present invention can be made by those skilled in the art without departing from the spirit and scope of the present invention by using the design and content of the above disclosed embodiments, and therefore, any simple modification, parameter change and modification of the above embodiments based on the research essence of the present invention shall fall within the protection scope of the present invention.
Claims (9)
1. A design method of a printed board with rigid-flexible combination on a spring is characterized by comprising the following steps:
designing a rigid-flex PCB layer, and determining the shape, size, thickness, layer number, line width, interval, size and tolerance of holes, hole positions and graphic positions of the rigid-flex PCB;
designing a rigid-flex PCB layout based on the rigid-flex PCB layer, and determining a heat dissipation area, a wiring forbidden area, key element positions and connection relations with other substrates;
and designing the shape of the connecting disc in the rigid-flex interface area based on the rigid-flex PCB layout.
2. The design method of the printed board with the rigid-flexible combination on the missile according to claim 1, wherein 10 layers of PCB rigid-flexible combination printed boards are adopted in the PCB layer with the rigid-flexible combination, and the signal processing unit and the communication interface on the missile are integrated into a rigid-flexible combination board.
3. The design method of the printed board with the rigid-flex combination on the spring according to claim 2, wherein the layers of the PCB with the rigid-flex combination sequentially comprise from top to bottom: the flexible antenna comprises a surface layer, a first electrical ground plane, a middle signal layer, a second electrical ground plane, a first flexible lead-out layer, a second flexible lead-out layer, a third electrical ground plane, a first power supply layer, a second power supply layer and a bottom layer.
4. The method for designing a printed board combining rigidity and flexibility on a bullet according to claim 3, wherein the device mounted on the surface layer comprises: DSP digital processor, FPGA logic processing unit, external connector, high-speed sampling A/D, high-precision D/A and relevant digital circuit chip.
5. The method for designing a flexible-rigid printed board on a bullet according to claim 4, wherein the surface layer is designed to have a minimum line width of 10mil, a minimum line spacing of 12mil and a minimum hole size of 10 mil.
6. The method for designing a printed board combining rigidity and flexibility on a bullet according to claim 3, wherein the first electrical ground plane is divided into 3 different electrical characteristic ground planes: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.
7. The method for designing the printed board with the rigid-flexible combination on the bullet as claimed in claim 4, wherein the intermediate signal layer is designed to be DSP and FPGA parallel address lines and data lines.
8. The method for designing a flexible-rigid printed board on a bullet according to claim 7, wherein the intermediate signal layer is designed to have a minimum printed wiring line width of 6mil, a minimum line spacing of 9mil and a minimum hole size of 10 mil.
9. The design method of the printed board with rigid-flexible combination on the spring is characterized in that the devices mounted on the bottom layer comprise a high-speed FLASH, a high-speed optical coupler, a magnetic isolator, a decoupling capacitor and an LDO power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910879030.7A CN110611991A (en) | 2019-09-18 | 2019-09-18 | Printed board combining rigidity and flexibility on spring and design method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910879030.7A CN110611991A (en) | 2019-09-18 | 2019-09-18 | Printed board combining rigidity and flexibility on spring and design method thereof |
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| Publication Number | Publication Date |
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| CN110611991A true CN110611991A (en) | 2019-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910879030.7A Pending CN110611991A (en) | 2019-09-18 | 2019-09-18 | Printed board combining rigidity and flexibility on spring and design method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112616307A (en) * | 2020-12-16 | 2021-04-06 | 无锡英诺赛思科技有限公司 | A high-efficient sharp grasping system for semiconductor chip mounter |
| CN113657070A (en) * | 2021-08-10 | 2021-11-16 | 苏州悦谱半导体有限公司 | CAM system-based automatic line and hole moving detection and optimization method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112616307A (en) * | 2020-12-16 | 2021-04-06 | 无锡英诺赛思科技有限公司 | A high-efficient sharp grasping system for semiconductor chip mounter |
| CN113657070A (en) * | 2021-08-10 | 2021-11-16 | 苏州悦谱半导体有限公司 | CAM system-based automatic line and hole moving detection and optimization method |
| CN113657070B (en) * | 2021-08-10 | 2023-10-17 | 苏州悦谱半导体有限公司 | Automatic line and hole shifting detection and optimization method based on CAM system |
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